SEMICOA SD3960F, SQ3960, SQ3960F Datasheet

Data Sheet No. 2C3960

Mechanical Specifications

BV

IC = 10.0 mA

BV

IC = 10 µA

BV

IE = 10.0 mA

I

VCE = 10 V, V

= 2.0 V

h

IC = 1.0 mA dc, V

= 1.0 V

h

IC = 10 mA dc, V

= 1.0 V

h

IC = 30 mA dc, V

= 1.0 V

V

IC = 30 mA dc, I

= 3.0 mA

Due to limitations of probe testing, only dc parameters are tested. This must be done with pulse width less

Chip Type 2C3960
Geometry 0003
Polarity NPN

Chip type 2C3960 by Semicoa Semi­conductors provides performance
similar to these devices.

Part Numbers:

2N3960, 2N3960UB, SD3960F, SQ3960,

SQ3960F

Generic Packaged Part:

2N3960

Product Summary:

APPLICATIONS:

Designed for high-speed current-mode
logic switching.

Features:

Metallization

Bonding Pad Size

Die Thickness

Chip Area

Top Surface

Top Al - 15 kÅ min.

Backside Au - 6.5 kÅ nom.

Emitter 2.7 mils x 2.7 mils

Base 2.7 mils x 2.7 mils

8 mils nominal
16 mils x 16 mils
Silox Passivated

Electrical Characteristics

TA = 25oC

Parameter Test conditions Min Max Unit

CEO
CBO
EBO

CEX

FE1
FE2
FE3

CE(sat)

than 300 µs, duty cycle less than 2%.

EB

CE
CE
CE

B

12 --- V dc
20 --- V dc

4.5 --- V dc

--- 5.0 nA
25 --- --­40 400 --­25 --- ---

--- 0.3 V dc