Data Sheet No. 2C2605
Mechanical Specifications
Electrical Characteristics
Due to limitations of probe testing, only dc parameters are tested. This must be done with pulse width less
Chip Type 2C2605
Geometry 0220
Polarity NPN
Chip type 2C2605 by Semicoa Semiconductors provides performance
similar to these devices.
Part Numbers:
2N2604, 2N2605, 2N3789, 2N3799, 2N3810,
2N3811
Generic Packaged Parts:
2N2604, 2N2605, 2N3798,
2N3799, 2N3810, 2N3811
Product Summary:
APPLICATIONS: Designed for high
speed switching applications.
Features:
• High speed switching capabilities
Metallization
Bonding Pad Size
Die Thickness
Chip Area
Top Surface
Top Al - 19.5 kÅ min.
Backside Au - 6.5 kÅ nom.
Emitter 3.6 mils diameter
Base 2.5 mils diameter
8 mils nominal
18 mils x 18 mils
Silox Passivated
TA = 25oC
Parameter Test conditions Min Max Unit
BV
CEO
BV
CBO
BV
EBO
I
CBO
h
FE
than 300 µs, duty cycle less than 2%.
IC = 10.0 A, IB = 0
IC = 10 µA, IE = 0
IE = 10 µA, IC = 0
VCB = 60 Vc, IE = 0
IC = 500 µA dc, V
CE
= 5.0 V
60 --- V dc
70 --- V dc
6.0 --- V dc
--- 10 nA
150 450 ---