Semelab Plc SML60S18 Datasheet
D
S
G
D3PAK Package Outline.
15.95 (0.628)
16.05 (0.632)
1.04 (0.041)
1.15 (0.045)
4.98 (0.196)
5.08 (0.200)
1.47 (0.058)
1.57 (0.062)
5.45 (0.215) BSC
2 plcs.
2.67 (0.105)
2.84 (0.112)
1.27 (0.050)
1.40 (0.055)
13.41 (0.528)
13.51 (0.532)
13.79 (0.543)
13.99 (0.551)
132
0.46 (0.018)
0.56 (0.022)
3 plcs.
1.22 (0.048)
1.32 (0.052)
1.98 (0.078)
2.08 (0.082)
11.51 (0.453)
11.61 (0.457)
3.81 (0.150)
4.06 (0.160)
Dimensions in mm (inches)
SML60S18
N–CHANNEL
ENHANCEMENT MODE
HIGH VOLTAGE
POWER MOSFETS
Pin 1 – Gate Pin 2 – Drain Pin 3 – Source
Heatsink is Drain.
ABSOLUTE MAXIMUM RATINGS (T
Drain – Source Voltage
Continuous Drain Current
Pulsed Drain Current
Gate – Source Voltage
Gate – Source Voltage Transient
Total Power Dissipation @ T
Derate Linearly
Operating and Storage Junction Temperature Range
Lead Temperature : 0.063” from Case for 10 Sec.
Avalanche Current
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Starting TJ= 25°C, L = 7.47mH, RG= 25Ω, Peak IL= 18A
1
(Repetitive and Non-Repetitive)
V
DSS
I
D
I
DM
V
GS
V
GSM
P
D
TJ, T
T
L
I
AR
E
AR
E
AS
STG
1
= 25°C unless otherwise stated)
case
= 25°C
case
1
2
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk
Website: http://www.semelab.co.uk
V
DSS
I
D(cont)
R
DS(on)
600V
18A
0.35
ΩΩ
• Faster Switching
• Lower Leakage
• 100% Avalanche Tested
• Surface Mount D3PAK Package
StarMOS is a new generation of high voltage
N–Channel enhancement mode power MOSFETs.
This new technology minimises the JFET effect,
increases packing density and reduces the
on-resistance. StarMOS also achieves faster
switching speeds through optimised gate layout.
600
18
72
±20
±30
280
2.24
–55 to 150
300
18
30
1210
V
A
A
V
W
W/°C
°C
A
mJ
5/99
SML60S18
STATIC ELECTRICAL RATINGS (T
Characteristic Test Conditions Min. Typ. Max. Unit
BV
DSS
Drain – Source Breakdown Voltage
Zero Gate Voltage Drain Current
I
DSS
I
GSS
V
GS(TH)
I
D(ON)
R
DS(ON)
(VGS= 0V)
Gate – Source Leakage Current
Gate Threshold Voltage
On State Drain Current
2
Drain – Source On State Resistance
DYNAMIC CHARACTERISTICS
Characteristic Test Conditions Min. Typ. Max. Unit
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
Gate – Source Charge
Gate – Drain (“Miller”) Charge
Turn–on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
= 25°C unless otherwise stated)
case
VGS= 0V , ID= 250µA
VDS= V
VDS= 0.8V
VGS= ±30V , VDS= 0V
VDS= VGS, ID= 1.0mA
VDS> I
VGS= 10V
2
VGS= 10V , ID= 0.5 ID[Cont.]
VGS= 0V
VDS= 25V
f = 1MHz
VGS= 10V
VDD= 0.5 V
ID= ID[Cont.] @ 25°C
VGS= 15V
VDD= 0.5 V
ID= ID[Cont.] @ 25°C
RG= 1.6Ω
DSS
D(ON)
, TC= 125°C
DSS
x R
DS(ON)
DSS
DSS
Max
600
V
25
µA
250
±100
24
18
0.35
nA
V
A
Ω
3450
412
pF
153
138
19
nC
65
12
8
ns
44
9
SOURCE – DRAIN DIODE RATINGS AND CHARACTERISTICS
Characteristic Test Conditions Min. Typ. Max. Unit
I
I
V
t
Q
S
SM
SD
rr
rr
Continuous Source Current
Pulsed Source Current
Diode Forward Voltage
1
2
Reverse Recovery Time
Reverse Recovery Charge
(Body Diode)
(Body Diode)
VGS= 0V , IS= – ID[Cont.]
IS= – ID[Cont.] , dls / dt = 100A/µs
IS= – ID[Cont.] , dls / dt = 100A/µs
THERMAL CHARACTERISTICS
Characteristic Min. Typ. Max. Unit
R
R
θJC
θJA
Junction to Case
Junction to Ambient
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Pulse Test: Pulse Width < 380µS , Duty Cycle < 2%
3) See MIL–STD–750 Method 3471
CAUTION — Electrostatic Sensitive Devices. Anti-Static Procedures Must Be Followed.
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk
Website: http://www.semelab.co.uk
440
7
18
72
1.3
0.45
40
A
V
ns
µC
°C/W
5/99
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