Semelab Plc SML10J225 Datasheet

SML10J225
SOT–227 Package Outline.
Dimensions in mm (inches)
11.8 (0.463)
31.5 (1.240)
31.7 (1.248)
7.8 (0.307)
8.2 (0.322)
1
R
2
W =
H =
4.1 (0.161
4.3 (0.169
4.8 (0.187)
4.9 (0.193) (4 p lac es)
4.0 (0.157 )
4.2 (0.165 )
12.2 (0.480)
8.9 (0.350)
)
9.6 (0.378)
)
Hex Nut M 4
(4 places)
ENHANCEMENT MODE
N–CHANNEL
HIGH VOLTAGE
0.75 (0.030)
0.85 (0.033)
25.2 (0.992)
25.4 (1.000)
12.6 (0.496)
12.8 (0.504)
POWER MOSFETS
34
3.3 (0.129)
14.9 (0.587)
15.1 (0.594)
30.1 (1.185)
30.3 (1.193)
38.0 (1.496)
38.2 (1.504)
R =
4.0 (0.157) (2 Place s)
S
S
D
G
D
G
S
ABSOLUTE MAXIMUM RATINGS (T
V I I V V
P
D DM
DSS
GS GSM
D
Drain – Source Voltage Continuous Drain Current Pulsed Drain Current
1
Gate – Source Voltage Gate – Source Voltage Transient Total Power Dissipation @ T Derate Linearly
5.1 (0.2 01)
5.9 (0.2 32)
1.95 (0.077)
2.1 4 (0.0 84 )
*
Source terminals are shorted internally. Current handling capability is equal for either Source terminal.
= 25°C unless otherwise stated)
case
= 25°C
case
V
DSS
I
D(cont)
R
DS(on)
100V
225A
0.007
• Faster Switching
• Lower Leakage
• 100% Avalanche Tested
• Popular SOT–227 Package
StarMOS is a new generation of high voltage N–Channel enhancement mode power MOSFETs. This new technology minimises the JFET effect, increases packing density and reduces the on-resistance. StarMOS also achieves faster switching speeds through optimised gate layout.
100 225 900 ±30 ±40 700
5.6
V A A
V
W
W/°C TJ, T T
L
I
AR
E
AR
E
AS
STG
Operating and Storage Junction Temperature Range Lead Temperature : 0.063” from Case for 10 Sec.
1
Avalanche Current Repetitive Avalanche Energy Single Pulse Avalanche Energy
(Repetitive and Non-Repetitive)
1
2
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Starting TJ= 25°C, L = 142µH, RG= 25, Peak IL= 225A
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk
Website: http://www.semelab.co.uk
–55 to 150
300 225
50
3600
°C
A
mJ
5/99
SML10J225
STATIC ELECTRICAL RATINGS (T
Characteristic Test Conditions Min. Typ. Max. Unit
BV
DSS
Drain – Source Breakdown Voltage Zero Gate Voltage Drain Current
I
DSS
I
GSS
V
GS(TH)
I
D(ON)
R
DS(ON)
(VGS= 0V) Gate – Source Leakage Current Gate Threshold Voltage
On State Drain Current
2
Drain – Source On State Resistance
DYNAMIC CHARACTERISTICS
Characteristic Test Conditions Min. Typ. Max. Unit
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge
3
Gate – Source Charge Gate – Drain (“Miller”) Charge Turn–on Delay Time Rise Time Turn-off Delay Time Fall Time
= 25°C unless otherwise stated)
case
VGS= 0V , ID= 250µA VDS= V VDS= 0.8V VGS= ±30V , VDS= 0V VDS= VGS, ID= 5.0mA VDS> I VGS= 10V
2
VGS= 10V , ID= 0.5 ID[Cont.]
VGS= 0V VDS= 25V f = 1MHz VGS= 10V VDD= 0.5 V ID= ID[Cont.] @ 25°C VGS= 15V VDD= 0.5 V ID= ID[Cont.] @ 25°C RG= 0.6
DSS
D(ON)
, TC= 125°C
DSS
x R
DS(ON)
DSS
DSS
Max
100
V
100
µA
500
±100
24
225
0.007
nA
V
A
18000
6900
pF
2700
670 110
nC
330
26 54
ns
82 18
SOURCE – DRAIN DIODE RATINGS AND CHARACTERISTICS
Characteristic Test Conditions Min. Typ. Max. Unit
I I V t Q
S SM
SD
rr
rr
Continuous Source Current Pulsed Source Current Diode Forward Voltage
1
2
Reverse Recovery Time Reverse Recovery Charge
(Body Diode) (Body Diode) VGS= 0V , IS= – ID[Cont.] IS= – ID[Cont.] , dls / dt = 100A/µs IS= – ID[Cont.] , dls / dt = 100A/µs
THERMAL CHARACTERISTICS
Characteristic Min. Typ. Max. Unit
R R
θJC θJA
Junction to Case Junction to Ambient
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Pulse Test: Pulse Width < 380µS , Duty Cycle < 2%
3) See MIL–STD–750 Method 3471 CAUTION — Electrostatic Sensitive Devices. Anti-Static Procedures Must Be Followed.
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk
Website: http://www.semelab.co.uk
330
3
225 900
1.3
0.18 40
A
V
ns
µC
°C/W
5/99
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