Semelab Plc SML100H11 Datasheet

TO–258 Package Outline.
Dimensions in mm (inches)
SML100H11
6.86 (0.270)
21.21 (0.835)
20.70 (0.815)
6.09 (0.240)
3.56 (0.140) BSC
17.65 (0.695)
17.39 (0.685)
4.19 (0.165)
3.94 (0.155)
17.96 (0.707)
17.70 (0.697)
13.84 (0.545)
13.58 (0.535)
19.05 (0.750)
12.70 (0.500)
Pin 1 – Drain Pin 2 – Source Pin 3 – Gate
123
5.08 (0.200)
1.65 (0.065)
1.39 (0.055) Typ.
BSC
Dia.
1.14 (0.707)
0.88 (0.035)
D
G
S
N–CHANNEL
ENHANCEMENT MODE
HIGH VOLTAGE
POWER MOSFETS
V
DSS
I
D(cont)
R
DS(on)
• Faster Switching
• Lower Leakage
• TO–258 Hermetic Package
StarMOS is a new generation of high voltage N–Channel enhancement mode power MOSFETs. This new technology minimises the JFET effect, increases packing density and reduces the on-resistance. StarMOS also achieves faster switching speeds through optimised gate layout.
1000V
11A
0.880
ABSOLUTE MAXIMUM RATINGS (T
V
DSS
I
I
DM
V
GS
V
GSM
P
TJ, T T
L
I
AR
E
AR
E
AS
STG
Drain – Source Voltage Continuous Drain Current Pulsed Drain Current
1
Gate – Source Voltage Gate – Source Voltage Transient Total Power Dissipation @ T Derate Linearly Operating and Storage Junction Temperature Range Lead Temperature : 0.063” from Case for 10 Sec.
1
Avalanche Current
(Repetitive and Non-Repetitive) Repetitive Avalanche Energy Single Pulse Avalanche Energy
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Starting TJ= 25°C, L = 21.49mH, RG= 25, Peak IL= 11A
= 25°C unless otherwise stated)
case
= 25°C
case
1
2
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk
Website: http://www.semelab.co.uk
1000
11
44 ±30 ±40 250
2.0
–55 to 150
300
11
30
1300
V A A
V
W
W/°C
°C
A
mJ
6/99
SML100H11
STATIC ELECTRICAL RATINGS (T
Characteristic Test Conditions Min. Typ. Max.Unit
BV
DSS
Drain – Source Breakdown Voltage Zero Gate Voltage Drain Current
I
DSS
I
GSS
V
GS(TH)
I
D(ON)
R
DS(ON)
(VGS= 0V) Gate – Source Leakage Current Gate Threshold Voltage
On State Drain Current
2
Drain – Source On State Resistance
DYNAMIC CHARACTERISTICS
Characteristic Test Conditions Min. Typ. Max.Unit
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge
3
Gate – Source Charge Gate – Drain (“Miller”) Charge Turn–on Delay Time Rise Time Turn-off Delay Time Fall Time
= 25°C unless otherwise stated)
case
VGS= 0V , ID= 250µA VDS= V VDS= 0.8V VGS= ±30V , VDS= 0V VDS= VGS, ID= 1.0mA VDS> I VGS= 10V
2
VGS= 10V , ID= 0.5 ID[Cont.]
VGS= 0V VDS= 25V f = 1MHz VGS= 10V VDD= 0.5 V ID= ID[Cont.] @ 25°C VGS= 15V VDD= 0.5 V ID= ID[Cont.] @ 25°C RG= 1.6
DSS
D(ON)
, TC= 125°C
DSS
x R
DS(ON)
DSS
DSS
Max
1000
V
25
µA
250
±100
24
11
0.880
nA
V
A
3700 4440
350 490
pF 180 270 185 275
16 24
nC
90 135 12 24 10 20
ns
43 65 10 20
SOURCE – DRAIN DIODE RATINGS AND CHARACTERISTICS
Characteristic Test Conditions Min. Typ. Max.Unit
I I V t Q
S SM
SD
rr
rr
Continuous Source Current Pulsed Source Current Diode Forward Voltage
1
2
Reverse Recovery Time Reverse Recovery Charge
(Body Diode) (Body Diode) VGS= 0V , IS= – ID[Cont.] IS= – ID[Cont.] , dls / dt = 100A/µs IS= – ID[Cont.] , dls / dt = 100A/µs
THERMAL CHARACTERISTICS
Characteristic Min. Typ. Max.Unit
R R
θJC θJA
Junction to Case Junction toAmbient
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Pulse Test: Pulse Width < 380µS , Duty Cycle < 2%
3) See MIL–STD–750 Method 3471 CAUTION — Electrostatic Sensitive Devices. Anti-Static Procedures Must Be Followed.
Semelab plc.Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk
Website: http://www.semelab.co.uk
800
11
11 44
1.3
0.50 40
A
V
ns
µC
°C/W
6/99
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