Semelab Plc SML100A9 Datasheet

TO–3 Package Outline.
Dimensions in mm (inches)
SML100A9
N–CHANNEL
25.15 (0.99)
26.67 (1.05)
10.67 (0.42)
11.18 (0.44)
38.61 (1.52)
39.12 (1.54)
29.9 (1.177)
30.4 (1.197)
16.64 (0.655)
Pin 1 – Gate Pin 2 – Source Case – Drain
12
17.15 (0.675)
3
(case)
3.84 (0.151)
4.09 (0.161)
1.47 (0.058)
1.60 (0.063)
1.52 (0.06)
3.43 (0.135)
7.92 (0.312)
12.70 (0.50)
6.35 (0.25)
9.15 (0.36)
D
G
S
ENHANCEMENT MODE
HIGH VOLTAGE
POWER MOSFETS
V
max.
22.23
(0.875)
DSS
I
D(cont)
R
DS(on)
• Faster Switching
• Lower Leakage
• TO–3 Hermetic Package
StarMOS is a new generation of high voltage N–Channel enhancement mode power MOSFETs. This new technology minimises the JFET effect, increases packing density and reduces the on-resistance. StarMOS also achieves faster switching speeds through optimised gate layout.
1000V
9A
1.100
ABSOLUTE MAXIMUM RATINGS (T
V
DSS
I
I
DM
V
GS
V
GSM
P
TJ, T T
L
I
AR
E
AR
E
AS
STG
Drain – Source Voltage Continuous Drain Current Pulsed Drain Current
1
Gate – Source Voltage Gate – Source Voltage Transient Total Power Dissipation @ T Derate Linearly Operating and Storage Junction Temperature Range Lead Temperature : 0.063” from Case for 10 Sec.
1
Avalanche Current
(Repetitive and Non-Repetitive) Repetitive Avalanche Energy Single Pulse Avalanche Energy
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Starting TJ= 25°C, L = 29.88mH, RG= 25, Peak IL= 9A
= 25°C unless otherwise stated)
case
= 25°C
case
1
2
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk
Website: http://www.semelab.co.uk
1000
9
36 ±30 ±40 200
1.6
–55 to 150
300
9
30
1210
V A A
V
W
W/°C
°C
A
mJ
6/99
SML100A9
STATIC ELECTRICAL RATINGS (T
Characteristic Test Conditions Min. Typ. Max. Unit
BV
DSS
Drain – Source Breakdown Voltage Zero Gate Voltage Drain Current
I
DSS
I
GSS
V
GS(TH)
I
D(ON)
R
DS(ON)
(VGS= 0V) Gate – Source Leakage Current Gate Threshold Voltage
On State Drain Current
2
Drain – Source On State Resistance
DYNAMIC CHARACTERISTICS
Characteristic Test Conditions Min. Typ. Max. Unit
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge
3
Gate – Source Charge Gate – Drain (“Miller”) Charge Turn–on Delay Time Rise Time Turn-off Delay Time Fall Time
= 25°C unless otherwise stated)
case
VGS= 0V , ID= 250µA VDS= V VDS= 0.8V VGS= ±30V , VDS= 0V VDS= VGS, ID= 1.0mA VDS> I VGS= 10V
2
VGS= 10V , ID= 0.5 ID[Cont.]
VGS= 0V VDS= 25V f = 1MHz VGS= 10V VDD= 0.5 V ID= ID[Cont.] @ 25°C VGS= 15V VDD= 0.5 V ID= ID[Cont.] @ 25°C RG= 1.6
DSS
D(ON)
, TC= 125°C
DSS
x R
DS(ON)
DSS
DSS
Max
1000
V
25
µA
250
±100
24
9
1.100
nA
V
A
3050 3660
280 390
pF 135 200 150 225
16 24
nC
70 105 12 24 11 22
ns
55 85 12 24
SOURCE – DRAIN DIODE RATINGS AND CHARACTERISTICS
Characteristic Test Conditions Min. Typ. Max. Unit
I I V t Q
S SM
SD
rr
rr
Continuous Source Current Pulsed Source Current Diode Forward Voltage
1
2
Reverse Recovery Time Reverse Recovery Charge
(Body Diode) (Body Diode) VGS= 0V , IS= – ID[Cont.] IS= – ID[Cont.] , dls / dt = 100A/µs IS= – ID[Cont.] , dls / dt = 100A/µs
THERMAL CHARACTERISTICS
Characteristic Min. Typ. Max. Unit
R R
θJC θJA
Junction to Case Junction to Ambient
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Pulse Test: Pulse Width < 380µS , Duty Cycle < 2%
3) See MIL–STD–750 Method 3471 CAUTION — Electrostatic Sensitive Devices. Anti-Static Procedures Must Be Followed.
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk
Website: http://www.semelab.co.uk
700
9
9
36
1.3
0.62 30
A
V
ns
µC
°C/W
6/99
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