Seme 2N6794 Datasheet

2N6794
LAB
SEME
Semelab plc. Telephone +44(0)1455) 556565. Fax +44(0)1455) 552612.
E-mail: sales@semelab.co.uk
Website http://www.semelab.co.uk
4/99
GS
Gate – Source Voltage
I
D
Continuous Drain Current (VGS= 10V , T
case
= 25°C)
I
D
Continuous Drain Current (VGS= 10V , T
case
= 100°C)
I
DM
Pulsed Drain Current
1
D
Power Dissipation @ T
case
= 25°C
Linear Derating Factor
AS
Single Pulse Avalanche Energy
2
dv/dt Peak Diode Recovery
3
TJ, T
stg
Operating and Storage Temperature Range
R
q
JC
Thermal Resistance Junction to Case
R
q
JCA
Thermal Resistance Junction-to-Ambient
±20V
1.5A 1A
6.5A
20W
0.16W/°C
0.11mJ
3.5V/ns
–55 to 150°C
6.25°C/W 175°C/W
MECHANICAL DATA
Dimensions in mm (inches)
ABSOLUTE MAXIMUM RATINGS (T
case
= 25°C unless otherwise stated)
TO39 – Package
Notes
1) Pulse Test: Pulse Width £300ms, 2%
2) @ VDD= 50V , L ³0.100mH , RG= 25W, Peak IL= 1.5A , Starting TJ= 25°C
3) @ ISD£
1.5A , di/dt £50A/ms , VDD£
BV
DSS
, TJ£
150°C , SUGGESTED RG= 7.5
W
N–CHANNEL
POWER MOSFET
FEATURES
• AVALANCHE ENERGY RATED
• HERMETICALLY SEALED
• DYNAMIC dv/dt RATING
• SIMPLE DRIVE REQUIREMENTS
Pin 1 – Source Pin 2 – Gate Pin 3 – Drain
BV
DSS
500V
I
D(cont)
1.5
R
DS(on)
3.0
WW
WW
Also available in a low profile version.
6.10 (0.240)
6.60 (0.260)
8.89 (0.35)
9.40 (0.37)
7.75 (0.305)
8.51 (0.335)
0.89 max.
(0.035)
12.70
(0.500)
min.
7.75 (0.305)
8.51 (0.335) dia.
5.08 (0.200) ty p .
2.54
(0.100)
0.66 (0.026)
1.14 (0.045)
0.71 (0.028)
0.86 (0.034)
123
45°
2N6794
LAB
SEME
Semelab plc. Telephone +44(0)1455) 556565. Fax +44(0)1455) 552612.
E-mail: sales@semelab.co.uk
Website http://www.semelab.co.uk
4/99
Parameter Test Conditions Min. Typ. Max. Unit
VGS= 0 ID= 1mA Reference to 25°C ID= 1mA VGS= 10V ID= 1A VGS= 10V ID= 1.5A VDS= V
GS
ID= 250mA
VDS³
15V IDS= 1A
VGS= 0 VDS= 0.8BV
DSS
TJ= 125°C VGS= 20V VGS= –20V
VGS= 0 VDS= 25V f = 1MHz VGS= 10V ID= 1.5A VDS= 0.5BV
DS
ID=1.5A VDS= 0.5BV
DS
VDD= 250V ID= 1.5A RG= 7.5
W
IS= 1.5A TJ= 25°C VGS= 0 IF= 1.5A TJ= 25°C di/ dt£
100A/ms VDD£
50V
ELECTRICAL CHARACTERISTICS (T
amb
= 25°C unless otherwise stated)
Drain – Source Breakdown Voltage Temperature Coefficient of Breakdown Voltage Static Drain – Source On–State Resistance Gate Threshold Voltage Forward Transconductance
Zero Gate Voltage Drain Current Forward Gate
– Source Leakage
Reverse Gate
– Source Leakage
Input Capacitance Output Capacitance Reverse Transfer Capacitance
Total Gate Charge Gate – Source Charge
Gate – Drain (“Miller”) Charge Turn–On Delay Time Rise Time Turn–Off Delay Time Fall Time
Continuous Source Current Pulse Source Current
2
Diode Forward Voltage Reverse Recovery Time
Reverse Recovery Charge Forward Turn–On Time
500
0.43 3
3.45 2 4 1
25 250 100
–100
350
80 35
7.3 16.7
0.1 3
3.7 8.7 40 30 60 30
1.5
6.5
1.2
900
5.9
Negligible
5.0
15.0
V
V/°C
W
V
S(
W
m
A
nA
pF
nC
nC
ns
A
V
ns
m
C
nH
BV
DSS
D
BV
DSS
D
T
J
R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
I
GSS
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
L
D
L
S
STATIC ELECTRICAL RATINGS
Notes
1) Pulse Test: Pulse Width £300ms,
d £
2%
2) Repetitive Rating – Pulse width limited by maximum junction temperature.
DYNAMIC CHARACTERISTICS
SOURCE – DRAIN DIODE CHARACTERISTICS
Internal Drain Inductance
(from centre of drain pad to die)
Internal Source Inductance (from centre of source pad to end of source bond wire)
PACKAGE CHARACTERISTICS
(W)
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