9.2VISUAL INSPECTION STANDARD .............................................................. 28
9.3PVTMFG.TEST PLAN ..................................................................... 28
2
0. Revision History
Date
Document
revision
COMPANY CONFIDENTIAL
Version
Author
Change Description
2017/08/25 1.0
2017/9/20 1.1
NA Fly Huang
NA
Fly Huang
Initial released
Update 4.1 Schematic Part
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COMPANY CONFIDENTIAL
1. Introduction
Project Name: J26H006
This documentation describes the engineering requirements specification of RTL8723DU
11n+BT Combo Module. It is a confidential document of Foxconn.
1.1 Scope
This module design is based on Realtek RTL8723DU chipset .The RTL8723DU is a
highly integrated single-chip 802.11b/g/n 1T1R WLAN, and an integrated Bluetooth
2.1/4.2 single chip with USB 2.0 multi-function. It provides a complete solution for a high
performance integrated wireless LAN and Bluetooth controller. The RTL8723DU WLAN
baseband implements Orthogonal Frequency Division Multiplexing (OFDM) with 1
transmit and 1 receive path and is compatible with the 802.11n specification. Features
include one spatial stream transmission, spatial spreading, and transmission over 20MHz
bandwidth. This module support antenna diversity for better coverage
This specification is applied at the product to deliver to Seiko Epson group (including
an overseas subsidiary),and EMS, the outsourcer to utilize in the company.
1.2 Function
z USB2.0 interface for WLAN and BT.
z Support single-band WLAN 20MHz at 2.4GHz
z Support BT4.2+HS , BLE and be backwards compatible with BT1.x,2.x+EDR.
z Support BT-WLAN coexistence.
z Support Antenna diversity.
z GP compliance
In accordance with SEIKO EPSON Group's requirements specified by the latest
“Green Purchasing Standard for Production Materials", all production materials shall
conform to SEIKO Epson’s policy about chemical substances already banned or to be
eliminated and shall be controlled by "4M Variation Management".
Country Approval Certification Certification No. Remark
USA NO FCC TBD
Canada NO IC TBD
EU NO CE
Japan NO TELEC
….
TBD
TBD
2. Mechanical Specification
2.1 Module Mechanical Drawing
Ⅰ.For J26H006.C01: Typical module dimension (W x L) is 28mmx28mm.
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COMPANY CONFIDENTIAL
Unit: mm
The tolerance for each mechanical dimension
1
Note
: The max shift degree of WTB connector is 2.3degree.
Ⅱ. For J26H006.B01: Typical module dimension (W x L) is 28mmx28mm.
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COMPANY CONFIDENTIAL
The tolerance for each mechanical dimension
Unit: mm
2
Note
: The max shift degree of BTB connector is 2.3degree.
2.2 USB Connector
Ⅰ.For J26H006.C01:WTB Connector
¾ 4pin, 2.0mm pitch, Right angle type
¾ Part number: HFK2040-G1C3K-8F
¾ Vendor: Foxconn FIT
¾ High temperature plastic PA9T which meet SMT reflow profile(PIP)
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COMPANY CONFIDENTIAL
Ⅱ. For J26H006.B01: BTB Connector
¾ 4pin, 2.0mm pitch, Vertical type
¾ Part number: HFL1040-G1C3K-9F
¾ Vendor: Foxconn FIT
¾ High temperature plastic PA9T which meet SMT reflow profile(PIP)
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COMPANY CONFIDENTIAL
2.3 RF Switch Connector
¾ Part number: MM8030-2610RJ3
¾ Vendor: Murata
3.USB Connector Pin-out
Pin Number Pin Name I/O Description
1 VDD33 I DC 3.3V source input
2 USB_DN I/O USB D- Signal
3 USB_DP I/O USB D+ Signal
4 GND -- Ground
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COMPANY CONFIDENTIAL
5. Electrical Specification
5.1 Recommended Operating Condition
Symbol Condition Min.Typ. Max Unit
3.3v(VDD33) Respect to GND 3.0 3.3 3.6 V
Max Ripple on Supplied Voltage 3.3V @full loading 95 330 mVpp
DC current @3.3V at full loading
(WiFi @TX and BT @ TX)
USB Suspend current -- 3.6 6 mA
Operating Temperature 0 +25 +70
Storage Temperature -25 25 +85
Operating Humidity 30~50%90% RH
ESD HBM(contact) Standard:MIL-STD-883H+/-1.5 KV
ESD (indirect) Standard:EN61000-4-2 +/-4 KV
Function operation is not guaranteed outside of this limit, and operation outside of this limit for extended
period can adversely affect long-term reliability of the device.
- 257 500 mA
℃
℃
5.2 RF Characteristics
All typical performance specification are measured at RF connector port operating in +25℃@3.3V
3
: The target power table is just defined for board level.
Note
4
: Power is compliance with EVM IEEE spec based-on the parameter “disable full packet”
Note
Standard IEEE802.11b/g/n
Data Rate
Bandwidth 20MHz for 2.4GHz,
Modulation Techniques
Operating Frequency 2.412GHz~2.462GHz,
Media Access Control CSMA/CA with ACK
WiFi
Transmit Output Power
Frequency error +/-10ppm
Receiver Sensitivity
Radio Modulation FHSS
Operating Frequency 2.402GHz ~ 2.480GHz
Channel Numbers 79 channels with 1MHz BW
BDR Transmitter Output
Power
BDR Power Control 2dB≤Power Control Step≤8dB
BDR Initial Carrier Freq.
Tolerance
RMS DEVM<=0.13 for all 8DPSK @3Mbps
Peak DEVM<=0.25 for all 8DPSK @3Mbps
99% DEVM<=0.2 for 99% 8DPSK @3Mbps
-80dBm@BER <= 0.01% at 3Mbps
≤1MHz
225kHz ≤ ∆f1avg ≤275kHz;
∆f2max ≥185kHz for at least 99.9% test packets;
∆f2avg/∆f1avg ≥0.8
Carrier frequency offset: ±150kHz
Carrier Drift: ≤50kHz
Drift rate: ≤20kHz/50us
5.3 Current consumption
5.3.1 WiFi current consumption
Remark: Base-on Win7 OS to do WiFi only throughput tests. The Standby mode means “module connect to
AP only, and don’t transfer the data.”
5.3.2 Bluetooth current consumption
Test Condition
Idle mode( power on only) 63.7 mA
BT BDR 1DH5 TX@6dBm 115 mA
BT BDR 1DH5 Rx 87 mA
BT EDR 2DH5 TX@6dBm 116 mA
BT EDR 2DH5 Rx 87 mA
BLE TX@6dBm 78 mA
BLE Rx 87 mA
Standby mode* 69 mA
Avg. Current at 3.3V
Min Typ. Max
Unit
Remark: The result is base-on Win7 driver.
The Idle mode means “ module power on only, don’t open any testing tool”
The standby mode means “module connect to BT device only, and don’t transfer the data”
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COMPANY CONFIDENTIAL
C
5.4 eFuse Content
5.4.1 WiFi eFuse
Revision Note
EEPROM Version Chang Lists Owner Date Remark
address Value for WiFi Efuse address 0xC4, change
0xC4 0x01
value from 0x00 to 0x01
address01 2 3 4 5 6 7 8 9 A B C D E FPath A cck TX calibration power index
eFuse for WiFieFuse address
029 81007C01880700 A004 EC3512C0A2D8
116 1413121212191817 161602FFFFFFFFPath A 11n HT40 mcs7 TX calibratio n
2FF FFFFFF FFFFFFFFFF FFFFFFFFFFFFFF
3FF FFFFFFFFFFFFFFFF FF1414141312120x1BPath A pow er diff in dex (offse t)fixed value
417 1717161502FFFFFF FF FFFFFFFFFFFF
5FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FFPath B cck TX power calibration index
6FF FFFFFF FFFFFFFFFF FFFFFFFFFFFFFF
7FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FFPath B 11n HT40 mcs7 TX calibration power index
8FF FFFFFF FFFFFFFFFF FFFFFFFFFFFFFF
9FF FFFFFF FFFFFFFFFF FFFFFFFFFFFFFF0x45Path B power diff index(offset)fixed value
AFF FFFFFFFFFFFFFFFF FF FFFFFFFFFFFF
BFFFFFFFFFFFFFFFF20 1F1A000000FFFF0xB8channel plan:0x20fixed value
CFF292050010000FF00 FF11FFFFFFFFFF
DFF FFFFFFFFFFFFFFFF FF FFFFFFFFFFFF0xB9Crystal calibration data
EFFFFFFFFFFFFFFFFFF FF FFFFFFFFFFFF