SEEED GRV TOUCH SENS Datasheet

Preliminary
TTP223
1 KEY TOUCH PAD DETECTOR IC
GENERAL DESCRIPTION
FEATURES
Operating voltage 2.0V~5.5V Operating current @VDD=3V, no load, SLRFTB=1
At low power mode typical 1.5uA, maximum 3.0uA At fast mode typical 3.5uA, maximum 7.0uA @VDD=3V, no load, SLRFTB=0
At low power mode typical 2.0uA, maximum 4.0uA At fast mode typical 6.5uA, maximum 13.0uA
The response time max about 60mS at fast mode, 220mS at low power mode @VDD=3V Sensitivity can adjust by the capacitance(0~50pF) outside Have two kinds of sampling length by pad option(SLRFTB pin) Stable touching detection of human body for replacing traditional direct switch key Provides Fast mode and Low Power mode selection by pad option(LPMB pin) Provides direct modetoggle mode by pad option(TOG pin)
Open drain mode by bonding option, OPDO pin is open drain output, Q pin is CMOS output
All output modes can be selected active high or active low by pad option(AHLB pin) Have the maximum on time 100sec by pad option(MOTB pin) Have external power on reset pin(RST pin) After power-on have about 0.5sec stable-time, during the time do not touch the key pad,
And the function is disabled Auto calibration for life
And the re-calibration period is about 4.0sec, when key has not be touched
APPLICATION
Wide consumer products Water proofed electric products Button key replacement
08’/04/07 Page 1 of 11 Ver :1.0
BLOCK DIAGRAM
Preliminary
TTP223
Sensor & Reference
detecting circuit
Touch detecting
circuit
Key-on & timing
control
LPMB
MOTB
SLRFTB
RST
I
Sensor oscillator
circuit
Timing counter
System oscillator
circuit
PAD DESCRIPTION
Pad No. Pad Name I/O Type Pad Description
Output
mode
&
driver circuit
Q
OPDO
TOG
AHLB
1 Q O CMOS output pin 2 OPDO O Open drain output pin 3 VSS P Negative power supply, ground 4 LPMB I-PH Low power mode selection,
1=>Fast mode; 0=>Low power mode
5 TOG I-PL Output type option pin,
1=>Toggle mode; 0=>Direct mode 6 VDD P Positive power supply 7 AHLB I-PL Output active high or low selection,
1=>Active low; 0=>Active high 8 RST I-PL External power on reset pin 9 SLRFTB I-PH Selecting the sampling length,
1=>about 1.6msec; 0=>about 3.2msec
10 MOTB I-PH Maximum on time 100sec selection,
1=>Disable, 0=>Enable
11 I I/O Input sensor port
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Preliminary
ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings
Parameter Symbol Conditions Value Unit
Operating Temperature TOP Storage Temperature T Power Supply Voltage VDD Input Voltage VIN NoteVSS symbolizes for system ground
STG
─ ─
Ta=25°C Ta=25°C
-20 ~ +70
-50 ~ +125
VSS-0.3 ~ VSS+5.5 V
VSS-0.3 ~ VDD+0.3 V
DC/AC Characteristics(Test condition at room temperature=25℃)
Parameter Symbol Test Condition Min. Typ. Max. Unit
TTP223
℃ ℃
Operating Voltage
System oscillator
Sensor oscillator F
Operating Current
Input Ports
Input Ports
Output Port Sink Current
Output Port Source Current
Output Response Time
Input Pin Pull-high Resistor
Input Pin Pull-low Resistor
VDD
F
FAS T
F
LOW
SEN
IOP
VIL VIH
IOL
IOH
TR
RPH
RPL
VDD=3V
VDD=3V no load
VDD=3V at low power mode and output no load
VDD=3V at fast mode and output no load
Input Low Voltage
Input High Voltage
VDD=3V, VOL=0.6V
VDD=3V, VOH=2.4V
VDD=3V, At fast mode VDD=3V, At low power mode VDD=3V,
(LPMB, MOTB, SLRFTB) VDD=3V, (TOG, AHLB) VDD=3V, (RST)
2.0
3 5.5 V
- 512K ­ 16K
- 1M - Hz
SLRFTB =1 SLRFTB =0 SLRFTB =1 SLRFTB =0
- 1.5 3.0
- 2.0 4.0
- 3.5 7.0
6.5 13.0
0 - 0.2 VDD
0.8 - 1.0 VDD
- 8 - mA
- -4 - mA 60
220 35K ohm
28K
200K
Hz
uA
mS
ohm
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Preliminary
TTP223
FUNCTION DESCRIPTION
1. Sensitivity adjustment
The total loading of electrode size and capacitance of connecting line on PCB can affect the
sensitivity. So the sensitivity adjustment must according to the practical application on PCB. The TTP223 offers some methods for adjusting the sensitivity outside. 1-1 by the electrode size Under other conditions are fixed. Using a larger electrode size can increase sensitivity. Otherwise it can decrease sensitivity. But the electrode size must use in the effective scope. 1-2 by the panel thickness Under other conditions are fixed. Using a thinner panel can increase sensitivity. Otherwise it can decrease sensitivity. But the panel thickness must be below the maximum value. 1-3 by the value of Cs (please see the down figure) Under other conditions are fixed. When do not use the Cs to VSS, the sensitivity is most sensitive. When adding the values of Cs will reduce sensitivity in the useful range (0≦Cs≦50pF).
VDD
ELECTRODE
Cs
VDD
I
SLRFTB
VSS
Q
OPDO
TOG AHLB LPMB
MOTB
RST
2. Output mode
The TTP223 has direct mode active high or low by AHLB pad option. And has toggle mode by
TOG pad option. Another has open drain mode by bonding option. Pad Q is digital output, pad OPDO is open drain output.
TOG AHLB Pad Q option features Pad OPDO option features
0 0 Direct mode,
CMOS active high output
0 1 Direct mode,
CMOS active low output
1 0 Toggle mode,
Power on state=0
1 1 Toggle mode,
Power on state=1
Direct mode, Open drain active high output Direct mode, Open drain active low output Toggle mode, Power on state high-Z, Active high Toggle mode, Power on state high-Z, Active low
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Preliminary
TTP223
3. Maximum key on duration time (By MOTB pad option)
If some objects cover in the sense pad, and causing the change quantity enough to be detected. To prevent this, the TTP223 sets a timer to monitor the detection. The timer is the maximum on duration time. It is set about 100sec at 3V. When the detection is over the timer, the system will return to the power-on initial state, and the output becomes inactive until the next detection.
MOTB Option features
1 Infinite(Disable maximum on time) 0 Maximum on time 100sec
4. Fast and Low power mode selection (By LPMB pad option)
The TTP223 has Fast mode and Low Power mode to be selected. It depends on the state of LPMB pad. When the LPMB pin is opened or connected to VDD, the TTP223 runs in Fast mode. When the LPMB pin is connected to VSS, the TTP223 runs in Low Power mode. In the Fast mode response time is faster, but the current consumption will be increased. In the Low Power mode it will be saving power, but will be slowing response time for first touch. When it awaked in fast mode, the response time is the same the fast mode. In this mode when detecting key touch, it will switch to Fast mode. Until the key touch is released and will keep a time about 12sec. Then it returns to Low Power mode. The states and timing of two modes please see below figure.
VDD
LPMB
VSS
~20ms
VDD
I
VSS
VDD
Q
VSS
KEY TOUCH KEY RELEASE
Fast Mode
VDD
LPMB
VSS
VDD
I
VSS
VDD
Q
VSS
Low Power
mode timing
(NOT REALLY TOUCH)
Fast mode
timing
KEY RELEASEPOSSIBLE KEY TOUCH
Low Power
mode timing timing
KEY TOUCH
Fast mode
KEY RELEASE
Low Power
mode timing
~160msABOUT 12SEC~20ms~160ms~20ms~160ms
Low Power Mode
LPMB Option features
1 Fast mode 0 Low Power mode
5. Sampling length selection (By SLRFTB pad option)
The TTP223 has two kinds of sampling length to be selected. It depends on the state of SLRFTB pad. When the SLRFTB pin is opened or connected to VDD, the sampling length is about 1.6msec. When the SLRFTB pin is connected to VSS, the sampling length is about 3.2msec. When selecting 3.2msec sampling length the sensitivity will be better, but the current consumption will be increased. Recommend to use 1.6msec sampling length.
SLRFTB Option features
1 Sampling length = 1.6msec 0 Sampling length = 3.2msec
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6. Option pin
For power saving concern and package bonding option consideration, all the feature option pins with latch type design and initial states are 0 or 1 as power on. If those pins are forced to VDD or VSS, the states will be changed to 1 or 0 without any current leakage to conflict the power saving issue.
Preliminary
TTP223
Feature option pins Initial state by Power on
AHLB 0
TOG 0
LPMB 1
MOTB 1
SLRFTB 1
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APPLICATION CIRCUIT
Preliminary
TTP223
Sense Pad
Cs
TTP223-ASB SSOP-16
1 NC
2 AHLB
3 RST
4 SLRFTB
5 MOTB
6 I
7 NC
8 NC
VDD 16
TOG 15
LPMB 14
VSS 13
OPDQ 12
Q 11
NC 10
NC 9
VDD
104
C1
PS1. On PCB, the length of lines from touch pad to IC pin shorter is better.
And the lines do not parallel and cross with other lines.
2. The power supply must be stable. If the supply voltage drift or shift quickly, maybe causing sensitivity anomalies or false detections.
3. The material of panel covering on the PCB can not include the metal or the electric element.
The paints on the surfaces are the same.
4. The capacitance Cs can be used to adjust the sensitivity. The value of Cs use smaller, then the sensitivity will be better. The sensitivity adjustment must according to the practical application on PCB. The range of Cs value is 0~50pF.
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Preliminary
TTP223
PACKAGE LIST
1. TTP223-ASB
Option Features Package Item Package Type
AHLB TOG LPMB MOTB SLRFTB RST Q OPDO
TTP223-ASB SSOP-16 V V V V V V V V
P. S . : Th e m a r k o f 〝V 〞 express that package item has the option feature pin.
TTP223-ASB PACKAGE CONFIGURATION
TOG
LPMB
VSS
13
14
15
16
TTP223-A
Date code
Lot No.
4
3
2
1VDD
OPDO
12
5
Q
11
6
NC
10
7
NCNC
9
8
Package Outline Dimension
NC
AHLB
RST
MOTB
SLRFTB
I
NC
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Preliminary
TTP223
2. TTP223-BA6
Option Features Package Item Package Type
AHLB TOG LPMB MOTB SLRFTB RST Q OPDO
TTP223-BA6 SOT-23-6L V V 0 1 1 X V X
P.S.: The mark of V express that package item has the option feature pin. The mark of X express that package item has no the option feature pin. The mark of 0 express that the state of option pin is fixed to VSS in the package item. The mark of 1 express that the state of option pin is fixed to VDD in the package item.
TTP223-BA6 PACKAGE CONFIGURATION
TOG
VDD
AHLBI
6
5
43
223B
Lot No.(Latter 5 digit)
2
1
Package Outline Dimension
Q
VSS
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Preliminary
TTP223
3. TTP223-DO8
Option Features Package Item Package Type
AHLB TOG LPMB MOTB SLRFTB RST Q OPDO
TTP223-DO8 SOP-8 V V V V 1 X V X
P.S.: The mark of V express that package item has the option feature pin. The mark of X express that package item has no the option feature pin. The mark of 0 express that the state of option pin is fixed to VSS in the package item. The mark of 1 express that the state of option pin is fixed to VDD in the package item.
TTP223-DO8 PACKAGE CONFIGURATION
Q
VSS
LPMB
TOG8
7
6
5
TTP223-D
Date code
Lot No.
Package Outline Dimension
1
VDD
2
AHLB
3
MOTB
4
I
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ORDER INFORMATION
a. Package form: TTP223-XXX b. Chip form: TCP223 c. Wafer base: TDP223
REVISE HISTORY
1. 2008/04/07
-Original version:V_1.0
Preliminary
TTP223
08’/04/07 Page 11 of 11 Ver :1.0
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