SECO SECOFCC1 Users manual

UDOO X86

Next-gen Open hardware SBC with the N-series Intel® Pentium® / Celeron® and x5-Series Atom

SoCs

Revision

Date

Note

Ref

1.0

30th March 2017

First Official Release.

1.1

3rd May 2017

Minor corrections. M.2 Key B specifications updated UEFI BIOS Section updated

1.2

9th June 2017

Block Diagram SATA reference corrected FCC certification paragraph added

1.3

4th August 2017

Minor corrections (DC barrel plug dimensions added in par. 2.3 CN22 connector s P/N and image corrected in par. 3.3.11)

1.4

11th September 2017

UEFI BIOS Section updated (par. 4.3.4.4 , 4.5.3 updated)

1.5

9th April 2018

FCC certification paragraph updated ISED certification paragraph added

REVISION HISTORY

This manual is released under Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0) license

Every effort has been made to ensure the accuracy of this manual. However, SECO S.r.l. accepts no responsibility for any inaccuracies, errors or omissions herein. SECO S.r.l. reserves the right to change precise specifications without prior notice to supply the best product possible.

Some of the information found in the UEFI BIOS SETUP Chapter has been extracted from the following copyrighted Insyde Software Corp. documents:

InsydeH2O Setup Utility - User Reference Guide The above mentioned documents are copyright © 2008 Insyde Software Corp. All rights reserved. To get the required assistance for any and possible issues, please contact us using the dedicated web form available at http://www.udoo.org/customer-

care/open.php.

Our team is ready to assist.

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INDEX

INTRODUCTION .......................................................................................................................................................................... 5 Chapter 1.

1.1 Warranty ........................................................................................................................................................................................................................................ 6

1.2 Information and assistance ............................................................................................................................................................................................................. 7

1.3 RMA number request ..................................................................................................................................................................................................................... 7

1.4 Safety ............................................................................................................................................................................................................................................ 8

1.5 Electrostatic discharges ................................................................................................................................................................................................................. 8

1.6 RoHS compliance .......................................................................................................................................................................................................................... 8

1.7 FCC certification ............................................................................................................................................................................................................................ 9

1.8 ISED certification .......................................................................................................................................................................................................................... 10

1.9 Terminology and definitions .......................................................................................................................................................................................................... 11

1.10 Reference specifications .............................................................................................................................................................................................................. 13

OVERVIEW ............................................................................................................................................................................... 14 Chapter 2.

2.1 Introduction .................................................................................................................................................................................................................................. 15

2.2 Technical specifications ............................................................................................................................................................................................................... 16

2.3 Electrical specifications ................................................................................................................................................................................................................ 17

2.3.1 RTC Battery ................................................................................................................................................................................................................................................ 17

2.3.2 Power consumption ..................................................................................................................................................................................................................................... 18

2.3.3 Power rails naming convention ..................................................................................................................................................................................................................... 19

2.4 Mechanical specifications............................................................................................................................................................................................................. 20

2.5 Block diagram .............................................................................................................................................................................................................................. 21

CONNECTORS ......................................................................................................................................................................... 22 Chapter 3.

3.1 Introduction .................................................................................................................................................................................................................................. 23

3.2 Connectors overview ................................................................................................................................................................................................................... 24

3.3 Connectors description ................................................................................................................................................................................................................ 25

3.3.1 Ethernet connector ...................................................................................................................................................................................................................................... 25

3.3.2 USB ports ................................................................................................................................................................................................................................................... 26

3.3.3 HDMI connector .......................................................................................................................................................................................................................................... 28

3.3.4 miniDP++ Connectors ................................................................................................................................................................................................................................. 29

3.3.5 Audio interfaces ........................................................................................................................................................................................................................................... 30

3.3.6 Buttons / LED header .................................................................................................................................................................................................................................. 31

3.3.7 μSD slot ..................................................................................................................................................................................................................................................... 32

3.3.8 S-ATA connectors ....................................................................................................................................................................................................................................... 32

3.3.9 M.2 SATA/PCI-e Slot: Socket 2 Key B type 2242/3042/2260 ....................................................................................................................................................................... 33

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3.3.10 M.2 Connectivity Slot: Socket 1 Key E Type 2230 ......................................................................................................................................................................................... 34

3.3.11 FAN connector ............................................................................................................................................................................................................................................ 35

3.3.12 UDOO Bricks connector .............................................................................................................................................................................................................................. 36

3.3.13 SPI Header .................................................................................................................................................................................................................................................. 36

3.3.14 ARDUINO interface + expansion connectors ................................................................................................................................................................................................. 36

3.3.15 IR Receiver .................................................................................................................................................................................................................................................. 39

UEFI BIOS SETUP ..................................................................................................................................................................... 40 Chapter 4.

4.1 InsydeH2O setup Utility ................................................................................................................................................................................................................ 41

4.2 Main setup menu ......................................................................................................................................................................................................................... 42

4.2.1 System Time / System Date ......................................................................................................................................................................................................................... 42

4.3 Advanced menu .......................................................................................................................................................................................................................... 43

4.3.1 Boot configuration submenu......................................................................................................................................................................................................................... 43

4.3.2 Security configuration (TXE) submenu ................................................................................................ ................................................................ ........................................... 43

4.3.3 Video configuration submenu ....................................................................................................................................................................................................................... 44

4.3.4 Chipset configuration submenu .................................................................................................................................................................................................................... 45

4.3.5 ACPI Table/features submenu ...................................................................................................................................................................................................................... 48

4.3.6 SATA configuration submenu ....................................................................................................................................................................................................................... 48

4.3.7 Console Redirection submenu ..................................................................................................................................................................................................................... 49

4.3.8 POST Hot Key submenu .............................................................................................................................................................................................................................. 51

4.3.9 Other configuration submenu ....................................................................................................................................................................................................................... 51

4.4 Security menu.............................................................................................................................................................................................................................. 52

4.5 Power menu ................................................................................................................................................................................................................................ 53

4.5.1 Advanced CPU control submenu ................................................................................................................................................................................................................. 55

4.5.2 EC Watchdog Configuration submenu .......................................................................................................................................................................................................... 56

4.5.3 Thermal Zone configuration submenu ........................................................................................................................................................................................................... 56

4.6 Boot menu .................................................................................................................................................................................................................................. 57

4.6.1 Legacy submenu ......................................................................................................................................................................................................................................... 59

4.7 Exit menu .................................................................................................................................................................................................................................... 60

APPENDICES............................................................................................................................................................................ 61 Chapter 5.

5.1 Accessories ................................................................................................................................................................................................................................. 62

5.1.1 M.2 Dual network modules .......................................................................................................................................................................................................................... 62

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Chapter 1.

 Warranty  Information and assistance  RMA number request  Safety  Electrostatic discharges  RoHS compliance  Terminology and definitions  Reference specifications

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Warning!

s functionalities and could void

the warranty

1.1 Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers. The warranty on this product lasts for 2 years. Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion. Items cannot be returned unless previously authorized by the supplier. The authorization is released after completing the specific form available on the web-site http://www.udoo.org/customer-care/ (Open a New Ticket  Return

Merchandise Application). The RMA authorization number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original packaging, with no signs of damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and has must accompany the returned item. Following a technical analysis, the supplier will verify if all the requirements, for which a warranty service applies, are met. If the warranty cannot be applied, the

Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

All changes or modifications to the equipment not explicitly approved by SECO S.r.l. could impair the equipment’

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1.2 Information and assistance

What do I have to do if I’m experiencing problems with my product? The following services are available:

 UDOO website: visit http://www.udoo.org to receive the latest information on the product. In most cases it is possible to find useful information to solve the

problem.

 UDOO Forum: join to the community of UDOO users. In the forum, available at http://www.udoo.org/forum/, it is possible to search the multiple topics of

the community, and look for other users that had the same kind of problem - and how they solved it. It is also possible to post new topics to ask for specific help.

 Repair centre: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

o Returned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted. o Returned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before asking for technical assistance:

 Name and serial number of the product;  Description of Customer’s peripheral connections;  Description of Customer’s software (operating system, version, application software, etc.);  A complete description of the problem;  The exact words of every kind of error message encountered.

1.3 RMA number request

To request a RMA number, please visit UDOO web-site. On the bottom of the page, please select “Customer Care”, click on the “Open a New ticket” button and. A RMA Number will be sent within 1 working day (only for on-line RMA requests).

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Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid Whenever handling a UDOO X86 board, ground yourself through an anti-static wrist strap. Placement of the board on an anti-static

1.4 Safety

The UDOO X86 board uses only extremely-low voltages. While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

boards.

short circuits due to unwanted contacts with other board components. If the board has become wet, never connect it to any external power supply unit or battery.

1.5 Electrostatic discharges

The UDOO X86 board, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all the devices and/or components on-board.

surface is also highly recommended.

1.6 RoHS compliance

The UDOO X86 board is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

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Warning!

equipment.

1.7 FCC certification

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to

provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the

To comply with FCC RF exposure compliance requirements, a separation distance of at least 20 cm must be maintained between th e antenna of this device and all nearby persons.

SECO srl Model: UDOO X86 Advanced Plus FCC ID: 2ALZB-SECOFCC1 IC: 22688-SECOIC1

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1.8 ISED certification

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR Canada applicables aux appareils radio exempts de licence.

est autorisée aux deux conditions suivantes: (1) ne doit pas produire de brouillage, et (2) de doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible compromettre le fonctionnement. Ce dispositif a été conçu pour fonctionner avec les antennes fournies avec ce produit. antennes peut enfreindre les règles industrielles du

Canada et annuler de quant au fonctionnement de

This device complies with RSS-210, ICES-3(B)/NMB-3(B)

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1.9 Terminology and definitions

ACPI Advanced Configuration and Power Interface, an open industrial standard for the board’s devices configuration and power management AHCI Advanced Host Controller Interface, a standard which defines the operation modes of SATA interface API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems BIOS Basic Input / Output System, the Firmware Interface that initializes the board before the OS starts loading CEC Consumer Electronics Control, an HDMI feature which allows controlling more devices connected together by using only one remote control DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU) DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock DDR3L DDR, 3rd generation, Low voltage DP++ Multimode Display Port, a video interface which can support both Display Port displays (directly) and HDMI/DVI displays (by using and external

adapter) GBE Gigabit Ethernet Gbps Gigabits per second GND Ground GPI/O General purpose Input/Output HD Audio High Definition Audio, most recent standard for hardware codecs developed by Intel® in 2004 for higher audio quality HDMI High Definition Multimedia Interface, a digital audio and video interface I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability IoT Internet of Things M.2 recent specifications for internal expansion modules, which defines many pinouts and sizes for different purposes. Can include SATA, PCI

Express, USB, UART, DP interfaces Mbps Megabits per second MMC/eMMC MultiMedia Card / embedded MMC, a type of memory card, having the same interface as the SD card. The eMMC is the embedded version of

the MMC. They are devices that incorporate the flash memories on a single BGA chip. N.A. Not Applicable N.C. Not Connected OpenCL Open Computing Language, a software library based on C99 programming language, conceived explicitly to realise parallel computing using

Graphics Processing Units (GPU) OpenGL Open Graphics Library, an Open Source API dedicated to 2D and 3D graphics

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OS Operating System PCI-e Peripheral Component Interface Express PSU Power Supply Unit PWM Pulse Width Modulation PWR Power PXE Preboot Execution Environment, a way to perform the boot from the network ignoring local data storage devices and/or the installed OS S-ATA Serial Advance Technology Attachment, a differential full duplex serial interface for Hard Disks SD Secure Digital, a memory card type SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and

other power supply-related devices SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed of a master and one or more slaves, individually

enabled through a Chip Select line TBM To be measured TDP Thermal Design Power, an indication of the amount of heat generated by the processor that must be used for the design of the thermal solution. TMDS Transition-Minimized Differential Signaling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces UEFI Unified Extensible Firmware Interface, a specification defining the interface between the OS and the board’s firmware. It is meant to replace the

original BIOS interface USB Universal Serial Bus V_REF Voltage reference Pin xHCI eXtensible Host Controller Interface, Host controller for USB 3.0 ports, which can also manage USB 2.0 and USB1.1 ports

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Reference

Link

ACPI

http://www.acpi.info

AHCI

http://www.intel.com/content/www/us/en/io/serial-ata/ahci.html

DDC

http://www.vesa.org

Gigabit Ethernet

http://standards.ieee.org/about/get/802/802.3.html

HD Audio

http://www.intel.com/content/dam/www/public/us/en/documents/product-specifications/high-definition-audio-specification.pdf

HDMI

http://www.hdmi.org/index.aspx

I2C

http://www.nxp.com/documents/other/UM10204_v5.pdf

Intel® Front Panel I/O connectivity DG

http://www.formfactors.org/developer/specs/A2928604-005.pdf

M.2

http://pcisig.com/specifications

MMC/eMMC

http://www.jedec.org/committees/jc-649

OpenCL

http://www.khronos.org/opencl

OpenGL

http://www.opengl.org

PCI Express

http://www.pcisig.com/specifications/pciexpress

SATA

https://www.sata-io.org

SD Card Association

https://www.sdcard.org/home

SM Bus

http://www.smbus.org/specs

TMDS

http://www.siliconimage.com/technologies/tmds

UEFI

http://www.uefi.org

USB 2.0 and USB OTG

http://www.usb.org/developers/docs/usb_20_070113.zip

USB 3.0

http://www.usb.org/developers/docs/usb_30_spec_070113.zip

Intel® N-Series Pentium® / Celeron® and x5-Series Atom family

http://ark.intel.com/products/codename/66094/Braswell#@Embedded

1.10 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

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Chapter 2.

 Introduction  Technical specifications  Electrical specifications  Mechanical specifications  Block diagram

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2.1 Introduction

UDOO-X86 is a board designed specifically for maker’s / DIY market, embedding both a System-on-Chips (SoC) of the Intel® family of embedded SoCs formerly coded as Braswell, and an Arduino 101-compatible platform.

This board represents a junction point between the PC world, represented by the Braswell SoCs, and the Arduino 101 World, implemented on-board using an Intel® Curie microcontroller (the same used, indeed, in Arduino 101 boards).

All the SoCs mounted on UDOO X86 are Quad-Core, ranging from 2.00GHz up to 2.56 GHz, with 64-bit instruction set and very low TDP. This single chip solution includes the memory controller, which gives support for up to 8GB of DDR3L memory directly soldered on-board.

All SoCs embed an Intel® HD Graphics controller, with up to 16 Execution units, which offers high graphical performances, with support for Microsoft® DirectX11.1, OpenGL 4.2, OpenCL 1.2, OpenGL ES 3.0 and HW acceleration for video decoding of HEVC, H.264, MPEG2, MVC, VC-1, WMV9, JPEG/MJPEG and VP8 video standards (for H.264, MVC and JPEG/MJPEG also HW encoding is offered). This embedded GPU is able to drive three independent displays, by using the HDMI and the two miniDP++. Any combinations of these video interfaces are supported.

Other features offered by the N-Series Intel® Pentium® / Celeron® and x5-Series Atom family of SoCs, and included in UDOO X86 board, are two SATA Channels (one used for the common SATA / SSD drives, the other used to implement a M.2 Socket 2 Key B SSD slot), microSD interface, four USB ports (three USB 3.0 on standard Type-A sockets, one USB 2.0 on M.2 Socket 1 Key E Connectivity slot and another USB 2.0 port used for the communications with the Intel® Curie microcontroller), HD Audio and four PCI Express lanes (a PCI express lane is used for the implementation of the Gigabit Ethernet interface, two lanes are carried out on M.2 Socket 2 Key B SSD slot, the remaining is available on M.2 Socket 1 Key E Connectivity Slot)

Through the Intel® Braswell SoC’s USB interface #3 pass all the communications with the Intel® Curie microcontroller, which implements the Arduino 101 interface: this situation reproduces exactly the situation of an external Arduino board connected to an X86 PC, with the advantages given by an integrated board solution.

The Intel® Curie microcontroller, however, not only implements the Arduino 101 interface, but also offers an embedded Bluetooth Low Energy interface (with onboard antenna) and 6-axis combo sensor with accelerometer and gyroscope.

All these features, combined together, make UDOO X86 the most powerful maker board ever. Please refer to following chapter for a complete list of all the integrated peripherals and the characteristics.

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** Temperatures indicated are the maximum temperature that the heatspreader / heatsink can reach in any of its parts. This means that it is

s responsibility to use any passive cooling solution along with an

application-dependent cooling system, capable to ensure that the

2.2 Technical specifications

SoC

Intel® Pentium® N3710, Quad Core @1.6GHz (Turbo Boost 2.56GHz), 2MB Cache, 6W TDP Intel® Celeron® N3160, Quad Core @1.6GHz (Turbo Boost 2.24GHz), 2MB Cache, 6W TDP Intel® Atom x5-E8000, Quad Core @1.04GHz, 2MB Cache, 5W TDP

Memory

Up to 8GB Dual Channel DDR3L Memory soldered on-board*

Graphics

Integrated Intel® HD Graphics controller Three independent display support HW decoding of HEVC(H.265), H.264, MPEG2, MVC, VC-1, VP8, WMV9, JPEG/MJPEG formats HW encoding of H.264, MVC and JPEG/MPEG formats

Video Interfaces

HDMI connector 2 x miniDP++ connectors

Video Resolution

Up to 3840 x 2160 24bpp @ 30Hz, 2560 x 1600 24bpp @60Hz

Mass Storage

Optional 32GB eMMC drive onboard SATA 7p M connector M.2 Key B SSD slot (Type 2242 or 2260 modules accepted) microSD Card slot

Networking

Realtek RTL811G Gigabit Ethernet controller Gigabit Ethernet LAN interface M.2 Key E Slot for optional Wireless modules Embedded Bluetooth Low Energy module + antenna

* Please notice that total amount of 8GB would be usable only with 64-bit OS. Total amount of memory available with a 32-bit OS depends on the OS itself (less than 4GB, however).

USB

3 x USB 3.0 Host ports on Type-A sockets 1 x USB 2.0 Host port on M.2 Key E slot

PCI-Express

1 x PCI-e x2 port on M.2 Key B SSD Slot 1 x PCI-e x1 port on M.2 Key E slot

Audio

HD Audio Codec Realtek ALC283 Combo TRSS connector with Mic In and Line out support S/PDIF signal 2 x Speaker internal headers

Serial ports

2 x UART with Flow Control ports

Other Interfaces

Up to 20 extended GPIOs, multiplexed with other interfaces LPC, 2x I2C, T/S signals, GPIOs on expansion connector I2C UDOO bricks connector SPI Connector Switch/LED Front Panel Header CIR (Consumer InfraRed) Sensor Arduino 101 compatible shield Integrated 6-axis combo sensor with accelerometer and gyroscope

Power supply: +12VDC ± 5%

RTC Coin cell Battery Operating temperature: 0°C ÷ +60°C** (Commercial temperature) Dimensions: 120 x 85 mm (4.72” x 3.35”). Supported Operating Systems:

Microsoft® Windows 10, 8.1, 7 Any Linux distribution for X86 64-bit platform Android-x86

customer

’

heatspreader / heatsink temperature remains in the range above indicated.

CAUTION: handling batteries incorrectly or replacing with not-approved devices may present a risk of fire or explosion.

Battery connector - CN1

Signal

RTC

2 GND

2.3 Electrical specifications

The UDOO X86 board needs to be supplied only with an external 12VDC ± 5% power supply, minimum 36W for basic functionalities recommended.

This voltage can be supplied through a standard 6.3mm (internal pin, diameter 2.0 mm) Power Jack (CN21). Internal pin is VIN power line. Mating DC barrel plug: outer diameter 5.5mm, inner diameter 2.1mm.

2.3.1 RTC Battery

For the occurrences when the module is not powered with an external power supply, on board there is a cabled coin Lithium Battery to supply, with a 3V voltage, the Real Time Clock embedded inside the Intel® SoC.

Battery used is a cabled CR2032-LD Lithium coin-cell battery, with a nominal capacity of 220mAh.

The battery is not rechargeable, and can be connected to the board using dedicated connector CN5 which is a 2-pin p1.27 mm type MOLEX p/n 53398-0271 or equivalent, with pinout shown in the table on the left.

Mating connector: MOLEX 51021-0200 receptacle with MOLEX 50079-8000 female crimp terminals. In case of exhaustion, the battery should only be replaced with devices of the same type. Always check the orientation before

inserting and make sure that they are aligned correctly and are not damaged or leaking.

Never allow the batteries to become short-circuited during handling.

Batteries supplied with UDOO X86 are compliant to requirements of European Directive 2006/66/EC regarding batteries and accumulators. When putting out of order UDOO X86, remove the batteries from the board in order to collect and dispose them according to the requirement of the same European Directive above mentioned. Even when replacing the batteries, the disposal has to be made according to these requirements.

Status

SoC / Configuration

N3710

32GB eMMC

8GB RAM

N3160

32GB eMMC

4GB RAM

x5-E3800

32GB eMMC

2GB RAM

Inrush current at boot

920mA

748mA

542mA

Idle, power saving configuration

307mA

264mA

314mA

OS Boot, power saving configuration

454mA

342mA

316mA

Video reproduction@720p, power saving configuration

372mA

359mA

336mA

Video reproduction@1080p, power saving configuration

487mA

420mA

335mA

Internal Stress Test Tool, maximum performance

1008mA

1020mA

906mA

2.3.2 Power consumption

Using the following setup, and using all possible SoCs offered for UDOO X86 board, the current consumption (RMS) has been measured on the VIN Power line when the board is supplied through DC power jack CN23 using a +12VDC Notebook DC Adapter.

 O.S. Windows 10 Professional  32GB eMMC onboard  USB mouse and keyboard connected  HDMI display connected, resolution 1920x1080.  UEFI BIOS Release 1.01

Independently by the SoC mounted onboard, the following power consumptions are common to all boards: Battery Backup power consumption: 5.7μA

Soft-Off State power consumption: 53.7mA Suspend State power consumption: 59.8mA

Please consider that the power consumption depends strongly on the utilization scenario. For this reasons, it is recommended to use PSU with a minimum power of 36W for basic functionalities

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2.3.3 Power rails naming convention

In all the tables contained in this manual, Power rails are named with the following meaning: _S: Switched voltages, i.e. power rails that are active only when the board is in ACPI’s S0 (Working) state. Examples: +3.3V_S, +5V_S. _A: Always-on voltages, i.e. power rails that are active both in ACPI’s S0 (Working), S3 (Standby) and S5 (Soft Off) state. Examples: +5V_A, +3.3V_A. Other suffixes are used for application specific power rails, which are derived from same voltage value of voltage switched rails, if it is not differently stated (for

example, +5V

is derived from +5V_S, and so on).

HDMI

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