Parameter Specification Test Method
Capacitance Within tolerance specified in Class (I)
the part number C≤1000 pF: 1 MHz. ±10%
Dissipation Factor Class (I) 0.5 to 5 V rms
(Tan d and Q) C<30 pF: Q≥ 400+20xC C>1000 pF: 1 KHz. ±10%
C30 pF: Q>1000 1.0 ±0.2 V rms
Class (II) Class (II)
X7R: DF≤3%, Z5U: 1 KHz. ±10%, 1.0 ±0.2 V rms
DF≤3%, Y5V: DF≤5%
Insulation Resistance C≤50,000 IR: >10 G Ohms Apply rated voltage fro 60
(IR) C≤ 50,000 IR: >500 Ohms.F seconds at room temperature
and normal humidity
(70% max.)
Dielectric There shall be no evidence Apply rated voltage (Class I) or
Withstanding Voltage of damage or flash over 2.5 x rated voltage (Class II) to
during the test. both terminations for 5
seconds. Charge and
discharge current are less hat
50 mA.
Termination No mechanical damage After soldering capacitor on
Adherence the glass-epoxy PWB, 50 gms
of steady pull is applied in
direction of arrow for 10
seconds. ( See Figure 1)
Bend Strength No mechanical damage After soldering capacitor on
the glass-epoxy PWB, 2 mm
of bending shall be applied for
10 seconds as shown in the
drawing. ( See Figure 2)
Life Test (High Class (I):
Temperature Loading No more than ±3% or ±0.3
test) - Capacitance pf which ever is more. Apply 2 x rated voltage at
Change Class (II): maximum operating
X7R: ±10% max. temperature for 1000 hours.
Z5U, Y5V: ±30% max. The surge current shall not
Life Test (High Class (I) exceed 50 mA. After this, the
Temperature Loading C<10 pF: Q≥200+10xC samples shall be kept in room
test) - DF or Q 10 pF≤ C < 30 pF temperature for 24 hours
Q≥275+2xC: (Class I) or 48 hours (class II)
C>30 pF: Q>350 and then measured for the
Class (II) parameters indicated.
X7R: DF≤5%
Z5U & Y5V: DF≤7.5%
Life Test (High 1000 M Ohms or 50 Ohms.F
Temperature Loading whichever is less
test) - IR
Parameter Specification Test Method
Moisture Resistance Class (I):
Test - Capacitance No more than ±5% or ± 0.5 pf
change which ever is more. The capacitor shall be
Class (II): subjected to 40 °C and 90 to
X7R: ±10% max. 95% RH for 500 hours. After this,
Z5U & Y5V: ±30% max. samples shall be
Moisture Resistance Class (I) kept in room temperature for
Test - Q or DF C<10 pF: Q≥200+10xC 24 hrs. (Class I) or 48 hrs.
10 pF≤ C < 30 pF (Class II), and them shall be
Q≥275+2xC: measured (Class I) or 48
C≥30 pF: Q≥350 hours (Class II) and then
Class (II) measured for the parameters
X7R: DF≤5% indicated.
Z5U & Y5V: DF≤7.5%
Moisture Resistance 1000 M Ohms or 50 Ohms.F
Test - IR whichever is less
Humidity Load Test - Class (I):
Capacitance change No more than ±7.5% or ±0.75 The capacitor shall be
pf which ever is more. subjected to rated voltage at
Class (II): 40 °C and 90 to 95 % RH for
X7R: ±12.5% max. 500 hours. Surge current shall
Z5U, Y5V: ±30% max. not exceed 50 mA. After this,
Humidity Load Test Class (I) samples shall be kept in room
Q or DF C<30 pF: Q≥ 100+3xC temperature for 24 hrs. (Class I)
C ≥ 30 pF: Q≥200 or 48 hours (Class II), and
Class (II) them shall be measured
X7R: DF≤5% (Class I) or 48 hours (Class II)
Z5U & Y5V: DF≤7.5% and then measured for the
Humidity Load Test - 500 M Ohms or 25 Ohms.F parameters indicated.
IR whichever is less
Temperature Cycling Class (I): Perform 5 cycles as follows:
Test - Capacitance No more than ±2.5% or ± 0.25 1. Room temperature dwell for
change pf which ever is more. 15 minutes.
Class (II): 2. Minimum operating
X7R: ±7.5% max. temperature dwell for 30
Z5U, Y5V: ±20% max. minutes.
Temperature Cycling Parts to meet the initial 3. Room temperature dwell for
Test - Q or DF specifications 30 minutes.
Temperature Cycling Parts to meet the initial 4. Maximum operating
Test - IR specifications temperature dwell for 30
minutes.
After the above testing
condition, samples shall be
kept in room temperature for
24 hrs. (Class I) or 48 hours
(Class II), and them shall be
measured (Class I) or 48 hours
(class II) and then measured
for the parameters indicated.
Solderability Termination area shall be at The capacitors are completely
least 75% covered with a new immersed for 10 ±0.5 seconds
solder coating. There shall be in the molten solder with a
no crack and ceramic temperature of 260±5°C solder.
exposure of terminated Cladding material of outer-
surface due to melting. electrode: Sn (~100%)
Resistance to Solder No more than ± 2.5% or ± 0.25 The capacitors are completely
Heat Test - pf which ever is more. immersed for 10 ±1.0 seconds
Capacitance Change Class (II): in the molten solder with a
X7R: ±7.5% max. temperature of 270±5°C solder.
Z5U, Y5V: ±20% max. Preheat before immersion,
Resistance to Solder Parts to meet the initial 1. 80 to 100 °C for 2 minutes
Heat Test - Q or DF specifications 2. 150 to 180 °C for 2 minutes
Resistance to Solder Parts to meet the initial The capacitance measurement
Heat Test - IR specifications shall be made after the
samples have been kept at
room temperature for 24 hours.
Figure 1
Figure 2
Reliability and Test Conditions
First symbol Second symbol Third Symbol
(a letter) (a number) (a letter)
Z +10 deg. C 2 +45 deg. C A +1.0%
Y -30 deg. C 4 +65 deg. C B +/- 1.5%
X -55 deg. C 5 +85 deg. C C +/- 2.2%
6 +105 deg. C D +/- 3.3%
7 +125 deg. C E +/- 4.7%
F +/- 7.5%
P +/- 10.0%
R +/- 15.0%
S +/- 22.0%
T +22%, -33%
U +22%, -56%
V +22%, -82%
Class II Dielectric Code Explanation
Low temperature
requirement
High Temperature
requirement
MAX. Capacitance change over
temperature