Seagate ZP500GM300013, ZP500GM30023, ZP1000GM300013, ZP1000GM30023, ZP2000GM300013 Users Guide

...
Seagate® FireCuda® 530 SSD
Product Manual
Form Factor User Capacity Standard Models Heatsink Models
M.2 2280-S2
M.2 2280-D2
500 GB ZP500GM300013 ZP500GM30023
1000 GB ZP1000GM300013 ZP1000GM30023
2000 GB ZP2000GM300013 ZP2000GM30023
4000 GB ZP4000GM300013 ZP4000GM30023
Revision History
Version and Date Description of Changes
Rev B, May 2021 Updated the document throughout to add models with heatsinks, different specifications, drawings, and
instructions.
Rev A, December 2020 First document release.
© 2021, Seagate Technology LLC All rights reserved. Publication number: 200432500, Rev B, May 202 1
Seagate Technology reserves the right to make changes to the product(s) or information disclosed herein at any time without notice.
Seagate, Seagate Technology and the Spiral logo are registered trademarks of Seagate Technology LLC in the United States and/or other countries. Nytro and SeaTools are either trademarks or registered trademarks of Seagate Technology LLC or one of its affiliated companies in the United States and/or other countries. All other trademarks or registered trademarks are the propert y of their respective owners.
No part of this publication may be reproduced in any form without written permission of Seagate Technology LLC. Call 877-PUB-TEK1(877-782-8351) to request permission.
The NVMe word mark and/or NVMExpress design mark are trademarks of NVMExpress, Inc. The PCIe word mark and/or PCIExpress desi gn mark are registered trademarks and/or service marks of PCI-SIG.
When referring to drive capacity, one gigabyte, or GB, equals one billion bytes and one terabyte, or TB, equals one trillion bytes. Your computer’s operating system may use a different standard of measurement and report a lower capacity. In addition, some of the listed capacity is used for formatt ing and other func tions, and thus wil l not be available for data storage. Actual quantities will vary based on various factors, including file size, file format, features and application software. Actual data rates may vary depending on operating environment and other factors. The export or re-export of hardware or software containing encryption may be regulated by the U.S. Department of Commerce, Bureau of Industry and Security (for more information, visit www.bis.doc.gov), and controlled for import and use outside of the U.S. Seagate reserves the right to change, without notice, product offerings or specifications.
Contents
Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Models and Capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4 Environmental Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.5 Reliability/Endurance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3. Mechanical Dimensions and Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4. Pin and Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5. NVMe Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6. SMART Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.1 SMART Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7. Feature Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.1 Flash Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.1.1 Error Correction Code (ECC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.1.2 Wear Leveling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.1.3 Bad Block Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.1.4 TRIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.1.5 SMART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.1.6 Over Provisioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.1.7 Firmware Upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.1.8 Thermal Throttling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.2 Advanced Device Security Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.2.1 NVMe format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.2.2 Sanitize Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.3 SSD Lifetime Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.3.1 Total Bytes Written (TBW) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.3.2 Media Wear Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.3.3 Read Only Mode (End of Life) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.4 An Adaptive Approach to Performance Tuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7.4.1 Throughput . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7.4.2 Predict & Fetch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7.4.3 SLC Caching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8. Safety, Standards, and Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.1 Regulatory Model Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
9. FireCuda 530 Installation Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Seagate FireCuda 530 SSD Product Manual, Rev B 3
Contents
9.1 FireCuda 530 SSD Handling Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
9.2 FireCuda 530 SSD Installation Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
9.3 Heatsink Disclosures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Seagate FireCuda 530 SSD Product Manual, Rev B 4

Support

For Internal SSD Support, visit: https://www.seagate.com/support/products/
For Firmware Download and Tools Download for Secure Erase, visit: https://www.seagate.com/support/downloads/
For information regarding online support and services, visit: http://www.seagate.com/contacts/
For information regarding Warranty Support, visit: http://www.seagate.com/support/warranty-and-replacements/
For information regarding data recovery services, visit:
http://www.seagate.com/services-software/seagate-recovery-services/recover/
For Seagate OEM and Distribution partner and Seagate reseller portal, visit: http://www.seagate.com/partners
Seagate FireCuda 530 SSD Product Manual, Rev B 5
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1. Introduction

The Seagate® FireCuda® 530 SSD is a versatile NVMe SSD with PCIe Gen4 x4 interface. It is up to 12x faster than SATA SSDs and delivers Ultra-fast performance and enhanced endurance for long term use.
Table 1 The FireCuda 530 SSD Features
Feature Description
Capacity (User)
Certifications, Eco-Compliance
Dimensions
Form Factor
Weight
Endurance
Interface Compliance
500 GB, 1000 GB, 2000 GB, 4000 GB
CE, UL, FCC, BSMI, KCC, Microsoft WHQL, VCCI, CB
RoHS
500 GB, 1000 GB
Length, Max 80.15 mm
Width, Max 22.15 mmHeight, Max 2.23 mm
2000 GB, 4000 GB
Length, Max 80.15 mmWidth, Max 22.15 mm
Height, Max 3.58 mm
With heatsink
Length, Max 80.15 mm
Width, Max 24.20 mm
Height, Max 10.74 mm
M2 2280-S2-M
M2 2280-D2-M
500 GB: 7.7 g1000 GB: 8.1 g
2000 GB: 10.0 g
4000 GB: 10.6 g
With heatsink
47 g
Total Bytes Written
500 GB: 640 TB1000 GB: 1275 TB
2000 GB: 2550 TB
4000 GB: 5100 TB
NVMe 1.4PCI Express Base 4.0, PCIe Gen 4 x 4 lane, and backward compatible to PCIe Gen3, Gen 2, and Gen 1
See Section 2.5, Reliability/Endurance.
NAND
Operating Systems
Performance Random
TLC
Windows 10 (64 bit)
Ubuntu 16.04, 18.04
CentOS 6, 7
Read: Up to 1,000,000 IOPSWrite: Up to 1,000,000 IOPS
Actual performance might vary depending on use conditions and environment.
See Section 2.2, Performance.
Seagate FireCuda 530 SSD Product Manual, Rev B 6
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Table 1 The FireCuda 530 SSD Features (continued)
Performance Sequential
Power Consumption
Power Management
Reliability
Shock and Vibration
Temperature Range
Volta ge
Warran ty
Feature Description
Read: Up to 7300MB/s
Write: Up to 6900MB/s
Actual performance might vary depending on the capacity, use conditions and environment.
See Section 2.2, Performance.
Active Power, Average: <6.0 W
Idle Power PS3, Average: <25 mW
Low Power L1.2 mode: < 2 mW
Supports ActiveStatePower Management (ASPM)Supports Autonomous Power StateTransition (APST)
Supports L1.2
End-to-end data path protection
MTBF: 1.9 million hours
UBER: 1 error in 10
16
bits read
See Section 2.3, Power Consumption.
Shock
Non-Operating: 1,500 G, at 0.5 ms
Vibration
Non-Operating: 1.52 G
, (20 to 80 Hz,
RMS
Frequency)
Operating: 0°C to 70°C Non-operating: -40°C to 85°C
Min = 3.14V±5%
Max = 3.47V±5%
Five years, or when the device reaches Host TBW, whichever happens first. Endurance rating valid for SSD Life Remaining > 1%.
See Section 2.4, Environmental
Conditions.
1.1 References
In case of conflict between this document and the following reference documents, this document takes precedence.
PCIe Specifications
PCIe - PCI Express Electromechanical specification, revision 4.0
NVMe - Non Volatile Memory Express specification 1.4
PCIe CEM - PCI Express Card Electromechanical specification, revision 1.1
PCI Express M.2 Specification, revision 1.1
Seagate Downloads are available on the Seagate Support page here:
https://www.seagate.com/support/
Seagate FireCuda 530 SSD Product Manual, Rev B 7
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2. Specifications

2.1 Models and Capacity
Table 2 Models and Capacity
User Capacity
500 GB ZP500GM300013 ZP500GM30023
1000 GB ZP1000GM300013 ZP1000GM30023
2000 GB ZP2000GM300013 ZP2000GM30023
4000 GB ZP4000GM300013 ZP4000GM30023
NOTE About capacity:
2.2 Performance
Table 3 Random and Sequential Read and Write Performance
Capacity
Standard
Models
Sector Size: 512 Bytes (default) and 4K
User-addressable LBA count = (97696368) + (1953504 x (Desired Capacity
Heatsink
Models
in Gb-50.0)) From International Disk Drive Equipment and Materials Association (IDEMA) (LBA1-03_standard.doc)
CrystalDiskMark IOMeter
Read
(MB/s)
Write
(MB/s)
Read
(IOPS)
Write
(IOPS)
500 GB 7000 3000 400,000 700,000
1000 GB 7300 6000 800,000 1,000,000
2000 GB 7300 6900 1,000,000 1,000,000
4000 GB 7300 6900 1,000,000 1,000,000
NOTE About performance:
Fresh out of box (FOB) performance obtained on newly formatted drive.
Performance may vary based on the SSD’s firmware version, system hardware, and configuration.
Performance is based on AMD Gen4 X570 + 8 Core CPU + 16 GB of DDR4
(3200mHz).
CrystalDiskMark 7.0.0, 1GB range, QD=16, Thread=1. IOMeter, 1GB range,
QD=32, 16 worker, 4k aligned.
Seagate FireCuda 530 SSD Product Manual, Rev B 8
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Sequential Read/Write is measured while testing 1000 MB five times by
CrystalDiskMark.
2.3 Power Consumption
Table 4 Power Consumption
Power Consumption
Capacity
Max Avg
Read
(W)
Max Avg
Write
(W)
Idle PS3
(mW)
L1.2
(mW)
500 GB 6.0 5.9 4.5 4.5
1000 GB 6.1 6.1 6.1 6.1
2000 GB 7.6 7.6 7.9 7.8
4000 GB 7.9 7.9 8.2 7.5
NOTE About power consumption:
The average value of power consumption is based on 100% conversion
efficiency.
Based on SU6SExxx-series under ambient temperature.
Use CrystalDiskMark 7.0.0, 1GB range, QD=8, Thread=1. Measuring power
consumption during sequential Read and sequential Write.
The measured power voltage is 3.3 V.
Measured under ambient temperature.
Power Consumption can differ with flash configuration and platform.
Power consumption during read and write operation is measured on
Gen4 X570 + 6 Core CPU.
Seagate FireCuda 530 SSD Product Manual, Rev B 9
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2.4 Environmental Conditions
Table 5 Temperature, Humidity, Shock
Specification Value
Temperature
Operating (case temperature at specific airflow)
Non-operating
Humidity
Operating Non-operating (storage)
Shock
Non-operating
Vibration
Non-operating
NOTE Temperature is measured without condensation. Operating mode
temperature is measured by temperature sensor, SMART Attribute.
Airflow is suggested. Airflow allows the device to be operated at the appropriate temperature for each component during heavy workloads environments.
0°C to 70°C
-40°C to 85°C
1,500 G, duration 0.5 ms
1.52 G
(20Hz to 80Hz, Frequency)
RMS,
90% 93%
Shock and vibration results assume that the SSD is mounted securely with the input vibration applied to the SSD mounting. These specifications do not cover connection issues that may result from testing at this level. The measured specification is in root mean square (RMS) form.
Non-operating Shock. The limits of non-operating shock applies to all
conditions of handling and transportation. This includes both isolated SSD and integrated SSDs. Shock may be applied in the X, Y, or Z-axis.
Non-Operating Vibration. The limits of non-operating vibration shall
apply to all conditions of handling and transportation. This includes both isolated SSD and integrated SSDs. Vibration may be applied in the X, Y, or Z-axis.
Seagate FireCuda 530 SSD Product Manual, Rev B 10
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