PRODUCT MANUAL
ST1.3 Series
ST612712DEG
ST612712DE
ST610712DEG
ST610712DE
ST680712DEG
ST680712DE
ST660712DEG
ST660712DE
Rev. C
February 2007
Revision status summary sheet
Revision Date Sheets Affected
Rev. A 07/13/2006 All.
Rev. B 09/14/2006 1, 3, 5-7, 17, 20 and 26.
Rev. C 02/27/2007 Front cover and 18 .
Copyright © 2006 - 2007 Seagate Technology LLC. All rights reserved. Printed in U.S.A.
Publication number: 100409345, Rev. C February 2007
Seagate, Seagate Technology and the Wave logo are registered trademarks of Seagate Technology LLC
in the United States and/or other countries. ST1.3 Series, SeaTools and SeaTDD are either trademarks
or registered trademarks of Seagate Technology LLC or one of its affiliated companies in the United
States and/or other countries. All other trademarks or registered trademarks are the property of their
respective owners.
One gigabyte, or GB, equals one billion bytes when referring to hard drive capacity. Accessible capacity
may vary depending on operating environment and formatting. Quantitative usage examples for various
applications are for illustrative purposes. Actual quantities will vary based on various factors, including file
size, file format, features and application software. Seagate reserves the right to change, without notice,
product offerings or specifications.
Contents
1.0 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Drive care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Handling precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.0 Drive specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 Power, access times and acoustics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Formatted capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3 Default logical geometry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.4 Recording and interface technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.5 Physical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.6 Time to ready. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.7 Power specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.7.1 Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.7.2 Conducted noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.7.3 Voltage tolerance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.7.4 Power-management modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.8 Environmental specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.1 Ambient temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.2 Temperature gradient. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.3 Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.4 Altitude . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.5 Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.8.6 Vibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.9 Acoustics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.10 Electromagnetic immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.11 Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.12 Agency certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.12.1 Safety certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.12.2 Electromagnetic compatibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.12.3 European Union Restriction of Hazardous Substances (RoHS) Directive . . . . . 17
2.12.4 China Restriction of Hazardous Substances (RoHS) Directive . . . . . . . . . . . . . 18
2.12.5 FCC verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.0 Configuring and mounting the drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.1 Handling and static discharge precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.2 Drive installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.3 Mounting considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.0 Interface description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.1 Connector interface signals and connector pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.1.1 Supported ATA commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.1.2 Identify Device command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.1.3 Set Features command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.0 Seagate Technology support services . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
ST1.3 Series Product Manual, Rev. C i
ii ST1.3 Series Product Manual, Rev. C
List of Figures
Figure 1. ST1.3 Series IDE interface (ZIF connector) disc drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 2. ST1.3 Series breather hole location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Figure 3. ST1.3 Series improper handling example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Figure 4. Typical 3.3V startup and operation current profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 5. Location where tri-axial accelerometer will be placed on ST1.3 Series drives . . . . . . . . . . . . 12
Figure 6. Drive axis definition for ST1.3 Series drives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 7. ST1.3 Series proper handling example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 8. ST1.3 Series improper handling example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 9. ST1.3 Series mechanical dimensions—top, bottom, side and end view . . . . . . . . . . . . . . . . 23
Figure 10. ST1.3 Series Area for Protective Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 11. ST1.3 Series Mounting Drive using FPC with Multiple Bends . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 12. ST1.3 Series ZIF connector with Groove for FPC with Tab . . . . . . . . . . . . . . . . . . . . . . . . . . 24
ST1.3 Series Product Manual, Rev. C iii
iv ST1.3 Series Product Manual, Rev. C
1.0 Introduction
This manual describes the functional, mechanical and interface specifications for the following Seagate® ST1.3
Series drives:
• ST612712DE-12GB, ST610712DE-10GB, ST680712DE-8GB and ST660712DE-6GB disc drives with a ZIF
(zero insertion force) connector using an IDE interface.
• ST612712DEG-12GB, ST610712DEG-10GB, ST680712DEG-8GB and ST660712DEG-6GB disc drives
with a ZIF (zero insertion force) connector using an IDE interface. These models incorporate an additional
free-fall sensor for robust drop performance.
These drives provide the following key features.
• 3,600-RPM spindle speed and a 2-Mbyte buffer combined for superior read/write performance.
• Quiet operation. Fluid Dynamic Bearing (FDB) motor.
• Giant magnetoresistive (GMR) recording heads and EPRML technology, which provide the drives with
increased areal density.
• State-of-the-art cache and on-the-fly error-correction algorithms.
• 2.0K Gs nonoperating shock, and 300 Gs operating shock.
• SeaTools™ diagnostic software performs a drive self-test that eliminates unnecessary drive returns.
Figure 1. ST1.3 Series IDE interface (ZIF connector) disc drive
ST1.3 Series Product Manual, Rev. C 1
1.1 Disclaimer
Seagate Technology LLC makes no warranties whatsoever, including any warranty of merchantability, noninfringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specifi
cation or sample. Seagate may not be held liable for any direct, indirect, incidental, special, exemplary, or consequential damages (including, but not limited to, loss of use, data, or profits; procurement of substitute goods
or services; or business interruptions) however caused and on any theory of liability, whether in contract, strict
liability, or tort (including negligence or otherwise) arising in any way from the use of this kit, even if advised of
the possibility of such damage.
1.2 Drive care
Do not use the ST1.3 Series disc drives outside of the ranges of environmental conditions found in Section 2.8,
"Environmental specifications." Doing so may void the warranty of the ST1.3 Series disc drive.
1.3 Handling precautions
• Do not cover or seal the breather hole! Covering or sealing the breather hole may result in loss of data.
-
Figure 2. ST1.3 Series breather hole location
• Do not apply any force to the drive during handling or installation.
• When handling the drive, wear an wrist strap that is properly grounded to prevent damage from electrostatic
discharge (ESD).
• Handle the drive carefully by the edges. Do not touch any exposed printed circuit board or the top cover.
• The drive is fragile—handle it with care. Do not press down on the top cover or attempt to use a pen to write
on the drive’s label. Do not apply more than 0.2 kg of force to the top cover.
Figure 3. ST1.3 Series improper handling example
• Do not drop the drive.
• Do not expose the drive to wet conditions.
• Do not place the drive near a strong magnetic field.
• Do not expose the drive to extreme temperatures.
• The drive may become hot during operation. Be careful when removing the drive from the host device
immediately after operation.
2 ST1.3 Series Product Manual, Rev. C
2.0 Drive specifications
Unless otherwise noted, all specifications are measured under ambient conditions, at 25°C, and nominal
power. For convenience, the phrases the drive and this drive are used throughout this manual to indicate
ST612712DE, ST612712DEG, ST610712DE, ST610712DEG, ST680712DE, ST680712DEG, ST660712DE
and ST660712DEG model drives.
2.1 Power, access times and acoustics
The specifications listed in this table are for quick reference. For details on specification measurement or definition, see the appropriate section of this manual.
Table 1: Specifications
ST612712DEG
Drive specification
Formatted Gbytes 12.0 10.0 8.0 6.0
Guaranteed sectors 23,438,016 19,533,024 15,625,008 11,719,008
Physical heads 2/1
Physical discs 1
Bytes per sector (logical) 512
Cache (Mbytes) 2
Recording density, BPI (bits/inch max) 933,000
Track density. TPI (tracks/inch max) 140,000
Areal density (Gbits/inch2 max) 130.6
Spindle speed (RPM) 3,600
Internal data transfer rate OD (Mbits/sec max) 130.0
Sustained data transfer rate OD (Mbytes/sec) 10.2
I/O data-transfer rate (Mbytes/sec max) 66.7 (UDMA 4)
ATA data-transfer modes supported PIO modes 0–4;
Height (max) 5.1 mm (0.2009 inches)
Width 40.0 +/-0.2 mm (1.5748 +/-0.008 inches)
Length 30.0 +/-0.2 mm (1.1811 +/-0.008 inches)
Weight 13.6 gm - 0.3000 lb. (typ)
Average latency (msec) 8.3
Power-on to ready (sec typical / max) (without retry) 1.0 / 2.5
Standby to ready (sec typical / max) (without retry) 1.0 / 2.5
Startup current 3.3v (peak)
(maximum RMS in 10ms window)
Seek power (typical 3.3V) 154 mA
ST612712DE
Multiword DMA modes 0-2;
Ultra DMA modes 0–4
330 mA
ST610712DEG
ST610712DE
ST680712DEG
ST680712DE
ST660712DEG
ST660712DE
ST1.3 Series Product Manual, Rev. C 3
Table 1: Specifications
ST612712DEG
Drive specification
Read/write power (typical 3.3V) 230/240 mA
Performance idle mode (typical 3.3V) 140 mA
Low power idle mode (typical 3.3V) 77 mA
Standby/Sleep mode (typical 3.3V) 13 mA
Voltage tolerance (including noise) 3.3V ± 5%
Ambient temperature 0° to 60°C (operating)
Temperature gradient (°C per hour max) 20°C (operating)
Relative humidity (noncondensing) 5% to 90% (operating)
Relative humidity gradient 30% per hour max
Wet bulb temperature (°C max) 33°C (operating)
Altitude, operating –60.98 m to 3,048 m (–200 ft to 10,000+ ft)
Altitude, nonoperating (below mean sea level, max) –60.98 m to 12,192 m (–200 ft to 40,000+ ft)
Shock, operating (Gs max at 1 msec) 300
Shock, nonoperating (Gs max at 1 msec) 2000
Vibration, operating
(max displacement may apply below 10 hz)
Vibration, nonoperating
(max displacement may apply below 22 hz)
Drive acoustics, sound power (bels)
Idle (typical / max) 1.6/ 1.9
Operational (typical / max) 1.7 / 2.0
Nonrecoverable read errors 1 per 1014 bits read
Load/Unload (LUL) cycles (25°C) 300,000 software-controlled power on/off cycles
Warranty Per agreement
ST612712DE
–40° to 70°C (nonoperating)
30°C (nonoperating)
5% to 95% (nonoperating)
40°C (nonoperating)
1.0 Gs (0 to peak, 10–500 Hz) @ 2 oct/min sweep rate
5.0 Gs (0 to peak, 10–500 Hz) @ 0.5 oct/min sweep rate
20,000 hard power on/off cycles
ST610712DEG
ST610712DE
ST680712DEG
ST680712DE
ST660712DEG
ST660712DE
4 ST1.3 Series Product Manual, Rev. C
2.2 Formatted capacity
Model Formatted capacity Guaranteed sectors Bytes per sector
ST612712DEG
ST612712DE
ST610712DEG
ST610712DE
ST680712DEG
ST680712DE
ST660712DEG
ST660712DE
12.0 Gbytes 23,438,016 512
10.0 Gbytes 19,533,924 512
8.0 Gbytes 15,625,008 512
6.0 Gbytes 11,719,008 512
2.3 Default logical geometry
Model Cylinders Read/write heads Sectors per track
ST612712DEG
ST612712DE
ST610712DEG
ST610712DE
ST680712DEG
ST680712DE
ST660712DEG
ST660712DE
LBA mode
When addressing these drives in LBA mode, all blocks (sectors) are consecutively numbered from 0 to n–1,
where n is the number of guaranteed sectors as defined above.
16,383 16 63
ST1.3 Series Product Manual, Rev. C 5
2.4 Recording and interface technology
Technology Specification
Interface Seagate (ZIF) Flex Connector (35-way)
Recording method Perpendicular Magnetic Recording
Recording density BPI (bits/inch max) 933,000
Track density TPI (tracks/inch max) 140,000
Areal density (Gbits/inch2 max) 130.6
Spindle speed (RPM) (± 0.2%) 3,600
Internal data-transfer rate OD (Mbits/sec max) 130.0
Sustained data transfer rate OD (Mbytes/sec max) 10.2
I/O data-transfer rate (Mbytes/sec max) 66.7 (UDMA 4)
Interleave 1:1
Cache buffer
All models 2 Mbytes (2,048 Kbytes)
2.5 Physical characteristics
Height (mm)
(inches)
Width (mm)
(inches)
Length (mm)
(inches)
Typical weight (grams)
(pounds)
Interface Connector Seagate (ZIF) Flex Connector (35-way)
5.1 (max)
0.2007 (max)
40.0 +/-0.2
1.5748 +/-0.008
30.0 +/-0.2
1.1811 +/-0.008
13.6 (typ)
0.030 (typ)
2.6 Time to ready
Time to ready Typical Max (without retry)
Power-On to Ready (sec) 1.0 2.5
Standby to Ready (sec) 1.0 2.5
6 ST1.3 Series Product Manual, Rev. C
2.7 Power specifications
The drive receives DC power (+3.3V) through the ZIF (IDE interface) connector for ST612712DE,
ST612712DEG, ST610712DE, ST610712DEG, ST680712DEG, ST680712DE, ST660712DEG and
ST660712DE models.
2.7.1 Power consumption
Power requirements for the drives are listed in the table on page 8. Typical power measurements are based on
an average of drives tested, under nominal conditions, using +3.3V input voltage at 25°C ambient temperature.
• Spinup power
Spinup power is measured from the time of power-on to the time that the drive spindle reaches operating speed.
• Seek mode
During seek mode, the read/write actuator arm moves toward a specific position on the disc surface and does
not execute a read or write operation. Servo electronics are active. Seek mode power is measured based on
three random seek operations every 100 msecs. This mode is not typical.
• Read/write power and current
Read/write power is measured with the heads on track, at the moment while the head is writing/reading
from/to disc. It is performed with 100 percent duty cycle of write/read operation.
• Low power idle mode
Spindle motor is working normally with actuator unloaded to the parked position.
• Standby mode / Sleep mode
During Standby mode, the drive accepts commands, but the drive is not spinning, and the servo and read/
write electronics are in power-down mode.
ST1.3 Series Product Manual, Rev. C 7
Table 2: DC power
ST1.3 Series Power Consumption (W)
Max current the average of the peak value in 10ms window
Current 270 330
Spinup 180 300
Load/Unload current 190 200
Write 240 300
Read 230 300
Seek 154 161
Performance idle 140 147
Low power idle 77 86
Standby/Sleep 13 18
*During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase acoustic and
power to operational levels.
Average 3.3V (mA) Max 3.3V (mA)
2.7.1.1 Typical current profile
Figure 4. Typical 3.3V startup and operation current profile
8 ST1.3 Series Product Manual, Rev. C
2.7.2 Conducted noise
Input noise ripple is measured at the host system power supply across an equivalent 15-ohm resistive load on
the +3.3 volt line.
Using 3.3-volt power, the drive is expected to operate with a maximum of 70 mV peak-to-peak square-wave
injected noise at up to 20 MHz.
Note. Equivalent resistance is calculated by dividing the nominal voltage by the typical RMS read/write
current.
2.7.3 Voltage tolerance
Voltage tolerance (including noise):
3.3V ± 5%
ST1.3 Series Product Manual, Rev. C 9
2.7.4 Power-management modes
The drive provides programmable power management to provide greater energy efficiency. The drive features
the following power-management modes:
Table 3: Power-management modes
Power modes Heads Spindle Buffer
Active (operating) Tracking Rotating Enabled
Idle, performance Tracking Rotating Enabled
Idle, low power Parked Stopped Disabled
Standby/Sleep Parked Stopped Disabled
• Active mode
The drive is in Active mode during the read/write and seek operations.
• Low power idle mode
Drive enters Low Power Idle mode from Performance Idle mode when the Advanced Power Management
Level is set between FDh and 80h, and the Idle timer is reached at 2 seconds (default setting is 2 seconds).
Disc is not spinning and heads are parked and drive accepts all commands and returns to Active mode any
time disc access is necessary.
• Performance idle mode
The buffer remains enabled, and the drive accepts all commands and returns to Active mode any time disc
access is necessary.
• Standby/Sleep mode
The drive enters Standby mode when the host sends a Standby Immediate command. If the host has set the
standby timer, the drive can also enter Standby mode automatically after the drive has been inactive for a
specifiable length of time. The standby timer delay is established using a Standby or Idle command. In Standby
mode, the drive buffer is disabled, the heads are parked and the spindle is at rest. The drive accepts all
commands and returns to Active mode any time disc access is necessary.
• Standby timers
Each time the drive performs an Active function (such as read, write or seek), the standby timer is reinitialized
and begins counting down from its specified delay times to zero. If the standby timer reaches zero before any
drive activity is required, the drive makes a transition to Standby mode. In both Idle and Standby mode, the
drive accepts all commands and returns to Active mode when disc access is necessary.
10 ST1.3 Series Product Manual, Rev. C
2.8 Environmental specifications
2.8.1 Ambient temperature
Ambient temperature is defined as the temperature of the environment immediately surrounding the drive.
Actual drive case temperature should not exceed
temperature of the drive operating at 60°C ambient may hit a maximum of 70°C at certain parts of the casing.
Above 1,000 feet (305 meters), the maximum temperature is derated linearly by 1°C every 1000 feet.
Operating 0° to 60°C (32° to 140°F) (70°C max case temperature)
Nonoperating –40° to 70°C (–40° to 158°F)
2.8.2 Temperature gradient
Operating 20°C per hour (36°F per hour max), without condensation
Nonoperating 30°C per hour (54°F per hour max), without condensation
2.8.3 Humidity
2.8.3.1 Relative humidity
70°C (158°F) within the operating ambient conditions. Case
Operating 5% to 90% noncondensing (30% per hour max)
Nonoperating 5% to 95% noncondensing (30% per hour max)
2.8.3.2 Wet bulb temperature
Operating 33°C (91.4°F max) [1]
Nonoperating 40°C (104°F max) [2]
[1] Operating: Wet bulb temperature is calculated by the operating Temperature and the Relative Humidity levels.
[2] Nonoperating: Wet bulb temperature is calculated by the nonoperating Temperature and the Relative Humidity levels.
2.8.4 Altitude
Operating –60.98 m to 3,048 m (–200 ft to 10,000+ ft)
Nonoperating –60.98 to 12,192 m (–200 ft to 40,000+ ft)
ST1.3 Series Product Manual, Rev. C 11
2.8.5 Shock
All shock measurements in this section are carried out at drive level. For all linear shock test, operating or nonoperating, the input shock level shall be measured at the frame of the disk drive at the specific location indicated by the ellipse in Figure 5 below for the ZIF interface drives.
Figure 5. Location where tri-axial accelerometer will be placed on ST1.3 Series drives
All shock test will cover all the 6 directions, +/- x, y and z axes. The drive axis definition in shown in Figure 6
below.
Figure 6. Drive axis definition for ST1.3 Series drives
2.8.5.1 Operating shock
The drive will be subjected to 10 shocks for each direction. During the shocks, there must be a minimum delay
of 3 seconds between shock pulses. Soft errors and automatic retries are allowed during the test. No data loss
or permanent damage occurs during a half sine shock pulse of:
300 Gs, 1 msec
2.8.5.2 Nonoperating shock
The nonoperating shock level that the drive can experience without incurring any physical damage when subsequently put into operation is 2000 Gs. The same applies for shock levels of 2000 Gs, 1 msec pulse duration
on fresh drives for each level.
2.8.6 Vibration
All vibration specifications assume that the drive is mounted securely in a fixture that does not have fixture
resonances in the frequency test range.
12 ST1.3 Series Product Manual, Rev. C
2.8.6.1 Operating sweep sine vibration
The following lists the maximum operating sweep sine vibration levels that the drive may experience while
meeting the performance standards specified. It will consist of a forward and backward sweep from 10 Hz to
500
Hz to 10 Hz. The drive will operate without a hard error while being subjected to the following vibration
levels.
10 Hz to 500 Hz @ 2 oct/min 1.0 Gs (0 to pk). Maximum displacement may apply below 10 Hz.
2.8.6.2 Operating random vibration
The test consists of 30 minutes of random vibration using the power spectral density (PSD) levels specified in
the table below. The vibration test level is 0.67
Gs RMS. The drive will operate without a hard error while being
subjected to the following vibration levels.
Table 4: Operating random vibration profile
Frequency (Hz) G2/Hz
17 1.1 x E-03
45 1.1 x E-03
48 8.0 x E-03
62 8.0 x E-03
65 1.0 x E-03
150 1.0 x E-03
200 5.0 x E-04
500 5.0 x E-04
2.8.6.3 Nonoperating sweep sine vibration
The following table lists the maximum nonoperating sweep sine vibration levels that the drive may experience
while meeting the performance standards specified. It will consist of a forward and backward sweep from 5 Hz
to 500 Hz to 5 Hz. The drive will not incur any physical damage when subsequently put into operation.
10 Hz to 500 Hz @ 0.5 oct/min 5.0 Gs (0 to pk). Maximum displacement may apply below 22 Hz.
5 Hz to 10 Hz 25.4 mm peak to peak displacement.
ST1.3 Series Product Manual, Rev. C 13
2.8.6.4 Nonoperating random vibration
The test consists of 15 minutes of random vibration using the power spectral density (PSD) levels specified in
the table below. The vibration test level is 3.01 Gs RMS. The drive will not incur any physical damage when
subsequently put into operation.
Table 5: Nonoperating random vibration profile.
Frequency (Hz) G2/Hz
2.5 1.0 x E-03
5 3.0 x E-02
40 1.8 x E-02
500 1.8 x E-02
2.8.6.5 Corrosive environment
Seagate electronic drive components pass accelerated corrosion testing equivalent to ten years of exposure to
light industrial environments containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM
B845. However, this accelerated testing cannot duplicate every potential application environment.
Users should use caution exposing any electronic components to uncontrolled chemical pollutants and corrosive chemicals as electronic drive component reliability can be affected by the installation environment. The silver, copper, nickel and gold films used in Seagate products are especially sensitive to the presence of sulfide,
chloride, and nitrate contaminants. Sulfur is found to be the most damaging. In addition, electronic components
should never be exposed to condensing water on the surface of the printed circuit board assembly (PCBA) or
exposed to an ambient relative humidity greater than 95 percent. Materials used in cabinet fabrication, such as
vulcanized rubber, that can outgas corrosive compounds should be minimized or eliminated. The useful life of
any electronic equipment may be extended by replacing materials near circuitry with sulfide-free alternatives.
14 ST1.3 Series Product Manual, Rev. C
2.9 Acoustics
Drive acoustics are measured as overall A-weighted acoustic sound power levels (no pure tones). Discrete
tone penalties are added to the A-weighted sound power (LW) with the following formula only when determin
ing compliance:
LWt(spec) == LW + 0.1Pt + 0.3 < 4.0 (Bels)
where
LW = A-weighted sound power level
pt == Value of discrete tone penalty [==dLt-6.0 (dBA)]
dLt = Tone-to-noise ratio taken in accordance with ISO 7779.
All measurements are consistent with ISO document 7779. Sound power measurements are taken under
essentially free-field conditions over a reflecting plane. For all tests, the drive is oriented with the cover facing
upward.
Note. For seek mode tests, the drive is placed in seek mode only. The number of seeks per second is defined
by the following equation:
(Number of seeks per second = 0.4 / (average latency + average access time)
Table 6: Drive level acoustics
Acoustic mode
Idle Operational
-
1.6 bels (typ)
1.7 bels (max)
1.9 bels (typ)
2.0 bels (max)
2.10 Electromagnetic immunity
When properly installed in a representative host system, the drive operates without errors or degradation in
performance when subjected to the radio frequency (RF) environments defined in the following table:
Table 7: Electromagnetic immunity
Performance
Test Description
Radiated RF immunity 80 to 1,000 MHz, 3 V/m,
80% AM with 1 kHz sine
900 MHz, 3 V/m, 50% pulse modulation @ 200
Hz
Electrical fast transient ± 1 kV on AC mains, ± 0.5 kV on external I/O B EN 61000-4-4: 95
Surge immunity ± 1 kV differential, ± 2 kV common, AC mains B EN 61000-4-5: 95
Conducted RF immunity 150 kHz to 80 MHz, 3 Vrms, 80% AM with 1
kHz sine
Voltage dips, interrupts 0% open, 5 seconds
0% short, 5 seconds
40%, 0.10 seconds
70%, 0.01 seconds
level
A EN 61000-4-3: 96
A EN 61000-4-6: 97
C
C
C
B
Reference
standard
ENV 50204: 95
EN 61000-4-11: 94
ST1.3 Series Product Manual, Rev. C 15
2.11 Reliability
Measurement type Specification
Nonrecoverable read errors 1 per 1014 bits read, max.
Load/Unload (LUL) cycles (25°C) 300,000 software-controlled power on/off cycles
20,000 hard power on/off cycles
Power On Hours (POH) 500 hours
Warranty Per agreement
16 ST1.3 Series Product Manual, Rev. C
2.12 Agency certification
2.12.1 Safety certification
The drives are recognized in accordance with UL60950-1, CAN/CSA-C22.2 No.60950-1, EN60950 and IEC
60950.
2.12.2 Electromagnetic compatibility
Hard drives that display the CE mark comply with the European Union (EU) requirements specified in the Electromagnetic Compatibility Directive (89/336/EEC). Testing is performed to the levels specified by the product
standards for Information Technology Equipment (ITE). Emission levels are defined by EN 55022, Class B and
the immunity levels are defined by EN 55024.
Seagate uses an independent laboratory to confirm compliance with the EC directives specified in the previous
paragraph. Drives are tested in representative end-user systems. Although CE-marked Seagate drives comply
with the directives when used in the test systems, we cannot guarantee that all systems will comply with the
directives. The drive is designed for operation inside a properly designed enclosure, with properly shielded I/O
cable (if necessary) and terminators on all unused I/O ports. Computer manufacturers and system integrators
should confirm EMC compliance and provide CE marking for their products.
Korean RRL
If these drives have the Korea Ministry of Information and Communication (MIC) logo, they comply with paragraph 1 of Article 11 of the Electromagnetic Compatibility control Regulation and meet the Electromagnetic
Compatibility (EMC) Framework requirements of the Radio Research Laboratory (RRL) Ministry of Information
and Communication Republic of Korea.
These drives have been tested and comply with the Electromagnetic Interference/Electromagnetic Susceptibility (EMI/EMS) for Class B products. Drives are tested in a representative, end-user system by a Korean-recognized lab.
• EUT name (model numbers): ST612712DE, ST612712DEG, ST610712DE, ST610712DEG, ST680712DEG,
ST680712DE, ST660712DEG and ST660712DE
Certificate numbers:
ST612712DEG, ST612712DE, ST610712DEG, ST610712DE
ST680712DEG, ST680712DE, ST660712DEG and ST660712DE STX-S103 (B)
• Trade name or applicant: Seagate Technology LLC
• Manufacturing date: July 2006
• Manufacturer/nationality: Seagate Technology International
Australian C-Tick (N176)
If these models have the C-Tick marking, they comply with the Australia/New Zealand Standard AS/NZS3548
1995 and meet the Electromagnetic Compatibility (EMC) Framework requirements of the Australian Communi
cation Authority (ACA).
2.12.3 European Union Restriction of Hazardous Substances (RoHS) Directive
Seagate designs its products to meet environmental protection requirements worldwide, including regulations
restricting certain chemical substances. A new law, the European Union Restriction of Hazardous Substances
(RoHS) Directive, will restrict the presence of chemical substances, including Lead (Pb), in electronic products,
effective July 2006. The Directive's requirements have not been finalized. This drive is manufactured with com
ponents and materials that are expected to comply with the RoHS Directive when the Directive takes effect.
-
-
ST1.3 Series Product Manual, Rev. C 17
2.12.4 China Restriction of Hazardous Substances (RoHS) Directive
2.12.4
This product has an Environmental Protection Use Period (EPUP) of 20 years. The following
table contains information mandated by China's "Marking Requirements for Control of Pollution
Caused by Electronic Information Products" Standard.
"O" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is lower
than the threshold defined by the China RoHS MCV Standard.
中国限制危险物品的指令
“O"表示该部件（于同类物品程度上）所含的危险和有毒物质低于中国RoHS MCV标准所定义的门槛值。
"X" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is over
the threshold defined by the China RoHS MCV Standard.
“
X "表示该部件（于同类物品程度上）所含的危险和有毒物质超出中国RoHS MCV标准所定义的门槛值。
2.12.5 FCC verification
These drives are intended to be contained solely within a personal computer or similar enclosure (not attached
as an external device). As such, each drive is considered to be a subassembly even when it is individually mar
keted to the customer. As a subassembly, no Federal Communications Commission verification or certification
of the device is required.
Seagate Technology LLC has tested this device in enclosures as described above to ensure that the total
assembly (enclosure, disc drive, motherboard, power supply, etc.) does comply with the limits for a Class B
computing device, pursuant to Subpart
likely to result in interference to radio and television reception.
Radio and television interference. This equipment generates and uses radio frequency energy and if not
installed and used in strict accordance with the manufacturer’s instructions, may cause interference to radio
and television reception.
This equipment is designed to provide reasonable protection against such interference in a residential installation. However, there is no guarantee that interference will not occur in a particular installation. If this equipment
does cause interference to radio or television, which can be determined by turning the equipment on and off,
you are encouraged to try one or more of the following corrective measures:
• Reorient the receiving antenna.
• Move the device to one side or the other of the radio or TV.
• Move the device farther away from the radio or TV.
• Plug the computer into a different outlet so that the receiver and computer are on different branch outlets.
J, Part 15 of the FCC rules. Operation with noncertified assemblies is
-
18 ST1.3 Series Product Manual, Rev. C
If necessary, you should consult your dealer or an experienced radio/television technician for additional suggestions. You may find helpful the following booklet prepared by the Federal Communications Commission:
How to Identify and Resolve Radio-Television Interference Problems. This booklet is available from the Super
intendent of Documents, U.S. Government Printing Office, Washington, DC 20402. Refer to publication number 004-000-00345-4.
-
ST1.3 Series Product Manual, Rev. C 19
20 ST1.3 Series Product Manual, Rev. C
3.0 Configuring and mounting the drive
This section contains the specifications and instructions for configuring and mounting the drive.
3.1 Handling and static discharge precautions
After unpacking, and before installation, the drive may be exposed to potential handling and electrostatic discharge (ESD) hazards. Observe the following standard handling and static-discharge precautions:
Caution:
• Keep the drive in the electrostatic discharge (ESD) bag until you are ready for installation to limit the drive’s
exposure to ESD.
• Before handling the drives, put on a grounded wrist strap, or ground yourself frequently by touching the metal
chassis of a computer that is plugged into a grounded outlet. Wear a grounded wrist strap throughout the entire
installation procedure.
• Handle the drive only by its edges or frame.
Host ZIF Connector
handling example
Bend Radius
Corners
Drive ZIF Connector
Drive Base Plate
Mounting
Drive HDA Cover
Host PCB
Rubber to be at least
1mm thick. For better
shock protection,
thicker rubber is
better.
Figure 7.ST
1.3 Series
proper
• The drive is fragile—handle it with care. Do not press down
on the drive top cover or attempt to use a pen to write on
the drive’s label.
• Do not apply more than 0.2 kg of force to the top cover.
ST1.3 Series Product Manual, Rev. C 21
Figure 8. ST1.3 Series improper handling example
• Always rest the drives on a padded, antistatic surface until you mount it in the system.
• Do not remove the factory-installed labels from the drive or cover them with additional labels. Removal voids
the warranty. Some factory-installed labels contain information needed to service the drive. Other labels are
used to seal out dirt and contamination.
• If provided, store drive in the protective casing when not in use.
• Turn the power off before installing or removing the drive.
• Do not cover the breather hole with any type of label, sticker, or impede the flow of air at any time.
3.2 Drive installation
See figure 9 for drive mechanical dimensions.
Follow these installation precautions when inserting the drive:
• Follow instructions for the installation of data storage devices, provided with your device’s user manual.
• Do not obstruct the breather hole on the drive (see Figure 4).
22 ST1.3 Series Product Manual, Rev. C
• Handle the drive only by its edges or frame or designated finger grip region during mounting (see Figure 4).
Figure 9. ST1.3 Series mechanical dimensions—top, bottom, side and end view
ST1.3 Series Product Manual, Rev. C 23
3.3 Mounting considerations
• Use an elastic mounting material to protect drives so as to ensure that more shock can be absorbed.
• There are no guides along the side for mounting. Instead, refer to figure on areas (refer to Figure 10, high-
lighted in blue) where the mounting material can rest on.
• The drive can be operated in any orientation but horizontal or vertical orientation is preferred.
• Allow a minimum clearance of 0.030 inches (0.76 mm) around the entire perimeter of the drive for cooling,
with the exception of the mounting edges for better airflow.
• Our recommendation is to make as few bends on the flex cable as possible, the ideal being a flat cable. This
is to prevent risk of circuit traces on FPC breaking during integration. (See Figure
• The FPC may be bent in order to improve suspension of the disk. In case the system design warrants bend-
ing, care should be taken to maximize the radius.
• Mounting materials are available from many third-party vendors.
• The ZIF connector on ST1.3 has a groove for FPC with tab (refer to Figure 12), for better retention.
Measurements made for horizontal retention force using FPC with tab versus FPC without tab is
17.44 N vs. 7.69 N.
• The ZIF connector has a specification of 5 insertion cycles.
11)
Figure 10. ST1.3 Series Area for Protective Mounting
Figure 11. ST1.3 Series Mounting Drive using FPC with Multiple Bends
Figure 12. ST1.3 Series ZIF connector with Groove for FPC with Tab
24 ST1.3 Series Product Manual, Rev. C
4.0 Interface description
These drives use the industry-standard ATA task file interface that supports 16-bit data transfers. It supports
ATA programmed input/output (PIO) modes 0–4; multiword DMA modes 0–2, and Ultra DMA modes 0–4. The
drive also supports the use of the IORDY signal to provide reliable high-speed data transfers.
For detailed information about the 35-way ZIF (IDE interface) connector, please contact your local Seagate
representative.
4.1 Connector interface signals and connector pins
The following table summarizes the signals on the 35-way ZIF (zero insertion force) IDE interface connector.
For a detailed description of these signals, please contact your local Seagate representative.
Table 8: 35-way ZIF (IDE interface) connector signals
Pin
Num
1GNDGround
2D10Data bus bit 10
3D09Data bus bit 09
4D02Data bus bit 02
5D08Data bus bit 08
6D01Data bus bit 01
7ResReserved. Do not connect
8D00Data bus bit 0
9ResReserved. Do not connect
10 A00 Address bus bit 0
11 DMACK- DMA Acknowledge
12 A01 Address bus bit 1
13 DMARQ DMA Request
14 A02 Address bus bit 2
15 IORDY
16 RESET- Hard Reset
17 Res Reserved. Do not connect
18 VCC 3.3V Voltage supply to drive
19 VCC 3.3V Voltage supply to drive
20 IRQ Interrupt request
21 IOWR-
Signal
Name
In, Out
Type
I/O Ready
DMA ready during Ultra DMA data-in bursts
DMA strobe during Ultra DMA data-out bursts
I/O Write
Stop during DMA data bursts
ST1.3 Series Product Manual, Rev. C 25
Table 8: 35-way ZIF (IDE interface) connector signals
22 IORD-
23 CS1- Chip select 1
24 CS0- Chip select 0
25 D15 Data bus bit 15
26 D07 Data bus bit 07
27 D14 Data bus bit 14
28 D06 Data bus bit 06
29 D13 Data bus bit 13
30 D05 Data bus bit 05
31 D12 Data bus bit 12
32 D04 Data bus bit 04
33 D11 Data bus bit 11
34 D03 Data bus bit 03
35 GND Ground
I/O Read
DMA ready during Ultra DMA data-in bursts
DMA strobe during Ultra DMA data-out bursts
Note. For ST1.3 Series, drive is operating in master-mode only, and the DASP# (Drive Active/Slave
Present) that is commonly used to drive LED light to indicate drive activity is not available.
26 ST1.3 Series Product Manual, Rev. C
4.1.1 Supported ATA commands
The following table lists ATA-standard commands that the drive supports. For a detailed description of the ATA
commands, refer to ATA version 7 specification, Volume 1. (www.t13.org).
Table 9: Supported commands
Command name Command code (in hex)
Does command cause drive to
transition to active mode?
ATA-standard commands
Check Power Mode 98
Download Microcode 92
Flush Cache E7
Identify Device EC
Idle 97
Idle Immediate 95
Read DMA C8
Read Multiple C4
Read Sectors 20
Seek 7X
Set Features EF
Set Multiple Mode C6
Sleep 99
H, E5H
H
H
H
H, E3H
H, E1H
H, C9H
H
H, 21H
H
H
H
H, E6H
Smart B0h X
[1]
X
X
X
X
X
X
X
X
X
X
Standby 96
Standby Immediate 94
Write DMA CA
Write Multiple C5
Write Sectors 30
H, E2H
H, E0H
H, CBH
H
H, 31H
X
X
X
X
X
[1] ‘X’ indicates: If the drive is in Standby mode, it will cause the drive to spin up to Active mode in order to
execute the command.
ST1.3 Series Product Manual, Rev. C 27
4.1.2 Identify Device command
The Identify Device command (command code ECH) transfers information about the drive to the host following
power up. The data is organized as a single 512-byte block of data, whose contents are shown in the table on
page 28. All reserved bits or words should be set to zero. Parameters listed with an “x” are drive-specific or
vary with the state of the drive. See Section 2.0 on page 3 for default parameter settings.
The following commands contain drive-specific features that may not be included in the Draft ATA-7 Standard.
Word ATA specification Value
Configuration information:
• Bit 15: 0 = ATA; 1 = ATAPI
0
1 Number of logical cylinders 16,383
• Bit 7: removable media
• Bit 6: removable controller
• Bit 0: reserved
848A
H
2 ATA-reserved 0000
3 Number of logical heads 16
4-5 Retired 0000
6 Number of logical sectors per logical track 003F
7-9 Retired 0000
10–19 Serial number: (20 ASCII characters, 0000H = none) ASCII
20 Retired 0003
21 Retired 0100
22 Obsolete 0004
23–26 Firmware revision (8 ASCII character string, padded with blanks to end of string) x.xx
ST612712DEG,
ST612712DE,
ST610712DEG,
27–46
Drive model number:
(40 ASCII characters, padded with blanks to end of string)
ST610712DE,
ST680712DEG,
ST680712DE,
ST660712DEG,
ST660712DE
47 (Bits 7–0) Maximum sectors per interrupt on Read multiple and Write multiple (16) 8010
48 Reserved 0000
49 Standard Standby timer, IORDY supported and may be disabled 0B00
50 ATA-reserved 0000
51 PIO data-transfer cycle timing mode 0200
52 Retired 0200
53 Words 54-58, 64–70 and 88 valid 0007
54 Number of current logical cylinders xxxx
55 Number of current logical heads xxxx
56 Number of current logical sectors per logical track xxxx
57-58 Current capacity in sectors xxxx
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
28 ST1.3 Series Product Manual, Rev. C
Word ATA specification Value
59 Number of sectors transferred during a Read Multiple or Write Multiple command 0100
60–61
Total number of user-addressable LBA sectors available
(see Section 2.2 for related information)
capacity xxxx
62 Retired 0000
63 Multiword DMA active and modes supported (see note following this table) xx07
64 Advanced PIO modes supported (modes 3 and 4 supported) 0003
65 Minimum multiword DMA transfer cycle time per word (120 nsec) 0078
66 Recommended multiword DMA transfer cycle time per word (120 nsec) 0078
67 Minimum PIO cycle time without IORDY flow control (240 nsec) 00F0
68 Minimum PIO cycle time with IORDY flow control (120 nsec) 0078
69–74 ATA-reserved 0000
75 Queue depth 0000
76-79 ATA-reserved 0000
80 Major version number 00F0
81 Minor version number 0000
82 Command sets supported 746B
83 Command sets supported 5109
84 Command sets supported extension 4000
85 Command sets enabled 7469
86 Command sets enabled 1009
87 Command sets enabled extension 4000
88 Ultra DMA support and current mode (see note following this table) xx1F
89 Security erase time 0000
90 Enhanced security erase time 0000
91 Advanced power management value 4040
92 Master password revision code 0000
93 Hardware reset value 400D
94 Auto acoustic management setting 8080
95-99 ATA-reserved 0000
100-103
Total number of user-addressable LBA sectors available for
48-bit addressing feature (48-bit addressing not supported)
0000
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
104–127 ATA-reserved 0000
128 Security status 0001
129–159 Seagate-reserved xxxx
160-254 ATA-reserved 0000
255 Integrity word xxA5
H
H
H
H
H
ST1.3 Series Product Manual, Rev. C 29
Note. See the bit descriptions below for words 63 and 88 of the Identify Drive data:
Description (if bit is set to 1)
Bit Word 63
0 Multiword DMA mode 0 is supported.
1 Multiword DMA mode 1 is supported.
2 Multiword DMA mode 2 is supported.
8 Multiword DMA mode 0 is currently active.
9 Multiword DMA mode 1 is currently active.
10 Multiword DMA mode 2 is currently active.
Bit Word 88
0 Ultra DMA mode 0 is supported.
1 Ultra DMA mode 1 is supported.
2 Ultra DMA mode 2 is supported.
3 Ultra DMA mode 3 is supported.
4 Ultra DMA mode 4 is supported.
8 Ultra DMA mode 0 is currently active.
9 Ultra DMA mode 1 is currently active.
10 Ultra DMA mode 2 is currently active.
11 Ultra DMA mode 3 is currently active.
12 Ultra DMA mode 4 is currently active.
30 ST1.3 Series Product Manual, Rev. C
4.1.3 Set Features command
This command controls the implementation of various features that the drive supports. When the drive receives
this command, it sets BSY, checks the contents of the Features register, clears BSY and generates an inter
rupt. If the value in the register does not represent a feature that the drive supports, the command is aborted.
Power-on default has the read look-ahead and write caching features enabled. The acceptable values for the
Features register are defined as follows:
Table 10: Features register values
Feature Description
-
02
03
05
55
66
82
85
AA
CC
H
H
Enable Write Cache.
Used for Set transfer mode Command.
Sector Count register values:
00
H
01
H
08
H
09
H
0A
0B
H
0C
H
20
H
21
H
22
H
40
H
41
H
42
H
43
H
44
H
H
H
H
H
H
H
H
Enable advanced power management
Disable read look-ahead (read cache) feature.
Disable Power On Reset (POR) establishment of defaults at Soft Reset.
Disable write cache.
Disable Advanced Power Management
Enable read look-ahead (read cache) feature.
Enable Power On Reset (POR) establishment of defaults at soft reset
Set PIO mode to default (PIO mode 2).
Set PIO mode to default and disable IORDY (PIO mode 2).
PIO mode 0
PIO mode 1
PIO mode 2
H
PIO mode 3
PIO mode 4
Multiword DMA mode 0
Multiword DMA mode 1
Multiword DMA mode 2
Ultra DMA mode 0
Ultra DMA mode 1
Ultra DMA mode 2
Ultra DMA mode 3
Ultra DMA mode 4
ST1.3 Series Product Manual, Rev. C 31
32 ST1.3 Series Product Manual, Rev. C
5.0 Seagate Technology support services
Internet
For information regarding Seagate products and services, visit www.seagate.com. Worldwide support is
available 24 hours daily by email for your questions.
Presales Support:
Presales@Seagate.com
Technical Support:
DiscSupport@Seagate.com
Warranty Support:
http://www.seagate.com/support/service/index.html
mySeagate
my.seagate.com is the industry's first Web portal designed specifically for OEMs and distributors. It provides
self-service access to critical applications, personalized content and the tools that allow our partners to
manage their Seagate account functions. Submit pricing requests, orders and returns through a single,
password-protected Web interface-anytime, anywhere in the world.
spp.seagate.com
spp.seagate.com supports Seagate resellers with product information, program benefits and sales tools. You
may register for customized communications that are not available on the web. These communications contain
product launch, EOL, pricing, promotions and other channel-related information. To learn more about the
benefits or to register, go to spp.seagate.com, any time, from anywhere in the world.
Seagate Service Centers
Presales Support
Our Presales Support staff can help you determine which Seagate products are best suited for your specific
application or computer system, as well as product availability and compatibility.
Technical Support
Seagate technical support is available to assist you online at support.seagate.com or through one of our call
centers. Have your system configuration information and your “ST” model number available.
SeaTDD™ (+1-405-324-3655) is a telecommunications device for the deaf (TDD). You can send questions or
comments 24 hours daily and exchange messages with a technical support specialist during normal business
hours for the call center in your region.
ST1.3 Series Product Manual, Rev. C 33
Customer Service Operations
Warranty Service
Seagate offers worldwide customer support for Seagate products. Seagate distributors, OEMs and other direct
customers should contact their Seagate Customer Service Operations (CSO) representative for warrantyrelated issues. Resellers or end users of drive products should contact their place of purchase or Seagate
warranty service for assistance. Have your serial number and model or part number available.
Data Recovery Services
Seagate offers data recovery services for all formats and all brands of storage media. Our data recovery
services labs are currently located throughout the world. . Additional information, including an online request
form and data loss prevention resources, is available at
http://services.seagate.com/index.aspx
Authorized Service Centers
Seagate Service Centers are available on a global basis for the return of defective products. Contact your
customer support representative for the location nearest you.
USA/Canada/Latin America support services
For an extensive list of telephone numbers to technical support, presales and warranty service in USA/
Canada/Latin America, including business hours, go to the "Contact Us" page on
www.seagate.com.
Global Customer Support
Presales, Technical, and Warranty Support
Call Center Toll-free Direct dial
USA, Canada,
and Mexico 1-800-SEAGATE +1-405-324-4700
Data Recovery Services
Call Center Toll-free Direct dial FAX
USA, Canada, 1-800-475-01435 +1-905-474-2162 1-800-475-0158
and Mexico +1-905-474-2459
Europe, the Middle East and Africa Support Services
For an extensive list of telephone numbers to technical support, presales and warranty service in Europe, the
Middle East and Africa, go to the "Contact Us" page on
www.seagate.com.
Asia/Pacific Support Services
For an extensive list of telephone numbers to technical support, presales and warranty service in Asia/Pacific,
go to the "Contact Us" page on
www.seagate.com.
34 ST1.3 Series Product Manual, Rev. C
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ST1.3 Series Product Manual, Rev. C 35
36 ST1.3 Series Product Manual, Rev. C
Index
A
acoustics 15
Active mode 10
agency certification (regulatory) 17
altitude 11
ambient conditions 3
ambient temperature 11
areal density 1, 6
ATA-standard commands 27
Australian C-Tick 17
B
BPI 6
buffer 1, 6
C
cache 1, 6
case temperature 11
CE mark 17
certification 17
CF+ interface connector signals 25
China RoHS directive 18
commands 27
compliance 17
conducted noise 9
conducted RF immunity 15
configuring the drive 21
connector pins 25
consumption 8
Corrosive environment 14
C-Tick 17
current profile 8
D
DC power 7, 8
density 6
diagnostic software 1
disclaimer 2
Download Microcode 27
drive care 2
drive self-test 1
E
electrical fast transient 15
electromagnetic compatibility 17
Electromagnetic Compatibility Directive 17
electromagnetic immunity 15
EMC compliance 17
enclosures 18
environmental specifications 11
EPRML 1
error-correction algorithms 1
errors 16
EU RoHS directive 17
European Union 17
F
FCC verification 18
Features register 31
Flush Cache 27
formatted capacity 5
frequency 15
G
GMR 1
guaranteed sectors 5
H
handling 21
heads 1
height 6
humidity 11
I
I/O data-transfer rate 6
Identify Device 27
Identify Device command 28
Idle mode power, low 7
Information Technology Equipment 17
interface 6
Interface description 25
interface signals 25
interference 18
interleave 6
internal data-transfer rate OD 6
Introduction 1
ISO document 7779 15
K
Korean RRL 17
L
LBA mode 5
length 6
Load/Unload current 8
logical geometry 5
low power idle 8
Low power idle mode 10
M
maximum temperature 11
mechanical dimensions 23
modes 25
ST1.3 Series Product Manual, Rev. C 37
Mounting considerations 24
mounting the drive 21, 22
N
noise 9
nominal power 3
nonoperating random vibration 14
nonoperating shock 1, 12
Nonoperating sweep sine vibration 13
nonrecoverable read errors 16
O
Operating random vibration 13
operating shock 1, 12
Operating sweep sine vibration 13
P
performance idle 8
Performance idle mode 10
physical characteristics 6
pins 25
PIO 25
power consumption 7, 8
power management 10
power specifications 7
power-management modes 10
Power-on to Ready 6
precautions 22
programmable power management 10
protective mounting 24
R
radiated RF immunity 15
radio and television interference 18
radio frequency (RF) 15
Read DMA 27
read errors 16
Read Multiple 27
Read Sectors 27
read/write power and current 7
recording and interface technology 6
recording density 6
recording heads 1
recording method 6
register 31
relative humidity 11
reliability 16
resistance 9
RF 15
RoHS 17, 18
S
safety certification 17
SeaTools 1
sectors 5
Seek 27
seek mode 7
Seeking 8
Set Features 27
Set Features command 31
Set Multiple Mode 27
shock 12
signals 25
sleep mode 7
sound 15
specifications 3
spindle speed 1, 6
Spinup 8
spinup power 7
standby mode 7
Standby timers 10
Standby to Ready 6
Standby/Sleep 8
Standby/Sleep mode 10
static-discharge precautions 21
subassembly 18
support services 33
surge immunity 15
sustained data transfer rate 6
T
technical support services 33
temperature 11
temperature gradient 11
theory of liability 2
time to ready 6
timers 10
tort 2
track density 6
V
Vibration 12
voltage 9
voltage dips, interrupts 15
voltage tolerance 9
W
Warranty 16
warranty 2
weight 6
wet bulb temperature 11
width 6
Write DMA 27
Write Multiple 27
Write Sectors 27
38 ST1.3 Series Product Manual, Rev. C
Z
zero insertion force 1
ZIF 1
ZIF conn w-FPC Tab Groove 24
ST1.3 Series Product Manual, Rev. C 39
40 ST1.3 Series Product Manual, Rev. C
Seagate Technology LLC
920 Disc Drive, Scotts Valley, California 95066-4544, USA
Publication Number: 100409345, Rev. C, Printed in U.S.A.
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