Seagate ST225,ST213 User Manual

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OEM MANUAL II

PLEASE NOTE

SPECIFICATIONS OF THE ST213 HALF HEIGHT

10MB DRIVE CAN BE FOUND AT THE BACK OF

THIS MANUAL.

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Appendix 3: S1213

Specifications

UNroltMAmD CAPACITY
Pet Driw:
~rCrlindor.

•••• Trocl.:

roRMAmD CA'ACT\'

Per Drtw:

P.rCylindet:

An Tnc:k:
IW SectOl':
SeetON per

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PHYSICAL ORGANI7.ATION

TrKu: t.210

Cylinden: 815
Red/Write He•••• : 2

DIK': 1

fUNCnONALSP£CnCATIONS
Rot.honlll Speed: 3.600 RPM
Record!n. Scheme: MFM
Recordihl Den.U,: '.827 BPI
Flu Den.lty: '.827 Fa

TrackDen.II,: 588TPI

Interface: ST412

o.'a Tr.Mr., tt.,.: S.O Mes.bUslleC

ACaSS TIME
1rKk·lo·TrKk; 20mMIC

Aver'lIt8: aSmRC

Full Strub: UOmaec

Lalency: I.JJmsec; noml •••1

EnOR RATES

RKowf.bI.

Non.rtICowr.W. RlrIHf Enon:

Seek Erron:

·1itK.~~wHhlll"ret""

u No4I NCCftIftlbie ."hlll •• ,.., ••

REWlnsrY S'WnCATIONS
MTBf: 20.000 A7wer~ Houn
PM: Not Requhod

M1TR: 30Mlnul••

SeI'YlceU": S

OP£RATIONAL ENVIRONMENT

AmbMtnI1empefllturo: ttrC 10 45"'C ISD-Flo 113-F,

Temperalure C,.ch.nt:
Rel,liw HumidUy: • 1080'" nonconden.lnl
Maximum Wet Bulb: 28'1: 1'•.•

DC!'OWU REQUIREMENTS
.IZVOC f: 5'" .1 AmIN 'yp.

• ,VOC

PowItr: 14.11
PHYSICAL SP£anCATIONS

U.lahl: 1.131nchet ma•. lfI..mm'
\Vkllh: S_lS = Inchet 1148.0S ~ mm'

Depth: 1.00 Inc:hee mu:.1203.Zmmt

WelSh': US II.. IUS kal

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12.1' Mea_byt"

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ST225 OEM MANUAL

October 22, 1985©

36005-001, Rev. F

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notice. the specifications contained in this manual.

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TABLE OF CONTENTS

I:'WTRODUcriON •.••••••••.••••••••••••••••••••••••.••••••.•••••
i.OSi'ECiHCATiOS SUMMARY •••••••••••••••••••••••••••••••••.• 8

1.1 Perrormance Specificalions ........•.•.••••..••.•.•...•...•••....• i

1.1.1 Access Time Ddinition and Timins .•.••..•.•..•.•..•...•..••.. I

1.2 Funclional Specifica.ions .••.•.•••.••.••••.•.•..•..••.•.•.•.••••. I

1.3 Physical Specificalions ...•..........•.••••.•..•..••..•....•••... !

1.4 RtiiabililY Specificalions ..........•...••••..•.•.•.•..•••..•.•••.. 2

1.4.1 Read Error Rales ....•.......•.•..•••••.•••.•....••..•.•..... 2

1.4.1.1 Bil Jiner •....•.....•......••..••....•.•.•...•..•......•. 2

1.4.2 Media DereCIS ••••........••.•.••••.•..•.......••••..•••.... 2

I.S Environmental Specifications ...........•••...........••.••.•.••.. 2

1.5.1 Ambien. Temperalure ..........•..••.•...•..••.••••..••....•. 2

1.5.2 TemperaiUre Gradi.ni. ......•...•...••..••..•..........•.••.• 2

1.5.3 Relalive HumidilY ......•..•.••......••.•.•.•.•..........•••• 3

I.SA Ahilude Limi.s .........••......•••.••..••......•...••.•.••• 3

I.S.S Optrating Shock ....•....••.....••••..••......•.••••••.•.... 3

1.5.6 Operaling Vibralion ........•.....•...•.••......••...•..•..•• 3

1.5.7 Nonope,ating Shock ..•...•.•......•......•.......•..•..•.•.. 3

!.S.8 Nonoperaling Vibralion ...........••.......••....••••••••.•.. 3

1.6 DC Power Requiremenls ...•.....•..•..••..•.•..•..•....•••...•.• 3

1.6.1 Inpu. Noise Ripple •....•..•.•....•.....•.•••.•.....•.••..•.. 4

1.6.2 Inpu. Noise Frequency •..•..•....•••••...•.......•.•..•.••••• 4

1.6.3 H.al Dissipation ••...•••..•.•..••.•.••.•••..•...••.••.•...•. 4

1.7 Mounling Requirements ...•.....••.••.•.•.••••.•.•.•••...••••... 5

1.7.1 Shock Mounring Recommendalion .•••....••...•.•....••.•••... 5

1.7.2 Handling and Slatic·Discharge Precautions .••.••......••.•.•••.• 6

1.7.3 Shipping Zone .•.....•......•..••.••...••••.....••..•.•..•.• 6

USn25 HOST/DRiVE INTERFACE ••••••••••••••••••••••••••••••• 7

2.1 Conlrol/Slatus Signals: PCB Edge·Connector. JI .•..•...•••••.•....• 7

2.2 Dala Signals; PCB Edge·Conneclor, J2 ...•••..•...••.•...••••..••.• 9

2.3 DC Power Connector, J3 .•••.....•..••.•..•.•.•...•.....••....•.. II

3.0 DRIVE CONfiGURATION ••••••••••••••••••••.•• , ••••••••••••• 13

3.1 Drive Configuralion Shunt. J7 ..••••.•••••.••••••...•.•.••....••.. 13

3.2 Drive Seleci Configuralion .•••.......•.•••••..•..•.•.•.•.••..••.. 13

3.2.1 Daisy.Chain •...•••.•...••.•..•.•.•...••...•.•...••.•••..... 13

3.3 Radial ..•...•...••....•.•..•.•..•.•...•••••.••.•.•••.••.•..•.. 14

3.4 Write Fault ....••.•••...•.•.•...•.•.••••.•..•••..•...•••...•••• 14

3.5 lire Test. ...•.•••...•....•••..•.....••••...••..•••.••••.•.••••. 14

3.6 Recovery Mode ••.•.•........•....••..•..•..•..•...••••.•.••.... IS

4.0 CONTROL INi'UYSiGNALS ••••••••••••••••••••••••••••••••••• 16

4.1 Head Seleci 2", 2'. 2'. 2' ..•...•.....•....••.••••.....••..•...••..• i6

4.2 Wrile Gale •.......•....•......•.••..••..•.•......•.•••••..•... 16

4.3 Slep ....•.....••...•....•••.•..•••••••.•.••.•....•....•••••••• 17

4.3.1 Burrered Seek ..•..•.•.•.•..•..•..••••.••••.•.•.•.•••••.••••. 18

4.3.2 Slow·Slep (Track-Io-Tr:ack) .••..••••.••••.••••.••.••..••.•••.•. 18

4.3.3 AUlo·Truncation •.. , •....•...•.•..••.•.••••..•.•.••.••.•.••• 19

4.4 Direclion In •....••.•• , •.••..•..•..•••••..••.••..•.••.••.•..... 19

4.5 Drive Select. ......•.•••....••......•••.•.•....•....•..•..•.•••. 20

4.6 Recovery Mode ...••••......•......••••.•.••••..•.•..•.••.•..... 21

5.0 CONTROL OUTPUT SiGNALS ••••••••••••••••••••••••••••••••• 22

5.1 Drive Selected ....•..•••...••.....•...••.....••••.•....••••••.•. 22

5.2 Index ..•..•.•...•••••.•....•....••..•.•••.••..••..•.•••.••..•. 22

5.3 Track" .....•..•.......•.•......•••••••••.•....•.••.•.•••••..• 22

5.4 index and Track" Scnsinl ..•..•...••.••••.•.............•..•••.• 22

5.5 Ready .•..•.•...••.•.•..•••.••..••..••...•.•....•••....••.•... 23

5.6 Seck Complete ...••.•..•....•.....•..•••.•.••.•.•...••.••.•.••• 23

5.7 Writc f~uli ....•................•..•••••..••••........••.••••.. 23

S.7.1 Wriie fault Signll <lener.iion ......••••.••••...••...•..•..••.• 23

5.7.1.1 Wrile Curreni imerrupiioli .......•....•...•..........••.•. 23

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5.8.\ DC·Um'al~ Si8n~1 ~4
'.8.1.1 VoUla~~ Comparalor., ,

'.8.2 H~ad Select Comparators ., ............•..................... 24

6.0 powt:R·B.\ SF.Ql'E;I;n: .•..•...........••....•••..••••••• :: ... 25

7.U UATATR.",;I;Sn:R U;I;t:s ...............••..••.•.....•••.....•. 26

7.1 WrileOper.ation., ......................•....................•.. 26

7.1.1 :\IFM \;vrile Data .............................•......•.•..... 27

7.\.2 Write Gale, .....................•....•........•......••.... 27

7.1.3 Line R"'cei\'~r . , 27

7.\04 Precorrnpensation ...........................•.......•....•... 27

7.2 R~ad Ope ••:"ion 28

7.2.\ M F~I Read Dala .............•.•...........•.•......•....... 28

7.2.2 Head Select 28

7.2.3 lSI Preamp , .................•..•..•....•.............. 28

7.204low·PatsS Filler ..................•........•..........•.•.. · .28

7.2.5 Phase Shifr~r 28

7.2.6 Z~ro·ClosS DCICclOr , ................••.................. 29

7.2.7 Time I>omain Fih~r ..................•.....•................ 29

1.2.8 Line Du-h'er ............................•.................. 29

1.0 TlIt:ORY OF OPERATIO;l;S .....•.....•..•......••.•.••.•••..•• 30

8.1 Microproc~sor .................................•............... 30

8.1.1 MPU·h,ilializing ............................•....•..•...•••. 30

8.1.2 MPU-Itdle ......................•.................•......... 30

8.\.3 Seeking: , ........................•.......................•.. 31

8.2 Spindle M01er Conllel .........•....•...•.............•.......•. 31

9.0 fIELD SERVICE ....•••...•......••..••.••..••••.••••...•....• 3J

9.1 PC Board Removal ....................•..•..................... JJ

10.0COMPOSf.:\T LOCATIO:\S. SCm:MATICS .....•.......•.•...• J5

APPE:IODIX

APPE:-IDIX 2~ Siandard Spares List. ..........••.......•••.........•. 39

I::J2Srclnr. 256 D)'le/Se<lor Formal Eumple •....••••.•••• 31

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FIGURES

FIGURE I: lYrical RMS + 12Voh DC Slan-UpCurn:ni Pial .........•.. ~

FIGURE 2: Reference Dimensions •.•..•.••..••.•..•...•...•.••..•.•.

FIGURE 3: Mounling Dimensions ...........•...................... 6

FIGURE 4: JI ConneclOr Dimensions ......••.•..................... 7

FIGURE S:Control/S.alus Signals ..........••...................•.. 8

FIGURE 6: J2 Connector Dimensions _................•.•... 9

FIGURE 7: Dala Signals .................•.. _ 10

FIGURE 8: JJ Conneclor ....•.............. - II

FIGURE 9: HOSi/Drive Imerface and Drh-eConfiguralion 12
FIGURE 10: Daisy-Chain Configuration 13

FIGURE II: Radial Configuralion _ , ...........•... 14

FIGURE 12:Comrol Signals Drh·er/ReceiverCombinalion ...•........... 16

FIGURE 13: Read/Wrile Timing ...............•..................... 17

FIGURE 14: Buffered·Seek Timing _ 18

FIGURE IS: Slow-Step Timing _•..........•.......... 18

FIGURE 16:AUla-Truncation Timing ........••.•..................•.. 19

FIGURE 17: Drive Select .....•..................................... 20

FIGURE 18: Recovery Mode Timing ......•••..•...................... 21

FIGURE 19: Faull Detection Flow ..........•........•............... 24

FIGURE 20: Power·On Sequence Timing _ 2S
FIGURE 21: Dala Signal Driver/Receiver CombirUltion 26

FIGURE 22: Write Operation _ 26

FIGURE 23: Read Operation , .•...................... 28

FIGURE 24: Microprocessor Operation ..........................•.... 30

FIGURE 2S:Spindle MOIOIControl ...........••...............••.... 31

FIGURE 26: PC Board Removal ..........• _" _

TABLES

TABLE I: JI Host/Drive Pin Assignments ......•..................... 8

TABLE 2: J2 HOSi/Drive Pin Assignments .. _.• _.....•..........•..•.. 10

TABLE 3: Precompensalion Pallem .......•..••..................... 27

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