seagate ST1.3 DATASHEET
Product Manual
ST1.3 Series
ST612712DEG
ST612712DE
ST610712DEG
ST610712DE
ST680712DEG
ST680712DE
ST660712DEG
ST660712DE
100409345
Rev . D
September 2007
Copyright © 2006 - 2007 Seagate Technology LLC. All rights reserved. Printed in U.S.A.
Publication number: 100409345, Rev. D September 2007
Seagate, Seagate Technology and the Wave logo are registered trademarks of Seagate Technology LLC
in the United States and/or other countries. ST1.3 Series, SeaTools and SeaTDD are either trademarks or
registered trademarks of Seagate Technology LLC or one of its affiliated companies in the United States
and/or other countries. All other trademarks or registered trademarks are the property of their respective
owners.
One gigabyte, or GB, equals one billion bytes when referring to hard drive capacity. Accessible capacity
may vary depending on operating environment and formatting. Quantitative usage examples for various
applications are for illustrative purposes. Actual quantities will vary based on various factors, including file
size, file format, features and application software. Seagate reserves the right to change, without notice,
product offerings or specifications.
ST1.3 Series Product Manual, Rev. D
i
Contents
1.0 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Drive care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Handling precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.0 Drive specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 Power, access times and acoustics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Formatted capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3 Default logical geometry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.4 Recording and interface technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.5 Physical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.6 Time to ready. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.7 Power specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.7.1 Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.7.2 Conducted noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.7.3 Voltage tolerance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.7.4 Power-management modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.8 Environmental specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.1 Ambient temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.2 Temperature gradient. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.3 Humidity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.4 Altitude. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.5 Shock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.8.6 Vibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.9 Acoustics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.10 Electromagnetic immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.11 Reliability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.12 Agency certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.12.1 Safety certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.12.2 Electromagnetic compatibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.12.3 European Union Restriction of Hazardous Substances (RoHS) Directive. . . . . 17
2.12.4 China Restriction of Hazardous Substances (RoHS) Directive . . . . . . . . . . . . . 18
2.12.5 FCC verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.0 Configuring and mounting the drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.1 Handling and static discharge precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.2 Drive installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.3 Mounting considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.0 Interface description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.1 Connector interface signals and connector pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.1.1 Supported ATA commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.1.2 Identify Device command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.1.3 Set Features command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.0 Seagate Technology support services. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
ii
ST1.3 Series Product Manual, Rev. D
ST1.3 Series Product Manual, Rev. D
iii
List of Figures
Figure 1. ST1.3 Series IDE interface (ZIF connector) disc drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 2. ST1.3 Series breather hole location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Figure 3. ST1.3 Series improper handling example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Figure 4. Typical 3.3V startup and operation current profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 5. Location where tri-axial accelerometer will be placed on ST1.3 Series drives. . . . . . . . . . . . 12
Figure 6. Drive axis definition for ST1.3 Series drives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 7. ST1.3 Series proper handling example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 8. ST1.3 Series improper handling example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 9. ST1.3 Series mechanical dimensions—top, bottom, side and end view . . . . . . . . . . . . . . . . 23
Figure 10. ST1.3 Series Area for Protective Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 11. ST1.3 Series Mounting Drive using FPC with Multiple Bends . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 12. ST1.3 Series ZIF connector with Groove for FPC with Tab . . . . . . . . . . . . . . . . . . . . . . . . . . 24
iv
ST1.3 Series Product Manual, Rev. D
ST1.3 Series Product Manual, Rev. D
1
1.0 Introduction
This manual de scribes t he fun cti onal, m echan ical and in terfa ce speci fica ti ons for the following Seagate® ST1.3
Series drives:
• ST612712DE-12GB, ST610712DE-10GB, ST680712DE-8GB and ST660712DE-6GB disc drives with a ZIF
(zero insertion force) connector using an IDE interface.
• ST612712DEG-12GB, ST610712DEG-10GB, ST680712DEG-8GB and ST660712DEG-6GB disc drives
with a ZIF (zero insertion force) connector using an IDE interface. These models incorporate an additional
free-fall sensor for robust drop performance.
These drives provide the following key features.
• 3,600-RPM spindle speed and a 2-Mbyte buffer combined for superior read/write performance.
• Quiet operation. Fluid Dynamic Bearing (FDB) motor.
• Tunneling Magnetoresistive (TMR) recording heads provide the drives with increased areal density.
• State-of-the-art cache and on-the-fly error-correction algorithms.
• 2.0K Gs nonoperating shock, and 300 Gs operating shock.
• SeaTools™ diagnostic software performs a drive self-test that eliminates unnecessary drive returns.
Figure 1. ST1.3 Series IDE interface (ZIF connector) disc drive
2
ST1.3 Series Product Manual, Rev. D
1.1 Disclaimer
Seagate Technology LLC makes no warranties whatsoever, including any warranty of merchantability, noninfringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification or sample. Seagate may not be held liable for any direct, indirect, incidental, special, exemplary, or consequential damages (including, but not limited to, loss of use, data, or profits; procurement of substitute goods
or services; or business interruptions) however caused and on any theory of liability, whether in contract, strict
liability, or tort (including negligence or otherwise) arising in any way from the use of this kit, even if advised of
the possibility of such damage.
1.2 Drive care
Do not use the ST 1.3 Series disc drives outside of the ranges of environ men ta l conditi on s found in S ection 2.8,
"Environmental specifications." Doing so may void the warranty of the ST1.3 Series disc drive.
1.3 Handlin g precautio ns
• Do not cover or seal the breather hole! Covering or sealing the breather hole may result in loss of data.
Figure 2. ST1.3 Series breather hole location
• Do not apply any force to the drive during handling or installation.
• When handling the drive, wear an wrist strap that is properly grounded to prevent damage from electrostatic
discharge (ESD).
• Handle the drive carefully by the edges. Do not touch any exposed printed circuit board or the top cover.
• The drive is fragile—handle it with care. Do not press down on the top cover or attempt to use a pen to write
on the drive’s label. Do not apply more than 0.2 kg of force to the top cover.
Figure 3. ST1.3 Series improper handling example
• Do not drop the drive.
• Do not expose the drive to wet conditions.
• Do not place the drive near a strong magnetic field.
• Do not expose the drive to extreme temperatures.
• The drive may become hot during operation. Be careful when removing the drive from the host device
immediately after operation.
ST1.3 Series Product Manual, Rev. D
3
2.0 Drive specifications
Unless otherwise noted, all specifications are measured under ambient conditions, at 25°C, and nominal
power. For convenience, the phrases the drive and this drive are used throughout this manual to indicate
ST612712DE, ST612712DEG, ST610712DE, ST610712DEG, ST680712DE, ST680712DEG, ST660712DE
and ST660712DEG model drives.
2.1 Power, access times and acoustics
The specifications listed in this table are for quick reference. For details on specification measurement or definition, see the appropriate section of this manual.
T a ble 1: S pec ifica tio ns
ST612712DEG
Drive specification
Formatted Gbytes 12.0 10.0 8.0 6.0
Guaranteed sectors 23,438,016 19,533,024 15,625,008 11,719,008
Physical heads 2/1
Physical discs 1
Bytes per sector (logical) 512
Cache (Mbytes) 2
Recording density, BPI (bits/inch max) 933,000
Track density. TPI (tracks/inch max) 140,000
Areal density (Gbits/inch2 max) 130.6
Spindle speed (RPM) 3,600
Internal data transfer rate OD (Mbits/sec max) 130.0
Sustained data transfer rate OD (Mbytes/sec) 10.2
I/O data-transfer rate (Mbytes/sec max) 66.7 (UDMA 4)
ATA data-transfer modes supported PIO modes 0–4;
Height (max) 5.1 mm (0.2009 inches)
Width 40.0 +/-0.2 mm (1.5748 +/-0.008 inches)
Length 30.0 +/-0.2 mm (1.1811 +/-0.008 inches)
Weight 13.6 gm - 0.3000 lb. (typ)
Average latency (msec) 8.3
Power-on to ready (sec typical / max) (without retry) 1.0 / 2.5
Standby to ready (sec typical / max) (without retry) 1.0 / 2.5
Startup current 3.3v (peak)
(maximum RMS in 10ms window)
Seek power (typical 3.3V) 154 mA
ST612712DE
Multiword DMA modes 0-2;
Ultra DMA modes 0–4
330 mA
ST610712DEG
ST610712DE
ST680712DEG
ST680712DE
ST660712DEG
ST660712DE
4
ST1.3 Series Product Manual, Rev. D
T a ble 1: S pec ifica tio ns
ST612712DEG
Drive specification
Read/write power (typical 3.3V) 230/240 mA
Performance idle mode (typical 3.3V) 140 mA
Low power idle mode (typical 3.3V) 77 mA
Standby/Sleep mode (typical 3.3V) 13 mA
Voltage tolerance (including noise) 3.3V ± 5%
Ambient temperature 0° to 60°C (operating)
Temperature gradient (°C per hour max) 20°C (operating)
Relative humidity (noncondensing) 5% to 90% (operating)
Relative humidity gradient 30% per hour max
Wet bulb temperature (°C max) 33°C (operating)
Altitude, operating –60.98 m to 3,048 m (–200 ft to 10,000+ ft)
Altitude, nonoperating (below mean sea level, max) –60.98 m to 12,192 m (–200 ft to 40,000+ ft)
Shock, operating (Gs max at 1 msec) 300
Shock, nonoperating (Gs max at 1 msec) 2000
Vibration, operating
(max displacement may apply below 10 hz)
Vibration, nonoperating
(max displacement may apply below 22 hz)
Drive acoustics, sound power (bels)
Idle (typical / max) 1.6/ 1.9
Operational (typical / max) 1.7 / 2.0
Nonrecoverable read errors 1 per 1014 bits read
Load/Unload (LUL) cycles (25°C) 300,000 software-controlled power on/off cycles
Warranty Per agreement
ST612712DE
–40° to 70°C (nonoperating)
30°C (nonoperating)
5% to 95% (nonoperating)
40°C (nonoperating)
1.0 Gs (0 to peak, 10–500 Hz) @ 2 oct/min sweep rate
5.0 Gs (0 to peak, 10–500 Hz) @ 0.5 oct/min sweep rate
20,000 hard power on/off cycles
ST610712DEG
ST610712DE
ST680712DEG
ST680712DE
ST660712DEG
ST660712DE
ST1.3 Series Product Manual, Rev. D
5
2.2 Formatted capacity
Model Formatted capacity Guaranteed sectors Bytes per sector
ST612712DEG
ST612712DE
ST610712DEG
ST610712DE
ST680712DEG
ST680712DE
ST660712DEG
ST660712DE
12.0 Gbytes 23,438,016 512
10.0 Gbytes 19,533,924 512
8.0 Gbytes 15,625,008 512
6.0 Gbytes 11,719,008 512
2.3 Default logical geo m etry
Model Cylinders Read/write heads Sectors per track
ST612712DEG
ST612712DE
ST610712DEG
ST610712DE
ST680712DEG
ST680712DE
ST660712DEG
ST660712DE
LBA mode
When addressing these drives in LBA mode, all blocks (sectors) are consecutively numbered from 0 to n–1,
where n is the number of guaranteed sectors as defined above.
16,383 16 63
6
ST1.3 Series Product Manual, Rev. D
2.4 Re cording and interface technol o gy
Technology Specification
Interface Seagate (ZIF) Flex Connector (35-way)
Recording method Perpendicular Magnetic Recording
Recording density BPI (bits/inch max) 933,000
Track density TPI (tracks/inch max) 140,000
Areal density (Gbits/inch2 max) 130.6
Spindle speed (RPM) (± 0.2%) 3,600
Internal data-transfer rate OD (Mbits/sec max) 130.0
Sustained data transfer rate OD (Mbytes/sec max) 10.2
I/O data-transfer rate (Mbytes/sec max) 66.7 (UDMA 4)
Interleave 1:1
Cache buffer
All models 2 Mbytes (2,048 Kbytes)
2.5 Physical characteristics
Height (mm)
(inches)
Width (mm)
(inches)
Length (mm)
(inches)
Typical weight (grams)
(pounds)
Interface Connector Seagate (ZIF) Flex Connector (35-way)
5.1 (max)
0.2007 (max)
40.0 +/-0.2
1.5748 +/-0.008
30.0 +/-0.2
1.181 1 +/-0.008
13.6 (typ)
0.030 (typ)
2.6 Time to ready
Time to ready T yp ical Max (without retry)
Power-On to Ready (sec) 1.0 2.5
St andby to Ready (sec) 1.0 2.5
ST1.3 Series Product Manual, Rev. D
7
2.7 Power specifications
The drive receives DC power (+3.3V) through the ZIF (IDE interface) connector for ST612712DE,
ST612712DEG, ST610712DE, ST610712DEG, ST680712DEG, ST680712DE, ST660712DEG and
ST660712DE models.
2.7.1 Power consumption
Power requiremen ts for the dr iv es are lis ted in the ta ble on page 8. Typical power measu rem ent s are ba sed on
an average of drives tested, under no minal co ndi tions, using + 3. 3V i nput vo lta ge at 25°C am bient tempe ratu re.
• Spinup power
Spinup power is measured from the time of power-on to the time that the drive spindle re aches operating speed.
• Seek mode
During seek mod e, the read /write actuator arm move s toward a spe cific positi on on the d isc surface and does
not execute a read or write operati on. Servo ele ctronics ar e acti ve. Seek mode power is mea sure d based on
three random seek operations every 100 msecs. This mode is not typical.
• Read/write power and current
Read/write power is measured with the heads on track, at the moment while the head is writing/reading
from/to disc. It is performed with 100 percent duty cycle of write/read operation.
• Low power idle mode
Spindle motor is working normally with actuator unloaded to the parked position.
• Standby mode / Sleep mode
During Standby mode, the drive accepts commands, but the drive is not spinning, and the servo and read/
write electronics are in power-down mode.
8
ST1.3 Series Product Manual, Rev. D
T a ble 2: DC power
ST1.3 Series Power Consumption (W)
Max current the average of the peak value in 10ms window
Current 270 330
Spinup 180 300
Load/Unload current 190 200
Write 240 300
Read 230 300
Seek 154 161
Performance idle 140 147
Low power idle 77 86
Standby/Sleep 13 18
*Duri ng pe riods of driv e idl e, some off lin e a c tivit y ma y occu r ac cord in g t o t he S.M .A. R. T. speci fic ation , w hich may increase acou s tic and
power to operational levels.
Average 3.3V (mA) Max 3.3V (mA)
2.7.1.1 Typical current profile
Figure 4. Typical 3.3V startup and operation current profile
Loading...