Seagate ST1.2 User Manual
ST1.2 Series
ST68022CF
ST68022FX
ST66022CF
ST66022FX
ST64022CF
ST64022FX
ST1.2 Series
ST68022CF
ST68022FX
ST66022CF
ST66022FX
ST64022CF
ST64022FX
© 2005, Seagate Technology LLC All rights reserved
Publication number: 100375652, Rev. A
May 2005
Seagate, Seagate Technology and the Wave logo are registered trademarks of Seagate
Technology LLC. SeaTools, SeaFONE, SeaBOARD and SeaTDD are registered trademarks
or trademarks of Seagate Technology LLC. Other product names are registered trademarks
or trademarks of their owners.
Seagate reserves the right to change, without notice, product offerings or specifications. No
part of this publication may be reproduced in any form without written permission of Seagate
Technology LLC.
Revision status summary sheet
Revision Date Sheets Affected
Rev. A 05/27/05 All.
Contents
1.0 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Drive care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Handling precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.0 Drive specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 Power, access times and acoustics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Formatted capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3 Default logical geometry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.4 Recording and interface technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.5 Physical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.6 Time to ready. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.7 Power specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.7.1 Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.7.2 Conducted noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.7.3 Voltage tolerance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.7.4 Power-management modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.8 Environmental specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.1 Ambient temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.2 Temperature gradient. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.3 Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.4 Altitude . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.5 Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.8.6 Vibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.9 Acoustics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.10 Electromagnetic immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.11 Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.12 Agency certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.12.1 Safety certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.12.2 Electromagnetic compatibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.12.3 European Union Restriction of Hazardous Substances (RoHS) Directive . . . . . 17
2.12.4 FCC verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.0 Configuring and mounting the drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.1 Handling and static discharge precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.2 Drive installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.0 Interface description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.1 Connector interface signals and connector pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.1.1 Flex interface connector signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.1.2 Supported ATA commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.1.3 Identify Device command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.1.4 Set Features command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.1.5 Card Information Structure (CIS) information for CF . . . . . . . . . . . . . . . . . . . . . 35
5.0 Seagate Technology support services. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
ST1.2 Series Product Manual, Rev. A v
vi ST1.2 Series Product Manual, Rev. A
List of Figures
Figure 1. ST1.2 Series CompactFlash+ disc drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 2. ST1.2 Series Flex (IDE interface) disc drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 3. ST1.2 Series breather hole location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Figure 4. ST1.2 Series improper handling example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Figure 5. Typical 3.3V startup and operation current profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 6. Location where tri-axial accelerometer will be placed on ST1.2 drive . . . . . . . . . . . . . . . . . . 12
Figure 7. Drive axis definition for ST1.2 drives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 8. ST1.2 Series proper handling example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 9. ST1.2 Series improper handling example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 10. CF model mechanical dimensions—top, side and end view . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 11. FX model mechanical dimensions—top, side and end view. . . . . . . . . . . . . . . . . . . . . . . . . . 21
ST1.2 Series Product Manual, Rev. A vii
viii ST1.2 Series Product Manual, Rev. A
1.0 Introduction
This manual describes the functional, mechanical and interface specifications for the following Seagate® ST1.2
Series drives:
• ST68022CF, ST66022CF and ST64022CF CompactFlash+ Type II disc drives.
• ST68022FX, ST66022FX and ST64022FX Flex (IDE interface) disc drives.
These drives provide the following key features.
• 3,600-RPM spindle speed and 2-Mbyte buffer combine for superior performance.
• Quiet operation. Fluid Dynamic Bearing (FDB) motor.
• Giant magnetoresistive (GMR) recording heads and EPRML technology, which provide the drives with
increased areal density.
• State-of-the-art cache and on-the-fly error-correction algorithms.
• 1.5K Gs nonoperating shock, and 200 Gs operating shock.
• SeaTools™ diagnostic software performs a drive self-test that eliminates unnecessary drive returns.
Figure 1. ST1.2 Series CompactFlash+ disc drive
Figure 2. ST1.2 Series Flex (IDE interface) disc drive
ST1.2 Series Product Manual, Rev. A 1
1.1 Disclaimer
Seagate Technology LLC makes no warranties whatsoever, including any warranty of merchantability, noninfringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specifi
cation or sample. Seagate may not be held liable for any direct, indirect, incidental, special, exemplary, or consequential damages (including, but not limited to, loss of use, data, or profits; procurement of substitute goods
or services; or business interruptions) however caused and on any theory of liability, whether in contract, strict
liability, or tort (including negligence or otherwise) arising in any way from the use of this kit, even if advised of
the possibility of such damage.
1.2 Drive care
Do not use the ST1.2 Series disc drives outside of the ranges of environmental conditions found in Section 2.8,
"Environmental specifications." Doing so may void the warranty of the ST1.2 Series disc drive.
1.3 Handling precautions
• Do not cover or seal the breather hole! Covering or sealing the breather hole may result in loss of data.
-
Figure 3. ST1.2 Series breather hole location
• Do not apply any force to the drive during handling or installation.
• Always handle the drive with care to prevent damage from shock, vibration, or electrostatic discharge (ESD).
• Handle the drive carefully by the edges. Do not touch any exposed printed circuit board or the top cover.
• The drive is fragile—handle it with care. Do not press down on the top cover or attempt to use a pen to write
on the drive’s label. Do not apply more than 1.5 kg of force to the top cover.
Figure 4. ST1.2 Series improper handling example
• Always carry the drive in its plastic case.
• Do not drop the drive.
• Do not expose the drive to wet conditions.
• Do not place the drive near a strong magnetic field.
• Do not expose the drive to extreme temperatures.
• Do not use the drive in CF+ Type II slots without an ejection mechanism.
• The drive may become hot during operation. Be careful when removing the drive from the host device
immediately after operation.
2 ST1.2 Series Product Manual, Rev. A
2.0 Drive specifications
Unless otherwise noted, all specifications are measured under ambient conditions, at 25°C, and nominal
power. For convenience, the phrases the drive and this drive are used throughout this manual to indicate
ST68022CF, ST68022FX, ST66022CF, ST66022FX, ST64022FX and ST64022CF model drives.
2.1 Power, access times and acoustics
The specifications listed in this table are for quick reference. For details on specification measurement or definition, see the appropriate section of this manual.
Table 1: Specifications
ST68022CF
Drive specification
Formatted Gbytes 8.0 6.0 4.0
Guaranteed sectors 15,625,008 11,719,008 7,999,488
Bytes per sector 1024
Cache (Mbytes) 2
Recording density, BPI (bits/inch max) 663,000
Track density. TPI (tracks/inch max) 110,000
Areal density (Gbits/inch2 max) 72.9
Spindle speed (RPM) 3,600
Internal data transfer rate OD (Mbits/sec max) 130.0
Sustained data transfer rate OD (Mbytes/sec) 8.8
I/O data-transfer rate (Mbytes/sec max) 33.3MB/s (UDMA 2)
ATA data-transfer modes supported PIO modes 0–4;
Height 5.0 +/-0.1 mm (0.1968 +/-0.004 inches)
Width 42.80 +/-0.101 mm (1.685 +/-0.004 inches)
Length 36.40 +/-0.15 mm (1.433 +/-0.006 inches)
Weight (typical) 18.0 grams (0.0397 lb.)
Average latency (msec) 8.3
Power-on to ready (sec typical / max) (without retry) 1.2 / 2.5
Standby to ready (sec typical / max) (without retry) 1.0 / 2.5
Startup current 5V (peak) (maximum RMS in 10ms window) 350 mA
Seek power (typical 3.3V) 226 mA
Read/write power (typical 3.3V) 330 mA
Performance idle mode (typical 3.3V) 200 mA
Low power idle mode (typical 3.3V) 90 mA
ST68022FX
Multiword DMA modes 0-2;
Ultra DMA modes 0–2
ST66022CF
ST66022FX
ST64022CF
ST64022FX
ST1.2 Series Product Manual, Rev. A 3
Table 1: Specifications
ST68022CF
Drive specification
Standby/Sleep mode (typical 3.3V) 30 mA
Voltage tolerance (including noise) 3.3V ± 5%
Ambient temperature 0° to 70°C (operating) (70°C case temperature)
Temperature gradient (°C per hour max) 20°C (operating)
Relative humidity (noncondensing) 5% to 90% (operating)
Relative humidity gradient 30% per hour max
Wet bulb temperature (°C max) 33°C (operating)
Altitude, operating –60.98 m to 3,048 m (–200 ft to 10,000+ ft)
Altitude, nonoperating (below mean sea level, max) –60.98 m to 12,192 m (–200 ft to 40,000+ ft)
Shock, operating (Gs max at 1 msec) Read 200
Shock, operating (Gs max at 2 msec) Write 175
Shock, nonoperating (Gs max at 1 msec) 1500
Shock, nonoperating (Gs max at 0.5 msec) 1500
Vibration, operating (max displacement may apply below 10 hz) 1.0 Gs (0 to peak, 5–500 Hz) @ 2 oct/min sweep rate
Vibration, nonoperating (max displacement may apply below 22 hz) 5.0 Gs (0 to peak, 5–500 Hz) @ 0.5 oct/min sweep rate
Drive acoustics, sound power (bels)
Idle (typical / max) 2.1/ 2.4
Operational (typical / max) 2.2 / 2.5
Nonrecoverable read errors
Annualized Failure Rate 0.4% AFR at 25°C
Load/Unload (LUL) cycles (40°C) 300,000 software-controlled power on/off cycles
Warranty Per agreement
ST68022FX
5V ± 10%
–40° to 70°C (nonoperating)
30°C (nonoperating)
5% to 95% (nonoperating)
40°C (nonoperating)
1 per 1014 bits read
20,000 hard power on/off cycles
ST66022CF
ST66022FX
ST64022CF
ST64022FX
4 ST1.2 Series Product Manual, Rev. A
2.2 Formatted capacity
Model Formatted capacity Guaranteed sectors Bytes per sector
ST68022CF
ST68022FX
ST66022CF
ST66022FX
ST64022CF
ST64022FX
8.0 Gbytes 15,625,008 1024
6.0 Gbytes 11,719,008 1024
4.0 Gbytes 7,999,488 1024
2.3 Default logical geometry
Model Cylinders Read/write heads Sectors per track
ST68022CF
ST68022FX
ST66022CF
ST66022FX
ST64022CF
ST64022FX
LBA mode
When addressing these drives in LBA mode, all blocks (sectors) are consecutively numbered from 0 to n–1,
where n is the number of guaranteed sectors as defined above.
15,501 16 63
11,626 16 63
7,936 16 63
ST1.2 Series Product Manual, Rev. A 5
2.4 Recording and interface technology
Technology Specification
Interface CompactFlash 2.0 (CF+ 2.0)
Recording method RLL 0,20
Recording density BPI (bits/inch max) 663,000
Track density TPI (tracks/inch max) 115,0 00
Areal density (Gbits/inch2 max) 72.9
Spindle speed (RPM) (± 0.2%) 3,600
Internal data-transfer rate OD (Mbits/sec max) 130.0
Sustained data transfer rate OD (Mbytes/sec max) 8.8
I/O data-transfer rate (Mbytes/sec max) 33.3MB/s (UDMA 2)
Interleave 1:1
Cache buffer
ST68022CF, ST68022FX, ST66022CF, ST66022FX,
ST64022CF and ST64022FX
2 Mbytes (2,048 Kbytes)
2.5 Physical characteristics
Height (mm)
(inches)
Width (mm)
(inches)
Length (mm)
(inches)
Typical weight (grams)
(pounds)
Interface Connector
ST68022CF, ST66022CF and ST64022CF
ST68022FX, ST66022FX and ST64022FX
5.0 +/-0.1 mm
0.1968 +/-0.004
42.80 +/-0.101
1.685 +/-0.004
36.40 +/-0.15
1.433 +/-0.006
18.0
0.0397
CompactFlash Type II Connector (50-pin)
Seagate Flex Connector (45-way)
2.6 Time to ready
Time to ready Typical Max (without retry)
Power-On to Ready (sec) 1.2 2.5
Standby to Ready (sec) 1.0 2.5
6 ST1.2 Series Product Manual, Rev. A
2.7 Power specifications
The drive receives DC power (+3.3V or +5V) through the CompactFlash interface connector for ST68022CF,
ST66022CF and ST64022CF models, and (+3.3V or +5V) through the Flex interface connector for
ST68022FX, ST66022FX and ST64022FX models.
2.7.1 Power consumption
Power requirements for the drives are listed in the table on page 8. Typical power measurements are based on
an average of drives tested, under nominal conditions, using +3.3V and +5.0V input voltage at 25°C ambient
temperature.
• Spinup power
Spinup power is measured from the time of power-on to the time that the drive spindle reaches operating speed.
• Seek mode
During seek mode, the read/write actuator arm moves toward a specific position on the disc surface and does
not execute a read or write operation. Servo electronics are active. Seek mode power is measured based on
three random seek operations every 100 msecs. This mode is not typical.
• Read/write power and current
Read/write power is measured with the heads on track, at the moment while the head is writing/reading
from/to disc. It is performed with 100 percent duty cycle of write/read operation.
• Idle mode power, low
Spindle motor is working normally with actuator unloaded to the parked position.
• Standby mode / Sleep mode
During Standby mode, the drive accepts commands, but the drive is not spinning, and the servo and read/
write electronics are in power-down mode.
ST1.2 Series Product Manual, Rev. A 7
Table 2: DC power
ST1 Power Consumption (W)
Max current the average of the
peak value in 10ms window
Current 350 350
Spinup 300 300
Load/Unload current 300 300
Write 330 350 330 350
Read 330 350 340 350
Seek 226 300 226 300
Performance idle 200 205
Low power idle 90 92
Standby/Sleep 30 33
*During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase acoustic and
power to operational levels.
Average
3.3V
(mA)
Max
3.3V
(mA)
Average
5.0V
(mA)
Max
5.0V
(mA)
2.7.1.1 Typical current profile
Figure 5. Typical 3.3V startup and operation current profile
8 ST1.2 Series Product Manual, Rev. A
2.7.2 Conducted noise
Input noise ripple is measured at the host system power supply across an equivalent 15-ohm resistive load on
the +5 volt line.
Using 5-volt power, the drive is expected to operate with a maximum of 100 mV peak-to-peak square-wave
injected noise at up to 20 MHz.
Using 3.3-volt power, the drive is expected to operate with a maximum of 70 mV peak-to-peak square-wave
injected noise at up to 20 MHz.
Note. Equivalent resistance is calculated by dividing the nominal voltage by the typical RMS read/write
current.
2.7.3 Voltage tolerance
Voltage tolerance (including noise):
5.0V ± 10%
3.3V ± 5%
ST1.2 Series Product Manual, Rev. A 9
2.7.4 Power-management modes
The drive provides programmable power management to provide greater energy efficiency. The drive features
the following power-management modes:
Table 3: Power-management modes
Power modes Heads Spindle Buffer
Active (operating) Tracking Rotating Enabled
Idle, low power Parked Rotating Disabled
Standby/Sleep Parked Stopped Disabled
• Active mode
The drive is in Active mode during the read/write and seek operations.
• Low power idle mode
Drive enters Low Power Idle mode from Active Idle mode when the Advanced Power Management Level is
set above 80h and the Idle timer is reached at 2 seconds. Disc is spinning and head is parked and drive accepts
all commands and returns to Active mode any time disc access is necessary.
• Performance idle mode
The buffer remains enabled, and the drive accepts all commands and returns to Active mode any time disc
access is necessary.
• Standby/Sleep mode
The drive enters Standby mode when the host sends a Standby Immediate command. If the host has set the
standby timer, the drive can also enter Standby mode automatically after the drive has been inactive for a
specifiable length of time. The standby timer delay is established using a Standby or Idle command. In Standby
mode, the drive buffer is disabled, the heads are parked and the spindle is at rest. The drive accepts all
commands and returns to Active mode any time disc access is necessary.
• Standby timers
Each time the drive performs an Active function (such as read, write or seek), the standby timer is reinitialized
and begins counting down from its specified delay times to zero. If the standby timer reaches zero before any
drive activity is required, the drive makes a transition to Standby mode. In both Idle and Standby mode, the
drive accepts all commands and returns to Active mode when disc access is necessary.
10 ST1.2 Series Product Manual, Rev. A
2.8 Environmental specifications
2.8.1 Ambient temperature
Ambient temperature is defined as the temperature of the environment immediately surrounding the drive.
Actual drive case temperature should not exceed
Above 1,000 feet (305 meters), the maximum temperature is derated linearly by 1°C every 1000 feet.
Operating 0° to 70°C (41° to 158°F) (70°C @ case temperature)
Nonoperating –40° to 70°C (–40° to 153°F)
2.8.2 Temperature gradient
Operating 20°C per hour (68°F per hour max), without condensation
Nonoperating 30°C per hour (86°F per hour max), without condensation
2.8.3 Humidity
2.8.3.1 Relative humidity
Operating 5% to 90% noncondensing (30% per hour max)
70°C (158°F) within the operating ambient conditions.
Nonoperating 5% to 95% noncondensing (30% per hour max)
2.8.3.2 Wet bulb temperature
Operating 33°C (91.4°F max) [1]
Nonoperating 40°C (104°F max) [2]
[1] Operating: Wet bulb temperature is calculated by the operating Temperature and the Relative Humidity levels.
[2] Nonoperating: Wet bulb temperature is calculated by the nonoperating Temperature and the Relative Humidity levels.
2.8.4 Altitude
Operating –60.98 m to 3,048 m (–200 ft to 10,000+ ft)
Nonoperating –60.98 to 12,192 m (–200 ft to 40,000+ ft)
ST1.2 Series Product Manual, Rev. A 11
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