seagate ST1.2 user guide

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PRODUCT MANUAL

ST1.2 Series

ST68022CF

ST68022FX

ST64022CF

ST64022FX

ST66022CF

ST66022FX

Rev. B

February 2007

Revision status summary sheet

Revision Date Sheets Affected

Rev. A 05/27/05 All. Rev. B 02/27/07 Front cover and 18.

Publication number: 100375652, Rev. B February 2007

Seagate, Seagate Technology and the Wave logo are registered trademarks of Seagate Technology LLC in the United States and/or other countries. ST1.2 Series, SeaTools and SeaTDD are either trademarks or registered trademarks of Seagate Technology LLC or one of its affiliated companies in the United States and/or other countries. All other trademarks or registered trademarks are the property of their respective owners.

One gigabyte, or GB, equals one billion bytes when referring to hard drive capacity. Accessible capacity may vary depending on operating environment and formatting. Quantitative usage examples for various applications are for illustrative purposes. Actual quantities will vary based on various factors, including file size, file format, features and application software. Seagate reserves the right to change, without notice, product offerings or specifications.

Contents

1.0 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2 Drive care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.3 Handling precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2.0 Drive specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2.1 Power, access times and acoustics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2.2 Formatted capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.3 Default logical geometry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.4 Recording and interface technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.5 Physical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.6 Time to ready. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.7 Power specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.7.1 Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.7.2 Conducted noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.7.3 Voltage tolerance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.7.4 Power-management modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.8 Environmental specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.8.1 Ambient temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.8.2 Temperature gradient. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.8.3 Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.8.4 Altitude . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.8.5 Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2.8.6 Vibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2.9 Acoustics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

2.10 Electromagnetic immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

2.11 Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

2.12 Agency certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2.12.1 Safety certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2.12.2 Electromagnetic compatibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2.12.3 European Union Restriction of Hazardous Substances (RoHS) Directive . . . . . 17

2.12.4 China Restriction of Hazardous Substances (RoHS) Directive . . . . . . . . . . . . . 18

2.12.5 FCC verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.0 Configuring and mounting the drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.1 Handling and static discharge precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.2 Drive installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

4.0 Interface description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

4.1 Connector interface signals and connector pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

4.1.1 Flex interface connector signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

4.1.2 Supported ATA commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

4.1.3 Identify Device command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

4.1.4 Set Features command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

4.1.5 Card Information Structure (CIS) information for CF . . . . . . . . . . . . . . . . . . . . . 37

5.0 Seagate Technology support services. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

ST1.2 Series Product Manual, Rev. B i

ii ST1.2 Series Product Manual, Rev. B

List of Figures

Figure 1. ST1.2 Series CompactFlash+ disc drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Figure 2. ST1.2 Series Flex (IDE interface) disc drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Figure 3. ST1.2 Series breather hole location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Figure 4. ST1.2 Series improper handling example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Figure 5. Typical 3.3V startup and operation current profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Figure 6. Location where tri-axial accelerometer will be placed on ST1.2 drive . . . . . . . . . . . . . . . . . . 12

Figure 7. Drive axis definition for ST1.2 drives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 8. ST1.2 Series proper handling example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 9. ST1.2 Series improper handling example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 10. CF model mechanical dimensions—top, side and end view . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 11. FX model mechanical dimensions—top, side and end view. . . . . . . . . . . . . . . . . . . . . . . . . . 23

ST1.2 Series Product Manual, Rev. B iii

iv ST1.2 Series Product Manual, Rev. B

1.0 Introduction

This manual describes the functional, mechanical and interface specifications for the following Seagate® ST1.2 Series drives:

• ST68022CF, ST66022CF and ST64022CF CompactFlash+ Type II disc drives.

• ST68022FX, ST66022FX and ST64022FX Flex (IDE interface) disc drives.

These drives provide the following key features.

• 3,600-RPM spindle speed and 2-Mbyte buffer combine for superior performance.

• Quiet operation. Fluid Dynamic Bearing (FDB) motor.

• Giant magnetoresistive (GMR) recording heads and EPRML technology, which provide the drives with increased areal density.

• State-of-the-art cache and on-the-fly error-correction algorithms.

• 1.5K Gs nonoperating shock, and 200 Gs operating shock.

• SeaTools™ diagnostic software performs a drive self-test that eliminates unnecessary drive returns.

Figure 1. ST1.2 Series CompactFlash+ disc drive

Figure 2. ST1.2 Series Flex (IDE interface) disc drive

ST1.2 Series Product Manual, Rev. B 1

1.1 Disclaimer

Seagate Technology LLC makes no warranties whatsoever, including any warranty of merchantability, noninfringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specifi cation or sample. Seagate may not be held liable for any direct, indirect, incidental, special, exemplary, or consequential damages (including, but not limited to, loss of use, data, or profits; procurement of substitute goods or services; or business interruptions) however caused and on any theory of liability, whether in contract, strict liability, or tort (including negligence or otherwise) arising in any way from the use of this kit, even if advised of the possibility of such damage.

1.2 Drive care

Do not use the ST1.2 Series disc drives outside of the ranges of environmental conditions found in Section 2.8, "Environmental specifications." Doing so may void the warranty of the ST1.2 Series disc drive.

1.3 Handling precautions

• Do not cover or seal the breather hole! Covering or sealing the breather hole may result in loss of data.

Figure 3. ST1.2 Series breather hole location

• Do not apply any force to the drive during handling or installation.

• Always handle the drive with care to prevent damage from shock, vibration, or electrostatic discharge (ESD).

• Handle the drive carefully by the edges. Do not touch any exposed printed circuit board or the top cover.

• The drive is fragile—handle it with care. Do not press down on the top cover or attempt to use a pen to write on the drive’s label. Do not apply more than 1.5 kg of force to the top cover.

Figure 4. ST1.2 Series improper handling example

• Always carry the drive in its plastic case.

• Do not drop the drive.

• Do not expose the drive to wet conditions.

• Do not place the drive near a strong magnetic field.

• Do not expose the drive to extreme temperatures.

• Do not use the drive in CF+ Type II slots without an ejection mechanism.

• The drive may become hot during operation. Be careful when removing the drive from the host device immediately after operation.

2 ST1.2 Series Product Manual, Rev. B

2.0 Drive specifications

Unless otherwise noted, all specifications are measured under ambient conditions, at 25°C, and nominal power. For convenience, the phrases the drive and this drive are used throughout this manual to indicate ST68022CF, ST68022FX, ST66022CF, ST66022FX, ST64022FX and ST64022CF model drives.

2.1 Power, access times and acoustics

The specifications listed in this table are for quick reference. For details on specification measurement or definition, see the appropriate section of this manual.

Table 1: Specifications

ST68022CF

Drive specification

Formatted Gbytes 8.0 6.0 4.0

Guaranteed sectors 15,625,008 11,719,008 7,999,488

Bytes per sector 1024

Cache (Mbytes) 2

Recording density, BPI (bits/inch max) 663,000

Track density. TPI (tracks/inch max) 110,000

Areal density (Gbits/inch2 max) 72.9

Spindle speed (RPM) 3,600

Internal data transfer rate OD (Mbits/sec max) 130.0

Sustained data transfer rate OD (Mbytes/sec) 8.8

I/O data-transfer rate (Mbytes/sec max) 33.3MB/s (UDMA 2)

ATA data-transfer modes supported PIO modes 0–4;

Height 5.0 +/-0.1 mm (0.1968 +/-0.004 inches)

Width 42.80 +/-0.101 mm (1.685 +/-0.004 inches)

Length 36.40 +/-0.15 mm (1.433 +/-0.006 inches)

Weight (typical) 18.0 grams (0.0397 lb.)

Average latency (msec) 8.3

Power-on to ready (sec typical / max) (without retry) 1.2 / 2.5

Standby to ready (sec typical / max) (without retry) 1.0 / 2.5

Startup current 5V (peak) (maximum RMS in 10ms window) 350 mA

Seek power (typical 3.3V) 226 mA

Read/write power (typical 3.3V) 330 mA

Performance idle mode (typical 3.3V) 200 mA

Low power idle mode (typical 3.3V) 90 mA

ST68022FX

Multiword DMA modes 0-2; Ultra DMA modes 0–2

ST66022CF ST66022FX

ST64022CF ST64022FX

ST1.2 Series Product Manual, Rev. B 3

Table 1: Specifications

ST68022CF

Drive specification

Standby/Sleep mode (typical 3.3V) 30 mA

Voltage tolerance (including noise) 3.3V ± 5%

Ambient temperature 0° to 70°C (operating) (70°C case temperature)

Temperature gradient (°C per hour max) 20°C (operating)

Relative humidity (noncondensing) 5% to 90% (operating)

Relative humidity gradient 30% per hour max

Wet bulb temperature (°C max) 33°C (operating)

Altitude, operating –60.98 m to 3,048 m (–200 ft to 10,000+ ft)

Altitude, nonoperating (below mean sea level, max) –60.98 m to 12,192 m (–200 ft to 40,000+ ft)

Shock, operating (Gs max at 1 msec) Read 200

Shock, operating (Gs max at 2 msec) Write 175

Shock, nonoperating (Gs max at 1 msec) 1500

Shock, nonoperating (Gs max at 0.5 msec) 1500

Vibration, operating (max displacement may apply below 10 hz) 1.0 Gs (0 to peak, 5–500 Hz) @ 2 oct/min sweep rate

Vibration, nonoperating (max displacement may apply below 22 hz) 5.0 Gs (0 to peak, 5–500 Hz) @ 0.5 oct/min sweep rate

Drive acoustics, sound power (bels)

Idle (typical / max) 2.1/ 2.4

Operational (typical / max) 2.2 / 2.5

Nonrecoverable read errors

Annualized Failure Rate 0.4% AFR at 25°C

Load/Unload (LUL) cycles (40°C) 300,000 software-controlled power on/off cycles

Warranty Per agreement

ST68022FX

5V ± 10%

–40° to 70°C (nonoperating)

30°C (nonoperating)

5% to 95% (nonoperating)

40°C (nonoperating)

1 per 1014 bits read

20,000 hard power on/off cycles

ST66022CF ST66022FX

ST64022CF ST64022FX

4 ST1.2 Series Product Manual, Rev. B

2.2 Formatted capacity

Model Formatted capacity Guaranteed sectors Bytes per sector

ST68022CF ST68022FX

ST66022CF ST66022FX

ST64022CF ST64022FX

8.0 Gbytes 15,625,008 1024

6.0 Gbytes 11,719,008 1024

4.0 Gbytes 7,999,488 1024

2.3 Default logical geometry

Model Cylinders Read/write heads Sectors per track

ST68022CF ST68022FX

ST66022CF ST66022FX

ST64022CF ST64022FX

LBA mode

When addressing these drives in LBA mode, all blocks (sectors) are consecutively numbered from 0 to n–1, where n is the number of guaranteed sectors as defined above.

15,501 16 63

11,626 16 63

7,936 16 63

ST1.2 Series Product Manual, Rev. B 5

2.4 Recording and interface technology

Technology Specification

Interface CompactFlash 2.0 (CF+ 2.0)

Recording method RLL 0,20

Recording density BPI (bits/inch max) 663,000

Track density TPI (tracks/inch max) 115, 000

Areal density (Gbits/inch2 max) 72.9

Spindle speed (RPM) (± 0.2%) 3,600

Internal data-transfer rate OD (Mbits/sec max) 130.0

Sustained data transfer rate OD (Mbytes/sec max) 8.8

I/O data-transfer rate (Mbytes/sec max) 33.3MB/s (UDMA 2)

Interleave 1:1

Cache buffer

ST68022CF, ST68022FX, ST66022CF, ST66022FX, ST64022CF and ST64022FX

2 Mbytes (2,048 Kbytes)

2.5 Physical characteristics

Height (mm)

(inches)

Width (mm)

(inches)

Length (mm)

(inches)

Typical weight (grams)

(pounds)

Interface Connector ST68022CF, ST66022CF and ST64022CF ST68022FX, ST66022FX and ST64022FX

5.0 +/-0.1 mm

0.1968 +/-0.004

42.80 +/-0.101

1.685 +/-0.004

36.40 +/-0.15

1.433 +/-0.006

18.0

0.0397

CompactFlash Type II Connector (50-pin) Seagate Flex Connector (45-way)

2.6 Time to ready

Time to ready Typical Max (without retry)

Power-On to Ready (sec) 1.2 2.5

Standby to Ready (sec) 1.0 2.5

6 ST1.2 Series Product Manual, Rev. B

2.7 Power specifications

The drive receives DC power (+3.3V or +5V) through the CompactFlash interface connector for ST68022CF, ST66022CF and ST64022CF models, and (+3.3V or +5V) through the Flex interface connector for ST68022FX, ST66022FX and ST64022FX models.

2.7.1 Power consumption

Power requirements for the drives are listed in the table on page 8. Typical power measurements are based on an average of drives tested, under nominal conditions, using +3.3V and +5.0V input voltage at 25°C ambient temperature.

• Spinup power

Spinup power is measured from the time of power-on to the time that the drive spindle reaches operating speed.

• Seek mode

During seek mode, the read/write actuator arm moves toward a specific position on the disc surface and does not execute a read or write operation. Servo electronics are active. Seek mode power is measured based on three random seek operations every 100 msecs. This mode is not typical.

• Read/write power and current

Read/write power is measured with the heads on track, at the moment while the head is writing/reading from/to disc. It is performed with 100 percent duty cycle of write/read operation.

• Idle mode power, low

Spindle motor is working normally with actuator unloaded to the parked position.

• Standby mode / Sleep mode

During Standby mode, the drive accepts commands, but the drive is not spinning, and the servo and read/ write electronics are in power-down mode.

ST1.2 Series Product Manual, Rev. B 7

Table 2: DC power

ST1 Power Consumption (W) Max current the average of the peak value in 10ms window

Current 350 350

Spinup 300 300

Load/Unload current 300 300

Write 330 350 330 350

Seek 226 300 226 300

Performance idle 200 205

Low power idle 90 92

Standby/Sleep 30 33

*During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase acoustic and

power to operational levels.

Average

3.3V (mA)

Max

3.3V (mA)

Average

5.0V (mA)

Max

5.0V (mA)

2.7.1.1 Typical current profile

Figure 5. Typical 3.3V startup and operation current profile

8 ST1.2 Series Product Manual, Rev. B

2.7.2 Conducted noise

Input noise ripple is measured at the host system power supply across an equivalent 15-ohm resistive load on the +5 volt line.

Using 5-volt power, the drive is expected to operate with a maximum of 100 mV peak-to-peak square-wave injected noise at up to 20 MHz.

Using 3.3-volt power, the drive is expected to operate with a maximum of 70 mV peak-to-peak square-wave injected noise at up to 20 MHz.

Note. Equivalent resistance is calculated by dividing the nominal voltage by the typical RMS read/write

current.

2.7.3 Voltage tolerance

Voltage tolerance (including noise):

5.0V ± 10%

3.3V ± 5%

ST1.2 Series Product Manual, Rev. B 9

2.7.4 Power-management modes

The drive provides programmable power management to provide greater energy efficiency. The drive features the following power-management modes:

Table 3: Power-management modes

Power modes Heads Spindle Buffer

Active (operating) Tracking Rotating Enabled

Idle, low power Parked Rotating Disabled

Standby/Sleep Parked Stopped Disabled

• Active mode

The drive is in Active mode during the read/write and seek operations.

• Low power idle mode

Drive enters Low Power Idle mode from Active Idle mode when the Advanced Power Management Level is set above 80h and the Idle timer is reached at 2 seconds. Disc is spinning and head is parked and drive accepts all commands and returns to Active mode any time disc access is necessary.

• Performance idle mode

The buffer remains enabled, and the drive accepts all commands and returns to Active mode any time disc access is necessary.

• Standby/Sleep mode

The drive enters Standby mode when the host sends a Standby Immediate command. If the host has set the standby timer, the drive can also enter Standby mode automatically after the drive has been inactive for a specifiable length of time. The standby timer delay is established using a Standby or Idle command. In Standby mode, the drive buffer is disabled, the heads are parked and the spindle is at rest. The drive accepts all commands and returns to Active mode any time disc access is necessary.

• Standby timers

Each time the drive performs an Active function (such as read, write or seek), the standby timer is reinitialized and begins counting down from its specified delay times to zero. If the standby timer reaches zero before any drive activity is required, the drive makes a transition to Standby mode. In both Idle and Standby mode, the drive accepts all commands and returns to Active mode when disc access is necessary.

10 ST1.2 Series Product Manual, Rev. B

2.8 Environmental specifications

2.8.1 Ambient temperature

Ambient temperature is defined as the temperature of the environment immediately surrounding the drive. Actual drive case temperature should not exceed

Above 1,000 feet (305 meters), the maximum temperature is derated linearly by 1°C every 1000 feet.

Operating 0° to 70°C (41° to 158°F) (70°C @ case temperature)

Nonoperating –40° to 70°C (–40° to 153°F)

2.8.2 Temperature gradient

Operating 20°C per hour (68°F per hour max), without condensation

Nonoperating 30°C per hour (86°F per hour max), without condensation

2.8.3 Humidity

2.8.3.1 Relative humidity

Operating 5% to 90% noncondensing (30% per hour max)

70°C (158°F) within the operating ambient conditions.

Nonoperating 5% to 95% noncondensing (30% per hour max)

2.8.3.2 Wet bulb temperature

Operating 33°C (91.4°F max) [1]

Nonoperating 40°C (104°F max) [2]

[1] Operating: Wet bulb temperature is calculated by the operating Temperature and the Relative Humidity levels. [2] Nonoperating: Wet bulb temperature is calculated by the nonoperating Temperature and the Relative Humidity levels.

2.8.4 Altitude

Operating –60.98 m to 3,048 m (–200 ft to 10,000+ ft)

Nonoperating –60.98 to 12,192 m (–200 ft to 40,000+ ft)

ST1.2 Series Product Manual, Rev. B 11

2.8.5 Shock

All shock measurements in this section are carried out at drive level. For all linear shock test, operating or nonoperating, the input shock level shall be measured at the frame of the disk drive at the specific location indicated by the red ellipse in Figure 6 below for the CF and interface drives.

Finger Grip Area

S1.2 CF interface drive

Figure 6. Location where tri-axial accelerometer will be placed on ST1.2 drive

S1.2 FX interface drive

All shock test will cover all the 6 directions, +/- x, y and z axes. The drive axis definition in shown in Figure 7 below.

-z

-y

-x

S1.2 CF interface drive

Figure 7. Drive axis definition for ST1.2 drives

-y

S1.2 FX interface drive

-z

-x

2.8.5.1 Operating shock

The drive will be subjected to 10 shocks for each direction. During the shocks, there must be a minimum delay of 3 seconds between shock pulses. Soft errors and automatic retries are allowed during the test. No data loss or permanent damage occurs during a half sine shock pulse of:

200 Gs, 1 msec (on-track read at OD)

175 Gs, 2 msec (random write)

2.8.5.2 Nonoperating shock

The nonoperating shock level that the drive can experience without incurring any physical damage when subsequently put into operation is 750 Gs based on a non-repetitive half sine shock pulse of 2 msec duration. The same applies for shock levels of 1500 Gs, 1 msec pulse duration and 1500 Gs, 0.5 msec pulse duration on fresh drives for each level.

2.8.6 Vibration

All vibration specifications assume that the drive is mounted securely in a fixture that does not have fixture resonances in the frequency test range. The input vibration is applied through the disc drive guide rails of the device under test. Testing is carried out in the x, y and z axes.

12 ST1.2 Series Product Manual, Rev. B

2.8.6.1 Operating sweep sine vibration

The following lists the maximum operating sweep sine vibration levels that the drive may experience while meeting the performance standards specified. It will consist of a forward and backward sweep from 5 Hz to 500

Hz to 5 Hz. The drive will operate without a hard error while being subjected to the following vibration

levels.

5 Hz to 500 Hz @ 2 oct/min 1.0 Gs (0 to pk). Maximum displacement may apply below 10 Hz.

2.8.6.2 Operating random vibration

The test consists of 30 minutes of random vibration using the power spectral density (PSD) levels specified in the table below. The vibration test level is 0.67

Gs RMS. The drive will operate without a hard error while being

subjected to the following vibration levels.

Table 4: Operating random vibration profile

Frequency (Hz) G2/Hz

17 1.1 x E-03

45 1.1 x E-03

48 8.0 x E-03

62 8.0 x E-03

65 1.0 x E-03

150 1.0 x E-03

200 5.0 x E-04

500 5.0 x E-04

2.8.6.3 Nonoperating sweep sine vibration

The following table lists the maximum nonoperating sweep sine vibration levels that the drive may experience while meeting the performance standards specified. It will consist of a forward and backward sweep from 5 Hz to 500 Hz to 5 Hz. The drive will not incur any physical damage when subsequently put into operation.

5 Hz to 500 Hz @ 0.5 oct/min 5.0 Gs (0 to pk). Maximum displacement may apply below 22 Hz.

ST1.2 Series Product Manual, Rev. B 13

2.8.6.4 Nonoperating random vibration

The test consists of 15 minutes of random vibration using the power spectral density (PSD) levels specified in the table below. The vibration test level is 3.01 Gs RMS. The drive will not incur any physical damage when subsequently put into operation.

Table 5: Nonoperating random vibration profile.

Frequency (Hz) G2/Hz

2.5 1.0 x E-03

5 3.0 x E-02

40 1.8 x E-02

500 1.8 x E-02

2.8.6.5 Corrosive environment

Seagate electronic drive components pass accelerated corrosion testing equivalent to ten years of exposure to light industrial environments containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM B845. However, this accelerated testing cannot duplicate every potential application environment.

Users should use caution exposing any electronic components to uncontrolled chemical pollutants and corrosive chemicals as electronic drive component reliability can be affected by the installation environment. The silver, copper, nickel and gold films used in Seagate products are especially sensitive to the presence of sulfide, chloride, and nitrate contaminants. Sulfur is found to be the most damaging. In addition, electronic components should never be exposed to condensing water on the surface of the printed circuit board assembly (PCBA) or exposed to an ambient relative humidity greater than 95 percent. Materials used in cabinet fabrication, such as vulcanized rubber, that can outgas corrosive compounds should be minimized or eliminated. The useful life of any electronic equipment may be extended by replacing materials near circuitry with sulfide-free alternatives.

14 ST1.2 Series Product Manual, Rev. B

2.9 Acoustics

Drive acoustics are measured as overall A-weighted acoustic sound power levels (no pure tones). Discrete tone penalties are added to the A-weighted sound power (LW) with the following formula only when determin ing compliance:

LWt(spec) == LW + 0.1Pt + 0.3 < 4.0 (Bels)

where

LW = A-weighted sound power level

pt == Value of discrete tone penalty [==dLt-6.0 (dBA)]

dLt = Tone-to-noise ratio taken in accordance with ISO 7779.

All measurements are consistent with ISO document 7779. Sound power measurements are taken under essentially free-field conditions over a reflecting plane. For all tests, the drive is oriented with the cover facing upward.

Note. For seek mode tests, the drive is placed in seek mode only. The number of seeks per second is defined

by the following equation:

(Number of seeks per second = 0.4 / (average latency + average access time)

Table 6: Drive level acoustics

Acoustic mode

Idle Operational

2.1 bels (typ)

2.4 bels (max)

2.2 bels (typ)

2.5 bels (max)

2.10 Electromagnetic immunity

When properly installed in a representative host system, the drive operates without errors or degradation in performance when subjected to the radio frequency (RF) environments defined in the following table:

Table 7: Electromagnetic immunity

Performance

Test Description

Radiated RF immunity 80 to 1,000 MHz, 3 V/m,

80% AM with 1 kHz sine 900 MHz, 3 V/m, 50% pulse modulation @ 200 Hz

Electrical fast transient ± 1 kV on AC mains, ± 0.5 kV on external I/O B EN 61000-4-4: 95

Surge immunity ± 1 kV differential, ± 2 kV common, AC mains B EN 61000-4-5: 95

Conducted RF immunity 150 kHz to 80 MHz, 3 Vrms, 80% AM with 1

kHz sine

Voltage dips, interrupts 0% open, 5 seconds

0% short, 5 seconds 40%, 0.10 seconds 70%, 0.01 seconds

level

A EN 61000-4-3: 96

A EN 61000-4-6: 97

C C C B

Reference standard

ENV 50204: 95

EN 61000-4-11: 94

ST1.2 Series Product Manual, Rev. B 15

2.11 Reliability

Measurement type Specification

Nonrecoverable read errors 1 per 1014 bits read, max.

Annualized Failure Rate 0.4% AFR at 25°C

Load/Unload (LUL) cycles (40°C) 300,000 software-controlled power on/off cycles

20,000 hard power on/off cycles

Warranty Per agreement

16 ST1.2 Series Product Manual, Rev. B

2.12 Agency certification

2.12.1 Safety certification

The drives are recognized in accordance with UL60950-1, CAN/CSA-C22.2 No.60950-1, EN60950 and IEC 60950 as tested by TUV Essen.

2.12.2 Electromagnetic compatibility

Hard drives that display the CE mark comply with the European Union (EU) requirements specified in the Electromagnetic Compatibility Directive (89/336/EEC). Testing is performed to the levels specified by the product standards for Information Technology Equipment (ITE). Emission levels are defined by EN 55022, Class B and the immunity levels are defined by EN 55024.

Seagate uses an independent laboratory to confirm compliance with the EC directives specified in the previous paragraph. Drives are tested in representative end-user systems. Although CE-marked Seagate drives comply with the directives when used in the test systems, we cannot guarantee that all systems will comply with the directives. The drive is designed for operation inside a properly designed enclosure, with properly shielded I/O cable (if necessary) and terminators on all unused I/O ports. Computer manufacturers and system integrators should confirm EMC compliance and provide CE marking for their products.

Korean RRL

If these drives have the Korea Ministry of Information and Communication (MIC) logo, they comply with paragraph 1 of Article 11 of the Electromagnetic Compatibility control Regulation and meet the Electromagnetic Compatibility (EMC) Framework requirements of the Radio Research Laboratory (RRL) Ministry of Information and Communication Republic of Korea.

These drives have been tested and comply with the Electromagnetic Interference/Electromagnetic Susceptibility (EMI/EMS) for Class B products. Drives are tested in a representative, end-user system by a Korean-recognized lab.

• EUT name (model numbers): ST68022CF, ST68022FX, ST66022CF, ST66022FX, ST64022CF and ST64022FX

Certificate numbers: ST68022CF, ST66022CF and ST64022CF E-H011-05-2175(B) ST68022FX, ST66022FX and ST64022FX E-H011-05-2175(B)

• Trade name or applicant: Seagate Technology International

• Manufacturing date: May 2005

• Manufacturer/nationality: Seagate Technology International

Australian C-Tick (N176)

If these models have the C-Tick marking, they comply with the Australia/New Zealand Standard AS/NZS3548 1995 and meet the Electromagnetic Compatibility (EMC) Framework requirements of the Australian Communi cation Authority (ACA).

2.12.3 European Union Restriction of Hazardous Substances (RoHS) Directive

Seagate designs its products to meet environmental protection requirements worldwide, including regulations restricting certain chemical substances. A new law, the European Union Restriction of Hazardous Substances (RoHS) Directive, will restrict the presence of chemical substances, including Lead (Pb), in electronic products, effective July 2006. The Directive's requirements have not been finalized. This drive is manufactured with com ponents and materials that are expected to comply with the RoHS Directive when the Directive takes effect.

ST1.2 Series Product Manual, Rev. B 17

2.12.4 China Restriction of Hazardous Substances (RoHS) Directive

2.12.4

This product has an Environmental Protection Use Period (EPUP) of 20 years. The following table contains information mandated by China's "Marking Requirements for Control of Pollution Caused by Electronic Information Products" Standard.

"O" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is lower than the threshold defined by the China RoHS MCV Standard.

中国限制危险物品的指令

“O"表示该部件（于同类物品程度上）所含的危险和有毒物质低于中国RoHS MCV标准所定义的门槛值。

"X" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is over the threshold defined by the China RoHS MCV Standard.

“

X "表示该部件（于同类物品程度上）所含的危险和有毒物质超出中国RoHS MCV标准所定义的门槛值。

2.12.5 FCC verification

These drives are intended to be contained solely within a personal computer or similar enclosure (not attached as an external device). As such, each drive is considered to be a subassembly even when it is individually mar keted to the customer. As a subassembly, no Federal Communications Commission verification or certification of the device is required.

Seagate Technology LLC has tested this device in enclosures as described above to ensure that the total assembly (enclosure, disc drive, motherboard, power supply, etc.) does comply with the limits for a Class B computing device, pursuant to Subpart likely to result in interference to radio and television reception.

Radio and television interference. This equipment generates and uses radio frequency energy and if not installed and used in strict accordance with the manufacturer’s instructions, may cause interference to radio and television reception.

This equipment is designed to provide reasonable protection against such interference in a residential installation. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause interference to radio or television, which can be determined by turning the equipment on and off, you are encouraged to try one or more of the following corrective measures:

• Reorient the receiving antenna.

• Move the device to one side or the other of the radio or TV.

• Move the device farther away from the radio or TV.

• Plug the computer into a different outlet so that the receiver and computer are on different branch outlets.

J, Part 15 of the FCC rules. Operation with noncertified assemblies is

18 ST1.2 Series Product Manual, Rev. B

If necessary, you should consult your dealer or an experienced radio/television technician for additional suggestions. You may find helpful the following booklet prepared by the Federal Communications Commission: How to Identify and Resolve Radio-Television Interference Problems. This booklet is available from the Super intendent of Documents, U.S. Government Printing Office, Washington, DC 20402. Refer to publication number 004-000-00345-4.

ST1.2 Series Product Manual, Rev. B 19

20 ST1.2 Series Product Manual, Rev. B

3.0 Configuring and mounting the drive

This section contains the specifications and instructions for configuring and mounting the drive.

3.1 Handling and static discharge precautions

After unpacking, and before installation, the drive may be exposed to potential handling and electrostatic discharge (ESD) hazards. Observe the following standard handling and static-discharge precautions:

Caution:

• Keep the drive in the electrostatic discharge (ESD) bag until you are ready for installation to limit the drive’s exposure to ESD.

• Before handling the FX interface model drives (ST68022FX, ST66022FX and ST64022FX), put on a grounded wrist strap, or ground yourself frequently by touching the metal chassis of a computer that is plugged into a grounded outlet. Wear a grounded wrist strap throughout the entire installation procedure.

• Handle the drive only by its edges or frame.

Figure 8. ST1.2 Series proper handling example

• The drive is fragile—handle it with care. Do not press down on the drive top cover or attempt to use a pen to write on the drive’s label.

• Do not apply more than 1.5 kg of force to the top cover.

Figure 9. ST1.2 Series improper handling example

• Always rest the FX interface model drives (ST68022FX, ST66022FX and ST64022FX) on a padded, antistatic surface until you mount it in the system.

ST1.2 Series Product Manual, Rev. B 21

• Do not remove the factory-installed labels from the drive or cover them with additional labels. Removal voids the warranty. Some factory-installed labels contain information needed to service the drive. Other labels are used to seal out dirt and contamination.

• Store drive in the provided protective casing when not in use. (CF interface)

• For the FX interface model drives (ST68022FX, ST66022FX and ST64022FX), turn the power off before installing or removing the drive.

• Do not cover the breather hole with any type of label, sticker, or impede the flow of air at any time.

3.2 Drive installation

See figures 10 and 11 for drive mechanical dimensions.

Follow these installation precautions when inserting the drive:

• Follow instructions for the installation of data storage devices, provided with your device’s user manual.

• Do not obstruct the breather hole on the drive (see Figure 4).

• Handle the drive only by its edges or frame or designated finger grip region during mounting (see Figure 4).

Recommended case

FINGER GRIP

temp. measurement location

Breather Hole Do not cover

Bottom View

Bottom

Pin 1

Top

Pin 50

Figure 10. CF model mechanical dimensions—top, side and end view

CF Dimension Table

Inches

0.197

± .004

1.433

± .006

1.685

± .004

1.015

± .003

1.152

± .010

0.299

± .010

0.394

min

0.063

± .002

0.040

± .003

0.039

± .002

0.039

± .004

0.065

± .004

0.243

± .004

Millimeters

5.00

36.40

42.80

2x 25.78

29.25

7.61

10.00

1.60

2x 1.01

1.00

2x 1.00

1.65

2x 6.16

± .10

± .15

± .10

± .07

± .25

min ± .05 ± .07 ± .05

min ± .10 ± .10

22 ST1.2 Series Product Manual, Rev. B

FINGER GRIP

Recommended case

temp. measurement location

Breather Hole Do not cover

Bottom View

Pin 45

Bottom

Top

Pin 1

Figure 11. FX model mechanical dimensions—top, side and end view

FX Dimension Table

Inches

0.197

± .004

1.433

± .006

1.685

± .004

1.015

± .003

1.152

± .010

0.299

± .010

0.394

min

0.063

± .002

0.040

± .003

0.039

± .002

0.039

± .004

0.065

± .004

0.906

± .003

0.669

± .020

0.414

± .020

0.130

± .004

Millimeters

5.00

36.40

42.80

2x 25.78

29.25

7.61

10.00

1.60

2x 1.01

1.00

2x 1.00

1.65

23.00

17.00

10.51

2X 3.30

± .10

± .15

± .10

± .07

± .25

min ± .05 ± .07 ± .05

min ± .10 ± .07 ± .50 ± .50 ± .10

ST1.2 Series Product Manual, Rev. B 23

24 ST1.2 Series Product Manual, Rev. B

4.0 Interface description

These drives use the industry-standard ATA task file interface that supports 16-bit data transfers. It supports ATA programmed input/output (PIO) modes 0–4; multiword DMA modes 0–2, and Ultra DMA modes 0–2. The drive also supports the use of the IORDY signal to provide reliable high-speed data transfers.

For detailed information about the CompactFlash interface, refer to CF+ and CompactFlash Spec Rev 2.0.

4.1 Connector interface signals and connector pins

The following table summarizes the signals on the CompactFlash interface connector. For a detailed description of these signals, refer to CF+ and CompactFlash Spec Rev 2.0.

Table 8: CompactFlash+ interface connector signals

PC Card Memory Mode PC Card I/O Mode True IDE Mode

Num

1 GND Ground 1 GND Ground 1 GND Ground

2 D03 I/O I1Z, OZ3 2 D03 I/O I1Z, OZ3 2 D03 I/O I1Z, OZ3

3 D04 I/O I1Z, OZ3 3 D04 I/O I1Z, OZ3 3 D04 I/O I1Z, OZ3

4 D05 I/O I1Z, OZ3 4 D05 I/O I1Z, OZ3 4 D05 I/O I1Z, OZ3

5 D06 I/O I1Z, OZ3 5 D06 I/O I1Z, OZ3 5 D06 I/O I1Z, OZ3

6 D07 I/O I1Z, OZ3 6 D07 I/O I1Z, OZ3 6 D07 I/O I1Z, OZ3

7 -CE1 I I3U 7 -CE1 I I3U 7 -CS0 I I3U

8 A10 I I1Z 8 A10 I I1Z 8 A10

9 -OE I I3U 9 -OE I I3U 9 -ATA SEL I I3U

10 A09 I I1Z 10 A09 I I1Z 10 A09

11 A08 I I1Z 11 A08 I I1Z 11 A08

12 A07 I I1Z 12 A07 I I1Z 12 A07

13 VCC Power 13 VCC Power 13 VCC Power

14 A06 I I1Z 14 A06 I I1Z 14 A06

15 A05 I I1Z 15 A05 I I1Z 15 A05

16 A04 I I1Z 16 A04 I I1Z 16 A04

17 A03 I I1Z 17 A03 I I1Z 17 A03

18 A02 I I1Z 18 A02 I I1Z 18 A02 I I1Z

19 A01 I I1Z 19 A01 I I1Z 19 A01 I I1Z

20 A00 I I1Z 20 A00 I I1Z 20 A00 I I1Z

21 D00 I/O I1Z, OZ3 21 D00 I/O I1Z, OZ3 21 D00 I/O I1Z, OZ3

22 D01 I/O I1Z, OZ3 22 D01 I/O I1Z, OZ3 22 D01 I/O I1Z, OZ3

23 D02 I/O I1Z, OZ3 23 D02 I/O I1Z, OZ3 23 D02 I/O I1Z, OZ3

Signal Name

Type

In, Out

Type

Num

Signal Name

Type

In, Out

Type

Num

Signal Name

[2]

[4]

Type

II1Z

In, Out

Type

ST1.2 Series Product Manual, Rev. B 25

Table 8: CompactFlash+ interface connector signals

PC Card Memory Mode PC Card I/O Mode True IDE Mode

[4]

24 WP O OT3 24 -IOIS16 O OT3 24 -IOIS16 O ON3

25 -CD2 O Ground 25 -CD2 O Ground 25 -CD2 O Ground

26 -CD1 O Ground 26 -CD1 O Ground 26 -CD1 O Ground

27 D11

28 D12

29 D13

30 D14

31 D15

32 -CE2

[1]

I/O I1Z, OZ3 27 D11

I/O I1Z, OZ3 28 D12

I/O I1Z, OZ3 29 D13

I/O I1Z, OZ3 30 D14

I/O I1Z, OZ3 31 D15

[1]

I I3U 32 -CE2

[1]

I/O I1Z, OZ3 27 D11

I/O I1Z, OZ3 28 D12

I/O I1Z, OZ3 29 D13

I/O I1Z, OZ3 30 D14

I/O I1Z, OZ3 31 D15

I I3U 32 -CS1

[1]

I/O I1Z, OZ3

II3Z

33 -VS1 O Ground 33 -VS1 O Ground 33 -VS1 O Ground

34 -IORD I I3U 34 -IORD I I3U 34 -IORD I I3Z

35 -IORW I I3U 35 -IORW I I3U 35 -IORW I I3Z

36 -WE I I3U 36 -WE I I3U 36 -WE

[3]

II3U

37 READY O OT1 37 -IREQ O OT1 37 INTRQ O OZ1

38 VCC Power 38 VCC Power 38 VCC Power

39 -CSEL

[5]

I I2Z 39 -CSEL

[5]

I I2Z 39 -CSEL I I2U

40 -VS2 O OPEN 40 -VS2 O OPEN 40 -VS2 O OPEN

41 RESET I I2Z 41 RESET I I2Z 41 -RESET I I2Z

42 -WAIT O OT1 42 -WAIT O OT1 42 IORDY O ON1

43 -INPACK O OT1 43 -INPACK O OT1 43 DMARC O OZ1

[6]

44 -REG I I3U 44 -REG I I3U 44 -DMACK

II3U

45 BVD2 O OT1 45 -SPKR O OT1 45 -DASP I/O I1U, ON1

46 BVD1 O OT1 46 -STSCHG O OT1 46 -PDIAG I/O I1U, ON1

47 D08

48 D09

49 D10

[1]

I/O I1Z, OZ3 47 D08

I/O I1Z, OZ3 48 D09

I/O I1Z, OZ3 49 D10

[1]

I/O I1Z, OZ3 47 D08

I/O I1Z, OZ3 48 D09

I/O I1Z, OZ3 49 D10

[1]

I/O I1Z, OZ3

50 GND Ground 50 GND Ground 50 GND Ground

Note. RFU is Reserved for Future Use

[1] These signals are required only for 16 bit accesses and not required when installed in 8 bit systems.

Devices should allow for 3-state signals not to consume current. [2] The signal should be grounded by the host. [3] The signal should be tied to VCC by the host. [4] The mode is optional for CF+ Cards, but required for CompactFlash Storage Cards. [5] The -CSEL signal is ignored by the card in PC Card modes. However, because it is not pulled up on the

card in these modes, it should not be left floating by the host in PC Card modes. In these modes, the pin

should be connected by the host to PC Card A25 or grounded by the host. [6] If DMA operations are not used, the signal should be held high or tied to VCC by the host. For proper

operation in older hosts: while DMA operations are not active, the card shall ignore this signal, including a

floating condition.

26 ST1.2 Series Product Manual, Rev. B

4.1.1 Flex interface connector signals

The following table summarizes the signal on the Seagate Flex interface connector. For a detailed description of these signals, refer to Draft ATA-7 Standard.

Table 9: Flex interface connector signals

Pin Signal Description

1 Ground Ground

2 DD11 Data bus bit 11

3 DD10 Data bus bit 10

4 DD8 Data bus bit 8

5 RESET- Reset

6 DD14 Data bus bit

7 DD15 Data bus bit

8 IORDY- I/O Ready

DMA ready during Ultra DMA data-in bursts Data strobe during Ultra DMA data-out bursts

9 INTRQ Interrupt request

10 DA1 Device address bit 1

11 GROUND Ground

12 DA2 Device address bit 2

13 DA0 Device address bit 0

14 DIOW- I/O Write

Stop during Ultra DMA data bursts

15 GROUND Ground

16 DIOR- I/O Read

DMA ready during Ultra DMA data-in bursts Data strobe during Ultra DMA data-out bursts

17 GROUND Ground

18 PDIAG- Passed diagnostics

19 GROUND Ground

20 DASP- Device active or slave present

21 GROUND Ground

22 CS1- Chip select 0

23 GROUND Ground

ST1.2 Series Product Manual, Rev. B 27

Table 9: Flex interface connector signals

24 DD9 Data bus bit 9

25 GROUND Ground

26 DD13 Data bus bit 13

27 CSEL Cable select

28 DD12 Data bus bit 12

29 DD7 Data bus bit 7

30 DD6 Data bus bit 6

31 DD5 Data bus bit 5

32 DD4 Data bus bit 4

33 DD3 Data bus bit 3

34 DD2 Data bus bit 2

35 GROUND Ground

36 DD1 Data bus bit 1

37 DD0 Data bus bit 0

38 DMARQ DMA request

39 DMACK- DMA Acknowledge

40 IOCS16- Data transfer size is one word per transfer cycle

41 CS0 Chip select 0

42 Reserved 1 Reserved for device use only

43 Reserved 2 Reserved for device use only

44 VCC +3.3V 3.3V Voltage supply to device

45 VCC +3.3V 3.3V Voltage supply to device

28 ST1.2 Series Product Manual, Rev. B

4.1.2 Supported ATA commands

The following table lists ATA-standard commands that the drive supports. For a detailed description of the CF commands, refer to CF+ and CompactFlash Spec Rev 2.0.

Table 10: Supported commands

Command name Command code (in hex)

Does command cause drive to

transition to active mode?

ATA-standard commands

Check Power Mode 98

Download Microcode 92

Erase Sector C0

Execute Device Diagnostics 90

Flush Cache E7

Format Track (Legacy) 50

Identify Device EC

Idle 97

Idle Immediate 95

H, E5H

H (for FX models only)

H, E3H

H, E1H

NOP 00h X

Read Buffer E4

Read DMA C8

Read Multiple C4

H, C9H

Read Native Max Address F8h X

[1]

Read Sectors 20

Read Verify Sectors 40

Recalibrate 10

Request Sense 03

Seek 7X

Set Drive Parameters 91

Set Features EF

H, 21H

H, 41H

Set Max Address F9h X

Set Multiple Mode C6

Sleep 99

H, E6H

X [2]

Smart B0h X

Standby 96

Standby Immediate 94

Translate Sector 87

Wear Level F5

Write Buffer E8

H, E2H

H, E0H

ST1.2 Series Product Manual, Rev. B 29

Table 10: Supported commands

Command name Command code (in hex)

Write DMA CA

Write Multiple C5

Write Multiple w/o Erase CD

Write Sectors 30

Write Sector w/o Erase 38

Write Verify 3C

H, CBH

H, 31H

Does command cause drive to

transition to active mode? [1]

ATA-standard power-management commands

Check Power Mode 98H or E5

Idle 97H or E3

Idle Immediate 95H or E1

Sleep 99H or E6

Standby 96H or E2

Standby Immediate 94H or E0

[1] ‘X’ indicates: If the drive is in Standby mode, it will cause the drive to spin up to Active mode in order to

execute the command. [2] Except 0Ah, 8Ah and DFh.

30 ST1.2 Series Product Manual, Rev. B

4.1.3 Identify Device command

The Identify Device command (command code ECH) transfers information about the drive to the host following power up. The data is organized as a single 512-byte block of data, whose contents are shown in the table on page 31. All reserved bits or words should be set to zero. Parameters listed with an “x” are drive-specific or vary with the state of the drive. See Section 2.0 on page 3 for default parameter settings.

The following commands contain drive-specific features that may not be included in the Draft ATA-7 Standard.

Word ATA specification CF specification Value Valu e Va lu e

CF Mem/IO CF TruIDE FX (Flex)

Configuration information:

• Bit 15: 0 = ATA; 1 = ATAPI

• Bit 7: removable media

• Bit 6: removable controller

• Bit 0: reserved

General Config 848A

848A

0C5A

1 Obsolete

2 Special Config Reserved 0000

Default number of cylinders

16,383 16,383 16,383

0000

3 Obsolete Default number of heads 16 16 16

4 Retired

5 Retired

6 Obsolete

7 Reserved for CF Spec

8 Reserved for CF Spec

9 Retired Obsolete 0000

Serial number:

10–19

(20 ASCII characters, 0000

= none)

20 Retired Obsolete 0000

21 Retired Obsolete 0000

22 Obsolete Number of ECC bytes 0004

Number of unformatted bytes/track (Obsolete)

Number of unformatted bytes/sector (Obsolete)

Default number of sectors/track

Number of sectors per card (MSW)

Number of sectors per card (LSW)

Serial number: (Right justified)

0000

003F

xxxx xxxx

0000

003F

xxxx xxxx

0000

003F

xxxx xxxx

0000

ASCII ASCII ASCII

0000

0004

0000

0004

Firmware revision

23–26

(8 ASCII character string, padded with blanks to end

Firmware revision x.xx x.xx x.xx

of string)

27–46

Drive model number: (40 ASCII characters, padded with blanks to end of string)

Drive model number (left justified) big endian byte order in word

ST68022CF ST66022CF ST64022CF

ST68022FX ST66022FX ST64022FX

ST1.2 Series Product Manual, Rev. B 31

Word ATA specification CF specification Value Value Value

(Bits 7–0) Maximum sectors per interrupt on Read multiple and Write multiple (16)

Maximum number of sectors on Read/Write Multiple command

8010

48 Reserved Reserved 0000

49 Capabilities Capabilities 0A00

50 Reserved Reserved 0000

51 Obsolete

PIO data transfer cycle timing mode

0200

52 Obsolete Obsolete 0000

53 Words 64–70 and 88 valid Field validity 0003

54 Obsolete

Current number of cylinders

xxxx

55 Obsolete Current number of heads xxxx

56 Obsolete Current number of tracks xxxx

57 Obsolete

58 Obsolete

Current capacity in sectors (LBA) LSW

Current capacity in sectors (LBA) MSW

capacity xxxx

59 Multiple sector setting Multiple sector setting 0100

60–61

Total number of useraddressable LBA sectors available

(see Section 2.2 for related information)

Total number of useraddressable LBA sectors available

(see Section 2.2 for related information)

capacity xxxx

8010

0000

0B00

0000

0200

0000

0003

xxxx

capacity

xxxx

capacity

xxxx

0100

capacity

xxxx

8010

0000

0B00

0000

0200

0000

0003

xxxx

capacity xxxx

0100

capacity xxxx

62 Obsolete Reserved

63 Retired Reserved 0000

Advanced PIO modes supported (modes 3 and 4 supported)

0003

65 Reserved Reserved 0000

66 Reserved Reserved 0000

Minimum PIO cycle time without IORDY flow con trol (120 nsec)

Minimum PIO cycle time with IORDY flow control (120 nsec)

Minimum PIO cycle time

without IORDY flow con trol (120 nsec)

Minimum PIO cycle time with IORDY flow control (120 nsec)

0078

69–79 Reserved 0000

80–81 Reserved 0000

Features/Command sets supported

7068

500C

0407

0003

0078

0000

7068

500C

0407

0003

0078

0000

7068

500D

32 ST1.2 Series Product Manual, Rev. B

Word ATA specification CF specification Value Value Value

Features/Command sets supported

Features/Command sets enabled

Features/Command sets supported

Features/Command sets enabled

4000

7068

100C

4000

Ultra DMA support and

current mode (see note following this

Reserved 0000

table)

Time required for security erase complete

Time required for enhanced security erase complete

Advanced power management value

Time required for security erase complete

Time required for enhanced security erase complete

Advanced power management value

0000

4040

92–105 Reserved 0000

106

Physical / Logical Sector size

4000

7068

100C

4000

0007

0000

4040

0000

6001

4000

7068

100D

4000

0007

0000

4040

0000

6001

107–127 Reserved 0000

128 Security status Security status 0000

129–159 Seagate-reserved Seagate-reserved 0000

160 CFA power mode 1 Power Level Description 814A

161

162

163–175 ATA-reserved

Reserved for assignment by the CFA

Key management schemes supported

Reserved for assignment by the CFA

0000

176–255 Reserved Reserved 0000

0000

814A

0000

814A

0000

ST1.2 Series Product Manual, Rev. B 33

Note. See the bit descriptions below for words 63, 88, 93 and 94 of the Identify Drive data:

Description (if bit is set to 1)

Bit Word 63

0 Multiword DMA mode 0 is supported.

1 Multiword DMA mode 1 is supported.

2 Multiword DMA mode 2 is supported.

8 Multiword DMA mode 0 is currently active.

9 Multiword DMA mode 1 is currently active.

10 Multiword DMA mode 2 is currently active.

Bit Word 88

0 Ultra DMA mode 0 is supported.

1 Ultra DMA mode 1 is supported.

2 Ultra DMA mode 2 is supported.

8 Ultra DMA mode 0 is currently active.

9 Ultra DMA mode 1 is currently active.

10 Ultra DMA mode 2 is currently active.

34 ST1.2 Series Product Manual, Rev. B

4.1.4 Set Features command

This command controls the implementation of various features that the drive supports. When the drive receives this command, it sets BSY, checks the contents of the Features register, clears BSY and generates an inter rupt. If the value in the register does not represent a feature that the drive supports, the command is aborted. Power-on default has the read look-ahead and write caching features enabled. The acceptable values for the Features register are defined as follows:

Table 11: Features register values

Availability in Interface Mode

Feature Description

Enable 8-bit data transfer; Only in True IDE mode.

Enable Write Cache.

Used for Set transfer mode Command.

Sector Count register values:

Set PIO mode to default (PIO mode 2).

Set PIO mode to default and disable IORDY (PIO mode 2).

PIO mode 0

PIO mode 1

0AHPIO mode 2

PIO mode 3

0CHPIO mode 4 (default)

Multiword DMA mode 0

CF Memory or I/O

No Ye s

Yes Yes

No Ye s

TrueI DE or IDE

Enable advanced power management

Enable Power Level 1 commands

Product Specific ECC bytes (XX bytes) apply on Read/Write Long Command

Disable read look-ahead (read cache) feature.

Disable Power On Reset (POR) establishment of defaults at Soft Reset.

Multiword DMA mode 1

Multiword DMA mode 2

Ultra DMA mode 0

Ultra DMA mode 1

Ultra DMA mode 2

No Ye s

Yes Yes

ST1.2 Series Product Manual, Rev. B 35

Table 11: Features register values

NOP- Accepted for backward compatibility

Disable 8 bit transfer; Only in True IDE mode

Disable write cache. (default)

Disable Advanced Power Management

Disable Power Level 1 Commands

NOP- Accepted for backward compatibility

Accepted for backward compatibility

It's NOP for backward compatibility

Enable read look-ahead (read cache) feature (default).

4 Bytes of ECC apply on Read/Write Long Command

Enable Power On Reset (POR) establishment of defaults at soft reset

Seagate Unique; Disable Reassignment

Seagate Unique; Enable Reassignment

Yes Yes

No Ye s

Yes Yes

Note. At power-on, or after a hardware or software reset, the default values of the features are as indi-

cated above.

36 ST1.2 Series Product Manual, Rev. B

4.1.5 Card Information Structure (CIS) information for CF

CIS information for the CF card is as follows:

Address

Common memory device information in 5V operation

000H 01H CISTPL_DEVICE

002H 04H TPL_LINK = 04 bytes

004H DFH

006H

008H 01H CISTPL_DEVICE: Device size = 1 (2K bytes)

00AH FFH CISTPL_DEVICE: End Marker

Other operating conditions device information for common memory

00CH 1CH CISTPL_DEVICE_OC

Data Description of data

CISTPL_DEVICE: Device ID Device type (bit 4...7 = D (DTYPE_FUNCSPEC) WPS (write protect switch) (bit 3) = 1 (non WP) Device Speed (bit 0...2) = 7 (DSPEED_EXT)

CISTPL_DEVICE: EXT (bit 7) = 0

12H

Mantissa (bit 3...6) = 2 (1.2) - -> 120ns Exponent (bit 0...2) = 2 (100)

00EH 05H TPL_LINK = 05 bytes

CISTPL_DEVICE_OC: Other conditions Information EXT (bit 7) = 0

010H 03H

012H DFH

014H 12H

016H 01H CISTPL_DEVICE_OC: Device size = 1 (2K bytes)

018H FFH CISTPL_DEVICE_OC: End Marker

JEDEC programming information for common memory

01AH 18H CISTPL_JEDEC_C

01CH 02H TPL_LINK = 02 bytes

01EH DFH CISPTL_JEDEC_C: PCMCIA JEDEC Code

Reserved (bit 3...6) = 0 Vcc used (bit 1,2) = 1 (3.3V) MWAIT (bit 0) = 1

CISTPL_DEVICE_OC: Device ID Information Device Type (bit 4...7) = D (DTYPE_FUNCSPEC) WPS (write protect switch) (bit 3) = 1 (non WP) Device Speed (bit 0...2) = 7 (DSPEED_EXT)

CISTPL_DEVICE_OC: EXT (bit 7) = 0 Mantissa (bit 3...6) = 2 (1.2) - -> 120ns Exponent (bit 0...2) = 2 (100)

020H 01H

ST1.2 Series Product Manual, Rev. B 37

Manufacturer identification string

022H 20H CISTPL_MANFID

024H 04H TPL_LINK = 04 bytes

026H 11H TPL_MANF: Manufacturer’s ID code (Low byte) = 11 for SEAGATE

028H 01H TPL_MANF: Manufacturer’s ID code (High byte) = 01 for SEAGATE

02AH 00H TPLMID_CARD: Product code (Low byte) (Manufacturer Info)

02CH 00H TPLMID_CARD: Product code (High byte) (Manufacturer Info)

02EH 15H CISTPL_VERS_1

030H 0EH TPL_LINK = 0Eh bytes

032H 04H TPLLV1_MAJOR: Major Version Number (JEIDA 4.2/PCMCIA 2.1)

034H 01H TPLLV1_MINOR: Minor Version Number = 1

036H 53H TPLLV1_INFO: ‘ S ’ (Vender Specific Strings)

038H 45H TPLLV1_INFO: ‘ E ’ (Vender Specific Strings)

03AH 41H TPLLV1_INFO: ‘ A ’ (Vender Specific Strings)

03CH 47H TPLLV1_INFO: ‘ G ’ (Vender Specific Strings)

03EH 41H TPLLV1_INFO: ‘ A ’ (Vender Specific Strings)

040H 54H TPLLV1_INFO: ‘ T ’ (Vender Specific Strings)

042H 45H TPLLV1_INFO: ‘ E ’ (Vender Specific Strings)

044H 00H TPLLV1_INFO: Null terminator (End of Name)

046H 53H TPLLV1_INFO: ‘ S ’ (Vender Specific Strings)

048H 54H TPLLV1_INFO: ‘ T ’ (Vender Specific Strings)

04AH 51H TPLLV1_INFO: ‘ 1 ’ (Vender Specific Strings)

04CH 00H TPLLV1_INFO: Null terminator (End of Name)

04EH FFH CISTPL_VERS_1: End marker

050H 21H CISTPL_FUNCID

052H 02H TPL_LINK = 02 bytes

054H 04H TPLFID_FUNCTION: (IC Card Function Code) = 04 (Fixed Disk)

TPLFD_SYSINT: (System Initialization bit mask)

056H 01H

058H 22H CISTPL_FUNCE :(Function Extension Tuple)

POST (bit 0) =1 ROM (bit 1) =0

05AH 02H TPL_LINK = 02 bytes

05CH 01H TUPLE_TYPE: (Extension Type) = 01 (Disk Device Interface)

05EH 01H TUPLE_DATA: (Interface Type) = 01 (PC Card ATA Interface)

38 ST1.2 Series Product Manual, Rev. B

060H 22H CISTPL_FUNCE: (Function Extension Tuple)

062H 03H TPL_LINK =3 bytes

064H 02H TUPLE_TYPE: (Extension Type) = 02 (Basic PC Card ATA Interface)

TPLFE_DATA V : Vpp[2::1] (bit0,1) = 00 (Vpp not required)

066H 08H

068H 0FH

06AH 1AH CISTPL_CONFIG (Configuration Tuple)

06CH 05H TPL_LINK = 5 bytes

06EH 01H

S : Silicon (bit2) = 0 (Rotating Device) U : Inique (bit3) = 0 (Single Drive) D : Dual Drive (bit4) = 0 (Single Drive)

TPLFE_DATA P0 : Sleep (bit0) = 1 (Support Sleep mode) P1 : Standby (bit1) = 1 (Support Standby mode) P2 : Idle (bit2) = 1 (Support Idle mode) P3 : Auto (bit 3) = 1 (Support Automatic Power Control) N : 3F7/377 (bit4) = 0 (Include 3F7h/377h for I/O Address) E : Index Emulate (bit5) = 0 (Index Emulation is not supported) I : IOIS16 (bit6) =0

TPCC_SZ :(Size of Field Byte) TPCC_RASZ (Size of TPCC_RADR) (bit0,1) = 1 (2 bytes) TPCC_RMSZ (Size of TPCC_RMSK) (bit 2..5) = 0 (1 byte)

070H 07H TPCC_LAST: (Last Entry Index) =07

072H 00H TPCC_RADR: (Low byte) (Base address of Configuration Register = 00h)

074H 02H TPCC_RADR: (High byte) (Base address of Configuration Register = 02h)

076H 0FH TPCC_RMSK: (Register Presence Mask) = 00001111b (200, 202, 204, 206)

Configuration for PC card memory mode in 5V operation (default)

078H 1BH CISTPL_CFTABLE_ENTRY: (16 Bit PCCard Configuration Table Entry Tuple)

07AH 0CH TPCE_LINK = 0C bytes

TPCE_INDX: (Configuration Table Entry Tuple)

07CH C0H

07EH C0H

Config Entry Number (bit0..5) = 00 (Memory Mode) Default (bit6) = 1 Interface (bit7) = 1 (Interface Field Exist)

TPCE_IF: (Interface Description Field) Interface Type (bit0..3) = 00 (Memory) BVDS active (bit4) = 0 WP active (bit5) = 0 READY active (bit6) = 1 MWAIT required (bit7) = 1

ST1.2 Series Product Manual, Rev. B 39

080H A1H

082H 27H

084H 55H

086H 4DH

088H 5DH

TPCE_FS: (Feature Selection Byte) Power (bit0,1) = 01 (Vcc Only) Timing (bit2) = 0 I/O (bit3) = 0 Interrupt (bit4) = 0 Memory (bit5,6) = 01 Misc (bit7) = 1 TPCE_PD (Power Description Structure)

TPCE_PS: Parameter Selection Byte NomV (bit0) =1 MinV (bit1) = 1 MaxV (bit2) =1 PeakI (bit5) =1

TPCE_PD: Power Parameter Definition (NomV) Exponent (bit 0..2) = 5 (1V) - ->5.0V Mantissa (bit3..6) = A (5.0)

TPCE_PD: Power Parameter Definition (MinV) Exponent (bit 0..2) = 5 (1V) - ->4.5V Mantissa (bit3..6) = 9 (4.5)

TPCE_PD: Power Parameter Definition (MaxV) Exponent (bit 0..2) = 5 (1V) - ->5.5V Mantissa (bit3..6) = C (5.5)

TPCE_PD: Power Parameter Definition (PeakI)

08AH B6H

08CH 1EH

08EH 08H

090H 00H

092H 20H

Configuration for PC card memory I/O mode in 3.3V operation (alternative)

094H 1BH CISTPL_CFTABLE_ENTRY: (16 bit PCCard Configuration Table Entry Tuple)

Exponent (bit 0..2) = 6 (100mA) - -+- ->330mA Mantissa (bit3..6) = 6 (3) + Extension (bit7) = 1 (Extension Byte Exists) +

TPCE_PD: Extension = 1Eh = +30 - -+ TPCE_MS: (Memory Space Description Structure)

TPCE_MS: Memory Space Descriptor Space # of Windows (-1) (bit0..2) = 0 (# of window =1) Length Size (bit3..4) =1 (Length Field Size =1 byte) Card Address Size (bit5..6) = 0 (no card addr field) Host Addr (bit7) = 0 (arbitrary host addr)

TPCE_MS: Window Descriptor Length of the window = 0

TPCE_MI: (Miscellaneous Features Field) Max Twin Card (bit0..2) = 0 Audio (bit3) =0 Read Only (bit4) =0 Power Down (bit5) =1 (Support Power Down Mode)

096H 07H TPCE_LINK = 07h bytes

40 ST1.2 Series Product Manual, Rev. B

TPCE_INDX: (Configuration Table Index Byte)

098H 00H

09AH 01H

09CH 21H

09EH B5H

0A0H 1EH TPCE_PD: Extension = 1Eh =+0.30 - - +

Config Entry Number (bit0..5) = 00 (Memory Mode) Default (bit6) = 0 Interface (bit7) = 0 (Interface Field Exist)

TPCE_FS Power (bit0,1) = 01 (Vcc Only) Timing (bit2) = 0 I/O (bit3) = 0 Interrupt (bit4) = 0 Memory (bit5,6) = 00 Misc (bit7) = 0

TPCE_PD: Parameter Selection Byte NomV (bit0) =1 MinV (bit1) = 0 MaxV (bit2) =0 PeakI (bit5) =1

TPCE_PD: Power Parameter Definition (NomV) Exponent (bit0..2) = 5 (1V) - -+ - ->3.3V Mantissa (bit3..6) =6 (3.0) + Extension (bit7) =1 (Extension Exists) +

TPCE_PD: Power Parameter Definition (PeakI)

0A2H B6H

0A4H 1EH TPCE_PD: Extension = 1Eh =+30 - - +

For PC card ATA I/O in contiguous memory mode in 5V operation (default)

0A6H 1BH CISTPL_CFTABLE_ENTRY: (16 Bit PCCard Configuration Table Entry Tuple)

0A8H 0EH TPCE_LINK = 0E bytes

0AAH C1H

0ACH 41H

Exponent (bit0..2) = 6 (100mA) - ->330mA Mantissa (bit3..6) = 6 (3) Extension (bit7) =1 (Extension Exists) +

TPCE_INDX: (Configuration Table Entry Tuple) Config Entry Number (bit0..5) = 01 (I/O and Memory Mode) Default (bit6) = 1 Interface (bit7) = 1 (Interface Field Exist)

TPCE_IF: (Interface Description Field) Interface Type (bit0..3) = 01 (I/O and Memory) BVDS active (bit4) = 0 WP active (bit5) = 0 READY active (bit6) = 1 MWAIT required (bit7) = 0

ST1.2 Series Product Manual, Rev. B 41

0AEH 99H

0B0H 27H

0B2H 55H

0B4H 4DH

0B6H 5DH

TPCE_FS: (Feature Selection Byte) Power (bit0,1) = 01 (Vcc Only) Timing (bit2) = 0 I/O (bit3) = 0 Interrupt (bit4) = 0 Memory (bit5,6) = 01 Misc (bit7) = 1 TPCE_PD (Power Description Structure)

TPCE_PD: Parameter Selection Byte NomV (bit0) =1 MinV (bit1) = 1 MaxV (bit2) =1 PeakI (bit5) =1

TPCE_PD: Power Parameter Definition (NomV) Exponent (bit 0..2) = 5 (1V) - ->5.0V Mantissa (bit3..6) = A (5.0)

TPCE_PD: Power Parameter Definition (MinV) Exponent (bit 0..2) = 5 (1V) - ->4.5V Mantissa (bit3..6) = 9 (4.5)

TPCE_PD: Power Parameter Definition (MaxV) Exponent (bit 0..2) = 5 (1V) - ->5.5V Mantissa (bit3..6) = C (5.5)

TPCE_PD: Power Parameter Definition (PeakI)

0B8H B6H

0BAH 1EH

0BCH 64H

0BEH F0H

0C0H FFH TPCE_IR+1: IRQ0..IRQ7 = All Supported

0C2H FFH TPCE_IR+2: IRQ8..IRQ15 = All Supported

0C4H 20H

Exponent (bit 0..2) = 6 (100mA) - -+- ->330mA Mantissa (bit3..6) = 6 (3) + Extension (bit7) = 1 (Extension Byte Exists) +

TPCE_PD: Extension = 1Eh = +30 - -+ TPCE_MS: (Memory Space Description Structure)

TPCE_IO: (I/O Space Address required for this configuration) I/O Address Lines (bit0..4) =4 (16 byte boundary) Bus 16/8 (bit5,6) = 3 (Support 16/8 bit access) Range (bit7) = 0 TPCE_IR (Interrupt Request Description Structure)

TPCE_IR: IRQ Line 0..15 (bit0..3) =0 MASK (bit4) = 1 Level (bit5) = 1 Pulse (bit6) = 1 Share (bit7) = 1

TPCE_MI :(Miscellaneous Features Field) Max Twin Card (bit0..2) = 0 Audio (bit3) = 0 Read Only (bit4) = 0 Power Down (bit5) = 1 (Support Power Down Mode)

42 ST1.2 Series Product Manual, Rev. B

For PC card ATA I/O in contiguous memory mode in 3.3V operation (default)

0C6H 1BH CISTPL_CFTABLE_ENTRY: (16 Bit PCCard Configuration Table Entry Tuple)

0C8H 07H TPCE_LINK = 07h bytes

TPCE_INDX :(Configuration Table Index Byte)

0CAH 01H

0CCH 01H

0CEH 21H

0D0H B5H

Config Entry Number (bit0..5) = 01 (I/O and Memory Mode) Default (bit6) = 0 Interface (bit7) = 0 (Interface Field Exist)

TPCE_FS Power (bit0,1) = 01 (Vcc Only) Timing (bit2) = 0 I/O (bit3) = 0 Interrupt (bit4) = 0 Memory (bit5,6) = 00 Misc (bit7) = 0

TPCE_PD: Parameter Selection Byte NomV (bit0) =1 MinV (bit1) = 0 MaxV (bit2) =0 PeakI (bit5) =1

TPCE_PD: Power Parameter Definition (NomV) Exponent (bit0..2) = 5 (1V) - -+ - ->3.3V Mantissa (bit3..6) =6 (3.0) + Extension (bit7) =1 (Extension Exists) +

0D2H 1EH TPCE_PD: Extension = 1Eh =+0.30 - - +

TPCE_PD: Power Parameter Definition (PeakI)

0D4H B6H

0D6H

For PC card ATA I/O primary mode (1F0-1F7, 3F6, 3F7) in 5V operation (default)

0D8H 1BH CISTPL_CFTABLE_ENTRY: (16 Bit PC Card Configuration Table Entry Tuple)

0DAH 13H TPCE_LINK = 13h bytes

0DCH C2H

0DEH 41H

1EH TPCE_PD: Extension = 1Eh =+30 - - +

Exponent (bit0..2) = 6 (100mA) - ->330mA Mantissa (bit3..6) = 6 (3) Extension (bit7) =1 (Extension Exists) +

TPCE_INDX :(Configuration Table Entry Tuple) Config Entry Number (bit0..5) = 02 (Primary I/O Mode) Default (bit6) = 1 Interface (bit7) = 1 (Interface Field Exist)

TPCE_IF: (Interface Description Field) Interface Type (bit0..3) = 01 (I/O and Memory) BVDS active (bit4) = 0 WP active (bit5) = 0 READY active (bit6) = 1 MWAIT required (bit7) = 0

ST1.2 Series Product Manual, Rev. B 43

0E0H 99H

0E2H 27H

0E4H 55H

0E6H 4DH

0E8H 5DH

TPCE_FS: (Feature Selection Byte) Power (bit0,1) = 01 (Vcc Only) Timing (bit2) = 0 I/O (bit3) = 0 Interrupt (bit4) = 0 Memory (bit5,6) = 01 Misc (bit7) = 1 TPCE_PD (Power Description Structure)

TPCE_PD: Parameter Selection Byte NomV (bit0) =1 MinV (bit1) = 1 MaxV (bit2) =1 PeakI (bit5) =1

TPCE_PD: Power Parameter Definition (NomV) Exponent (bit 0..2) = 5 (1V) - ->5.0V Mantissa (bit3..6) = A (5.0)

TPCE_PD: Power Parameter Definition (MinV) Exponent (bit 0..2) = 5 (1V) - ->4.5V Mantissa (bit3..6) = 9 (4.5)

TPCE_PD: Power Parameter Definition (MaxV) Exponent (bit 0..2) = 5 (1V) - ->5.5V Mantissa (bit3..6) = C (5.5)

TPCE_PD: Power Parameter Definition (PeakI)

0EAH B6H

0ECH 1EH TPCE_PD: Extension = 1Eh = +30 - -+

0EEH EAH

0F0H 61H

0F2H F0H TPCE_IO: I/O Address Range Description Field #1 Address = 1F0

0F4H 01H

0F6H 07H TPCE_IO: I/O Address Block Length = 8

0F8H F6H TPCE_IO: I/O Address Range Description Field #2 Address = 3F6

0FAH 03H

0FCH 01H TPCE_IO: I/O Address Block Length = 2

Exponent (bit 0..2) = 6 (100mA) - -+- ->330mA Mantissa (bit3..6) = 6 (3) + Extension (bit7) = 1 (Extension Byte Exists) +

TPCE_IO: (I/O Space Address required for this configuration) I/O Address Lines (bit0..4) =A (1K byte boundary) Bus 16/8 (bit5,6) = 3 (Support 16/8 bit access) Range (bit7) = 1 (See I/O Range Description Byte)

TPCE_IO: I/O Range Description Byte # of address range - 1 (bit0..3) = 1 (#of field = 2) Size Of Address (bit4,5) = 2 (2 byte address) Size Of Length (bit6,7) = 1 (1 byte length)

44 ST1.2 Series Product Manual, Rev. B

TPCE_IR: (Interrupt Request Description Structure) IRQ Line 0..15 (bit0..3) = E

0FEH EEH

100H 20H

For PC card ATA I/O primary mode (1F0-1F7, 3F6, 3F7) in 3.3V operation (alternative)

102H 1BH CISTPL_CFTABLE_ENTRY: (16 Bit PC Card Configuration Table Entry Tuple)

104H 07H TPCE_LINK = 07 bytes

106H 02H

108H 01H

MASK (bit4) = 0 Level (bit5) = 1 Pulse (bit6) = 1 Share (bit7) = 1

TPCE_MI: (Miscellaneous Features Field) Max Twin Card (bit0..2) = 0 Audio (bit3) = 0 Read Only (bit4) = 0 Power Down (bit5) = 1 (Support Power Down Mode)

TPCE_INDX: (Configuration Table Index Byte) Config Entry Number (bit0..5) = 02 (Primary I/O Mode) Default (bit6) = 0 Interface (bit7) = 0 (Interface Field Exist)

TPCE_FS Power (bit0,1) = 01 (Vcc Only) Timing (bit2) = 0 I/O (bit3) = 0 Interrupt (bit4) = 0 Memory (bit5,6) = 00 Misc (bit7) = 0

TPCE_PD: Parameter Selection Byte NomV (bit0) =1

10AH 21H

10CH B5H

10EH 1EH TPCE_PD: Extension = 1Eh =+0.30 - - +

110 H B6H

112 H 1EH TPCE_PD: Extension = 1Eh =+30 - - +

For PC card ATA I/O secondary mode (170-177, 377, 377) in 5V operation (default)

114 H 1BH CISTPL_CFTABLE_ENTRY (16 Bit PC Card Configuration Table Entry Tuple)

116 H 13H TPCE_LINK = 13h bytes

MinV (bit1) = 0 MaxV (bit2) =0 PeakI (bit5) =1

TPCE_PD: Power Parameter Definition (NomV) Exponent (bit0..2) = 5 (1V) - -+ - ->3.3V Mantissa (bit3..6) =6 (3.0) + Extension (bit7) =1 (Extension Exists) +

TPCE_PD: Power Parameter Definition (PeakI) Exponent (bit0..2) = 6 (100mA) - ->330mA Mantissa (bit3..6) = 6 (3) Extension (bit7) =1 (Extension Exists) +

ST1.2 Series Product Manual, Rev. B 45

118 H C3H

11A H 41H

11C H 99H

11E H 27H

TPCE_INDX :(Configuration Table Entry Tuple) Config Entry Number (bit0..5) = 03 (Secondary I/O Mode) Default (bit6) = 1 Interface (bit7) = 1 (Interface Field Exist)

TPCE_IF: (Interface Description Field) Interface Type (bit0..3) = 01 (I/O and Memory) BVDS active (bit4) = 0 WP active (bit5) = 0 READY active (bit6) = 1 MWAIT required (bit7) = 0

TPCE_FS: (Feature Selection Byte) Power (bit0,1) = 01 (Vcc Only) Timing (bit2) = 0 I/O (bit3) = 0 Interrupt (bit4) = 0 Memory (bit5,6) = 01 Misc (bit7) = 1 TPCE_PD (Power Description Structure)

TPCE_PD: Parameter Selection Byte NomV (bit0) =1 MinV (bit1) = 1 MaxV (bit2) =1 PeakI (bit5) =1

TPCE_PD: Power Parameter Definition (NomV)

120H 55H

122H 4DH

124H 5DH

126H B6H

128H 1EH TPCE_PD: Extension = 1Eh = +0.30 - -+

12AH EAH

12CH 61H

Exponent (bit 0..2) = 5 (1V) - ->5.0V Mantissa (bit3..6) = A (5.0)

TPCE_PD: Power Parameter Definition (MinV) Exponent (bit 0..2) = 5 (1V) - ->4.5V Mantissa (bit3..6) = 9 (4.5)

TPCE_PD: Power Parameter Definition (MaxV) Exponent (bit 0..2) = 5 (1V) - ->5.5V Mantissa (bit3..6) = C (5.5)

TPCE_PD: Power Parameter Definition (PeakI) Exponent (bit 0..2) = 6 (100mA) - -+- ->330mA Mantissa (bit3..6) = 6 (3) + Extension (bit7) = 1 (Extension Byte Exists) +

TPCE_IO: I/O Range Description Byte # of address range - 1 (bit0..3) = 1 (#of field = 2) Size Of Address (bit4,5) = 2 (2 byte address) Size Of Length (bit6,7) = 1 (1 byte length)

12EH 70H TPCE_IO: I/O Address Range Description Field #1 Address = 170

46 ST1.2 Series Product Manual, Rev. B

130H 01H

132H 07H TPCE_IO: I/O Address Block Length = 8

134H 76H TPCE_IO: I/O Address Range Description Field #2 Address = 376

136H 03H

138H 01H TPCE_IO: I/O Address Block Length = 2

TPCE_IR: (Interrupt Request Description Structure) IRQ Line 0..15 (bit0..3) = E

13AH EEH

13CH 20H

For PC Card ATA I/O Secondary Mode (170-177, 377, 377) in 3.3V Operation (Default)

13EH 1BH CISTPL_CFTABLE_ENTRY (16 Bit PC Card Configuration Table Entry Tuple)

140H 06H TPCE_LINK = 07h bytes

MASK (bit4) = 0 Level (bit5) = 1 Pulse (bit6) = 1 Share (bit7) = 1

TPCE_MI: (Miscellaneous Features Field) Max Twin Card (bit0..2) = 0 Audio (bit3) = 0 Read Only (bit4) = 0 Power Down (bit5) = 1 (Support Power Down Mode)

TPCE_INDX: (Configuration Table Index Byte)

142H 03H

144H 01H

146H 21H

148H B5H

14AH 1EH TPCE_PD: Extension = 1Eh =+0.30 - - +

Config Entry Number (bit0..5) = 03 (Secondary I/O Mode) Default (bit6) = 0 Interface (bit7) = 0 (Interface Field Exist)

TPCE_FS Power (bit0,1) = 01 (Vcc Only) Timing (bit2) = 0 I/O (bit3) = 0 Interrupt (bit4) = 0 Memory (bit5,6) = 00 Misc (bit7) = 0

TPCE_PD: Parameter Selection Byte NomV (bit0) =1 MinV (bit1) = 0 MaxV (bit2) =0 PeakI (bit5) =1

TPCE_PD: Power Parameter Definition (NomV) Exponent (bit0..2) = 5 (1V) - -+ - ->3.3V Mantissa (bit3..6) =6 (3.0) + Extension (bit7) =1 (Extension Exists) +

TPCE_PD: Power Parameter Definition (PeakI)

14CH B6H

Exponent (bit 0..2) = 6 (100mA) - -+- ->330mA Mantissa (bit3..6) = 6 (3) + Extension (bit7) = 1 (Extension Byte Exists) +

ST1.2 Series Product Manual, Rev. B 47

14EH 1EH TPCE_PD: Extension = 1Eh = +30 - -+

150H 14H CISTPL_NO_LINK

152H 00H TPCE_LINK

154H FFH CISTPL_END

48 ST1.2 Series Product Manual, Rev. B

5.0 Seagate Technology support services

Online services

Internet

www.seagate.com for information about Seagate products and services. Worldwide support is available 24

hours daily by e-mail for your questions.

Presales Support: www.seagate.com/support/email/email_presales.html or Presales@Seagate.com Technical Support: www.seagate.com/support/email/email_disc_support.html or DiscSupport@Seagate.com

mySeagate

my.seagate.com is the industry’s first Web portal designed specifically for OEMs and distributors. It provides self-service access to critical applications, personalized content and the tools that allow our partners to man age their Seagate account functions. Submit pricing requests, orders and returns through a single, passwordprotected Web interface—anytime, anywhere in the world.

reseller.seagate.com

reseller.seagate.com supports Seagate resellers with product information, program benefits and sales tools. You may register for customized communications that are not available on the web. These communications contain product launch, EOL, pricing, promotions and other channel-related information. To learn more about the benefits or to register, go to

Automated phone services

reseller.seagate.com, any time, from anywhere in the world.

SeaFONE® (1-800-SEAGATE) is the Seagate toll-free number (1-800-732-4283) to access our automated

directory assistance for Seagate Service Center support options. International callers can reach this service by dialing +1-405-324-4770.

Seagate Service Centers

Presales Support

Our Presales Support staff can help you determine which Seagate products are best suited for your specific application or computer system, as well as drive availability and compatibility.

Technical Support

If you need help installing your drive, consult your system's documentation or contact the dealer's support services department for assistance specific to your system. Seagate technical support is also available to assist you online at tion and your drive’s “ST” model number available.

SeaTDD™ (+1-405-324-3655) is a telecommunications device for the deaf (TDD). You can send questions or

comments 24 hours daily and exchange messages with a technical support specialist during normal business hours for the call center in your region.

support.seagate.com or through one of our call centers. Have your system configuration informa-

ST1.2 Series Product Manual, Rev. B 49

Customer Service Operations

Warranty Service

Seagate offers worldwide customer support for Seagate drives. Seagate distributors, OEMs and other direct customers should contact their Seagate Customer Service Operations (CSO) representative for warrantyrelated issues. Resellers or end users of drive products should contact their place of purchase or one of the Seagate CSO warranty centers for assistance. Have your drive’s “ST” model number and serial number avail able.

Data Recovery Services

Seagate offers data recovery services for all formats and all brands of storage media. Our Data Recovery Services labs are currently located in North America. To get a free quick quote or speak with a case management representative, call 1-800-475-0143. Additional information, including an online request form and data loss pre vention resources, is available at www.datarecovery.seagate.com.

Authorized Service Centers

In some locations outside the US, you can contact an Authorized Service Center for service.

USA/Canada/Latin America support services

Seagate Service Centers

Presales Support

Call center Toll-free Direct dial FAX

Americas 1-877-271-3285

+1-405-324-4730

+1-405-324-4704

Technical Support

Call center Toll-free Direct dial FAX

Americas 1-800-SEAGATE

+1-405-324-4700

+1-405-324-3339

Customer Service Operations

Warranty Service

Call center Toll-free Direct dial FAX / E-mail

USA, Canada, Mexico and 1-800-468-3472 Latin America

Brazil Jabil Industrial Do Brasil — +55-11-4191-4761 +55-11-4191-5084 LTD A

Data Recovery Services

Call center Toll-free Direct dial FAX

USA, Canada, 1-800-475-01435 +1-905-474-2162 1-800-475-0158 and Mexico +1-905-474-2459

Hours of operation are 8:00 A.M. to 11:45 A.M. and 1:00 P.M. to 6:00 P.M., Monday through Friday (Central time).

Hours of operation are 8:00 A.M. to 8:00 P.M., Monday through Friday (Central time).

Hours of operation are 8:00 A.M. to 5:00 P.M., Monday through Friday (Central time).

Authorized Service Center

Hours of operation are 8:00 A.M. to 8:00 P.M., Monday through Friday, and 9:00 A.M. to 5:00 P.M., Saturday (Eastern time).

— +1-956-664-4725

SeagateRMA.br@jabil.com

50 ST1.2 Series Product Manual, Rev. B

European support services

For presales and technical support in Europe, dial the Seagate Service Center toll-free number for your specific location. If your location is not listed here, dial our presales and technical support call center at +1-405324-4714 from 8:00 The presales and technical support call center is located in Oklahoma City, USA.

For European warranty service, dial the toll-free number for your specific location. If your location is not listed here, dial our European CSO warranty center at +31-20-316-7222 from 8:30 time) Monday through Friday. The CSO warranty center is located in Amsterdam, The Netherlands.

A.M. to 11:45 A.M. and 1:00 P.M. to 5:00 P.M. (Central Europe time) Monday through Friday.

A.M. to 5:00 P.M. (Central Europe

Seagate Service Centers

Toll-free support numbers

Call center Presales and Technical Support Warranty Service

Austria — 00 800-47324289 Belgium 00 800-47324283 (00 800-4SEAGATE) 00 800-47324289 Denmark 00 800-47324283 00 800-47324289 France 00 800-47324283 00 800-47324289 Germany 00 800-47324283 00 800-47324289 Ireland 00 800-47324283 00 800-47324289 Italy 00 800-47324283 00 800-47324289 Netherlands 00 800-47324283 00 800-47324289 Norway 00 800-47324283 00 800-47324289 Poland 00 800-311 12 38 00 800-311 12 38 Spain 00 800-47324283 00 800-47324289 Sweden 00 800-47324283 00 800-47324289 Switzerland 00 800-47324283 00 800-47324289 Turkey 00 800-31 92 91 40 00 800-31 92 91 40 United Kingdom 00 800-47324283 00 800-47324289

FAX services—All Europe (toll call)

Technical Support +1-405-324-3339 Warranty Service +31-20-653-3513

Africa/Middle East support services

For presales and technical support in Africa and the Middle East, dial our presales and technical support call center at +1-405-324-4714 from 8:00 day through Friday. The presales and technical support call center is located in Oklahoma City, USA.

For warranty service in Africa and the Middle East, dial our European CSO warranty center at +31-20-3167222 from 8:30

3513. The CSO warranty center is located in Amsterdam, The Netherlands.

A.M. to 5:00 P.M. (Central Europe time) Monday through Friday, or send a FAX to +31-20-653-

A.M. to 11:45 A.M. and 1:00 P.M. to 5:00 P.M. (Central Europe time) Mon-

ST1.2 Series Product Manual, Rev. B 51

Asia/Pacific support services

For Asia/Pacific presales and technical support, dial the toll-free number for your specific location. The Asia/ Pacific toll-free numbers are available from 6:00

A.M. to 10:45 A.M. and 12:00 P.M. to 6:00 P.M. (Australian East-

ern time) Monday through Friday, except as noted. If your location is not listed here, direct dial one of our technical support locations.

Warranty service is available from 9:00 A.M. to 6:00 P.M. April through October, and 10:00 A.M. to 7:00 P.M. November through March (Australian Eastern time) Monday through Friday.

Seagate Service Centers

Call center Toll-free Direct dial FAX

Australia 1800-14-7201 — — China (Mandarin) Hong Kong 800-90-0474 — — Hong Kong (Cantonese)

2, 4

India Indonesia 001-803-1-003-2165 — —

3, 4

Japan

3, 4

Korea Malaysia 1-800-80-2335 — — New Zealand 0800-443988 — — Singapore 800-1101-150 — +65-6488-7525 Taiwan (Mandarin) Thailand 001-800-11-0032165 — —

1, 4

800-810-9668 +86-10-6225-5336 —

1, 4

001-800-0830-1730 — — 1-600-180-1104 — —

0034 800 400 554 — — 007 98 8521 7635 — —

00-800-0830-1730 — —

Customer Service Operations

Warranty Service

Call center Toll-free Direct dial FAX

Asia/Pacific — +65-6485-3595 +65-6485-4860 Australia 1800-12-9277 — —

India

— +91-44-821-6164 +91-44-827-2461

Hours of operation are 8:30 A.M. to 5:30 P.M., Monday through Friday (Australian Western time).

Hours of operation are 9:00 A.M. to 6:00 P.M., Monday through Saturday.

Hours of operation are 9:30 A.M. to 6:30 P.M., Monday through Friday.

Authorized Service Center

52 ST1.2 Series Product Manual, Rev. B

ST1.2 Series Product Manual, Rev. B 53

Publication feedback survey

We are interested in your comments and suggestions regarding this publication. Please take a few minutes to participate in our survey at the following URL:

http://survey.seagate.com/survey/techpubs.nsf

Thank you for your time and comments.

54 ST1.2 Series Product Manual, Rev. B

Index

acoustics 15 Active mode 10 agency certification (regulatory) 17 altitude 11 ambient conditions 3 ambient temperature 11 areal density 1, 6 ATA-standard commands 29 Australian C-Tick 17

BPI 6 buffer 1, 6

EMC compliance 17 enclosures 18 environmental specifications 11 EPRML 1 error-correction algorithms 1 errors 16 EU RoHS directive 17 European Union 17 Execute Device Diagnostics 29

FCC verification 18 Features register 35 feedback survey 54 Flush Cache 29 formatted capacity 5 frequency 15 FX interface connector signals 27

cache 1, 6 card information structure 37 case temperature 11 CE mark 17 certification 17 CF+ interface connector signals 25 Check Power Mode 30 China RoHS directive 18 CIS 37 commands 29 compliance 17 conducted noise 9 conducted RF immunity 15 configuring the drive 21 connector pins 25 consumption 8 Corrosive environment 14 C-Tick 17 current profile 8

DC power 7, 8 density 6 diagnostic software 1 disclaimer 2 Download Microcode 29 drive care 2 drive self-test 1

electrical fast transient 15 electromagnetic compatibility 17 Electromagnetic Compatibility Directive 17 electromagnetic immunity 15

GMR 1 guaranteed sectors 5

handling 21 heads 1 height 6 humidity 11

I/O data-transfer rate 6 Identify Device 29 Identify Device command 31 Idle 30 Idle Immediate 30 Idle mode power, low 7 Information Technology Equipment 17 interface 6 Interface description 25 interface signals 25 interference 18 interleave 6 internal data-transfer rate OD 6 Introduction 1 ISO document 7779 15

Korean RRL 17

LBA mode 5 length 6

ST1.2 Series Product Manual, Rev. B 55

Load/Unload current 8 logical geometry 5 low power idle 8 Low power idle mode 10

maximum temperature 11 modes 25 mounting the drive 21, 22

noise 9 nominal power 3 nonoperating random vibration 14 nonoperating shock 1, 12 Nonoperating sweep sine vibration 13 nonrecoverable read errors 16

Operating random vibration 13 operating shock 1, 12 Operating sweep sine vibration 13

performance idle 8 Performance idle mode 10 physical characteristics 6 pins 25 PIO 25 power consumption 7, 8 power management 10 power specifications 7 power-management commands 30 power-management modes 10 Power-on to Ready 6 precautions 22 programmable power management 10

safety certification 17 SeaTools 1 sectors 5 Seek 29 seek mode 7 Seeking 8 Set Features 29 Set Features command 35 Set Multiple Mode 29 shock 12 signals 25 Sleep 30 sleep mode 7 sound 15 specifications 3 spindle speed 1, 6 Spinup 8 spinup power 7 Standby 30 Standby Immediate 30 standby mode 7 Standby timers 10 Standby to Ready 6 Standby/Sleep 8 Standby/Sleep mode 10 static-discharge precautions 21 subassembly 18 support services 49 surge immunity 15 survey 54 sustained data transfer rate 6

radiated RF immunity 15 radio and television interference 18 radio frequency (RF) 15 Read Buffer 29 Read DMA 29 read errors 16 Read Multiple 29 Read Sectors 29 Read Verify Sectors 29 read/write power and current 7 recording and interface technology 6 recording density 6 recording heads 1 recording method 6

56 ST1.2 Series Product Manual, Rev. B

technical support services 49 temperature 11 temperature gradient 11 theory of liability 2 time to ready 6 timers 10 tort 2 track density 6

Vibration 12 voltage 9 voltage dips, interrupts 15

voltage tolerance 9

Warranty 16 warranty 2 weight 6 wet bulb temperature 11 width 6 Write Buffer 29 Write DMA 30 Write Multiple 30 Write Sectors 30

ST1.2 Series Product Manual, Rev. B 57

58 ST1.2 Series Product Manual, Rev. B

Seagate Technology LLC

920 Disc Drive, Scotts Valley, California 95066-4544, USA

Publication Number: 100375652, Rev. B, Printed in U.S.A.

seagate ST1.2 user guide

Specifications and Main Features

Frequently Asked Questions

User Manual

1.0 Introduction

1.1 Disclaimer

1.2 Drive care

1.3 Handling precautions

2.0 Drive specifications

2.1 Power, access times and acoustics

2.2 Formatted capacity

2.3 Default logical geometry

2.4 Recording and interface technology

2.5 Physical characteristics

2.6 Time to ready

2.7 Power specifications

2.7.1 Power consumption

2.7.1.1 Typical current profile

2.7.2 Conducted noise

2.7.3 Voltage tolerance

2.7.4 Power-management modes

2.8 Environmental specifications

2.8.1 Ambient temperature

2.8.2 Temperature gradient

2.8.3 Humidity

2.8.3.1 Relative humidity

2.8.3.2 Wet bulb temperature

2.8.4 Altitude

2.8.5 Shock

2.8.5.1 Operating shock

2.8.5.2 Nonoperating shock

2.8.6 Vibration

2.8.6.1 Operating sweep sine vibration

2.8.6.2 Operating random vibration

2.8.6.3 Nonoperating sweep sine vibration

2.8.6.4 Nonoperating random vibration

2.8.6.5 Corrosive environment

2.9 Acoustics

2.10 Electromagnetic immunity

2.11 Reliability

2.12 Agency certification

2.12.1 Safety certification

2.12.2 Electromagnetic compatibility

2.12.3 European Union Restriction of Hazardous Substances (RoHS) Directive

2.12.4 China Restriction of Hazardous Substances (RoHS) Directive

2.12.5 FCC verification

3.0 Configuring and mounting the drive

3.1 Handling and static discharge precautions

3.2 Drive installation

4.0 Interface description

4.1 Connector interface signals and connector pins

4.1.1 Flex interface connector signals

4.1.2 Supported ATA commands

4.1.3 Identify Device command

4.1.4 Set Features command

4.1.5 Card Information Structure (CIS) information for CF

5.0 Seagate Technology support services

Index