seagate ST1.2 user guide

PRODUCT MANUAL

ST1.2 Series

ST68022CF

ST68022FX

ST64022CF

ST64022FX

ST66022CF

ST66022FX

Rev. B

February 2007

Revision status summary sheet

Revision Date Sheets Affected

Rev. A 05/27/05 All.
Rev. B 02/27/07 Front cover and 18.

Copyright © 2005 - 2007 Seagate Technology LLC. All rights reserved. Printed in U.S.A.

Publication number: 100375652, Rev. B February 2007

Seagate, Seagate Technology and the Wave logo are registered trademarks of Seagate Technology LLC in
the United States and/or other countries. ST1.2 Series, SeaTools and SeaTDD are either trademarks or
registered trademarks of Seagate Technology LLC or one of its affiliated companies in the United States
and/or other countries. All other trademarks or registered trademarks are the property of their respective
owners.

One gigabyte, or GB, equals one billion bytes when referring to hard drive capacity. Accessible capacity
may vary depending on operating environment and formatting. Quantitative usage examples for various
applications are for illustrative purposes. Actual quantities will vary based on various factors, including file
size, file format, features and application software. Seagate reserves the right to change, without notice,
product offerings or specifications.

Contents

1.0 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2 Drive care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.3 Handling precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2.0 Drive specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2.1 Power, access times and acoustics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2.2 Formatted capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.3 Default logical geometry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.4 Recording and interface technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.5 Physical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.6 Time to ready. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.7 Power specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.7.1 Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.7.2 Conducted noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.7.3 Voltage tolerance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.7.4 Power-management modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.8 Environmental specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.8.1 Ambient temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.8.2 Temperature gradient. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.8.3 Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.8.4 Altitude . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.8.5 Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2.8.6 Vibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2.9 Acoustics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

2.10 Electromagnetic immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

2.11 Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

2.12 Agency certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2.12.1 Safety certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2.12.2 Electromagnetic compatibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2.12.3 European Union Restriction of Hazardous Substances (RoHS) Directive . . . . . 17

2.12.4 China Restriction of Hazardous Substances (RoHS) Directive . . . . . . . . . . . . . 18

2.12.5 FCC verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.0 Configuring and mounting the drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.1 Handling and static discharge precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.2 Drive installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

4.0 Interface description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

4.1 Connector interface signals and connector pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

4.1.1 Flex interface connector signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

4.1.2 Supported ATA commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

4.1.3 Identify Device command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

4.1.4 Set Features command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

4.1.5 Card Information Structure (CIS) information for CF . . . . . . . . . . . . . . . . . . . . . 37

5.0 Seagate Technology support services. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

ST1.2 Series Product Manual, Rev. B i

ii ST1.2 Series Product Manual, Rev. B

List of Figures

Figure 1. ST1.2 Series CompactFlash+ disc drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Figure 2. ST1.2 Series Flex (IDE interface) disc drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Figure 3. ST1.2 Series breather hole location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Figure 4. ST1.2 Series improper handling example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Figure 5. Typical 3.3V startup and operation current profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Figure 6. Location where tri-axial accelerometer will be placed on ST1.2 drive . . . . . . . . . . . . . . . . . . 12

Figure 7. Drive axis definition for ST1.2 drives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 8. ST1.2 Series proper handling example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 9. ST1.2 Series improper handling example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 10. CF model mechanical dimensions—top, side and end view . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 11. FX model mechanical dimensions—top, side and end view. . . . . . . . . . . . . . . . . . . . . . . . . . 23

ST1.2 Series Product Manual, Rev. B iii

iv ST1.2 Series Product Manual, Rev. B

1.0 Introduction

This manual describes the functional, mechanical and interface specifications for the following Seagate® ST1.2
Series drives:

• ST68022CF, ST66022CF and ST64022CF CompactFlash+ Type II disc drives.

• ST68022FX, ST66022FX and ST64022FX Flex (IDE interface) disc drives.

These drives provide the following key features.

• 3,600-RPM spindle speed and 2-Mbyte buffer combine for superior performance.

• Quiet operation. Fluid Dynamic Bearing (FDB) motor.

• Giant magnetoresistive (GMR) recording heads and EPRML technology, which provide the drives with
increased areal density.

• State-of-the-art cache and on-the-fly error-correction algorithms.

• 1.5K Gs nonoperating shock, and 200 Gs operating shock.

• SeaTools™ diagnostic software performs a drive self-test that eliminates unnecessary drive returns.

Figure 1. ST1.2 Series CompactFlash+ disc drive

Figure 2. ST1.2 Series Flex (IDE interface) disc drive

ST1.2 Series Product Manual, Rev. B 1

1.1 Disclaimer

Seagate Technology LLC makes no warranties whatsoever, including any warranty of merchantability, non­infringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specifi
cation or sample. Seagate may not be held liable for any direct, indirect, incidental, special, exemplary, or con­sequential damages (including, but not limited to, loss of use, data, or profits; procurement of substitute goods
or services; or business interruptions) however caused and on any theory of liability, whether in contract, strict
liability, or tort (including negligence or otherwise) arising in any way from the use of this kit, even if advised of
the possibility of such damage.

1.2 Drive care

Do not use the ST1.2 Series disc drives outside of the ranges of environmental conditions found in Section 2.8,
"Environmental specifications." Doing so may void the warranty of the ST1.2 Series disc drive.

1.3 Handling precautions

• Do not cover or seal the breather hole! Covering or sealing the breather hole may result in loss of data.

-

Figure 3. ST1.2 Series breather hole location

• Do not apply any force to the drive during handling or installation.

• Always handle the drive with care to prevent damage from shock, vibration, or electrostatic discharge (ESD).

• Handle the drive carefully by the edges. Do not touch any exposed printed circuit board or the top cover.

• The drive is fragile—handle it with care. Do not press down on the top cover or attempt to use a pen to write
on the drive’s label. Do not apply more than 1.5 kg of force to the top cover.

Figure 4. ST1.2 Series improper handling example

• Always carry the drive in its plastic case.

• Do not drop the drive.

• Do not expose the drive to wet conditions.

• Do not place the drive near a strong magnetic field.

• Do not expose the drive to extreme temperatures.

• Do not use the drive in CF+ Type II slots without an ejection mechanism.

• The drive may become hot during operation. Be careful when removing the drive from the host device
immediately after operation.

2 ST1.2 Series Product Manual, Rev. B

2.0 Drive specifications

Unless otherwise noted, all specifications are measured under ambient conditions, at 25°C, and nominal
power. For convenience, the phrases the drive and this drive are used throughout this manual to indicate
ST68022CF, ST68022FX, ST66022CF, ST66022FX, ST64022FX and ST64022CF model drives.

2.1 Power, access times and acoustics

The specifications listed in this table are for quick reference. For details on specification measurement or defi­nition, see the appropriate section of this manual.

Table 1: Specifications

ST68022CF

Drive specification

Formatted Gbytes 8.0 6.0 4.0

Guaranteed sectors 15,625,008 11,719,008 7,999,488

Bytes per sector 1024

Cache (Mbytes) 2

Recording density, BPI (bits/inch max) 663,000

Track density. TPI (tracks/inch max) 110,000

Areal density (Gbits/inch2 max) 72.9

Spindle speed (RPM) 3,600

Internal data transfer rate OD (Mbits/sec max) 130.0

Sustained data transfer rate OD (Mbytes/sec) 8.8

I/O data-transfer rate (Mbytes/sec max) 33.3MB/s (UDMA 2)

ATA data-transfer modes supported PIO modes 0–4;

Height 5.0 +/-0.1 mm (0.1968 +/-0.004 inches)

Width 42.80 +/-0.101 mm (1.685 +/-0.004 inches)

Length 36.40 +/-0.15 mm (1.433 +/-0.006 inches)

Weight (typical) 18.0 grams (0.0397 lb.)

Average latency (msec) 8.3

Power-on to ready (sec typical / max) (without retry) 1.2 / 2.5

Standby to ready (sec typical / max) (without retry) 1.0 / 2.5

Startup current 5V (peak) (maximum RMS in 10ms window) 350 mA

Seek power (typical 3.3V) 226 mA

Read/write power (typical 3.3V) 330 mA

Performance idle mode (typical 3.3V) 200 mA

Low power idle mode (typical 3.3V) 90 mA

ST68022FX

Multiword DMA modes 0-2;
Ultra DMA modes 0–2

ST66022CF
ST66022FX

ST64022CF
ST64022FX

ST1.2 Series Product Manual, Rev. B 3

Table 1: Specifications

ST68022CF

Drive specification

Standby/Sleep mode (typical 3.3V) 30 mA

Voltage tolerance (including noise) 3.3V ± 5%

Ambient temperature 0° to 70°C (operating) (70°C case temperature)

Temperature gradient (°C per hour max) 20°C (operating)

Relative humidity (noncondensing) 5% to 90% (operating)

Relative humidity gradient 30% per hour max

Wet bulb temperature (°C max) 33°C (operating)

Altitude, operating –60.98 m to 3,048 m (–200 ft to 10,000+ ft)

Altitude, nonoperating (below mean sea level, max) –60.98 m to 12,192 m (–200 ft to 40,000+ ft)

Shock, operating (Gs max at 1 msec) Read 200

Shock, operating (Gs max at 2 msec) Write 175

Shock, nonoperating (Gs max at 1 msec) 1500

Shock, nonoperating (Gs max at 0.5 msec) 1500

Vibration, operating (max displacement may apply below 10 hz) 1.0 Gs (0 to peak, 5–500 Hz) @ 2 oct/min sweep rate

Vibration, nonoperating (max displacement may apply below 22 hz) 5.0 Gs (0 to peak, 5–500 Hz) @ 0.5 oct/min sweep rate

Drive acoustics, sound power (bels)

Idle (typical / max) 2.1/ 2.4

Operational (typical / max) 2.2 / 2.5

Nonrecoverable read errors

Annualized Failure Rate 0.4% AFR at 25°C

Load/Unload (LUL) cycles (40°C) 300,000 software-controlled power on/off cycles

Warranty Per agreement

ST68022FX

5V ± 10%

–40° to 70°C (nonoperating)

30°C (nonoperating)

5% to 95% (nonoperating)

40°C (nonoperating)

1 per 1014 bits read

20,000 hard power on/off cycles

ST66022CF
ST66022FX

ST64022CF
ST64022FX

4 ST1.2 Series Product Manual, Rev. B

2.2 Formatted capacity

Model Formatted capacity Guaranteed sectors Bytes per sector

ST68022CF
ST68022FX

ST66022CF
ST66022FX

ST64022CF
ST64022FX

8.0 Gbytes 15,625,008 1024

6.0 Gbytes 11,719,008 1024

4.0 Gbytes 7,999,488 1024

2.3 Default logical geometry

Model Cylinders Read/write heads Sectors per track

ST68022CF
ST68022FX

ST66022CF
ST66022FX

ST64022CF
ST64022FX

LBA mode

When addressing these drives in LBA mode, all blocks (sectors) are consecutively numbered from 0 to n–1,
where n is the number of guaranteed sectors as defined above.

15,501 16 63

11,626 16 63

7,936 16 63

ST1.2 Series Product Manual, Rev. B 5

2.4 Recording and interface technology

Technology Specification

Interface CompactFlash 2.0 (CF+ 2.0)

Recording method RLL 0,20

Recording density BPI (bits/inch max) 663,000

Track density TPI (tracks/inch max) 115, 000

Areal density (Gbits/inch2 max) 72.9

Spindle speed (RPM) (± 0.2%) 3,600

Internal data-transfer rate OD (Mbits/sec max) 130.0

Sustained data transfer rate OD (Mbytes/sec max) 8.8

I/O data-transfer rate (Mbytes/sec max) 33.3MB/s (UDMA 2)

Interleave 1:1

Cache buffer

ST68022CF, ST68022FX, ST66022CF, ST66022FX,
ST64022CF and ST64022FX

2 Mbytes (2,048 Kbytes)

2.5 Physical characteristics

Height (mm)

(inches)

Width (mm)

(inches)

Length (mm)

(inches)

Typical weight (grams)

(pounds)

Interface Connector
ST68022CF, ST66022CF and ST64022CF
ST68022FX, ST66022FX and ST64022FX

5.0 +/-0.1 mm

0.1968 +/-0.004

42.80 +/-0.101

1.685 +/-0.004

36.40 +/-0.15

1.433 +/-0.006

18.0

0.0397

CompactFlash Type II Connector (50-pin)
Seagate Flex Connector (45-way)

2.6 Time to ready

Time to ready Typical Max (without retry)

Power-On to Ready (sec) 1.2 2.5

Standby to Ready (sec) 1.0 2.5

6 ST1.2 Series Product Manual, Rev. B

2.7 Power specifications

The drive receives DC power (+3.3V or +5V) through the CompactFlash interface connector for ST68022CF,
ST66022CF and ST64022CF models, and (+3.3V or +5V) through the Flex interface connector for
ST68022FX, ST66022FX and ST64022FX models.

2.7.1 Power consumption

Power requirements for the drives are listed in the table on page 8. Typical power measurements are based on
an average of drives tested, under nominal conditions, using +3.3V and +5.0V input voltage at 25°C ambient
temperature.

• Spinup power

Spinup power is measured from the time of power-on to the time that the drive spindle reaches operating speed.

• Seek mode

During seek mode, the read/write actuator arm moves toward a specific position on the disc surface and does
not execute a read or write operation. Servo electronics are active. Seek mode power is measured based on
three random seek operations every 100 msecs. This mode is not typical.

• Read/write power and current

Read/write power is measured with the heads on track, at the moment while the head is writing/reading
from/to disc. It is performed with 100 percent duty cycle of write/read operation.

• Idle mode power, low

Spindle motor is working normally with actuator unloaded to the parked position.

• Standby mode / Sleep mode

During Standby mode, the drive accepts commands, but the drive is not spinning, and the servo and read/
write electronics are in power-down mode.

ST1.2 Series Product Manual, Rev. B 7

Table 2: DC power

ST1 Power Consumption (W)
Max current the average of the
peak value in 10ms window

Current 350 350

Spinup 300 300

Load/Unload current 300 300

Write 330 350 330 350

Read 330 350 340 350

Seek 226 300 226 300

Performance idle 200 205

Low power idle 90 92

Standby/Sleep 30 33

*During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase acoustic and

power to operational levels.

Average

3.3V
(mA)

Max

3.3V
(mA)

Average

5.0V
(mA)

Max

5.0V
(mA)

2.7.1.1 Typical current profile

Figure 5. Typical 3.3V startup and operation current profile

8 ST1.2 Series Product Manual, Rev. B

2.7.2 Conducted noise

Input noise ripple is measured at the host system power supply across an equivalent 15-ohm resistive load on
the +5 volt line.

Using 5-volt power, the drive is expected to operate with a maximum of 100 mV peak-to-peak square-wave
injected noise at up to 20 MHz.

Using 3.3-volt power, the drive is expected to operate with a maximum of 70 mV peak-to-peak square-wave
injected noise at up to 20 MHz.

Note. Equivalent resistance is calculated by dividing the nominal voltage by the typical RMS read/write

current.

2.7.3 Voltage tolerance

Voltage tolerance (including noise):

5.0V ± 10%

3.3V ± 5%

ST1.2 Series Product Manual, Rev. B 9

2.7.4 Power-management modes

The drive provides programmable power management to provide greater energy efficiency. The drive features
the following power-management modes:

Table 3: Power-management modes

Power modes Heads Spindle Buffer

Active (operating) Tracking Rotating Enabled

Idle, low power Parked Rotating Disabled

Standby/Sleep Parked Stopped Disabled

• Active mode

The drive is in Active mode during the read/write and seek operations.

• Low power idle mode

Drive enters Low Power Idle mode from Active Idle mode when the Advanced Power Management Level is
set above 80h and the Idle timer is reached at 2 seconds. Disc is spinning and head is parked and drive accepts
all commands and returns to Active mode any time disc access is necessary.

• Performance idle mode

The buffer remains enabled, and the drive accepts all commands and returns to Active mode any time disc
access is necessary.

• Standby/Sleep mode

The drive enters Standby mode when the host sends a Standby Immediate command. If the host has set the
standby timer, the drive can also enter Standby mode automatically after the drive has been inactive for a
specifiable length of time. The standby timer delay is established using a Standby or Idle command. In Standby
mode, the drive buffer is disabled, the heads are parked and the spindle is at rest. The drive accepts all
commands and returns to Active mode any time disc access is necessary.

• Standby timers

Each time the drive performs an Active function (such as read, write or seek), the standby timer is reinitialized
and begins counting down from its specified delay times to zero. If the standby timer reaches zero before any
drive activity is required, the drive makes a transition to Standby mode. In both Idle and Standby mode, the
drive accepts all commands and returns to Active mode when disc access is necessary.

10 ST1.2 Series Product Manual, Rev. B

2.8 Environmental specifications

2.8.1 Ambient temperature

Ambient temperature is defined as the temperature of the environment immediately surrounding the drive.
Actual drive case temperature should not exceed

Above 1,000 feet (305 meters), the maximum temperature is derated linearly by 1°C every 1000 feet.

Operating 0° to 70°C (41° to 158°F) (70°C @ case temperature)

Nonoperating –40° to 70°C (–40° to 153°F)

2.8.2 Temperature gradient

Operating 20°C per hour (68°F per hour max), without condensation

Nonoperating 30°C per hour (86°F per hour max), without condensation

2.8.3 Humidity

2.8.3.1 Relative humidity

Operating 5% to 90% noncondensing (30% per hour max)

70°C (158°F) within the operating ambient conditions.

Nonoperating 5% to 95% noncondensing (30% per hour max)

2.8.3.2 Wet bulb temperature

Operating 33°C (91.4°F max) [1]

Nonoperating 40°C (104°F max) [2]

[1] Operating: Wet bulb temperature is calculated by the operating Temperature and the Relative Humidity levels.
[2] Nonoperating: Wet bulb temperature is calculated by the nonoperating Temperature and the Relative Humidity levels.

2.8.4 Altitude

Operating –60.98 m to 3,048 m (–200 ft to 10,000+ ft)

Nonoperating –60.98 to 12,192 m (–200 ft to 40,000+ ft)

ST1.2 Series Product Manual, Rev. B 11

2.8.5 Shock

All shock measurements in this section are carried out at drive level. For all linear shock test, operating or non­operating, the input shock level shall be measured at the frame of the disk drive at the specific location indi­cated by the red ellipse in Figure 6 below for the CF and interface drives.

Finger
Grip Area

S1.2 CF interface drive

Figure 6. Location where tri-axial accelerometer will be placed on ST1.2 drive

S1.2 FX interface drive

All shock test will cover all the 6 directions, +/- x, y and z axes. The drive axis definition in shown in Figure 7
below.

-z

-y

+x

+z

-x

S1.2 CF interface drive

Figure 7. Drive axis definition for ST1.2 drives

-y

+y

+x

S1.2 FX interface drive

-z

+z

-x

+y

2.8.5.1 Operating shock

The drive will be subjected to 10 shocks for each direction. During the shocks, there must be a minimum delay
of 3 seconds between shock pulses. Soft errors and automatic retries are allowed during the test. No data loss
or permanent damage occurs during a half sine shock pulse of:

200 Gs, 1 msec (on-track read at OD)

175 Gs, 2 msec (random write)

2.8.5.2 Nonoperating shock

The nonoperating shock level that the drive can experience without incurring any physical damage when sub­sequently put into operation is 750 Gs based on a non-repetitive half sine shock pulse of 2 msec duration. The
same applies for shock levels of 1500 Gs, 1 msec pulse duration and 1500 Gs, 0.5 msec pulse duration on
fresh drives for each level.

2.8.6 Vibration

All vibration specifications assume that the drive is mounted securely in a fixture that does not have fixture
resonances in the frequency test range. The input vibration is applied through the disc drive guide rails of the
device under test. Testing is carried out in the x, y and z axes.

12 ST1.2 Series Product Manual, Rev. B

2.8.6.1 Operating sweep sine vibration

The following lists the maximum operating sweep sine vibration levels that the drive may experience while
meeting the performance standards specified. It will consist of a forward and backward sweep from 5 Hz to
500

Hz to 5 Hz. The drive will operate without a hard error while being subjected to the following vibration

levels.

5 Hz to 500 Hz @ 2 oct/min 1.0 Gs (0 to pk). Maximum displacement may apply below 10 Hz.

2.8.6.2 Operating random vibration

The test consists of 30 minutes of random vibration using the power spectral density (PSD) levels specified in
the table below. The vibration test level is 0.67

Gs RMS. The drive will operate without a hard error while being

subjected to the following vibration levels.

Table 4: Operating random vibration profile

Frequency (Hz) G2/Hz

17 1.1 x E-03

45 1.1 x E-03

48 8.0 x E-03

62 8.0 x E-03

65 1.0 x E-03

150 1.0 x E-03

200 5.0 x E-04

500 5.0 x E-04

2.8.6.3 Nonoperating sweep sine vibration

The following table lists the maximum nonoperating sweep sine vibration levels that the drive may experience
while meeting the performance standards specified. It will consist of a forward and backward sweep from 5 Hz
to 500 Hz to 5 Hz. The drive will not incur any physical damage when subsequently put into operation.

5 Hz to 500 Hz @ 0.5 oct/min 5.0 Gs (0 to pk). Maximum displacement may apply below 22 Hz.

ST1.2 Series Product Manual, Rev. B 13

2.8.6.4 Nonoperating random vibration

The test consists of 15 minutes of random vibration using the power spectral density (PSD) levels specified in
the table below. The vibration test level is 3.01 Gs RMS. The drive will not incur any physical damage when
subsequently put into operation.

Table 5: Nonoperating random vibration profile.

Frequency (Hz) G2/Hz

2.5 1.0 x E-03

5 3.0 x E-02

40 1.8 x E-02

500 1.8 x E-02

2.8.6.5 Corrosive environment

Seagate electronic drive components pass accelerated corrosion testing equivalent to ten years of exposure to
light industrial environments containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM
B845. However, this accelerated testing cannot duplicate every potential application environment.

Users should use caution exposing any electronic components to uncontrolled chemical pollutants and corro­sive chemicals as electronic drive component reliability can be affected by the installation environment. The sil­ver, copper, nickel and gold films used in Seagate products are especially sensitive to the presence of sulfide,
chloride, and nitrate contaminants. Sulfur is found to be the most damaging. In addition, electronic components
should never be exposed to condensing water on the surface of the printed circuit board assembly (PCBA) or
exposed to an ambient relative humidity greater than 95 percent. Materials used in cabinet fabrication, such as
vulcanized rubber, that can outgas corrosive compounds should be minimized or eliminated. The useful life of
any electronic equipment may be extended by replacing materials near circuitry with sulfide-free alternatives.

14 ST1.2 Series Product Manual, Rev. B