Publication number: 100375652, Rev. B February 2007
Seagate, Seagate Technology and the Wave logo are registered trademarks of Seagate Technology LLC in
the United States and/or other countries. ST1.2 Series, SeaTools and SeaTDD are either trademarks or
registered trademarks of Seagate Technology LLC or one of its affiliated companies in the United States
and/or other countries. All other trademarks or registered trademarks are the property of their respective
owners.
One gigabyte, or GB, equals one billion bytes when referring to hard drive capacity. Accessible capacity
may vary depending on operating environment and formatting. Quantitative usage examples for various
applications are for illustrative purposes. Actual quantities will vary based on various factors, including file
size, file format, features and application software. Seagate reserves the right to change, without notice,
product offerings or specifications.
• Giant magnetoresistive (GMR) recording heads and EPRML technology, which provide the drives with
increased areal density.
• State-of-the-art cache and on-the-fly error-correction algorithms.
• 1.5K Gs nonoperating shock, and 200 Gs operating shock.
• SeaTools™ diagnostic software performs a drive self-test that eliminates unnecessary drive returns.
Figure 1.ST1.2 Series CompactFlash+ disc drive
Figure 2.ST1.2 Series Flex (IDE interface) disc drive
ST1.2 Series Product Manual, Rev. B1
1.1Disclaimer
Seagate Technology LLC makes no warranties whatsoever, including any warranty of merchantability, noninfringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specifi
cation or sample. Seagate may not be held liable for any direct, indirect, incidental, special, exemplary, or consequential damages (including, but not limited to, loss of use, data, or profits; procurement of substitute goods
or services; or business interruptions) however caused and on any theory of liability, whether in contract, strict
liability, or tort (including negligence or otherwise) arising in any way from the use of this kit, even if advised of
the possibility of such damage.
1.2Drive care
Do not use the ST1.2 Series disc drives outside of the ranges of environmental conditions found in Section 2.8,
"Environmental specifications." Doing so may void the warranty of the ST1.2 Series disc drive.
1.3Handling precautions
• Do not cover or seal the breather hole! Covering or sealing the breather hole may result in loss of data.
-
Figure 3.ST1.2 Series breather hole location
• Do not apply any force to the drive during handling or installation.
• Always handle the drive with care to prevent damage from shock, vibration, or electrostatic discharge (ESD).
• Handle the drive carefully by the edges. Do not touch any exposed printed circuit board or the top cover.
• The drive is fragile—handle it with care. Do not press down on the top cover or attempt to use a pen to write
on the drive’s label. Do not apply more than 1.5 kg of force to the top cover.
Figure 4.ST1.2 Series improper handling example
• Always carry the drive in its plastic case.
• Do not drop the drive.
• Do not expose the drive to wet conditions.
• Do not place the drive near a strong magnetic field.
• Do not expose the drive to extreme temperatures.
• Do not use the drive in CF+ Type II slots without an ejection mechanism.
• The drive may become hot during operation. Be careful when removing the drive from the host device
immediately after operation.
2ST1.2 Series Product Manual, Rev. B
2.0Drive specifications
Unless otherwise noted, all specifications are measured under ambient conditions, at 25°C, and nominal
power. For convenience, the phrases the drive and this drive are used throughout this manual to indicate
ST68022CF, ST68022FX, ST66022CF, ST66022FX, ST64022FX and ST64022CF model drives.
2.1Power, access times and acoustics
The specifications listed in this table are for quick reference. For details on specification measurement or definition, see the appropriate section of this manual.
Table 1: Specifications
ST68022CF
Drive specification
Formatted Gbytes8.06.04.0
Guaranteed sectors15,625,00811,719,0087,999,488
Bytes per sector1024
Cache (Mbytes)2
Recording density, BPI (bits/inch max)663,000
Track density. TPI (tracks/inch max)110,000
Areal density (Gbits/inch2 max)72.9
Spindle speed (RPM)3,600
Internal data transfer rate OD (Mbits/sec max)130.0
Load/Unload (LUL) cycles (40°C)300,000 software-controlled power on/off cycles
WarrantyPer agreement
ST68022FX
5V ± 10%
–40° to 70°C (nonoperating)
30°C (nonoperating)
5% to 95% (nonoperating)
40°C (nonoperating)
1 per 1014 bits read
20,000 hard power on/off cycles
ST66022CF
ST66022FX
ST64022CF
ST64022FX
4ST1.2 Series Product Manual, Rev. B
2.2Formatted capacity
ModelFormatted capacity Guaranteed sectors Bytes per sector
ST68022CF
ST68022FX
ST66022CF
ST66022FX
ST64022CF
ST64022FX
8.0 Gbytes15,625,0081024
6.0 Gbytes11,719,0081024
4.0 Gbytes7,999,4881024
2.3Default logical geometry
ModelCylinders Read/write heads Sectors per track
ST68022CF
ST68022FX
ST66022CF
ST66022FX
ST64022CF
ST64022FX
LBA mode
When addressing these drives in LBA mode, all blocks (sectors) are consecutively numbered from 0 to n–1,
where n is the number of guaranteed sectors as defined above.
15,5011663
11,6261663
7,9361663
ST1.2 Series Product Manual, Rev. B5
2.4Recording and interface technology
TechnologySpecification
InterfaceCompactFlash 2.0 (CF+ 2.0)
Recording methodRLL 0,20
Recording density BPI (bits/inch max)663,000
Track density TPI (tracks/inch max)115, 000
Areal density (Gbits/inch2 max)72.9
Spindle speed (RPM) (± 0.2%)3,600
Internal data-transfer rate OD (Mbits/sec max)130.0
Sustained data transfer rate OD (Mbytes/sec max)8.8
ST68022CF, ST68022FX, ST66022CF, ST66022FX,
ST64022CF and ST64022FX
2 Mbytes (2,048 Kbytes)
2.5Physical characteristics
Height(mm)
(inches)
Width(mm)
(inches)
Length(mm)
(inches)
Typical weight(grams)
(pounds)
Interface Connector
ST68022CF, ST66022CF and ST64022CF
ST68022FX, ST66022FX and ST64022FX
5.0 +/-0.1 mm
0.1968 +/-0.004
42.80 +/-0.101
1.685 +/-0.004
36.40 +/-0.15
1.433 +/-0.006
18.0
0.0397
CompactFlash Type II Connector (50-pin)
Seagate Flex Connector (45-way)
2.6Time to ready
Time to readyTypicalMax (without retry)
Power-On to Ready (sec)1.22.5
Standby to Ready (sec)1.02.5
6ST1.2 Series Product Manual, Rev. B
2.7Power specifications
The drive receives DC power (+3.3V or +5V) through the CompactFlash interface connector for ST68022CF,
ST66022CF and ST64022CF models, and (+3.3V or +5V) through the Flex interface connector for
ST68022FX, ST66022FX and ST64022FX models.
2.7.1Power consumption
Power requirements for the drives are listed in the table on page 8. Typical power measurements are based on
an average of drives tested, under nominal conditions, using +3.3V and +5.0V input voltage at 25°C ambient
temperature.
• Spinup power
Spinup power is measured from the time of power-on to the time that the drive spindle reaches operating speed.
• Seek mode
During seek mode, the read/write actuator arm moves toward a specific position on the disc surface and does
not execute a read or write operation. Servo electronics are active. Seek mode power is measured based on
three random seek operations every 100 msecs. This mode is not typical.
• Read/write power and current
Read/write power is measured with the heads on track, at the moment while the head is writing/reading
from/to disc. It is performed with 100 percent duty cycle of write/read operation.
• Idle mode power, low
Spindle motor is working normally with actuator unloaded to the parked position.
• Standby mode / Sleep mode
During Standby mode, the drive accepts commands, but the drive is not spinning, and the servo and read/
write electronics are in power-down mode.
ST1.2 Series Product Manual, Rev. B7
Table 2: DC power
ST1 Power Consumption (W)
Max current the average of the
peak value in 10ms window
Current350350
Spinup300300
Load/Unload current300300
Write330350330350
Read330350340350
Seek226300226300
Performance idle200205
Low power idle9092
Standby/Sleep3033
*During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase acoustic and
power to operational levels.
Average
3.3V
(mA)
Max
3.3V
(mA)
Average
5.0V
(mA)
Max
5.0V
(mA)
2.7.1.1Typical current profile
Figure 5.Typical 3.3V startup and operation current profile
8ST1.2 Series Product Manual, Rev. B
2.7.2Conducted noise
Input noise ripple is measured at the host system power supply across an equivalent 15-ohm resistive load on
the +5 volt line.
Using 5-volt power, the drive is expected to operate with a maximum of 100 mV peak-to-peak square-wave
injected noise at up to 20 MHz.
Using 3.3-volt power, the drive is expected to operate with a maximum of 70 mV peak-to-peak square-wave
injected noise at up to 20 MHz.
Note. Equivalent resistance is calculated by dividing the nominal voltage by the typical RMS read/write
current.
2.7.3Voltage tolerance
Voltage tolerance (including noise):
5.0V ± 10%
3.3V ± 5%
ST1.2 Series Product Manual, Rev. B9
2.7.4Power-management modes
The drive provides programmable power management to provide greater energy efficiency. The drive features
the following power-management modes:
Table 3: Power-management modes
Power modesHeadsSpindleBuffer
Active (operating)TrackingRotatingEnabled
Idle, low powerParkedRotatingDisabled
Standby/SleepParkedStoppedDisabled
• Active mode
The drive is in Active mode during the read/write and seek operations.
• Low power idle mode
Drive enters Low Power Idle mode from Active Idle mode when the Advanced Power Management Level is
set above 80h and the Idle timer is reached at 2 seconds. Disc is spinning and head is parked and drive accepts
all commands and returns to Active mode any time disc access is necessary.
• Performance idle mode
The buffer remains enabled, and the drive accepts all commands and returns to Active mode any time disc
access is necessary.
• Standby/Sleep mode
The drive enters Standby mode when the host sends a Standby Immediate command. If the host has set the
standby timer, the drive can also enter Standby mode automatically after the drive has been inactive for a
specifiable length of time. The standby timer delay is established using a Standby or Idle command. In Standby
mode, thedrive buffer is disabled, the heads are parked and the spindle is at rest. The drive accepts all
commands and returns to Active mode any time disc access is necessary.
• Standby timers
Each time the drive performs an Active function (such as read, write or seek), the standby timer is reinitialized
and begins counting down from its specified delay times to zero. If the standby timer reaches zero before any
drive activity is required, the drive makes a transition to Standby mode. In both Idle and Standby mode, the
drive accepts all commands and returns to Active mode when disc access is necessary.
10ST1.2 Series Product Manual, Rev. B
2.8Environmental specifications
2.8.1Ambient temperature
Ambient temperature is defined as the temperature of the environment immediately surrounding the drive.
Actual drive case temperature should not exceed
Above 1,000 feet (305 meters), the maximum temperature is derated linearly by 1°C every 1000 feet.
Operating0° to 70°C (41° to 158°F) (70°C @ case temperature)
Nonoperating–40° to 70°C (–40° to 153°F)
2.8.2Temperature gradient
Operating20°C per hour (68°F per hour max), without condensation
Nonoperating30°C per hour (86°F per hour max), without condensation
2.8.3Humidity
2.8.3.1Relative humidity
Operating 5% to 90% noncondensing (30% per hour max)
70°C (158°F) within the operating ambient conditions.
Nonoperating 5% to 95% noncondensing (30% per hour max)
2.8.3.2Wet bulb temperature
Operating 33°C (91.4°F max) [1]
Nonoperating 40°C (104°F max) [2]
[1]Operating: Wet bulb temperature is calculated by the operating Temperature and the Relative Humidity levels.
[2]Nonoperating: Wet bulb temperature is calculated by the nonoperating Temperature and the Relative Humidity levels.
2.8.4Altitude
Operating–60.98 m to 3,048 m (–200 ft to 10,000+ ft)
Nonoperating–60.98 to 12,192 m (–200 ft to 40,000+ ft)
ST1.2 Series Product Manual, Rev. B11
2.8.5Shock
All shock measurements in this section are carried out at drive level. For all linear shock test, operating or nonoperating, the input shock level shall be measured at the frame of the disk drive at the specific location indicated by the red ellipse in Figure 6 below for the CF and interface drives.
Finger
Grip Area
S1.2 CF interface drive
Figure 6.Location where tri-axial accelerometer will be placed on ST1.2 drive
S1.2 FX interface drive
All shock test will cover all the 6 directions, +/- x, y and z axes. The drive axis definition in shown in Figure 7
below.
-z
-y
+x
+z
-x
S1.2 CF interface drive
Figure 7.Drive axis definition for ST1.2 drives
-y
+y
+x
S1.2 FX interface drive
-z
+z
-x
+y
2.8.5.1Operating shock
The drive will be subjected to 10 shocks for each direction. During the shocks, there must be a minimum delay
of 3 seconds between shock pulses. Soft errors and automatic retries are allowed during the test. No data loss
or permanent damage occurs during a half sine shock pulse of:
200 Gs, 1 msec (on-track read at OD)
175 Gs, 2 msec (random write)
2.8.5.2Nonoperating shock
The nonoperating shock level that the drive can experience without incurring any physical damage when subsequently put into operation is 750 Gs based on a non-repetitive half sine shock pulse of 2 msec duration. The
same applies for shock levels of 1500 Gs, 1 msec pulse duration and 1500 Gs, 0.5 msec pulse duration on
fresh drives for each level.
2.8.6Vibration
All vibration specifications assume that the drive is mounted securely in a fixture that does not have fixture
resonances in the frequency test range. The input vibration is applied through the disc drive guide rails of the
device under test. Testing is carried out in the x, y and z axes.
12ST1.2 Series Product Manual, Rev. B
2.8.6.1Operating sweep sine vibration
The following lists the maximum operating sweep sine vibration levels that the drive may experience while
meeting the performance standards specified. It will consist of a forward and backward sweep from 5 Hz to
500
Hz to 5 Hz. The drive will operate without a hard error while being subjected to the following vibration
levels.
5 Hz to 500 Hz @ 2 oct/min1.0 Gs (0 to pk). Maximum displacement may apply below 10 Hz.
2.8.6.2Operating random vibration
The test consists of 30 minutes of random vibration using the power spectral density (PSD) levels specified in
the table below. The vibration test level is 0.67
Gs RMS. The drive will operate without a hard error while being
subjected to the following vibration levels.
Table 4: Operating random vibration profile
Frequency (Hz)G2/Hz
171.1 x E-03
451.1 x E-03
488.0 x E-03
628.0 x E-03
651.0 x E-03
1501.0 x E-03
2005.0 x E-04
5005.0 x E-04
2.8.6.3Nonoperating sweep sine vibration
The following table lists the maximum nonoperating sweep sine vibration levels that the drive may experience
while meeting the performance standards specified. It will consist of a forward and backward sweep from 5 Hz
to 500 Hz to 5 Hz. The drive will not incur any physical damage when subsequently put into operation.
5 Hz to 500 Hz @ 0.5 oct/min5.0 Gs (0 to pk). Maximum displacement may apply below 22 Hz.
ST1.2 Series Product Manual, Rev. B13
2.8.6.4Nonoperating random vibration
The test consists of 15 minutes of random vibration using the power spectral density (PSD) levels specified in
the table below. The vibration test level is 3.01 Gs RMS. The drive will not incur any physical damage when
subsequently put into operation.
Table 5: Nonoperating random vibration profile.
Frequency (Hz)G2/Hz
2.51.0 x E-03
53.0 x E-02
401.8 x E-02
5001.8 x E-02
2.8.6.5Corrosive environment
Seagate electronic drive components pass accelerated corrosion testing equivalent to ten years of exposure to
light industrial environments containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM
B845. However, this accelerated testing cannot duplicate every potential application environment.
Users should use caution exposing any electronic components to uncontrolled chemical pollutants and corrosive chemicals as electronic drive component reliability can be affected by the installationenvironment. The silver, copper, nickel and gold films used in Seagate products are especially sensitive to the presence of sulfide,
chloride, and nitrate contaminants. Sulfur is found to be the most damaging. In addition, electronic components
should never be exposed to condensing water on the surface of the printed circuit board assembly (PCBA) or
exposed to an ambient relative humidity greater than 95 percent. Materials used in cabinet fabrication, such as
vulcanized rubber, that can outgas corrosive compounds should be minimized or eliminated. The useful life of
any electronic equipment may be extended by replacing materials near circuitry with sulfide-free alternatives.
14ST1.2 Series Product Manual, Rev. B
2.9Acoustics
Drive acoustics are measured as overall A-weighted acoustic sound power levels (no pure tones). Discrete
tone penalties are added to the A-weighted sound power (LW) with the following formula only when determin
ing compliance:
LWt(spec) == LW + 0.1Pt + 0.3 < 4.0 (Bels)
where
LW = A-weighted sound power level
pt == Value of discrete tone penalty [==dLt-6.0 (dBA)]
dLt = Tone-to-noise ratio taken in accordance with ISO 7779.
All measurements are consistent with ISO document 7779. Sound power measurements are taken under
essentially free-field conditions over a reflecting plane. For all tests, the drive is oriented with the cover facing
upward.
Note. For seek mode tests, the drive is placed in seek mode only. The number of seeks per second is defined
by the following equation:
(Number of seeks per second = 0.4 / (average latency + average access time)
Table 6: Drive level acoustics
Acoustic mode
IdleOperational
-
2.1 bels (typ)
2.4 bels (max)
2.2 bels (typ)
2.5 bels (max)
2.10Electromagnetic immunity
When properly installed in a representative host system, the drive operates without errors or degradation in
performance when subjected to the radio frequency (RF) environments defined in the following table:
Table 7: Electromagnetic immunity
Performance
TestDescription
Radiated RF immunity80 to 1,000 MHz, 3 V/m,
80% AM with 1 kHz sine
900 MHz, 3 V/m, 50% pulse modulation @ 200
Hz
Electrical fast transient± 1 kV on AC mains, ± 0.5 kV on external I/OBEN 61000-4-4: 95
Nonrecoverable read errors1 per 1014 bits read, max.
Annualized Failure Rate0.4% AFR at 25°C
Load/Unload (LUL) cycles (40°C)300,000 software-controlled power on/off cycles
20,000 hard power on/off cycles
WarrantyPer agreement
16ST1.2 Series Product Manual, Rev. B
2.12Agency certification
2.12.1Safety certification
The drives are recognized in accordance with UL60950-1, CAN/CSA-C22.2 No.60950-1, EN60950 and IEC
60950 as tested by TUV Essen.
2.12.2Electromagnetic compatibility
Hard drives that display the CE mark comply with the European Union (EU) requirements specified in the Electromagnetic Compatibility Directive (89/336/EEC). Testing is performed to the levels specified by the product
standards for Information Technology Equipment (ITE). Emission levels are defined by EN 55022, Class B and
the immunity levels are defined by EN 55024.
Seagate uses an independent laboratory to confirm compliance with the EC directives specified in the previous
paragraph. Drives are tested in representative end-user systems. Although CE-marked Seagate drives comply
with the directives when used in the test systems, we cannot guarantee that all systems will comply with the
directives. The drive is designed for operation inside a properly designed enclosure, with properly shielded I/O
cable (if necessary) and terminators on all unused I/O ports. Computer manufacturers and system integrators
should confirm EMC compliance and provide CE marking for their products.
Korean RRL
If these drives have the Korea Ministry of Information and Communication (MIC) logo, they comply with paragraph 1 of Article 11 of the Electromagnetic Compatibility control Regulation and meet the Electromagnetic
Compatibility (EMC) Framework requirements of the Radio Research Laboratory (RRL) Ministry of Information
and Communication Republic of Korea.
These drives have been tested and comply with the Electromagnetic Interference/Electromagnetic Susceptibility (EMI/EMS) for Class B products. Drives are tested in a representative, end-user system by a Korean-recognized lab.
• EUT name (model numbers): ST68022CF, ST68022FX, ST66022CF, ST66022FX, ST64022CF and
ST64022FX
Certificate numbers:
ST68022CF, ST66022CF and ST64022CFE-H011-05-2175(B)
ST68022FX, ST66022FX and ST64022FXE-H011-05-2175(B)
• Trade name or applicant: Seagate Technology International
• Manufacturing date: May 2005
• Manufacturer/nationality: Seagate Technology International
Australian C-Tick (N176)
If these models have the C-Tick marking, they comply with the Australia/New Zealand Standard AS/NZS3548
1995 and meet the Electromagnetic Compatibility (EMC) Framework requirements of the Australian Communi
cation Authority (ACA).
2.12.3European Union Restriction of Hazardous Substances (RoHS) Directive
Seagate designs its products to meet environmental protection requirements worldwide, including regulations
restricting certain chemical substances. A new law, the European Union Restriction of Hazardous Substances
(RoHS) Directive, will restrict the presence of chemical substances, including Lead (Pb), in electronic products,
effective July 2006. The Directive's requirements have not been finalized. This drive is manufactured with com
ponents and materials that are expected to comply with the RoHS Directive when the Directive takes effect.
-
-
ST1.2 Series Product Manual, Rev. B17
2.12.4China Restriction of Hazardous Substances (RoHS) Directive
2.12.4
This product has an Environmental Protection Use Period (EPUP) of 20 years. The following
table contains information mandated by China's "Marking Requirements for Control of Pollution
Caused by Electronic Information Products" Standard.
"O" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is lower
than the threshold defined by the China RoHS MCV Standard.
"X" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is over
the threshold defined by the China RoHS MCV Standard.
“
X "表示该部件(于同类物品程度上)所含的危险和有毒物质超出中国RoHS MCV标准所定义的门槛值。
2.12.5FCC verification
These drives are intended to be contained solely within a personal computer or similar enclosure (not attached
as an external device). As such, each drive is considered to be a subassembly even when it is individually mar
keted to the customer. As a subassembly, no Federal Communications Commission verification or certification
of the device is required.
Seagate Technology LLC has tested this device in enclosures as described above to ensure that the total
assembly (enclosure, disc drive, motherboard, power supply, etc.) does comply with the limits for a Class B
computing device, pursuant to Subpart
likely to result in interference to radio and television reception.
Radio and television interference. This equipment generates and uses radio frequency energy and if not
installed and used in strict accordance with the manufacturer’s instructions, may cause interference to radio
and television reception.
This equipment is designed to provide reasonable protection against such interference in a residential installation. However, there is no guarantee that interference will not occur in a particular installation. If this equipment
does cause interference to radio or television, which can be determined by turning the equipment on and off,
you are encouraged to try one or more of the following corrective measures:
• Reorient the receiving antenna.
• Move the device to one side or the other of the radio or TV.
• Move the device farther away from the radio or TV.
• Plug the computer into a different outlet so that the receiver and computer are on different branch outlets.
J, Part 15 of the FCC rules. Operation with noncertified assemblies is
-
18ST1.2 Series Product Manual, Rev. B
If necessary, you should consult your dealer or an experienced radio/television technician for additional suggestions. You may find helpful the following booklet prepared by the Federal Communications Commission:
How to Identify and Resolve Radio-Television Interference Problems. This booklet is available from the Super
intendent of Documents, U.S. Government Printing Office, Washington, DC 20402. Refer to publication number 004-000-00345-4.
-
ST1.2 Series Product Manual, Rev. B19
20ST1.2 Series Product Manual, Rev. B
3.0Configuring and mounting the drive
This section contains the specifications and instructions for configuring and mounting the drive.
3.1Handling and static discharge precautions
After unpacking, and before installation, the drive may be exposed to potential handling and electrostatic discharge (ESD) hazards. Observe the following standard handling and static-discharge precautions:
Caution:
• Keep the drive in the electrostatic discharge (ESD) bag until you are ready for installation to limit the drive’s
exposure to ESD.
• Before handling the FX interface model drives (ST68022FX, ST66022FX and ST64022FX), put on a grounded
wrist strap, or ground yourself frequently by touching the metal chassis of a computer that is plugged into a
grounded outlet. Wear a grounded wrist strap throughout the entire installation procedure.
• Handle the drive only by its edges or frame.
Figure 8.ST1.2 Series proper handling example
• The drive is fragile—handle it with care. Do not press down on the drive top cover or attempt to use a pen to
write on the drive’s label.
• Do not apply more than 1.5 kg of force to the top cover.
Figure 9.ST1.2 Series improper handling example
• Always rest the FX interface model drives (ST68022FX, ST66022FX and ST64022FX) on a padded, antistatic
surface until you mount it in the system.
ST1.2 Series Product Manual, Rev. B21
• Do not remove the factory-installed labels from the drive or cover them with additional labels. Removal voids
the warranty. Some factory-installed labels contain information needed to service the drive. Other labels are
used to seal out dirt and contamination.
• Store drive in the provided protective casing when not in use. (CF interface)
• For the FX interface model drives (ST68022FX, ST66022FX and ST64022FX), turn the power off before
installing or removing the drive.
• Do not cover the breather hole with any type of label, sticker, or impede the flow of air at any time.
3.2Drive installation
See figures 10 and 11 for drive mechanical dimensions.
Follow these installation precautions when inserting the drive:
• Follow instructions for the installation of data storage devices, provided with your device’s user manual.
• Do not obstruct the breather hole on the drive (see Figure 4).
• Handle the drive only by its edges or frame or designated finger grip region during mounting (see Figure 4).
Recommended case
FINGER GRIP
G
temp. measurement location
F
Breather Hole
Do not cover
E
Bottom View
C
Bottom
H
L
Pin 1
Top
Pin 50
B
D
N
J
M
A
K
Figure 10.CF model mechanical dimensions—top, side and end view
CF Dimension Table
Inches
A
0.197
± .004
B
1.433
± .006
C
1.685
± .004
D
1.015
± .003
E
1.152
± .010
F
0.299
± .010
G
0.394
min
H
0.063
± .002
J
0.040
± .003
K
0.039
± .002
L
0.039
± .004
M
0.065
± .004
N
0.243
± .004
Millimeters
5.00
36.40
42.80
2x 25.78
29.25
7.61
10.00
1.60
2x 1.01
1.00
2x 1.00
1.65
2x 6.16
± .10
± .15
± .10
± .07
± .25
± .25
min
± .05
± .07
± .05
min
± .10
± .10
22ST1.2 Series Product Manual, Rev. B
FINGER GRIP
Recommended case
G
temp. measurement location
A
Breather Hole
Do not cover
E
Bottom View
R
Pin 45
S
P
C
Bottom
H
Top
Pin 1
J
L
F
B
D
T
K
M
Figure 11.FX model mechanical dimensions—top, side and end view
FX Dimension Table
Inches
A
0.197
± .004
B
1.433
± .006
C
1.685
± .004
D
1.015
± .003
E
1.152
± .010
F
0.299
± .010
G
0.394
min
H
0.063
± .002
J
0.040
± .003
K
0.039
± .002
L
0.039
± .004
M
0.065
± .004
P
0.906
± .003
R
0.669
± .020
S
0.414
± .020
T
0.130
± .004
Millimeters
5.00
36.40
42.80
2x 25.78
29.25
7.61
10.00
1.60
2x 1.01
1.00
2x 1.00
1.65
23.00
17.00
10.51
2X 3.30
± .10
± .15
± .10
± .07
± .25
± .25
min
± .05
± .07
± .05
min
± .10
± .07
± .50
± .50
± .10
ST1.2 Series Product Manual, Rev. B23
24ST1.2 Series Product Manual, Rev. B
4.0Interface description
These drives use the industry-standard ATA task file interface that supports 16-bit data transfers. It supports
ATA programmed input/output (PIO) modes 0–4; multiword DMA modes 0–2, and Ultra DMA modes 0–2. The
drive also supports the use of the IORDY signal to provide reliable high-speed data transfers.
For detailed information about the CompactFlash interface, refer to CF+ and CompactFlash Spec Rev 2.0.
4.1Connector interface signals and connector pins
The following table summarizes the signals on the CompactFlash interface connector. For a detailed description of these signals, refer to CF+ and CompactFlash Spec Rev 2.0.
[1]These signals are required only for 16 bit accesses and not required when installed in 8 bit systems.
Devices should allow for 3-state signals not to consume current.
[2]The signal should be grounded by the host.
[3]The signal should be tied to VCC by the host.
[4]The mode is optional for CF+ Cards, but required for CompactFlash Storage Cards.
[5]The -CSEL signal is ignored by the card in PC Card modes. However, because it is not pulled up on the
card in these modes, it should not be left floating by the host in PC Card modes. In these modes, the pin
should be connected by the host to PC Card A25 or grounded by the host.
[6]If DMA operations are not used, the signal should be held high or tied to VCC by the host. For proper
operation in older hosts: while DMA operations are not active, the card shall ignore this signal, including a
floating condition.
26ST1.2 Series Product Manual, Rev. B
4.1.1Flex interface connector signals
The following table summarizes the signal on the Seagate Flex interface connector. For a detailed description
of these signals, refer to Draft ATA-7 Standard.
Table 9: Flex interface connector signals
PinSignalDescription
1GroundGround
2DD11Data bus bit 11
3DD10Data bus bit 10
4DD8Data bus bit 8
5RESET-Reset
6DD14Data bus bit
7DD15Data bus bit
8IORDY-I/O Ready
DMA ready during Ultra DMA data-in bursts
Data strobe during Ultra DMA data-out bursts
9INTRQInterrupt request
10DA1Device address bit 1
11GROUNDGround
12DA2Device address bit 2
13DA0Device address bit 0
14DIOW-I/O Write
Stop during Ultra DMA data bursts
15GROUNDGround
16DIOR-I/O Read
DMA ready during Ultra DMA data-in bursts
Data strobe during Ultra DMA data-out bursts
17GROUNDGround
18PDIAG-Passed diagnostics
19GROUNDGround
20DASP-Device active or slave present
21GROUNDGround
22CS1-Chip select 0
23GROUNDGround
ST1.2 Series Product Manual, Rev. B27
Table 9: Flex interface connector signals
24DD9Data bus bit 9
25GROUNDGround
26DD13Data bus bit 13
27CSELCable select
28DD12Data bus bit 12
29DD7Data bus bit 7
30DD6Data bus bit 6
31DD5Data bus bit 5
32DD4Data bus bit 4
33DD3Data bus bit 3
34DD2Data bus bit 2
35GROUNDGround
36DD1Data bus bit 1
37DD0Data bus bit 0
38DMARQDMA request
39DMACK-DMA Acknowledge
40IOCS16-Data transfer size is one word per transfer cycle
41CS0Chip select 0
42Reserved 1Reserved for device use only
43Reserved 2Reserved for device use only
44VCC +3.3V3.3V Voltage supply to device
45VCC +3.3V3.3V Voltage supply to device
28ST1.2 Series Product Manual, Rev. B
4.1.2Supported ATA commands
The following table lists ATA-standard commands that the drive supports. For a detailed description of the CF
commands, refer to CF+ and CompactFlash Spec Rev 2.0.
Table 10: Supported commands
Command nameCommand code (in hex)
Does command cause drive to
transition to active mode?
ATA-standard commands
Check Power Mode98
Download Microcode92
Erase SectorC0
Execute Device Diagnostics90
Flush CacheE7
Format Track (Legacy)50
Identify DeviceEC
Idle97
Idle Immediate95
H, E5H
H (for FX models only)
H
H
H
H
H
H, E3H
H, E1H
NOP00hX
Read BufferE4
Read DMAC8
Read MultipleC4
H
H, C9H
H
Read Native Max AddressF8hX
[1]
X
X
X
X
X
X
X
X
Read Sectors 20
Read Verify Sectors 40
Recalibrate10
Request Sense03
Seek7X
Set Drive Parameters91
Set FeaturesEF
H, 21H
H, 41H
H
H
H
H
H
Set Max AddressF9hX
Set Multiple ModeC6
Sleep99
H
H, E6H
X [2]
SmartB0hX
Standby96
Standby Immediate94
Translate Sector87
Wear LevelF5
Write BufferE8
H, E2H
H, E0H
H
H
H
X
X
X
X
X
X
X
X
X
X
X
X
ST1.2 Series Product Manual, Rev. B29
Table 10: Supported commands
Command nameCommand code (in hex)
Write DMACA
Write MultipleC5
Write Multiple w/o EraseCD
Write Sectors30
Write Sector w/o Erase38
Write Verify3C
H, CBH
H
H
H, 31H
H
H
Does command cause drive to
transition to active mode? [1]
X
X
X
X
X
X
ATA-standard power-management commands
Check Power Mode98H or E5
Idle97H or E3
Idle Immediate95H or E1
Sleep99H or E6
Standby96H or E2
Standby Immediate94H or E0
H
H
H
H
H
H
X
X
[1]‘X’ indicates: If the drive is in Standby mode, it will cause the drive to spin up to Active mode in order to
execute the command.
[2]Except 0Ah, 8Ah and DFh.
30ST1.2 Series Product Manual, Rev. B
4.1.3Identify Device command
The Identify Device command (command code ECH) transfers information about the drive to the host following
power up. The data is organized as a single 512-byte block of data, whose contents are shown in the table on
page 31. All reserved bits or words should be set to zero. Parameters listed with an “x” are drive-specific or
vary with the state of the drive. See Section 2.0 on page 3 for default parameter settings.
The following commands contain drive-specific features that may not be included in the Draft ATA-7 Standard.
WordATA specificationCF specificationValueValu eVa lu e
CF Mem/IOCF TruIDEFX (Flex)
Configuration information:
• Bit 15: 0 = ATA; 1 =
ATAPI
0
• Bit 7: removable media
• Bit 6: removable controller
• Bit 0: reserved
General Config848A
H
848A
H
0C5A
H
1Obsolete
2Special ConfigReserved0000
Default number of
cylinders
16,38316,38316,383
H
0000
H
0000
3ObsoleteDefault number of heads161616
4Retired
5Retired
6Obsolete
7Reserved for CF Spec
8Reserved for CF Spec
9RetiredObsolete0000
Serial number:
10–19
(20 ASCII characters,
0000
= none)
H
20RetiredObsolete0000
21RetiredObsolete0000
22ObsoleteNumber of ECC bytes0004
Number of unformatted
bytes/track (Obsolete)
Number of unformatted
bytes/sector (Obsolete)
Default number of
sectors/track
Number of sectors per
card (MSW)
Number of sectors per
card (LSW)
Serial number:
(Right justified)
0000
H
0000
H
003F
H
xxxx xxxx
H
H
0000
H
0000
H
003F
H
xxxx xxxx
0000
H
H
0000
0000
003F
xxxx xxxx
0000
ASCIIASCIIASCII
H
H
H
0000
0000
0004
H
H
H
0000
0000
0004
Firmware revision
23–26
(8 ASCII character string,
padded with blanks to end
Firmware revisionx.xxx.xxx.xx
of string)
H
H
H
H
H
H
H
H
H
27–46
Drive model number:
(40 ASCII characters,
padded with blanks to end
of string)
Drive model number (left
justified) big endian byte
order in word
Time required for
enhanced security erase
complete
Advanced power management value
Time required for security
erase complete
Time required for
enhanced security erase
complete
Advanced power management value
0000
0000
4040
92–105Reserved0000
106
Physical / Logical Sector
size
H
H
H
H
H
H
H
H
H
4000
7068
100C
4000
0007
0000
0000
4040
0000
6001
H
H
H
H
H
H
H
H
H
H
4000
7068
100D
4000
0007
0000
0000
4040
0000
6001
H
H
H
H
H
H
H
H
H
H
107–127Reserved0000
128Security statusSecurity status0000
129–159Seagate-reservedSeagate-reserved0000
160CFA power mode 1Power Level Description814A
161
162
163–175ATA-reserved
Reserved for assignment
by the CFA
Key management
schemes supported
Reserved for assignment
by the CFA
0000
0000
0000
176–255ReservedReserved0000
H
H
H
H
H
H
H
H
0000
0000
0000
814A
0000
0000
0000
0000
H
H
H
H
H
H
H
H
0000
0000
0000
814A
0000
0000
0000
0000
H
H
H
H
H
H
H
H
ST1.2 Series Product Manual, Rev. B33
Note.See the bit descriptions below for words 63, 88, 93 and 94 of the Identify Drive data:
Description (if bit is set to 1)
BitWord 63
0Multiword DMA mode 0 is supported.
1Multiword DMA mode 1 is supported.
2Multiword DMA mode 2 is supported.
8Multiword DMA mode 0 is currently active.
9Multiword DMA mode 1 is currently active.
10Multiword DMA mode 2 is currently active.
BitWord 88
0Ultra DMA mode 0 is supported.
1Ultra DMA mode 1 is supported.
2Ultra DMA mode 2 is supported.
8Ultra DMA mode 0 is currently active.
9Ultra DMA mode 1 is currently active.
10Ultra DMA mode 2 is currently active.
34ST1.2 Series Product Manual, Rev. B
4.1.4Set Features command
This command controls the implementation of various features that the drive supports. When the drive receives
this command, it sets BSY, checks the contents of the Features register, clears BSY and generates an inter
rupt. If the value in the register does not represent a feature that the drive supports, the command is aborted.
Power-on default has the read look-ahead and write caching features enabled. The acceptable values for the
Features register are defined as follows:
Table 11: Features register values
Availability in Interface Mode
-
Feature Description
01
02
03
H
H
H
Enable 8-bit data transfer; Only in True IDE mode.
Enable Write Cache.
Used for Set transfer mode Command.
Sector Count register values:
00
01
08
09
Set PIO mode to default (PIO mode 2).
H
Set PIO mode to default and disable IORDY (PIO mode 2).
H
PIO mode 0
H
PIO mode 1
H
0AHPIO mode 2
0B
H
PIO mode 3
0CHPIO mode 4 (default)
20
Multiword DMA mode 0
H
CF Memory
or I/O
NoYe s
YesYes
YesYes
YesYes
YesYes
YesYes
YesYes
YesYes
YesYes
YesYes
NoYe s
TrueI DE
or IDE
05
0A
44
55
66
21
22
40
41
42
H
H
H
H
H
Enable advanced power management
Enable Power Level 1 commands
Product Specific ECC bytes (XX bytes) apply on Read/Write Long Command
Disable read look-ahead (read cache) feature.
Disable Power On Reset (POR) establishment of defaults at Soft Reset.
TPCE_MI :(Miscellaneous Features Field)
Max Twin Card (bit0..2) = 0
Audio (bit3) = 0
Read Only (bit4) = 0
Power Down (bit5) = 1 (Support Power Down Mode)
42ST1.2 Series Product Manual, Rev. B
For PC card ATA I/O in contiguous memory mode in 3.3V operation (default)
0C6H1BHCISTPL_CFTABLE_ENTRY: (16 Bit PCCard Configuration Table Entry Tuple)
0C8H07HTPCE_LINK = 07h bytes
TPCE_INDX :(Configuration Table Index Byte)
0CAH01H
0CCH01H
0CEH21H
0D0HB5H
Config Entry Number (bit0..5) = 01 (I/O and Memory Mode)
Default (bit6) = 0
Interface (bit7) = 0 (Interface Field Exist)
TPCE_IO: (I/O Space Address required for this configuration)
I/O Address Lines (bit0..4) =A (1K byte boundary)
Bus 16/8 (bit5,6) = 3 (Support 16/8 bit access)
Range (bit7) = 1 (See I/O Range Description Byte)
TPCE_IO: I/O Range Description Byte
# of address range - 1 (bit0..3) = 1 (#of field = 2)
Size Of Address (bit4,5) = 2 (2 byte address)
Size Of Length (bit6,7) = 1 (1 byte length)
44ST1.2 Series Product Manual, Rev. B
TPCE_IR: (Interrupt Request Description Structure)
IRQ Line 0..15 (bit0..3) = E
0FEHEEH
100H20H
For PC card ATA I/O primary mode (1F0-1F7, 3F6, 3F7) in 3.3V operation (alternative)
102H1BHCISTPL_CFTABLE_ENTRY: (16 Bit PC Card Configuration Table Entry Tuple)
TPCE_MI: (Miscellaneous Features Field)
Max Twin Card (bit0..2) = 0
Audio (bit3) = 0
Read Only (bit4) = 0
Power Down (bit5) = 1 (Support Power Down Mode)
TPCE_INDX: (Configuration Table Index Byte)
Config Entry Number (bit0..5) = 02 (Primary I/O Mode)
Default (bit6) = 0
Interface (bit7) = 0 (Interface Field Exist)
TPCE_IO: (I/O Space Address required for this configuration)
I/O Address Lines (bit0..4) =A (1K byte boundary)
Bus 16/8 (bit5,6) = 3 (Support 16/8 bit access)
Range (bit7) = 1 (See I/O Range Description Byte)
TPCE_IO: I/O Range Description Byte
# of address range - 1 (bit0..3) = 1 (#of field = 2)
Size Of Address (bit4,5) = 2 (2 byte address)
Size Of Length (bit6,7) = 1 (1 byte length)
12EH70HTPCE_IO: I/O Address Range Description Field #1 Address = 170
46ST1.2 Series Product Manual, Rev. B
130H01H
132H07HTPCE_IO: I/O Address Block Length = 8
134H76HTPCE_IO: I/O Address Range Description Field #2 Address = 376
136H03H
138H01HTPCE_IO: I/O Address Block Length = 2
TPCE_IR: (Interrupt Request Description Structure)
IRQ Line 0..15 (bit0..3) = E
13AHEEH
13CH20H
For PC Card ATA I/O Secondary Mode (170-177, 377, 377) in 3.3V Operation (Default)
13EH1BHCISTPL_CFTABLE_ENTRY (16 Bit PC Card Configuration Table Entry Tuple)
TPCE_MI: (Miscellaneous Features Field)
Max Twin Card (bit0..2) = 0
Audio (bit3) = 0
Read Only (bit4) = 0
Power Down (bit5) = 1 (Support Power Down Mode)
TPCE_INDX: (Configuration Table Index Byte)
142H03H
144H01H
146H21H
148HB5H
14AH1EHTPCE_PD: Extension = 1Eh =+0.30 - - +
Config Entry Number (bit0..5) = 03 (Secondary I/O Mode)
Default (bit6) = 0
Interface (bit7) = 0 (Interface Field Exist)
www.seagate.com for information about Seagate products and services. Worldwide support is available 24
hours daily by e-mail for your questions.
Presales Support: www.seagate.com/support/email/email_presales.html or Presales@Seagate.com
Technical Support: www.seagate.com/support/email/email_disc_support.html or DiscSupport@Seagate.com
mySeagate
my.seagate.com is the industry’s first Web portal designed specifically for OEMs and distributors. It provides
self-service access to critical applications, personalized content and the tools that allow our partners to man
age their Seagate account functions. Submit pricing requests, orders and returns through a single, passwordprotected Web interface—anytime, anywhere in the world.
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reseller.seagate.com supports Seagate resellers with product information, program benefits and sales tools.
You may register for customized communications that are not available on the web. These communications
contain product launch, EOL, pricing, promotions and other channel-related information. To learn more about
the benefits or to register, go to
Automated phone services
reseller.seagate.com, any time, from anywhere in the world.
-
SeaFONE® (1-800-SEAGATE) is the Seagate toll-free number (1-800-732-4283) to access our automated
directory assistance for Seagate Service Center support options. International callers can reach this service by
dialing +1-405-324-4770.
Seagate Service Centers
Presales Support
Our Presales Support staff can help you determine which Seagate products are best suited for your specific
application or computer system, as well as drive availability and compatibility.
Technical Support
If you need help installing your drive, consult your system's documentation or contact the dealer's support services department for assistance specific to your system. Seagate technical support is also available to assist
you online at
tion and your drive’s “ST” model number available.
SeaTDD™ (+1-405-324-3655) is a telecommunications device for the deaf (TDD). You can send questions or
comments 24 hours daily and exchange messages with a technical support specialist during normal business
hours for the call center in your region.
support.seagate.com or through one of our call centers. Have your system configuration informa-
ST1.2 Series Product Manual, Rev. B49
Customer Service Operations
Warranty Service
Seagate offers worldwide customer support for Seagate drives. Seagate distributors, OEMs and other direct
customers should contact their Seagate Customer Service Operations (CSO) representative for warrantyrelated issues. Resellers or end users of drive products should contact their place of purchase or one of the
Seagate CSO warranty centers for assistance. Have your drive’s “ST” model number and serial number avail
able.
Data Recovery Services
Seagate offers data recovery services for all formats and all brands of storage media. Our Data Recovery Services labs are currently located in North America. To get a free quick quote or speak with a case management
representative, call 1-800-475-0143. Additional information, including an online request form and data loss pre
vention resources, is available at www.datarecovery.seagate.com.
Authorized Service Centers
In some locations outside the US, you can contact an Authorized Service Center for service.
USA/Canada/Latin America support services
Seagate Service Centers
Presales Support
Call centerToll-freeDirect dialFAX
Americas1-877-271-3285
1
+1-405-324-4730
1
+1-405-324-4704
-
-
Technical Support
Call centerToll-freeDirect dialFAX
Americas1-800-SEAGATE
2
+1-405-324-4700
2
+1-405-324-3339
Customer Service Operations
Warranty Service
Call centerToll-freeDirect dialFAX / E-mail
USA, Canada, Mexico and 1-800-468-3472
Latin America
Brazil
Jabil Industrial Do Brasil—+55-11-4191-4761+55-11-4191-5084
LTD A
4
Data Recovery Services
Call centerToll-freeDirect dialFAX
USA, Canada, 1-800-475-01435+1-905-474-21621-800-475-0158
and Mexico+1-905-474-2459
1
Hours of operation are 8:00 A.M. to 11:45 A.M. and 1:00 P.M. to 6:00 P.M., Monday through Friday (Central time).
2
Hours of operation are 8:00 A.M. to 8:00 P.M., Monday through Friday (Central time).
3
Hours of operation are 8:00 A.M. to 5:00 P.M., Monday through Friday (Central time).
4
Authorized Service Center
5
Hours of operation are 8:00 A.M. to 8:00 P.M., Monday through Friday, and 9:00 A.M. to 5:00 P.M., Saturday (Eastern time).
3
—+1-956-664-4725
SeagateRMA.br@jabil.com
50ST1.2 Series Product Manual, Rev. B
European support services
For presales and technical support in Europe, dial the Seagate Service Center toll-free number for your specific location. If your location is not listed here, dial our presales and technical support call center at +1-405324-4714 from 8:00
The presales and technical support call center is located in Oklahoma City, USA.
For European warranty service, dial the toll-free number for your specific location. If your location is not listed
here, dial our European CSO warranty center at +31-20-316-7222 from 8:30
time) Monday through Friday. The CSO warranty center is located in Amsterdam, The Netherlands.
A.M. to 11:45 A.M. and 1:00 P.M. to 5:00 P.M. (Central Europe time) Monday through Friday.
A.M. to 5:00 P.M. (Central Europe
Seagate Service Centers
Toll-free support numbers
Call centerPresales and Technical SupportWarranty Service
For presales and technical support in Africa and the Middle East, dial our presales and technical support call
center at +1-405-324-4714 from 8:00
day through Friday. The presales and technical support call center is located in Oklahoma City, USA.
For warranty service in Africa and the Middle East, dial our European CSO warranty center at +31-20-3167222 from 8:30
3513. The CSO warranty center is located in Amsterdam, The Netherlands.
A.M. to 5:00 P.M. (Central Europe time) Monday through Friday, or send a FAX to +31-20-653-
A.M. to 11:45 A.M. and 1:00 P.M. to 5:00 P.M. (Central Europe time) Mon-
ST1.2 Series Product Manual, Rev. B51
Asia/Pacific support services
For Asia/Pacific presales and technical support, dial the toll-free number for your specific location. The Asia/
Pacific toll-free numbers are available from 6:00
A.M. to 10:45 A.M. and 12:00 P.M. to 6:00 P.M. (Australian East-
ern time) Monday through Friday, except as noted. If your location is not listed here, direct dial one of our technical support locations.
Warranty service is available from 9:00 A.M. to 6:00 P.M. April through October, and 10:00 A.M. to 7:00 P.M.
November through March (Australian Eastern time) Monday through Friday.
Seagate Service Centers
Call centerToll-freeDirect dialFAX
Australia1800-14-7201——
China (Mandarin)
Hong Kong800-90-0474——
Hong Kong (Cantonese)
2, 4
India
Indonesia001-803-1-003-2165——
3, 4
Japan
3, 4
Korea
Malaysia1-800-80-2335——
New Zealand0800-443988——
Singapore800-1101-150—+65-6488-7525
Taiwan (Mandarin)
Thailand001-800-11-0032165——
Hours of operation are 8:30 A.M. to 5:30 P.M., Monday through Friday (Australian Western time).
2
Hours of operation are 9:00 A.M. to 6:00 P.M., Monday through Saturday.
3
Hours of operation are 9:30 A.M. to 6:30 P.M., Monday through Friday.
4
Authorized Service Center
52ST1.2 Series Product Manual, Rev. B
ST1.2 Series Product Manual, Rev. B53
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Thank you for your time and comments.
54ST1.2 Series Product Manual, Rev. B
Index
A
acoustics 15
Active mode 10
agency certification (regulatory) 17
altitude 11
ambient conditions 3
ambient temperature 11
areal density 1, 6
ATA-standard commands 29
Australian C-Tick 17
B
BPI 6
buffer 1, 6
EMC compliance 17
enclosures 18
environmental specifications 11
EPRML 1
error-correction algorithms 1
errors 16
EU RoHS directive 17
European Union 17
Execute Device Diagnostics 29
F
FCC verification 18
Features register 35
feedback survey 54
Flush Cache 29
formatted capacity 5
frequency 15
FX interface connector signals 27
C
cache 1, 6
card information structure 37
case temperature 11
CE mark 17
certification 17
CF+ interface connector signals 25
Check Power Mode 30
China RoHS directive 18
CIS 37
commands 29
compliance 17
conducted noise9
conducted RF immunity 15
configuring the drive 21
connector pins 25
consumption 8
Corrosive environment 14
C-Tick 17
current profile 8
D
DC power 7, 8
density 6
diagnostic software 1
disclaimer 2
Download Microcode 29
drive care 2
drive self-test 1