Seagate Spinpoint M8 Product Manual

M8 Product Manual
2.5” Hard Disk Drive
March 6, 2013. Rev 2.6
© 2013 Seagate Technology LLC. All rights reserved. Seagate and Seagate Technology are registered trademarks of Seagate Technology LLC in the United States and/or other countries. Momentus is either a trademark or registered trademark of Seagate Technology LLC or one of its affiliated companies in the United States and/or other countries. All other trademarks or registered trademarks are the property of their respective owners. When referring to drive capacity, one gigabyte, or GB, equals one billion bytes and one terabyte, or TB, equals one trillion bytes. Your computer’s operating system may use a different standard of measurement and report a lower capacity. In addition, some of the listed capacity is used for formatting and other functions, and thus will not be available for data storage. Actual data rates may vary depending on operating environment and other factors. The export or re-export of hardware or software containing encryption may be regulated by the U.S. Department of Commerce, Bureau of Industry and Security (for more information, visit www.bis.doc.gov), and controlled for import and use outside of the U.S. Seagate reserves the right to change, without notice, product offerings or specifications.
Spinpoint M8 Product Manual REV 2.6
TABLE OF
CONTENTS
CHAPTER 1
SCOPE .............................................................................................................................1
1.1 USER DEFINITION
..............................................................................................................................1
1.2 M
ANUAL ORGANIZATION
..................................................................................................................1
1.3 SATA
.................................................................................................................................................2
1.4 R
EFERENCE
........................................................................................................................................2
CHAPTER 2 DESCRIPTION
..............................................................................................................3
2.1 INTRODUCTION
..................................................................................................................................3
2.2 K
EY FEATURES
..................................................................................................................................4
2.3 S
TANDARDS AND REGULATIONS
........................................................................................................5
2.4 H
ARDWARE REQUIREMENTS
.............................................................................................................5
CHAPTER 3 SPECIFICATIONS
........................................................................................................6
3.1 SPECIFICATION SUMMARY
................................................................................................................6
3.2 P
HYSICAL SPECIFICATIONS
...............................................................................................................7
3.3 L
OGICAL CONFIGURATIONS
..............................................................................................................7
3.4 P
ERFORMANCE SPECIFICATIONS
......................................................................................................8
3.5 P
OWER CONSUMPTION
......................................................................................................................9
3.6 E
NVIRONMENTAL SPECIFICATIONS
.................................................................................................10
3.7 R
ELIABILITY SPECIFICATIONS
........................................................................................................12
CHAPTER 4
INSTALLATION..........................................................................................................13
4.1 SPACE
R
EQUIREMENTS
....................................................................................................................13
4.2 U
NPACKING INSTRUCTIONS
.............................................................................................................14
4.3 M
OUNTING
.......................................................................................................................................14
4.3.1
Orientation......................................................................................................................15
4.3.2 Ventilation
......................................................................................................................16
4.4 C
ABLE CONNECTORS
.......................................................................................................................16
4.4.1 SATA Connectivity
..........................................................................................................17
4.5 D
RIVE INSTALLATION
......................................................................................................................21
CHAPTER 5 DISK DRIVE
OPERATION........................................................................................22
5.1 HEAD / DISK ASSEMBLY (HDA)
......................................................................................................22
5.1.1 Base Casting Assembly
...................................................................................................22
5.1.2 DC Spindle Motor
Assembly...........................................................................................22
5.1.3 Disk Stack Assembly
.......................................................................................................24
5.1.4 Head Stack
Assembly ......................................................................................................24
5.1.5 Voice Coil Motor an
d Actuator Latch
Assemblies ..........................................................24
5.1.6 Air Filtration
System.......................................................................................................24
5.1.7 Load/Unload
Mechanism................................................................................................24
5.2 D
RIVE ELECTRONICS
.......................................................................................................................25
5.2.1 Digital Signal Process and Interface Controller
............................................................25
5.2.2 Disk Controller
...............................................................................................................25
5.2.2.1 The Host Interface Control Block .............................................................................................. 27
5.2.2.2
The Buffer Control Block .......................................................................................................... 27
5.2.2.3 The Disk Control Block ............................................................................................................. 28
5.2.2.4 The Disk LDPC Control Block .................................................................................................. 28
5.2.2.5 Frequency Synthesizer ............................................................................................................... 28
5.2.2.6 Power Management...........................
......................................................................................... 29
5.2.3 Read/Write
IC .................................................................................................................29
5.2.3.1 Time Base Generator.................................................................................................................. 29
5.2.3.2 Automatic Gain Control ............................................................................................................. 29
5.2.3.3 Asymmetry Correction Circuitry (ASC) ....................................................................................
29
5.2.3.4 Analog Anti-Aliasing Low Pass Filter ....................................................................................... 30
5.2.3.5 Analog to Digital Converter (ADC) and FIR ............................................................................. 30
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5.3 SERVO SYSTEM
................................................................................................................................31
5.4 R
EAD AND WRITE OPERATIONS
......................................................................................................31
5.4.1 The Read
Channel...........................................................................................................31
5.4.2 The Write
Channel ..........................................................................................................32
5.5 F
IRMWARE FEATURES
.....................................................................................................................32
5.5.1 Read Caching
.................................................................................................................32
5.5.2 Write
Caching .................................................................................................................33
5.5.3 Defect Management
........................................................................................................34
5.5.4 Automatic Defect Allocation
...........................................................................................34
5.5.5
SMART............................................................................................................................34
5.5.6 APM
...............................................................................................................................34
CHAPTER 6 SATA II INTERFACE
.................................................................................................35
6.1 INTRODUCTION
................................................................................................................................35
6.1.1 SATA Terminology..................................................................................................... ...35
6.2 P
HYSICAL INTERFACE
.....................................................................................................................37
6.3 S
IGNAL SUMMARY
...........................................................................................................................37
6.3.1 Signal
Descriptions.........................................................................................................37
6.3.2 I/O Register - Address
....................................................................................................38
6.3.3 Control Block Reg
ister Descriptions
..............................................................................38
6.3.3.1 Alternate Status Register (ex. 3F6h) .......................................................................................... 38
6.3.3.2 Device Control Register (ex. 3F6h)............................................................................................ 39
6.3.4 Command Block Register Descriptions
..........................................................................39
6.3.4.1 Data Register (Ex. 1F0h)............................................................................................................ 39
6.
3.4.2 Features Register and Feature Extended Register (Ex. 1F1h) .................................................... 39
6.3.4.3 Sector Number Register and Sector Number Extended Register (Ex. 1F3h) .............................. 39
6.3.4.4 Error Register (Ex. 1F1h) ........................................................................................................... 39
6.3.4.5 Sector Count Register and Sector Count Extended Register (Ex. 1F2h) .................................... 40
6.3.4.6 Cylinder High Register and Cylinder High Extended Register (Ex. 1F5h) ................................ 40
6.3.4.7 Cylinder Low Re
gister and Cylinder Low Extended Register (Ex. 1F4h) .................................. 40
6.3.4.8 Command Register (Ex. 1F7h)................................................................................................... 40
6.3.4.9 Device Register (Ex. 1F6h) ........................................................................................................ 40
6.3.4.10 Status Register (Ex. 1F7h) ......................................................................................................... 41
CHAPTER 7 SATA II FEATURE
SET .............................................................................................42
7.1 DEVICE ACTIVITY SIGNAL
..............................................................................................................42
7.2 S
TAGGERED SPIN-UP DISABLE CONTROL
.......................................................................................42
7.3 A
UTO-ACTIVATE IN DMA SETUP FIS
............................................................................................42
7.4 N
ATIVE COMMAND QUEUING (NCQ)
.............................................................................................42
7.5 P
HY. EVENT COUNTERS
..................................................................................................................43
7.6 S
OFTWARE SETTINGS PRESERVATION
............................................................................................44
7.7 SATA P
OWER MANAGEMENT
.........................................................................................................44
CHAPTER 8 ATA COMMAND DESCRIPTIONS
..........................................................................45
8.1 COMMAND
T
ABLE
............................................................................................................................45
8.2 C
OMMAND DESCRIPTIONS
...............................................................................................................47
8.2.1 Check Power Mode
(E5h)...............................................................................................47
8.2.2 Download Micro Code
(92h) ..........................................................................................47
8.2.3 Device Configuration Overlay
(B1h) ..............................................................................47
8.2.4 Execute Device Diagnostics
(90h) ..................................................................................49
8.2.5 Flush Cache (E7h, EAh:
extended).................................................................................49
8.2.6 F
ormat Track (50h)
........................................................................................................49
8.2.7 Identify Device (ECh)
.....................................................................................................49
8.2.8 Idle
(E3h) ........................................................................................................................55
8.2.9 Idle Immediate (E1h)
......................................................................................................55
8.2.10 Initialize Device Parameters
(91h) .................................................................................56
8.2.11 NOP
(00h).......................................................................................................................56
8.2.12 Read Buffer
(E4h) ...........................................................................................................56
8.2.13 Read DMA (C8h,
25h:extended).....................................................................................56
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8.2.14 Read FPDMA Queued
(60h)...........................................................................................56
8.2.15 Read Log Extended
(2Fh) ...............................................................................................57
8.2.16 Read Long (22h)
.............................................................................................................57
8.2.17 Read Multiple Command (C4h,
29h:extended)...............................................................57
8.2.18 Read Native Max Address (F8h, 27h :extended)
.........................................................58
8.2.19 Read Sector(s) (20h, 24h:
extended)...............................................................................58
8.2.20 Read Verify Sector(s) (40h, 41h :extended)
....................................................................58
8.2.21 Recalib
rate
(10h) ............................................................................................................59
8.2.22 Security Disable Password (F6h)
...................................................................................59
8.2.23 Security Erase Prepare
(F3h) .........................................................................................59
8.2.24 Security Erase Unit
(F4h)...............................................................................................59
8.2.25 Security Freeze Lock
(F5h).............................................................................................60
8.2.26 Security Set Password
(F1h)...........................................................................................60
8.2.27 Security Unlock
(F2h).....................................................................................................61
8.2.28 Seek (7xh)
.......................................................................................................................61
8.2.29 Set Features
(EFh)..........................................................................................................61
8.2.30 Set Max Address (F9h, 37h: extended)
...........................................................................63
8.2.31 Set Multiple Mode
(C6h).................................................................................................63
8.2.32 Sleep (E6h)
.....................................................................................................................63
8.2.33 Standby (E2h)
.................................................................................................................63
8.2.34 SMART
(B0h)..................................................................................................................64
8.2.34.1 Smart disable operations (D9h) .................................................................................................. 64
8.2.34.2 Smart enable/disable attribute auto-save (D2h).......................................................................... 64
8.2.34.3 Smart enable operations (D8h) ................................................................................................... 65
8.2.34.4 Smart execute off-line immediate (D4h) .................................................................................... 65
8.2.34.5 Smart read data (D0h) ...............................................................................
................................. 66
8.2.34.6 SMART read log sector (D5h) ................................................................................................... 71
8.2.34.7 SMART return status (DAh) ...................................................................................................... 71
8.2.34.8 SMART write log sector (D6h) .................................................................................................. 71
8.2.35 Standby (E2h)
.................................................................................................................72
8.2.36 Standby Immediate
(E0h)................................................................................................72
8.2.37 Write Buffer (E8h)
..........................................................................................................72
8.2.38 Write DMA (CAh,
35h:extended)....................................................................................72
8.2.39 Write FPDMA Queued
(61h) ..........................................................................................72
8.2.40 Write Long
(32h).............................................................................................................73
8.2.41 Write Multiple Command (C5h, 39h:extended)
..............................................................73
8.2.42 Write Sector(s) (30h, 34h:extended)
............................................................................73
CHAPTER 9
MAINTENANCE..........................................................................................................75
9.1 GENERAL INFORMATION
.................................................................................................................75
9.2 M
AINTENANCE PRECAUTIONS
........................................................................................................75
9.3 SERVICE AND REPAIR
......................................................................................................................77
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TABLE OF
TABLES
Table 3-1 Specifications ............................................................................................................................6
Table 3-2 Physical Specifications ..............................................................................................................7
Table 3-3 Logical Configurations ..............................................................................................................7
Table 3-4 Performance Specifications .......................................................................................................8
Table 3-5 Power consumption ...................................................................................................................9
Table 3-6 Environmental
Specifications
...................................................................................................10
Table 3-7 Reliability Specifications.........................................................................................................12
Table 4-1 SATA Connector
Pin Definitions ............................................................................................19
Table 7-1 Phy Event Counter Supports....................................................................................................44
Table 8-1 Command Code Parameters ....................................................................................................46
Table 8-2 Device Configuration Overlay Feature Register Values..........................................................48
Table 8-3 Device Configuration Identify data structure ..........................................................................49
Table 8-4 Diagnostic
Codes
.....................................................................................................................50
Table 8-5 IDENTIFY DEVICE information ...........................................................................................51
Table 8-6 Automatic Sta
ndby Timer Periods...........................................................................................56
Table 8-7 Security password content ......................................................................................................60
Table 8-8 Security Erase Unit Password..................................................................................................61
Table 8-9 Security Set Password data content .........................................................................................61
Table 8-10 Identifier and security level bit interaction ............................................................................62
Table 8-11 Set Features Register Definitions ..........................................................................................6
3
Table 8-12 Transfer Mode Values ...........................................................................................................63
Table 8-13 Set Max Feature Register Values ..........................................................................................64
Table 8-14 SMART Feature Registers Values.........................................................................................65
Table 8-15 Device SMART Data Structure .............................................................................................67
Table 8-16 SMART Attribute Status Flags..............................................................................................68
Table 8-17 SMART Attribute Data List ..................................................................................................70
Table 8-18 Off-line Data Collection Status Values .................................................................................
70
Table 8-19 Self-test Execution Status Values ..........................................................................................71
SCOPE
Spinpoint M8 Product Manual REV 2.6
1
CHAPTER 1 SCOPE
Welcome to the Spinpoint
TM
M8 series of SamsungTM hard disk drive. This series of drives consists of the following models: ST320LM001, ST500LM012, ST750LM022, and ST1000LM024. This chapter provides an overview of the contents of this manual, including the
intended user,
manual organization, terminology and
conventions. In addition, it provides a list of references that might be helpful to the reader.
1.1 User Definition
The Spinpoint M8 product manual is intended for the following readers:
Original Equipment Manufacturers (OEMs)
Dist
ributors
1.2 Manual Organization
This manual provides information about installation, principles of operation, and interface command
implementation. It is organized into the following chapters:
Chapter 1 - SCOPE
Chapter 2 - DESCRIPTION
Chapter 3 - SPECIFICATIONS
Chapter 4 - INSTALLATION
Chapter 5 - DISK DRIVE OPERATION
Chapter 6 - SATA INTERFACE
Chapter 7 - MAINTENANCE
In addition, this manual contains a glossary of terms to help you understand important information
SCOPE
Spinpoint M8 Product Manual REV 2.6
2
1.3 SATA
The ATA (Advanced Technology Attachment) interface which was developed based on the IDE (Integrated Drive Electronics) has been around from 1980’s. As the PC processor speed has improved, so have the data rates of the HDD. The parallel ATA is reaching its limit of 133 MB/s data transfer rate. Serial implementation of ATA (SATA) will allow the data rate to run even faster so the processor will be utilized more efficiently. Serial ATA has been developed to provide the next generation storage interface.
SATA interface replaces 2 inch wide, 40 pin parallel interface connector with 0.25 inch wide 7 pin serial interface connector. The maximum length of the SATA interface cable can be extended to 1 meter (approximately 39 inches) compared to 18 inch of parallel ATA. SATA also allows a data transfer speed of 150 MB/s, 300 MB/s, and 600 MB/s. Even though SATA will not directly interface with Parallel or traditional ATA (PATA) hardware, it is compliant with ATA protocol and therefore software compatible. The cable geometry with smaller footprint connector reduces board space requirements and impro
ves air flow and heat exchange inside computer systems.
SATA uses point to point connection topology and each channel works independently. There is no sharing of interface, master/slave drive configuration, and no master/slave jumper settings. This is different from Parallel ATA (PATA) architecture where 2 drives per port are supported by a shared bus and drives are designated as master or slave drive based on jumper pin or cable selection. Unlike
parallel ATA, SATA drives are hot-plug and hot-swappab
le.
1.4 Reference
For additional information about the AT interface, refer to:
ATA-2 (AT Attachment 2), Revision 3, January, 1995 ATA-3 (Attachment-3 Interface) Revision 7b, 27 January, 1997
ATA-4 (AT Attachment with Packet Interface Extension) Revision 18, 19 August, 1998ATA-5 (AT Attachment with Packet Interface Extension) Revision 3, 29 February, 2000ATA-6 (AT Attachment with Packet Interface Extension) Revision 2a, 26 September, 2001
ATA-7 (AT Attachment with Packet
Interface Extension) Revision 1, 28 August, 2002
ATA-8 (AT Attachment with Packet Interface Extension) Revision 0, 16 September, 2008
For introduction about SATA interface please refer to:
SATA 1.0 Design Guides, April 5, 2002. (URL: http:// www.serialdata.org retrieved on May 22, 2003)
Serial ATA: A comparison with Ultra ATA Technology
(URL:
http://www.intel.com retrieved April
18,2003)
Serial ATA: High Speed Serialized AT Attachment, Rev. 1.0a, January 7, 2003, Serial Workgroup.
(URL:
http://www.serialdata.org retrieved on May 22, 2003)
Serial ATA II: Port Multiplier 1.0 Specification, April 29th, 2003. (URL:
http://www.serialdata.org retrieved on May 22, 2003)
Spinpoint M8 Product Manual REV 2.6
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DESCRIPTION
CHAPTER 2 DESCRIPTION
This chapter summarizes general functions and key features of the Spinpoint M8 hard disk drive, as well as the standards and regulations they meet.
2.1 Introduction
The Samsung Spinpoint M8 2.5 inch hard disk drive is high capacity, high performance random access storage device, which uses non-removable 2.5-inch disks as storage media. Each disk incorporates thin film metallic media technology for enhanced performance and reliability. And for each disk surface there is a corresponding movable head actuator assembly to randomly access the data track s an d wr ite or read the user data.
The Spinpoint M8 hard disk drive includes the AT controller embedded in the disk drive PCB electronics. The drive's electrical interface is compatible with all mandatory, optional and vendor-specific commands within the ATA specification.
Drive size conforms to the industry standard 2.5-inch form factor with a SATA 15-pin DC power connector, and the standard SATA 7-pin Interface connector.
The Spinpoint M8 hard disk drive incorporates TuMR head and Noise Predictive PRML (Partial Response Maximum Likelihood) signal processing technologies. These advanced technologies allow for areal density of about 677 Gigabits per square inch and st or ag e capac ity of over 5 0 0.0 G igab ytes per disk.
The heads, disk(s), and actuator housing are environmentally sealed within an aluminum-alloy base and cove r. As the disks spin, air circulates within this base and cover, commonly referred to as the head and disk assembly (HDA), through a non-replaceable absolute filter ensuring a contamination free environment for the heads and disks throu ghout the life of the drive.
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4
DESCRIPTION
2.2 Key Features
Key features of the Spinpoint M8 SATA hard disk drive includes:
 Formatted capacities are 320, 500, 750 GB, 1TB
 9.5 ± 0.2 mm height form factor
 5400 RPM Class
 12 ms average seek time
 High accuracy rotary voice coil actuator with embedded sector servo
 Support ATA standard PIO Mode 4/DMA Mode 2/Ultra DMA Mode 5 (UDMA 100)
 Serial ATA (SATA) Interface
 Supports SATA interface 6.0 Gbps(3.0 Gbps, 1.5 Gbps) speed
 Native SATA device without using SATA bridge chip
 Support SATA 3.0 and SATA II features
 Asynchronous Signal Recovery (ASR)
 Pin-11 Device Activity Signal (Activity LED)
 Pin-11 Staggered Spin-up Control
 Auto-Activate DMA Setup FIS
 Native Command Queuing with queue depth of 32 (First Party DMA)
 Physical Event Counters
 Software Settings Preservation
 SATA Device Hot Plug Capability
 Device Initiated Power Management
 Supports LBA Addressing modes
 Supports all logical geometries as programmed by the host
 Transparent media defect mapping
 High performance in-line defective sector skipping
 Auto-reassignment
 Automatic error correction and retries
 On-the-fly (OTF) error correction
 Noise predictive PRML read channel
 TA detection and correction
 TuMR/PMR head
 SMART III support
 1MB = 1,000,000 Bytes, 1GB = 1,000,000,000 Bytes
Accessible capacity may vary as some OS uses binary numbering system for reported capacity.
Spinpoint M8 Product Manual REV 2.6
5
DESCRIPTION
2.3 Standards and Regulations
The Samsung Spinpoint M8 hard disk drive depends upon its host equipment to provide power and appropriate environmental conditions to achieve optimum performance and compliance with applicable industry and governmental regulations. Special attention has been given in the areas of safety, power distribution, shielding, audible nois e c ontrol, and temperature regulation.
The Spinpoint M8 hard disk drive satisfies the following standards and regulations:
Underwriters Laboratory (UL): Standard 1950. Information technology equipment including business
equipment.
Technisher Überwachungs Verein (TUV): Standard EN 60 950. Information technology equipment including business equipment.
2.4 Hardware Requirements
The Spinpoint M8 hard disk drive is designed for use with host computers and controllers that are ATA compatible. It is connected to a PC either by:
Using an adapter board with SATA interface, or Plugging a cable from the drive directly into a PC motherboard with a SATA interface
Spinpoint M8 Product Manual REV 2.6
6
SPECIFICATIONS
CHAPTER 3 SPECIFICATIONS
This chapter gives a detail description of the physical, electrical and environmental characteristics of the Spinpoint M8 hard disk drive.
3.1 Specification Summary
Table 3-1:
Specifications
DESCRIPTION ST320LM001 ST500LM012 ST750LM022 ST1000LM024
Number of R/W heads
2
3/4 4
Maximum KBPI
2418
Flexible data TPI
400
Encoding method
Noise Predictive
PRML
Interface
SATA 6.0 Gbps
(3.0Gbps, 1.5 Gbps
)
Actuator type
Rotary Voice
Coil
Servo type
Embedded Sector
Servo
Spindle speed (RPM)
5400 RPM
Class
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7
SPECIFICATIONS
3.2 Physical Specifications
Table 3-2: Physical Specifications
DESCRIPTION
ST320LM001
ST500LM012
ST750LM022
ST1000LM024
Physical dimensions
Length Width
Height
Weight (max)
100.3 ±
0.4
mm [3.949 ± 0.0157 inch]
69.85 ±
0.25
mm [2.750 ± 0.0098 inch]
9.5 ±
0.2
mm [0.374 ± 0.0079 inch]
1 Disk 109 g [0.241 lb] / 2 Disk 117 g [0.258 lb]
3.3 Logical Configurations
Table 3-3: Logical Configurations
* 1MB = 1,000,000 Bytes, 1GB = 1,000,000,000 Bytes * Accessible capacity may vary as some OS uses binary numbering system for reported capacity.
DESCRIPTION
ST320LM001
ST500LM012
ST750LM022
ST1000LM024
Total Number of
logical sectors
625,142,448 976,773,168 1,465,149,168 1,953,525,168
Capacity
320GB 500GB 750GB
1TB
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SPECIFICATIONS
3.4 Performance Specifications
Table 3-4: Performance Specifications
NOTES:
Seek time is defined as the time fro m the receipt of a read, write or seek command until the actuator has
repositioned and settled on the desired track with the drive operating at nominal DC input voltages and nominal operating te m per a ture .
Average seek time i s de term i ne d by averaging the time to com pl ete 1,000 s e eks of random length.
Average latency is the time required for the drive to rotate 1 /2 of a revolution and on average is incurred
after a seek compl etion prior to reading or wr iting user data.
Startup time is the time elapsed between the supply v ol tage s re a ching operating range and the drive be i ng
ready to accept all commands.
Actual rotational speed can be different a little.
Performance specification is limited to the r oom temperature & normal v ol tage c ondi ti on.
DESCRIPTION
ST320LM001
ST500LM012
ST750LM022
ST1000LM024
Seek Time (RD/WRT,
Typ)
Average seek time Track to track seek time
Full stroke seek time
12/14 ms
2/4 ms
22/24 ms
`
Average Latency
5.6 ms
Data Transfer Rate
(Max)
buffer to/from
media
host to/from buffer
145Mbits/s
600 MB/s
Rotational Speed
5400 RPM Class
Startup Time (Typ / Max)
Power on to Drive Ready
Standby to
Drive Ready
3 sec / 4 sec
2.5 sec / 4 sec
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9
SPECIFICATIONS
3.5 Power consumption
Table 3-5: Power consumption
DESCRIPTION
ST320LM001 ST500LM012 ST750LM022 ST1000LM024
Rated
Voltage V
+5
Current A
0.85
Power Consumption
Start Up
mA
1000
Low Power Idle
Watt
0.7
Read/Write
Watt
2.3
Seek
Watt
2.0
Stand by
Watt
0.2
Sleep
Watt
0.2
Power Requirements
Tolerance For + 5V
%
+/- 5
Ripple, 0-30MHz
mV
p-p
100
Supply Rise Time
us/
msec
10us-100ms
Supply Fall Time
Sec
< 5
1) Random seek: 30% Duty cycle seek commands with logical random location.
2) Read/Write: Avg. Read/Write operation at OD f or 32 sec tor s.
3) All the power should be measured at the room temperature and normal voltage condition.
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SPECIFICATIONS
3.6 Environmental Specifications
Table 3-6: Environmental Specifications
DESCRIPTION
ST320LM001 ST500LM012 ST750LM022 ST1000LM024
Ambient Temperature
Operating Non-operating Max. gradient
(Temperature/Humidity)
(Drive temperature measured on position of figure 3-1 should be max 65C in range of
0°C -60°C, specified operation temperature.)
0°C
~
60°C
-40°C
~
70°C
20°C / 20%/hr
Relative Humidity (non condensing)
Operation Non-operation
Maximum wet bulb temperature
Operating Non-operating
5~90 % 5~95 %
30°C 40°C
Altitude (relative to sea level)
Operating Non-operating
-300 ~ 3000 m
-400 ~ 15,000 m
Vibration
Operating :
10-500 Hz, Random :
Non-operating :
10-500 Hz, Random
1.5 Grms
5.85 Grms
Linear Shock (1/2 sine pulse)
Operating 2.0 ms
Non-operating 2.0 ms
Rotational Shock
Operating 2.0 ms Non-operating 2.0 ms
350G 850G
3K rad/sec
2
30K rad/sec
2
Acoustic
Noise
(Typical Sound Power)
Idle Seek
2.3
Bels
2.5
Bels
Spinpoint M8 Product Manual REV 2.6
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SPECIFICATIONS
Figure 3-1: Measurement Position.
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SPECIFICATIONS
3.7 Reliability Specifications
Table 3-7: Reliability
Specifications
DESCRIPTION
ST320LM001 ST500LM012 ST750LM022 ST1000LM024
Recoverable Read Error
<10 in 10
11
bits
Non-Recoverable Read Error
<1 sector in 10
14
bits
MTBF (POH)
550,000
hours
MTTR (Typical)
5
minutes
Load/Unload Cycles
Ambient
600,000
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INSTALLATION
CHAPTER 4 INSTALLATION
This chapter describes how to unpack, mount, configure and connect a Spinpoint M8 hard disk drive. It also describes how to install the drive in systems.
4.1 Space Requirements
Figure 4-1 shows the external dimensions of the drive.
Figure 4-1: Mechanical Dimension
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4.2 Unpacking Instructions
(1) Open the shipping container of the Spinpoint M8 hard disk drive.
(2) Lift the packing assembly that contains the drive out of the shipping container.
(3) Remove the drive from the packing assembly. When you are ready t o install the drive, remove it from
the ESD (Electro Static Discharge) protection bag. Take precautions to protect the drive from ESD damage after removing it from the bag.
CAUTION: During shipment and handling, the anti-static ESD protection bag prevents elec tronic component damage due to electrostatic d ischarge. To avoid accid ental damage to the drive, do not use a sharp instrument to open the ESD pro tection bag.
(4) Save the packing material for possible future use.
4.3 Mounting
Refer to your system manual for complete mounting details.
(1) Be sure that the system power is off.
(2) For mounting, use four M3 screws.
CAUTION: Torque applied to the screws is recommended to be 3.5 [kg* cm]
±0.5 (
3.0 [inch *pounds] ± 0.5)
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4.3.1 Orientation
Figure 4-2 shows the physical dimensions and mounting holes located on each side of the drive. The
mounting holes on Spinpoint M8 hard disk drive allow the drive to be mounted in any direction.
Figure 4-2:
Mounting
Dimensions
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4.3.2 Ventilation
The Spinpoint M8 hard disk drive is designed to operate without the need of a cooling fan provided the ambient air temperature does not exceed 60ºC. Any user-designed cabinet must provide adequate air circulation to prevent exceeding the maximum temperature.
4.4 Cable Connectors
The Interface/Power connector consists of two cables; a SATA 15-pin DC power connector, and the standard SATA 7-pin Interface connector.
4.4.1 SATA Connectivity
The SATA interface is connected within a point to point configuration with the SATA host port. There is no master or slave relationship within the devices. Thus SATA does not require master/slave jumper. The drive interface section of the host adapter employs a new design which processed data into a serial data­control system.
Figure 4.4 illustrates the connection for the SATA. There are two cables for SATA drives. One is for data transmission. The other is for power. Figure 4-4 illustrates (a) device signal plug connector, (b) device power plug c
onnector, (c) signal cable receptacle connector mating with (a), and (d) power cable receptacle connector to be mated with (b). For more information, please refer to SATA Specifications cited in the reference.
.
Figure 4-4 Serial ATA
Connector
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Computer mainboard
or
...
Serial
ATA
host
adapter
Figure 4-5 Connectivity to
Drives
Figur e 4 -5 illustrates Connectivity of SATA to drives. It can be us ed with a SATA host adapter (lower picture) or directly into motherboard that has the SATA built-in host bus adapter (upper picture).
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SATA Device Connector Definition
Please note that all pins are in a single row, with a 1.27 mm (50 mil) pitch diameter. There are three power pins for each voltage source. One pin from each voltage is utilized for pre-charge when installed in a blind- mate backplane configuration.
The notes on the mating sequence apply to the case of backplane blind mate connector.
When the drive is inserted, the ground pins and the pre-charge pins are in contact first followed by the remaining pins.
Table 4-1 lists the signals connection on the SATA interface and power connector. It is based on SATA 1.0a Specifications. Note that pin numbers is designated from the pin farthest from power segment.
Table 4-1 SATA Connector Pin
Definitions
Data Signal
Connector
Pin Function Definition
*S1 Ground Ground
S2 Rx+ Differential Signal pair S3 Rx- Differential Signal pair
*S4 Ground Ground
S5 Tx- Differential Signal Pair S6 Tx+ Differential Signal pair
*S7 Ground Ground
Key and spacing separate
signal and power segment
Power
Management
P1 V
33
3.3 v
P2 V33 3.3 v
*P3 V
33 3.3 v
*P4 Ground Ground *P5 Ground Ground *P6 Ground Ground *P7 V
5 5 v
P8 V
5 5 v
P9 V
5 5 v
*P
10 Ground Ground
P
11 Device Activity This pin was reserved in SATA 1.0a
/ Stagger Spin­up Control
*P
12 Ground Ground
*P
13 V12 12 v
P
14 V12 12 v
P
15 V12 12 v
* First Mate
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SATA-Bus Interface Connector
The SATA-Bus interface connector on the drive connects the drive to an SATA host bus adapter or an on- board SATA adapter in the computer. Figure 4.6 illustrates the power, SATA, and factory use only jumper. Figure 4.7 shows pin locations on the SATA drive.
Figure 4-6 HDD Power, SATA Interface, and Factory Jumper Connector
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