I Specifications
I Preparation for Servicing
I Adjustment Procedures
I Schematic Diagrams
I CBA’s
I Exploded views
I Parts List
Sec. 2: Deck Mechanism Section
I Standard Maintenance
I Alignment for Mechanism
I Disassembly/Assembly of Mechanism
I Alignment Procedures of Mechanism
I Deck Exploded Views
I Deck Parts List
VIDEO CASSETTE RECORDER
VCX606
SECAMPAL
Page 2
MAIN SECTION
VIDEO CASSETTE RECORDER
VCX606
Sec. 1: Main Section
I Specifications
I Preparation for Servicing
I Adjustment Procedures
I Schematic Diagrams
I CBA’s
I Exploded Views
I Parts List
Note: Nominal specs represent the design specs. All units should be able to approximate these – some will exceed
and some may drop slightly below these specs. Limit specs represent the absolute worst condition that still might
be considered acceptable; In no case should a unit fail to meet limit specs.
1-1-1HG450SP
Page 4
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteristics which are often not evident from visual inspection, nor can the protection they
give necessarily be obtained by replacing them with
components rated for higher voltage, wattage, etc.
Parts that have special safety characteristics are identified by a ! on schematics and in parts lists. Use of a
substitute replacement that does not have the same
safety characteristics as the recommended replacement part might create shock, fire, and/or other hazards. The Product’s Safety is under review
continuously and new instructions are issued whenever appropriate. Prior to shipment from the factory,
our products are carefully inspected to confirm with
the recognized product safety and electrical codes of
the countries in which they are to be sold. However, in
order to maintain such compliance, it is equally important to implement the following precautions when a set
is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spurious radiation. These must also be
replaced only with specified replacements.
Examples: RF converters, RF cables, noise blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
F. Observe that the wires do not contact heat produc-
ing parts (heatsinks, oxide metal film resistors, fusible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has been replaced, check that
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repaired locations.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power transformer uses crimp type connectors
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent
shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important: Do not re-use a connector. (Discard it.)
2)Strip about 15 mm of the insulation from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp fully to the complete closure of the tool.
L. When connecting or disconnecting the internal
connectors, first, disconnect the AC plug from the
AC outlet.
1-2-1U29P_F_SFP
Page 5
Safety Check after Servicing
Examine the area surrounding the repaired location for
damage or deterioration. Observe that screws, parts,
and wires have been returned to their original positions. Afterwards, do the following tests and confirm
the specified values to verify compliance with safety
standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d’) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d) (d’)
230 V
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
≥3mm(d)
≥6 mm(d’)
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure across the terminals of load
Z. See Fig. 2 and the following table.
Chassis or Secondary Conductor
Primary Circuit Terminals
dd'
Exposed Accessible Part
Z
One side of
B
Power Cord Plug Prongs
AC Voltmeter
(High Impedance)
Fig. 1
Fig. 2
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2kΩ RES.
Connected in
parallel
230 V
50kΩ RES.
Connected in
parallel
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
1-2-2U29P_F_SFP
One side of power cord plug
prongs (B) to:
RF or
Antenna terminals
A/V Input, Output
Page 6
STANDARD NOTES FOR SERVICING
Circuit Board Indications
a. The output pin of the 3 pin Regulator ICs is indi-
cated as shown.
Top View
Out
b. For other ICs, pin 1 and every fifth pin are indicated
as shown.
Pin 1
c. The 1st pin of every male connector is indicated as
shown.
Input
In
Bottom View
5
10
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:.
(1) Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Pin 1
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an angle.
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
Fig. S-1-1
(2) Remove the flat pack-IC with tweezers while apply-
ing the hot air.
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Caution:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage to
the chip parts may occur. Put masking tape around
the flat pack-IC to protect other parts from damage.
(Fig. S-1-2)
1-3-1NOTE_1
Page 7
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when removing
it.
Hot-air
Flat Pack-IC
Desoldering
CBA
Masking
Tape
Machine
Flat Pack-IC
Tweezers
Fig. S-1-2
With Soldering Iron:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
Flat Pack-IC
Desoldering Braid
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
With Iron Wire:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA contact
pads as shown in Fig. S-1-5
(4) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(5) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Note:
When using a soldering iron, care must be taken
to ensure that the flat pack-IC is not being held by
glue. When the flat pack-IC is removed from the
CBA, handle it gently because it may be damaged
if force is applied.
Soldering Iron
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
Hot Air Blower
or
Iron Wire
Soldering Iron
To Solid
Mounting Point
Fig. S-1-5
1-3-2NOTE_1
Page 8
Instructions for Handling
Semi-conductors
CBA
Tweezers
Fine Tip
Soldering Iron
Flat Pack-IC
Fig. S-1-6
2. Installation
(1) Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA so
you can install a replacement flat pack-IC more
easily.
(2) The “ I ” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
(3) Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1MΩ) that is properly grounded to remove any static electricity that may
be charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate
with proper grounding (1MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on clothing will not escape through the body grounding band,
be careful to avoid contacting semi-conductors with
your clothing.
<Incorrect>
CBA
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Presolder
Fig. S-1-7
<Correct>
1MΩ
Grounding Band
1MΩ
CBA
Conductive Sheet or
Copper Plate
CBA
Flat Pack-IC
Fig. S-1-8
1-3-3NOTE_1
Page 9
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors
Caution:
An optical sensor system is used for the Tape Start
and End Sensors on this equipment. Carefully read
and follow the instructions below. Otherwise the unit
may operate erratically.
What to do for preparation
Insert a tape into the Deck Mechanism Assembly and
press the PLAY button. The tape will be loaded into
the Deck Mechanism Assembly. Make sure the power
is on, connect TP507 (S-INH) to GND. This will stop
the function of Tape Start Sensor, Tape End Sensor
and Reel Sensors. (If these TPs are connected before
plugging in the unit, the function of the sensors will
stay valid.) See Fig. 1.
Note: Because the Tape End Sensors are inactive, do
not run a tape all the way to the start or the end of the
tape to avoid tape damage.
Q505
Q504
TP507
S-INH
Fig. 1
1-4-1HG240PFS
Page 10
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembly Flowchart
This flowchart indicates the disassembly steps to gain
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[1] Top Case
[2] Front Assembly
[3] VCR Chassis Unit
[4] Jack CBA
[5] Deck Assembly
[6] Main CBA
[7] Cylinder Shield
[8] Jack Board
2. Disassembly Method
REMOVAL
ID/
LOC
.No.
PA RT
REMOVE/*UNHOOK/
Fig.
UNLOCK/RELEASE/
No.
UNPLUG/DESOLDER
Note
(1): Identification (location) No. of parts in the figures
(2): Name of the part
(3): Figure Number for reference
(4): Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P=Spring, L=Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
(5): Refer to “Reference Notes.”
Reference Notes
CAUTION: Locking Tabs (L-1) and (L-2) are fragile.
Be careful not to break them.
1. Remove five Screws (S-2), three Screws (S-3) and
Screw (S-4). Then, slowly lift the VCR Chassis Unit
(Deck Assembly, Jack CBA and Main CBA) up.
2. When reassembling, solder wire jumpers as shown
in Fig. D5.
3. Before installing the Deck Assembly, be sure to
place the pin of LD-SW on Main CBA as shown in
Fig. D6. Then, install the Deck Assembly while
aligning the hole of Cam Gear with the pin of LDSW, the shaft of Cam Gear with the hole of LD-SW
as shown in Fig. D6.
[1]Top CaseD17(S-1)-
Front
[2]
Assembly
VCR Chassis
[3]
Unit
[4]Jack CBAD4Desolder, (S-5)-
Deck
[5]
Assembly
[6]Main CBAD5*(L-3)-
Cylinder
[7]
Shield
[8]Jack BoardD5-----------
↓
(1)
↓
(2)
D2*3(L-1),*4(L-2)-
D3-1
5(S-2), 3(S-3), (S-4)1
D3-2
D5
2(S-6), Desolder2,3
D6
D5(S-7)-
↓
(3)
↓
(4)
(S-1)
(S-1)
[1] Top Case
(S-1)
↓
(5)
Fig. D1
1-5-1HG450DC
Page 11
(L-2)
[2] Front
Assembly
(S-2)
(S-3)
[3]VCR
Chassis
Unit
(L-1)
(S-3)
(S-2)
(L-2)
(S-2)
[4] Jack CBA
(S-5)
Desolder
Fig. D4
Fig. D2
(S-4)
(S-3)
(S-2)
Fig. D3
1-5-2HG450DC
Page 12
[7] Cylinder Shield
FE Head
Cylinder Assembly
(S-7)
ACE Head
Assembly
Pin
SW507
LD-SW
[6] Main CBA
[8] Jack Board
(L-3)
From
From
FE Head
Cylinder
Assembly
(S-6)
TOP VIEW
From
ACE Head
Assembly
[5] Deck
Assembly
[6] Main CBA
(S-6)
From
Capstan Motor
Assembly
Lead with
blue stripe
[5] Deck Assembly
Shaft
Hole
LD-SW
Cam Gear
Hole
Pin
[6] Main CBA
Fig. D6
Printing
Lead with
white stripe
Lead connections of Deck Assembly and Main CBA
Lead with
blue stripe
Desolder
from bottom
side
Fig. D5
1-5-3HG450DC
Page 13
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
1.Electrical adjustments are required after replacing
circuit components and certain mechanical parts.
It is important to do these adjustments only after
all repairs and replacements have been completed. Also, do not attempt these adjustments
unless the proper equipment is available.
2.To perform these alignment / confirmation procedures, make sure that the tracking control is set in
the center position: Press either "L " or "K" button
on the remote control unit first, then the "PLAY"
button (Front Panel only).
Test Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe,
V-Range: 0.001~50V/Div.,
F-Range: DC~AC-20MHz
2.Alignment Tape (FL6A)
Head Switching Position Adjustment
Purpose:
To determine the Head Switching position during
playback.
Symptom of Misadjustment:
May cause Head Switching noise or vertical jitter
in the picture.
Test pointAdj.PointModeInput
J23(V-OUT)
TP502(RF-SW)
GND
Tape
FL6AOscilloscope
Connections of Measurement Equipment
Main CBA
VR501
(Switching Point)
(MAIN CBA)
Measurement
Equipment
J23
GND
TP502
PLAY
(SP)
6.5H±1H
(412.7µs±63.5µs)
Oscilloscope
-----
Spec.
CH1 CH2
Trig. (+)
Figure 1
EXT. Syncronize Trigger Point
CH1
CH2
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edge of the CH1 video output waveform is at the 6.5H±1H(412.7µs±63.5µs) delayed position from the rising edge of the CH2 head switching
pulse waveform.
1.0H
6.5H+/-1H (412.7µs+/-63.5µs)
Switching Pulse
0.5H
V-Sync
1-6-1HG240EA
Page 14
BLOCK DIAGRAMS
Servo/System Control Block Diagram
TO
AUDIO BLOCK
FROM/TO
Hi-Fi AUDIO
BLOCK
FROM/TO
VIDEO BLOCK
KEY
SWITCH
TP507
SENS-INH
KEY
SWITCH
8
7
KEY- 2
KEY- 1REMOCON-IN
CTL(+)
CTL(-)
REMOTE
RS501
14
SENSOR
D502
S-LED
LD-SW
9
94
957610480
AL+5V
IC501
(SERVO/SYSTEM CONTROL)
AL+5V
D561 STAND-BY
AL+5V
ST-S
T-REEL
END-S
D562 POWER
Q562
S-REEL
79
Q501
PS503
D563 CAS
Q563
23
POWER-LED
RESET
34
RESET
TIMER+5V
S-REEL
D564 TIMER
Q564
24
CAS-LED
D565 REC
Q565
25
TIMER-LED
SDA
SCL
SDA
SCL
TU701(TUNER UNIT)
3
5
12
11
26
REC-LED
SDA
SCL
IC503 (MEMORY)
5
6
AL+5V
VR501
IIC-BUS SCL
IIC-BUS SDA
REC-SAF-SW
PG-DELAY
2
31
SW506
AL+5V
SW-POINT
A-MUTE-H
REC-SAFETY
A-MODE
Hi-Fi-H-SW
LINE-MUTE
IIC-BUS SCL
IIC-BUS SDA
32
19
83
A-MUTE-H
P-ON+15V
CN502
P-ON+15V11AL+12V(2)10GND9D-PFG8D-CONT7LM-FWD/REV
12
Hi-Fi-H-SW
AL+12V
28
A-MODE
LINE-MUTE
D-CONT
D-PFG
77
90
RF-SW
H-A-SW
C-ROTA
D-REC-H
D-V-SYNC
13
15
183316
RF-SW
C-ROTA
D-V-SYNC
C-FG
87
AL+12V/+20.5V
P-ON+5V
H-A-COMP
17
H-A-SW
H-A-COMP
IIC-BUS SCL
IIC-BUS SDA
71
72
D-REC-H
IIC-BUS SCL
IIC-BUS SDA
LM-FWD/REV
C-CONT
C-F/R
78
81
GND5C-CONT4C-F/R3C-FG2P-ON+5V1AL+12V/+20.5V
6
V-ENV
C-SYNC
6
58
V-ENV
C-SYNC
C-POW-SW
66
P-ON-H
C-POW-SW
FROM/TO
POWER
TRICK-H
SECAM-H
65
61
TRICK-H
SECAM-H
P-ON-H
P-DOWN-L
67
86
P-DOWN-L
SUPPLY
BLOCK
Q504
SW507
MAIN CBA
ST-S
LD-SW
SENSOR CBA
Q505
END-S
T-REEL
Q503
TP506
END-S
SENSOR CBA
(DECK ASSEMBLY)
CN504
2 CTL(+)
1 CTL(-)
CONTROL
AC HEAD ASSEMBLY
HEAD
1-7-1
CAPSTAN MOTOR
M
PG
SENSOR
CYLINDER ASSEMBLY
DRUM
MOTOR
M
CAPSTAN
MOTOR
M
LOADING
MOTOR
HG421BLS
Page 15
Video Block Diagram
REC-VIDEO SIGNAL PB-VIDEO SIGNAL MODE: SP/REC
IIC-BUS SDA
IIC-BUS SCL
FROM
SERVO/SYSTEM
CONTROL BLOCK
50
55
CYLINDER ASSEMBLY
(DECK ASSEMBLY)
123
CN253
V(R)-1
969593
7978
69684643
SERIAL
DECORDER
Y. DELAY
65
VIDEO (L)-1
HEAD
VIDEO (R)-1
HEAD
456
V(L)-1
V(L)-2
V-COM
94
SP
HEAD
AMP
SP
EP
P
R
LUMINANCE
SIGNAL
PROCESS
VIDEO (R)-2
VIDEO (L)-2
HEAD
V(R)-2
V-COM
AGC
BYPASS
HEAD
908988
WF1
87
EP
HEAD
AMP
REC FM
+
Y
CCD 1H DELAY
CHARA.
INS.
TP502
RF-SW
AGC
C
1/2
RF-SW
C-ROTA
D-REC-H
D-V-SYNC
80
D-REC-H
C-ROTA/RF-SW
RPRP
CHROMINANCE
SIGNAL
PROCESS
FROM/TO SERVO/SYSTEM
CONTROL BLOCK
V-ENV
H-A-SW
C-SYNC
TRICK-H
67
84
83
V-ENV
C-SYNC
H-A-COMP
PR
SECAM-H
AGCVXO
H-A-COMP
716270
H-A-SW
D-V-SYNC
Y/C
MIX
FBC
PAL/SECAM
1
171418216
29
28
PB-H OUT
21
2544
2928IC370 (PAL/SECAM DECTECTOR)
5859
C-PB
TP301
X301
4.433619MHz
DETECTOR
WF2
IC501 (OSD)
MAIN CBA
COLOR
-IN
OSD
CHARACTER
MIX
52
IC301
(Y/C SIGNAL PROCESS)
BUFFER
Q351
FRT
IN1
IN2
TUNER
485052
54
24
VIDEO OUT
TU701(TUNER UNIT)
JK756
FRONT
1-7-2
IN2
56
V-IN
FRT
PB/EE
MUTE
IN1
TUNER
PB/EE
MUTE
J23
WF3
V-OUT
JACK CBA
61
63
CN151
CN152
1
1
V-OUT1
V-OUT2
V-IN1
V-IN23
33
20
V-IN1
CN102
Q102
JK102
3
1
BUFFER
19
20
V-OUT2
V-IN2
CN101
Q101
JK101
1
BUFFER
19
V-OUT1
HG421BLV
Page 16
Audio Block Diagram
PB-AUDIO SIGNALREC-AUDIO SIGNALMode : SP/REC
TO SERVO/SYSTEM
11
12
SERIAL
DECODER
AUDIO HD-SW
CONTROL
71
68 69
16
MUTE
LINE
AMP
ALC
ALC
DET
IN1
151317
TUNERIN2
INV
P
R
ATT
REC-ON
REC
AMP
CONTROL BLOCK
A-MUTE-H
IIC-BUS SCL
IIC-BUS SDA
98
7
MAIN CBA
IC301
(AUDIO SIGNAL PROCESS)
EQ
PB-ON
5
AMP
6
SP/LP-ON
+5V
Q401
CN504
BIAS
Q402
3 A-PB/REC
4 A-COM
6 AE-H
100
3
AUTO
1
OSC
5 AE-H/FE-H
BIAS
2
Q406
Q403
CN501
+5V
Q405
2 FE-H
(PB=ON)
1 FE-H-GND
N-A-PB
N-A-REC
TO Hi-Fi
AUDIO BLOCK
1-7-3
AC HEAD ASSEMBLY
AUDIO
HEAD
(DECK ASSEMBLY)
AUDIO
ERASE
HEAD
FE HEAD
FULL
ERASE
HEAD
HG421BLA
Page 17
Hi-Fi Audio Block Diagram
A-OUT
(L)
A-OUT
(R)
TU-AUDIO
JK751
SIF OUT
TU701
(TUNER UNIT)
22
21
AUDIO IN
2
FROM/TO
SERVO/SYSTEM
CONTROL BLOCK
Hi-Fi
CYLINDER
ASSEMBLY
AUDIO
(R) HEAD
Hi-Fi
AUDIO
(L) HEAD
CN509
A-OUT1(L)2A-OUT1(R)
1
REC-AUDIO SIGNALPB-AUDIO SIGNALMode : SP/REC
MAIN CBA
SUB JACK CBA
AFV CBA
2
CN701
SIF
2
CN1
4
TU-AUDIO(R)
4
CN701CN 1
1
TU-AUDIO
1
IF SIGNAL
PROCESS
5
TU-AUDIO(L)
5
7374727677
MUTE-ON
VCOMUTE
OUTPUT
SELECT
75
MUTE-ON
A-MODE
IIC-BUS SCL
IIC-BUS SDA
Q451
37
38
LOGIC
ENV
R-CH
BPF
NOISE
COMP
SW
NOISE
PPR
R-CH
PNR
LINE-MUTE
21
53
MUTE
DET
DET
VCO
LIMDEV
Hi-Fi-H-SW
39
HOLD
PULSE
LPF
(DECK ASSEMBLY)
MIXV/I
LPF
VCO
LIMDEV
A(R) 7
A(L) 9
-COM 8
CN253
Hi-Fi-
Hi-Fi
Hi-Fi-
242627
R
L
34 33
LIM
L-CH
BPF
DO
DET
COMP
SW
NOISE
R
L-CH
PNR
CN151
9
A-IN1(R)
9
CN101
JACK CBA
JK101
2
A-IN1(R)
5
A-OUT1(R)
A-IN1(L)7
7
5
6
1
A-OUT1(R)
A-IN1(L)
A-OUT1(L) 11
11
JK102
3
A-OUT1(L)
CN152
9
A-IN2(R)
9
CN102
2
A-IN2(R)
6
A-OUT2(R)
A-IN2(L)8
8
6
6
1
A-OUT2(R)
A-IN2(L)
A-OUT2(L) 11
11
3
A-OUT2(L)
(Hi-Fi AUDIO SIGNAL PROCESS)
IC451
2
6108
JK757
A-IN(L)
L-CH
14
INSEL
15
4
ALC
+
78
N-A-REC
80
N-A-PB
TO AUDIO BLOCK
6171
47
48
R-CH
INSEL
5256545060
JK758
A-IN(R)
FRONT
ALC
70
SW
ALC
62
ALC
SW
67
65
1-7-4
HG421BLH
Page 18
Power Supply Block Diagram
P-ON+44V
P-ON+15V12P-ON-H
AL+12V/+20.5V
AL+9V
AL+12V
C-POW-SW
AL+5V
TIMER+5V
P-ON+5V
P-DOWN-L
Q053
MAIN CBA
CAUTION !
Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
Q051
T001
2
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE T1.6AL/250V FUSE.
Q052
Q057
13
14
4
Q058
Q055
15
Q001
Q054
Q059
16
Q056
SHUNT
REGULATOR
Q004
11
17
18
1
4
IC001
ERROR
6
7
VOLTAGE DET
COLD
23
D001 - D004
F001L003
HOT CIRCUIT. BE CAREFUL.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
BRIDGE
RECTIFIER
LINE
FILTER
T1.6A L 250V
AC001
Q002
1-7-5
Q003
HOT
HG421BLP
Page 19
FUNCTION INDICATOR SYMBOLS
Note:
The following symbols will appear on the indicator panel to indicate the current mode or operation of the VCR.
On-screen modes will also be momentarily displayed on the tv screen when you press the operation buttons.
Display panel
STANDBY
FUNCTIO
N
TAPE IN
TIMER
MODEINDICATOR ACTIVE
STANDBYPower on = " H "
Power off = " L "
FUNCTIONVCR mode = " H "
TV mode = " L "
TAPE INCassette in = " H "
Cassette out = " L "
TIMERTimer stand by = " H "
One touch recording = " H "
Timer recording = " H "
General mode = " L "
RECREC mode = " H "
REC pause
General mode = " L "
REC
" H "= LED Light on, " L "= LED Light off
Blinks at 0.8Hz interval
When reel and capstan mechanism is not
functioning correctly
When tape loading mechanism is not functioning correctly
When cassette loading mechanism is not
functioning correctly
When the drum is not working properly
P-ON Power safety detection
“A R” is displayed on a TV screen. (Refer to Fig. 1.)
“A T” is displayed on a TV screen. (Refer to Fig. 2.)
“A C” is displayed on a TV screen. (Refer to Fig. 3.)
“A D” is displayed on a TV screen. (Refer to Fig. 4.)
“A P” is displayed on a TV screen. (Refer to Fig. 5.)
1-7-6HG420FIS
Page 20
TV screen
Note:
OSD for mechanical error will be displayed for 5 sec. after the mechanical error occurs.
When reel and capstan mechanism is not functioning
correctly
A
R
Fig. 1
When tape loading mechanism is not functioning correctly
A
T
Fig. 2
When cassette loading mechanism is not functioning
correctly
When the drum is not working properly
A
D
P-ON Power safety detection
A
P
Fig. 4
Fig. 5
A
C
Fig. 3
1-7-7HG420FIS
Page 21
SCHEMATIC DIAGRAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using replacement components rated for higher voltage, wattage,
etc. Replacement parts that have these special safety
characteristics are identified in this manual and its
supplements; electrical components having such features are identified by the mark " ! " in the schematic
diagram and the parts list. Before replacing any of
these components, read the parts list in this manual
carefully. The use of substitute replacement parts that
do not have the same safety characteristics as specified in the parts list may create shock, fire, or other
hazards.
Capacitor Temperature Markings
Mark
Capacity
change rate
Standard
temperature
Temperature
range
Notes:
1. Do not use the part number shown on these drawings for ordering. The correct part number is shown
in the parts list, and may be slightly different or
amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Resistor wattages are 1/4W or 1/6W unless otherwise specified.
4. All capacitance values are indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identified by four digits. The first two digits are not shown for each component. In each
block of the diagram, there is a note such as shown
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
(B)
(F)+30 - 80%20°C-25~+85°C
(SR)
(Z)+30 - 80%20°C-10~+70°C
Capacitors and transistors are represented by the following symbols.
±10%
±15%
20°C-25~+85°C
20°C-25~+85°C
CBA Symbols
(Top View) (Bottom View)
+
Electrolytic Capacitor
(Bottom View)
Transistor or Digital Transistor
E C B
(Top View)
NPN Transistor
(Top View)
PNP Transistor
Schematic Diagram Symbols
Digital Transistor
E C B
(Top View)
E C B
NPN Digital Transistor
E C B
(Top View)
PNP Digital
Transistor
E C B
1-8-1SCPA1
Page 22
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOWING
PAG ES :
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, first check to see that all components in the power supply circuit are not defective
before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the power
supply circuit to fail.
3. Note:
(1) Do not use the part number shown on the drawings for ordering. The correct part number is shown in the parts
list, and may be slightly different or amended since the drawings were prepared.
(2) To maintain original function and reliability of repaired units, use only original replacement parts which are
listed with their part numbers in the parts list section of the service manual.
4. Mode: SP/REC
5. Voltage indications for PLAY and REC modes on the schematics are as shown below:
Unit: Volts
The same voltage for
both PLAY & REC modes
6. How to read converged lines
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to area "D3".
2. "1-B1" means that line number "1" goes to area "B1".
7. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
: Used to indicate a test point with no test pin.
5.0
231
5.0
PLAY mode
REC mode
(2.5)
Indicates that the voltage
is not consistent here.
3
AREA D3
2
1
AREA B1
1-D3
ABCD
1-B1
: Used to indicate a test point with a test pin.
1-8-2SCRK05
Page 23
Main 1/7 Schematic Diagram
1-8-31-8-4
HG421SCM1
Page 24
Main 2/7 & Sensor Schematic Diagrams
1-8-51-8-6
HG421SCM2
Page 25
Main 3/7 Schematic Diagram
1-8-71-8-8
HG421SCM3
Page 26
Main 4/7, Jack & Sub Jack Schematic Diagrams
1-8-91-8-10
HG421SCM4
Page 27
Main 5/7 Schematic Diagram
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
1-8-111-8-12
HG421SCM5
Page 28
Main 6/7 Schematic Diagram
1-8-131-8-14
HG421SCM6
Page 29
Main 7/7 Schematic Diagram
1-8-151-8-16
HG421SCM7
Page 30
AFV Schematic Diagram
1-8-171-8-18
HG421SCAFV
Page 31
Main CBA Top View
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE :
The voltage for parts in hot circuit is measured
using hot GND as a common terminal.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
Sensor CBA Top View
BHF300F01011A
BHF300F01011B
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
WF3
J23
V-OUT
WF1
TP502
RF-SW
VR501
SW-P
1-8-191-8-20
TP507
S-INH
TP501
CTL
WF2
TP301
C-PB
BHG470F01014A
Page 32
Main CBA Bottom View
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE :
The voltage for parts in hot circuit is measured
using hot GND as a common terminal.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
1-8-211-8-22
BHG470F01014A
Page 33
Jack CBA Top View
Jack CBA Bottom View
1-8-231-8-24
BHG470F01014C
Page 34
AFV CBA Top View
AFV CBA Bottom View
Sub Jack CBA Top View
BHC400F01093
Sub Jack CBA Bottom View
BHG470F01014B
1-8-251-8-26
Page 35
WAVEFORMS
WF2
UPPER
TP301
WF1
LOWER
TP502
C-PB 10mV x 10
RF-SW 0.5V x 10
5ms
WF3
UPPER
J23
WF1
LOWER
TP502
V-OUT 0.1V x 10
RF-SW 0.5V x 10
50µs
WF3
J23
V-OUT E-E
10µs 50mV x 10
1-9-1
U29WFPAL
Page 36
WIRING DIAGRAM
AC CORD
123456789
1NU
CN701CN1
ANT-INANT-OUT
SIF
2
3 GND
AFV CBA
TU-AUDIO(R)
4
(BHC400F01093)
TU-AUDIO(L)5
IIC-BUS SCL8
IIC-BUS SDA9
P-ON+5V
P-ON+5V
6
7
123456789
JK101,102
123456789
JW002
AL+12V(1)
GND
JK1-8P-OUT
A-OUT1(R)
1 V-OUT1
2
3 V-IN1
4
5
6
CN151CN101
1011121314151617181920
JACK CBA
(BHG470F01014C)
10
A-IN1(R)
A-IN1(L)7
NU8
GND
9
10
123456789
11
JW001
A-OUT1(L)11
1 V-OUT2
CN152CN102
GND
2NU3 V-IN2
4
21
GND5
A-OUT2(R)
6
A-IN2(L)8
SC2-IN
7
A-IN2(R)9
10
11
GND
A-OUT2(L)
10
11
AUDIO
OUT(R)
AUDIO
SUB JACK CBA
(BHE470F01014B)
1
3
CN509
JW003
GND
A-OUT(R)2A-OUT(L)
OUT(L)
FRONT
AUDIO
IN (L)
AUDIO
IN (R)
VIDEO
IN
SENSOR CBA
SENSOR CBA
(BHF300F01011A,B)
(BHF300F01011A,B)
CTL(-)1
CN504
MAIN CBA
(BHG470F01014A)
A-COM4
CTL(+)2
AE-H6
AE-H/FE-H5
A-PB/REC3
FE-H2
CN501
FE-H GND1
P-ON+5V
CN502
1 AL+12V/+20.5V
2
3 C-FG
C-F/R
4
M
C-CONT5
GND
6
CAPSTAN
GND
D-CONT8
D-PFG9
LM-FWD/REV
7
10
MOTOR
P-ON+15V12
AL+12V(2)
11
CN253
V(R)-11
V-COM5
V(R)-26
V-COM2
V(L)-2
Hi-Fi-A(R)7
Hi-Fi-COM8
3 V(L)-1
4
Hi-Fi-A(L)9
CAPSTAN MOTOR
M
AUDIO HEAD
CONTROL HEAD
AC HEAD ASSEMBLY
(DECK ASSEMBLY)
AUDIO
ERASE HEAD
FULL
ERASE HEAD
FE HEAD
LOADING
MOTOR
1-10-1
M
PG
SENSOR
DRUM
CYLINDER ASSEMBLY
MOTOR
VIDEO
(R)1
HEAD
VIDEO
(L)1
HEAD
VIDEO
(L)2
HEAD
VIDEO
(R)2
HEAD
Hi-Fi AUDIO
(R) HEAD
HG421WI
Hi-Fi AUDIO
(L) HEAD
Page 37
IC PIN FUNCTION DESCRIPTIONS
IC501( SERVO / SYSTEM CONTROL IC )
“H” ≥ 4.5V, “L” ≤ 1.0V
Pin
IN/
No.
OUT
1INSC2-IN
2IN
3IN
4INEND-S
5INAFC
6INV-ENV
7INKEY-1
8INKEY-2
9INLD-SW
10INST-S
Signal
Name
PGDELAY
POWSAF
Function
Input Signal from Pin
8 of SCART2
Video Head Switching
Pulse Signal Adjusted
Voltage
P-ON Power
Detection Input Signal
Tape End Position
Detect Signal
Automatic Frequency
Control Signal
Video Envelope
Comparator Signal
Key Scan Input Signal
1
Key Scan Input Signal
2
Deck Mode Position
Detector Signal
Tape Start Position
Detector Signal
Active
Level
A/D
A/D
A/D
A/D
A/D
A/D
A/D
A/D
A/D
A/D
Pin
IN/
Signal
No.
OUT
24
OUT CAS-LED
25
OUT
26
OUT REC-LED
27-N.U.Not Used-
28 OUT
29-N.U.Not Used-
30-N.U.Not Used-
31IN
32IN A-MODE
33 OUT D-REC-H
34IN RESET
35IN XcinSub Clock-
Name
TIMERLED
LINEMUTE
RECSAF-SW
Function
“CASSETTE” LED
Signal Output
“TIMER” LED Signal
Output
Recording LED
Control Signal
Audio Mute Control
Signal
Recording Safety SW
Detect (With Record
tab="L"/With out
Record tab="H")
Hi-Fi Tape Detection
Signal
Delayed Record
Signal
System Reset Signal
(Reset=”L”)
Active
Level
H
H
H
H
H
L
H
L
11-N.U.Not Used-
12-N.U.Not Used-
13 OUT
14IN
15 OUT C-ROTA
16 OUT H-A-SW
17IN
18 OUT RF-SW
19 OUT
20-N.U.Not Used-
21-N.U.Not Used-
22-N.U.Not Used-
D-VSYNC
REMOCO
N-IN
H-ACOMP
Hi-Fi-H-SWHi-Fi Audio Head
Dummy V-sync
Output
Remote Control
Sensor
Color Phase Rotary
Changeover SIgnal
Video Head Amp
Switching Pulse
Head Amp
Comparator Signal
Video Head Switching
Pulse
Switching Pulse
H/Hi-z
H/L
H/L
H/L
H/L
H/L
36 OUT XcoutSub Clock-
37-VccVcc-
38IN XinMain Clock Input-
39 OUT XoutMain Clock Input-
L
40-VssVss(GND)-
41-N.U.Not Used-
42-N.U.Not Used-
43IN CLKSELClock Select (GND)-
44INOSCin
45 OUT OSCout
46-N.U.Not Used-
47-LPLP-
48IN
49-OSDVssOSDVss-
FSC-IN
[4.43MHz]
Clock Input for letter
size
Clock Output for letter
size
4.43MHz Clock Input-
-
-
23 OUT
POWERLED
“POWER” LED Signal
Output
H
1-11-1HG421PIN
50IN OSD-V-IN
51-N.U.Not Used-
OSD Video Signal
Input
-
Page 38
Pin
No.
IN/
OUT
Signal
Name
Function
Active
Level
Pin
No.
IN/
OUT
Signal
Name
Function
Active
Level
52 OUT
OSD-VOUT
OSD Video Signal
Output
53-OSDVccOSDVcc-
54-HLF
LPF Connected
Terminal (Slicer)
SECAM or
55IN
COLORIN
MESECAM Chroma
Video Input Signal at
Super Impose
56-N.U.Not Used-
57-N.U.Not Used-
58INC-SYNC
59 OUT 8POUT-1
Composite
Synchronized Pulse
SCART 1 8Pin
Output Control Signal
PULSE
H/L
60-N.U.Not Used-
61IN
62-
63-
64-
65 OUT TRICK-H
66 OUT
67IN P-ON-H
SECAMH
SECAM Mode at High
N.U.Not Used
N.U.Not Used
N.U.Not Used
Special Playback =
“H” in SECAM Mode
C-POW-SWCapstan Power
Switching Signal
Power On Signal at
High
H/L
H/L
68-N.U.Not Used-
69-N.U.Not Used-
70-N.U.Not Used-
71 OUT
IN/
72
OUT
IIC-BUS
SCL
IIC-BUS
SDA
2
I
C BUS Control
Clock
2
I
C BUS Control Data
H/L
H/L
73-N.U.Not Used-
74-N.U.Not Used-
75-N.U.Not Used-
-
79INS-REEL
80INT-REEL
81 OUT
-
82-N.U.Not Used-
LM-FWD/
REV
83 OUT A-MUTE
Supply Reel Rotation
Signal
Take Up Reel
Rotation Signal
Loading Motor
Control Signal
Audio Mute Control
Signal
PULSE
PULSE
H/L/
Hi-z
H
84-N.U.Not Used-
85-N.U.Not Used-
86IN
P-DOWN-LPower Voltage Down
Detector Signal
L
Capstan Motor
87INC-FG
Rotation Detection
PULSE
Pulse
88-N.U.Not Used-
89-N.U.Not Used-
90IND-PFG
-
-
H
91-
92-
AMPVRE
F OUT
AMPVRE
Fin
Drum Motor Pulse
Generator
PULSE
V-Ref for CTL AM P-
V-Ref for CTL AM P-
93-P80/CP80/C Terminal-
IN/
H
94
95
OUT
IN/
OUT
CTL(-)
CTL(+)
96-AMPC
97-
CTLAMP
out
Playback/Record
Control Signal (-)
Playback/Record
Control Signal (+)
CTL AMP Connected
Te r mi n a l
To Monitor for CTL
AMP Output
H/L
H/L
-
PULSE
98-AMPVccAMPVcc-
A/D Converter Power
99-AVcc
Input/ Standard
-
Voltage Input
100INAGC
IF AGC Comparator
Signal
A/D
76 OUT C-CONT
77 OUT D-CONT
78 OUT C-F/R
Capstan Motor
Control Signal
Drum Motor Control
Signal
Capstan Motor FWD/
REV Control Signal
(FWD=”L”/REV=”H”)
PWM
Notes:
Abbreviation for Active Level:
PWM
PWM -----Pulse Wide Modulation
A/D--------Analog - Digital Converter
See Electrical Parts List
for parts with this mark.
Some Ref. Numbers are
not in sequence.
2L021
2L021
2B5
2L051
2L021
SUB JACK CBA
AFV CBA
MAIN CBA
SENSOR CBA
2B46
A7
2B8
2L031
2B7
2L041
2L099
A10
1B1
A3
1-13-2HG410CEX
Page 42
Packing
Some Ref. Numbers are not in sequence.
S7
X6
X1
S2
X20BX20A
X3
X2
X4
S2
S3
Unit
A14
SHIPPING LABEL
S1
1-13-3HG421PEX
Page 43
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a !
have special characteristics important to safety. Before
replacing any of these components, read carefully the
product safety notice in this service manual. Don't
degrade the safety of the product through improper servicing.
NOTE:
Parts that are not assigned part numbers (---------) are
not available.
Ref. No.DescriptionPart No.
A1XFRONT ASSEMBLY HG421FD1VM220181
A2CASE, TOP(ANTHRACITE) HE240ED0VM101267
A3CHASSIS(U27F-GMBH) HE240ED0VM000177
A4JACK BOARD(U27 FTZ) HE480ED
A5JACK BOARD(2-21P) HE470ED
A7PANEL, BOTTOM HE470ED0VM203862
A10!RATING LABEL HG421FD----------
A14LABEL, SERIAL NO. HE240ED or----------
1B1DECK ASSEMBLY CZD013/VM23EDN23E0FL
2B5SHEILD, CYLINDER HG470ED0VM306638
2B7SHIELD ASSEMBLY HG470ED
2B8BUSH, LED(F) H3700UD
2B9CUSHION HC460ED0VM413251
2B18FIBER, TOP CASE HC460ED0VM412906
2B46ROHM HOLDER H7770JD
2L011SCREW, P-TIGHT 3X10 BIND HEAD+GBCP3100
2L012SCREW, P-TIGHT 3X10 BIND HEAD+GBCP3100
2L021SCREW, P-TIGHT M3X10 WASHER HEAD+GCMP3100
2L022SCREW, P-TIGHT M3X10 WASHER HEAD+
2L031SCREW, S-TIGHT M3X6 BIND HEAD+GBMS3060
2L041P-TIGHT SCREW 3X8 BIND +GBMP3080
2L042P-TIGHT SCREW 3X8 BIND +GBMP3080
2L051SCREW, S-TIGHT M3X5 BIND HEAD+GBMS3050
2L099SCREW, P-TIGHT M3X8 BIND HEAD+GBCP3080
S1GIFT BOX CARTON HG421FD1VM320393
S2STYROFOAM HG470ED0VM204516
S3UNIT, BAG V4010PA0VM406453B
S721P PAD HC463FD0VM413384
X1REMOTE CONTROL UNIT 364/CZF29UUNA690ED
X2DRY BATTERY R6P/2S orXB0M451T0001
X3RF CORD PAL 1.2M orWPZ0122LG001
X4ACCESSORY BAG K8092BA0VM404632
X621P CABLE(BYR SUPPLY) H9300ED0VMN03276
X20A! OWNER'S MANUAL(ENGLISH) HG421FD1VMN20199
X20B! OWNER'S MANUAL(FRENCH) HG421FD1VMN20200
(See Electrical Parts List)
(See Electrical Parts List)
BARCODE LABEL HG421FD----------
(See Electrical Parts List)
(See Electrical Parts List)
(See Electrical Parts List)
(See Electrical Parts List)
PACKING
ACCESSORIES
DRY BATTERY ES-GR6M-CXB0M571GLP01
RF CABLE CC1001020012010WPZ0122LW001
200406281-14-1HG421CA
Page 44
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a !
have special characteristics important to safety. Before
replacing any of these components, read carefully the
product safety notice in this service manual. Don't
degrade the safety of the product through improper servicing.
NOTES:
1.Parts that are not assigned part numbers (---------)
are not available.
2.Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
MCV CBA
Ref. No.DescriptionPart No.
MCV CBA
Consists of the following:
MAIN CBA (MCV-A)------------
SUB JACK CBA (MCV-B)------------
JACK CBA (MCV-C)------------
SENSOR CBA0VSA14893
MAIN CBA
Ref. No.DescriptionPart No.
MAIN CBA (MCV-A)-----------
Consists of the following:
CAPACITORS
C002!METALLIZED FILM CAP. 0.068µF/ 275V K orCT2E683HJE06
!METALLIZED FILM CAP. 0.068µF /250V KCT2E683DC011
C003!SAFTY CAP. 2200pF/250V orCCN2EMA0E222
!SAFETY CAP. 2200pF/250VCA2E222MR049
C004ELECTROLYTIC CAP. 33µF/400V M(L.Z)CA2H330NC010
C005CERAMIC CAP. B K 0.01µF/500VCCD2JKP0B103
C006CERAMIC CAP. SL K 56pF/1KV orCCD3AKPSL560
CERAMIC CAP. SL J 56pF/1KVCCD3AJPSL560
C007CERAMIC CAP.(AX) B K 1000pF/50VCCA1JKT0B102
C008CERAMIC CAP.(AX) X K 5600pF/16VCCA1CKT0X562
C010FILM CAP.(P) 0.022µF/50V J orCMA1JJS00223
FILM CAP.(P) 0.022µF/ 50V JCA1J223MS029
C011ELECTROLYTIC CAP. 10µF/ 16V M H7CE1CMAVSL100
C012ELECTROLYTIC CAP. 10µF/ 50V M H7CE1JMAVSL100
C014ELECTROLYTIC CAP. 470µF/35V M orCE1GMASDL471
ELECTROLYTIC CAP. 470µF/35V MCE1GMASTL471
C015ELECTROLYTIC CAP. 47µF/ 25V M H7CE1EMAVSL470
C017ELECTROLYTIC CAP. 470µF/16V M orCE1CMASDL471
ELECTROLYTIC CAP. 470µF/16V MCE1CMASTL471
C018ELECTROLYTIC CAP. 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP. 470µF/10V MCE1AMASTL471
C025CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
1VSA10534
Ref. No.DescriptionPart No.
C026ELECTROLYTIC CAP. 47µF/16V M H7CE1CMAVSL470
C053ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMASSL221
C056CHIP CERAMIC CAP.(1608) B K 0.047µF/ 50V or CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C057CHIP CERAMIC CAP.(1608) CH J 470pF/50V or CHD1JJ3CH471
CHIP CERAMIC CAP. CG J 470pF/50VCHD1JJ3CG471
C060ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C061CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C157ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C158CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C251ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C252CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C253ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C254CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C302CHIP CERAMIC CAP.(1608) B K 0.022µF/ 50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25VCHD1EK30B223
C303ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C304ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C305CHIP CERAMIC CAP. F Z 0.22µF/ 16V orCHD1CZ30F224
CHIP CERAMIC CAP. FZ Z 0.22µF/25VCHD1EZ3FZ224
C307CHIP CERAMIC CAP.(1608) B K 0.047µF/ 50V or CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C308CHIP CERAMIC CAP.(1608) B K 0.022µF/ 50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25VCHD1EK30B223
C309CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C310CHIP CERAMIC CAP.(1608) B K 0.047µF/ 50V or CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C312CHIP CERAMIC CAP. B K 8200pF/50VCHD1JK30B822
C313CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C314CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C315CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C316CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C317ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C318ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C319ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C320CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C321CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C322ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C323CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
C347CHIP CERAMIC CAP.(1608) CH D 10pF/50V orCHD1JD3CH100
CHIP CERAMIC CAP.(1608) CG D 10pF/50VCHD1JD3CG100
C351ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C352ELECTROLYTIC CAP. 100µF/16V M H7CE1CMAVSL101
C370CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C371CHIP CERAMIC CAP.(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/ 25VCHD1EK30B223
C372CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C373CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C374CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C375CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C376CHIP CERAMIC CAP.(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/ 25VCHD1EK30B223
C377CERAMIC CAP.(AX) Y M 0.01µF/16VCCA1CMT0Y103
C378CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C379ELECTROLYTIC CAP. 0.47µF/ 50V M H7CE1JMAVSLR47
C381CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
Ref. No.DescriptionPart No.
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C382CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C383CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C384ELECTROLYTIC CAP. 2.2µF/50V M H7CE1JMAVSL2R2
C401ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C402ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMASSL221
C403CERAMIC CAP. B K 470pF/100VCCD2AKS0B471
C404FILM CAP.(P) 0.018µF /100V J orCMA2AJP00183
FILM CAP.(P) 0.018µF/50V J orCMA1JJP00183
FILM CAP.(P) 0.018µF/50V JCA1J183MS029
C411CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C412CHIP CERAMIC CAP. B K 1800pF/50VCHD1JK30B182
C414CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C415ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C416CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C417CHIP CERAMIC CAP.(1608) B K 0.022µF/ 50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25VCHD1EK30B223
C419CHIP CERAMIC CAP.(1608) B K 4700pF/50VCHD1JK30B472
C421ELECTROLYTIC CAP. 33µF/6.3V M H7CE0KMAVSL330
C422ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C424ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C425CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C430ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C451ELECTROLYTIC CAP. 47µF/16V M H7CE1CMAVSL470
C452CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C453ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C454ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C455CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C456CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C457ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C458ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C459CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C460CHIP CERAMIC CAP.(1608) B K 4700pF/50VCHD1JK30B472
C461ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C462CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C463CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C464ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C465CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C466ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C467ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C468CHIP CERAMIC CAP.(1608) B K 4700pF/50VCHD1JK30B472
C469CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C470ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C471ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
200406281-15-2HG421EL
Page 46
Ref. No.DescriptionPart No.
C472CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C473CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C474ELECTROLYTIC CAP. 22µF/ 6.3V M H7CE0KMAVSL220
C475CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C476CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C477ELECTROLYTIC CAP. 10µF/ 16V M H7CE1CMAVSL100
C478ELECTROLYTIC CAP. 4.7µF/ 25V M H7CE1EMAVSL4R7
C479ELECTROLYTIC CAP. 4.7µF/ 25V M H7CE1EMAVSL4R7
C480CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C482ELECTROLYTIC CAP. 4.7µF/ 25V M H7CE1EMAVSL4R7
C483ELECTROLYTIC CAP. 4.7µF/ 25V M H7CE1EMAVSL4R7
C484ELECTROLYTIC CAP. 10µF/ 16V M H7CE1CMAVSL100
C485CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C486CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C489CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C501ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C502CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C506CERAMIC CAP.(AX) B K 100pF/50VCCA1JKT0B101
C508ELECTROLYTIC CAP. 1µF/ 50V M H7CE1JMAVSL1R0
C510ELECTROLYTIC CAP. 22µF/ 10V M H7CE1AMAVSL220
C511ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C512CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 25V orCHD1EZ30F104
C526CHIP CERAMIC CAP.(1608) B K 4700pF/50VCHD1JK30B472
Ref. No.DescriptionPart No.
C527ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMASSL220
C528CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C530CERAMIC CAP.(AX) F Z 0.022µF/25VCCA1EZTFZ223
C531CERAMIC CAP.(AX) Y M 0.01µF/16VCCA1CMT0Y103
C532ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMASSL220
C533CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C535CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C538CHIP CERAMIC CAP.(1608) B K 0.022µF/ 50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25VCHD1EK30B223
C563CHIP CERAMIC CAP. F Z 1µF/ 10V orCHD1AZB0F105
CHIP CERAMIC CAP. F Z 1µF/ 10VCHD1AZ30F105
C564CHIP CERAMIC CAP.(1608) CH J 100pF/50V or CHD1JJ3CH101
CHIP CERAMIC CAP.(1608) CG J 100pF/50VCHD1JJ3CG101
C567CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C702CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C704CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C706CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C708CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C716CHIP CERAMIC CAP. F Z 0.22µF/ 16V orCHD1CZ30F224
CHIP CERAMIC CAP. FZ Z 0.22µF/25VCHD1EZ3FZ224
C717CHIP CERAMIC CAP. F Z 0.22µF/ 16V orCHD1CZ30F224
CHIP CERAMIC CAP. FZ Z 0.22µF/25VCHD1EZ3FZ224
C756CHIP CERAMIC CAP.(1608) CH J 470pF/50V or CHD1JJ3CH471
CHIP CERAMIC CAP. CG J 470pF/50VCHD1JJ3CG471
C757CHIP CERAMIC CAP.(1608) CH J 470pF/50V or CHD1JJ3CH471
C853CHIP CERAMIC CAP.(1608) B K 4700pF/50VCHD1JK30B472
C854CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C855CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
C11CHIP CERAMIC CAP.(1608) B K 0.01µF /50VCHD1JK30B103
C12ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C13CHIP CERAMIC CAP.(1608) B K 0.01µF /50VCHD1JK30B103
C14CHIP CERAMIC CAP.(1608) B K 0.01µF /50VCHD1JK30B103
C15ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C16ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C17CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C19CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C20ELECTROLYTIC CAP. 3.3µF/50V M H7CE1JMASSL3R3
C21CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C22ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C23CHIP CERAMIC CAP. F Z 0.47µF /10V orCHD1AZ30F474
CHIP CERAMIC CAP. F Z 0.47µF/16V orCHD1CZ30F474
CHIP CERAMIC CAP. FZ Z 0.47µF/25VCHD1EZ3FZ474
C24ELECTROLYTIC CAP. 0.22µF/ 50V M H7CE1JMASSLR22
CONNECTOR
CN1ANGLE PIN HEADER, 9P 6029B-1-09Z003-T5700069
DIODES
D2SWITCHING DIODE 1N4148M orNDTZ01N4148M
SWITCHING DIODE 1SS133(T-77)QDTZ001SS133
ICS
IC1IC:AUDIO PROCESSOR MSP3417G-QG-B8 or NSZBA0SP3002
This maintenance chart shows you the standard of replacement and cleaning time for each part.
Because those may replace depending on environment and purpose for use, use the chart for reference.
h: Hours : Cleaning I: Replace
DeckPeriodic Service Schedule
Ref.No.Part Name1,000 h2,000 h3,000 h4,000 h
B2Cylinder Assembly
B3
B8
B587Tension Lever Assembly
B31
B573, B574
B37Capstan Motor
B52
*B73
*B86F Brake Assembly (HI)II
B133
B410
B414M Brake (SP) Assembly (HI)II
B416
Loading Motor Assembly
Pulley Assembly
ACE Head Assembly
Reel S, Reel T
Cap Belt
FE Head
Idler Assembly (HI)
Pinch Arm Assembly
M Brake (TU) Assembly (HI)
II
I
II
II
I
I
II
II
I
II
II
II
B525
Notes:
1.Clean all parts for the tape transport (Upper Drum with Video Head / Pinch Roller / ACE Head / FE Head) using
90% lsopropyl Alcohol.
2.After cleaning the parts, do all DECK ADJUSTMENTS.
3.For the reference numbers listed above, refer to Deck Exploded Views.
* B73 ------ Recording model only
* B86 ------ Not used in 2 head model.
LDG Belt
II
2-1-1U29PHSMEN
Page 55
Cleaning
Cleaning of Video Head
Clean the head with a head cleaning stick or chamois
cloth.
Procedure
1.Remove the top cabinet.
2.Put on a glove (thin type) to avoid touching the
upper and lower drum with your bare hand.
3.Put a few drops of 90% Isopropyl alcohol on the
head cleaning stick or on the chamois cloth and,
by slightly pressing it against the head tip, turn the
upper drum to the right and to the left.
Notes:
1.The video head surface is made of very hard
material, but since it is very thin, avoid cleaning it
vertically.
2.Wait for the cleaned part to dry thoroughly before
operating the unit.
3.Do not reuse a stained head cleaning stick or a
stained chamois cloth.
Cleaning of ACE Head
Clean the head with a cotton swab.
Procedure
1.Remove the top cabinet.
2.Dip the cotton swab in 90% isopropyl alcohol and
clean the ACE Head. Be careful not to damage the
upper drum and other tape running parts.
Notes:
1.Avoid cleaning the ACE Head vertically.
2.Wait for the cleaned part to dry thoroughly before
operating the unit or damage may occur.
ACE Head
Upper
Cylinder
Do Not !
Video Head
Do Not touch
with your bare
hand!
Cleaning Stick
2-1-2U29PHSMEN
Page 56
SERVICE FIXTURE AND TOOLS
J-1-1, J-1-2
J-3
J-5
J-2
J-4
Ref. No. NamePart No.Adjustment
J-1-1Alignment TapeFL6AHead Adjustment of ACE Head
J-1-2Alignment TapeFL6N8
(2 Head model)
FL6NS8
(4 Head model)
J-2Guide Roller Adj. Screwdriver Available
Locally
J-3MirrorAvailable
Locally
J-4Azimuth Adj. Screwdriver +Available
Locally
J-5Flat Screwdriver -Available
Locally
2-2-1U29PFIX
Azimuth and X Value Adjustment of ACE Head /
Adjustment of Envelope Waveform
Guide Roller
Tape Transportation Check
ACE Head Height
X Value
Page 57
MECHANICAL ALIGNMENT PROCEDURES
Explanation of alignment for the tape to correctly run
starts on the next page. Refer to the information below
on this page if a tape gets stuck, for example, in the
mechanism due to some electrical trouble of the unit.
Service Information
A. Method for Manual Tape Loading/Unloading
To load a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Insert a cassette tape. Though the tape will not be
automatically loaded, make sure that the cassette
tape is all the way in at the inlet of the Cassette
Holder. To confirm this, lightly push the cassette
tape further in and see if the tape comes back out,
by a spring motion, just as much as you have
pushed in.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 for a minute or two to complete
this task.
To unload a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Make sure that the Moving guide preparations are
in the Eject Position.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 until the Moving guide preparations come to the Eject Position. Stop turning when
the preparations begin clicking or can not be
moved further. However, the tape will be left wound
around the cylinder.
5. Turn the LDG Belt in the appropriate direction continuously, and the cassette tape will be ejected.
Allow a minute or two to complete this task.
B. Method to place the Cassette Holder in the tape-
loaded position without a cassette tape
1. Disconnect the AC Plug.
2. Remove the Top Case and Front Assembly.
3. Turn the LDG Belt in the appropriate direction
shown in Fig. M1. Release the locking tabs shown
in Fig. M1 and continue turning the LDG Belt until
the Cassette Holder comes to the tape-loaded
position. Allow a minute or two to complete this
task.
Top View
Moving guide T preparation
(Eject Position)
Moving guide S preparation
(Eject Position)
Push the tape
to load it.
Push the locking tab gently to unlock
when loading without a cassette.
UNLOAD
/EJECT
LOAD
Side View
LDG Belt
Fig. M1
Bottom View
LDG Belt (B)
UNLOAD
/EJECT
Cam Gear
Fig. M2
2-3-1U29P4HSMA
Page 58
1. Tape Interchangeability Alignment
Note:
To do these alignment procedures, make sure that the
Tracking Control Circuit is set to the preset position
every time a tape is loaded or unloaded. (Refer to
page 2-3-4, procedure 1-C, step 2.)
Note: Before starting this Mechanical Alignment, do all
Electrical Adjustment procedures.
Flowchart of Alignment for tape traveling
Loading (Use a blank tape.)
Adjust the height of the Guide Rollers
(Supply side and take-up side).
(Use a blank tape.) (Page 2-3-3)
1-A
No good
Check to see that the tape is not creasing
and that there is no slack on the supply
and take-up side Guide Rollers.
(Use a blank tape.)
Adjust the X Value for maximum envelope.
(Page 2-3-3) (Use Alignment Tape.)
Adjust the envelope. (Page 2-3-4)
Check the envelope.
OK
Adjust the Audio Section.
(Azimuth Alignment) (Page 2-3-4)
Check the audio output.
OK
Check the following:
1. X Value (Page 2-3-3)
2. Envelope (Page 2-3-4)
OK
1-A
1-B
1-C
1-C
1-D
1-D
1-B, 1-C
No good
No good
No good
Do the final tape-traveling test to see that
the tape runs normally in play mode without creasing or slacking.
OK
Check to see that the tape is not creasing
and that there is no slack on the REV Post.
(Use a blank tape.)
OK
Completion
Adjust the X value and envelope.
1-A
1-E
1-B, 1-C
2-3-2U29P4HSMA
Page 59
1-A. Preliminary/Final Checking and
Alignment of Tape Path
Purpose:
To make sure that the tape path is well stabilized.
Symptom of Misalignment:
If the tape path is unstable, the tape will be damaged.
Note: Do not use an Alignment Tape for this procedure. If the unit is not correctly aligned, the tape may
be damaged.
1. Playback a blank cassette tape and check to see
that the tape runs without creasing at Guide Rollers
[2] and [3], and at points A and B on the lead surface. (Refer to Fig. M3 and M4.)
2. If creasing is apparent, align the height of the guide
rollers by turning the top of Guide Rollers [2] and
[3] with a Guide Roller Adj. Screwdriver. (Refer to
Fig. M3 and M5.)
Guide Roller [2]
Guide Roller [3]
ACE Head
4. If creasing or snaking is apparent, adjust the Tilt
Adj. Screw of the ACE Head. (Fig. M6)
Azimuth Adj. Screw
ACE Head
Flat
Screwdriver
Tilt Adj. Screw
Fig. M6
1-B. X Value Alignment
Purpose:
To obtain maximum PB FM envelope signal at the preset position of the Tracking Control Circuit, align the
Horizontal Position of the ACE Head.
Symptom of Misalignment:
If the Horizontal Position of the ACE Head is not properly aligned, maximum PB FM envelope cannot be
obtained at the preset position of the Tracking Control
Circuit.
A
Take-up Guide Post [4]
Lead Surface of Cylinder
Correct
Guide Roller
Tape
Take-up Guide
Post
Tape
B
Incorrect
Tape
Fig. M3
Fig. M4
1. Connect the oscilloscope to TP301 (C-PB) and
TP501 (CTL) on the Main CBA. Use TP502 (RFSW) as a trigger.
2. Playback the Gray Scale of the Alignment Tape
(FL6NS8) and confirm that the PB FM signal is
present.
3. Set the Tracking Control Circuit to the preset position by pressing CH UP button on the remote control unit then “PLAY” button on the unit. (Refer to
note on bottom of page 2-3-4.)
4. Use the Flat Screwdriver so that the PB FM signal
at TP301 (C-PB) is maximum. (Fig. M6)
Fig. M5
3. Check to see that the tape runs without creasing at
Take-up Guide Post [4] or without snaking between
Guide Roller [3] and ACE Head. (Fig. M3 and M5)
2-3-3U29P4HSMA
Page 60
5. To shift the CTL waveform, press CH UP or CH
DOWN button on the remote control unit. Then
make sure that the maximum output position of PB
FM envelope signal become within
set position.
±2ms from pre-
Good
FM envelope signal
2ms
Center Position
5. When Guide Rollers [2] and [3] (Refer to Fig. M3)
are aligned properly, there is no envelope drop
either at the beginning or end of track as shown in
Fig. M9.
Dropping envelope level at the beginning of track.
Fig. M8
FM envelope output signal
is adjusted at maximum.
CTL signal
No Good
FM envelope output signal is low.
Fig. M7
6. Set the Tracking Control Circuit to the preset position by pressing CH UP button on the remote control unit. and then “PLAY” button.
1-C. Checking/Adjustment of Envelope
Waveform
Purpose:
To achieve a satisfactory picture, adjust the PB FM
envelope becomes as flat as possible.
Symptom of Misalignment:
If the envelope output is poor, noise will appear in the
picture. The tracking will then lose precision and the
playback picture will be distorted by any slight variation of the Tracking Control Circuit.
1. Connect the oscilloscope to TP301 (C-PB) on the
Main CBA. Use TP502 (RF-SW) as a trigger.
2. Playback the Gray Scale on the Alignment Tape
(FL6NS8). Set the Tracking Control Circuit to the
preset position by pressing CH UP button and then
“PLAY” button on the unit. Adjust the height of
Guide Rollers [2] and [3] (Fig. M3, Page 2-3-3)
watching the oscilloscope display so that the envelope becomes as flat as possible. To do this adjustment, turn the top of the Guide Roller with the
Guide Roller Adj. Screwdriver.
3. If the envelope is as shown in Fig. M7, adjust the
height of Guide Roller [2] (Refer to Fig. M3) so that
the waveform looks like the one shown in Fig. M9.
4. If the envelope is as shown in Fig. M8, adjust the
height of Guide Roller [3] (Refer to Fig. M3) so that
the waveform looks like the one shown in Fig. M9.
Dropping envelope level at the end of track.
Fig. M9
Envelope is adjusted properly. (No envelope drop)
Fig. M10
Note: Upon completion of the adjustment of Guide
Rollers [2] and [3] (Refer to Fig. M3), check the X
Value by pushing the CH UP or DOWN buttons alternately, to check the symmetry of the envelope. Check
the number of pushes to ensure preset position. The
number of pushes CH UP button to achieve 1/2 level of
envelope should match the number of pushes CH
DOWN button from center. If required, redo the “X
Value Alignment.”
2-3-4U29P4HSMA
Page 61
1-D. Azimuth Alignment of Audio/Con-
trol/ Erase Head
Purpose:
To correct the Azimuth alignment so that the Audio/
Control/Erase Head meets tape tracks properly.
Symptom of Misalignment:
If the position of the Audio/Control/Erase Head is not
properly aligned, the Audio S/N Ratio or Frequency
Response will be poor.
1. Connect the oscilloscope to the audio output jack
on the rear side of the deck.
2. Playback the alignment tape (FL6NS8) and confirm
that the audio signal output level is 8kHz.
3. Adjust Azimuth Adj. Screw so that the output level
on the AC Voltmeter or the waveform on the oscilloscope is at maximum. (Fig. M6)
Note: Upon completion of the adjustment of Azimuth
Adj. Screw, check the X Value by pushing the CH UP
or DOWN buttons alternately, to check the symmetry
of the envelope. Check the number of pushes to
ensure preset position. The number of pushes CH UP
button to achieve 1/2 level of envelope should match
the number of pushes CH DOWN button from center. If
required, redo the “X Value Alignment.”
2. When the tape has been curled up or bent, turn the
alignment screw to adjust the height of REV Post.
(Refer to Fig. M11 and M13.)
REV Post [5]
Take-up Guide Post [4]
Fig. M11
Correct
REV Post
Tape
Take-up Guide
Post
Tape
Incorrect
1-E. Checking and Alignment of Tape
Path during reversing
Purpose:
To make sure that the tape path is well stabilized during reversing.
Symptom of Misalignment:
If the tape path is unstable during reversing, the tape
will be damaged.
Note: Do not use an Alignment Tape for this procedure. If the unit is not correctly aligned, the tape may
be damaged.
1. Insert a black cassette tape into the tray and set
the unit to REV. Then confirm if the tape has been
curled up or bent at the Take-up Guide Post[4] or
REV Post[5]. (Refer to Fig. M11 and M12.)
Fig. M12
Alignment
Screw
Tape Guide
Assembly
Fig. M13
2-3-5U29P4HSMA
Page 62
DISASSEMBLY/ASSEMBLY PROCEDURES
OF DECK MECHANISM
Before following the procedures described below, be sure to remove the deck assembly from the cabinet. (Refer to
CABINET DISASSEMBLY INSTRUCTIONS.)
All the following procedures, including those for adjustment and replacement of parts, should be done in Eject
mode; see the positions of [44] and [45] in Fig. DM1H on page 2-4-3. When reassembling, follow the steps in
reverse order.
* [ 22 ] F Brake Assembly (HI) is not used in 2 head model.
2-4-2U29PHSDA
Page 64
Top View
[14]
[38]
[37]
[7][49][8]
[45][44][46][9]
[32][43][41][40][31][42]
[13]
[11]
[15]
[10]
[12]
[36]
Bottom View
[23]
[24]
[27]
Fig. DM1H
[19]
[35]
[34]
[25]
[26]
[33][20][28][22]
Fig. DM2H
2-4-3U29PHSDA
Page 65
(S-1)
[1]
(S-1)
Fig. DM3H
A
(S-1A)
[3]
[4]
(L-1)
(L-3)
[5]
B
(L-2)
[6]
(P-1)
Installation of [3] and [6]
First, insert [6] diagonally in [3] as shown below. Then,
install [6] in [3] while pushing (L-1) in a direction of
arrow. After installing [6] in [3], confirm that pin A of [3]
enters hole A of [6] properly.
[3]
Pin D
Pin C
Slots B
First, while pushing the locking tab as
shown in the right, slide and pull up the right
side on [2] to release Pin A and Pin B from
the slots A.
Then, remove Pin C and Pin D on [2] from
the slots B as shown.
[2]
2
Pull up
Pin A
A
1
Slide
Pin B
Slot A
Slot A
1
Hole A
[6]
2
Pin A
View for A
(L-1)
Installation of [4] and [6]
Install [6] in [4] while pulling (L-2) in a direction of
arrow. After installing [6] in [4], confirm that pin B of [4]
enters hole B of [6] properly.
[4]
View for B
Hole B
Pin B
[6]
(L-2)
Fig. DM5H
Locking tab
View for A
Fig. DM4H
2-4-4U29PHSDA
Page 66
[7]
[49]
(S-4A)
[11]
(L-4)
(P-3)
Desolder
from bottom
(S-2)
View for A
Lead with
Red Stripe
A
Fig. DM6H
[50]
(L-12)
[13]
Removal of [11]
1) Remove screw (S-4A).
2) Unhook spring (P-2).
3) Release (L-4) while
holding [12] with a
finger.
4) Loosen a finger
holding [12] and
remove [11].
Pin of [12]
Pin of [10]
View for A
[10]
A
Groove of [27]
When reassembling [10] and
[12], confirm that pin of [10]
and pin of [12] are in the
[27]
groove of [27] as shown.
Fig. DM8H-1
[12]
(P-2)
[9]
A
(S-4)
(S-3)
Desolder
from bottom
Lead with White Stripe
LDG
Belt
[8]
[8]
View for A
Fig. DM7H
2-4-5U29PHSDA
Page 67
Installation of [13] and [12]
Hook spring (P-3) up to [12]
and [13], then install then to
the specified position so that
[12] will be floated slightly
while holding [12] and [13].
(Refer to Fig. A.)
Install pin of [12] in groove of [27].
(Refer to Fig. B.)
(P-3)
[13]
Fig. A
Pin of [12]
[27]
[12]
[14]
(S-5)
(S-6)
[15]
Fig. DM9H
Groove of [27]
Fig. B (Top view)
Notch of
Hold [12] and [13] till groove of
pin of chassis looks and fit [13]
in notch of chassis. Then, turn
a few [13] while holding [12].
(Refer to Fig. C.)
Install [11] and [10] while holding [12].
(Refer to Fig. DM8H-1.)
chassis
Groove of
pin of chassis
[13]
turn
[12]
Fig. C
Fig. DM8H-2
[17]
(L-5)
[16]
[18]
(P-4)
(S-7)
Fig. DM10H
2-4-6U29PHSDA
Page 68
Cap Belt
A
[19]
(S-8)
[22]
turn
(C-1)
[20]
(L-6)
[21]
Installation position of Cap Belt
[20]Cap Belt
View for A
Pin on [22]
[27]
Position of pin on [22]
Fig. DM12H
[19]
Fig. DM11H
2-4-7U29PHSDA
Page 69
[24]
(S-9)
(L-8)
(C-4)
(C-5)
[28]
[29]
[30]
[26]
(L-7)
[23]
(C-3)
(C-2)
[25]
Position of Mode Lever when installed
Pin of [36]
Bottom View
[27]
Installation of [26]
Pin of [33]
Align [26] and [27] as shown.
Pin of [37]
[26]
[27]
[31]
Fig. DM13H-1
[33]
Top View
(P-5)
[32]
First groove on [27]
First tooth on [47]
[27]
When reassembling [27],
meet the first groove on
[27] to the first tooth on
[47] as shown.
Refer to the Alignment
Section, Page 2-5-1.
[35]
(L-9)
Fig. DM13H-2
[34]
Fig. DM14H
2-4-8U29PHSDA
Page 70
[38]
(P-6)
[37]
(C-7)
[41]
[39]
turn
(C-6)
[40]
turn
[43]
(L-10)
[42]
[36]
turn
Fig. DM15H
[48]
[47]
Slide
Fig. DM17H
[44]
Slide Plate
(S-11)
[45]
[46]
(L-11)
Fig. DM16H
2-4-9U29PHSDA
Page 71
ALIGNMENT PROCEDURES OF MECHANISM
The following procedures describe how to align the
individual gears and levers that make up the tape loading/unloading mechanism. Since information about the
state of the mechanism is provided to the System
Control Circuit only through the Mode Switch, it is
essential that the correct relationship between individual gears and levers be maintained.
All alignments are to be performed with the mechanism in Eject mode, in the sequence given. Each
procedure assumes that all previous procedures have
been completed.
IMPORTANT:
If any one of these alignments is not performed properly, even if off by only one tooth, the unit will unload or
stop and it may result in damage to the mechanical or
electrical parts.
Alignment points in Eject Position
Top View
Alignment 3
Alignment 1
Loading Arm (SP) and (TU) Assembly
Install Loading Arm (SP) and (TU) Assembly so that
their triangle marks point to each other as shown in
Fig. AL2.
Alignment 2
Mode Gear
Keeping the two triangles pointing at each other, install
the Loading Arm (SP) Assembly so that the last tooth
of the gear meets the most inside teeth of the Mode
Gear. See Fig. AL2.
Triangle Marks
Loading Arm
(SP) Assembly
Last Tooth
Alignment 2
Loading Arm
(TU) Assembly
Most inside teeth
of Mode Gear
Alignment 1
Mode Gear
Bottom View
Alignment 1
Alignment 2
Fig. AL1
Fig. AL2
Alignment 3
Cam Gear (A) (HI), Rack Assembly
Install the Rack Assembly so that the first tooth on the
gear of the Rack Assembly meets the first groove on
the Cam Gear (A) (HI) as shown in Fig. AL3.
Top View
Cam Gear (A)(HI)
Alignment 3
First tooth
First groove
on the Cam Gear (A)(HI)
Gear on Rack Assembly
Fig. AL3
2-5-1U29PHSAPM
Page 72
DECK EXPLODED VIEWS
Deck Mechanism View 1
B2
B9
L1191
B73
B10
L1053
B411
B567
L1467
B494
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
B35
B553
(Blue grease)
B5
L1322
B12
B11
B571
L1450
B492
B74
L1051
B37
B410
L1450
B121
B8
Chassis Assembly
Top View (Lubricating Point)
B501
L1466
B126
B86
Some Ref. Numbers are not in sequence.
Chassis Assembly
Bottom View (Lubricating Point)
2-6-1U29P4HSDEX
Page 73
Deck Mechanism View 2
B487
B587
B416
B521
B591
MarkDescription
Floil G-684G or Multemp MH-D
(Blue grease)
SLIDUS OIL #150
SANKOUL FG84M (Yellow grease)
B508
B414
B572
B565
B499
B417
B568
B573
B585
B574
B518
B564
B590
B148
B592
B31
B522
L1151
L1406
B3
B558
B557
B525
B578
B579
B582
B580
B583
B579
View
for A
Some Ref. Numbers are not in sequence.
A
B581
B559
B516
B133
B52
B551
B507
B488
B491
B513
Bottom Side (Grease point)
Bottom Side
(Grease point)
2-6-2U29P4HSDEX
Page 74
Deck Mechanism View 3
L1321
B355
L1341
B347
B482
L1321
B354
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
B483
B425
(Blue grease)
B562
B563
B300
B313
B529
B360
B359
B361
B555
Some Ref. Numbers are not in sequence.
B303
B514
2-6-3U29P4HSDEX
Page 75
DECK PARTS LIST
Ref. No.DescriptionPart No.
B2CYLINDER ASSEMBLY MK12.5 PAL 6HD orN236ACYL
CYLINDER ASSEMBLY MK12.5 PAL 6HD(V)N236BCYL
B3LOADING MOTOR ASSEMBLY MK12.50VSA14636
B5SLIDE PLATE MK12.50VM416429
B8PULLEY ASSEMBLY(HI) MK120VSA13501
B9MOVING GUIDE S P.P MK12.50VSA14717
B10MOVING GUIDE T P.P MK12.50VSA14639
B11LOADING ARM(TU) ASSEMBLY MK120VSA13300
B12LOADING ARM(SP) ASSEMBLY MK120VSA13299
B31AC HEAD ASSEMBLY MK12.50VSA14841
B35TAPE GUIDE ARM ASSEMBLY MK12.50VSA15014
B37CAPSTAN MOTOR 288/VCZC1301N9681CML
B52CAP BELT MK100VM411138
B73FE HEAD(MK11) MH-131SF11 orDHVEC01Z0005
FE HEAD(MK12) VTR-1X2ERS11-155 orDHVEC01TE005
FE HEAD(MK12) HVFHP0047ADHVEC01AL007
B74PRISM MK100VM202870
B86F BRAKE ASSEMBLY(HI) MK120VSA13447
B121WORM MK120VM414091
B126PULLEY MK120VM414330B
B133IDLER ASSEMBLY(HI) MK12.50VSA14849
B148TG CAP MK60VM407664C
B300C DRIVE LEVER(TU) MK120VM203773
B303F DOOR OPENER MK120VM203751C
B313C DRIVE SPRING MK120VM414145
B347GUIDE HOLDER A MK100VM304920
B354SLIDER(TU) MK120VM101172F
B355SLIDER(SP) MK120VM101182H
B359CLEANER LEVER MK100VM304413
B360CLEANER ROLLER MK90VM410032C
B361CL POST MK100VM411114
B410PINCH ARM(A) ASSEMBLY(6) MK12.5 or0VSA14935
PINCH ARM(A) ASSEMBLY(5) MK120VSA13788
B411PINCH SPRING MK120VM414644
B414M BRAKE(SP) ASSEMBLY(HI) MK120VSA13655
B416M BRAKE(TU) ASSEMBLY(HI) MK120VSA13449
B417TENSION SPG(3002645) MK12.50VM414221G
B425LOCK LEVER SPRING MK100VM411110
B482CASSETTE PLATE MK120VM203749
B483LOCK LEVER MK120VM414095
B487BAND BRAKE(SP) MK120VM305723
B488MODE LEVER(HI) MK12 or0VM101175J
MODE LEVER(HI) MK12.50VM101352
B491CAM GEAR(A)(HI) MK120VM101176
B492MODE GEAR(LM) MK120VM204236
B494C DOOR OPENER MK120VM305719
B499T LEVER HOLDER MK120VM305729
B501WORM HOLDER MK12 or0VM203767
WORM HOLDER(R) MK120VM204324
B507REEL WASHER MK9 5*2.1*0.50VM410058
B508S BRAKE SPRING(HI) MK120VM414899
B513P.S.W F 6*2.55*0.50VM402629A
B514SCREW RACK MK100VM411535
B516REEL WASHER MK9 5*2.1*0.50VM410058
B518P.S.W CUT 1.6X4.0X0.5T0VM408485A
B521REV BRAKE SPG(HI) MK120VM414943
Ref. No.DescriptionPart No.
B522TG POST ASSEMBLY MK100VSA11012
B525LDG BELT MK110VM412804
B529CLEANER ASSEMBLY MK100VSA11161
B551FF ARM(HI) MK120VM306183
B553REV SPRING MK110VM412555
B555RACK ASSEMBLY MK120VSA13289
B557MOTER PULLEY U50VM403205
B558LOADING MOTOR M31E-1 R-14 7401 orMMDZB12MM007
LOADING MOTOR M31E-1 R-14 7402MMDZB12MM008
B559CLUTCH ASSEMBLY(HI) MK120VSA13450
B562C DRIVE LEVER(SP) MK120VM203772
B563SLIDER SHAFT MK120VM305762
B564M GEAR(HI) MK120VM305755
B565SENSOR GEAR(HI) MK120VM305756
B567PINCH ARM(B) MK120VM305718
B568BT ARM MK120VM305728
B571P.S.W CUT 1.6X4.0X0.5T0VM408485A
B572P.S.W CUT 1.6X4.0X0.5T0VM408485A
B573REEL S MK110VM203436
B574REEL T MK100VM202872C
B578TR GEAR A MK100VM304440
B579TR GEAR B MK120VM305900
B580TR GEAR C MK120VM305743A
B581CENTER GEAR MK110VM305081
B582TR GEAR SPRING MK100VM411187C
B583CAM WASHER MK120VM414741
B585PSW(317505) MK110VM413663
B587TENSION LEVER ASSEMBLY MK120VSA13279
B590BRAKE ARM(TU) MK120VM203752E
B591BAND BRAKE(TU) MK120VM305724C
B592TG POST MK100VM411108E
L1051SCREW, B-TIGHT M2.6X6 PAN HEAD+GPMB9060
L1053SCREW, S-TIGHT M2.6X8 WASHER HEAD+GCMS9080
L1151SCREW, SEMS M2.6X4 PAN HEAD+CPM39040
L1191SCREW, S-TIGHT M2.6X8 WASHER HEAD+GCMS9080
L1321SCREW, S-TIGHT M3X6 BIND HEAD+GBMS3060
L1322SCREW, B-TIGHT M2.3X4 BIND HEAD+GBMBY040
L1341SCREW, P-TIGHT M2X6 PAN HEAD+GPMP2060
L1406AC HEAD SCREW MK90VM410964
L1450SCREW, SEMS M2.6X5 PAN HEAD+CPM39050
L1466SCREW, S-TIGHT M2.6X6 BIND HEAD+GBMS9060
L1467SCREW M2.6X5 WASHER HEAD+SCM39050
200406282-7-1HG421DPL
Page 76
VCX606
HG421FD
2004-07-20
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