I Specifications
I Preparation for Servicing
I Adjustment Procedures
I Schematic Diagrams
I CBA’s
I Exploded views
I Parts List
Sec. 2: Deck Mechanism Section
I Standard Maintenance
I Alignment for Mechanism
I Disassembly/Assembly of Mechanism
I Alignment Procedures of Mechanism
I Deck Exploded Views
I Deck Parts List
VIDEO CASSETTE RECORDER
VCX602
SECAMPAL
Page 2
MAIN SECTION
VIDEO CASSETTE RECORDER
VCX602
Sec. 1: Main Section
I Specifications
I Preparation for Servicing
I Adjustment Procedures
I Schematic Diagrams
I CBA’s
I Exploded Views
I Parts List
4-1. Video outputVp-p0.81.01.2E-E Mode
4-2. Video S/NdB3942E-E Mode
4-3. Audio outputdB-10-6-2E-E Mode
4-4. Audio S/NdB4046E-E Mode
Note: Nominal specs represent the design specs. All units should be able to approximate these – some will exceed
and some may drop s lightly bel ow these s pecs. Limi t specs repr esent the absolute w orst condi tion that s till migh t
be considered acceptable; In no case should a unit fail to meet limit specs.
1-1-1HG240SP
Page 4
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related cha racteristics which are often not ev ident from visual inspection, nor can the protection they
give necessarily be obtained by replacing them with
components rated for higher voltage, wattage, etc.
Parts that have special safety characteristics are identified by a ! on schematics and in parts lists. Use of a
substitute replacement that does not have the same
safety characteristics as the recommended replacement part might create shock, fire, and/or other hazards. The Product’s Safety is under review
continuously and new instructions are issued whenever appropriate. Prior to shipment from the factory,
our products are carefully inspected to confirm with
the recognized pro duct safety and electrical code s of
the countries in which t hey ar e to be sold. However, in
order to maintain suc h com pliance, it is eq ually impor tant to implement the following precautions when a set
is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spurious ra diation. Thes e must also be
replaced only with specified replacements.
Examples: RF converter s, RF cables, noise blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
F. Observe that the wires do not contact heat pro duc-
ing parts (heatsinks, oxid e metal fi lm r esist ors, fus ible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has been repla ced, check tha t
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repaired locations.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power transformer uses crimp type co nne cto rs
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent
shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important: Do not re-use a connector. (Discard it.)
2)Strip about 15 mm of the i nsulation fro m the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimpi ng to o l to cr i mp the me tal sleeve at it s
center. Be sure to crimp full y to the complete c losure of the tool.
L. When connecting or disconnecting the internal
connectors, first, dis connect the AC plug from the
AC outlet.
1-2-1U29P_F_SFP
Page 5
Safety Check after Servicing
1
B
Z
2
Examine the area surrounding the repaired location for
damage or deterioration. Obs erve that screws, parts,
and wires have been returned to their original positions. Afterwards, do the following tests and confirm
the specified values to verify compliance with safety
standards.
1. Clearance Dist ance
When replacing primary circuit components, confirm
specified clear ance distance (d) a nd (d’) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
T a ble 1 : Ratings for selected area
AC Line VoltageClearance Distance (d) (d’)
230 V
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
≥3mm(d)
≥6 mm(d’)
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure a cross the terminals o f load
Z. See Fig. 2 and the following table.
Chassis or Secondary Conductor
Primary Circuit Terminals
dd'
Fig.
Exposed Accessible Part
AC Voltmeter
(High Impedance)
One side of
Power Cord Plug Prongs
Fig.
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2kΩ RES.
Connected in
230 V
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
parallel
50kΩ RES.
Connected in
parallel
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
1-2-2U29P_F_SFP
One side of power cord plug
prongs (B) to:
RF or
Antenna terminals
A/V Input, Output
Page 6
STANDARD NOTES FOR SERVICING
Circuit Board Indications
a. The output pin of the 3 pin Regulator ICs is indi-
cated as shown.
Top View
Out
b. For other ICs, pin 1 and every fifth pin are indicated
as shown.
Pin 1
c. The 1st pin of every ma le con nec tor is in dic ate d as
shown.
Input
In
Bottom View
5
10
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
How to Remove / Install Fl at Pack- IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:.
(1) Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Pin 1
Instructions for Connectors
1. When you con nect or dis conne ct the FFC ( Flexi ble
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an angle.
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
Fig. S-1-1
(2) Remove the flat pack-IC with tweezers while apply-
ing the hot air.
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing en tire flat pack-IC, first apply
soldering iron to c ent er of the fl at pack- IC and he at
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Caution:
1. The Flat Pack -IC shape may differ by models. Us e
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chi p parts around the
flat pack-IC for over 6 seconds because damage to
the chip parts may occur. Put masking tape aroun d
the flat pack-IC to protect other parts from damage.
(Fig. S-1-2)
1-3-1NOTE_1
Page 7
3. The flat pack-IC on th e CBA i s a ffixed with g lue , so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when removing
it.
Hot-air
Flat Pack-IC
Desoldering
CBA
Masking
Tape
Machine
Flat Pack-IC
Tweezers
Fig. S-1-2
With Soldering Iron:
(1)Using desoldering braid, remove the solder from all
pins of the flat pack-IC . When you use solder flux
which is applied to all pin s of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
Flat Pack-IC
Desoldering Braid
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing en tire flat pack-IC, first apply
soldering iron to c ent er of the fl at pack- IC and he at
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
With Iron Wire:
(1)Using desoldering braid, remove the solder from all
pins of the flat pack-IC. W hen you use solder flux
which is applied t o all pins of the fl at pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the s older
melts so as to lift the IC leads from the CBA contact
pads as shown in Fig. S-1-5
(4) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing en tire flat pack-IC, first apply
soldering iron to c ent er of the fl at pack- IC and he at
up. Then remove (glue will be melted). (Fig. S-1-6)
(5) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Note:
When using a solder ing iron, care must be taken
to ensure that the flat pack-IC is not being held by
glue. When the flat pack-IC is removed from the
CBA, handle it gently because it m ay be dam age d
if force is applied.
Soldering Iron
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which sol der will
not adhere (iron wi re). When hea ting the pins , use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
Hot Air Blower
or
Iron Wire
Soldering Iron
To Solid
Mounting Point
Fig. S-1-5
1-3-2NOTE_1
Page 8
Instructions for Handling
Semi-conductors
CBA
Tweezers
Fine Tip
Soldering Iron
Flat Pack-IC
Fig. S-1-6
2. Installation
(1) Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA so
you can install a replacement flat pack-IC more
easily.
(2)The “ I ” mark on the flat pack-IC indica tes pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positio ning for installatio n. Then
presolder the four corne rs of the flat pack-IC. ( See
Fig. S-1-8.)
(3)Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
Electrostatic breakdown of the semi-conductors may
occur due to a poten tial difference caused by elec trostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a groun ding ban d (1M Ω) that is properly grounded to r emo ve any static electric it y t hat may
be charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper pla te
with proper grounding (1MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on clothing will not escape through the b ody grounding band,
be careful to avoid contacting semi-conductors with
your clothing.
<Incorrect>
CBA
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Presolder
Fig. S-1-7
<Correct>
1MΩ
Grounding Band
1MΩ
CBA
Conductive Sheet or
Copper Plate
CBA
Flat Pack-IC
Fig. S-1-8
1-3-3NOTE_1
Page 9
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors
Caution:
An optical sensor system is used for the Tape Start
and End Sensors on this equipment. Carefully read
and follow the instructions below. Otherwise the unit
may operate erratically.
What to do for preparation
Insert a tape into the Deck Mechanism Assembly and
press the PLAY button. The tape will be loaded into
the Deck Mechanism A ssembly. Make sure the power
is on, connect TP507 (S-INH) to GND. This will stop
the function of Tape Start Sensor, Tape End Sensor
and Reel Sensors. (If these TPs are connec ted befo re
plugging in the unit, the function of the sensors will
stay valid.) See Fig. 1.
Note: Because the Tape End Sensors are inactive, do
not run a tape all the way to the start or the end of the
tape to avoid tape damage.
Q505
Q504
TP507
S-INH
Fig. 1
1-4-1HG240PFS
Page 10
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembly Flowchart
This flowchart indicates the disassembly steps to gain
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[1] Top Case
[2] Front Assembly
[3] VCR Chassis Unit
[4] Jack CBA
[5] Deck Assembly
[6] Main CBA
[7] Cylinder Shield
2. Disassembly Method
REMOVAL
ID/
LOC.
No.
PART
REMOVE/*UNHOOK/
Fig.
UNLOCK/RELEASE/
No.
UNPLUG/DESOLDER
Note
(1):Identification (location) No. of parts in the figures
(2): Name of the part
(3): Figure Number for reference
(4): Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P=Spring, L=Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs ( L-2)
(5): Refer to “Reference Notes.”
Reference Notes
CAUTION: Locking Tabs (L-1) and (L-2) are fragile.
Be careful not to break them.
1. Remove five Screws (S-2), two Screws (S-3) and
Screw (S-4). Then, slowly lift the VCR Chassis Unit
(Deck Assembly, Jack CBA and Main CBA) up.
2. When reassembling, solder wire jumpers as shown
in Fig. D5.
3. Before installing the Deck Assembly, be sure to
place the pin of LD-SW on M ain CBA as shown in
Fig. D6. Then, install the Deck Assembly while
aligning the hole of Cam Gear with the pin of LDSW, the shaft of Cam Gear with the hole of LD- SW
as shown in Fig. D6.
[1]Top CaseD17(S-1)-
Front
[2]
Assembly
VCR
[3]
Chassis
Unit
[4]Jack CBAD4Desolder, (S-5)-
Deck
[5]
Assembly
[6]Main CBA D5-----------
Cylinder
[7]
Shield
↓
(1)
↓
(2)
D2*3(L-1),*4(L-2)-
D35(S-2), 2(S-3), (S-4), 1
D5,
2(S-6), Desolder2,3
D6
D5(S-7)-
↓
(3)
↓
(4)
↓
(5)
1-5-1HG240DC
Page 11
(S-1)
[1] T op Case
(S-1)
(S-1)
Fig. D1
(S-2)
[3] VCR
Chassis Unit
(S-2)
(S-3)
(S-2)
(S-4)
(S-3)
(S-2)
(L-2)
[2] Front
Assembly
(L-1)
(L-2)
Fig. D3
[4] Jack CBA
(S-5)
Desolder
Fig. D2
Fig. D4
1-5-2HG240DC
Page 12
[7] Cylinder Shield
FE Head
Cylinder Assembly
(S-7)
Pin
[5] Deck
Assembly
From
FE Head
From
Cylinder
Assembly
(S-6)
TOP VIEW
From
ACE Head
Assembly
ACE Head
Assembly
[6] Main CBA
(S-6)
From
Capstan Motor
Assembly
Lead with
blue stripe
[6] Main CBA
[5] Deck Assembly
Shaft
Hole
LD-SW
SW507
LD-SW
Cam Gear
Hole
Pin
[6] Main CBA
Fig. D6
Printing
Lead with
white stripe
Lead connections of Deck Assembly and Main CBA
Lead with
blue stripe
Desolder
from bottom
side
Fig. D5
1-5-3HG240DC
Page 13
ELECTRICAL ADJUSTMENT INSTRUCTIONS
e
2
)
C
C
c
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
1.Electrical ad justments are r equired after repl acing
circuit components and certain mechanical parts.
It is important to do these adjustments only after
all repairs and replacements have been completed. Also, do not attempt these adjustments
unless the proper equipment is available.
2.To perform these alignment / confirmation procedures, make su re that th e trac king c ontrol is se t in
the center position: Pr ess either " L " or "K" button
on the remote control unit first, then the "PLAY"
button (Front Panel only).
Test Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe,
V-Range: 0.001~50V/Div.,
F-Range: DC~AC-20MHz
2.Alignment Tape (FL6A)
Head Switching Position Adjustment
Purpose:
To determine the Head Switching position during
playback.
Symptom of Misadjustment:
May cause Head Switching noise or ver tical jitter
in the picture.
Test pointAdj.PointModeInput
J23(V-OUT)
TP502(RF-SW)
GND
Tape
FL6AOscilloscope
Connections of Measurement Equipment
Main CBA
VR501
(Switching Point)
(MAIN CBA)
Measurement
Equipment
J23
GND
TP502
PLAY
(SP)
6.5H±1H
(412.7µs±63.5µs)
Oscilloscop
-----
Spec.
CH1 CH
Trig. (+
Figure 1
EXT. Syncronize Trigger Point
H1
H2
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edge of the CH1 video output waveform is at the 6.5H±1H(412.7µs±63.5µs) delayed position from the rising edge of the CH2 head switching
pulse waveform.
1.0H
6.5H+/-1H (412.7µs+/-63.5µs)
Switching Pulse
0.5H
V-Syn
1-6-1HG240EA
Page 14
BLOCK DIAGRAMS
Servo/System Control Block Diagram
TO
AUDIO BLOCK
FROM/TO
VIDEO BLOCK
TP507
SENS-INH
KEY
SWITCH
KEY
SWITCH
8
7
KEY- 2
KEY- 1
IC501
(SERVO/SYSTEM CONTROL)
AL+5V
D502
S-LED
CTL(+)
LD-SW
9
95
AL+5V
D561 STAND-BY
+5V
CTL(-)
94
ST-S
END-S
10480
D562 POWER
Q562
S-REEL
T-REEL
79
D563 CAS
23
POWER-LED
RESET
34
RESET
TIMER+5V
S-REEL
PS503
Q563
Q501
D564 TIMER
Q564
24
CAS-LED
D565 REC
Q565
25
TIMER-LED
CTL AMP OUT
97
CTL
TP501
SDA
SDA
TU701(TUNER UNIT)
3
12
26
REC-LED
SCL
5
SCL
11
AL+5V
VR501
SDA
IC503 (MEMORY)
5
REMOTE
SENSOR
RS501
14
REMOCON-IN
REC-
SAF-SW
PG-DELAY
2
31
AL+5V
SW-POINT
SCL
6
REC-
SW506
A-MUTE-H
IIC-BUS SCL
AUDIO-SW-1
AUDIO-SW-2
IIC-BUS SDA
29
30
AUDIO-SW-1
AUDIO-SW-2
SAFETY
P-ON+15V
AL+12V
CN502
P-ON+15V11AL+12V(2)10GND9D-PFG8D-CONT7LM-FWD/REV
12
RF-SW
D-REC-H
IIC-BUS SCL
IIC-BUS SDA
71
33
72
83
A-MUTE-H
D-REC-H
IIC-BUS SCL
IIC-BUS SDA
D-CONT
LM-
FWD/REV
D-PFG
90
C-CONT
77
76
81
GND5C-CONT4C-F/R3C-FG2P-ON+5V1AL+12V/+20.5V
6
C-ROTA
151318
RF-SW
C-ROTA
C-F/R
78
V-ENV
C-SYNC
D-V SYNC
6
V-ENV
D-V-SYNC
C-FG
87
AL+12V/+20.5V
P-ON+5V
TRICK-H
SECAM-H
58
65
C-SYNC
TRICK-H
C-POW-SW
FROM/TO
61
SECAM-H
P-ON-H
C-POW-SW
P-DOWN-L
67
66
86
P-ON-H
P-DOWN-L
POWER
SUPPLY
BLOCK
SW507
MAIN CBA
LD-SW
Q504
ST-S
SENSOR CBA
Q503
TP506
T-REEL
END-S
Q505
END-S
SENSOR CBA
CN504
2 CTL(+)
1 CTL(-)
CONTROL
HEAD
(DECK ASSEMBLY)
1-7-1
AC HEAD ASSEMBLY
CYLINDER ASSEMBLYCAPSTAN MOTOR
PG
M
CAPSTAN
MOTOR
SENSOR
M
DRUM
MOTOR
M
LOADING
MOTOR
HG223BLS
Page 15
Video Block Diagram
REC-VIDEO SIGNAL PB-VIDEO SIGNAL MODE: SP/REC
IIC-BUS SDA
IIC-BUS SCL
FROM
SERVO/SYSTEM
CONTROL BLOCK
50
55
CYLINDER ASSEMBLY
(DECK ASSEMBLY)
123
V(R)
CN253
969593
7978
69684643
SERIAL
DECORDER
Y. DELAY
65
VIDEO (L)-1
HEAD
VIDEO (R)-1
HEAD
V(L)
V-COM
94
SP
HEAD
AMP
SP
EP
P
R
LUMINANCE
SIGNAL
PROCESS
AGC
BYPASS
WF1
TP502
EP
HEAD
AMP
REC FM
AGC
+
Y
CCD 1H DELAY
CHARA.
INS.
RF-SW
C
CHROMINANCE
1/2
FROM/TO SERVO/SYSTEM
CONTROL BLOCK
V-ENV
RF-SW
C-ROTA
D-REC-H
D-V-SYNC
84
62
70
80
V-ENV
D-REC-H
D-V-SYNC
C-ROTA/RF-SW
RPRP
SIGNAL
PROCESS
Y/C
FBC
C-SYNC
TRICK-H
67
C-SYNC
MIX
SECAM-H
PR
IC370 (PAL/SECAM DECTECTOR)
28
44
PB-H OUT
21
25
2928
AGCVXO
5859
PAL/SECAM
DETECTOR
1
171418216
29
WF2
C-PB
TP301
X301
4.433619MHz
IC501 (OSD)
MAIN CBA
COLOR
-IN
OSD
CHARACTER
MIX
52
IC301
(Y/C SIGNAL PROCESS)
BUFFER
Q351
IN1
IN2
TUNER
485052
6
24
VIDEO IN
VIDEO OUT
TU701(TUNER UNIT)
1-7-2
IN2
MUTE
PB/EE
IN1
MUTE
TUNER
PB/EE
56
WF3
JACK CBA
J23
61
63
V-OUT
CN151
CN101
Q101
JK101
CN152
1
V-OUT1
V-IN1
33
1
CN102
20
V-IN1
Q102
JK102
BUFFER
19
V-OUT1
1
V-OUT2
V-IN23
3
1
BUFFER
19
20
V-OUT2
V-IN2
HG223BLV
Page 16
Audio Block Diagram
Mode : SP/REC
PB-AUDIO SIGNALREC-AUDIO SIGNAL
MAIN CBA
PB/EE
IC151 (SWITCHING)
152
PB/EE
PB/EE
3
4
IN2
1214151110
PB/EE
TUNER
IN1
IN1
13
TO SERVO/SYSTEM
CONTROL BLOCK
AUDIO-SW-1
AUDIO-SW-2
9
SW
CTL
ALC
TO SERVO/SYSTEM
71
68 69
16
CONTROL BLOCK
A-MUTE-H
IIC-BUS SCL
IIC-BUS SDA
11
12
MUTE
SERIAL
DECODER
AUDIO HD-SW
CONTROL
DET
INV
LINE
R
ALC
AMP
ATT
REC-ON
P
REC
AMP
2
21
AUDIO
TU-AUDIO
TU701(TUNER UNIT)
CN151
5
7
A-IN1
A-OUT1
5
7
CN101
Q151
CN152
8
A-IN2
8
CN102
BUFFER
6
A-OUT2
6
Q152
BUFFER
TUNER
IC301 (AUDIO SIGNAL PROCESS)
IN1
IN2
151317
EQ
PB-ON
5
98
AMP
6
7
SP/LP-ON
+5V
Q401
CN504
BIAS
Q402
3 A-PB/REC
4 A-COM
6 AE-H
100
3
AUTO
1
OSC
5 AE-H/FE-H
BIAS
2
Q406
+5V
Q403
(SWITCHING)
CN501
2 FE-H
Q405
(PB=ON)
1 FE-H-GND
JACK CBA
JK101
261
A-IN1
A-IN1
3
A-OUT1
A-OUT1
JK102
261
A-IN2
A-IN2
3
A-OUT2
A-OUT2
1-7-3
ACE HEAD ASSEMBLY
AUDI O
HEAD
(DECK ASSEMBLY)
AUDI O
ERASE
HEAD
FE HEAD
FULL
ERASE
HG223BLA
HEAD
Page 17
Power Supply Block Diagram
P-ON+44V
P-ON+15V12P-ON-H
AL+12V/+20.5V
AL+12V
AL+5V
TIMER+5V
C-POW-SW
P-ON+5V
P-DOWN-L
AL-5V
MAIN CBA
T001
Q051
Q054
Q055
Q059
Q057
Q052
131514
2
Q058
16
4
Q001
Q056
SHUNT
REGULATOR
Q004
11
17
18
1
4
IC001
ERROR
6
7
VOLTAGE DET
COLD
23
BRIDGE
RECTIFIER
D001 - D004
LINE
FILTER
F001L003
T1.6A L 250V
HOT CIRCUIT. BE CAREFUL.
AC001
1-7-4
Q002
Q003
HOT
HG223BLP
Page 18
FUNCTION INDICATOR SYMBOLS
Note:
The following symbol s wil l app ear o n th e i ndi cator panel to in di cat e th e c urr ent mod e o r ope ratio n o f the V CR.
On-screen modes will also be momentarily displayed on the tv screen when you press the operation buttons.
Display panel
STANDBY
FUNCTION
TAPE IN
TIMER
MODEINDICATOR ACTIVE
STANDBYPower on = " H "
Power off = " L "
FUNCTIONVCR mode = " H "
TV mode = " L "
TAPE INCassette in = " H "
Cassette out = " L "
TIMERTimer stand by = " H "
One touch recording = " H "
Timer recording = " H "
General mode = " L "
RECREC mode = " H "
REC pause
General mode = " L "
REC
" H "= LED Light on, " L "= LED Light off
Blinks at 0.8Hz interval
When reel and capstan mechanism is not
functioning correctly
When tape loading mechanism is not functioning correctly
When cassette loading mechanism is not
functioning correctly
When the drum is not working properly
P-ON Power safety detection
“A R” is displayed on a TV screen. (Refer to Fig. 1.)
“A T” is displayed on a TV screen. (Refer to Fig. 2.)
“A C” is displayed on a TV screen. (Refer to Fig. 3.)
“A D” is displayed on a TV screen. (Refer to Fig. 4.)
“A P” is displayed on a TV screen. (Refer to Fig. 5.)
1-7-5HG221FIS
Page 19
TV screen
Note:
OSD for mechanical error will be displayed for 5 sec. after the mechanical error occurs.
When reel and capstan mechanism is not functioning
correctly
A
R
Fig. 1
When tape loading mechan ism is not functioni ng correctly
A
T
Fig. 2
When cassette lo ading mechanism is not functioning
correctly
When the drum is not working properly
A
D
P-ON Power safety detection
A
P
Fig. 4
Fig. 5
A
C
Fig. 3
1-7-6HG221FIS
Page 20
SCHEMATIC DIAGRAMS / CBA’S AND TEST POINTS
(
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using replacement components rated for higher voltage, wattage,
etc. Replacemen t parts that h ave thes e spec ial sa fety
characteristics are identified in this manual and its
supplements; electric al components having such features are identified by the mark " ! " in the schematic
diagram and the parts list. Before replacing any of
these components, read the parts list in this manual
carefully. The use of substitute replacement parts tha t
do not have th e same safe ty characteri stics as sp ecified in the parts list may create shock, fire, or other
hazards.
Capacitor Temperature Markings
Mark
Capacity
change rate
Standard
temperature
Temperature
range
Notes:
1. Do not use the part number shown on thes e drawings for or de ri n g. Th e co rr ect part number i s show n
in the parts list, and may be slightly different or
amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Resistor wattages are 1/4 W or 1/6W unless otherwise specified.
4. All capacitance values are indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identified by fo ur digits. The fir st two digits are not shown for each component. In each
block of the diag ram , ther e is a not e suc h as sh own
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
(B)
(F)+30 - 80%20°C-25~+85°C
(SR)
(Z)+30 - 80%20°C-10~+70°C
Capacitors and transistors are represented by the following symbols.
±10%
±15%
CBA Symbols
(Top View) (Bottom View)
Bottom View)
Transistor or Digital Transistor
E C B
(Top View)
E C B
NPN Transistor
20°C-25~+85°C
20°C-25~+85°C
Schematic Diagram Symbols
Digital Transistor
+
Electrolytic Capacitor
(Top View)
PNP Transistor
E C B
(Top View)
E C B
NPN Digital Transistor
(Top View)
PNP Digital
Transistor
E C B
1-8-1SCPA1
Page 21
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOWING
1
".
".
3
2
1
PAGES:
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, first check to see that all components in the power supply circuit are not defective
before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the power
supply circuit to fail.
3. Note:
(1) Do not use the part number shown on the drawings for ordering. The correct part number is shown in the parts
list, and may be slightly different or amended since the drawings were prepared.
(2) To maintain original function and reliability of repaired units, use only original replaceme nt parts which are
listed with their part numbers in the parts list section of the service manual.
4. Mode: SP/REC
5. Voltage indications for PLAY and REC modes on the schematics are as shown below:
Unit: Volts
The same voltage for
both PLAY & REC modes
6. How to read converged lines
-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to area "D3
2. "1-B1" means that line number "1" goes to area "B1
7. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
: Used to indicate a test point with no test pin.
5.0
231
5.0
PLAY mode
REC mode
(2.5)
Indicates that the voltage
is not consistent here.
AREA D3
1-B1
AREA B1
1-D3
ABCD
: Used to indicate a test point with a test pin.
1-8-2SCRK05
Page 22
Main 1/6 Schematic Diagram
1-8-3
1-8-4
HG223SCM1
Page 23
Main 2/6 & Sensor Schematic Diagrams
1-8-5
1-8-6
HG223SCM2
Page 24
Main 3/6 Schematic Diagram
1-8-7
1-8-8
HG223SCM3
Page 25
Main 4/6 & Jack Schematic Diagrams
1-8-9
1-8-10
HG223SCM4
Page 26
Main 5/6 Schematic Diagram
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
1-8-11
1-8-12HG223SCM5
Page 27
Main 6/6 Schematic Diagram
1-8-13
1-8-14HG223SCM6
Page 28
Main CBA Top View
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE :
The voltage for parts in hot circuit is measured
using hot GND as a common terminal.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
Sensor CBA Top View
BHF300F01011A
BHF300F01011B
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
WF3
J23
V-OUT
WF1
TP502
RF-SW
VR501
SW-P
TP507
S-INH
TP501
CTL
WF2
TP301
C-PB
1-8-15
1-8-16
BHG470F01014A
Page 29
Main CBA Bottom View
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE :
The voltage for parts in hot circuit is measured
using hot GND as a common terminal.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
1-8-171-8-18
BHG470F01014A
Page 30
Jack CBA Top View
Jack CBA Bottom View
1-8-19
1-8-20
BHG470F01014C
Page 31
WAVEFORMS
WF2
UPPER
TP301
WF1
LOWER
TP502
C-PB 10mV x 10
RF-SW 0.5V x 10
5ms
WF3
UPPER
J23
WF1
LOWER
TP502
V-OUT 0.1V x 10
RF-SW 0.5V x 10
50µs
WF3
J23
V-OUT E-E
10µs 50mV x 10
1-9-1
U29WFPAL
Page 32
WIRING DIAGRAM
AC CORD
ANT-INANT-OUT
JK101,
JK102
1234567
JW001
AL+12V(1)
GND
1 V-OUT1
2
3 V-IN145
CN151CN101
123456789
A-IN1
JK1-8P-OUT
A-OUT1
6
7
1011121314151617181920
JACK CBA
(BHG470F01014C)
1234567
JW002
GND
1 V-OUT2
2NU3 V-IN2
CN152CN102
21
8
GND5
A-IN28
SC2-IN
A-OUT2
4
6
7
SENSOR CBA
(BHF300F01011)
SENSOR CBA
(BHF300F01011)
CTL(-)
CN504
A-PB/REC
CTL(+)
2
3
A-COM
4
5
AE-H1AE-H/FE-H
6
FE-H2
CN501
MAIN CBA
(BHG470F01014A)
FE-H GND1
CN502
1 AL+12V/+20.5V
CAPSTAN MOTOR
M
P-ON+5V
2
3 C-FG
C-F/R
4
M
C-CONT5
GND
6
CAPSTAN
GND
D-PFG9
D-CONT8
LM-FWD/REV
7
10
MOTOR
P-ON+15V12
AL+12V(2)
11
CN253
V(R)1
V-COM2
3 V(L)
AUDIO HEAD
AC HEAD ASSEMBLY
CONTROL HEAD
(DECK ASSEMBLY)
AUDIO
ERASE HEAD
FULL
ERASE HEAD
FE HEAD
1-10-1
LOADING
MOTOR
CYLINDER ASSEMBLY
PG
SENSOR
M
DRUM
MOTOR
VIDEO
(R)
HEAD
VIDEO
(L)
HEAD
HG223WI
Page 33
IC PIN FUNCTION DESCRIPTIONS
IC501( SERVO / SYSTEM CONTROL IC )
“H” ≥ 4.5V, “L” ≤ 1.0V
Pin
IN/
No.
OUT
1IN
2IN
3IN
4IN
5IN
6IN
7IN
8IN
9IN
10IN
11-
1213 OUT
14IN
15 OUT
16-
1718 OUT
19-
202122-
23 OUT
24
OUT CAS-LED
25
OUT
26
OUT REC-LED
Signal
Name
SC2-IN
PG-DELAY
POW-SAF
END-S
AFC
V-ENV
KEY-1
KEY-2
LD-SW
ST-S
N.U.Not Used
N.U.Not Used
D-V-SYNC
REMOCO
N-IN
C-ROTA
N.U.Not Used
N.U.Not Used
RF-SW
N.U.Not Used
N.U.Not Used
N.U.Not Used
N.U.Not Used
POWER-
LED
TIMERLED
Function
Input Signal from Pin
8 of SCART2
Video Head
Switching Pulse
Signal Adjusted
Voltage
P-ON Power
Detection Input
Signal
Tape End Position
Detect Signal
Automatic Frequency
Control Signal
Video Envelope
Comparator Signal
Key Scan Input
Signal 1
Key Scan Input
Signal 2
Deck Mode Position
Detector Signal
Tape Start Position
Detector Signal
Dummy V-sync
Output
Remote Control
Sensor
Color Phase Rotary
Changeover SIgnal
Video Head
Switching Pulse
“POWER” LED
Signal Output
“CASSETTE” LED
Signal Output
“TIMER” LED
Signal Output
Recording LED
Control Signal
Active
Level
A/D
A/D
A/D
A/D
A/D
A/D
A/D
A/D
A/D
A/D
H/Hi-z
H/L
H/L
Pin
IN/
No.
OUT
2728-
29 OUT
30 OUT
31IN
3233 OUT
34IN
35IN
36 OUT
3738IN
39 OUT
4041-
-
-
L
-
-
-
-
-
-
H
H
H
4243IN
44IN
45 OUT
46-
4748IN
4950IN
5152 OUT
5354-
55INCOLOR-IN
5657-
Signal
Name
N.U.Not Used
N.U.Not Used
AUDIO-
SW-1
AUDIO-
SW-2
REC-SAFSW
N.U.Not Used
D-REC-H
RESET
XC-INSub Clock
XC-OUTSub Clock
VccVcc
X-INMain Clock Input
X-OUTMain Clock Input
VssVss(GND)
N.U.Not Used
N.U.Not Used
CLKSELClock Select (GND)
OSCin
OSCout
N.U.Not Used
LPLP
FSC-IN
[4.43MHz]
OSDVssOSDVss
OSD-V-IN
N.U.Not Used
OSD-VOUT
OSDVccOSDVcc
HLF
N.U.Not Used
N.U.Not Used
Function
Audio IN/OUT
Control Signal
Audio IN/OUT
Control Signal
Recording Safety
SW Detect (With
Record tab="L"/With
out Record tab="H")
Delayed Record
Signal
System Reset Signal
(Reset=”L”)
Clock Input for letter
size
Clock Output for
letter size
4.43MHz Clock Input
OSD Video Signal
Input
OSD Video Signal
Output
LPF Connected
Terminal (Slicer)
SECAM or
MESECAM Chroma
Video Input Signal at
Super Impose
Active
Level
-
-
H/L
H/L
H
-
H
L
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1-11-1HG223PIN
Page 34
Pin
IN/
No.
OUT
58IN
59 OUT
6061IN
62-
6364-
Signal
Name
C-SYNC
8POUT-1
N.U.Not Used
SECAM-H
N.U.Not Used
N.U.Not Used
N.U.Not Used
65 OUT TRICK-H
66 OUT
67IN
68-
6970-
71 OUT
72
73-
7475-
76 OUT
77 OUT
78 OUT
79IN
80IN
81 OUT
8283 OUT
84-
8586IN
87IN
C-POW-SWCapstan Power
P-ON-H
N.U.Not Used
N.U.Not Used
N.U.Not Used
IIC-BUS
SCL
IN/
IIC-BUS
SDA
OUT
N.U.Not Used
N.U.Not Used
N.U.Not Used
C-CONT
D-CONT
C-F/R
S-REEL
T-REEL
LM-FWD/
REV
N.U.Not Used
A-MUTE
N.U.Not Used
N.U.Not Used
P-DOWN-L
C-FG
Function
Composite
Synchronized Pulse
SCART 1 8Pin
Output Control
Signal
SECAM Mode at
High
Special Playback =
“H” in SECAM Mode
Switching Signal
Power On Signal at
High
2
I
C BUS Control
Clock
2
I
C BUS Control
Data
Capstan Motor
Control Signal
Drum Motor Control
Signal
Capstan Motor FWD/
REV Control Signal
(FWD=”L”/REV=”H”)
Supply Reel Rotation
Signal
Take Up Reel
Rotation Signal
Loading Motor
Control Signal
Audio Mute Control
Signal
Power Volt age Down
Detector Signal
Capstan Motor
Rotation Detection
Pulse
Active
Level
PULSE
H/L
-
H/L
-
-
-
H
H/L
H
-
-
-
H/L
H/L
-
-
-
PWM
PWM
H/L
PULSE
PULSE
H/L/
Hi-z
-
H
-
-
L
PULSE
Pin
No.
OUT
8889-
90IN
91-
929394
OUT
95
OUT
96-
9798-
IN/
IN/
IN/
Signal
Name
Function
N.U.Not Used
N.U.Not Used
D-PFG
AMPVREF
OUT
AMPVREF
IN
Drum Motor Pulse
Generator
V-Ref for CTL AMP
V-Ref for CTL AMP
P80/CP80/C Terminal
CTL (-)
CTL (+)
AMPC
CTLAMP
out
Playback/Record
Control Signal (-)
Playback/Record
Control Signal (+)
CTL AMP Connected
Terminal
To Monitor for CTL
AMP Output
AMPVccAMPVcc
A/D Converter Power
99-
AVcc
Input/ Standard
Voltage Input
100IN
AGC
IF AGC Comparator
Signal
Notes:
Abbreviation for Active Level:
PWM -----Pulse Wide Modulation
A/D--------Analog - Digital Converter
See Electrical Parts List
for parts with this mark.
Some Ref. Numbers are
not in sequence.
2L021
2L021
2B5
2L051
MAIN CBA
2L041
SENSOR CBA
2B46
2B8
2L031
2B7
2L041
2L099
A10
2L021
1B1
A3
A7
1-13-2HG221CEX
Page 38
Packing
Some Ref. Numbers are not in sequence.
S7
X6
S2
X1
X20A
X3
X2
X4
S2
A14
S3
Unit
SHIPPING
LABEL
S1
1-13-3HG223PEX
Page 39
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a !
have special charac teristics important to safety. Before
replacing any of these components, read caref ully the
product safety notice in this service manual. Don't
degrade the safety of the product through improper servicing.
NOTE:
Parts that are not assigned part numbers (---------) are
not available.
have special charac teristics important to safety. Before
replacing any of these components, read car efully the
product safety notice in this service manual. Don't
degrade the safety of the product through improper servicing.
NOTES:
1.Parts that are n ot assigned part numbers (---------)
are not available.
2.Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
MCV CBA
Ref. No.DescriptionPart No.
MCV CBA
Consists of the following
MAIN CBA (MCV-A)
JACK CBA (MCV-C)
SENSOR CBA
MAIN CBA
Ref. No.DescriptionPart No.
MAIN CBA (MCV-A)----------Consists of the following
CAPACITORS
C002!MET ALLIZED FILM CAP. 0.068µF/275V K orCT2E683HJE06
!METALLIZED FILM CAP . 0.068µF/250V KCT2E683DC011C003!SAFTY CAP. 2200pF/250V orCCN2EMA0E222
!SAFETY CAP. 2200pF/25 0VCA2E222MR049
C004ELECTROL YTIC CAP. 33µF/400V M(L.Z)CA2H330NC0 10
C005CERAMIC CAP . B K 0.01µF/500VCCD2JKP0B103
C006CERAMIC CAP . SL K 56pF/1KV orCCD3AKPSL560
CERAMIC CAP . SL J 56pF/1KVCCD3AJPSL560
C007CERAMIC CAP.(AX) B K 1000pF/50VCCA1JKT0B102
C008CERAMIC CAP.(AX) X K 5600pF/16VCCA1CKT0X562
C010FILM CAP.(P) 0.022µF/50V J orCMA1JJS00223
FILM CAP.(P) 0.022µF/50V JCA1J223MS029
C011ELECTROL YTIC CAP. 10µF/16V M H7CE1CMA VSL100
C012ELECTROL YTIC CAP. 10µF/50V M H7C E1J MAVSL100
C014ELECTROL YTIC CAP. 470µF/35V M orCE1GMASDL471
ELECTROLYTIC CAP. 470µF/35V MCE1GMASTL471
C015ELECTROL YTIC CAP. 47µF/25V M H7CE1EMA VSL470
C017ELECTROL YTIC CAP. 470µF/16V M orCE1CMASDL471
ELECTROLYTIC CAP. 470µF/16V MCE1CMASTL471
C018ELECTROL YTIC CAP. 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP. 470µF/10V MCE1AMASTL471
C022ELECTROL YTIC CAP. 22µF/16V M H7CE1CMA VSL220
C025CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C026ELECTROL YTIC CAP. 47µF/16V M H7CE1CMA VSL470
0VSA15092
------------
-----------0VSA14893
Ref. No.Descrip tio nPart No.
C053ELECTROL YTIC CAP. 220µF/6.3V M H7CE0KMASSL221
C056CHIP CERAMIC CAP .(1608) B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP .(1608) B K 0.047µF/25VCHD1EK30B473
C057CHIP CERAMIC CAP .(1608) CH J 470pF/50V or CHD1JJ3CH471
CHIP CERAMIC CAP. CG J 470pF/50VCHD1JJ3CG471
C151CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C152CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C154CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C155ELECTROL YTIC CAP. 10µF/16V M H7CE1CMAVSL100
C156ELECTROL YTIC CAP. 10µF/16V M H7CE1CMAVSL100
C157ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C158CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C159CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C251ELECTROL YTIC CAP. 10µF/16V M H7CE1CMAVSL100
C252CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C253ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C254CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C302CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
C303ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C304ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C305CHIP CERAMIC CAP. F Z 0.22µF/16V orCHD1CZ30F224
CHIP CERAMIC CAP. FZ Z 0.22µF/25VCHD1EZ3FZ224
C307CHIP CERAMIC CAP .(1608) B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP .(1608) B K 0.047µF/25VCHD1EK30B473
C308CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
C309CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C310CHIP CERAMIC CAP .(1608) B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP .(1608) B K 0.047µF/25VCHD1EK30B473
C312CHIP CERAMIC CAP . B K 8200pF/50VCHD1JK30B822
C313CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C314CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C315CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C316CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C317ELECTROL YTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C318ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C319ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C320CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
200405111-15-1HG223EL
Page 41
Ref. No.DescriptionPart No.
C321CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C322ELECTROL YTIC CAP. 10µF/16V M H7CE1CMA VSL100
C323CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C324CHIP CERAMIC CAP . CH J 68pF/50V orCHD1JJ3CH680
CHIP CERAMIC CAP. CG J 68pF/50VCHD1JJ3CG680
C325CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C326CHIP CERAMIC CAP . CH J 68pF/50V orCHD1JJ3CH680
CHIP CERAMIC CAP. CG J 68pF/50VCHD1JJ3CG680
C327ELECTROL YTIC CAP. 0.47µF/50V M H7CE1JMAV SLR47
C330CERAMIC CAP .(AX) F Z 0.1µF/50VCCA1JZTFZ104
C332CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C333ELECTROL YTIC CAP. 0.47µF/50V M H7CE1JMAV SLR47
C334ELECTROL YTIC CAP. 4.7µF/25V M NP H7CP1EMAVSB4R7
C335ELECTROL YTIC CAP. 10µF/16V M H7CE1CMA VSL100
C336CHIP CERAMIC CAP .(1608) CH J 1000pF/50V or CHD1JJ3CH102
CHIP CERAMIC CAP. CH J 1000pF/25V orCHD1EJ3CH102
CHIP CERAMIC CAP. CG J 1000pF/50VCHD1JJ3CG102
C337CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C338ELECTROL YTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C339ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C340CHIP CERAMIC CAP . CH J 120pF/50V orCHD1JJ3CH121
CHIP CERAMIC CAP. CG J 68pF/50VCHD1JJ3CG680
C347CHIP CERAMIC CAP . CH D 10pF/50V orCHD1JD3CH100
CHIP CERAMIC CAP. CG D 10pF/50VCHD1JD3CG100
C351ELECTROL YTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C352ELECTROL YTIC CAP. 100µF/16V M H7CE1CMAVSL101
C370CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C371CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
C372CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C373CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C374CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C375CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C376CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
Ref. No.Descrip tio nPart No.
C377CERAMIC CAP.(AX) Y M 0.0 1µF/16VCCA1CMT0Y103
C378CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C379ELECTROL YTIC CAP. 0.47µF/50V M H7CE1JMAVSLR47
C381CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C382CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C383CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C384ELECTROL YTIC CAP. 2.2µF/50V M H7CE1JMAVSL2R2
C401ELECTROL YTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C402ELECTROL YTIC CAP. 220µF/6.3V M H7CE0KMASSL221
C403CERAMIC CAP. B K 470pF/100VCCD2AKS0B471
C404FILM CAP . (P) 0 .01 8µF/100V J orCMA2AJP00183
FILM CAP.(P) 0.018µF/50V JCMA1JJP00183
C411CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C412CHIP CERAMIC CAP . B K 1800pF/50VCHD1JK30B182
C414CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C415ELECTROL YTIC CAP. 10µF/16V M H7CE1CMAVSL100
C416CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C417CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
C418CHIP CERAMIC CAP .(1608) CH J 33pF/50V orCHD1JJ3CH330
CHIP CERAMIC CAP. CG J 33pF/50VCHD1JJ3CG330
C419CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C421ELECTROL YTIC CAP. 33µF/6.3V M H7CE0KMAVSL330
C422ELECTROL YTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C423CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C424ELECTROL YTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C425CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C426CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. CG J 68pF/50VCHD1JJ3CG680
C430ELECTROL YTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C501ELECTROL YTIC CAP. 220µF/6.3V M H7CE0KMAVS L22 1
C502CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C508ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C510ELECTROL YTIC CAP. 22µF/10V M H7CE1AMAVSL220
C511ELECTROL YTIC CAP. 100µF/6.3V H7CE0KMA VS L10 1
C512CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C513CHIP CERAMIC CAP .(1608) CH J 22pF/50V orCHD1JJ3CH220
C516CHIP CERAMIC CAP . CH J 18pF/50V orCHD1JJ3CH180
CHIP CERAMIC CAP. CG J 18pF/50VCHD1JJ3CG180
C517CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C518CHIP CERAMIC CAP .(1608) B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP .(1608) B K 0.047µF/25VCHD1EK30B473
C519CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C520CHIP CERAMIC CAP .(1608) CH J 100pF/50V or CHD1JJ3CH101
CHIP CERAMIC CAP. CG J 560pF/50VCHD1JJ3CG561
C522ELECTROL YTIC CAP. 22µF/6.3V M H7CE0KMASSL220
C523CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C524CHIP CERAMIC CAP . CH J 330pF/50V orCHD1JJ3CH331
CHIP CERAMIC CAP. CG J 330pF/50VCHD1JJ3CG331
C526CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C527ELECTROL YTIC CAP. 22µF/6.3V M H7CE0KMASSL220
C528CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C530CERAMIC CAP .(AX) F Z 0.022µF/25VCCA1EZTFZ223
C531CERAMIC CAP .(AX) Y M 0.01µF/16VCCA1CMT0Y103
C532ELECTROL YTIC CAP. 22µF/6.3V M H7CE0KMASSL220
C533CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C535CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C538CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
C563CHIP CERAMIC CAP . F Z 1µF/10V orCHD1AZB0F105
CHIP CERAMIC CAP . F Z 1µF/10VCHD1AZ30F105
C564CHIP CERAMIC CAP .(1608) CH J 100pF/50V or CHD1JJ3CH101
CHIP CERAMIC CAP. CG J 100pF/50VCHD1JJ3CG101
C567CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C702CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C704CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C706CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C708CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C709ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C710CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C715CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C851CHIP CERAMIC CAP .(1608) CH J 22pF/50V orCHD1JJ3CH220
CHIP CERAMIC CAP. CG J 22pF/50VCHD1JJ3CG220
C853CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C854CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C855CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C856CHIP CERAMIC CAP . CH J 180pF/50V orCHD1JJ3CH181
X'TAL 4.433619MHz1811388
X501X'T AL 12. 000MHzFXD126LDS001
X502X'TAL 32.768kHz(20PPM) orFXC323LQUA01
X'T AL 32. 768kHz (20PPM)FXC323LDS00 2
JACK CBA
Ref. No.DescriptionPart No.
JACK CBA (MCV-C)-----------
Consists of the following
CAPACITORS
C102CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C104CHIP CERAMIC CAP .(1608) CH J 470pF/50V or CHD1JJ3CH471
CHIP CERAMIC CAP. CG J 470pF/50VCHD1JJ3CG471
C105CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C107ELECTROLYTIC CAP. 1µF/50V M H7CE1JMA V SL1 R0
C108CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C109CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C112CHIP CERAMIC CAP .(1608) CH J 470pF/50V or CHD1JJ3CH471
CHIP CERAMIC CAP. CG J 470pF/50VCHD1JJ3CG471
C113CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C115ELECTROLYTIC CAP. 100µF/16V M H7CE1CMA VSL101
C116ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C117ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
This maintenance chart shows you the standard of replacement and cleaning time for each part.
Because those may replace depending on environment and purpose for use, use the chart for reference.
h: Hours : Cleaning I: Repl ac e
DeckPeriodic Service Schedule
Ref.No.Part Name1,000 h2,000 h3,000 h4,000 h
B2Cyli nde r As se mbl y
B3
B8
B587Tension Lever Assembly
B31
B573, B574
B37Capstan Motor
B52
*B73
*B86F Brake Assembly (HI)II
B133
B410
B414M Brake (SP) Assembly (HI)II
B416
Loading Motor Assembly
Pulley Assembly
ACE Head Assembly
Reel S, Reel T
Cap Belt
FE Head
Idler Assembly (HI)
Pinch Arm Assembly
M Brake (TU) Assembly (HI)
II
I
II
II
I
I
II
II
I
II
II
II
B525
Notes:
1.Clean all parts for the tape transport (Upper Drum with Video Head / Pinch Roller / ACE Head / FE Head) using
90% lsopropyl Alcohol.
2.After cleaning the parts, do all DECK ADJUSTMENTS.
3.For the reference numbers listed above, refer to Deck Exploded Views.
* B73 ------ Recording model only
* B86 ------ Not used in 2 head model.
LDG Belt
II
2-1-1U29PHSMEN
Page 49
Cleaning
Cleaning of Video Head
Clean the head with a head cle aning stick or ch amois
cloth.
Procedure
1.Remove the top cabinet.
2.Put on a glove (thin type) to avoid touching the
upper and lower drum with your bare hand.
3.Put a few drops of 90% Isopropyl alcohol on the
head cleaning stick or on the chamois cloth and,
by slightly pressing it against the head tip, tu rn the
upper drum to the right and to the left.
Notes:
1.The video head surface is made of very hard
material, but since it is very thin, avoid cleani ng it
vertically.
2.Wait for the cleaned part to dry thoroughly before
operating the unit.
3.Do not reuse a stained head cleaning stick or a
stained chamois cloth.
Cleaning of ACE Head
Clean the head with a cotton swab.
Procedure
1.Remove the top cabinet.
2.Dip the co tton swab in 90 % isopropyl al cohol and
clean the ACE Head. Be careful not to damage the
upper drum and other tape running parts.
Notes:
1.Avoid cleaning the ACE Head vertically.
2.Wait for the cleane d part to dry thoroughl y before
operating the unit or damage may occur.
ACE Head
Upper
Cylinder
Do Not !
Video Head
Do Not touch
with your bare
hand!
Cleaning Stick
2-1-2U29PHSMEN
Page 50
SERVICE FIXTURE AND TOOLS
J-1-1, J-1-2
J-3
J-5
J-2
J-4
Ref. No. NamePart No.Adjustment
J-1-1Alignment TapeFL6AHead Adjustment of ACE Head
J-1-2Alignment TapeFL6N8
(2 Head model)
FL6NS8
(4 Head model)
J-2Guide Roller Adj. Screwdriver Available
Locally
J-3MirrorAvailable
Locally
J-4Azimuth Adj. Screwdriver +Available
Locally
J-5Flat Screwdriver -Available
Locally
2-2-1U29PFIX
Azimuth and X Value Adjustment of ACE Head /
Adjustment of Envelope Waveform
Guide Roller
Tape Transportation Check
ACE Head Height
X Value
Page 51
MECHANICAL ALIGNMENT PROCEDURES
Explanation of alignm ent for the tape to correctly run
starts on the next page. Refer to the information below
on this page if a tape gets st uck, for example, in the
mechanism due to some electrical trouble of the unit.
Service Information
A. Method for Manual Tape Loading/Unloading
To load a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembl y.
3. Insert a cassette tape . Though the tape will not be
automatica lly loaded, make sure th at the cassette
tape is all the way in at the inlet of the Cassette
Holder. To confirm this, lightly push the cassette
tape further in and se e if the tap e comes back out,
by a spring motion, just as much as you have
pushed in.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 for a minute or two to comp lete
this task.
To unload a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembl y.
3. Make sure tha t the Moving guid e preparations are
in the Eject Position.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 u ntil the Moving guide preparations come to the Eject P ositi on. Stop turning when
the preparations begin clicking or can not be
moved further. However, the tape will be left wound
around the cylinder.
5. Turn the LDG Belt in the appropriate dir ection co ntinuously, and the cassette tape will be ejected.
Allow a minute or two to complete this task.
B. Method to place the Cassette Holder in the tape-
loaded position without a cassette tape
1. Disconnect the AC Plug.
2. Remove the Top Case and Front Assembly.
3. Turn the LDG Belt in the appropriate direction
shown in Fig. M1. Release the locking tabs shown
in Fig. M1 and continue turning the LDG Belt unti l
the Cassette Holder comes to the tape-loaded
position. Allow a minute or two to complete this
task.
T op View
Moving guide T preparation
(Eject Position)
Moving guide S preparation
(Eject Position)
Push the tape
to load it.
Push the locking tab gently to unlock
when loading without a cassette.
UNLOAD
/EJECT
LOAD
Side View
LDG Belt
Fig. M1
Bottom View
LDG Belt (B)
UNLOAD
/EJECT
Cam Gear
Fig. M2
2-3-1U29P2HSMA
Page 52
1. Tape Interchangeability Alignment
Note:
To do these alignme nt proc ed ur es, ma ke sure that the
Tracking Control Circuit is set to the preset position
every time a tape is loaded or unloaded. (Refer to
page 2-3-4, procedure 1-C, step 2.)
Note: Before starting this Mechanical Alignment, do all
Electrical Adjustment procedures.
Flowchart of Alignment for tape traveling
Loading (Use a blank tape.)
Adjust the height of the Guide Rollers
(Supply side and take-up side).
(Use a blank tape.) (Page 2-3-3)
1-A
No good
Check to see that the tape is not creasing
and that there is no slack on the supply
and take-up side Guide Rollers.
(Use a blank tape.)
Adjust the X Value for maximum envelope.
(Page 2-3-3) (Use Alignment Tape.)
Adjust the envelope. (Page 2-3-4)
Check the envelope.
OK
Adjust the Audio Section.
(Azimuth Alignment) (Page 2-3-4)
Check the audio output.
OK
Check the following:
1. X Value (Page 2-3-3)
2. Envelope (Page 2-3-4)
OK
1-A
1-B
1-C
1-C
1-D
1-D
1-B, 1-C
No good
No good
No good
Do the final tape-traveling test to see that
the tape runs normally in play mode without creasing or slacking.
OK
Check to see that the tape is not creasing
and that there is no slack on the REV Post.
(Use a blank tape.)
OK
Completion
Adjust the X value and envelope.
1-A
1-E
1-B, 1-C
2-3-2U29P2HSMA
Page 53
1-A. Preliminary/Final Checking and
r
Alignment of Tape Path
Purpose:
To make sure that the tape path is well stabilized.
Symptom of Misalignment:
If the tape path is unstable, the tape will be damaged.
Note: Do not use an Alignment Tape for this proce-
dure. If the unit is not correct ly aligned, the tape may
be damaged.
1. Playback a bl ank cassette tape and check to see
that the tape runs without creasing at Guide Rollers
[2] and [3], and at points A and B on the lead sur face. (Refer to Fig. M3 and M4.)
2. If creasin g is apparent, align t he h ei g ht o f th e g ui d e
rollers by turning the top of Guide Rollers [2] and
[3] with a Gu ide Roller Adj. Scr ewdriver. (Refer to
Fig. M3 and M5.)
Guide Roller [2]
Guide Roller [3]
ACE Head
4. If creasing or snaking is apparent, adjust the Tilt
Adj. Screw of the ACE Head. (Fig. M6)
Azimuth Adj. Screw
ACE Head
Flat
Screwdrive
Tilt Adj. Screw
Fig. M6
1-B. X Value Alignment
Purpose:
To obtain maximum PB FM envelope signal at the preset position of the Tracking Control Circuit, align the
Horizontal Position of the ACE Head.
Symptom of Misalignment:
If the Horizontal Position of t he A CE Head is not pr operly aligned, maximum PB FM envelope cannot be
obtained at the preset position of the Tracking Control
Circuit.
A
Take-up Guide Post [4]
Lead Surface of Cylinder
Correct
Guide Roller
Tape
Take-up Guide
Post
Tape
B
Tape
Incorrect
Fig. M3
Fig. M4
1. Connect the oscilloscope to TP301 (C-PB) and
TP501 (CTL) on the Main CBA. Use TP502 (RFSW) as a trigger.
2. Playback the Gray Scale of the Alignment Tape
(FL6N8) and confirm that the PB FM signal is
present.
3. Set the Tracking Control Circui t to the preset position by pressing CH U P button on t he remote c ontrol unit then “PLAY” button on the unit. (R efer to
note on bottom of page 2-3-4.)
4. Use the Fl at Screwdriver so that th e PB FM si gnal
at TP301 (C-PB) is maximum. (Fig. M6)
Fig. M5
3. Check to se e tha t the tape r uns wi thou t cr ea si ng a t
Take-up Guide Post [4] or without snaking between
Guide Roller [3] and ACE Head. (Fig. M3 and M5)
2-3-3U29P2HSMA
Page 54
5. To shift the CTL waveform, press CH UP or CH
DOWN button on the remote control unit. Then
make sure that the maxi mum outp ut posi tion of PB
FM envelope s ig nal b ec ome w ithi n
set position.
±2ms from pre-
Good
FM envelope signal
2ms
Center Position
5. When Guid e Rollers [2] and [ 3] (Refer to Fig. M3)
are aligned properly, there is no envelope drop
either at the beginning or end of track as shown in
Fig. M9.
Dropping envelope level at the beginning of track.
Fig. M8
FM envelope output signal
is adjusted at maximum.
CTL signal
No Good
FM envelope output signal is low.
Fig. M7
6. Set the Tracking Control Circui t to the preset position by pressing C H UP button on the remote control unit. and then “PLAY” button.
1-C. Checking/Adjustment of Envelope
Waveform
Purpose:
To achieve a satisfactory picture, adjust the PB FM
envelope becomes as flat as possible.
Symptom of Misalignment:
If the envelope o utput is poor, noise will appear in the
picture. The tracki ng will then lose precision and the
playback picture wil l be distorted by any slight variation of the Tracking Control Circuit.
1. Connect the os cilloscope to TP301 (C-PB) on the
Main CBA. Use TP502 (RF-SW) as a trigger.
2. Playback the Gray Scale on the Alignment Tape
(FL6N8). Set the Tracking Control Circuit to the
preset position by p ress ing CH UP butto n an d then
“PLAY” button on the unit. Adjust the height of
Guide Rollers [2] and [3] (Fig. M3, Page 2-3-3)
watching the oscillosc ope dis play s o that the enve lope becomes as flat as possible. To do this adjustment, turn the top of the Guide Roller with the
Guide Roller Adj. Screwdriver.
3. If the envelope is as shown in Fig. M7, adjus t the
height of Guide Roller [2] (Refer to Fig. M3) so that
the waveform looks like the one shown in Fig. M9.
4. If the envelope is as shown in Fig. M8, adjus t the
height of Guide Roller [3] (Refer to Fig. M3) so that
the waveform looks like the one shown in Fig. M9.
Dropping envelope level at the end of track.
Fig. M9
Envelope is adjusted properly. (No envelope drop)
Fig. M10
Note: Upon completion of the adjustment of Guide
Rollers [2] and [3] (Refer to Fig. M3), check the X
Value by pushing the CH UP or DOWN buttons alte rnately, to check the symmetry of the envelope. Check
the number of pushes to ensur e preset position. The
number of pushes CH UP button to achieve 1/2 level of
envelope should match the number of pushes CH
DOWN button from center. If required, redo the “X
Value Alignmen t.”
2-3-4U29P2HSMA
Page 55
1-D. Azimuth Alignment of Audio/Con-
trol/ Erase He ad
Purpose:
To correct the Azimuth alignment so that the Audio/
Control/Erase Head meets tape tracks properly.
Symptom of Misalignment:
If the position of the Audio/Control/Erase Head is not
properly aligned, the Audio S/N Ratio or Frequency
Response will be poor.
1. Connect the oscilloscope to the audio ou tput jack
on the rear side of the deck.
2. Playback the alignm ent tape (FL6N8) and confirm
that the audio signal output level is 8kHz.
3. Adjust Azimuth Adj. Screw so that the output level
on the AC Voltmeter or the waveform on the oscilloscope is at maximum. (Fig. M6)
Note: Upon completion of the adjustm ent of Azimuth
Adj. Screw, check the X Value by pushing the CH UP
or DOWN buttons alternate ly, to check the symmetry
of the envelope. Check the number of pushes to
ensure preset po sitio n. The n umber of pus hes C H UP
button to achieve 1/2 level of envel ope should match
the number of pushes CH DOWN button from center. If
required, redo the “X Value Alignment.”
2. When the tape has been curled up or bent, turn the
alignment screw t o adjust the heigh t of REV Post.
(Refer to Fig. M11 and M13.)
REV Post [5]
Take-up Guide Post [4]
Fig. M11
Correct
REV Post
Tape
Take-up Guide
Post
Tape
Incorrect
1-E. Checking and Alignment of Tape
Path during reversing
Purpose:
To make sure that the tape path is well stabilized during reversing.
Symptom of Misalignment:
If the tape path is unstable during reversing , the tape
will be damaged.
Note: Do not use an Alignment Tape for this procedure. If the unit is not correct ly aligned, the tape may
be damaged.
1. Insert a black cassette tape into the tray and set
the unit to REV. Then confirm if the tape ha s been
curled up or bent at the Take-up Guide Post[4] or
REV Post[5]. (Refer to Fig. M11 and M12.)
Fig. M12
Alignment
Screw
Tape Guide
Assembly
Fig. M13
2-3-5U29P2HSMA
Page 56
DISASSEMBLY/ASSEMBLY PROCEDURES
OF DECK MECHANISM
Before following the procedures described below, be sure to remove the deck assembly from the cabinet. (Refer to
CABINET DISASSEMBLY INSTRUCTIONS.)
All the following pro cedures, i ncluding those for adjustment and replace ment of parts, should be done in Eject
mode; see the positions of [44] and [45] i n Fig. DM1H on page 2-4-3. Whe n reassembling, follow the ste ps in
reverse order.
STEP
/LOC.
[10][2]
[12][11]Pinch Arm (B)T
[13][12]
[14][14]FE HeadTDM1H, DM9H(S-5)
[15][15]PrismTDM1H, DM9H(S-6)
[16][2]Slider ShaftTDM10H*(L-5)
[17][16]C Drive Lever (SP)TDM10H
[18][16]C Drive Lever (TU)TDM10H(S-7), *(P-4)
[19][19]Capstan MotorBDM2H, DM11H3(S-8), Cap Belt
[20]
M Gear (HI)TDM1H, DM15H(C-6)
Sensor Gear (HI)TDM1H, DM15H(C-7)
Moving Guide S
Preparation
Moving Guide T
Preparation
↓
(3)
BDM2H, DM14H
BDM2H, DM14H
TDM1H, DM15H
TDM1H, DM15H*(P-6)
TDM1H, DM15H
TDM1H, DM16H(S-11), Slide Plate
TDM1H, DM16H
↓
(4)
Fig. No.
↓
(5)
REMOVALINSTALLATION
REMOVE/*UNHOOK/
UNLOCK/RELEASE/
UNPLUG/DESOLDER
↓
(6)
ADJUSTMENT
CONDITION
(+)Refer to Alignment
Sec.Page 2-5-1
(+)Refer to Alignment
Sec.Page 2-5-1
(+)Refer to Alignment
Sec.Page 2-5-1
↓
(7)
(1): Follow steps in sequence. When reassembling, follow the steps in reverse order.
These numbers are also used as identification (location) No. of parts in the figures.
(2): Indicates the part to start disassembling with in order to disassemble the part in column (1).
(3):Name of the part
(4): Location of the part: T=Top B=Bottom R=Right L=Left
(5):Figure Number
(6): Identification of parts to be removed, unhooked, unlocked, released, unplugged, unclamped, or desoldered.
e.g., 2(L-2) = two Locking Tabs (L-2).
(7): Adjustment Information for Installation
(+):Refer to Deck Exploded Views for lubrication.
.
* [ 22 ] F Brake Assembly (HI) is not used in 2 head model.
2-4-2U29PHSDA
Page 58
T op View
[14]
[38]
[37]
[7][49][8]
[45][44][46][9]
[32][43][41][40][31][42]
[13]
[11]
[15]
[10]
[12]
[36]
Bottom View
[23]
[24]
[27]
Fig. DM1H
[19]
[35]
[34]
[25]
[26]
[33][20][28][22]
Fig. DM2H
2-4-3U29PHSDA
Page 59
(S-1)
[1]
(S-1)
Fig. DM3H
A
(S-1A)
[3]
[4]
(L-1)
(L-3)
[5]
B
(L-2)
[6]
(P-1)
Installation of [3] and [6]
First, insert [6] diagonally in [3] as shown below. Then,
install [6] in [3] while pushing (L-1) in a direction of
arrow. After installing [6] in [3], confirm that pin A of [3]
enters hole A of [6] properly.
[3]
Pin D
Pin C
Slots B
First, while pushing the locking tab as
shown in the right, slide and pull up the right
side on [2] to release Pin A and Pin B from
the slots A.
Then, remove Pin C and Pin D on [2] from
the slots B as shown.
[2]
2
Pull up
Pin A
A
1
Slide
Pin B
Slot A
Slot A
1
Hole A
[6]
2
Pin A
View for A
(L-1)
Installation of [4] and [6]
Install [6] in [4] while pulling (L-2) in a direction of
arrow. After installing [6] in [4], confirm that pin B of [4]
enters hole B of [6] properly.
[4]
View for B
Hole B
Pin B
[6]
(L-2)
Fig. DM5H
Locking tab
View for A
Fig. DM4H
2-4-4U29PHSDA
Page 60
[7]
[49]
(S-4A)
[11]
(L-4)
(P-3)
Desolder
from bottom
(S-2)
View for A
Lead with
Red Stripe
A
Fig. DM6H
[50]
(L-12)
[13]
Removal of [11]
1) Remove screw (S-4A).
2) Unhook spring (P-2).
3) Release (L-4) while
holding [12] with a
finger.
4) Loosen a finger
holding [12] and
remove [11].
Pin of [12]
Pin of [10]
View for A
[10]
A
Groove of [27]
When reassembling [10] and
[12], confirm that pin of [10]
and pin of [12] are in the
[27]
groove of [27] as shown.
Fig. DM8H-1
[12]
(P-2)
[9]
(S-4)
[8]
A
(S-3)
Desolder
from bottom
Lead with White Stripe
LDG
Belt
View for A
[8]
Fig. DM7H
2-4-5U29PHSDA
Page 61
Installation of [13] and [12]
Hook spring (P-3) up to [12]
and [13], then install then to
the specified position so that
[12] will be floated slightly
while holding [12] and [13].
(Refer to Fig. A.)
Install pin of [12] in groove of [27].
(Refer to Fig. B.)
(P-3)
[13]
Fig. A
Pin of [12]
[27]
[12]
[14]
(S-5)
(S-6)
[15]
Fig. DM9H
Groove of [27]
Fig. B (Top view)
Notch of
Hold [12] and [13] till groove of
pin of chassis looks and fit [13]
in notch of chassis. Then, turn
a few [13] while holding [12].
(Refer to Fig. C.)
Install [11] and [10] while holding [12].
(Refer to Fig. DM8H-1.)
chassis
Groove of
pin of chassis
[13]
turn
[12]
Fig. C
Fig. DM8H-2
[17]
(L-5)
[16]
[18]
(P-4)
(S-7)
Fig. DM10H
2-4-6U29PHSDA
Page 62
Cap Belt
A
[19]
(S-8)
[22]
turn
(C-1)
[20]
(L-6)
[21]
Installation position of Cap Belt
[20]Cap Belt
View for A
Pin on [22]
[27]
Position of pin on [22]
Fig. DM12H
[19]
Fig. DM11H
2-4-7U29PHSDA
Page 63
[24]
(S-9)
(L-8)
(C-4)
(C-5)
[28]
[29]
[30]
[26]
(L-7)
[23]
(C-3)
(C-2)
[25]
Position of Mode Lever when installed
Pin of [36]
Bottom View
[27]
Installation of [26]
Pin of [33]
Align [26] and [27] as shown.
Pin of [37]
[26]
[27]
[31]
Fig. DM13H-1
[33]
T op Vie w
(P-5)
[32]
First groove on [27]
First tooth on [47]
[27]
When reassembling [27],
meet the first groove on
[27] to the first tooth on
[47] as shown.
Refer to the Alignment
Section, Page 2-5-1.
[35]
(L-9)
Fig. DM13H-2
[34]
Fig. DM14H
2-4-8U29PHSDA
Page 64
[38]
(P-6)
[37]
(C-7)
[41]
[39]
turn
(C-6)
[40]
turn
[43]
(L-10)
[42]
[36]
turn
Fig. DM15H
[48]
[47]
Slide
Fig. DM17H
[44]
Slide Plate
(S-11)
[45]
[46]
(L-11)
Fig. DM16H
2-4-9U29PHSDA
Page 65
ALIGNMENT PROCEDURES OF MECHANISM
The following procedures describe how to align the
individual gears and levers that make up the tape loading/unloading mechanism. Since information about the
state of the mechanism is provided to the System
Control Circuit only through the Mode Switch, it is
essential that the co rrect rel ationship be tween indi vidual gears and levers be maintained.
All alignments are to be performed with the mechanism in Eject mode, in the sequence given. Each
procedure assumes that all prev ious proc edures have
been completed.
IMPORTANT:
If any one of these a lignments is not perfor med properly, even if off by only one tooth, the unit will unload or
stop and it may result in da mage to th e mec hanical or
electrical parts.
Alignment points in Eject Position
T op View
Alignment 3
Alignment 1
Loading Arm (SP) and (TU) Assembly
Install Loading Arm (SP) and (TU) Assembly so that
their triangle marks point to each other as shown in
Fig. AL2.
Alignment 2
Mode Gear
Keeping the two triangles pointing at each other, install
the Loading Arm (SP) Asse mbly so that the last tooth
of the gear meets the most insid e teeth of the Mode
Gear. See Fig. AL2.
Triangle Marks
Loading Arm
(SP) Assembly
Last T ooth
Alignment 2
Loading Arm
(TU) Assembly
Most inside teeth
of Mode Gear
Alignment 1
Mode Gear
Bottom View
Alignment 1
Alignment 2
Fig. AL1
Fig. AL2
Alignment 3
Cam Gear (A) (HI), Rack Assembly
Install the Rack Assembly so that the fir st tooth on the
gear of the Rack As sembly meets the first gr oove on
the Cam Gear (A) (HI) as shown in Fig. AL3.
T op Vie w
Cam Gear (A)(HI)
Alignment 3
First tooth
First groove
on the Cam Gear (A)(HI)
Gear on Rack Assembly
Fig. AL3
2-5-1U29PHSAPM
Page 66
DECK EXPLODED VIEWS
Deck Mechanism View 1
B2
B9
L1191
B73
B10
L1053
B411
B567
L1467
B494
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
B35
B553
(Blue grease)
B5
L1322
B12
B11
B571
L1450
B492
B74
L1051
B37
B410
L1450
B121
B8
Chassis Assembly
Top View (Lubricating Point)
B501
L1466
B126
Some Ref. Numbers are not in sequence.
Chassis Assembly
Bottom View (Lubricating Point)
2-6-1U29P2HSDEX
Page 67
Deck Mechanism View 2
B487
B587
B416
B521
B591
MarkDescription
Floil G-684G or Multemp MH-D
(Blue grease)
SLIDUS OIL #150
SANKOUL FG84M (Yellow grease)
B508
B414
B572
B565
B499
B417
B568
B573
B585
B574
B518
B564
B590
B148
B592
B31
B522
L1151
L1406
B3
B558
B557
B525
B578
B579
B582
B580
B583
B579
View
for A
Some Ref. Numbers are not in sequence.
A
B581
B559
B516
B133
B52
B551
B507
B488
B491
B513
Bottom Side (Grease point)
Bottom Side
(Grease point)
2-6-2U29P2HSDEX
Page 68
Deck Mechanism View 3
L1321
B355
L1341
B347
B482
L1321
B354
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
B483
B425
(Blue grease)
B562
B563
B300
B313
B529
B360
B359
B361
B555
Some Ref. Numbers are not in sequence.
B303
B514
2-6-3U29P2HSDEX
Page 69
DECK PARTS LIST
Ref. No.DescriptionPart No.
B2CYLINDER ASSEMBLY MK12.5 PAL 2HD 1SPN2327CYL
B3LOADING MOTOR ASSEMBLY MK12.50VSA14636
B5SLIDE PLATE MK12.50VM416429
B8PULLEY ASSEMBLY(HI) MK120VSA13501
B9MOVING GUIDE S P.P MK12.50VSA14717
B10MOVING GUIDE T P.P MK12.50 VSA14639
B11LOADING ARM(TU) ASSEMBLY MK120VSA13300
B12LOADING ARM(SP) ASSEMBLY MK120VSA13299
B31AC HEAD ASSEMBLY MK12.50VSA14841
B35TAPE GUIDE ARM ASSEMBL Y MK12.50VSA15014
B37CAPSTAN MOTOR 288/VCZC1301N9681CML
B52CAP BELT MK100VM411138
B73FE HEAD(MK11) MH-131SF1 1 o rDHVEC01Z0005
FE HEAD(MK12) VTR-1X2ERS11-155 orDHVEC01TE005
FE HEAD(MK12) HVFHP0047ADHVEC01AL007
B74PRISM MK100VM202870
B121WORM MK120VM414091
B126PULLEY MK120 VM414 330B
B133IDLER ASSEMBLY(HI) MK12.50VSA14849
B148TG CAP MK60VM407664C
B300C DRIVE LEVER(TU) MK120VM203773
B303F DOOR OPENER MK120VM203751C
B313C DRIVE SPRING MK120VM414145
B347GUIDE HOLDER A MK100VM304920
B354SLIDER(TU) MK120VM101172F
B355SLIDER(SP) MK120VM101182H
B359CLEANER LEVER MK100VM304413
B360CLEANER ROLLER MK90VM410032C
B361CL POST MK100VM411114
B410PINCH ARM(A) ASSEMBLY(6) MK12.5 or0VSA14935
PINCH ARM(A) ASSEMBLY(5) MK120VSA13788
B411PINCH SPRING MK120VM414644
B414M BRAKE(SP) ASSEMBLY(HI) MK120VSA13655
B416M BRAKE(TU) ASSEMBLY(HI) MK120VSA13449
B417TENSION SPG(3002645) MK12.50VM414221G
B425LOCK LEVER SPRING MK100VM4111 10
B482CASSETTE PLATE MK120VM203749
B483LOCK LEVER MK120VM414095
B487BAND BRAKE(SP) MK120VM305723
B488MODE LEVER(HI) MK12 or0VM101175J