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Fuseholder Blocks & Clips
www.schurter.com /PG02
Fuseholder Open Design, 5 x 20 mm, SMD, var. Covers, IEC 60335-1
250 VAC · 4 W / 10 A (VDE) · 500 V · 10 A (UL/CSA)
OGN-SMD
Description
- For appliances in unattended use
- Glow wire tests acc. to IEC 60695-2-12 and -13
Unique Selling Proposition
- Suitable for fully automated PCD assembling
- Available with blister tape packaging
- Small design height
- Available preassembled with fuses
Standards
- IEC 60127-6
- UL 4248-1
- CSA C22.2 no. 4248.1
Approvals
- VDE Certificate Number: 40001042
- UL File Number: E39328
Technical Data
Fuse-Link 5 x 20 mm
Mounting PCB
Terminal Solder SMT
Rated Voltage 250 VAC (VDE), 500 V (UL/CSA)
Rated current 10 A (VDE), 10 A (UL/CSA)
Rated Power Acceptance IEC 4 W / 10 A @ Ta 23 °C
2.5 W / 10 A with transparant cover, see
derating curves
Degree of Protection IP 20 (with cover)
Protection Class Suitable for appliances with protection
class I or II acc. to IEC 61140
Admissible Ambient Air Temp. -40 °C to 85 °C
Climatic Category 40/085/21 acc. to IEC 60068-1
Material: Socket see variants
Material: Cover Thermoplastic UL 94V-0
Material: Terminals Tin-Plated Copper Alloy
Unit Weight 1.7 g
Storage Conditions 0 °C to 60 °C, max. 70% r.h.
Product Marking , Type, Rated Voltage, Rated current,
Power Rating, Approvals
Applications
- Household appliances
References
Packaging Details
Weblinks
pdf datasheet, html-datasheet, General Product Information, Packaging
details, Approvals, CE declaration of conformity, RoHS, CHINA-RoHS,
REACH, Distributor-Stock-Check, Accessories, Detailed request for
product
Soldering Methods Reflow (lead-free)
Soldering Profile
Solderability 245-260 °C / max. 30 sec acc. to JE-
DEC J-STD-020D
Contact Resistance ≤ 10 mΩ at 20 mV acc. to IEC 60127-6
Dielectric Strength > 3 kV between Life parts
(50 Hz; 1 min)
Impulse Withstand Voltage > 4 kV between Life parts
Insulation Resistance ≥ 10 MΩ
(500 VDC; 1 min)
Overvoltage Category III acc. to IEC 60664-1
Pollution Degree 3 acc. to IEC 60664-1
Fuses
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OGN-SMD
r
2.5
4.0
Fuseholder Blocks & Clips
www.schurter.com /PG02
Dimension
25 9.6
22.7 10.8
Derating Curves
With Transparent Cover
2.0
1.5
1.0
0.5
Admissible Power Acceptance in Watt
Ambient Air Temperature Ta °C
0.0
020406080 100
12
I = 1.0 I
I = 0.7 I
I = << I
n
n
n
13.2
Cove
22.7 mm
Soldering pads
3.5
3.0
2.5
2.0
1.5
1.0
0.5
Admissible Power Acceptance in Watt
0.0
020406080 100
Ambient Air Temperature Ta °C
11 6
I = 1.0 I
I = 0.7 I
I = << I
6
n
n
n
2
Fuses
Page 3
Fuseholder Blocks & Clips
www.schurter.com /PG02
Order numbers for pre-assembled OGN-SMD, blister tape packaging with 400 pieces per reel
Rated FTT 5x20 FTT 5x20 FST 5x20 FST 5x20 FSF 5x20 FSF 5x20 SMD-SPT 5x20 SMD-SPT 5x20
current In with reflow cover no cover with reflow cover no cover with reflow cover no cover with reflow cover no cover
0853.0571 0853.0571 0853.0571 0853.0571
50 mA 0031.8304 0031.8354
63 mA 0031.8501 0031.8551 0031.8305 0031.8355
80 mA 0031.8502 0031.8552 0031.8306 0031.8356
100 mA 0031.8503 0031.8553 0031.8307 0031.8357
125 mA 0031.8504 0031.8554 0031.8308 0031.8358
160 mA 0031.8505 0031.8555 0031.8309 0031.8359
200 mA 0031.8506 0031.8556 0031.8310 0031.8360
250 mA 0031.8507 0031.8557 0031.8311 0031.8361
315 mA 0031.8508 0031.8558 0031.8312 0031.8362
400 mA 0031.8509 0031.8559 0031.8313 0031.8363
500 mA 0031.8510 0031.8560 0031.8314 0031.8364 0031.8413 0031.8463
630 mA 0031.8511 0031.8561 0031.8315 0031.8365 0031.8414 0031.8464
800 mA 0031.8512 0031.8562 0031.8316 0031.8366 0031.8415 0031.8465
1 A 0031.8513 0031.8563 0031.8317 0031.8367 0031.8416 0031.8466 0031.8993 0031.9007
1,25 A 0031.8514 0031.8564 0031.8318 0031.8368 0031.8417 0031.8467 0031.8994 0031.9008
1,6 A 0031.8515 0031.8565 0031.8319 0031.8369 0031.8418 0031.8468 0031.8995 0031.9009
2A 0031.8516 0031.8566 0031.8320 0031.8370 0031.8419 0031.8469 0031.8996 0031.9010
2,5 A 0031.8517 0031.8567 0031.8321 0031.8371 0031.8420 0031.8470 0031.8997 0031.9011
3,15 A 0031.8518 0031.8568 0031.8322 0031.8372 0031.8421 0031.8471 0031.8998 0031.9012
4 A 0031.8519 0031.8569 0031.8323 0031.8373 0031.8422 0031.8472 0031.8999 0031.9013
5 A 0031.8324 0031.8374 0031.8423 0031.8473 0031.9000 0031.9014
6,3 A 0031.8325 0031.8375 0031.8424 0031.8474 0031.9001 0031.9015
8 A 0031.8326 0031.8376 0031.8425 0031.8475 0031.9002 0031.9016
10 A 0031.8327 0031.8377 0031.8426 0031.8476 0031.9003 0031.9017
OGN-SMD
All fuses in the pre-assembled OGN-SMD fuseholders are suitable for the reflow solder process.
Fuses
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OGN-SMD
Fuseholder Blocks & Clips
www.schurter.com /PG02
All Variants
Holder Material Material: Terminals Reflow Condition Packaging Order Number
l
Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=245 +0/-5 °C, tp = max. 30 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8221
l
Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=245 +0/-5 °C, tp = max. 30 s Blister Tape 38 cm Reel (400 pcs.) 0031.8225
l
Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=245 +0/-5 °C, tp = max. 30 s Blister Tray 266 x 174 mm (500 pcs.) 0031.8222
l
Spec. Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8263
l
Spec. Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s Blister Tape 38 cm Reel (400 pcs.) 0031.8265
l
Spec. Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s Blister Tray 266 x 174 mm (500 pcs.) 0031.8264
l
Spec. Thermoplastic Gold-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8273
l
Spec. Thermoplastic Gold-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s Blister Tape 38 cm Reel (400 pcs.) 0031.8275
l
Spec. Thermoplastic Gold-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s Blister Tray 266 x 174 mm (500 pcs.) 0031.8274
█ Most Popular.
Availability for all products can be searched real-time:http://www.schurter.com/Stock-Check/Stock-Check-SCHURTER
The fuseholder is suitable for use in equipment according to IEC 60335-1.
Fuseholders with gold-plated terminals are more heat resistant than fuseholders with tin-plated terminals.
If soldering problems occur with the thermoplastic version, it is recommended to use the spec. thermoplastic with tin-plated and gold-plated terminals.
Packaging Unit
see variants
Accessories
Description
█
█
█
█
Covers for OGN, OGN-SMD
Cover for Holder OGN, OGN-SMD
Adapter to OGN, OGN-SMD
Fuse Carriage with Handle for OGN, OGN-SMD
11.01.2017
The specifications, descriptions and illustrations indicated in this document are based on current
4
Fuses
information. All content is subject to modifications and amendments. Information furnished is believed
to be accurate and reliable. However, users should independently evaluate the suitability and test each
product selected for their own applications.
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