The components designated by a symbol ( ! ) in this schematic diagram designates components whose value are of
special significance to product safety. Should any component designated by a symbol need to be replaced, use only the part
designated in the Parts List. Do not deviate from the resistance, wattage, and voltage ratings shown.
CAUTION : Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the manufacturer.
Discard used batteries according to the manufacturer’s instructions.
NOTE : 1. Parts order must contain model number, part number, and description.
2. Substitute parts may be supplied as the service parts.
3. N. S. P. : Not available as service parts.
Design and specification are subject to change without notice.
SX612/EX, U, GX, SVA03/U, EX, E
REFERENCE No. SM5310441
Page 2
1. OUTLINE OF CIRCUIT DESCRIPTION
1-1. CA1 and A PART OF CA2 CIRCUIT
DESCRIPTIONS
Around CCD block
1. IC Configuration
CA1 board
IC901 (ICX274AQ) CCD imager
CA2 board
IC901 (H driver, CDS, AGC and A/D converter)
2. IC901 (CA1) (CCD imager)
[Structure]
Interline type CCD image sensor
Image sizeDiagonal 8.293 mm (1/1.8 type)
Pixels in total1688 (H) x 1248 (V)
Recording pixels1600 (H) x 1200 (V)
10
11
OUT
V
DD
V
GND
7
6
5
B
G
R
G
G
B
R
G
G
B
R
Vertical register
G
B
G
R
G
Horizontal register
15
16
GND
(Note) : Photo sensor
12
8
9
13
14
Fig. 1-1. CCD Block Diagram
17
3
4
G
R
G
R
G
R
G
R
18
L
V
SUB
C
1
2
B
G
B
G
B
G
B
G
(Note)
20
19
Pin No.
1
2
3
4
5
6
7
8
9
10
Symbol
4
Vø
Vø3A
Vø3B
Vø3C
Vø2A
Vø2B
Vø2C
Vø1
GND
V
OUT
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
GND
Signal output
Pin Description
Table 1-1. CCD Pin Description
3. IC904 (V Driver) and IC901 (CA2 board) (H driver)
An H driver and V driver are necessary in order to generate
the clocks (vertical transfer clock, horizontal transfer clock
and electronic shutter clock) which driver the CCD.
IC904 are V driver. In addition the XV1-XV4 signals which are
output from IC102 are the vertical transfer clocks, and the
XSG signal which is output from IC102 is superimposed onto
XV2 and XV3 at IC902 in order to generate a ternary pulse.
In addition, the XSUB signal which is output from IC102 is
used as the sweep pulse for the electronic shutter. A H driver
is inside IC901 (CA2 board), and H1A, H1B, H2A, H2B and
RG clock are generated at IC901 (CA2 board).
4. IC901 (CA2 board)
(CDS, AGC Circuit and A/D Converter)
The video signal which is output from the CCD is input to Pin
(29) of IC901 (CA2 board). There are inside the sampling hold
block, AGC block and A/D converter block.
The setting of sampling phase and AGC amplifier is carried
out by serial data at Pin (37) of IC911. The video signal is
carried out A/D converter, and is output by 10-bit.
This circuit uses the function of a 128-Mbit SDRAMs to convert the non-interlaced signal which is output from the CCD
into an interlaced signal for the video monitor.
1-2. Camera signal processor
This comprises circuits such as the digial clamp circuit, white
balance circuit, γ circuit, color signal generation circuit, matrix circuit and horizontal aperture circuit.
1. Digital clamp circuit
The optical black section of the CCD extracts 16-pixel averaged values from the subsequent data to make the black level
of the CCD output data uniform for each line. The 16-pixel
averaged value for each line is taken as the sum of the value
for the previous line multiplied by the coefficient k and the
value for the current line multiplied by the coefficient 1-k.
2. White balance circuit
This circuit controls the white balance by using the AWB judgement value computed by the CPU to control the gain for each
R, G and B pixel based on the CCD data which has been
read.
3. γ circuit
This circuit performs (gamma) correction in order to maintain
a linear relationship between the light input to the camera
and the light output from the picture screen.
4. Color generation circuit
This circuit converts the CCD data into RGB signals.
5. Matrix circuit
This circuit generates the Y signals, R-Y signals and B-Y signals from the RGB signals.
6. Horizontal aperture circuit
This circuit is used generate the aperture signal.
1-3. SDRAM controller
This circuit outputs address, RAS, CAS and AS data for controlling the SDRAM. It also refreshes the SDRAM.
1-4. PIO
The expansion parallel port can be used for functions such
as stroboscope control and LCD driver control.
1-8. Sound buffer
Audio memory
1-9. LCD driver
The 8-bit digital YUV signals which are input to the LCD driver
are converted to RGB signals, and the timing signal which is
necessary for LCD monitor display and the RGB signals are
then supplied to the LCD monitor.
1-10. LCD monitor
This is the image display device which displays the image
signals supplied from the LCD driver.
1-11. Memory card control
This reads data from the memory card and stores it in SDRAM,
and writes out the image data stored in SDRAM. In addition,
error correction is carried out when the data is read.
1-12. MJPEG compression
Still and continuous frame data is converted to JPEG format,
and movie images are compressed and expanded in MJPEG
format.
2. Outline of Operation
When the shutter opens, the reset signals, ZTEST0, ZTEST1,
ZTEST2 signals and the serial signals (“take a picture” commands) from the 8-bit microprocessor are input and record
operation starts. When the TG drives the CCD, picture data
passes through the A/D and is then input to the ASIC as 10bit data. This data then passes through the DCLP, AWB, shutter
and γ circuit, after which it is input to the SDRAM. The AWB,
shutter, γ, and AGC value are computed from this data, and
two exposures are made to obtain the optimum picture. The
data which has already been stored in the SDRAM is read by
the CPU and color generation is carried out. Each pixel is
interpolated from the surrounding data as being either R, G
or B primary color data to produce R, G and B data. At this
time, correction of the lens distortion which is a characteristic
of wide-angle lenses is carried out. Aperture correction is carried out, and in case of still picture the data is then compressed
by the JPEG method and in case of picture it is compressed
by MJPEG method and is written to compact flash card. When
the data is to be output to an external device, it is read JPEG
picture data from the compact flash card and output to PC via
the USB.
1-5. SIO (Serial control)
This is the interface for the 4-bit microprocessor.
1-6. USB control
This is comunicated PC with 12 Mbps.
1-7. TG, SG block
This is the timing generation circuit which generates the clocks
(vertical transfer clock and electronic shutter clock) which drive
the CCD.
– 3 –
Page 4
3. LCD Block
During EE, gamma conversion is carried out for the 10-bit
RGB data which is input from the A/D conversion block of the
CCD to the ASIC in order that the γ revised can be displayed
on the video. The YUV of 640 x 480 is then transferred to the
SVRAM.
The data which has accumulated in the SDRAM is converted
to digital YUV signal in conformity to ITUR-601 inside the ASIC
by SDRAM control circuit inside the ASIC, the data is sent to
the LCD driver IC and displayed the image to LCD panel.
If the shutter button is pressed in this condition, the 10-bit
data which is output from the A/D conversion block of the
CCD is sent to the SDRAM (DMA transfer), and is displayed
on the LCD as a freeze-frame image.
During playback, the JPEG image data which has accumulated in the compact flash card is converted to YUV signals.
In the same way as for EE, the data is then sent to the SDRAM,
converted to digital YUV signal in conformity to ITUR-601 inside the ASIC, the data is sent to the LCD driver IC and displayed the image to LCD panel.
The LCD driver is converted digital YUV signals to RGB signals from ASIC, and these RGB signals and the control signal which is output by the LCD driver are used to drive the
LCD panel. The RGB signals are 1H transposed so that no
DC component is present in the LCD element, and the two
horizontal shift register clocks drive the horizontal shift registers inside the LCD panel so that the 1H/1V transposed RGB
signals are applied to the LCD panel.
Because the LCD closes more as the difference in potential
between the VCOM (common polar voltage: AC drive) and
the R, G and B signals becomes greater, the display becomes
darker; if the difference in potential is smaller, the element
opens and the LCD become brighter. In addition, the brightness and contrast settings for the LCD can be varied by means
of the serial data from the ASIC.
– 4 –
Page 5
1-3. PW1 POWER CIRCUIT and LENS DRIVE
BLOCK DESCRIPTION
1. Outline
This is the main power circuit, and is comprised of the following blocks.
Switching power controller (IC501)
Analog and LCD system power output (Q5001, T5001)
Digital 1.85 V power output (Q5009, L5008)
Digital 3.35 V power output (Q5010, L5009)
Digital 3.35 V step-up power output (Q5011, L5010)
LED backlight power output (Q5012, L5011)
5 V system power output (Q5015, L5012)
2. Switching Controller
This is the basic circuit which is necessary for controlling the
power supply for a PWM-type switching regulator, and is provided with six built-in channels, only CH1 (analog and LCD
system power output), CH2 (digital 1.85 V system power output), CH3 (digital 3.35 V system power output), CH4 (digital
3.35 V step-up power output), CH5 (LED back light power
output) and CH6 (5 V system power output) are used. Feedback from 15.0 V (A) (CH1), 1.85 V (D) (CH2), 3.35 V (D)
(CH3), 4.7 V (L) (CH4), LED backlight output (CH5) and 5 V
(CH6) power supply outputs are received, and the PWM duty
is varied so that each one is maintained at the correct voltage
setting level.
2-1. Short-circuit Protection
If output is short-circuited for the length of time determined
by the condenser which is connected to Pin (37) of IC501, all
output is turned off. The control signal (P ON) are recontrolled
to restore output.
3. Analog and LCD System Power Output
15.0 V (A), -7.5 V (A) and 9.6 V (L) are output. Feedback for
the 15.0 V (A) is provided to the switching controller (Pin (40)
of IC501) so that PWM control can be carried out.
7. LED Backlight Power Output
A constant current flows to the backlight LEDs. Feedback for
the voltage of R5098 is provided to the power controller (Pin
(2) of IC501) so that PWM control can be carried out.
8. 5 V System Power Output
5 V is output. Feedback for the 5 V is provided to the swiching
controller (Pin (4) of IC501) so that PWM control can be carried out.
9. Lens drive block
9-1. Iris drive
When the drive signals (IRIS_A, IRIS_/A, IRIS_B and IRIS_/
B) which are output from the ASIC, the stepping motor is driven
by the driver (IC951), and are then used to drive the iris steps.
9-2. Focus drive
When the drive signals (FRSTB, FCW, FOEB and FCLK) which
are output from the ASIC, the focus stepping motor is sinewave driven by the micro-step motor driver (IC953). Detection
of the standard focusing positions is carried out by means of
the photointerruptor (FOCUS PI) inside the lens block.
9-3. Iris drive
The zoom DC motor drive signals (ZOOM_A and ZOOM_/A)
which are output from the ASIC are used to drive by the motor
driver (IC951). Detection of the zoom positions is carried out
by means of photointerruptor (ZOOM PI) inside the lens block.
9-4. Shutter drive
When the shutter drive signals (SHUT_A and SHUT_/A) which
are output from the ASIC, it is driven regular current by the
motor driver IC (IC951).
4. Digital 1.85 V Power Output
1.85 V (D) is output. Feedback for the 1.85 V (D) is provided
to the switching controller (Pins (43) of IC501) so that PWM
control can be carried out.
5. Digital 3.35 V Power Output
3.35 V (D) is output. Feedback for the 3.35 V (D) is provided
to the swiching controller (Pin (45) of IC501) so that PWM
control can be carried out.
6. Digital 3.35 V Step-up Power Output
4.7 V is output. Feedback for the 4.7 V is provided to the
swiching controller (Pin (47) of IC501) so that PWM control
can be carried out.
– 5 –
Page 6
1-4. ST1 STROBE CIRCUIT DESCRIPTION
1. Charging Circuit
When UNREG power is supplied to the charge circuit and the
CHG signal from SY1 board becomes High (3.3 V), the charging circuit starts operating and the main electorolytic capacitor is charged with high-voltage direct current.
However, when the CHG signal is Low (0 V), the charging
circuit does not operate.
1-1. Power switch
When the CHG signal switches to Hi, Q5407 turns ON and
the charging circuit starts operating.
1-2. Power supply filter
C5401 constitutes the power supply filter. They smooth out
ripples in the current which accompany the switching of the
oscillation transformer.
1-3. Oscillation circuit
This circuit generates an AC voltage (pulse) in order to increase the UNREG power supply voltage when drops in current occur. This circuit generates a drive pulse with a frequency
of approximately 50-100 kHz. Because self-excited light omission is used, the oscillation frequency changes according to
the drive conditions.
2. Light Emission Circuit
When RDY and TRIG signals are input from the ASIC expansion port, the stroboscope emits light.
2-1. Emission control circuit
When the RDY signal is input to the emission control circuit,
Q5409 switches on and preparation is made to let current
flow to the light emitting element. Moreover, when a STOP
signal is input, the stroboscope stops emitting light.
2-2. Trigger circuit
When a TRIG signal is input to the trigger circuit, D5405
switches on, a high-voltage pulse of several kilovolts is generated inside the trigger circuit, and this pulse is then applied
to the light emitting part.
2-3. Light emitting element
When the high-voltage pulse form the trigger circuit is applied to the light emitting part, currnet flows to the light emitting element and light is emitted.
Beware of electric shocks.
1-4. Oscillation transformer
The low-voltage alternating current which is generated by the
oscillation control circuit is converted to a high-voltage alternating current by the oscillation transformer.
1-5. Rectifier circuit
The high-voltage alternating current which is generated at
the secondary side of T5401 is rectified to produce a highvoltage direct current and is accumulated at electrolytic capacitor C5412.
1-6. Voltage monitoring circuit
This circuit is used to maintain the voltage accumulated at
C5412 at a constance level.
After the charging voltage is divided and converted to a lower
voltage by R5417, R5419 and R5420, it is output to the SY1
circuit board as the monitoring voltage VMONIT. When this
VMONIT voltage reaches a specified level at the SY1 circuit
board, the CHG signal is switched to Low and charging is
interrupted.
– 6 –
Page 7
1-5. SY1 CIRCUIT DESCRIPTION
1. Configuration and Functions
For the overall configuration of the SY1 circuit board, refer to the block diagram. The SY1 circuit board centers around a 8-bit
microprocessor (IC301), and controls camera system condition (mode).
The 8-bit microprocessor handles the following functions.
1. Operation key input, 2. Clock control and backup, 3. Power ON/OFF, 4. Storobe charge control, 5. Signal input and output for
zoom and lens control.
Pin
1~4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24VDD
25AVSS
26~29SCAN IN 3~0
30
31NOT USED
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
STBY_LED (GREEN)
Signal
SCAN OUT 0~3
P ON
PA O N
LCD ON
BL_ON
VSS
VDD
SELF_LED
STBY_LED (RED)
AVREF_ON
SI
SO
SCK
PRG SI
PRG SO
PRG SCK
NOT USED
NOT USED
CHG ON
INT_TMP
CHG VOL
BATTERY
AVREF
AVDD
RESET
XCOUT
XCIN
IC
XOUT
XIN
VSS
BAT OFF
SREQ
SCAN IN6
INTP3
NOT USED
BOOT
I/O
O
O
O
O
O
O
O
O
O
O
I/O
O
I/O
O
O
O
I/O
Outline
Key matrix output
Digital power ON/OFF controlH : ON
Analog power ON/OFF controlH : ON
LCD power ON/OFF controlH : ON
LCD backlight ON/OFF
-
-
I
I
-
-
-
-
I
I
-
I
I
-
-
I
I
I
I
-
I
I
I
I
-
GND
VDD
Self-timer LED controlL : ON
Stand-by LED (green) controlL : ON
Stand-by LED (red) controlL : ON
A/D converter standard voltage controlL : ON
Receiving data (from ASIC)
Sending data (to ASIC)
Communication clock (to ASIC)
Flash memory write receiving data
Flash memory write sending data
Flash memory write communication clock
-
-
Flash charge controlH : ON
VDD
Analog GND
Key scan input
Internal temperature detection input (analog input)
-
Storobe charge voltage detection (analog input)
Battery voltage detection (analog input)
Analog standard voltage input terminal
A/D converter analog power terminal
Reset input
Clock oscillation terminal (32.768 kHz)
Clock oscillation terminal
Flash memory writing voltage
Main clock oscillation terminal (4MHz)
Main clock oscillation terminal
GND
Battery OFF detection
Serial communication requirement (from ASIC)
Key scan input 6
-
-
Compulsion boot control
See next page →
– 7 –
Page 8
49AV JACK
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
DC IN
CARD
BUZZER
SCAN OUT 4
SCAN IN 4
SCAN IN 5
SUB1
USB
LCD ON2O
NTZPALONTSC/PAL switchH : NTSC
BACKUP_CNT
ASIC TEST 0
ASIC TEST 1
ASIC TEST 2
ASIC RESET
I
ODC jack/battery detection input (analog input)L : DC jack insertion
I
O
I
O
I
I/O
I
O
OASIC reset control signal 0
OASIC reset control signal 1
O
O
Table 5-1. 8-bit Microprocessor Port Specification
AV jack connection detectionH : AV jack detection
CF card insertion detectionL : Insertion
Buzzer beep tone outputH : Pulse output
Key scan output 4
Key scan input 4
Key scan input 5
Communication line to main
USB connector detectionL : USB detecion
LCD ON/OFF control 2H : ON
Backup battery charge controlL : Charge ON
ASIC reset control signal 2
ASIC reset singal
2. Internal Communication Bus
The SY1 circuit board carries out overall control of camera operation by detecting the input from the keyboard and the condition
of the camera circuits. The 8-bit microprocessor reads the signals from each sensor element as input data and outputs this data
to the camera circuits (ASIC) or to the LCD display device as operation mode setting data. Fig. 5-1 shows the internal communication between the 8-bit microprocessor, ASIC and SPARC lite circuits.
ASIC RESET
S. REQ
8-bit
Microprocessor
Fig. 5-1 Internal Bus Communication System
ASIC SO
ASIC SI
ASIC SCK
ASIC TEST 1
ASIC TEST 2
ASIC TEST 0
3. Key Operaiton
For details of the key operation, refer to the instruction manual.
SCAN
OUT
SCAN
IN
0
1
2
3
0
← LEFT
PLAY
-
WEB
-
1
↑ UP
VF
-
DC MODE
-4
2
↓ DOWN
LCD
TEST
SET UP
-
3
→ RIGHT
WIDE
FOCUS
VIDEO CLIP
SHOOTING
-
4
MENU
TELE
FLASH
SEQUENTIAL
SHOT
-
ASIC
5
SET
-
1st
STILL IMAGE
-
6
-
-
2nd
-
POWER ON
Table 5-2. Key Operation
– 8 –
Page 9
4. Power Supply Control
The 8-bit microprocessor controls the power supply for the overall system.
The following is a description of how the power supply is turned on and off. When the battery is attached, a regulated 3.2 V
voltage is normally input to the 8-bit microprocessor (IC301) by IC302, so that clock counting and key scanning is carried out
even when the power switch is turned off, so that the camera can start up again. When the battery is removed, the 8-bit microprocessor operates in sleep mode using the backup capacitor. At this time, the 8-bit microprocessor only carries out clock
counting, and waits in standby for the battery to be attached again. When a switch is operated, the 8-bit microprocessor supplies
power to the system as required.
The 8-bit microprocessor first sets both the P (A) ON signal at pin (6) and the P ON signal at pin (5) to high, and then turns on the
DC/DC converter. After this, low signals are output from pins (61), (62), (63) and (64) so that the ASIC is set to the reset condition.
After this these pins set to high, and set to active condition. If the LCD monitor is on, the LCD ON 2 signal at pin (58) set to high,
and the DC/DC converter for the LCD monitor is turned on. Once it is completed, the ASIC returns to the reset condition, all DC/
DC converters are turned off and the power supply to the whole system is halted.
ASIC,
memory
Power voltage
Power OFF
Power switch ON-
Auto power OFF
Shutter switch ON
CAMERA
Monitor OFF
LCD finder
Play back
Table 5-3. Camera Mode (Battery Operation)
Note) 4 MHz = Main clock operation, 32 kHz = Sub clock operation
3.3 V 1.8 V
OFF
OFF
ON
OFF
ON
ON
CCD
5 V (A)
+12 V etc.
OFF
OFF
ON → 2 OFF
OFF
ON
OFF
(ALWAYS)
5. 8-bit D/A circuit (Audio)
This circuit converts the audio signals (analog signals) from the microphone to 8-bit digital signals.
8 bit
CPU
3.2 V
32KHzOFF
4 MHzOFF
4 MHzOFF
4 MHzOFF
4 MHzON
4 MHzON
LCD
MONITOR
5 V (L)
+8.5 V etc.
6. 8-bit A/D circuit (Audio)
The audio signals which were converted to digial form by the 8-bit A/D circuit are temporarily to a sound buffer and then recorded
in the SSFDC card. During playback, the 8-bit D/A circuit converts these signals into analog audio signals.
– 9 –
Page 10
2. DISASSEMBLY
5
1
2
3
2
4
5
6
7
8
9
10
11
12
2-1. REMOVAL OF CABINET FRONT, CABINET BACK AND CABINET TOP
8
1. Six screws 1.7 x 2.5
2. Three screws 1.7 x 4
3. Four screws 1.7 x 2
4. Cabinet front
5. Cabinet back
6. FPC
7. Screw 1.7 x 2.5
8. Cabinet top
7
5
3
6
1
4
2
1
3
1
NOTE: Do not touch the holder cabi lock.
1
2
2
1
Because they change the shape
and get injured.
2-2. REMOVAL OF SY1 BOARD AND LCD
1. Two screws 1.7 x 3
2. Two connector
3. Connector
4. SY1 board
5. Four screws 1.7 x 3
6. Screw 1.7 x 3
7. Holder card
8. Holder monitor
9. FPC
10. Connector
11. LCD
12. Screw 1.7 x 4
NOTE: Attach the button buttery + side is
the bottom (Z3001 of SY1 board).
– 10 –
Page 11
2-3. REMOVAL OF PW1 BOARD, CA2 BOARD, ST1 BOARD AND CA1 BOARD
Note: If the lens, CCD and board in item 2-6, it is necessary
to adjust again. Item 2-6 adjustments other than these
should be carried out in sequence. For 5 and 6, carry
out adjustment after sufficient charging has taken place.
In case of carrying out adjustment item 3 and 4 after
adjusting item 5 and 6, adjust item 3 and 4 after turing
off the power.
3-4. Setup
1. System requirements
Windows 98 or Me or 2000 or XP
IBM R -compatible PC with pentium processor
CD-ROM drive
3.5-inch high-density diskette drive
USB port
40 MB RAM
Hard disk drive with at least 15 MB available
VGA or SVGA monitor with at least 256-color display
2. Installing calibration software
1. Insert the calibration software installation diskette into your
diskette drive.
2. Open the explorer.
3. Copy the DscCalDI_129 folder on the floppy disk in the FD
drive to a folder on the hard disk.
J-5
3-2. Equipment
1. Oscilloscope
2. Digital voltmeter
3. AC adaptor
4. PC (IBM R -compatible PC, Pentium processor, Window
98 or Me or 2000 or XP)
3-3. Adjustment Items and Order
1. IC501 Oscillation Frequency Adjustment
2. CCD VSUB Adjustment
3. AWB Adjustment
4. Lens Adjustment
5. CCD Defect Detect Adjustment
6. CCD Black Point Defect Detect Adjustment
7. LCD Panel Adjustment
7-1. LCD RGB Offset Adjustment
7-2. LCD Gain Adjustment
3. Installing USB driver
Install the USB driver with camera or connection kit for PC.
4. Pattern box (color viewer)
Turn on the switch and wait for 30 minutes for aging to take
place before using Color Pure. It is used after adjusting the
chroma meter (VJ8-0192) adjust color temperature to 3100 ±
20 K and luminosity to 900 ± 20 cd/m
2
. Be careful of handling
the lump and its circumference are high temperature during
use and after power off for a while.
5. Computer screen during adjustment
– 12 –
Page 13
3-5. Connecting the camera to the computer
1. Line up the arrow on the cable connector with the notch on the camera's USB port. Insert the connector.
2. Locate a USB port on your computer.
To USB port
AC adaptor
USB cable
– 13 –
Page 14
3-6. Adjust Specifications
[PW1 board (Side B)]
CL526
VR501
Note:
1. When installing a new CCD, read the abbreviation described
on the rear side of CCD, and write it to the board.
2. If the CCD, each board and parts replaces, it is necessary
to adjust again.
Adjustment method:
1. Turn on the power. (Insert the DC jack.)
2. Shorten TP301 and TP302 of SY1 board with pushing S3003
(Flash sw).
3. Read the abbreviation display on the rear side of CCD.
Convert these to voltages using the table below.
For example, “h” → VSUB = 11.7 V
4. Adjust with VR921 so that the voltage of TP901 at VSUB
becomes the displayed voltage value ± 0.1 V.
Note:
1. Frequency adjustment is necessary to repair in the PW1
board and replace the parts. It is carried out with LCD
through screen display mode.
Preparation:
1. Carry out the frequency adjustment disconnecting cabinet
front, cabinet back, cabinet top and screws of holder battery. Side B of PW1 board can be seen.
2. Connect FPC of cabinet back to CN303.
3. Insert the compact flash.
4. Set the main switch to the camera mode.
5. Set the selector dial to the still image shooting mode.
6. Push the power switch, and comfirm that the through screen
from the CCD can be seen on the LCD.
1. IC501 Oscillation Frequency Adjustment
Measuring Point
Measuring Equipment
ADJ. Location
ADJ. Value
Adjustment method:
1. Adjust with VR501 to 496 ± 1 kHz.
CL526
Frequency counter
VR501
496 ± 1 kHz
VSUB abbreviation
Voltage
C
10.7
N
12.7
1
8.9
D
10.9E11.1
P
12.9
3. AWB Adjustment
Camera
2
9.139.349.5
f
11.5
11.3
R
S
13.5
13.3
13.1
0~18 cm
6
9.779.9810.1
G
H
11.7
U
V
13.7
Pattern box
(color viewer)
J
11.9
W
13.9
K
12.1
X
14.1
9
10.3
L
12.3
Y
14.3
A
10.5
m
12.5
Z
14.5
2. CCD VSUB Adjustment
[CA2 board (Side A)]
TP901
CL136(G)
VR501
Preparation:
POWER switch: ON
Adjusting method:
1. When setting the camera in place, set it to an angle so that
nothing appears in any part of the color viewer except the
white section. (Do not enter any light.)
2. Double-click on the DscCalDi129.
3. Click the AWB, and click the Yes.
4. AWB adjustment value will appear on the screen.
5. Click the OK.
– 14 –
Page 15
4. Lens Adjustment
6. CCD Black Point Defect Detect Adjustment
Camera
Siemens
star chart
Preparation:
POWER switch: ON
Adjustment condition:
More than A3 size siemens star chart
Fluorescent light illumination with no flicker
Illumination above the subject should be 400 lux ± 10 %.
Adjustment method:
1. Set the siemens star chart 100 cm ± 3 cm so that it becomes center of the screen.
2. Double-click on the DscCalDi129.
3. Click the Focus, and click the Yes.
4. Lens adjustment value will appear on the screen.
5. Click the OK.
5. CCD Defect Detect Adjustment
Preparation:
POWER switch: ON (Set the camera mode.)
Adjustment method:
1. Double-click on the DscCalDi129.
2. Select “CCD Defect” on the LCD “Test”, and click the “Ye s ”.
3. After the adjustment is completed, OK will display.
4. Click the OK.
Camera
0~18 cm
Pattern box
(color viewer)
Preparation:
POWER switch: ON
Adjusting method:
1. When setting the camera in place, set it to an angle so that
nothing appears in any part of the color viewer except the
white section. (Do not enter any light.)
2. Double-click on the DscCalDi129.
3. Select “CCD Black” on the LCD “Test”, and click the “Ye s ”.
4. After the adjustment is completed, the number of defect will
appear.
7. LCD Panel Adjustment
[CA2 board (Side A)]
TP901
VR501
CL136(G)
7-1. LCD RGB Offset Adjustment
Preparation:
POWER switch: ON
Adjusting method:
1. Double-click on the DscCalDi129.
2. Adjust LCD “RGB Odd” so that the amplitude of the CL136
waveform is 0.95 V ± 0.05 V.
3. Adjust LCD “RGB Even” so that the amplitude of the CL136
waveform is 4.55 V ± 0.05 V.
– 15 –
Page 16
4.55 ±
0.05 V
0.95 ± 0.05 V
CL136 waveform
7-2. LCD Gain Adjustment
Adjusting method:
1. Adjust LCD “RGB Gain” so that the amplitude of the CL136
waveform is 1.55 V ± 0.1 Vp-p.
Note:
7-1. LCD RGB Offset adjustment should always be carried
out first.
1.55 V
± 0.1 Vp-p
CL136 waveform
– 16 –
Page 17
4. USB STORAGE INFORMATION
REGISTRATION
USB storage data is important for when the camera is connected to a computer via a USB connection.
If there are any errors in the USB storage data, or if it has not
been saved, the USB specification conditions will not be satisfied, so always check and save the USB storage data.
Preparation:
POWER switch: ON
Adjustment method:
1. Connect the camera to a computer. (Refer to 3-5. Connecting the camera to the computer on the page 13.)
2. Double-click on the DscCalDi129.
3. Click on the Get button in the USB storage window and
check the USB storage data.
VID: SANYO
PID: VPC-MZ3 or VPC-MZ3EX
Serial:
Rev. : 1.00
4. Check the “Serial” in the above USB storage data. If the
displayed value is different from the serial number printed
on the base of the camera, enter the number on the base
of the camera. Then click the Set button.
5. Next, check VID, PID and Rev. entries in the USB storage
data. If any of them are different from the values in 3. above,
make the changes and then click the corresponding Set
button.
Calibration
AWB
Focus
UV Matrix
Cal Mode
Cal Data
USB storage
VID
Get
PID
Set
OK
OK
Upload
Firmware
Image
Initialize
EVF
LCD Type
LCD
RGB Odd
RGB Gain
Tint
VCO
H AFCTest
Serial
Set
Set
Rev.
RGB Even
VCOMDC
Phase
Set
Set
VCOMPP(LOW)
VCOMPP(HI)
Setting
Language
Video Mode
– 17 –
Page 18
5. TROUBLESHOOTING GUIDE
POWER LOSS INOPERTIVE
PUSH MAIN SW
IC301-45 (SCAN IN 6)
PULSE INPUT
YES
IC302-7 4.7 V
(BOOST 4.7 V)
HIGH
IC301-10
(VDD)
HIGH
IC301-36
(RESET)
HIGH
IC301-43
(BAT OFF)
HIGH
IC301-40
OSCILLATION
YES
IC301-37
OSCILLATION
YES
NO
CHECK CN303-3
LOW
CHECK PW1, IC952
LOW
LOW
CHECK IC302, R3004
LOW
NO
NO
CHECK R3003
CHECK X3001
CHECK X3002
CHECK IC302
TAKING INOPERATIVE
PUSH SHUTTER
BUTTON
IC301-55, 45
(SCAN IN 5, 6)
PULSE INPUT
YES
CN301-18, 15
(P ON, P(A) ON)
HIGH
SERIAL
COMMUNICATION
OK
CHECK CA2
NO
LOW
NG
CHECK S3001,
D3012, D3013,
R3038, R3037
CHECK IC301,
RB302, PW1
CHECK
IC301, CA2
CHECK IC301
NO PICTURE
CHECK CLK
OSCILLATION X1101,
IC111, R1101
YES
SD CLK
OSCILLATION
R1103
OK
IC102-62, 63
IC301-15, 16
OK
CHECK SOLDERING
OF MEMORY PIN
MAIN CLOCK FOR SYSTEM OPERATION
NO
NO OPERATION IF ABSENT
CHECK X1101 OSCILLATOR, R1101 AND IC111
SD RAM (IC103) MOVEMENT CLOCK
NG
NO READ PROGRAM FROM IC121 IF ABSENT
CHECK IC102, IC103
INCORRECT HAND
NG
SHAKING 8-BIT CPU
CHECK EACH INTERFACE
– 18 –
Page 19
6. PARTS LIST
LOCATION PARTS NO.DESCRIPTIONLOCATION PARTS NO.DESCRIPTION
1. Materials of Capacitors and Resistors are abbreviated as follows ;
Resistors Capacitors
MT-FILMMetallized Film Resistor MT-POLYESTMetallized Polyester Capacitor
MT-GLAZEMetallized Glaze Resistor MT-COMPOMetallized Composite Capacitor
OXIDE-MTOxide Metallized Film Resistor TA-SOLDTantalum Solid Capacitor
2. Tolerance of Capacitor (10pF over) and Resistor are noted with follow symboles.
F ............1%G ............2%J ............5%K ............10%
M ..........20%N ..........30%Z ..........+80% ~ -20%
3. Capacitors
µ
FP : pF
U :
4. Inductors
µ
HMH : mH
UH :
5. N.S.P. : Not available as service parts.
LOCATION PARTS NO.DESCRIPTIONLOCATION PARTS NO.DESCRIPTION
COMPL,CA-1 SV-SX612
636 068 9848
C9001403 157 1904CERAMIC10P D 50V
C9002403 314 5905CERAMIC0.47U K 16V
C9003403 314 5905CERAMIC0.47U K 16V
C9004403 314 5905CERAMIC0.47U K 16V
C9005403 314 5905CERAMIC0.47U K 16V
C9014403 338 4403CERAMIC0.1U K 16V
C9016403 283 6309CERAMIC1U Z 10V
C9017403 333 3708CERAMIC10U M 10V
C9019403 338 4403CERAMIC0.1U K 16V
C9020403 332 8209CERAMIC10U M 16V
C9021403 332 8209CERAMIC10U M 16V
C9022403 320 5500CERAMIC1U Z 25V
Q9002405 153 6709TR 2SC3931-D
R9015401 105 7503MT-GLAZE82K JA 1/16W
R9020401 105 0405MT-GLAZE100 JA 1/16W
R9021401 105 4106MT-GALZE 3.3K JA 1/16W
R9022401 105 7909MT-GLAZE 0.000 ZA 1/16W
C1001403 345 3802TA-SOLID22U M 4V
C1002403 346 2309CERAMIC0.1U K 10V
C1004403 346 2309CERAMIC0.1U K 10V
C1005403 346 2309CERAMIC0.1U K 10V
C1006403 345 3802TA-SOLID22U M 4V
C1007403 343 3101CERAMIC1U K 6.3V
C1008403 346 2309CERAMIC0.1U K 10V
C1009403 369 0306CERAMIC1U Z 4V
C1010403 345 3802TA-SOLID22U M 4V
C1011403 346 2309CERAMIC0.1U K 10V
C1012403 346 2309CERAMIC0.1U K 10V
C1015403 345 4205TA-SOLID47U M 6.3V
C1016403 311 3409CERAMIC0.01U K 16V
C1017403 311 3409CERAMIC0.01U K 16V
C1019403 311 3409CERAMIC0.01U K 16V
C1021403 311 3409CERAMIC0.01U K 16V
C1023403 311 3409CERAMIC0.01U K 16V
C1025403 346 2309CERAMIC0.1U K 10V
C1027403 346 2309CERAMIC0.1U K 10V
C1028403 329 6508TA-SOLID10U M 6.3V
C1029403 345 3802TA-SOLID22U M 4V
C1031403 346 2309CERAMIC0.1U K 10V
C1032403 311 3409CERAMIC0.01U K 16V
C1033403 311 3409CERAMIC0.01U K 16V
C1034403 346 2309CERAMIC0.1U K 10V
C1035403 346 2309CERAMIC0.1U K 10V
C1036403 311 3409CERAMIC0.01U K 16V
C1037403 311 3409CERAMIC0.01U K 16V
C1038403 311 3409CERAMIC0.01U K 16V
C1039403 311 3409CERAMIC0.01U K 16V
C1040403 346 2309CERAMIC0.1U K 10V
C1041403 346 2309CERAMIC0.1U K 10V
C1042403 311 3409CERAMIC0.01U K 16V
C1043403 311 3409CERAMIC0.01U K 16V
C1044403 346 2309CERAMIC0.1U K 10V
C1045403 346 2309CERAMIC0.1U K 10V
C1046403 311 3409CERAMIC0.01U K 16V
C1047403 369 0306CERAMIC1U Z 4V
C1048403 369 0306CERAMIC1U Z 4V
C1050403 346 2309CERAMIC0.1U K 10V
C1052403 346 2309CERAMIC0.1U K 10V
C1053403 311 4505CERAMIC1000P K 50V
C1054403 311 4505CERAMIC1000P K 50V
C1055403 311 4505CERAMIC1000P K 50V
C1056403 311 4505CERAMIC1000P K 50V
C1057403 329 6508TA-SOLID10U M 6.3V
C1101403 343 3101CERAMIC1U K 6.3V
C1102403 311 3409CERAMIC0.01U K 16V
C1113403 346 2309CERAMIC0.1U K 10V
C1201403 346 2309CERAMIC0.1U K 10V
C1302403 343 3101CERAMIC1U K 6.3V
C1401403 312 6805CERAMIC0.1U Z 16V
C1402403 312 6805CERAMIC0.1U Z 16V
C1404403 312 6805CERAMIC0.1U Z 16V
C1405403 329 6508TA-SOLID10U M 6.3V
C1406403 312 6805CERAMIC0.1U Z 16V
C1501403 311 5007CERAMIC33P J 50V
C1502403 369 0306CERAMIC1U Z 4V
C1503403 343 3101CERAMIC1U K 6.3V
C1504403 345 3802TA-SOLID22U M 4V
C1505403 345 4205TA-SOLID47U M 6.3V
C1506403 343 3101CERAMIC1U K 6.3V
C1507403 311 7506CERAMIC22P J 50V
C1701403 346 2309CERAMIC0.1U K 10V
C1702403 369 0306CERAMIC1U Z 4V
C1703403 369 0306CERAMIC1U Z 4V
C1704403 343 3101CERAMIC1U K 6.3V
C1705403 343 3101CERAMIC1U K 6.3V
C1706403 346 2309CERAMIC0.1U K 10V
C1707403 346 2309CERAMIC0.1U K 10V
C1708403 343 3101CERAMIC1U K 6.3V
C1709403 346 2309CERAMIC0.1U K 10V
C1710403 346 2309CERAMIC0.1U K 10V
C1711403 346 2309CERAMIC0.1U K 10V
C1712403 369 0306CERAMIC1U Z 4V
C1713403 311 3409CERAMIC0.01U K 16V
C1714403 348 9108CERAMIC0.47U K 6.3V
21
Page 22
LOCATION PARTS NO.DESCRIPTIONLOCATION PARTS NO.DESCRIPTION
C1716403 373 0804CERAMIC3.3U K 6.3V
C1717403 346 2309CERAMIC0.1U K 10V
C1718403 311 3409CERAMIC0.01U K 16V
C1719403 346 2309CERAMIC0.1U K 10V
C1720403 343 3101CERAMIC1U K 6.3V
C1721403 343 3101CERAMIC1U K 6.3V
C1722403 343 3101CERAMIC1U K 6.3V
C1728403 329 6508TA-SOLID10U M 6.3V
C1729403 329 6508TA-SOLID10U M 6.3V
C1730403 343 3101CERAMIC1U K 6.3V
C1731403 343 3101CERAMIC1U K 6.3V
C1732403 338 4403CERAMIC0.1U K 16V
C1733403 343 8700CERAMIC1U M 12V
C1734403 379 0808CERAMIC1U M 16V
C2501403 343 3101CERAMIC1U K 6.3V
C9001403 320 5500CERAMIC1U Z 25V
C9002403 312 6805CERAMIC0.1U Z 16V
C9003403 283 6309CERAMIC1U Z 10V
C9004403 311 7605CERAMIC2200P K 50V
C9005403 283 6309CERAMIC1U Z 10V
C9006403 311 3409CERAMIC0.01U K 16V
C9007403 312 6805CERAMIC0.1U Z 16V
C9008403 312 6805CERAMIC0.1U Z 16V
C9009403 312 6805CERAMIC0.1U Z 16V
C9010403 283 6309CERAMIC1U Z 10V
C9011403 312 6805CERAMIC0.1U Z 16V
C9013403 320 5500CERAMIC1U Z 25V
C9014403 343 3101CERAMIC1U K 6.3V
C9016403 346 2309CERAMIC0.1U K 10V
C9017403 343 3101CERAMIC1U K 6.3V
C9018403 311 3409CERAMIC0.01U K 16V
C9019403 343 3101CERAMIC1U K 6.3V
C9020403 343 3101CERAMIC1U K 6.3V
C9021403 312 6805CERAMIC0.1U Z 16V
C9022403 311 3409CERAMIC0.01U K 16V
C9023403 346 2309CERAMIC0.1U K 10V
C9024403 320 5500CERAMIC1U Z 25V
C9026403 320 5302CERAMIC0.15U K 25V
C9027403 346 2309CERAMIC0.1U K 10V
C9028403 346 2309CERAMIC0.1U K 10V
C9029403 346 2309CERAMIC0.1U K 10V
C9031403 346 2309CERAMIC0.1U K 10V
C9032403 345 4304TA-SOLID22U M 10V
C9033403 346 2309CERAMIC0.1U K 10V
C9034403 311 3409CERAMIC0.01U K 16V
C9035403 346 2309CERAMIC0.1U K 10V
C9036403 311 3409CERAMIC0.01U K 16V
C9037403 345 4304TA-SOLID22U M 10V
C9038403 346 2309CERAMIC0.1U K 10V
C9039403 346 2309CERAMIC0.1U K 10V
C9040403 352 7305CERAMIC4.7U K 6.3V
CAMERA CIRCUIT ........................................................................................................................................... C4
POWER CIRCUIT ............................................................................................................................................. C5
CA2 BOARD MAIN ........................................................................................................................................ C13
SY1 BOARD SYSTEM CONTROL, AUDIO ................................................................................................... C18
CA1 P.W.B. (SIDEA, B) .................................................................................................................................. C20
CA2 P.W.B. (SIDEA, B) .................................................................................................................................. C20
SY1 P.W.B. (SIDEA, B) ................................................................................................................................... C21
PW1 P.W.B. (SIDEA, B) .................................................................................................................................. C21
ST1 P.W.B. (SIDEA, B) ................................................................................................................................... C21
C1
Page 28
NOTES:
1. All resistance values in "OHMS" unless otherwise noted.
(K=1,000 ; M=1,000,000)
2. All capacitance values in "µF" unless otherwise noted.
p=pico farad ; µ ,u or U=micro farad
3. All inductance values in "µH" unless otherwise noted.
µ ,u or U=micro henry ; m=milli henry
PRODUCT SAFETY NOTICE
THE COMPONENTS DESIGNATED BY A SYMBOL ( ) IN THIS
SCHEMATIC DIAGRAM DESIGNATES COMPONENTS WHOSE
VALUE ARE OF SPECIAL SIGNIFICANCE TO PRODUCT SAFETY.
SHOULD ANY COMPONENT DESIGNATED BY A SYMBOL NEED TO
BE REPLACED, USE ONLY THE PART DESIGNATED IN THE PARTS
LIST.
DO NOT DEVIATE FROM THE RESISTANCE, WATTAGE AND VOLTAGE RATINGS SHOWN.
ALWAYS3V
SCAN IN 0B
SCAN IN 1B
SCAN IN 2B
SCAN IN 5C
SCAN IN 2C
SCAN IN 0C
SCAN IN 3C
SCAN IN 1C
SCAN IN 4C
SCAN OUT 1
SCAN OUT 0
SCAN OUT 4
SCAN IN 4B
SCAN IN 2A
SCAN IN 1A
SCAN IN 0A
SCAN OUT 3
SCAN IN 5A
SCAN IN 4A
SCAN IN 3A
SCAN IN 3B