Sanyo VPC-FH1BK, VPC-FH1EXBK, VPC-FH1GXBK, VPC-FH1, VPC-FH1EX Service Manual

...

SERVICE MANUAL

FILE NO.

Dual Camera

1. OUTLINE OF CIRCUIT DESCRIPTION ............................... 3

2. DISASSEMBLY ................................................................... 12

3. ELECTRICAL ADJUSTMENT ............................................. 18

4. USB STORAGE INFORMATION REGISTRATION ............ 25

5. TROUBLESHOOTING GUIDE............................................ 26

6. PARTS LIST........................................................................ 28

CIRCUIT DIAGRAMS & PRINTED WIRING BOARDS...........C1

RoHS

•This product does not contain any hazardous substances prohibited by the RoHS Directive.

WARNING

•You are requested to use RoHS compliant parts for maintenance or repair.

•You are requested to use lead-free solder.

(This product has been manufactured using lead-free solder. Be sure to follow the

warning given on page 2 when carrying out repair work.)

VPC-FH1BK

(Product Code : 168 176 02) (U.S.A.) (Canada) (Taiwan) (General)

VPC-FH1EXBK

(Product Code : 168 176 03) (Europe) (U.K.) (South America) (China) (Australia) (Hong Kong) (Russia) (Middle East) (Africa) (General) (Korea) (Taiwan)

VPC-FH1GXBK

(Product Code : 168 176 04) (South America) (China) (Australia) (Hong Kong) (General) (Korea) (Taiwan)

VPC-FH1

(Product Code : 168 176 06) (U.S.A.) (Canada) (Taiwan) (General)

VPC-FH1EX

(Product Code : 168 176 07) (Europe) (U.K.) (South America) (China) (Australia) (Hong Kong) (Russia) (Middle East) (Africa) (General) (Korea) (Taiwan)

VPC-FH1GX

(Product Code : 168 176 08) (South America) (China) (Australia) (Hong Kong) (General) (Korea) (Taiwan)

CAUTION : Danger of explosion if battery is incorrectly replaced.

Replace only with the same or equivalent type recommended by the manufacturer. Discard used batteries according to the manufacturer’s instructions.

NOTE : 1. Parts order must contain model number, part number, and description.

2. Substitute parts may be supplied as the service parts.

3. N. S. P. : Not available as service parts.

Design and specification are subject to change without notice.

SG317/U, EX, GX, U2, EX2, GX2 (R)

REFERENCE No. SM5310779

PRODUCT SAFETY NOTICE

The components designated by a symbol ( ! ) in this schematic diagram designates components whose value are of

special significance to product safety. Should any component designated by a symbol need to be replaced, use only the part

designated in the Parts List. Do not deviate from the resistance, wattage, and voltage ratings shown.

WARNING

Do not use solder containing lead.

This product has been manufactured using lead-free solder in order to help preserve the environment. Because of this, be sure to use lead-free solder when carrying out repair work, and never use solder containing lead.

Lead-free solder has a melting point that is 30 - 40°C (86 104°F) higher than solder containing lead, and moreover it does not contain lead which attaches easily to other metals. As a result, it does not melt as easily as solder containing lead, and soldering will be more difficult even if the temperature of the soldering iron is increased. The extra difficulty in soldering means that soldering time will increase and damage to the components or the circuit board may easily occur. Because of this, you should use a soldering iron and solder that satisfy the following conditions when carrying out repair work.

Note:

If replacing existing solder containing lead with lead-free solder in the soldered parts of products that have been manufactured up until now, remove all of the existing solder at those parts before applying the lead-free solder.

Soldering iron

Use a soldering iron which is 70 W or equivalent, and which lets you adjust the tip temperature up to 450°C (842°F). It should also have as good temperature recovery characteristics as possible. Set the temperature to 350°C (662°F) or less for chip components, to 380°C (716°F) for lead wires and similar, and to 420°C (788°F) when installing and removing shield plates. The tip of the soldering iron should have a C-cut shape or a driver shape so that it can contact the circuit board as flat or in a line as much as possible.

Solder

Use solder with the metal content and composition ratio by weight given in the table below. Do not use solders which do not meet these conditions.

Metal content

Composition ratio by weight

Lead-free solder is available for purchase as a service tool. Use the following part number when ordering:

Part name: Lead-free solder with resin (0.5 mm dia., 500 g) Part number: VJ8-0270

Tin (Sn) Silver (Ag)

96.5 %

3.0 %

Copper (Cu)

0.5 %

– 2 –

OUTLINE OF CIRCUIT DESCRIPTION

1-1. CMOS CIRCUIT DESCRIPTION

1. IC Configuration

The CMOS peripheral circuit block basically consists of the following ICs. IC911 (IMX039LQR) CMOS imager

H driver, V driver, serial communication circuit built-in CDS/PGA built-in Gain + 18 dB (step pitch 0.1 dB) 10 bit/12 bit A/D converter built-in

2. IC911 (CMOS)

[Structure]

The electric charges which are generated when each pixel is optically converted are in turn converted into signal voltages by the FD amplifier, and they are then transmitted by the builtin H driver and V driver. The signals are sampled and amplified by the CDS and PGA circuits at the point they are output, and then they are AD converted and output. The output uses the LVDS interface.

CMOS image sensor Image size: diagonal 7.63 mm (1/2.3 type) Pixels in total:

3632 (H) x 2832 (V) approx. 10.29 million pixels

Effective pixels:

-when using 1/2.3 type approx 9.29 million pixels: 3528 (H) x 2632 (V) approx. 9.29 million pixels

-when using 1/2.5 type approx 8.30 million pixels: 3336 (H) x 2488 (V) approx. 8.30 million pixels

-when using 1/2.9 type approx 5.56 million pixels: 3144 (H) x 1768 (V) approx. 5.56 million pixels

-when using 1/4.1 type approx 2.89 million pixels: 2160 (H) x 1336 (V) approx. 2.89 million pixels

Unit cell size: 1.75 µm (H) x 1.75 µm (V) Optical black:

Horizontal (H) direction: Front 48 pixels, Rear 0 pixel Vertical (V) direction: Front 4 pixels, Rear 0 pixel

– 3 –

1-2. CP1 and VF1 CIRCUIT DESCRIPTION

1. Circuit Description 1-1. Digital clamp

The optical black section extracts averaged values from the subsequent data to make the black level of the sensor output data uniform for each line. The optical black section averaged value for each line is taken as the sum of the value for the previous line multiplied by the coefficient k and the value for the current line multiplied by the coefficient k-1.

1-2. Signal processor

1. γ correction circuit

This circuit performs (gamma) correction in order to maintain a linear relationship between the light input to the camera and the light output from the picture screen.

2. Color generation circuit

This circuit converts the image sensor into RGB signals.

3. Matrix circuit

This circuit generates the Y signals, R-Y signals and B-Y signals from the RGB signals.

4. Horizontal and vertical aperture circuit

This circuit is used gemerate the aperture signal.

1-3. AE/AWB and AF computing circuit

The AE/AWB carries out computation based on a 64-segment screen, and the AF carries out computations based on a 6segment screen.

1-4. SDRAM controller

This circuit outputs address, RAS, CAS and CLOCK data for controlling the SDRAM. It also refreshes the SDRAM.

1-5. Communication control

1. SIO

This is the interface for the 8-bit microprocessor.

2. PIO/PWM/SIO for LCD

8-bit parallel input and output makes it possible to switch between individual input/output and PWM input/output.

2. Outline of Operation

When the shutter opens, the reset signals (ASIC and CPU) and the serial signals (“take a picture” commands) from the 8bit microprocessor are input and operation starts. When the TG/SG drives the image sensor, picture data is converted internally into a small-amplitude actuating signal, and is then input to ASIC. The data that is input to the ASIC is input to the SDRAM through digital clamp. The AF, AE, AWB, shutter, and AGC value are computed from this data, and obtain the optimum picture. The data which has already been stored in the SDRAM is read by the CPU and color generation is carried out. Each pixel is interpolated from the surrounding data as being either R, G, and B primary color data to produce R, G and B data. At this time, correction of the lens distortion which is a characteristic of wide-angle lenses is carried out. After AWB and γ processing are carried out, a matrix is generated and aperture correction is carried out for the Y signal, and the data is then compressed by JPEG and is then written to card memory (SD card). When played back on the LCD and monitor, data is transferred from memery to the SDRAM, and the image is then elongated so that it is displayed over the SDRAM display area.

3. LCD Block

The LCD display circuit is located on the CP1 board, and consists of components such as a power circuit. The signals from the ASIC are 8-bit digital signals, that is input to the LCD directly. The 8-bit digital signals are converted to RGB signals inside the LCD driver circuit . This LCD has a 3-wire serial, and functions such as the brightness and image quality are controlled. Because the LCD closes more as the difference in potential between the VCOM (common polar voltage: AC) and the R, G and B signals becomes greater, the display becomes darker; if the difference in potential is smaller, the element opens and the LCD become brighter. In addition, the timing pulses for signals other than the video signals are also input from the ASIC directory to the LCD.

1-6. TG/SG

Timing generated for image sensor control.

1-7. Digital encorder

It generates chroma signal from color difference signal.

– 4 –

4. Lens drive block

4-1. Focus drive

The 16-bit serial data signals (LENS_SDI) and (LENS_SCLK and LENS_EN) which are output from the ASIC (IC101) are used to drive (FOCUS A +, FOCUS A -, FOCUS B + and FOCUS B -) by the motor driver IC (IC951), and are then used to microstep-drive the stepping motor for focusing operation. Detection of the standard focusing positions is carried out by means of the photointerruptor (F_SENSE) inside the lens block.

4-2. Zoom drive

The 16-bit serial data signals (LENS_SDI) and (LENS_SCLK and LENS_EN) which are output from the ASIC (IC101) are used to drive (ZOOM A +, ZOOM A -, ZOOM B + and ZOOM B

-) by the motor driver IC (IC951), and are then used to microstep-drive the stepping motor for zooming operation. Detection of the standard zooming positions is carried out by means of the photointerruptor (F_SENSE) inside the lens block.

4-3. ND filter

The 16-bit serial data signals (LENS_SDI) and (LENS_SCLK and LENS_EN) which are output from the ASIC (IC101) are used to drive (ND + and ND –) by the motor driver IC (IC951), and then the ND filter is inserted into and removed from the beam path.

4-3. Iris drive

The drive method is a galvanometer type without braking coil. The output from the Hall sensor inside the lens is amplified by the Hall amplifier circuit inside the IC951 lens drive IC, and the difference between the current and target aperture determined by the resulting output and the exposure amout (16 bit serial signal (LENS_SDI) and (LENS_SCLK and LENS_EN)) output from the ASIC (IC101) is input to the servo amplifier circuit (IC951) to keep the aperture automatically controlled (DRIVE+ and DRIVE -) to the target aperture.

5. Video Clip Recording and Playback

5-1. Recording

The signal from the camera block is input to IC101 (ASIC). The data that is input to the ASIC is input to SDRAM, and converts this data to encoded MPEG4 data, after which it is written in sequence onto the SD card as streaming data. At this time, the audio signals that are input to the built-in microphone are converted into digital data by the audio CODEC IC of IC182, and they are then input to ASIC. The audio data is then encoded (AAC), and then it is written in sequence onto the SD card together as streaming data with the image signals described above.

5-2. Playback

The data is read from the SD card, and the encoded data is decoded into image data where it is displayed by the LCD or on a TV monitor. At the same time, the audio data is also decoded, and is input to IC182 as digital data. D/A conversion is carried out at IC182, and the sound is then output to the speaker or to the LINE OUT terminal or the headphone.

6. Audio CODEC Circuit (IC182)

The audio signals from the microphone are converted into 16bit digital data. AD conversion is carried out at a maximum sampling frequency of 48 kHz. During audio playback, the 16-bit digital data is converted into analog signals and these drive headphone through the speaker or line out system and headphone amplifier. DA conversion is carried out at a maximum sampling frequency of 48 kHz.

4-4. Shutter drive

Reverse voltage is applied to the above aperture drive coil to operate the shutter. When the shutter operates, the SHUTTER + signal that is output from the ASIC (IC101) becomes high (input to SHUTTER of IC951) and the shutter operates.

– 5 –

1-3. PWA POWER CIRCUIT DESCRIPTION

1. Outline

This is the main power circuit, and is comprised of the following blocks. Switching controller (IC501) Digital 3.25 V power output (L5002) Digital 1.8 V power output (L5003) Digital 1.2 V power output (IC502, L5004) LCD backlight system power output (Q5007, L5007) Motor system 5.0 V power output (L5301) CMOS digital 1.8 V power output (IC503, L5006) Charge circuit (IC521)

2. Switching Controller (IC501)

This is the basic circuit which is necessary for controlling the power supply for a PWM-type switching regulator, and is provided with seven built-in channels, only CH1 (motor system), CH2 (digital 3.25 V), CH3 (digital 1.8 V) and CH7 (LCD backlight) are used. Feedback from BOOST 5 V (CH1), VDD3 (CH2), VDD1.8 (CH3) and LCD backlight system (CH7) are received, and the PWM duty is varied so that each one is maintained at the correct voltage setting level. Feedback for the backlight power (CH7) is provided to the both ends voltage of registance so that regular current can be controlled to be current that was setting.

2-1. Short-circuit protection circuit

If output is short-circuited for the length of time determined by the condenser which is connected to Pin (A6) of IC501, all output is turned off. To reset, momentarily set the control signal (P ON) to repeat control.

3. Digital 3.25 V Power Output

VDD3 is output. Feedback for the VDD3 is provided to the swiching controller (Pin (F3) of IC501) so that PWM control can be carried out.

4. Digital 1.8 V Power Output

VDD 1.8 is output. Feedback for the VDD 1.8 is provided to the switching controller (Pin (C3) of IC501) so that PWM control to be carried out.

5. Digital 1.2 V Power Output

VDD 1.2 is output. Feedback for the VDD 1.2 is provided to the switching controller (Pin (11) of IC502) so that PWM control to be carried out.

6. LCD Backlight Power Supply output

Regular current (15 mA) is being transmitted to LED for LCD backlight. Feedback for the both ends voltage of registance that is being positioned to in series LED are provided to the switching controller (Pin (C4) of IC501) so that PWM control to be carried out.

7. Motor System 5.0 V Power Output

BOOST 5 V is output. Feedback for the BOOST 5 V is provided to the (Pin (B7) of IC501) so that PWM control to be carried out.

8. CMOS Digital 1.8 V Power Output

+1.8 V (D) is output.

9. Camera Charging Circuit

If the camera’s power is turned off, power save mode and sleep mode setting while it is connected to the AC adaptor, the battery will be recharged. In the above condition, a CTL signal is sent from the microprocessor and recharging starts.

– 6 –

1-4. ST1 STROBE CIRCUIT DESCRIPTION

1. Charging Circuit

When UNREG power is supplied to the charge circuit and the CHG signal from microprocessor becomes High (3.3 V), the charging circuit starts operating and the main electorolytic capacitor is charged with high-voltage direct current. However, when the CHG signal is Low (0 V), the charging circuit does not operate.

1-1. Charge switch

When the CHG signal switches to Hi, IC541 starts charging operation.

1-2. Power supply filter

C5401 constitutes the power supply filter. They smooth out ripples in the current which accompany the switching of the oscillation transformer.

1-3. Oscillation circuit

This circuit generates an AC voltage (pulse) in order to increase the UNREG power supply voltage when drops in current occur. This circuit generates a drive pulse with a frequency of approximately 200-300 kHz, and drive the oscillation transformer.

2. Light Emission Circuit

When FLCTL signal is input from the ASIC, the stroboscope emits light.

2-1. Emission control circuit

When the FLCLT signal is input to the emission control circuit, Q5402 switches on and preparation is made to the light emitting. Moreover, when a FLCLT signal becomes Lo, the stroboscope stops emitting light.

2-2. Trigger circuit

The Q5402 is turned ON by the FLCLT signal and light emission preparation is preformed. Simultaneously, high voltage pulses of several kV are emitted from the trigger coil and applied to the light emitter.

2-3. Light emitting element

When the high-voltage pulse form the trigger circuit is applied to the light emitting part, currnet flows to the light emitting element and light is emitted.

Beware of electric shocks.

1-4. Oscillation transformer

The low-voltage alternating current which is generated by the oscillation control circuit is converted to a high-voltage alternating current by the oscillation transformer.

1-5. Rectifier circuit

The high-voltage alternating current which is generated at the secondary side of T5401 is rectified to produce a highvoltage direct current and is accumulated at electrolytic capacitor C5412.

1-6. Charge monitoring circuit

The functions programmed in the IC541 monitor oscillations and estimate the charging voltage. If the voltage exceeds the rated value, charging automatically stops. Then, the ZCHG_DONE signal is changed to Lo output and a "charging stopped" signal is sent to the microcomputer.

– 7 –

1-5. SYA CIRCUIT DESCRIPTION

1. Configuration and Functions

For the overall configuration of the SYA block, refer to the block diagram. The SYA block centers around a 8-bit microprocessor (IC301), and controls camera system condition (mode). The 8-bit microprocessor handles the following functions.

1. Operation key input, 2. Clock control and backup, 3. Power ON/OFF, 4. Storobe charge control

11~14

21 SCAN_IN0

22 PANEL_OPEN

23 KEY 2nd

25 NOT USED

30 NOT USED

31 P ON

32 NOT USED

41 HINGE

42~44

Signal

ASIC_SCK

ZCARD

ZBACKUPCTL

CHG_CNT

HOT LINE

GREEN_LED

RED_LED

ST_CHG_ON

VDD2

VSS2

SCAN IN4~1

ZUSB_DET

HDMI_HPD

ZCHG_DONE

TIMEOUT

BAT_UTX

BAT_URX

USB_ON

TGVD

MRST

SW3.2ON

NOT USED

ZBOOT_COMREQ

ERR

VSS3

VDD3

RDSEL

CLK (SFW)

DATA0 (SFW)

DC_IN

SCAN OUT2~0

ZOOM_AD

NOT USED

ZAV_JACK

I/O

O-

O Digital system power start-up signal

O-

I/O

Serial communication clock output

Card detection

Backup battery charge control

Camera charge permission

Hot line request from ASIC

Switch unit LED (green)

Switch unit LED (red)

Strobo charge control

Power

Keyscan input 4~1

USB power detection terminal

HDMI hot plug detection

Main condensor charge detection

Camera charge done detection

Battery power detection IC UART output

Battery power detection IC UART input

Keyscan input 0

Panel open detection

S2 key input

USB charge control

VSYNC monitoring

System reset

SW 3.2 V power control

BOOT signal input

Camera charge error detection

Power

Debugger signal

DC jack insertion detection

Panel rotation detection

Keyscan output 2~0

Zoom key AD input

AV cable detection

Outline

See next page →

– 8 –

53 54

BAT_TMP

BAT_OFF

ZSREQ

KEY_1st

IR_IN

ZRESET

XCIN

XCOUT

VSS1

XIN I

XOUT O -

VDD1

BATTERY

USB_HOST I USB host cable detection

INT_TEMP I

ASIC_SDI O

ASIC_SDO

I I

I UNREG voltage detection

Table 5-1. 8-bit Microprocessor Port Specification

Battery temperature detection

Battery OFF detection signal input

Serial communication request signal

S1 key input

Remote controller input

Microprocessor reset input

32 k oscillation input

32 k oscillation output

Power

Camera temperature detection

Serial communication data output

Serial communication data input

2. Internal Communication Bus

The SYA block carries out overall control of camera operation by detecting the input from the keyboard and the condition of the camera circuits. The 8-bit microprocessor reads the signals from each sensor element as input data and outputs this data to the camera circuits (ASIC) or to the LCD display device as operation mode setting data. Fig. 5-1 shows the internal communication between the 8-bit microprocessor, ASIC and SPARC lite circuits.

SREQ

8-bit

Microprocessor

Fig. 5-1 Internal Bus Communication System

ASIC_SDO

ASIC_SDI

ASIC_SCK

MRST

3. Key Operaiton

For details of the key operation, refer to the instruction manual.

SCAN

SCAN OUT

PW_TEST

123

DOWN

VREC

Table 5-2. Key Operation

LEFT

PLAY

TEST -

RIGHT

ASIC

SET

POWER

– 9 –

4. Power Supply Control

The 8-bit microprocessor controls the power supply for the overall system. The following is a description of how the power supply is turned on and off. When the battery is attached, a regulated 3.2 V voltage is normally input to the 8-bit microprocessor (IC301) by IC302, so that clock counting and key scanning is carried out even when the power switch is turned off, so that the camera can start up again. When the battery is removed, the 8-bit microprocessor operates in sleep mode using the backup lithum battery. At this time, the 8-bit microprocessor only carries out clock counting, and waits in standby for the battery to be attached again. When a switch is operated, the 8-bit microprocessor supplies power to the system as required. The PON signal from the 8-bit microprocessor at pin (32) set to high, and then turns on the DC/DC converter. At this time, low signal is output from pin (18) so that the ASIC is set to the reset condition. After, this pin set to high, and set to active condition. When the power switch is turned off, the ASIC returns to the reset condition, all DC/DC converters are turned off and the power supply to the whole system is halted.

ASIC,

memory

Power voltage

Power OFF

Power switch ON-

Auto power OFF

CAMERA

LCD monitor

Playback

Note) 4 MHz = Main clock operation, 32 kHz = Sub clock operation

3.3 V 1.8 V 1.2 V

OFF

Table 5-3. Camera Mode

CMOS

2.7 V (A) 1.8 V (D)

1.8 V (I/O)

OFF

8 bit

CPU

3.2 V

(ALWAYS)

32KHz OFF

4 MHz ON

MONITOR

LCD

3.3 V

– 10 –

MEMO

– 11 –

2. DISASSEMBLY

2-1. REMOVAL OF CABINET BOTTOM, CABINET TOP, CABINET BACK, TB4 BOARD AND CABINET FRONT

When assembling,

assemble order.

A → B

When assembling,

assemble order.

A → B

When assembling,

tighten the screws order.

a → b → c

When assembling,

tighten the screws order.

a → b → c

When assembling,

assemble order.

A → B

NOTE: Discharge a strobe capacitor with the

discharge jig (VJ8-0188) for electric shock prevention.

– 12 –

1. Cover battery

2. Spacer bottom

3. Spacer LCD

4. Spacer LCD front

5. Two screws 1.7 x 2

6. Screw 1.7 x 7

7. Three screws 1.7 x 3

8. Screw 1.7 x 3

50. Dec joint

51. Dec line joint

52. Two screws 1.7 x 4

53. Screw 1.7 x 3

54. Two screws 1.7 x 3

55. Compl, cabinet front

56. Screw 1.7 x 3

57. Screw 1.7 x 3

9. Three screws 1.7 x 4

10. Remove the cabi bottom from the main body.

11. Screw 1.7 x 3

12. Holder strap front

13. Spacer blind

14. Screw 1.7 x 3

15. Holder strap back

16. Two screws 1.7 x 4

17. Stand

18. Remove the solder.

19. Screw 1.7 x 3

20. Screw 1.7 x 3

21. Cabinet top

22. Screw 1.7 x 3

23. Two screws 1.7 x 3

43. Spacer mic

24. Two screws 1.7 x 3

25. Flexible pwb CP1 & TB4

26. Cover SD

27. Remove the cabinet back from the main body.

28. Cover DC

29. Three screws 1.7 x 4

30. Holder back

31. Two screws 1.7 x 4

32. TB4 board

33. FPC

34. Unit, zoom

35. Flexible pwb CP1 & TB4

36. Button select

37. Holder button bas

48. Sheild tape LCD CP1

38. Button menu

39. Button rec play

40. Button movie

41. Button shutter

42. Sheild tape mic

43. Spacer mic

44. Remove the solder.

45. Two screws 1.7 x 4

46. Holder bottom

47. Spacer shield wire

48. Sheild tape LCD CP1

49. Connector

47. Spacer shield wire

42. Sheild tape mic

Cross-section drawing

Do not run.

55. Compl, cabinet front

Note:

Do not tuck the

lead wires.

– 13 –

2-2. REMOVAL OF TB1 BOARD, TB5 BOARD, LENS, ST1 BOARD, CP1 BOARD AND TB3 BOARD

When assembling,

tighten the screws order.

a → b → c

When assembling,

tighten the screws order.

A → B

24, 26

45 47 14

When assembling,

tighten the screws order.

a → b

– 14 –

1. Shield tape VF1

2. Screw 1.7 x 3

3. Heat sink left

4. Heat sink tape top

5. Three screws 1.7 x 3

6. TB1 board

7. Flexible pwb TB1 & TB5

8. Three screws 1.7 x 2.5

9. TB5 board

10. Flexible pwb TB1 & TB5

11. Two screws 1.7 x 4

12. Screw 1.7 x 3

13. Two screws 1.7 x 3

14. Two screws 1.7 x 4

15. FPC

16. Holder lens chassis

17. Holder lens

18. Two screws 1.7 x 3

19. Holder TB1

20. Spacer CA

21. Screw 1.7 x 2.5

22. Holder CA

23. Connector

24. Remove the lens part.

25. Holder lens

26. Lens

27. Two screws 1.7 x 7

28. Screw 1.7 x 3

29. Connector

30. ST1 board

31. Spacer ST1

32. Remove the solder.

33. Assy, lamp

34. Cover triger

35. Remove the solder.

36. Spacer con ST1

37. Spacer lens right

38. Flexible pwb CP1 & TB3

39. Four screws 1.7 x 3

40. CP1 board

41. Flexible pwb CP1 & TB3

42. Heat sink rub ASIC

43. Sheild tape DDR

44. Spacer DDR

45. Screw 1.4 x 2

46. Earth jack

47. Two screws 1.7 x 3

48. Chassis bottom

49. Spacer holder TB1

50. Three screws 1.7 x 2.5

51. TB3 board

52. Chassis right

33. Assy lamp soldering order

16. Holder lens chassis

44. Spacer DDR

33. Assy lamp dressing method

38, 41. Flexible pwb CP1 & TB3

37. Spacer lens right

43. Sheild tape DDR

– 15 –

2-3. REMOVAL OF TB2 BOARD, VF1 BOARD AND LCD

1. Screw 1.7 x 2

2. Screw 1.7 x 3

3. Holder wire

4. Spacer holder joint

5. Two screws 1.7 x 3

6. Holder joint

7. Cabinet right

8. Button power

9. Cover joint

10. Two screws 1.7 x 3

11. Cover LCD back

12. Dec line A

13. Sheild tape VF1

14. Connector

13. Sheild tape VF1

15. Spacer LCD FPC

16. Remove the solder.

17. Assy, joint

When assembling,

assemble order.

A → B

18. Screw 1.7 x 2

19. TB2 board

20. FPC

21. Two screws 1.7 x 3

22. VF1 board

23. Spacer pwb

24. Holder LCD

25. LCD

26. Cover LCD front

When assembling,

assemble order.

A → B

15. Spacer LCD FPC

4. Spacer holder joint

3. Holder wire

– 16 –

2-4. BOARD LOCATION

TB4 board

CP1 board

TB1 board

TB5 board

TB3 board

VF1 board

TB2 board

ST1 board

– 17 –

3. ELECTRICAL ADJUSTMENT

Firmware

QrCode

AWB

Focus

UV Matrix

R Bright

RGB Offset

Tint

B Bright

Gain

Phase

LCD

Calibration

Upload

PAF Cal.

LCD Type

H AFC Test

VCOMDC

VCOMPP

Cal Data

Cal Mode

EVF

USB storage

Get Set

VID

Set

PID

Set

Serial

Set

Rev.

Set

Setting

Language

Video Mode

VCO

Factory Code

Hall Cal.

Backrush pulse :

Set

Get

3-1. Table for Servicing Tools

Ref. No.

J-1

J-2

J-3

J-4

J-5

J-6

J-7

J-8

J-9

Name

Pattern box

Calibration software

Chroma meter

Spare lump (pattern box)

Discharge jig

Collimator

Spare lump (collimator)

Siemens star chart

ND2 filter

Number

Part code

VJ8-0190

VJ8-0192

VJ8-0191

VJ8-0188

VJ8-0260

VJ8-0282

3-3. Adjustment Items and Order

1. Lens Adjustment (Barcode Input)

2. Lens Adjustment (Infinity)

3. Lens Adjustment (1m)

4. Mecha Shutter Adjustment

5. WB Adjustment

6. CMOS White Point Defect Detect Adjustment

7. CMOS Black Point And White Point Defect Detect Adjust-

ment In Lighted Note: If the lens, board and changing the part, it is necessary to adjust again. Item 1-7 adjustments should be carried out in sequence.

*Adjustment environment

Temperature: 25 ± 10 degrees, Humidity: 55 ± 25 %

Download the calibration software and the firmware from the following URL. http://www.digital-sanyo.com/overseas/service/ Place the DscCalDi.exe file, camapi32.dll file and QrCodeInfo.dll file together into a folder of your choice.

J-1 J-3

J-4

J-5

3-4. Setup

1. System requirements

Windows 2000 or XP or Vista IBM R -compatible PC with pentium processor USB port

40 MB RAM

Hard disk drive with at least 15 MB available VGA or SVGA monitor with at least 256-color display

2. Pattern box

Turn on the switch and wait for 30 minutes for aging to take place before using Color Pure. It is used after adjusting the chroma meter (VJ8-0192) adjust color temperature to 3100 ± 20 K and luminosity to 900 ± 20 cd/m the lump and its circumference are high temperature during use and after power off for a while.

3. Computer screen during adjustment

. Be careful of handling

J-8

3-2. Equipment

1. AC adaptor

2. PC (IBM R -compatible PC, Windows 2000 or XP or Vista)

3-5. Connecting the camera to the computer

1. Use the supplied dedicated USB interface cable to connect

the camera to the computer.

2. Turn on the camera.

3. Choose the “COMPUTER”, and press the SET button.

Next, choose the “CARD READER”, and press the SET

button.

– 18 –

3-6. The adjustment item which in necessary in part exchange

Lens

Adjust-

ment

(Barcode

Input)

Lens

Adjust-

ment

(Infinity)

Lens

Adjust-

ment

(1 m)

Mecha

Shutter

Adjust-

ment

Adjust-

ment

CMOS

White Point

Defect Detect

Adjustment

CMOS Black

Point And

White Point

Defect Detect

Adjustment

In Lighted

Factory

Cord

Setting

Language

Setting

COMPL PWB CP1

COMPL PWB VF1

COMPL PWB ST1

COMPL PWB TB1

COMPL PWB TB2

COMPL PWB TB3

COMPL PWB TB4

COMPL PWB TB5

ASSY, FLEXIBLE

PWB CA1

: Be sure to carry out the necessary adjustments after replacing the unit. : Adjustment is possible from the menu setting screen of the camera and by using the calibration software.

USB

storage information registration

Reset

Setting

3-7. Updating the firmware

Check the firmware version immediately after the CP1 board has been replaced. If an old version is being used, interference and errors in operation may also occur. If an old version is being used, update it with a newer version. Refer to

3-8. Adjust Specifications

1. Lens Adjustment (Barcode Input)

Adjustment method:

1. Double-click on the DscCalDi.exe.

2. Click the “QrCode”.

3. QrCode Input Dialog display will be displayed.

4. Deselect Bar code Input.

3-13. Firmware uploading procedure. (Page 24)

5. Enter the alphanumeric characters which are underneath the bar code which is included with the lens.

6. Click the Execute.

7. Click the OK.

Note: The five input boxes (numbered (1) (2) (3) (4) (5) in order starting from the left) have the following limits on input. (1) can only contain numerical input from 0 to 2. (2) can only contain numerical input from 0 to 2. (3) can only contain numerical input from 1 to 2.

– 19 –

2. Lens Adjustment (Infinity)

Camera

Collimator

Preparation:

POWER switch: ON If using a ready-made collimator, set to infinity.

Note:

Do not vibrate during the adjustment. If readjusting after it has already been adjusted, wait for 15 minutes or more for the unit to cool down first.

Adjustment method:

1. Set the camera so that it becomes center of the siemens star chart in the collimator (zoom wide and tele). (Set a distance of 0.5-1.0 cm between camera lens and collimator lens. Do not touch the each lens.)

2. Set the camera so that it becomes center of the screen in the collimator.

3. Double-click on the DscCalDi.exe.

4. Select “Infinity Cal.” on the LCD “Test”, and click the “Ye s ”.

5. Lens infinity adjustment value will appear on the screen.

6. Click the OK.

3. Lens Adjustment (1m) is carried out after this adjust-

ment.

Dsc Calibration

Infinity calibration : AF_TEMP_AD_I: 480 PZ_BR: 2 AF_BR: 5 AF_I_WIDE: 69 AF_I_MID1: 257 AF_I_MID2: 126 AF_I_MID3: 213 AF_I_MID4: 203 AF_I_MID5: 187 AF_I_MID6: 121 AF_I_TELE: 195 FLAG_PZ_ADJ: 1 PZ_ADJ_INDEX: 0 IRIS_GAIN: -112 IRIS_OFFSET: -6

Copy

Adjustment value determination is effectuated using below values. The adjustment values fulfill the conditions below, they are determined as within specifications.

Adjustment value determination

AF_TEMP_AD_I: ATADI

ATADI: adjustment value of focus temperature A/D (250<=ATADI<=893)

PZ_BR: PBR

PBR: adjustment value of zoom backrush pulse (0<=PBR<=10)

AF_BR: ABR

ABR: adjustment value of focus backrush pulse (0<=ABR<=10)

AF_I_WIDE: ZIW

ZIW: infinity adjustment value of focus at zoom position wide (–300<=ZIW<=300)

AF_I_MID1: ZIM1

ZIM1: infinity adjustment value of focus at zoom position middle1 (–300<=ZIM1<=300)

AF_I_MID2: ZIM2

ZIM2: infinity adjustment value of focus at zoom position middle2 (–300<=ZIM2<=300)

AF_I_MID3: ZIM3

ZIM3: infinity adjustment value of focus at zoom position middle3 (–300<=ZIM3<=300)

AF_I_MID4: ZIM4

ZIM4: infinity adjustment value of focus at zoom position middle4 (–300<=ZIM4<=300)

AF_I_MID5: ZIM5

ZIM5: infinity adjustment value of focus at zoom position middle5 (–300<=ZIM5<=300)

AF_I_MID6: ZIM6

ZIM6: infinity adjustment value of focus at zoom position middle6 (–300<=ZIM6<=300)

AF_I_TELE: ZIT

ZIT: infinity adjustment value of focus at zoom position tele (–250<=ZIT<=300)

FLAG_PZ_ADJ: FPZ

FPZ: flag of zoom barcode adjustment (FPZ=1)

PZ_ADJ_INDEX: PZI

PZI: index of zoom barcode adjustment (0<=PZI<=2)

IRIS_GAIN: g

g: adjustment value of gain (-128<=g<=127)

IRIS_OFFSET: o

o: adjustment value of offset (-128<=o<=127)

– 20 –

+ 44 hidden pages

Sanyo VPC-FH1BK, VPC-FH1EXBK, VPC-FH1GXBK, VPC-FH1, VPC-FH1EX Service Manual

SERVICE MANUAL

Contents

OUTLINE OF CIRCUIT DESCRIPTION

2. DISASSEMBLY

3. ELECTRICAL ADJUSTMENT