CAUTION : Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the
manufacturer.
Discard used batteries according to the manufacturer’s instructions.
NOTE : 1. Parts order must contain model number, part number, and description.
2. Substitute parts may be supplied as the service parts.
3. N. S. P. : Not available as service parts.
Design and specification are subject to change without notice.
SG317/U, EX, GX, U2, EX2, GX2 (R)
REFERENCE No. SM5310779
Page 2
PRODUCT SAFETY NOTICE
The components designated by a symbol ( ! ) in this schematic diagram designates components whose value are of
special significance to product safety. Should any component designated by a symbol need to be replaced, use only the part
designated in the Parts List. Do not deviate from the resistance, wattage, and voltage ratings shown.
WARNING
Do not use solder containing lead.
This product has been manufactured using lead-free solder in
order to help preserve the environment.
Because of this, be sure to use lead-free solder when carrying
out repair work, and never use solder containing lead.
Lead-free solder has a melting point that is 30 - 40°C (86 104°F) higher than solder containing lead, and moreover it does
not contain lead which attaches easily to other metals. As a
result, it does not melt as easily as solder containing lead, and
soldering will be more difficult even if the temperature of the
soldering iron is increased.
The extra difficulty in soldering means that soldering time will
increase and damage to the components or the circuit board
may easily occur.
Because of this, you should use a soldering iron and solder
that satisfy the following conditions when carrying out repair
work.
Note:
If replacing existing solder containing lead with lead-free solder in the soldered parts of products that have been manufactured up until now, remove all of the existing solder at those
parts before applying the lead-free solder.
Soldering iron
Use a soldering iron which is 70 W or equivalent, and which
lets you adjust the tip temperature up to 450°C (842°F). It
should also have as good temperature recovery characteristics as possible.
Set the temperature to 350°C (662°F) or less for chip components, to 380°C (716°F) for lead wires and similar, and to 420°C
(788°F) when installing and removing shield plates.
The tip of the soldering iron should have a C-cut shape or a
driver shape so that it can contact the circuit board as flat or in
a line as much as possible.
Solder
Use solder with the metal content and composition ratio by
weight given in the table below. Do not use solders which do
not meet these conditions.
Metal content
Composition
ratio by weight
Lead-free solder is available for purchase as a service tool.
Use the following part number when ordering:
Part name: Lead-free solder with resin (0.5 mm dia., 500 g)
Part number: VJ8-0270
Tin (Sn)Silver (Ag)
96.5 %
3.0 %
Copper (Cu)
0.5 %
– 2 –
Page 3
OUTLINE OF CIRCUIT DESCRIPTION
1-1. CMOS CIRCUIT DESCRIPTION
1. IC Configuration
The CMOS peripheral circuit block basically consists of the
following ICs.
IC911 (IMX039LQR) CMOS imager
H driver, V driver, serial communication circuit built-in
CDS/PGA built-in Gain + 18 dB (step pitch 0.1 dB)
10 bit/12 bit A/D converter built-in
2. IC911 (CMOS)
[Structure]
The electric charges which are generated when each pixel is
optically converted are in turn converted into signal voltages
by the FD amplifier, and they are then transmitted by the builtin H driver and V driver. The signals are sampled and amplified by the CDS and PGA circuits at the point they are output,
and then they are AD converted and output. The output uses
the LVDS interface.
CMOS image sensor
Image size: diagonal 7.63 mm (1/2.3 type)
Pixels in total:
3632 (H) x 2832 (V) approx. 10.29 million pixels
Effective pixels:
-when using 1/2.3 type approx 9.29 million pixels:
3528 (H) x 2632 (V) approx. 9.29 million pixels
-when using 1/2.5 type approx 8.30 million pixels:
3336 (H) x 2488 (V) approx. 8.30 million pixels
-when using 1/2.9 type approx 5.56 million pixels:
3144 (H) x 1768 (V) approx. 5.56 million pixels
-when using 1/4.1 type approx 2.89 million pixels:
2160 (H) x 1336 (V) approx. 2.89 million pixels
Unit cell size: 1.75 µm (H) x 1.75 µm (V)
Optical black:
The optical black section extracts averaged values from the
subsequent data to make the black level of the sensor output
data uniform for each line. The optical black section averaged
value for each line is taken as the sum of the value for the
previous line multiplied by the coefficient k and the value for
the current line multiplied by the coefficient k-1.
1-2. Signal processor
1. γ correction circuit
This circuit performs (gamma) correction in order to maintain
a linear relationship between the light input to the camera and
the light output from the picture screen.
2. Color generation circuit
This circuit converts the image sensor into RGB signals.
3. Matrix circuit
This circuit generates the Y signals, R-Y signals and B-Y signals from the RGB signals.
4. Horizontal and vertical aperture circuit
This circuit is used gemerate the aperture signal.
1-3. AE/AWB and AF computing circuit
The AE/AWB carries out computation based on a 64-segment
screen, and the AF carries out computations based on a 6segment screen.
1-4. SDRAM controller
This circuit outputs address, RAS, CAS and CLOCK data for
controlling the SDRAM. It also refreshes the SDRAM.
1-5. Communication control
1. SIO
This is the interface for the 8-bit microprocessor.
2. PIO/PWM/SIO for LCD
8-bit parallel input and output makes it possible to switch between individual input/output and PWM input/output.
2. Outline of Operation
When the shutter opens, the reset signals (ASIC and CPU)
and the serial signals (“take a picture” commands) from the 8bit microprocessor are input and operation starts. When the
TG/SG drives the image sensor, picture data is converted internally into a small-amplitude actuating signal, and is then
input to ASIC. The data that is input to the ASIC is input to the
SDRAM through digital clamp.
The AF, AE, AWB, shutter, and AGC value are computed from
this data, and obtain the optimum picture. The data which has
already been stored in the SDRAM is read by the CPU and
color generation is carried out. Each pixel is interpolated from
the surrounding data as being either R, G, and B primary color
data to produce R, G and B data. At this time, correction of the
lens distortion which is a characteristic of wide-angle lenses is
carried out. After AWB and γ processing are carried out, a matrix
is generated and aperture correction is carried out for the Y
signal, and the data is then compressed by JPEG and is then
written to card memory (SD card).
When played back on the LCD and monitor, data is transferred
from memery to the SDRAM, and the image is then elongated
so that it is displayed over the SDRAM display area.
3. LCD Block
The LCD display circuit is located on the CP1 board, and
consists of components such as a power circuit.
The signals from the ASIC are 8-bit digital signals, that is
input to the LCD directly. The 8-bit digital signals are converted to RGB signals inside the LCD driver circuit . This LCD
has a 3-wire serial, and functions such as the brightness and
image quality are controlled.
Because the LCD closes more as the difference in potential
between the VCOM (common polar voltage: AC) and the R,
G and B signals becomes greater, the display becomes darker;
if the difference in potential is smaller, the element opens and
the LCD become brighter.
In addition, the timing pulses for signals other than the video
signals are also input from the ASIC directory to the LCD.
1-6. TG/SG
Timing generated for image sensor control.
1-7. Digital encorder
It generates chroma signal from color difference signal.
– 4 –
Page 5
4. Lens drive block
4-1. Focus drive
The 16-bit serial data signals (LENS_SDI) and (LENS_SCLK
and LENS_EN) which are output from the ASIC (IC101) are
used to drive (FOCUS A +, FOCUS A -, FOCUS B + and FOCUS B -) by the motor driver IC (IC951), and are then used to
microstep-drive the stepping motor for focusing operation. Detection of the standard focusing positions is carried out by
means of the photointerruptor (F_SENSE) inside the lens block.
4-2. Zoom drive
The 16-bit serial data signals (LENS_SDI) and (LENS_SCLK
and LENS_EN) which are output from the ASIC (IC101) are
used to drive (ZOOM A +, ZOOM A -, ZOOM B + and ZOOM B
-) by the motor driver IC (IC951), and are then used to
microstep-drive the stepping motor for zooming operation. Detection of the standard zooming positions is carried out by
means of the photointerruptor (F_SENSE) inside the lens block.
4-3. ND filter
The 16-bit serial data signals (LENS_SDI) and (LENS_SCLK
and LENS_EN) which are output from the ASIC (IC101) are
used to drive (ND + and ND –) by the motor driver IC (IC951),
and then the ND filter is inserted into and removed from the
beam path.
4-3. Iris drive
The drive method is a galvanometer type without braking coil.
The output from the Hall sensor inside the lens is amplified by
the Hall amplifier circuit inside the IC951 lens drive IC, and the
difference between the current and target aperture determined
by the resulting output and the exposure amout (16 bit serial
signal (LENS_SDI) and (LENS_SCLK and LENS_EN)) output
from the ASIC (IC101) is input to the servo amplifier circuit
(IC951) to keep the aperture automatically controlled (DRIVE+
and DRIVE -) to the target aperture.
5. Video Clip Recording and Playback
5-1. Recording
The signal from the camera block is input to IC101 (ASIC). The
data that is input to the ASIC is input to SDRAM, and converts
this data to encoded MPEG4 data, after which it is written in
sequence onto the SD card as streaming data. At this time,
the audio signals that are input to the built-in microphone are
converted into digital data by the audio CODEC IC of IC182,
and they are then input to ASIC. The audio data is then encoded (AAC), and then it is written in sequence onto the SD
card together as streaming data with the image signals described above.
5-2. Playback
The data is read from the SD card, and the encoded data is
decoded into image data where it is displayed by the LCD or
on a TV monitor. At the same time, the audio data is also decoded, and is input to IC182 as digital data. D/A conversion is
carried out at IC182, and the sound is then output to the speaker
or to the LINE OUT terminal or the headphone.
6. Audio CODEC Circuit (IC182)
The audio signals from the microphone are converted into 16bit digital data. AD conversion is carried out at a maximum
sampling frequency of 48 kHz.
During audio playback, the 16-bit digital data is converted into
analog signals and these drive headphone through the speaker
or line out system and headphone amplifier. DA conversion is
carried out at a maximum sampling frequency of 48 kHz.
4-4. Shutter drive
Reverse voltage is applied to the above aperture drive coil to
operate the shutter. When the shutter operates, the SHUTTER
+ signal that is output from the ASIC (IC101) becomes high
(input to SHUTTER of IC951) and the shutter operates.
– 5 –
Page 6
1-3. PWA POWER CIRCUIT DESCRIPTION
1. Outline
This is the main power circuit, and is comprised of the following blocks.
Switching controller (IC501)
Digital 3.25 V power output (L5002)
Digital 1.8 V power output (L5003)
Digital 1.2 V power output (IC502, L5004)
LCD backlight system power output (Q5007, L5007)
Motor system 5.0 V power output (L5301)
CMOS digital 1.8 V power output (IC503, L5006)
Charge circuit (IC521)
2. Switching Controller (IC501)
This is the basic circuit which is necessary for controlling the
power supply for a PWM-type switching regulator, and is provided with seven built-in channels, only CH1 (motor system),
CH2 (digital 3.25 V), CH3 (digital 1.8 V) and CH7 (LCD backlight) are used.
Feedback from BOOST 5 V (CH1), VDD3 (CH2), VDD1.8
(CH3) and LCD backlight system (CH7) are received, and
the PWM duty is varied so that each one is maintained at the
correct voltage setting level.
Feedback for the backlight power (CH7) is provided to the
both ends voltage of registance so that regular current can
be controlled to be current that was setting.
2-1. Short-circuit protection circuit
If output is short-circuited for the length of time determined
by the condenser which is connected to Pin (A6) of IC501, all
output is turned off. To reset, momentarily set the control signal (P ON) to repeat control.
3. Digital 3.25 V Power Output
VDD3 is output. Feedback for the VDD3 is provided to the
swiching controller (Pin (F3) of IC501) so that PWM control
can be carried out.
4. Digital 1.8 V Power Output
VDD 1.8 is output. Feedback for the VDD 1.8 is provided to
the switching controller (Pin (C3) of IC501) so that PWM control to be carried out.
5. Digital 1.2 V Power Output
VDD 1.2 is output. Feedback for the VDD 1.2 is provided to
the switching controller (Pin (11) of IC502) so that PWM control to be carried out.
6. LCD Backlight Power Supply output
Regular current (15 mA) is being transmitted to LED for LCD
backlight. Feedback for the both ends voltage of registance
that is being positioned to in series LED are provided to the
switching controller (Pin (C4) of IC501) so that PWM control
to be carried out.
7. Motor System 5.0 V Power Output
BOOST 5 V is output. Feedback for the BOOST 5 V is provided to the (Pin (B7) of IC501) so that PWM control to be
carried out.
8. CMOS Digital 1.8 V Power Output
+1.8 V (D) is output.
9. Camera Charging Circuit
If the camera’s power is turned off, power save mode and
sleep mode setting while it is connected to the AC adaptor,
the battery will be recharged. In the above condition, a CTL
signal is sent from the microprocessor and recharging starts.
– 6 –
Page 7
1-4. ST1 STROBE CIRCUIT DESCRIPTION
1. Charging Circuit
When UNREG power is supplied to the charge circuit and the
CHG signal from microprocessor becomes High (3.3 V), the
charging circuit starts operating and the main electorolytic
capacitor is charged with high-voltage direct current.
However, when the CHG signal is Low (0 V), the charging
circuit does not operate.
1-1. Charge switch
When the CHG signal switches to Hi, IC541 starts charging
operation.
1-2. Power supply filter
C5401 constitutes the power supply filter. They smooth out
ripples in the current which accompany the switching of the
oscillation transformer.
1-3. Oscillation circuit
This circuit generates an AC voltage (pulse) in order to increase the UNREG power supply voltage when drops in current occur. This circuit generates a drive pulse with a frequency
of approximately 200-300 kHz, and drive the oscillation transformer.
2. Light Emission Circuit
When FLCTL signal is input from the ASIC, the stroboscope
emits light.
2-1. Emission control circuit
When the FLCLT signal is input to the emission control circuit, Q5402 switches on and preparation is made to the light
emitting. Moreover, when a FLCLT signal becomes Lo, the
stroboscope stops emitting light.
2-2. Trigger circuit
The Q5402 is turned ON by the FLCLT signal and light emission preparation is preformed. Simultaneously, high voltage
pulses of several kV are emitted from the trigger coil and applied to the light emitter.
2-3. Light emitting element
When the high-voltage pulse form the trigger circuit is applied to the light emitting part, currnet flows to the light emitting element and light is emitted.
Beware of electric shocks.
1-4. Oscillation transformer
The low-voltage alternating current which is generated by the
oscillation control circuit is converted to a high-voltage alternating current by the oscillation transformer.
1-5. Rectifier circuit
The high-voltage alternating current which is generated at
the secondary side of T5401 is rectified to produce a highvoltage direct current and is accumulated at electrolytic capacitor C5412.
1-6. Charge monitoring circuit
The functions programmed in the IC541 monitor oscillations
and estimate the charging voltage. If the voltage exceeds the
rated value, charging automatically stops. Then, the
ZCHG_DONE signal is changed to Lo output and a "charging
stopped" signal is sent to the microcomputer.
– 7 –
Page 8
1-5. SYA CIRCUIT DESCRIPTION
1. Configuration and Functions
For the overall configuration of the SYA block, refer to the block diagram. The SYA block centers around a 8-bit microprocessor
(IC301), and controls camera system condition (mode).
The 8-bit microprocessor handles the following functions.
1. Operation key input, 2. Clock control and backup, 3. Power ON/OFF, 4. Storobe charge control
Pin
1
2
3
4
5
6
7
8
9
10
11~14
15
16
17
18
19
20
21SCAN_IN0
22PANEL_OPEN
23KEY 2nd
24
25NOT USED
26
27
28
29
30NOT USED
31P ON
32NOT USED
33
34
35
36
37
38
39
40
41HINGE
42~44
45
46
47
Signal
ASIC_SCK
ZCARD
ZBACKUPCTL
CHG_CNT
HOT LINE
GREEN_LED
RED_LED
ST_CHG_ON
VDD2
VSS2
SCAN IN4~1
ZUSB_DET
HDMI_HPD
ZCHG_DONE
TIMEOUT
BAT_UTX
BAT_URX
USB_ON
TGVD
MRST
SW3.2ON
NOT USED
ZBOOT_COMREQ
ERR
VSS3
VDD3
RDSEL
CLK (SFW)
DATA0 (SFW)
DC_IN
SCAN OUT2~0
ZOOM_AD
NOT USED
ZAV_JACK
I/O
O
I
O
O
I
O
O
O
-
-
I
I
I
I
I
O
I
I
I
I
O
O
I
O
O
O
O-
ODigital system power start-up signal
O-
I/O
I
-
-
I
I
I
I
I
O
I
O
I
Serial communication clock output
Card detection
Backup battery charge control
Camera charge permission
Hot line request from ASIC
Switch unit LED (green)
Switch unit LED (red)
Strobo charge control
Power
Power
Keyscan input 4~1
USB power detection terminal
HDMI hot plug detection
Main condensor charge detection
Camera charge done detection
Battery power detection IC UART output
Battery power detection IC UART input
Keyscan input 0
Panel open detection
S2 key input
USB charge control
-
VSYNC monitoring
System reset
SW 3.2 V power control
-
BOOT signal input
Camera charge error detection
Power
Power
Debugger signal
Debugger signal
Debugger signal
DC jack insertion detection
Panel rotation detection
Keyscan output 2~0
Zoom key AD input
-
AV cable detection
Outline
See next page →
– 8 –
Page 9
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
BAT_TMP
BAT_OFF
ZSREQ
KEY_1st
IR_IN
ZRESET
XCIN
XCOUT
VSS1
XINI
XOUTO-
VDD1
BATTERY
USB_HOSTIUSB host cable detection
INT_TEMPI
ASIC_SDIO
ASIC_SDO
I
I
I
I
I
I
I
O
-
-
IUNREG voltage detection
I
Table 5-1. 8-bit Microprocessor Port Specification
Battery temperature detection
Battery OFF detection signal input
Serial communication request signal
S1 key input
Remote controller input
Microprocessor reset input
32 k oscillation input
32 k oscillation output
Power
Power
Power
Camera temperature detection
Serial communication data output
Serial communication data input
2. Internal Communication Bus
The SYA block carries out overall control of camera operation by detecting the input from the keyboard and the condition of the
camera circuits. The 8-bit microprocessor reads the signals from each sensor element as input data and outputs this data to the
camera circuits (ASIC) or to the LCD display device as operation mode setting data. Fig. 5-1 shows the internal communication
between the 8-bit microprocessor, ASIC and SPARC lite circuits.
SREQ
8-bit
Microprocessor
Fig. 5-1 Internal Bus Communication System
ASIC_SDO
ASIC_SDI
ASIC_SCK
MRST
3. Key Operaiton
For details of the key operation, refer to the instruction manual.
SCAN
SCAN
OUT
IN
0
1
2
0
UP
-
PW_TEST
123
DOWN
VREC
-
Table 5-2. Key Operation
LEFT
PLAY
TEST-
RIGHT
MENU
ASIC
4
SET
POWER
-
– 9 –
Page 10
4. Power Supply Control
The 8-bit microprocessor controls the power supply for the overall system.
The following is a description of how the power supply is turned on and off. When the battery is attached, a regulated 3.2 V
voltage is normally input to the 8-bit microprocessor (IC301) by IC302, so that clock counting and key scanning is carried out
even when the power switch is turned off, so that the camera can start up again. When the battery is removed, the 8-bit microprocessor operates in sleep mode using the backup lithum battery. At this time, the 8-bit microprocessor only carries out clock
counting, and waits in standby for the battery to be attached again. When a switch is operated, the 8-bit microprocessor supplies
power to the system as required.
The PON signal from the 8-bit microprocessor at pin (32) set to high, and then turns on the DC/DC converter. At this time, low
signal is output from pin (18) so that the ASIC is set to the reset condition. After, this pin set to high, and set to active condition.
When the power switch is turned off, the ASIC returns to the reset condition, all DC/DC converters are turned off and the power
supply to the whole system is halted.
ASIC,
memory
Power voltage
Power OFF
Power switch ON-
Auto power OFF
CAMERA
LCD monitor
Playback
Note) 4 MHz = Main clock operation, 32 kHz = Sub clock operation
3.3 V 1.8 V 1.2 V
OFF
OFF
ON
ON
Table 5-3. Camera Mode
CMOS
2.7 V (A) 1.8 V (D)
1.8 V (I/O)
OFF
OFF
ON
OFF
8 bit
CPU
3.2 V
(ALWAYS)
32KHzOFF
32KHzOFF
4 MHzON
4 MHzON
MONITOR
LCD
3.3 V
– 10 –
Page 11
MEMO
– 11 –
Page 12
2. DISASSEMBLY
2-1. REMOVAL OF CABINET BOTTOM, CABINET TOP, CABINET BACK, TB4 BOARD AND CABINET FRONT
When assembling,
assemble order.
A → B
When assembling,
assemble order.
A → B
A
7
I
21
28
33
22
34
B
39
A
38
D
41
37
36
When assembling,
tighten the screws order.
a → b → c
31
30
F
b
A
27
B
40
23
32
35
F
26
24
3
J
c
a
29
19
24
56
D
25
J
A
20
57
E
43
42
45
15
46
13
18
14
44
B
17
6
I
47
3
H
B
G
48
16
49
H
a
G
B
54
b
53
c
55
A
9
C
5
4
54
52
51
C
When assembling,
tighten the screws order.
a → b → c
E
50
10
8
1
2
12
When assembling,
assemble order.
A → B
11
9
NOTE: Discharge a strobe capacitor with the
discharge jig (VJ8-0188) for electric shock prevention.
– 12 –
Page 13
1. Cover battery
2. Spacer bottom
3. Spacer LCD
4. Spacer LCD front
5. Two screws 1.7 x 2
6. Screw 1.7 x 7
7. Three screws 1.7 x 3
8. Screw 1.7 x 3
50. Dec joint
51. Dec line joint
52. Two screws 1.7 x 4
53. Screw 1.7 x 3
54. Two screws 1.7 x 3
55. Compl, cabinet front
56. Screw 1.7 x 3
57. Screw 1.7 x 3
9. Three screws 1.7 x 4
10. Remove the cabi bottom from the main body.
11. Screw 1.7 x 3
12. Holder strap front
13. Spacer blind
14. Screw 1.7 x 3
15. Holder strap back
16. Two screws 1.7 x 4
17. Stand
18. Remove the solder.
19. Screw 1.7 x 3
20. Screw 1.7 x 3
21. Cabinet top
22. Screw 1.7 x 3
23. Two screws 1.7 x 3
43. Spacer mic
24. Two screws 1.7 x 3
25. Flexible pwb CP1 & TB4
26. Cover SD
27. Remove the cabinet back from the main body.
28. Cover DC
29. Three screws 1.7 x 4
30. Holder back
31. Two screws 1.7 x 4
32. TB4 board
33. FPC
34. Unit, zoom
35. Flexible pwb CP1 & TB4
36. Button select
37. Holder button bas
48. Sheild tape LCD CP1
38. Button menu
39. Button rec play
40. Button movie
41. Button shutter
42. Sheild tape mic
43. Spacer mic
44. Remove the solder.
45. Two screws 1.7 x 4
46. Holder bottom
47. Spacer shield wire
48. Sheild tape LCD CP1
49. Connector
47. Spacer shield wire
42. Sheild tape mic
Cross-section drawing
Do not run.
55. Compl, cabinet front
Note:
Do not tuck the
lead wires.
– 13 –
Page 14
2-2. REMOVAL OF TB1 BOARD, TB5 BOARD, LENS, ST1 BOARD, CP1 BOARD AND TB3 BOARD
When assembling,
tighten the screws order.
a → b → c
When assembling,
tighten the screws order.
A → B
3
2
51
5
7
c
a
b
6
E
10
8
9
19
21
22
A
17
20
C
B
23
H
12
1
4
A
D
15
25
24, 26
F
B
25
16
49
A
38
52
14
46
a
B
18
B
11
45
47
14
a
47
40
13
E
42
C
b
43
39
50
48
When assembling,
tighten the screws order.
37
G
D
a → b
27
H
44
41
G
39
b
F
29
30
36
28
31
34
33
32
I
I
35
– 14 –
Page 15
1. Shield tape VF1
2. Screw 1.7 x 3
3. Heat sink left
4. Heat sink tape top
5. Three screws 1.7 x 3
6. TB1 board
7. Flexible pwb TB1 & TB5
8. Three screws 1.7 x 2.5
9. TB5 board
10. Flexible pwb TB1 & TB5
11. Two screws 1.7 x 4
12. Screw 1.7 x 3
13. Two screws 1.7 x 3
14. Two screws 1.7 x 4
15. FPC
16. Holder lens chassis
17. Holder lens
18. Two screws 1.7 x 3
19. Holder TB1
20. Spacer CA
21. Screw 1.7 x 2.5
22. Holder CA
23. Connector
24. Remove the lens part.
25. Holder lens
26. Lens
27. Two screws 1.7 x 7
28. Screw 1.7 x 3
29. Connector
30. ST1 board
31. Spacer ST1
32. Remove the solder.
33. Assy, lamp
34. Cover triger
35. Remove the solder.
36. Spacer con ST1
37. Spacer lens right
38. Flexible pwb CP1 & TB3
39. Four screws 1.7 x 3
40. CP1 board
41. Flexible pwb CP1 & TB3
42. Heat sink rub ASIC
43. Sheild tape DDR
44. Spacer DDR
45. Screw 1.4 x 2
46. Earth jack
47. Two screws 1.7 x 3
48. Chassis bottom
49. Spacer holder TB1
50. Three screws 1.7 x 2.5
51. TB3 board
52. Chassis right
33. Assy lamp soldering order
16. Holder lens chassis
44. Spacer DDR
33. Assy lamp dressing method
38, 41. Flexible pwb CP1 & TB3
37. Spacer lens right
43. Sheild tape DDR
– 15 –
Page 16
2-3. REMOVAL OF TB2 BOARD, VF1 BOARD AND LCD
1. Screw 1.7 x 2
2. Screw 1.7 x 3
3. Holder wire
4. Spacer holder joint
5. Two screws 1.7 x 3
6. Holder joint
7. Cabinet right
8. Button power
9. Cover joint
10. Two screws 1.7 x 3
11. Cover LCD back
12. Dec line A
13. Sheild tape VF1
14. Connector
13. Sheild tape VF1
15. Spacer LCD FPC
16. Remove the solder.
17. Assy, joint
When assembling,
assemble order.
A → B
18. Screw 1.7 x 2
19. TB2 board
20. FPC
26
20
1
17
B
A
9
14
12
21. Two screws 1.7 x 3
22. VF1 board
23. Spacer pwb
24. Holder LCD
25. LCD
26. Cover LCD front
When assembling,
assemble order.
A → B
25
24
21
23
B
A
21
22
16
A
11
13
18
15
15. Spacer LCD FPC
4
3
2
4. Spacer holder joint
A
19
10
8
7
6
5
3. Holder wire
– 16 –
Page 17
2-4. BOARD LOCATION
TB4 board
CP1 board
TB1 board
TB5 board
TB3 board
VF1 board
TB2 board
ST1 board
– 17 –
Page 18
3. ELECTRICAL ADJUSTMENT
Firmware
QrCode
AWB
Focus
UV Matrix
R Bright
RGB Offset
Tint
B Bright
Gain
Phase
LCD
Calibration
Upload
PAF Cal.
LCD Type
H AFCTest
VCOMDC
VCOMPP
Cal Data
Cal Mode
OK
OK
EVF
USB storage
Get
Set
VID
Set
PID
Set
Serial
Set
Rev.
Set
Setting
Language
Video Mode
VCO
Factory Code
Hall Cal.
Backrush pulse :
Set
Get
3-1. Table for Servicing Tools
Ref. No.
J-1
J-2
J-3
J-4
J-5
J-6
J-7
J-8
J-9
Name
Pattern box
Calibration software
Chroma meter
Spare lump (pattern box)
Discharge jig
Collimator
Spare lump (collimator)
Siemens star chart
ND2 filter
Number
1
1
1
1
1
1
1
1
1
Part code
VJ8-0190
VJ8-0192
VJ8-0191
VJ8-0188
VJ8-0260
VJ8-0282
3-3. Adjustment Items and Order
1. Lens Adjustment (Barcode Input)
2. Lens Adjustment (Infinity)
3. Lens Adjustment (1m)
4. Mecha Shutter Adjustment
5. WB Adjustment
6. CMOS White Point Defect Detect Adjustment
7. CMOS Black Point And White Point Defect Detect Adjust-
ment In Lighted
Note: If the lens, board and changing the part, it is necessary
to adjust again. Item 1-7 adjustments should be carried out in
sequence.
*Adjustment environment
Temperature: 25 ± 10 degrees, Humidity: 55 ± 25 %
Download the calibration software and the firmware
from the following URL.
http://www.digital-sanyo.com/overseas/service/
Place the DscCalDi.exe file, camapi32.dll file and
QrCodeInfo.dll file together into a folder of your
choice.
J-1J-3
J-4
J-5
3-4. Setup
1. System requirements
Windows 2000 or XP or Vista
IBM R -compatible PC with pentium processor
USB port
40 MB RAM
Hard disk drive with at least 15 MB available
VGA or SVGA monitor with at least 256-color display
2. Pattern box
Turn on the switch and wait for 30 minutes for aging to take
place before using Color Pure. It is used after adjusting the
chroma meter (VJ8-0192) adjust color temperature to 3100 ±
20 K and luminosity to 900 ± 20 cd/m
the lump and its circumference are high temperature during
use and after power off for a while.
3. Computer screen during adjustment
2
. Be careful of handling
J-8
3-2. Equipment
1. AC adaptor
2. PC (IBM R -compatible PC, Windows 2000 or XP or Vista)
3-5. Connecting the camera to the computer
1. Use the supplied dedicated USB interface cable to connect
the camera to the computer.
2. Turn on the camera.
3. Choose the “COMPUTER”, and press the SET button.
Next, choose the “CARD READER”, and press the SET
button.
– 18 –
Page 19
3-6. The adjustment item which in necessary in part exchange
Lens
Adjust-
ment
(Barcode
Input)
Lens
Adjust-
ment
(Infinity)
Lens
Adjust-
ment
(1 m)
Mecha
Shutter
Adjust-
ment
WB
Adjust-
ment
CMOS
White Point
Defect
Detect
Adjustment
CMOS Black
Point And
White Point
Defect Detect
Adjustment
In Lighted
Factory
Cord
Setting
Language
Setting
COMPL PWB CP1
COMPL PWB VF1
COMPL PWB ST1
COMPL PWB TB1
COMPL PWB TB2
COMPL PWB TB3
COMPL PWB TB4
COMPL PWB TB5
ASSY, FLEXIBLE
PWB CA1
: Be sure to carry out the necessary adjustments after replacing the unit.
: Adjustment is possible from the menu setting screen of the camera and by using the calibration software.
USB
storage
information
registration
Reset
Setting
3-7. Updating the firmware
Check the firmware version immediately after the CP1 board has been replaced. If an old version is being used, interference and errors in operation may also occur. If an old version is being used, update it with a newer version.
Refer to
3-8. Adjust Specifications
1. Lens Adjustment (Barcode Input)
Adjustment method:
1. Double-click on the DscCalDi.exe.
2. Click the “QrCode”.
3. QrCode Input Dialog display will be displayed.
4. Deselect Bar code Input.
3-13. Firmware uploading procedure. (Page 24)
5. Enter the alphanumeric characters which are underneath
the bar code which is included with the lens.
6. Click the Execute.
7. Click the OK.
Note: The five input boxes (numbered (1) (2) (3) (4) (5) in
order starting from the left) have the following limits on input.
(1) can only contain numerical input from 0 to 2.
(2) can only contain numerical input from 0 to 2.
(3) can only contain numerical input from 1 to 2.
– 19 –
Page 20
2. Lens Adjustment (Infinity)
Camera
Collimator
Preparation:
POWER switch: ON
If using a ready-made collimator, set to infinity.
Note:
Do not vibrate during the adjustment.
If readjusting after it has already been adjusted, wait for 15
minutes or more for the unit to cool down first.
Adjustment method:
1. Set the camera so that it becomes center of the siemens
star chart in the collimator (zoom wide and tele).
(Set a distance of 0.5-1.0 cm between camera lens and
collimator lens. Do not touch the each lens.)
2. Set the camera so that it becomes center of the screen in
the collimator.
3. Double-click on the DscCalDi.exe.
4. Select “Infinity Cal.” on the LCD “Test”, and click the “Ye s ”.
5. Lens infinity adjustment value will appear on the screen.
6. Click the OK.
3. Lens Adjustment (1m) is carried out after this adjust-
Adjustment value determination is effectuated using below values.
The adjustment values fulfill the conditions below, they are determined as within specifications.
Adjustment value determination
AF_TEMP_AD_I: ATADI
ATADI: adjustment value of focus temperature A/D
(250<=ATADI<=893)
PZ_BR: PBR
PBR: adjustment value of zoom backrush pulse
(0<=PBR<=10)
AF_BR: ABR
ABR: adjustment value of focus backrush pulse
(0<=ABR<=10)
AF_I_WIDE: ZIW
ZIW: infinity adjustment value of focus at zoom position
wide (–300<=ZIW<=300)
AF_I_MID1: ZIM1
ZIM1: infinity adjustment value of focus at zoom position
middle1 (–300<=ZIM1<=300)
AF_I_MID2: ZIM2
ZIM2: infinity adjustment value of focus at zoom position
middle2 (–300<=ZIM2<=300)
AF_I_MID3: ZIM3
ZIM3: infinity adjustment value of focus at zoom position
middle3 (–300<=ZIM3<=300)
AF_I_MID4: ZIM4
ZIM4: infinity adjustment value of focus at zoom position
middle4 (–300<=ZIM4<=300)
AF_I_MID5: ZIM5
ZIM5: infinity adjustment value of focus at zoom position
middle5 (–300<=ZIM5<=300)
AF_I_MID6: ZIM6
ZIM6: infinity adjustment value of focus at zoom position
middle6 (–300<=ZIM6<=300)
AF_I_TELE: ZIT
ZIT: infinity adjustment value of focus at zoom position
tele (–250<=ZIT<=300)
FLAG_PZ_ADJ: FPZ
FPZ: flag of zoom barcode adjustment
(FPZ=1)
PZ_ADJ_INDEX: PZI
PZI: index of zoom barcode adjustment
(0<=PZI<=2)
IRIS_GAIN: g
g: adjustment value of gain (-128<=g<=127)
IRIS_OFFSET: o
o: adjustment value of offset (-128<=o<=127)
– 20 –
Page 21
3. Lens Adjustment (1m)
Camera
Preparation:
POWER switch: ON
Adjustment condition:
Siemens star chart (A3)
Fluorescent light illumination with no flicker
Illumination above the subject should be 700 lux ± 10%.
Note:
Do not vibrate during the adjustment.
If readjusting after it has already been adjusted, wait for 15
minutes or more for the unit to cool down first.
Adjustment method:
1. Set the siemens star chart 100 ± 0.5 cm from lens surface
so that it becomes center of the screen (zoom wide and
tele). Set the camera and the chart in a straight, and do not
put optical systems (mirror and conversion lens etc.)
2. Double-click on the DscCalDi.exe.
3. Click the “Focus”, and Click the “Yes ”.
4. Lens adjustment value will appear on the screen.
5. Click the OK.
100 0.5 cm
Siemens
star chart
Adjustment value determination
AF_TEMP_AD: ATAD
ATAD: adjustment value of focus temperature A/D
(250<=ATAD<=893)
AF_WIDE: ZW
ZW: adjustment value of focus at zoom position wide
(–300<=ZW<=300)
AF_MID1: ZM1
ZM1: adjustment value of focus at zoom position middle1
(–300<=ZM1<=300)
AF_MID2: ZM2
ZM2: adjustment value of focus at zoom position middle2
(–300<=ZM2<=300)
AF_MID3: ZM3
ZM3: adjustment value of focus at zoom position middle3
(–300<=ZM3<=300)
AF_MID4: ZM4
ZM4: adjustment value of focus at zoom position middle4
(–300<=ZM4<=300)
AF_MID5: ZM5
ZM5: adjustment value of focus at zoom position middle5
(–300<=ZM5<=300)
AF_MID6: ZM6
ZM6: adjustment value of focus at zoom position middle6
(–300<=ZM6<=300)
AF_TELE: ZT
ZT: adjustment value of focus at zoom position tele
(–250<=ZT<=300)
Adjustment value determination is effectuated using below values.
The adjustment values fulfill the conditions below, they are determined as within specifications.
1. Set a distance of 0.5-1.0 cm between the pattern box and
the camera. (Do not enter any light.)
2. Double-click on the DscCalDi.exe.
3. Input “22” in the Cal Mode, and click Ok at the right side.
4. Click the OK.
5. Input “25” in the Cal Mode, and click Ok at the right side.
6. Click the OK.
Dsc Calibration
OK
Copy
Cal Mode Results:
WB=342,522,623
CHECK=129,127,127
Dsc Calibration
x
Cal Mode Results:
WB_ND=0,0,0
FLAG_FS_ADJ=17
CHECK_ND=129,129,0
Adjustment value determination is effectuated using the
“CHECK" and “CHECK_ND” values. If
CHECK= wc0, wc1, wc2
CHECK_ND= wnc0, wnc1, wnc2
the adjustment values fulfill the conditions below, they are determined as within specifications.
Adjustment values other than the above are irrelevant.
6. CMOS White Point Defect Detect Adjustment
Preparation:
POWER switch: ON
Adjustment method:
1. Double-click on the DscCalDi.exe.
2. Select “CCD Defect” on the LCD “Test”, and click the “Ye s ”.
3. After the adjustment is completed, OK will display.
4. Click the OK.
7. CMOS Black Point And White Point Defect Detect
Adjustment In Lighted
3-9. Factory Code Setting
1. Check the "Factory Code" display within the Setting group.
2. For U.S.A., Canada and NTSC general area
If "FC_SANYO_U" does not appear, click on the " " mark
located on the right of the "Factory Code" display BOX and
select "FC_SANYO_U".
3. For Europe and PAL general area
If "FC_SANYO_EX" does not appear, click on the " " mark
located on the right of the "Factory Code" display BOX and
select "FC_SANYO_EX".
3-10. Language Setting
1. Click on the " " mark located on the right of the
"Language" display BOX.
2. Select language. (Default is English.)
3. End "DscCal" and remove the camera before turning the
camera power OFF.
1. Set a distance of 0.5-1.0 cm between the pattern box and
the camera.
2. Double-click on the DscCalDi.exe.
3. Select “CCD Black” on the LCD “Test”, and click the “Ye s ”.
4. After the adjustment is completed, the number of defect
will appear.
5. Click the OK.
Calibration
AWB
Focus
UV Matrix
Cal Mode
Cal Data
USB storage
VID
Get
PID
Set
Backrush pulse :
OK
OK
Upload
Firmware
QrCode
PAF Cal.
EVF
LCD Type
Get
LCD
R Bright
RGB Offset
Tint
VCO
H AFCTest
Serial
Set
Set
Rev.
B Bright
Gain
Phase
Set
Set
Set
VCOMDC
VCOMPP
Hall Cal.
Setting
Language
Video Mode
Factory Code
3-11. Reset Setting
Carry out reset settings after replacing CP1 board.
1. Turn on the camera.
2. Set the NORMAL mode, and press the MENU button.
3. Choose the OPTION MENU 3.
4. Choose the RESET SETTINGS, and press the SET button.
5. Select RESET, and press the SET button.
3-12. The Compulsive boot starting method
1. Keep MENU button, SET button, and SHUTTER button depressed while switching on the power.
2. Connect the camera and the computer with USB cable.
– 23 –
Page 24
3-13. Firmware uploading procedure
1. Uploading the firmware should be carried out if the version
number (COMPL PWB XX-X) on the replacement circuit
board is lower than the version of the distributed firmware.
For XX-X, enter the name of the circuit board containing the
firmware.
2. The firmware is distributed by e-mail in self-extracting archive
format. Change the extension of the distributed file to .EXE
and save it in your preferred folder.
3. When you double-click the saved file, the firmware (binary
file) will be saved in the same folder.
4. The firmware must not be distributed without permission.
1. Overwriting firmware from the SD card
Preparation:
SD card: SD card with firmware rewritten into the root directory
Data: S317Nxxx.BIN (xxx: version)
Overwriting method:
1. Insert the above SD card.
2. Turn on the camera.
3. Set the NORMAL mode.
4. Press the MENU button.
5. Choose the OPTION MENU 3.
6. Choose the FORMAT.
7. Toggle the SET button to the left for 2 seconds. FIRMWARE
UPDATE will display.
8. Choose YES.
9. Press the SET button. Update is starting.
Note:
Do not turn off the camera’s power or remove the SD card
while the firmware is being updated.
The power will turn off after the update is complete.
2. Overwriting firmware from the calibration software
Preparation:
PC with overwriting firmware copied to the preferred folder in
the HD.
Data: S317Nxxx.BIN (xxx: version)
Overwriting method:
1. Connect the camera’s USB/AV terminal to the computer’
USB connector.
2. The USB Connection screen appears on the camera’s LCD
monitor. Choose the “COMPUTER”, and press the SET
button. Next, choose the “CARD READER”, and press the
SET button.
3. Double-click on the DscCalDi.exe.
4. Click the Firmware.
5. Choose the fimware file to use for overwriting, and click
the Yes.
6. Update is starting. The message will appear, and choose
OK.
7. After the update is complete, disconnect the USB cable
and turn the camera’s power off.
Note:
Do not turn off the camera’s power while the firmware is being updated.
– 24 –
Page 25
4. USB STORAGE INFORMATION
REGISTRATION
USB storage data is important for when the camera is connected to a computer via a USB connection.
If there are any errors in the USB storage data, or if it has not
been saved, the USB specification conditions will not be satisfied, so always check and save the USB storage data.
Preparation:
POWER switch: ON
Adjustment method:
1. Connect the camera to a computer. (Refer to 3-5. Connecting the camera to the computer on the page 18.)
2. Double-click on the DscCalDi.exe.
3. Click on the Get button in the USB storage window and
check the USB storage data.
VID: SANYO
PID: FH1
Serial:
Rev. : 1.00
4. Check the “Serial” in the above USB storage data. If the
displayed value is different from the serial number printed
on the base of the camera, enter the number on the base
of the camera. Then click the Set button.
5. Next, check VID, PID and Rev. entries in the USB storage
data. If any of them are different from the values in 3. above,
make the changes and then click the corresponding Set
button.
Calibration
AWB
Focus
UV Matrix
Cal Mode
Cal Data
USB storage
VID
Get
PID
Set
Backrush pulse :
OK
OK
Upload
Firmware
QrCode
PAF Cal.
EVF
LCD Type
Get
LCD
R Bright
RGB Offset
Tint
VCO
H AFCTest
Serial
Set
Set
Rev.
B Bright
Gain
Phase
Set
Set
Set
VCOMDC
VCOMPP
Hall Cal.
Setting
Language
Video Mode
Factory Code
– 25 –
Page 26
5. TROUBLESHOOTING GUIDE
POWER LOSS INOPERTIVE
PUSH THE POWER
SW FOR A WHILE
IC301-43
(SCAN OUT1)
PULSE INPUT
NO
IC302-7 5.3 V
(BOOST 5.3 V)
YES
IC301-9, 35, 59
(VDD)
HIGH
IC301-53
(RESET)
HIGH
IC301-49
(BAT OFF)
HIGH
IC301-55
OSCILLATION
YES
YES
NO
LOW
LOW
LOW
NO
CHECK S3003
CHECK IC501
CHECK IC302
CHECK IC302, RB312
CHECK RB312
CHECK X3002
TAKING INOPERATIVE
PUSH SHUTTER
BUTTON
IC301-51, 23
(KEY_1st, KEY_2nd)
LEVEL INPUT
YES
IC501-F6 (PON)
IC503-4 (PAON2)
IC504-1 (PAON1)
HIGH
SERIAL
COMMUNICATION
OK
CHECK CP1 DMA
BLOCK
NO
LOW
CHECK IC301, IC101,
NG
CHECK SW UNIT
PWA BLOCK
CHECK IC301,
CP1 DMA BLOCK
CHECK IC301
NO PICTURE
X1102
CHECK
OSCILLATION
OK
IC301-64, 63
(ASIC_SO, ASIC_SI)
OK
CHECK SOLDERING
OF MEMORY
EACH PIN
NG
MAIN CLOCK FOR SYSTEM OPERATION
NO OPERATION IF ABSENT
Xacti software,PDF instruction manual and
quick guide(English,French,German,Spanish,
Italian,Dutch,Portuguese,Russian,Turkish,Korean,
Traditional chinese,Simplified chinese
Note:Turkish is only a quick guide.)
VPC-FH1,VPC-FH1EX,VPC-FH1GX
102411 194 8206SCR PAN PCS 1.7X3,
VPC-FH1BK,VPC-FH1EXBK,VPC-FH1GXBK
104411 218 4405SCR S-TPG PAN PCS 1.7X7
105411 178 6204SCR PAN PCS 1.7X4
106411 175 5705SCR PAN PCS 1.7X3
107411 177 9503SCR S-TPG PAN PCS 1.7X3
109411 178 9403SCR S-TPG PAN PCS 1.7X4.0
110411 199 0601SCR TIN 1.7X2,
VPC-FH1BK,VPC-FH1EXBK,VPC-FH1GXBK
110411 199 0700SCR TIN 1.7X2,
VPC-FH1,VPC-FH1EX,VPC-FH1GX
111411 184 0005SCR PAN PCS 1.7X2.0
112411 181 2705SCR PAN PCS-1.4X2
114411 176 1003SCR PAN PCS 1.7X2.5
32
Page 33
106
87
106
84
114
106
114
86
81
85
82
73
114
114
B
C
83
78
80
25
A
79
78
78
107
57
56
114
55
74
59
58
75
D
76
63
106
73
D
73
77
78
72
105
73
71
70
69
107
68
67
109
60
A
B
61
106
106
62
109
112
106
107
89
61
114
104
88
104
110
46
41
66
42
64
65
44
43
C
54
106
106
SG317/J PARTS LIST 1
53
106
48
111
55
56
106
52
49
47
50
51
106
39
35
40
36
37
33
106
36
106
38
45
111
102
102
Cabinet 2
Page 34
ELECTRICAL PARTS
Note:
1. Materials of Capacitors and Resistors are abbreviated as follows ;
ResistorsCapacitors
MT-FILMMetallized Film ResistorMT-POLYESTMetallized Polyester Capacitor
MT-GLAZEMetallized Glaze ResistorMT-COMPOMetallized Composite Capacitor
OXIDE-MTOxide Metallized Film ResistorTA-SOLIDTantalum Solid Capacitor
2. Tolerance of Capacitor (10pF over) and Resistor are noted with follow symboles.
F ............1%G ............2%J ............5%K ............10%
M ..........20%N ..........30%Z ..........+80% ~ -20%
3. Capacitors
U : µFP : pF
4. Inductors
UH : µHMH : mH
5. N.S.P. : Not available as service parts.
LOCATION PARTS NO.DESCRIPTIONLOCATION PARTS NO.DESCRIPTION
L1001645 094 0521IMPEDANCE,33 OHM P
L1002645 094 0521IMPEDANCE,33 OHM P
L1003945 061 7417INDUCTOR,47U M
L1004645 094 0521IMPEDANCE,33 OHM P
L1005945 053 5476IMPEDANCE,240 OHM P
L1006645 053 2276IMPEDANCE,5 OHM P
L1301645 095 6522FILTER,EMI 90 OHM
L1302945 066 4688IMPEDANCE,30 OHM P
L1901645 090 9719IMPEDANCE,90 OHM M
L1902645 090 9719IMPEDANCE,90 OHM M
L5001945 066 4688IMPEDANCE,30 OHM P
L5002645 068 7136INDUCTOR,4.7U N
L5003645 068 7136INDUCTOR,4.7U N
L5004645 098 4822INDUCTOR,2.0U M
OR645 086 2007INDUCTOR,2.0U M
L5006645 095 6508INDUCTOR,4.7U N
L5007645 095 6515INDUCTOR,6.8U N
L5301645 098 2118INDUCTOR,4.7U M
OR645 091 0043INDUCTOR,4.7U M
(CAPACITORS)
CB301403 467 3704CERAMIC1U K 6.3V
CB302403 467 3704CERAMIC1U K 6.3V
CB303303 391 4306CERAMIC0.1U K 16V
C1002303 384 6508CERAMIC10U K 6.3V
C1004303 276 1307CERAMIC1000P K 50V
C1005303 384 6409CERAMIC4.7U K 6.3V
C1007303 338 0309CERAMIC0.1U K 10V
C1008303 338 0309CERAMIC0.1U K 10V
C1010303 338 0309CERAMIC0.1U K 10V
C1011303 338 0309CERAMIC0.1U K 10V
C1012303 381 8109CERAMIC1U K 6.3V
C1013303 381 8109CERAMIC1U K 6.3V
C1014303 338 0309CERAMIC0.1U K 10V
C1016303 338 0309CERAMIC0.1U K 10V
C1017303 381 8109CERAMIC1U K 6.3V
C1019303 381 8109CERAMIC1U K 6.3V
C1021303 393 2607CERAMIC22U M 6.3V
C1022303 338 0309CERAMIC0.1U K 10V
C1023303 338 0309CERAMIC0.1U K 10V
C1024303 384 6508CERAMIC10U K 6.3V
C1025303 338 0309CERAMIC0.1U K 10V
C1026303 338 0309CERAMIC0.1U K 10V
C1028303 338 0309CERAMIC0.1U K 10V
C1030303 338 0309CERAMIC0.1U K 10V
C1031303 393 2607CERAMIC22U M 6.3V
C1032303 381 8109CERAMIC1U K 6.3V
C1033303 419 8903CERAMIC10U M 6.3V
C1034303 419 8903CERAMIC10U M 6.3V
C1035303 338 0309CERAMIC0.1U K 10V
C1036303 276 1000CERAMIC0.01U K 16V
C1038303 338 0309CERAMIC0.1U K 10V
C1040303 338 0309CERAMIC0.1U K 10V
C1043303 384 6409CERAMIC4.7U K 6.3V
C1044303 419 8903CERAMIC10U M 6.3V
C1051303 338 0309CERAMIC0.1U K 10V
C1052303 338 0309CERAMIC0.1U K 10V
C1053303 338 0309CERAMIC0.1U K 10V
C1057303 338 0309CERAMIC0.1U K 10V
C1058303 338 0309CERAMIC0.1U K 10V
C1063303 338 0309CERAMIC0.1U K 10V
C1064303 338 0309CERAMIC0.1U K 10V
C1065303 338 0309CERAMIC0.1U K 10V
C1066303 338 0309CERAMIC0.1U K 10V
C1067303 338 0309CERAMIC0.1U K 10V
C1101303 419 8903CERAMIC10U M 6.3V
C1121303 311 7806CERAMIC8P D 50V
C1122303 311 7806CERAMIC8P D 50V
C1201303 338 0309CERAMIC0.1U K 10V
C1202303 338 0309CERAMIC0.1U K 10V
C1301303 381 8109CERAMIC1U K 6.3V
C1302303 381 8109CERAMIC1U K 6.3V
C1303303 381 8109CERAMIC1U K 6.3V
C1304303 409 3406CERAMIC0.1U K 16V
C1305303 338 0309CERAMIC0.1U K 10V
C1306303 409 3406CERAMIC0.1U K 16V
C1307303 276 1000CERAMIC0.01U K 16V
C1308303 381 8109CERAMIC1U K 6.3V
C1309303 381 8109CERAMIC1U K 6.3V
C1310303 338 0309CERAMIC0.1U K 10V
C1311303 433 1102CERAMIC1U K 10V
C1501303 338 0309CERAMIC0.1U K 10V
C1801303 338 0309CERAMIC0.1U K 10V
C1802303 384 6409CERAMIC4.7U K 6.3V
C1804303 338 0309CERAMIC0.1U K 10V
C1805303 338 0309CERAMIC0.1U K 10V
C1806303 381 8109CERAMIC1U K 6.3V
C1807303 381 8109CERAMIC1U K 6.3V
C1808303 381 8109CERAMIC1U K 6.3V
C1809303 381 8109CERAMIC1U K 6.3V
C1810303 439 8402CERAMIC2.2U K 6.3V
C1811303 279 5005CERAMIC4700P K 25V
C1812303 384 6409CERAMIC4.7U K 6.3V
C1818303 338 0309CERAMIC0.1U K 10V
C1901303 376 9401CERAMIC1U K 6.3V
C1902303 376 9401CERAMIC1U K 6.3V
C1903303 338 0309CERAMIC0.1U K 10V
C1904303 276 2106CERAMIC3P C 50V
C1905303 276 2106CERAMIC3P C 50V
C1906303 338 0309CERAMIC0.1U K 10V
C1907303 376 9401CERAMIC1U K 6.3V
C1908303 338 0309CERAMIC0.1U K 10V
C1909303 381 8109CERAMIC1U K 6.3V
C1910303 276 1000CERAMIC0.01U K 16V
C1911303 338 0309CERAMIC0.1U K 10V
C3001303 391 0506CERAMIC10U K 6.3V
C3005303 381 8109CERAMIC1U K 6.3V
C3006303 381 8109CERAMIC1U K 6.3V
C3012303 276 1901CERAMIC22P J 50V
C3015303 276 1901CERAMIC22P J 50V
C5001303 338 0309CERAMIC0.1U K 10V
C5003303 384 6409CERAMIC4.7U K 6.3V
C5004303 320 0607CERAMIC220P J 25V
C5005303 433 1102CERAMIC1U K 10V
C5006303 338 0309CERAMIC0.1U K 10V
C5007303 383 5007CERAMIC1U K 16V
C5021303 393 2607CERAMIC22U M 6.3V
C5022303 276 1901CERAMIC22P J 50V
C5023303 376 9401CERAMIC1U K 6.3V
C5024303 376 9401CERAMIC1U K 6.3V
C5025303 276 1000CERAMIC0.01U K 16V
C5026303 276 1307CERAMIC1000P K 50V
C5031303 393 2607CERAMIC22U M 6.3V
C5032303 279 5104CERAMIC3300P K 50V
C5033303 433 1102CERAMIC1U K 10V
C5036303 376 9401CERAMIC1U K 6.3V
C5037303 376 9401CERAMIC1U K 6.3V
C5055303 376 9401CERAMIC1U K 6.3V
C5066303 376 9401CERAMIC1U K 6.3V
C5067303 393 2607CERAMIC22U M 6.3V
C5068303 376 9401CERAMIC1U K 6.3V
C5071303 408 5500CERAMIC2.2U K 16V
C5072303 383 5007CERAMIC1U K 16V
C5073303 276 1000CERAMIC0.01U K 16V
C5074303 376 9401CERAMIC1U K 6.3V
C5101303 393 2607CERAMIC22U M 6.3V
C5102303 393 2607CERAMIC22U M 6.3V
C5105303 338 0309CERAMIC0.1U K 10V
C5106303 344 0409CERAMIC 0.033U K 10V
C5107303 338 0309CERAMIC0.1U K 10V
C5108303 320 0706CERAMIC270P J 25V
C5109303 308 3408CERAMIC390P K 50V
C5110303 276 2106CERAMIC3P C 50V
C5111303 384 6409CERAMIC4.7U K 6.3V
C5112303 384 6508CERAMIC10U K 6.3V
C5201303 408 5500CERAMIC2.2U K 16V
C5202303 408 5500CERAMIC2.2U K 16V
C5204303 341 7005CERAMIC 0.068U K 10V
35
Page 36
LOCATION PARTS NO.DESCRIPTIONLOCATION PARTS NO.DESCRIPTION
C5206303 433 1102CERAMIC1U K 10V
C5207303 433 1102CERAMIC1U K 10V
C5208303 433 1102CERAMIC1U K 10V
C5301303 384 6508CERAMIC10U K 6.3V
C5302303 381 1209POS-SOLID33U M 6.3V
C5303303 294 6100CERAMIC100P J 50V
C5304303 383 5007CERAMIC1U K 16V
C9502303 338 0309CERAMIC0.1U K 10V
C9504303 338 0309CERAMIC0.1U K 10V
C9505303 338 0309CERAMIC0.1U K 10V
C9506303 338 0309CERAMIC0.1U K 10V
C9510303 283 5701CERAMIC2200P K 50V
C9511303 282 9403CERAMIC680P K 50V
C9512303 282 9403CERAMIC680P K 50V
C9513303 338 0309CERAMIC0.1U K 10V
C9515303 338 0309CERAMIC0.1U K 10V
C9518303 338 0309CERAMIC0.1U K 10V
C9519303 282 9403CERAMIC680P K 50V
C9523303 380 6601CERAMIC0.22U K 6.3V
C9524303 358 8309CERAMIC1U K 10V
C9525303 358 8309CERAMIC1U K 10V
L1401945 053 5476IMPEDANCE,240 OHM P
L1402945 053 5476IMPEDANCE,240 OHM P
L1403945 053 5476IMPEDANCE,240 OHM P
(CAPACITORS)
C1401303 381 8109CERAMIC1U K 6.3V
C1402303 286 1403CERAMIC10P D 50V
C1403303 286 1403CERAMIC10P D 50V
C1404303 286 1403CERAMIC10P D 50V
C1405303 286 1403CERAMIC10P D 50V
C1406303 286 1403CERAMIC10P D 50V
C1410303 276 2106CERAMIC3P C 50V
C1551303 381 8109CERAMIC1U K 6.3V
C1552303 381 8109CERAMIC1U K 6.3V
C1553303 381 8109CERAMIC1U K 6.3V
C1554303 338 0309CERAMIC0.1U K 10V
C1555303 433 1102CERAMIC1U K 10V
C1556303 384 4702TA-SOLID47U M 6.3V
C1557303 388 6603TA-SOLID22U M 4V
C1558303 384 4702TA-SOLID47U M 6.3V
C1559303 388 6603TA-SOLID22U M 4V
C1560303 384 4702TA-SOLID47U M 6.3V
C1561303 388 6603TA-SOLID22U M 4V
T5401645 097 3864TRANS,STEP UP
T5402645 084 1835TRANS,STEP UP
C3501303 433 1102CERAMIC1U K 10V
C5401303 393 2607CERAMIC22U M 6.3V
C5410303 428 3302CERAMIC 0.022U K 350V
C5411303 428 3609CERAMIC0.01U K 350V
C5431303 381 8109CERAMIC1U K 6.3V
C5432303 381 8109CERAMIC1U K 6.3V
C5433303 276 1307CERAMIC1000P K 50V
C5434303 276 1307CERAMIC1000P K 50V
C5435303 276 3103CERAMIC33P J 50V
RB541945 028 0703R-NETWORK 1KX4 1/16W
R3501301 224 8804MT-GLAZE100 JA 1/16W
R5402402 110 5003MT-GLAZE 100K JE 1/8W
R5422402 110 5102MT-GLAZE 220K JE 1/8W
R5424301 224 9009MT-GLAZE10K JA 1/16W
R5425301 225 1804MT-GLAZE47 JA 1/16W
R5431301 224 8804MT-GLAZE100 JA 1/16W
R5432301 224 9009MT-GLAZE10K JA 1/16W
R5433301 225 0609MT-GLAZE 5.6K JA 1/16W
R5434301 225 0203MT-GLAZE 3.3K JA 1/16W
R5435301 224 8804MT-GLAZE100 JA 1/16W
CN541645 092 3906SOCKET,PWB-PWB 20(N.S.P)
636 122 6936
(SEMICONDUCTOR)
(INTEGRATED CIRCUITS)
(DIODES)
(TRANSFORMERS)
(CAPACITORS)
(RESISTOR PACK)
(RESISTORS)
(CONNECTOR)
COMPL PWB,VF-1
636 122 6929
(CAPACITORS)
C1701303 381 8109CERAMIC1U K 6.3V
C1702303 433 1102CERAMIC1U K 10V
C1703303 382 7804CERAMIC2.2U K 10V
C1704303 382 7804CERAMIC2.2U K 10V
C1705303 382 7804CERAMIC2.2U K 10V
C1706303 382 7804CERAMIC2.2U K 10V
C1707303 281 2405CERAMIC0.22U K 16V
C1708303 281 2405CERAMIC0.22U K 16V
C1709303 383 5007CERAMIC1U K 16V
C1710303 383 5007CERAMIC1U K 16V
C1711303 420 7209CERAMIC10U K 10V
C1712303 381 8109CERAMIC1U K 6.3V
POWER CIRCUIT...............................................................................................................................................C4
MAIN CIRCUIT ...................................................................................................................................................C6
SYSTEM CONTROL CIRCUIT ......................................................................................................................... C7
CP1 P.W.B. (SIDE A) ...................................................................................................................................... C20
CP1 P.W.B. (SIDE B) ...................................................................................................................................... C21
CA1 P.W.B. (SIDE A & B) ................................................................................................................................ C22
TB3 P.W.B. (SIDE A & B) ................................................................................................................................ C22
TB1 P.W.B. (SIDE A & B) ................................................................................................................................ C23
TB2 P.W.B. (SIDE A & B) ................................................................................................................................ C23
TB4 P.W.B. (SIDE A & B) ................................................................................................................................ C24
TB5 P.W.B. (SIDE A & B) ................................................................................................................................ C24
VF1 P.W.B. (SIDE A & B) ................................................................................................................................ C25
ST1 P.W.B. (SIDE A & B) ................................................................................................................................ C25
C1
Page 40
NOTES:
1. All resistance values in "OHMS" unless otherwise noted.
(K=1,000 ; M=1,000,000)
2. All capacitance values in "µF" unless otherwise noted.
3. All inductance values in "µH" unless otherwise noted.
µ ,u or U=micro henry ; m=milli henry
Figure of printed wiring boards
Multilayer board:
"Side A" means the view from A side of the board.
"Side B" means the view from B side of the board.
Singlelayer board:
View from the copper-foil side of the board, otherwise noted.
PRODUCT SAFETY NOTICE
THE COMPONENTS DESIGNATED BY A SYMBOL ( ) IN THIS
SCHEMATIC DIAGRAM DESIGNATES COMPONENTS WHOSE VALUE ARE OF SPECIAL SIGNIFICANCE TO PRODUCT SAFETY.
SHOULD ANY COMPONENT DESIGNATED BY A SYMBOL NEED TO
BE REPLACED, USE ONLY THE PART DESIGNATED IN THE PARTS
LIST.
DO NOT DEVIATE FROM THE RESISTANCE, WATTAGE AND VOLTAGE RATINGS SHOWN.
EXPLANATORY NOTES (EXAMPLES)
Resistor 10K:1/16J means 10kilo ohm ±5%, 1/16watt max.
1M:1/10D means 1mega ohm ±0.5%, 1/10watt max.
(Tolerance K:±10%, J:±5%, G:±2%, F:±1%, D:±0.5%)
Capacitor 0.047:F means 0.047micro farad, Ftype.
Electrolytic capacitor
10:16 means 10micro farad, 16volt max.
Inductor 330:J means 330micro henry ±5%
470:K means 470micro henry ±10%
No description J or K means ±5%
The number of "H=##" written in slant character, shows the voltage.
The number of "H=##" written in upright character, shows the height of the parts.