Sanyo SPI-315-34 Specifications
Ordering number : EN6028
SPI-315-34
Ultraminiature photoreflector
(single-transistor type)
Features
• Infrared LED plus Phototransistor (single)
• DIP type
• Compact type : 3.4 (L) ✕ 2.7 (W) ✕ 1.5 (H) mm
• Visible light cut type
• Lead length : (L=3.5mm)
Absolute Maximum Ratings at Ta=25°C, 65%RH
Parameter Symbol Rating Unit
Forward Current I
Input LED
Reverse Voltage V
Power Dissipation P
Collector-Emitter Voltage V
Output
Phototransistor
Emitter-Collector Voltage V
Collector Curren I
Power Dissipation P
Operating Temperature Topr --20 to +80 °C
Storage Temperature Tstg --30 to +100 °C
1
Soldering T emperature
1
*
Soldering conditions : time : max. 3sec; clearance : min. 1mm from lower case edge.
*
F
R
D
CEO
ECO
C
C
Tsol 260 °C
Infrared LED
SPI-315-34
50 mA
5V
70 mW
20 V
5V
20 mA
70 mW
Electro-Optical Characteristics at Ta=25°C, 65%RH
Parameter Symbol Condition Min. Typ. Max. Unit
Input
Forward Voltage V
Reverse Current I
Output Dark Current I
Collector Output Current I
Leakage Current I
Coupled
Collector Emitter
Saturation Voltage
Rise Time tr
Fall Time tf
1
*
Location of reflector is shown in Fig. 1.
2
*
No reflector
3
*
Table of Classification of Collector Output
CEO
LEAKIF
VCE(sat) IF=10mA, IC=50µA -- -- 0.5 V
IF=10mA 1.0 1.2 1.6 V
F
VR=5V -- -- 10 µA
R
IF=0mA, VCE=10V -- -- 200 nA
IF=10mA, VCE=5V
C
=10mA, VCE=5V
VCC=5V, RL=100Ω
IC=1mA
Class A B C D
Ic (µA) 1100 to 450 600 to 260 350 to 150 200 to 80
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
1
*
2
*
80 - - 1100 µA
-- -- 1 µA
-- 5 -- µs
-- 5 -- µs
Fig. 1 Location of Reflector
AL V .E. film
Glass plate (t : 1mm)
72199 GI, (MI
)
No.6028 1/6
Package dimensions and Pin connection
1mm
Fig. 3
As stated in the sttached paper. (No.6028 4/6)
SPI-315-34
A
Lot marking
Color division shall be done as shown in the drawing. (Fig. 2)
Year of even number : Front side
Year of odd number : Back side
Color Black Blue Red Green Orange Brown
Part ‘A’ January February March April May June
Part ‘B’ July August September October November December
Front side
B
Fig. 2
Soldering conditions
(1) Temperature : Max. 260°C
(2) Time : Max. 3sec
(3) Clearance : Min. 1mm from the case edge. (Fig. 3)
PRECAUTIONS
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
stress for the regin part cause troubles such as gold wire breaking and so on.
e A lead must be bend at intervals of 1mm from the case edge.
r Do not bend the same position of leads more than twice.
(2) The hole pitch of a circuit board must fit to the lead pitch.
(3) Take core the following when soldering.
q Do not heat a product under any stress (a twist and so on) to leads.
w Do not heat a product in the states of operating force to the regin part.
(4) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
No.6028 2/6
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