Ordering number : ENN*6614A
20802TN (OT)/82500RM (OT) No. 6614-1/13
Functions
• CD-ROM decoder/encoder functions
• CD decoder/encoder functions
• Pit and wobble CLV servo
• CAV audio functions
• SCSI interface (includes the register block)
• Subcode encoder/decoder functions
• ATIP demodulator/ATIP decoder
• Supports BURN-Proof recording
• Write strategy function (CD-R/RW)
• CD-DSP function with built-in digital servo
Features
• ECC and EDC correction/addition (decoding/encoding)
for CD-ROM data.
• ECC error correction/addition (decoding/encoding) for
subcode data
• Servo control implemented in a digital servo system
(decoding/encoding)
• Wobble CLV servo control using ATIP data (encoding)
• ATIP decoding function and CRC check function
(decoding/encoding)
• CIRC code generation and addition and EFM
modulation (encoding)
• CAV audio functions
• Write strategy function supports 16× recording.
• Built-in SCSI interface (supports Ultra SCSI)
• Supports 40× decoding and 16× encoding.
Clock frequencies: CD-ROM block: 33.8688 MHz,
SCSI block: 20 MHz
• Ultra SCSI data transfer rate: 20 Mbyte/s (Maximum
synchronous transfer rate), Fast SCSI: 10 Mbyte/s
(Maximum synchronous transfer rate), 5 Mbyte/s
(Maximum asynchronous transfer rate)
Uses 16-bit data bus 45 ns EDO DRAM.
• From 1 to 64 Mbits of buffer RAM can be used. (16-bit
data bus EDO DRAM)
• The user can freely set up the CD main channel, C2 flag,
and subcode areas in buffer RAM.
• Batch transfer function (Function for transferring the CD
main channel, C2 flag, subcode, and other data in a
single operation)
• Multi-transfer function (Function for automatically
transferring multiple blocks to the host in a single
operation)
Preliminary
LC898023KW, 898023KL
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
40× Playback/16× Write CD-R/RW Encoder/Decoder IC
with Built-in SCSI Interface
CMOS IC
Any and all SANYO products described or contained herein do not have specifications that can handle
applications that require extremely high levels of reliability, such as life-support systems, aircraft’s
control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your SANYO representative nearest you before using
any SANYO products described or contained herein in such applications.
SANYO assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other
parameters) listed in products specifications of any and all SANYO products described or contained
herein.
“BURN-Proof” stands for Proof against Buffer Under RuN
error, not for proof against burning.
“BURN-Proof” is a trademark of SANYO Electric Co.,Ltd.
No. 6614-2/13
LC898023KW, 898023KL
Package Dimensions
unit: mm
3261-SQFP208J (28 × 28)
unit: mm
3264-LQFP208
28.0
31.2
0.15
0.2
3.56max
0.8
31.2
(0.5)
(1.25)
28.0
1
52
156 105
53
208
104
157
(3.2)
0.1
SANYO: SQFP208J (28 × 28)
[LC898023KW]
28.0
25.5
(0.5)
30.0
0.09
0.22
0.5
1.6max
25.5
30.0
0.5
28.0
0.10
(1.4)
1
52
156 105
53
208
104
157
SANYO: LQFP208
[LC898023KL]
Parameter Symbol Conditions Ratings Unit
Supply voltage
V
DD
5 max Ta ≤ 25°C –0.3 to +6.0 V
V
DD
3 max Ta ≤ 25°C –0.3 to +4.6 V
I/O voltages
V
I
5, VO5 Ta ≤ 25°C –0.3 to VDD5 + 0.3 V
V
I
3, VO3 Ta ≤ 25°C –0.3 to VDD3 + 0.3 V
Allowable power dissipation Pd max Ta ≤ 70°C 900 mW
Operating temperature Topr –30 to +70 °C
Storage temperature Tstg –55 to +125 °C
Soldering conditions (pins only) 10 seconds 260 °C
Specifications
Absolute Maximum Ratings at VSS= 0 V
Parameter Symbol Conditions
Ratings
Unit
min typ max
[I/O cells, 5.0 V power supply]
Supply voltage V
DD
5 4.5 5.0 5.5 V
Input voltage range V
IN
0 VDD5 V
[Internal cells, 3.3 V power supply]
Supply voltage V
DD
3 3.0 3.3 3.6 V
Input voltage range V
IN
0 VDD3 V
Allowable Operating Ranges at Ta = –30 to +70°C, VSS= 0 V
No. 6614-3/13
LC898023KW, 898023KL
Parameter Symbol Conditions
Ratings
Unit
min typ max
Input high-level voltage V
IH
TTL level inputs: (2), (14)
2.2 V
Input low-level voltage V
IL
0.8 V
Input high-level voltage V
IH
TTL level inputs with built-in pull-up resistors: (13)
2.2 V
Input low-level voltage V
IL
0.8 V
Input high-level voltage V
IH
TTL level Schmitt trigger inputs: (1)
2.5 V
Input low-level voltage V
IL
0.6 V
Input high-level voltage V
IH
(15)
2.0 V
Input low-level voltage V
IL
0.8 V
Input high-level voltage V
IH
CMOS level Schmitt trigger inputs: (3)
0.8 V
DD
V
Input low-level voltage V
IL
0.2 V
DD
V
Input high-level voltage V
IH
CMOS level inputs with built-in pull-up resistors: (4)
0.7 V
DD
V
Input low-level voltage V
IL
0.3 V
DD
V
Analog input voltage V
ANI
(5) 1/4 V
DD
3/4 V
DD
V
Output high-level voltage V
OHIOH
= –12 mA: (8) VDD– 2.1 V
Output low-level voltage V
OLIOL
= 12 mA: (8) 0.4 V
Output high-level voltage V
OHIOH
= –8 mA: (7) VDD– 2.1 V
Output low-level voltage V
OLIOL
= 8 mA: (7) 0.4 V
Output high-level voltage V
OHIOH
= –2 mA: (6), (13), (14) VDD– 2.1 V
Output low-level voltage V
OLIOL
= 2 mA: (6), (13), (14) 0.4 V
Output low-level voltage V
OLIOL
= 48 mA: (15) 0.4 V
Output low-level voltage V
OLIOL
= 8 mA: (12) 0.4 V
Output low-level voltage V
OLIOL
= 1 mA: (9) 0.4 V
Output high-level voltage V
OHIOH
= –4 mA: (11) VDD– 2.1 V
Output low-level voltage V
OLIOL
= 4 mA: (11) 0.4 V
Output high-level voltage V
OHIOH
= –6 mA: (16), (17) 2.4 V
Output low-level voltage V
OLIOL
= 6 mA: (16), (17) 0.4 V
Analog output voltage V
ANO
(10) 1/4 V
DD
3/4 V
DD
V
Input leakage current I
IL
VI= VSS, VDD: (1), (2), (14), (15) –10 +10 µA
Output leakage current I
OZ
In the high-impedance output state: (9), (11), (12) –10 +10 µA
Pull-up resistance R
UP
(12), (13) 40 80 160 kΩ
Pull-up resistance R
UP
(4) 50 100 200 kΩ
Electrical Characteristics at Ta = –30 to +70°C, VSS= 0 V, VDD= 4.5 to 5.5 V
The applicable pin groups are listed on the following page.
No. 6614-4/13
LC898023KW, 898023KL
Applicable Pins
[INPUT]
(1) · · · · · · WOBBLE, CS, RD, WR, DEF, HFL, TES, RESET
(2) · · · · · · SUA0 to SUA7, TEST0 to TEST4
(3) · · · · · · WRITE
(4) · · · · · · FG
(5) · · · · · AD0, AD1, RREC, FE, TE, VREF, FR, OPP, JITIN, PCKISTF, PCKISTP, EFMIN, EFMIN2, SLCIST1,
SLCIST2
[OUTPUT]
(6) · · · · · · LDON
(7) · · · · · EFMG, SHOCK, LOCK, EFMO, SSP2/1, RAPC, WAPC, H11TO, LDH, ATEST3, ATEST1, WDAT,
NWDAT
(8) · · · · · · PCK2, SUBSYNC
(9) · · · · · · PDS1 to PDS3
(10) · · · · · DA0 to DA2, TDO, FDO, SLDO, SPDO, JITC, LOUT, ROUT, PDO, RPO, SLDO, SLCO1 to SLCO3
(11) · · · · · DSLB
(12) · · · · · INT0, INT1, SWAIT
(16) · · · · · RA0 to RA9, CAS0 to CAS1, RAS0 to RAS2, LWE, UWE, OE
[INOUT]
(13) · · · · · D0 to D7
(17) · · · · · ID0 to ID15
(14) · · · · · ATIPSYNC, BICLK, BIDATA, ACRCNG
(15) · · · · · ACK, ATN, BSY, C/D, DB0 to DB7, DBP, I/O, MSG, REQ, RST, SEL
Note: The XTAL0, XTAL1, XTALCK0, and XTALCK1 are not included in the DC characteristics.
SCSI Pin Input Characteristics
Active Negation Output Characteristics
Note: The active negation output characteristics only applies to DB0 to DB7, REQ, and DBPB
Rise Time Test Circuit
SCSI
Driver
TP
47
Ω±
5%
15pF
±
5%
2.5V
+
—
A13480
Parameter Symbol Conditions
Ratings
Unit
min typ max
Input threshold voltage
V
t + t1
VDD= 4.50 to 5.50 V 1.60 2.00 V
V
t – t1
VDD= 4.50 to 5.50 V 0.80 1.10 V
Hysteresis width ∆V
tt1
VDD= 5.0 V 0.41 0.5
Parameter Symbol Conditions
Ratings
Unit
min typ max
Output high voltage V
OH
2.5 V
Output low voltage V
OL
0.4 V
No. 6614-5/13
LC898023KW, 898023KL
De-scramble &
Buffering
Address generator
Microcontroller
RAM access
Address generator
Address generator
ECC & EDC
SCSI I/F Block
Address generator
Data output input I/F
Bus
Arbiter
&
DRAM
controller
External
Buffer
DRAM
Each Block
Bus control
signal
Each Block
Register
R0-R87
CD-DSP I/F
& SYNC
Detector
Digital Servo
&
CIRC EnDec
HOST
Micro
controller
decoder
PLL
&
Clock
generator
*8
DAC
*9
TEST0-4
*13
*10
*6
*7
*3
*2
CAV-Audio
Sub-code ECC
Address generator
*1
Write Strategy
&
Link-position
*12
Sub-code I/F
de-interleve/interleve
Address generator
ATIP/CLV servo
ATIPSYNC
INT0, INT1
SWAIT
XTALCK0
XTAL0
XTALCK1
XTAL1
Each Block
SCSI Block
Data bus[0:7]
Address bus[0:21]
RAM
Data bus[0:15]
LC898023K
A13483
*1 DSLB (pin96) to FR (pin123), CSS (pin126) to SPDO (pin142), SHOCK (pin147) to PCK2 (pin155)
*2 SUBSYNC
*3 DB0 to DB7, DBP, BSY, MSG, SEL, RST, REQ, I/O, C/D, ACK, ATN
*6 RD, WR, SUA0 to SUA7, CS
*7 D0 to D7
*8 IO0 to IO15
*9 RA0 to RA9, RAS0, RAS1, RAS2, CAS0, CAS1, OE, UWE, LWE
*10 WOBBLE, BIDATA, BICLK, ATIPSYNC
*12 WRITE, SSP2/1, RAPC, WAPC, H11T0, LDH, TEST2/1, WDAT, NWDAT, EFMG
*13 LOUT, ROUT
Block Diagram
No. 6614-6/13
LC898023KW, 898023KL
Pin Functions
Pin type
I Input B Bidirectional pin NC Not connected
O Output P Power supply A Analog pin
Pin No. Pin name Type Pin function
1 V
SS
P Digital system ground (VSS)
2 RA4 O
3 RA5 O
4 RA6 O
CD-ROM encoder/decoder DRAM address lines
5 RA7 O
6 RA8 O
7 RA9 O
8 V
DD
P Digital system power supply (5 V)
9 V
SS
P Digital system ground (VSS)
10 IO0 B
11 IO1 B
12 IO2 B CD-ROM encoder/decoder buffer RAM data lines
13 IO3 B These pins have built-in pull-up resistors.
14 IO4 B
15 IO5 B
16 V
DD
P Digital system power supply (3.3 V)
17 V
SS
P Digital system ground (VSS)
18 IO6 B
19 IO7 B
CD-ROM encoder/decoder buffer RAM data lines
20 IO8 B
These pins have built-in pull-up resistors.
21 IO9 B
22 IO10 B
23 V
SS
P Digital system ground (VSS)
24 V
DD
P Digital system power supply (3.3 V)
25 IO11 B
26 IO12 B
27 IO13 B CD-ROM encoder/decoder buffer RAM data lines
28 IO14 B
29 IO15 B
30 ATIPSYNC I ATIP SYNC detection signal
31 BIDATA B
32 BICLK B ATIP demodulator I/O signals
33 WOBBLE I
34 V
DD
P Digital system power supply (5 V)
35 V
SS
P Digital system ground (VSS)
36 ACRCNG O ATIP CRC error signal
37 WRITE I Write strategy signal control input
38 SSP2 O Servo sampling pulse output
39 SSP1 O Servo sampling pulse output
40 RAPC O Laser control sampling pulse output
41 WAPC O Laser control sampling pulse output
42 H11T0 O Running OPC sampling pulse
43 LDH O Recording laser diode control signal output
44 V
DD
P Digital system power supply (3.3 V)
45 V
SS
P Digital system ground (VSS)
46 ATEST3 O Analog block test output
47 ATEST1 O Analog block test output
48 WDAT O Recording laser diode control signal output
49 NWDAT O Recording laser diode control signal output (WDAT inverted)
50 V
DD
P Analog system power supply (3.3 V)
51 V
SS
P Analog system ground (VSS)
Continued on next page.
No. 6614-7/13
LC898023KW, 898023KL
Continued from preceding page.
Pin No. Pin name Type Pin function
52 V
DD
P Digital system power supply (5 V)
53 V
SS
P Digital system ground (VSS)
54 R1 I
55 VCNT1 I
Write strategy analog signals
56 MDC1 I
57 PD1 O
58 SWAIT O Wait signal to the microcontroller
59 INT0 O
Interrupt request signal outputs to the microcontroller
60 INT1 O
These are open-drain outputs with built-in pull-up resistors.
61 D0 B
62 D1 B
63 D2 B
Microcontroller data signal lines
64 D3 B
These pins have built-in pull-up resistors.
65 D4 B
66 D5 B
67 D6 B
68 V
DD
P Digital system power supply (5 V)
69 V
SS
P Digital system ground (VSS)
70 D7 B Microcontroller data signal line
71 SUA0 I
72 SUA1 I
73 SUA2 I
74 SUA3 I
Command register selection address
75 SUA4 I
76 SUA5 I
77 SUA6 I
78 SUA7 I
79 CS I Chip select signal input from the microcontroller
80 RD I Data read signal from the microcontroller
81 WR I Data write signal from the microcontroller
82 TEST0 I Test pin. This pin must be tied to V
SS
.
83 VCNT I VCO control voltage
84 R I VCO bias resistor connection
85 PD O Charge pump output
86 V
DD
P Analog system power supply (3.3 V)
87 V
SS
P Analog system ground (VSS)
88 TEST1 I Test pin. This pin must be tied to V
SS
.
89 RESET I Reset input
90 XTALCK0 I Crystal oscillator circuit input (33.8688 MHz)
91 XTAL0 O Crystal oscillator circuit output
92 ROUT O D/A converter output
93 V
SS
P Analog system ground (VSS)
94 V
DD
P Analog system power supply (5 V)
95 LOUT O D/A converter output
96 DSLB O SLC PWM output
97 SLCIST1 I
EFM slice level setting input
98 SLCIST2 I
99 V
SS
P Analog system ground (VSS)
100 V
DD
P Analog system power supply (3.3 V)
101 SLCO0 O
102 SLCO1 O EFM slice level output
103 SLCO2 O
104 V
DD
P Digital system power supply (5 V)
105 V
SS
P Digital system ground (VSS)
Continued on next page.
No. 6614-8/13
LC898023KW, 898023KL
Continued from preceding page.
Pin No. Pin name Type Pin function
106 SLCO3 O EFM slice level output
107 EFMIN I
EFM input
108 EFMIN2 I
109 TEST4 I Test pin. This pin must be tied to V
SS
.
110 JITC O Jitter output
111 RPO O
P/N balance adjustment
112 OPP I
113 PCKISTF I Frequency comparator charge pump
114 PCKISTP I Phase comparator charge pump
115 V
SS
P Analog system ground (VSS)
116 V
DD
P Analog system power supply (3.3 V)
117 PDO O Charge pump filter
118 PDS1 O
Charge pump selection
119 PDS2 O
120 V
DD
P Digital system power supply (3.3 V)
121 V
SS
P Digital system ground (VSS)
122 PDS3 O Charge pump selection
123 FR I VCO frequency setting
124 TEST2 I Test pin. This pin must be tied to V
SS
.
125 TEST3 I DRAM voltage (5 V/3.3 V) selection pin
126 CSS I Center servo input pin
127 AD0 I AD input
128 RREC I Optical signal discrimination input
129 FE I FE input
130 TE I TE input
131 VREF I VREF input
132 AD1 I AD input
133 V
SS
P Analog system ground (VSS)
134 DA0 O DA output
135 DA1 O DA output
136 DA2 O DA output
137 TDO O Tracking output
138 V
DD
P Analog system power supply (5 V)
139 V
SS
P Analog system ground (VSS)
140 FDO O Focus output
141 SLDO O Sled output
142 SPDO O Spindle output
143 V
SS
P Digital system ground (VSS)
144 V
DD
P Digital system power supply (3.3 V)
145 SUBSYNC O Subcode SYNC signal
146 EFMG O EFM gate signal
147 SHOCK O Shock detection signal output
148 LOCK O PLL lock state output
149 DEF I Defect detection signal input
150 HFL I Mirror detection signal input
151 TES I TES comparator input
152 EFMO O Post-binarization EFM signal output
153 LDON O Laser control
154 FG I FG input
155 PCK2 O PCK output
156 V
DD
P Digital system power supply (5 V)
157 V
SS
P Digital system ground (VSS)
158 XTALCK1 I SCSI interface crystal oscillator circuit input (20 MHz)
159 XTAL1 O SCSI interface crystal oscillator circuit output
160 DB0 B SCSI connection
Continued on next page.
No. 6614-9/13
LC898023KW, 898023KL
Continued from preceding page.
Pin No. Pin name Type Pin function
161 V
SS
P Digital system ground (VSS)
162 DB1 B
SCSI connection
163 DB2 B
164 V
DD
P Digital system power supply (5 V)
165 DB3 B
SCSI connection
166 DB4 B
167 V
SS
P Digital system ground (VSS)
168 DB5 B
169 DB6 B SCSI connection
170 DB7 B
171 V
SS
P Digital system ground (VSS)
172 V
DD
P Digital system power supply (5 V)
173 V
SS
P Digital system ground (VSS)
174 DBP B
175 ATN B SCSI connection
176 BSY B
177 V
SS
P Digital system ground (VSS)
178 ACK B
SCSI connection
179 RST B
180 V
DD
P Digital system power supply (5 V)
181 MSG B
SCSI connection
182 SEL B
183 V
SS
P Digital system ground (VSS)
184 C/D B SCSI connection
185 V
SS
P Digital system ground (VSS)
186 V
DD
P Digital system power supply (5 V)
187 REQ B
SCSI connections
188 I/O B
189 V
SS
P Digital system ground (VSS)
190 V
DD
P Digital system power supply (3.3 V)
191 V
SS
P Digital system ground (VSS)
192 NC Unused
193 NC Unused
194 RAS0 O
195 RAS1 O DRAM RAS signal outputs
196 RAS2 O
197 LWE O DRAM lower write enable
198 V
DD
P Digital system power supply (3.3 V)
199 V
SS
P Digital system ground (VSS)
200 UWE O DRAM upper write enable
201 CAS0 O
DRAM CAS signal output
202 CAS1 O
203 OE O DRAM output enable
204 RA0 O
205 RA1 O
CD-ROM encoder/decoder DRAM address lines
206 RA2 O
207 RA3 O
208 V
DD
P Digital system power supply (3.3 V)
No. 6614-10/13
LC898023KW, 898023KL
Pin Functions
<SCSI Interface Pins>
BSY, ACK, MSG, SEL, REQ, ATN, RST, I/O, C/D (input/output)
SCIS bus control.
DB0 to DB7, DBP (input/output)
SCSI data bus.
<Microcontroller Interface Pins>
CS (input)
Chip select signal from the microcontroller. The microcontroller interface is active when this pin is low.
RD, WR (input)
Connect the microcontroller read and write lines to these inputs.
SWAIT (input)
Wait signal output to the microcontroller. When accessing buffer RAM, the microcontroller must wait if this pin is
low.
SUA0 to SUA7 (input)
Internal register address lines
D0 to D7 (input)
Microcontroller data bus. These pins have built-in pull-up resistors.
INT0, INT1 (output)
Interrupt request signals output to the microcontroller. INT1 can be set to output the ATAPI interrupt by setting
INT1EN (Conf-R11 bit 7)
These are open drain outputs with built-in 80 kΩ (at room temperature, 5 V) pull-up resistors.
<Buffer RAM Pins>
I/O0 to I/O15 (input/output)
Buffer RAM data bus. These pins have built-in pull-up resistors.
RA0 to RA9 (output)
Buffer RAM address lines.
RAS0, RAS1, RAS2 (output)
Buffer DRAM RAS outputs. Normally, RAS0 is used. However, if two 16-Mbit DRAMs are used, connect the RAS0
and RAS1 lines to the RAS pins on the DRAMs. If four 16-Mbit DRAMs are used, connect the RAS0, RAS1, RAS2,
and LWE lines to the RAS pins on the DRAMs.
CAS0, CAS1 (output)
Buffer DRAM CAS outputs. Normally, CAS0 is used. However, if two 16-Mbit DRAMs are used, connect the CAS0
output to the CAS pins on the DRAMs. If 2-CAS type DRAMs are used, connect CAS0 to UCAS and CAS1 to
LCAS.
OE (output)
Buffer RAM read output.
UWE, LWE (output)
Buffer RAM write outputs. Connect these to the corresponding pins. If 2-CAS type DRAMs are used, UWE must be
connected. (Leave LWE open.)
1. Analog Interface Pins
CCS (input)
Midpoint servo input pin.
RREC (input)
Optical discrimination input.
FE (input)
Focus error signal input.
TE (input)
Tracking error signal input.
VREF (input)
Input for the servo system reference voltage.
No. 6614-11/13
LC898023KW, 898023KL
AD0, AD1, AD2 (input)
A/D converter auxiliary inputs.
DA0, DA1, DA2 (input)
D/A converter auxiliary inputs.
TES (input)
TES comparator input.
TDO (output)
Tracking control signal output.
FDO (output)
Focus control signal output.
SLDO (output)
Sled control signal output.
SPDO (output)
Spindle control signal output.
2. EFM Input Block Pins
EFMIN (input)
EFM signal input.
The high-frequency components of the RF signal acquired from the RF amplifier are cut with a capacitor, and this
pin inputs that signal biased by the value of the SLCO0 to SLCO3 outputs passed through a low-pass filter.
EFMIN2 (input)
Used to change the time constant of the low-pass filter.
SLCIST1, SLCIST2 (input)
Slice level controller charge pump bias resistor connection.
SLCO0, SLCO1, SLCO2, SLCO3 (output)
Slice level controller charge pump outputs.
These levels bias the RF signal input to the EFMIN pin after being passed through a low-pass filter.
DSLB (output)
Slice level control PWM output.
EFMO (output)
Post-binarization EFM signal output. (For monitoring)
3. EFM Clock Generation Block Pins
FR (input)
EFM reproduction PLL VCO bias resistor connection.
PDO, PDS1, PDS2, PDS3 (output)
EFM reproduction PLL lag-lead filter connection.
PCKISTF (input)
EFM reproduction PLL frequency comparator charge pump bias resistor connection.
PCKISTP (input)
EFM reproduction PLL phase comparator charge pump bias resistor connection.
RPO (output)
P/N balance adjustment.
OPP (input)
P/N balance adjustment.
PCK2 (output)
EFM reproduction bit clock output.
4. Jitter Discrimination Pins
JITC (output)
Jitter output.
No. 6614-12/13
LC898023KW, 898023KL
5. Spindle Speed Detection Pins
FG (input)
Input for the speed monitor signal from the spindle driver.
6. Audio Interface Pins
LOUT, ROUT (output)
Left and right channel audio signal outputs.
7. RF Amplifier Interface Pins
LDON (output)
RF amplifier interface.
8. Write Strategy Pins
WRITE, SSP2/1, RAPC, WAPC, H11T0, LDH, ATEST3, 1, WDAT, NWDAT (I/O)
Write strategy signal connections.
9. ATIP Decoder Related Pins
ATIPSYNC (output)
ATIP synchronization detection signal. (For monitoring)
BIDATA, BICLK (I/O)
Input mode: Input of the biphase data and biphase clock when an external ATIP demodulator is used.
Output mode: Output of the biphase data and biphase clock when the internal ATIP demodulator is used. (For
monitoring)
WOBBLE (input)
Wobble signal is input when the internal ATIP demodulator is used.
ACRCNG (output)
Outputs the result of the ATIP decoder CRC check. (For monitoring)
<Other Pins>
RESET (input)
The LC898023K reset input. A low level input resets the LC898023K.
This pin must be held low for at least 1 µs when power is first applied.
TEST4 to TEST0 (input)
Test inputs. These pins must be connected to ground.
XTALCK0 (input), XTAL0 (output)
Drive these pins at 33.8688 MHz. This signal is used, without modification, as main clock for the CD-ROM encoder
and decoder blocks, including the DRAM interface.
XTALCK1 (input), XTAL1 (output)
Main clock for the SCSI block. The LC898023K is designed so that it can operate even when the ECC and SCSI
blocks are not synchronized. Providing a 20 MHz input to the XTALCK0 and XTALCK1 pins assures that correct,
synchronized transfer at 10 Mbyte/s (20 Mbyte/s for Ultra SCSI) can be achieved. The maximum frequency that can
be used is 20 MHz.
Since both edges of the clock signal are used by Ultra SCSI, the duty ratio must be correct. Add feedback resistors on
the XTALCK1 and XTAL1 pins and take other measures as required.
R, VCNT, PDO, R1, VCNT1, PD1, MDC1 (I/O)
Clock reproduction PLL circuit pins.
SUBSYNC (output)
Subcode SYNC output signal from the CIRC encoder during recording. (For monitoring)
EFMG (output)
Outputs a high level during recording.
SHOCK (output)
Outputs a high level when a mechanical shock is detected.
PS No. 6614-13/13
LC898023KW, 898023KL
This catalog provides information as of February, 2002. Specifications and information herein are subject
to change without notice.
Specifications of any and all SANYO products described or contained herein stipulate the performance,
characteristics, and functions of the described products in the independent state, and are not guarantees
of the performance, characteristics, and functions of the described products as mounted in the customer’s
products or equipment. To verify symptoms and states that cannot be evaluated in an independent device,
the customer should always evaluate and test devices mounted in the customer’s products or equipment.
SANYO Electric Co., Ltd. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with some probability. It is possible that these probabilistic failures could
give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire,
or that could cause damage to other property. When designing equipment, adopt safety measures so
that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective
circuits and error prevention circuits for safe design, redundant design, and structural design.
In the event that any or all SANYO products (including technical data, services) described or contained
herein are controlled under any of applicable local export control laws and regulations, such products must
not be exported without obtaining the export license from the authorities concerned in accordance with the
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or otherwise, without the prior written permission of SANYO Electric Co., Ltd.
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the “Delivery Specification”
for the SANYO product that you intend to use.
Information (including circuit diagrams and circuit parameters) herein is for example only; it is not
guaranteed for volume production. SANYO believes information herein is accurate and reliable, but
no guarantees are made or implied regarding its use or any infringements of intellectual property rights
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LOCK (output)
Outputs a high level when the PLL circuit is locked.
DEF (input)
Inputs the defect detection signal.
HFL (input)
Inputs the mirror detection signal.
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