- Input/output ports
Data direction programmable for each bit individually : 26 (P1n, P30-P35, P70-P7 3, P 8n)
Data direction programmable in nibble units : 8 (P0n)
(When N-channel open drain output is selected, data can be input in bit units.)
- Input ports : 2 (XT1,XT2)
- LCD ports
Segment output : 48 (S00-S47)
Common output : 4 (COM0-COM3)
Bias terminals for LCD driver 3 (V1-V3)
- Seven display modes are available (static, 1/2, 1/3, 1/4 duty × 1/2, 1/3 bias)
- Segment output and common output can be switched to general purpose input/output ports.
(7) Small signal detection (MIC signals etc)
- Counts pulses with the level which is greater than a preset value
- 2 bit counter
(8) Timers
- Timer 0: 16 bit timer / counter with capture register
Mode 0: 2 channel 8-bit timer with programmable 8 bit prescaler and 8 bit capture register
Mode 1: 8 bit timer with 8 bit programmable prescaler and 8 bit capture register + 8 bit
Counter with 8-bit capture register
Mode 2: 16 bit timer with 8 bit programmable prescaler and 16 bit capture register
Mode 3: 16 bit counter with 16 bit capture register
- Timer 1: PWM / 16 bit timer with toggle output function
Mode 0: 2 channel 8 bit timer (with toggle output)
Mode 1: 2 channel 8 bit PWM
Mode 2: 16 bit timer (with toggle output) Toggle output from lower 8 bits is also possible.
Mode 3: 16 bit timer (with toggle output) Lower order 8 bits can be used as PWM.
- Base Timer
1) The clock signal can be selected from any of the following :
Sub-clock (32.768kHz crystal oscillator), system clock, and prescaler output from timer 0
2) Interrupts of five different time intervals are possible.
(9) Serial-interface
- SIO 0: 8 bit synchronous serial interface
1) LSB first / MSB first is selectable
2) Internal 8 bit baud-rate generator (fastest clock period 4 / 3 Tcyc)
3) Consecutive automatic data communication (1-256 bits)
- SIO 1: 8 bit asynchronous / synchronous serial interface
Mode 0: Synchronous 8 bit serial IO (2-wire or 3-wire, transmit clock 2–512 Tcyc)
Mode 1: Asynchronous serial IO (half duplex, 8 data bits, 1 stop bit, baud rate 8–2048Tcyc)
Mode 2: Bus mode 1 (start bit, 8 data bits, transmit clock 2–512 Tcyc)
Mode 3: Bus mode 2 (start detection, 8 data bits, stop detection)
(10) AD converter
-8 bits × 12 channels
No.6842-2/24
LC8772C8B/B2B/96B/80B
(11) Re mo te control receiver circuit (connecte d to P73 / INT3 / T0IN termina l)
-Noise rejection function (noise rejection filter’s time constant can be selected from 1 / 32 / 128 Tcyc)
(12) Watchdog timer
- The watching time period is determined by an external RC.
- Watchdog timer can produce interrupt or system reset
(13) Interrupts: 14 sources, 10 vectors
1) Three prior ity (low, high and highest) multiple interrupts are supported. During inte rrupt hand ling, an equal or
lower priority interrupt request is postponed.
2) If interrupt requests to two or more vector addresses occur at once, the higher priority interrupt takes precedence.
In the case of equal priority levels, the vector with the lowest address takes precedence.
No. Vector Selectable Level Interrupt signal
1 00003H X or L INT0
2 0000BH X or L INT1
3 00013H H or L INT2/T0L
4 0001BH H or L INT3/Base timer
5 00023H H or L T0H
6 0002BH H or L T1L/T1H
7 00033H H or L SIO0
8 0003BH H or L SIO1
9 00043H H or L ADC/MIC
10 0004BH H or L Port 0
• Priority Level : X > H > L
• For equal priority levels, vector with lowest address takes precedence.
(14) Subroutine stack levels: 1024 levels max. Stack is located in RAM.
(15) Multiplication and division
- 16 bit × 8 bit (executed in 5 cycles)
- 24 bit × 16 bit (12 cycles)
- 16 bit ÷ 8 bit (8 cycles)
- 24 bit ÷ 16 bit (12 cycles)
(16) Oscillation circuits
- On-chip RC oscillation for system clock use.
- CF oscillation for system clock use. (Rf built in, Rd external)
- Crystal oscillation low speed system clock use. (Rf built in, Rd external)
(17) Standby function
- HALT mode
HALT mode is used to reduce power consumption. During the HALT mode, program execution is stopped but
peripheral circuits keep operating (some parts of serial transfer operation stop.)
1) Oscillation circuits are not stopped automatically.
2) Released by the system reset or interrupts.
-HOLD mode
HOLD mode is used to reduce power consumption. Program execution and peripheral circuits are stopped.
1) CF, RC and crystal oscillation circuits stop automatically.
2) Released by any of the following conditions.
(1) Low level input to the reset pin
(2) Specified level input to one of INT0, INT1, INT2
(3) Port 0 interrupt
No.6842-3/24
LC8772C8B/B2B/96B/80B
-X’tal HOLD made
X’tal HOLD mode is used to reduce power consumption. Program execution is stopped.
All peripheral circuits except the base timer are stopped.
1) CF and RC oscillation circuits stop automatically.
2) Crystal oscillator operation is kept in its state at HOLD mode inception.
3) Released by any of the following conditions
(1) Low level input to the reset pin
(2) Specified level input to one of INT0, INT1, INT2
(3) Port 0 interrupt
(4) Base-timer interrupt
(18) Package
- QIP100E
- SQFP100
(19) Development tools
- Evaluation chip : LC876096
- Emulator: EVA62S + ECB876500 (Evaluation chip board) + SUB877200 + POD100QFP
or POD100SQFP (Type B)
• Use of pull-up resistor can be specified in nibble units
• Input for HOLD release
• Input for port 0 interrupt
I/O • 8bit input/output port
• Data direction pr ogrammable for each bit
• Use of pull-up resistor can be specified for each bit individ ually
• Other pin functions
P10 SIO0 data output
P11 SIO0 data input or bus input/output
P12 SIO0 clock input/output
P13 SIO1 data output
P14 SIO1 data input or bus input/output
P15 SIO1 clock input/output
P16: Timer 1 PWML output
P17: Timer 1 PWMH output/Buzzer output
I/O • 6bit Input/output port
• Data direction can b e specified for each bit
• Use of pull-up resistor can be specified for each bit individ ually
• 4bit Input/output port
I/O
• Data direction can be specified for each bit
• Use of pull-up resistor can be specified for each bit individ ually
• Other func tions
P70: INT0 input/HOLD release input/Timer0L capture input/output for watchdog
2 Nch-open drain None
1 CMOS Programmable P10 to P17 each bit
2 Nch-open drain Programmable
1 CMOS Programmable P30 to P35 each bit
2 Nch-open drain None
(Note 1)
S0/PA0 to
S47/PF7
COM0/PL0 to
COM3/PL3
V1/PL4 to
V3/PL6
XT1 – None Input only None
XT2 – None Output for 32.768kHz crystal
– None CMOS Programmable
– None Input only None
– None Input only None
None
oscillation
Note 1 Attachment of Port0 programmable pull-up resistors is controllable in nibble units (P00-03, P04-07).
* Note 1: Connect as follows to reduce noise on VDD.
VSS1, VSS2 and VSS3 must be connected together and grounded.
*Note 2 : The power supply for the internal memory is VDD1 but it uses the VDD3 as the power supply for ports. When the
VDD3 is not backed up, the port level does not become “H” even if the port latch is in the “H” level. Therefore,
when the VDD3 is no t backed up and the p ort latc h is “H” level , the por t level is unstabl e in the HOLD mode, and
the back up time becomes shorter because the through current runs from VDD to GND in the input buffer.
If VDD3 is not backed up, output “L” by the program or pull the port to “L” by the external circuit in the HOLD
mode so that the port level becomes “L” level and unnecessary current consumption is prevented.
Power
supply
Back-up capacitors *2
LSI
VDD1
VDD2
VDD3
VSS3
VSS2 VSS1
No.6842-10/24
LC8772C8B/B2B/96B/80B
V
1. Absolute Maximum Ratings at Ta=25°C and VSS1=VSS2=VSS3=0V
Parameter Symbol Pins Conditions
Supply voltage VDDMAX VDD1,VDD2,VDD3 VDD1=VDD2
Supply voltage
for LCD
Input voltage VI Port L
Input/Output
voltage
High
level
output
current
Low
level
output
current
consumption
Operating
temperature
range
Storage
temperature
range
Peak
output
current
Total
output
current
Peak
output
current
Total
output
current
VLCD V1/PL4, V2/PL5,
VI0(1) •Port0, 1, 3, 7, 8
IOPH(1) Port 0, 1, 3 •CMOS output
IOPH(2) Port 7 1 ,72,73 Current at each pin -3
IOPH(3) Port A, B, C, D, E, F Current at each pin -5
IOAH(1)
Σ
IOAH(2)
Σ
IOAH(3)
Σ
IOAH(4)
Σ
IOAH(5)
Σ
IOPL(1) Port 0, 1, 32-3 5 Current at each pin 20
IOPL(2) Port 30, 31 Current at each pin 30
IOPL(3) Port 7,8 Current at each pin 5
IOPL(4) Port A, B,C, D, E, F Current at each pin 15
IOAL(1)
Σ
IOAL(2)
Σ
IOAL(3)
Σ
IOAL(4)
Σ
IOAL(5)
Σ
Pdmax
Topg -30 70
Tstg -55 125
V3/PL6
XT1,XT2,CF1,
•Port A, B, C, D, E, F
Port 0, 1, 32, 33, 34, 35 Total of all pins -40
Port 30, 31 Total of all pins -10
Port 7 Total of all pins -5
Port A, B, C Total of all pins -25
Port D, E, F Total of all pins -25
Port 0, 1, 32, 33, 34, 35 Total of all pins 60
Port 30, 31 Total of all pins 60
Port 7,8 Total of all pins 20
Port A,B,C Total of all pins 40
Port D, E, F Total of all pins 40
QIP100E Maximum power
SQFP100
RES
=VDD3
VDD1=VDD2
=VDD3
-0.3 VDD+0.3
-0.3 VDD+0.3
selected
•Current at each pin
Ta = -30 to +70°C
Ratings
[V]
DD
min. typ. max.
-0.3 +7.0
-0.3 VDD
-10
unit
V
mA
mW
C
°
No.6842-11/24
LC8772C8B/B2B/96B/80B
2. Recommended Operating Range at Ta=-30°C to +70°C, VSS1=VSS2=VSS3=0V
Parameter Symbol Pins Conditions
Operating
supply voltage
range
VDD(1)
VDD(2)
VDD1=VDD2=VDD3
0.294µs ≤ t
200µs
0.735µs ≤ t
CYC
CYC
200µs
Supply voltage
range in Hold
mode
Input high
voltage
VHD VDD1 Keep RAM and
register data in
HOLD mode.
VIH(1) •Port 0, 3, 8
Output disable 2.5 to 6.0 0.3VDD
•Port A,B,C,D,E,F,L
VIH(2) •Port 1
Output disable 2.5 to 6.0 0.3VDD
•Port 71,72, 73
•P70 port input/interrupt
VIH(3) P87 small signal input Output disable 2.5 to 6.0 0.75VDD VDD
VIH(4) Port 70
Output disable 2.5 to 6.0 0.9VDD VDD
Watchdog timer
Input low
voltage
VIH(5)
XT1, XT2, CF1,
VIL(1) •Port 0, 3, 8
•Port A,B,C,D,E,F,L
VIL(2) •Port 1
RES
2.5 to 6.0 0.75VDD VDD
Output disable 2.5 to 6.0 VSS 0.15VDD
Output disable 2.5 to 6.0 VSS 0.1VDD
•Port 71,72, 73
•P70 port input/interrupt
VIL(3) Port 87 small signal input Output disable 2.5 to 6.0 VSS 0.25VDD
VIL(4) Port 70
Output disable 2.5 to 6.0 VSS 0.8VDD
Watchdog timer
VIL(5)
CYC
t
XT1,XT2,CF1,
RES
2.5 to 6.0 VSS 0.25VDD
cycle time
External system
clock
frequency
FEXCF(1) CF1
•system clock
divider :1/1
•external clock
DUTY = 50±5%
≤
≤
Ratings
[V]
VDD
min. typ. max.
4.5 6.0
2.5 6.0
2.0 6.0
+0.7
+0.7
4.5 to 6.0 0.294 200 Operation
2.5 to 6.0 0.735 200
4.5 to 6.0 0.1 10 •CF2 open
2.5 to 6.0 0.1 4
VDD
VDD
+0.4
+0.4
-1.0
unit
V
s
µ
MHz
•CF2 open
4.5 to 6.0 0.2 20
•system clock
divider :1/2
2.5 to 6.0 0.2 8
Continued/
No.6842-12/24
LC8772C8B/B2B/96B/80B
Parameter Symbol Pins Conditions
Oscillation
frequency
range
(Note 1)
FmCF(1) CF1, CF2 10MHz ceramic resonator
oscillation
Refer to figure 1
FmCF(2) CF1, CF2 4MHz ceramic resonator
oscillation
Refer to figure 1
FmRC RC oscillation 2.5 to 6.0 0.3 1.0 2.0
Ratings
VDD[V] min. typ. max.
4.5 to 6.0 10
2.5 to 6.0 4
unit
MHz
FsX’tal XT1, XT2 32.768kHz crystal resonator
oscillation
Refer to figure 2
2.5 to 6.0 32.768 kHz
(Note 1) The port value of oscillation circuit is shown in table 1 and table 2.
No.6842-13/24
LC8772C8B/B2B/96B/80B
3. Electrical Characteristics at Ta=-30°C to +70°C, VSS1=VSS2=VSS3=0V
Parameter Symbol Pins Conditions
High level
input
current
IIH(1) •Port 0,1,3,7,8
•Port A,B,C,D,E,F,L
•Output disabled
•Pull-up resister OFF.
•VIN=VDD
(including OFF state leak
current of the output Tr.)
IIH(2)
RES
VIN=VDD 2.5 to 6.0 1
IIH(3) XT1,XT2 When configured as an input
port
VIN=VDD
IIH(4) CF1 VIN=VDD 2.5 to 6.0 15
Low level
input
current
IIH(5) P87/AN7/MICIN
small signal input
IIL(1) •Port 0,1,3,7,8
•Port A,B,C,D,E,F,L
VIN=V
(V
+0.5V
BIS
: Bias voltage)
BIS
•Output disabled
•Pull-up resister OFF.
•VIN=VSS
(including OFF state leak
current of the output Tr.)
IIL(2)
RES
VIN=VSS 2.5 to 6.0 -1
IIL(3) XT1,XT2 When configured as an input
port
VIN=VSS
IIL(4) CF1 VIN=VSS 2.5 to 6.0 -15
High level
output
voltage
Low level
output
voltage
LCD output
voltage
regulation
IIL(5) P87/AN7/MICIN
small signal input
VOH(1) IOH=-1.0mA 4.5 to 6.0 VDD-1
VOH(2)
Port 0,1,3: CMOS
output option
VOH(3) Port 7 IOH=-0.4mA 2.5 to 6.0 VDD-1
VOH(4) IOH=-1.0mA 4.5 to 6.0 VDD-1
Port A,B,C,D,E,F
VOH(5)
VOL(1) IOL=10mA 4.5 to 6.0 1.5
Port 0,1,3
VOL(2)
VOL(3) Port 30,31 IOL=30mA 4.5 to 6.0 1.5
VOL(4) IOL=1mA 4.5 to 6.0 0.4
Port 7,8
VOL(5)
VOL(6) IOL=8mA 4.5 to 6.0 1.5
Port A,B,C,D,E,F
VOL(7)
VODLS S0–S47 I0=0mA
VIN=V
(V
-0.5V
BIS
: Bias voltage)
BIS
IOH=-0.1mA 2.5 to 6.0 VDD-0.5
IOH=-0.1mA 2.5 to 6.0 VDD-0.5
IOL=1.6mA 2.5 to 6.0 0.4
IOL=0.5mA 2.5 to 6.0 0.4
IOL=1.4mA 2.5 to 6.0 0.4
VLCD, 2/3VLC D,
1/3VLCD level output
Refer to figure 8
4. Serial Input/Output Characteristics at Ta=-30°C to +70°C, VSS1=VSS2=VSS3=0V
Parameter Symbol Pins Conditions
Cycle time tSCK(1) 4/3
SCK0(P12) Refer to figure 6 2.0 to 6.0
Ratings
VDD[V] min. typ. max.
unit
CYC
t
pulse width
pulse width
Input clock
Cycle time tSCK(2)
Low level
pulse width
High level
pulse width
Cycle time tSCK(3)
Serial clock
pulse width
pulse width
Output clock
Cycle time tSCK(4)
Low level
pulse width
High level
pulse width
Data set-up time
Data hold time t
Serial input
Output delay
time
Serial output
tSCKL(1)
tSCKLA(1)
tSCKH(1)
tSCKHA(1)
tSCKL(2)
tSCKH(2)
tSCKL(3)
tSCKLA(2)
tSCKH(3)
tSCKHA(2)
tSCKL(4)
tSCKH(4)
sDI
t
hDI
tdDO SO0(P12),
SCK1(P15) Refer to figure 6 2.5 t o 6.0
SCK0(P12) •CMOS output
SCK1(P15) •CMOS output
SI0(P10),
SI1(P13),
SB0(P11),
SB1(P14)
SO1(P15),
SB0(011),
SB1(P14)
•Refer to figure 6
•Refer to figure 6
•Measured with resp ect
to SI0CLK leading
edge.
•Refer to figure 6
•When Port is open
drain:
Time delay form
SIOCLK trailing edge
to the SO data chan ge
•Refer to figure 6
2/3 Low level
2/3
2/3 High level
3
2
1
1
2.5 to 6.0
2.5 to 6.0
4.5 to 6.0 0.03
2.5 to 6.0 0.1
4.5 to 6.0 0.03
2.5 to 6.0 0.1
4.5 to 6.0 1/3
2.5 to 6.0 1/3
4/3
1/2 Low level
3/4
1/2 High level
2
2 tCYC
1/2
1/2
tCYC
+0.05
tCYC
+0.25
tSCK
tSCK
s
µ
No.6842-16/24
LC8772C8B/B2B/96B/80B
5. Pulse Input Conditions at Ta=-30°C to +70°C, VSS1=VSS2=VSS3=0V
Parameter Symbol Pins Conditions
pulse width
tPIH(1)
tPIL(1)
tPIH(2)
tPIL(2)
tPIH(3)
tPIL(3)
tPIH(4)
tPIL(4)
tPIL(5)
tPIL(5)
tPIL(6)
INT0(P70),
INT1(P71),
INT2(P72)
INT3(P73)
(Noise rejection ratio
is 1/1.)
INT3(P73)
(Noise rejection ratio
is 1/32.)
INT3(P73)
(Noise rejection ratio
is 1/128.)
MICIN(P87) •Condition that signal is
RES
•Condition that reset is
•Condition that interrupt is
accepted
•Condition that event input
to timer 0 is accepted
•Condition that interrupt is
accepted
•Condition that event input
to timer 0 is accepted
•Condition that interrupt is
accepted
•Condition that event input
to timer 0 is accepted
•Condition that interrupt is
accepted
•Condition that event input
to timer 0 is accepted
accepted to small signal
detection counter.
accepted
Ratings
VDD[V] min. typ. max.
2.5 to 6.0 1
2.5 to 6.0 2
2.5 to 6.0 64
2.5 to 6.0 256
2.5 to 6.0 1
2.5 to 6.0 200
unit
CYC
t
High/low level
s
µ
6. AD Converter Characteristics at Ta=-30°C to + 70°C, VSS1=VSS2=VSS3=0V
Parameter Symbol Pins Conditions
Resolution N 3.0 to 6.0 8 bit
Absolute precision ET (Note2) 3.0 to 6.0
Conversion time TCAD
Analog input
voltage range
current
VAIN 3.0 to 6.0 VSS VDD V
IAINH VAIN=VDD 3.0 to 6.0 1 Analog port input
IAINL
AN0(P80)
–AN7(P87)
AN8(P70)
AN9(P71)
AN10(XT1)
AN11(XT2)
AD conversion time
= 32 × tCYC
(ADCR2=0)
(Note 3)
AD conversion time
= 64 × tCYC
(ADCR2=1)
(Note 3)
VAIN=VSS 3.0 to 6.0 -1
Ratings
VDD[V] min. typ. max.
4.0 to 6.0 15.62
(tCYC=
0.488µs)
3.0 to 6.0 23.52
(tCYC=
0.735µs)
4.5 to 6.0 18.82
(tCYC=
0.294µs)
3.0 to 6.0 47.04
(tCYC=
0.735µs)
±
97.92
(tCYC=
3.06µs)
97.92
(tCYC=
3.06µs)
97.92
(tCYC=
1.53µs)
97.92
(tCYC=
1.53µs)
1.5
unit
LSB
µ
s
µ
A
(Note 2) Abso lute precision does not include quantizing error (±1/2 LSB).
(Note 3) Conversion time means time from executing AD conversion instruction to loading complete digital value to register.
No.6842-17/24
LC8772C8B/B2B/96B/80B
7. Current Consumption Characteri stics at Ta=-30°C to +70°C, VSS1=VSS2=VSS3=0V
Parameter Symbol Pins Conditions
Current consumption
during normal
operation
(Note 4)
IDDOP(1) •FmCF=10MHz
IDDOP(2) •CF1=20MHz external
IDDOP(3) 4.5 to 6.0
IDDOP(4)
VDD1=
VDD2=
VDD3
Ceramic resonator
oscillation
•FsX’tal=32.768kHz
crystal oscillation
•System clock: CF
10MHz oscillation
•Internal RC oscillation
stopped.
•Divider : 1/1
clock
•FsX’tal=32.768kHz
crystal oscillation
•System clock: CF1
oscillation
•Internal RC oscillation
stopped.
•Divider :1/ 2
•FmCF=4M Hz Ceramic
resonator oscillation
•FsX’tal=32.768kHz
crystal oscillation
•System clock: CF
4MHz oscillation
•Internal RC oscillation
stopped.
•Divider :1/ 1
Ratings
VDD[V] min. typ. max
4.5 to 6.0
4.5 to 6.0
2.5 to 4.5
unit
mA
IDDOP(5) 4.5 to 6.0
IDDOP(6)
IDDOP(7) 4.5 to 6.0
IDDOP(8)
•FmCF=0Hz (No
oscillation)
•FsX’tal=32.768kHz
crystal oscillation
•System clock: RC
oscillation
•Divider :1/ 2
•FmCF=0Hz (No
oscillation)
•FsX’tal=32.768kHz
crystal oscillation
•System clock:
32.768kHz
•Internal RC oscillation
stopped.
•Divider :1/ 2
2.5 to 4.5
2.5 to 4.5
A
µ
Continued/
No.6842-18/24
LC8772C8B/B2B/96B/80B
V
V
V
Parameter Symbol Pins Conditions
Current
consumption
during
HALT mode
(Note 4)
IDDHALT(1) HALT mode
IDDHALT(2) HALT mode
DD1=
•FmCF=10MHz Cera mic
DD2=
DD3
resonator oscillation
•FsX’tal=32.768kHz
crystal oscillation
•System clock :
CF 10MHz oscillation
•Internal RC oscillation
stopped.
•Divider: 1/1
•CF1=20MHz for extern al
clock
•FsX’tal=32.768kHz
crystal oscillation
•System clock :
CF1 oscillation
•Internal RC oscillation
stopped.
•Divider :1/2
Ratings
VDD[V] min. typ. max.
4.5 to 6.0
4.5 to 6.0
unit
mA
IDDHALT(3) 4.5 to 6.0
IDDHALT(4)
IDDHALT(5) 4.5 to 6.0
IDDHALT(6)
IDDHALT(7) 4.5 to 6.0
IDDHALT(8)
HALT mode
HALT mode
HALT mode
•FmCF=4M Hz Ceramic
resonator oscillation
•FsX’tal=32.768kHz
crystal oscillation
•System clock :
CF 4MHz oscillation
•Internal RC oscillation
stopped.
•Divider: 1/1
•FmCF=0Hz
(Oscillation stop)
•FsX’tal=32.768kHz
crystal oscillation
•System clock :
RC oscillation
•Divider: 1/2
•FmCF=0Hz
(Oscillation stop)
•FsX’tal=32.768kHz
crystal oscillation
•System clock : 32.768kHz
•Internal RC oscillation
stopped.
•Divider: 1/2
2.5 to 4.5
2.5 to 4.5
2.5 to 4.5
A
µ
Continued/
No.6842-19/24
LC8772C8B/B2B/96B/80B
Parameter Symbol Pins Conditions
during HOLD mode
during Date/time
clock HOLD mode
IDDHOLD(1) 4.5 to 6.0 Current consumption
IDDHOLD(2)
IDDHOLD(3) 4.5 to 6.0 Current consumption
IDDHOLD(4)
VDD1 HOLD mode
•CF1=VDD or open
(when using external
clock)
VDD1 Date/time clock HOLD
mode
•CF1=VDD or open
(when using external
clock)
•FmX’tal=32.768kHz
crystal oscillation
Ratings
VDD[V] min. typ. max.
2.5 to 4.5
2.5 to 4.5
(Note 4) The currents through the output transistors and the pull-up MOS transistors are ignored.
unit
A
µ
No.6842-20/24
LC8772C8B/B2B/96B/80B
Main system clock osci llation circuit characteristics
The characteristics in the table bellow is based on the following conditions:
1. Use the standard evaluation board SANYO has provided.
2. Use the peripheral parts with indicated value externally.
3. The peripheral parts value is a recommended value of oscillator manufacturer
Table 1. Main system clock oscillation circuit cha racteris tics using ceramic resonator
Frequency Manufacturer Oscillator
10MHz
4MHz
Circuit parameters
C1 C2 Rd1
supply voltage
Operating
range
Oscillation
stabilizing time
typ max
Notes
The oscillation stabilizing time is a period until the oscillation becomes stable after VDD becomes higher than
minimum operating voltage. (Refer to Figure4)
The characteristics in the table bellow is based on the following conditions:
1. Use the sta nda rd evaluation board SANYO has pro vided.
2. Use the peripheral parts with indicated value externally.
3. The peripheral parts value is a recommended value of oscillator manufacturer
Table 2. Subsystem clock oscillation circuit characteristics using crysta l oscil lator
Frequency Manufacturer Oscillator
32.768kHz
Circuit parameters
C3 C4 Rf Rd2
Operating
supply voltage
range
Oscillation
stabilizing time
typ max
Notes
The oscillation stabilizing time is a period until the oscillation becomes stable after executing the instruction which starts the
sub-clock oscillation or after releasing the HOLD mode. (Refer to Figure4)
(Notes) • Since the circuit pattern affects the oscillation frequency, place the oscillation-related parts as close to
the oscillation pins as possible with the shortest possible pattern length.