(2) Random Access Memory (RAM): LC8766C8A/B2A/96A 4096 × 9 bits
(3) Minimum Bus Cycle Time: 100ns (10MHz)
Note: The bus cycle time indicates ROM read time.
(4) Minimum Instruction Cycle Time: 300ns (10MHz)
(5) Ports
- Input/output ports
Data direction programmable for each bit individually : 20 (P1n, P70 to P73, P8n)
- 15V withstand input/output ports
Data direction programmable in nibble units : 8 (P0n)
(When N-channel open drain output is selected, data can be input in bit units.)
Data direction programmable for each bit individually : 8 (P3n)
- Input ports : 2 (XT1,XT2)
- VFD output ports
Large current outputs for digits : 9 (S0 / T0 to S8 / T8)
Large current outputs for digits / segments : 7 (S9 / T9 to S15 / T15)
digit / segment outputs : 8 (S16 to S23)
segment outputs : 28 (S24 to S51)
- Programmable segment/digit output pattern
Output can be switched between digit/segment waveform output (pins 9 to 24 can be used for output of digit
waveforms).
parallel-drive available for large current VFD.
- 16-step dimmer function available
(7) Weak signal detection (MIC signals etc)
- Counts pulses with width greater than a preset value
- 2 bit counter
(8) Timers
- Timer 0: 16 bit timer / counter with capture register
Mode 0: 2 channel 8-bit timer with programmable 8 bit prescaler and 8 bit capture register
Mode 1: 8 bit timer with 8 bit programmable prescaler and 8 bit capture register + 8 bit
Counter with 8-bit capture register
Mode 2: 16 bit timer with 8 bit programmable prescaler and 16 bit capture register
Mode 3: 16 bit counter with 16 bit capture register
- Timer 1: PWM / 16 bit timer toggle output
Mode 0: 2 channel 8 bit timer (with toggle output)
Mode 1: 2 channel 8 bit PWM
Mode 2: 16 bit timer (with toggle output) Toggle output also possible using lower order 8 bits.
Mode 3: 16 bit timer (with toggle output) Lower order 8 bits can be used as PWM output.
No.6718-2/23
LC8766C8A/B2A/96A
- Base Timer
1) The clock signal can be selected from any of the following :
Sub-clock (32.768kHz crystal oscillator), system clock, and prescaler output from timer 0
2) Interrupts can be selected to occur at one of five different times.
(9) High speed clock counter
1) Capable of counting maximum : 20MHz clock (Using main clock 10MHz)
2) Real time output
(10) Serial-interface
- SIO 0: 8 bit synchronous serial Interface
1) LSB first / MSB first function available
2) Internal 8 bit baud-rate generator (maximum transmit clock period 4 / 3 Tcyc)
3) Continuous automatic data communication (1-256 bits)
- SIO 1: 8 bit asynchronous / synchronous serial interface
Mode 0: Synchronous 8 bit serial IO (2-wire or 3-wire, transmit clock 2–512 Tcyc)
Mode 1: Asynchronous serial IO (half duplex, 8 data bits, 1 stop bit, baud rate 8–2048Tcyc)
Mode 2: Bus mode 1 (start bit, 8 data bits, transmit clock 2–512 Tcyc)
Mode 3: Bus mode 2 (start detection, 8 data bits, stop detection)
(11) AD converter
-8 bits × 12 channels
(12) Remote control receiver circuit (connected to P73 / INT3 / T0IN terminal)
-Noise rejection function (noise rejection filter time constant can selected from 1 / 32 / 128 Tcyc)
(13) Watchdog timer
- The watching timer period is set using an external RC.
- Watchdog timer can produce interrupt, system reset
1) Three priority (low, high and highest) multiple interrupts are supported. During interrupt handling, an equal or
lower priority interrupt request is refused.
2) If interrupt requests to two or more vector addresses occur at once, the higher priority interrupt takes precedence.
In the case of equal priority levels, the vector with the lowest address takes precedence.
(15) Subroutine stack levels: 2048 levels max. Stack is located in RAM.
(16) Multiplication and division
- 16 bit × 8 bit (executed in 5 cycles)
- 24 bit × 16 bit (12 cycles)
- 16 bit ÷ 8 bit (8 cycles)
- 24 bit ÷ 16 bit (12 cycles)
(17) Oscillation circuits
- On-chip RC oscillation circuit for system clock use.
- On-chip CF oscillation circuit for system clock use. (R
- On-chip Crystal oscillation circuit low speed system clock use. (Rd, R
built in)
f
external)
f
(18) System clock divider function
- Able to reduce current consumption
Available minimum instruction cycle time: 300ns, 600ns, 1.2µs, 4.8µs, 9.6µs, 19.2µs, 38.4µs, 76.8µs.
(Using 10MHz main clock)
No.6718-3/23
LC8766C8A/B2A/96A
(19) Standby function
- HALT mode
HALT mode is used to reduce power consumption. Program execution is stopped. Peripheral circuits still
operate but VFD display and some serial transfer operations stop.
1) Oscillation circuits are not stopped automatically.
2) Release occurs on system reset or by interrupt.
-HOLD mode
HOLD mode is used to reduce power consumption. Both program execution and peripheral circuits are
stopped.
2) Release occurs on any of the following conditions.
(1) input to the reset pin goes low
(2) a specified level is input at least one of INT0, INT1, INT2
(3) an interrupt condition arises at port 0
-X’tal HOLD made
X’tal HOLD mode is used to reduce power consumption. Program execution is stopped.
All peripheral circuits except the base timer are stopped.
1) CF and RC oscillation circuits stop automatically.
2) Crystal oscillator is maintained in its state at HOLD mode inception.
3) Release occurs on any an any of the following conditions
(1) input to the reset pin goes low
(2) a specified level is input to at least one of INT0, INT1, INT2
(3) an interrupt condition arises at port 0
(4) an interrupt condition arises at the base-timer
capture input
AD input port: AN8(P70), AN9(P71)
The following types of interrupt detection are possible:
INT0
INT1
INT2
INT3
Rising Falling Rising/
falling
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
No
Yes
Yes
H level L level
Yes
Yes
No
No
Yes
Yes
No
No
Yes
Yes
Yes
No
No.6718-7/23
LC8766C8A/B2A/96A
Pin name I/O Function description Option
PORT8
P80 to P87
S0/T0 to
S6/T6
S7/T7 to
S8/T8
S9/T9 to
S15/T15
S16 to S23 I/O • Output for VFD display controller segment/digit
S24 to S31 I/O • Output for VFD display controller segment
S32 to S39
S40 to S47
S48 to S51
RES
XT1 I • Input for 32.768kHz crystal oscillation
XT2 I/O • Output for 32.768kHz crystal oscillation
CF1 I Input terminal for ceramic oscillator No
CF2 O Output terminal for ceramic oscillator No
I/O • 8bit Input/output port
• Input/out put can be specified in a bit unit
• Other func tions:
AD input port: AN0 to AN7
Weak signal detector input port: MICIN(P87)
O • Large current output for VFD disp lay controller digit (can be used for segment) Yes
O • Large current output for VFD disp lay controller digit (can be used for segment) No
O • Large current output for VFD display controller segment/digit No
• Other func tions:
High voltage input port: PC0 to PC7
• Other func tions:
High voltage input port: PD0 to PD7
I/O • Output for V FD display controller segment
• Other func tions
High voltage input port: PE0 to PE7
I/O • Output for V FD display controller segment
• Other func tions:
High voltage input/output port: PF0 to PF7
I/O • Output for V FD display controller segment
• Other func tions:
High voltage input/output port: PG0 to PG3
I Reset terminal No
• Other func tions:
General purpose input port
When not in use, connect to VDD1.
AD input port: AN10
• Other func tions:
General purpose input port
When not in use, set to oscillation mode and leave open circuit.
AD input port: AN11
No
No
No
Yes
Yes
No
No
No
No.6718-8/23
LC8766C8A/B2A/96A
Port Output Configuration
Output configuration and pull-up/pull-down resistor options are shown in the following table.
Input /output is possible even when port is set to output mode.
Terminal Option applies to: Options Output Format Pull-up resistor
1 CMOS Programmable
(Note 1)
2 15 voltage Nch-open drain None 1 CMOS Programmable - P10 to P17 each bit
2 Nch-open drain Programmable 1 CMOS Programmable - P30 to P37 each bit
1 High voltage Pch-open drain - Fixed S0/T0 to S6/T6 each bit
2 High voltage Pch-open drain - None
S7/T7 to S15/T15
S16 to S31
- None High voltage Pch-open drain - fixed
1 High voltage Pch-open drain - Fixed S32 to S47 each bit
Pull-down
resistor
- P00 to P07 1 bit units
2 High voltage Pch-open drain - None
S48 to S51 - None High voltage Pch-open drain - None
XT1 - None Input only None XT2 - None Output for 32.768kHz crystal
oscillation
None -
Note 1 Programmable pull-up resisters of Port 0 can be attatched in nibble units (P00-03, P04-07).
* Note 1: Connect as follows to reduce noise on VDD and increase the back-up time.
VSS1, and VSS2 must be connected together and grounded.
*Note 2 : The power supply for the internal memory is VDD1 but it uses the VDD2 as the power supply for ports. When the
VDD2 is not backed up, the port level does not become “H” even if the port latch is in the “H” level. Therefore,
when the VDD2 is no t backed up and the p ort latc h is “H” level , the por t level is unstabl e in the HOLD mode, and
the back up time becomes shorter because the through current runs from VDD to GND in the input buffer.
If VDD2 is not backed up, output “L” by the program or pull the port to “L” by the external circuit in the HOLD
mode so that the port level becomes “L” level and unnecessary current consumption is prevented.
Power
Back-up capacitors *2
LSI
VDD1
VDD2
VDD3
VFD
VDD4
VSS2 VSS1
No.6718-9/23
LC8766C8A/B2A/96A
1. Absolute Maximum Ratings at Ta=25°C and VSS1=VSS2=0V
Parameter Symbol Pins Conditions
Supply voltage VDDMAX VDD1,VDD2,
VDD3,VDD4
Input voltage
VI(1)
XT1,XT2,CF1,
RES
VDD1=VDD2=
VDD3=VDD4
-0.3 VDD+0.3
VI(2) VP VDD-45 VDD+0.3
Output voltage VO(1) S0/T0 to S15/T15 VDD-45 VDD+0.3
Input/Output
voltage
VIO(1) •Port 0: CMOS output
option
-0.3 VDD+0.3
•Port 1
•Port 3: CMOS output
option
•Port 7
•Port 8
VIO(2) •Port 0 open drain
-0.3 15
•Port 3 open drain
VIO(3) S16 to S51 VDD-45 VDD+0.3
High
level
output
current
Peak
output
current
IOPH(1) Port 0, 1, 3 •CMOS output
selected
•Current at each pin
IOPH(2) Port71,72,73 Current at each pin -3
IOPH(3) S0/T0 to S15/ T1 5 Current at each pin -30
IOPH(4) S16 to S51 Current at each pin -15
Total
output
current
Low
level
output
Peak
output
current
current
Total
output
current
Maximum power
IOAH(1) Port 0 Total of all pins -30
Σ
IOAH(2) Port 1,3 Total of all pins -30
Σ
IOAH(3) Port 7 Total of all pins -5
Σ
IOAH(4) S0/T0 to S15/T15 Total of all pins -65
Σ
IOAH(5) S16 to S27 Total of all pins -60
Σ
IOAH(6) S28 to S39 Total of all pins -60
Σ
IOAH(7) S40 to S51 Total of all pins -60
Σ
IOPL(1) Port 02,03 For each pin 30
IOPL(2) •Port 00,01,04 to 07
For each pin 20
•Port 1,3
IOPL(3) Port 7, 8 For each pin 5
IOAL(1) Port 00,01,02,03 For each pin 60
Σ
IOAL(2) •Port 04,05,06,07
Σ
For each pin 50
•Port 1,3
IOAL(3) Ports 7,8 For each pin 20
Σ
Pdmax QIP100E Ta = -30 to+70°C 450 mW
dissipation
Operating
Topr -30 70
temperature
range
Storage
Tstg -55 125
temperature
range
Ratings
min. typ. max.
[V]
VDD
-0.3 +7.0
-10
unit
V
mA
°
C
No.6718-10/23
LC8766C8A/B2A/96A
2. Recommended Operating Range at Ta=-30°C to +70°C, VSS1=VSS2=0V
Parameter Symbol Pins Conditions
Operating
supply voltage
VDD(1) VDD1=VDD2=VDD3
=VDD4
0.294µs ≤ Tcyc
200µs
≤
range
Hold voltage VHD VDD1 RAM and the
register data are
kept in HOLD
mode.
Pull-down
VP VP 4.5–6.0 -35 VDD
voltage
Input high
voltage
VIH(1) •Port 0,3: CMOS output
option
•Port 8
VIH(2) Port 0,3: N-ch open drain
Output disable 4.5–6.0 0.3VDD
Output disable 4.5–6.0 0.3VDD
output
VIH(3) •Port 1
•Port71,72,73
Output disable 4.5–6.0 0.3VDD
•P70 port input/interrupt
VIH(4) S16 to S51 Output P-channel
Tr. OFF
VIH(5) P70 Weak signal input Output disable 4.5–6.0 0.75VDD VDD
VIH(6) Port 70
Output disable 4.5–6.0 0.9VDD VDD
Watchdog timer
VIH(7) XT1, XT2, CF1,
4.5–6.0 0.75VDD VDD
RES
Ratings
[V]
VDD
4.5 6.0
2.0 6.0
4.5–6.0 0.3VDD
min. typ. max.
VDD
+0.7
13.5
+0.7
VDD
+0.7
VDD
+1.0
unit
V
Input low
voltage
Operation
cycle time
External system
clock
frequency
VIL(1) •Port 0,3: CMOS output
option
Output disable 4.5–6.0 VSS 0.15VDD
+0.4
•Port 8
VIL(2) Port 0,3: N-ch open drain
output
VIL(3) •Port 1
•Port 71,72, 73
Output disable 4.5–6.0 VSS 0.15VDD
+0.4
Output disable 4.5–6.0 VSS 0.1VDD
+0.4
•P70 port input/interrupt
VIL(4) S16 to S51 Output P-channel
4.5–6.0 -35 0.2VDD
Tr. OFF
VIL(5) Port 87 weak signal input Output disabled 4.5–6.0 VSS 0.25VDD
VIL(6) Port 70
Watchdog timer
VIL(7)
CYC
t
XT1,XT2,CF1,
4.5–6.0 0.294 200
RES
Output disabled 4.5–6.0 VSS 0.8VDD
-1.0
4.5–6.0 VSS 0.25VDD
fEXCF(1) CF1
•CF2 open circuit
4.5–6.0 0.1 10
•system clock
divider set to 1/1
•external clock
DUTY = 50±50%
•CF2 open circuit
4.5–6.0 0.2 20
•system clock
divider set to 1/2
Continued
s
µ
MHz
No.6718-11/23
LC8766C8A/B2A/96A
Parameter Symbol Pins Conditions
Oscillation
stabilizing
time period
(Note 1)
FmCF(1) CF1, CF2 10MHz ceramic resonator
oscillation
Refer to figure 1
FmCF(2) CF1, CF2 4MHz ceramic resonator
oscillation
Refer to figure 1
FmRC
FsX’tal XT1, XT2 32.768kHz crystal resonator
RC oscillation 4.5–6.0 0.3 1.0 2.0
oscillation
Refer to figure 2
(Note 1) The oscillation constant is shown in table 1 and table 2.
Ratings
VDD[V] min. typ. max.
4.5–6.0 10
4.5–6.0 4
4.5–6.0 32.768
unit
No.6718-12/23
LC8766C8A/B2A/96A
3. Electrical Charact eristics at Ta=-30°C to +70°C, VSS1=VSS2=0V
Parameter Symbol Pins Conditions
Input high
current
Input low
current
Output high
voltage
Output low
voltage
Pull-up
resistor
IIH(1) Ports 0,3: N-ch open
drain output
IIH(2) Port 0,1,3,7,8 •Output disabled
IIH(3) S16 to S51 without
pull-down resister
(Por t C,D,E ,F,G)
IIH(4)
IIH(5) XT1,XT2 When configured as an input
current of the output Tr.)
When configured as an input
port
VIN=VDD
port
VIN=VDD
VIN=VBIS+0.5V
(VBIS : Bias voltage)
•VIN=VSS
(including OFF state leak
current of the output Tr.)
VIN=VSS 4.5–6.0 -1
port
VIN=VSS
VIN=VBIS-0.5V
(VBIS : Bias voltage)
IOH=-0.1mA 4.5–6.0 VDD-0.5
IOH=-1.0mA
IOH at any single pin is not
over 1mA.
IOH=-1.0mA
IOH at any single pin is not
over 1mA.
IOL=1.6mA 4.5–6.0 0.4
Continued
Ratings
VDD[V] min. typ. max.
4.5–6.0 5
4.5–6.0 1
4.5–6.0 60
4.5–6.0 1
4.5–6.0 4.2 8.5 15
4.5–6.0 -1
4.5–6.0 -1
4.5–6.0 -15 -8.5 -4.2
4.5–6.0 VDD-1
4.5–6.0 VDD-1
unit
A
µ
V
No.6718-13/23
LC8766C8A/B2A/96A
Parameter Symbol Pins Conditions
S0/T0 to S15/T15,
S16 to S51 without
pull-down resistor
S16 to S51 with
pull-down resistor
RES
•
input
input
•VOUT=VSS
•Output P-ch Tr. OFF
•VOUT=VDD-40V
•Output P-ch Tr. OFF
•VOUT=3V
•Vp=-30V
4.5–6.0 0.1VDD
4.5–6.0 0.1VDD
connected to VSS.
•f=1MHz
•T
=25°C
a
4.5–6.0 0.12VDD Vpp
leak current
Resistance of
the low level
hold Tr.
High voltage
pull-down
resistor
Hysteresis
voltage
Pin
capacitance
Input
sensitivity
IOFF(1) •Output P-ch Tr. OFF
IOFF(2)
Rinpd S16 to S51 •Output P-ch Tr. OFF
Rpd S0/T0 to S15/T15,
VHIS(1) •Port 1,7
VHIS(2) Port 87 weak signal
CP All pins •All other terminals
Vsen Port 87 weak signal
VDD[V] min. typ. max.
4.5–6.0 -1 Output off-
4.5–6.0 -30
4.5–6.0 200
5.0 60 100 200
4.5–6.0 10 pF
Ratings
unit
A
µ
kΩ
V
No.6718-14/23
LC8766C8A/B2A/96A
4. Serial Input/Output Characteristics at Ta=-30°C to +70°C, VSS1=VSS2=0V
Parameter Symbol Pins Conditions
Cycle Time tSCK(1) 4/3
SCK0(P12) Refer to figure 6 4.5–6.0
VDD[V] min. typ. max.
Ratings
unit
CYC
t
pulse width
pulse width
Input clock
Cycle Time tSCK(2)
Low Level
pulse width
High Level
pulse width
Cycle Time tSCK(3)
Serial clock
pulse width
pulse width
Output clock
Cycle Time tSCK(4)
Low Level
pulse width
High Level
pulse width
Data set-up time
Data hold time t
Serial input
tSCKL(1)
tSCKLA(1)
tSCKH(1)
tSCKHA(1)
SCK1(P15) Refer to figure 6 4.5–6.0
tSCKL(2)
tSCKH(2)
SCK0(P12) •CMOS output option
tSCKL(3)
tSCKLA(2)
tSCKH(3)
tSCKHA(2)
SCK1(P15) •CMOS output option
tSCKL(4)
tSCKH(4)
sDI
t
0.03
hDI
SI0(P11),
SI1(P14),
SB0(P11),
SB1(P14)
•Refer to figure 6
•Refer to figure 6
•Measured with resp ect
to SI0CLK leading
edge.
•Refer to figure 6
4.5–6.0
4.5–6.0
4.5–6.0
2/3 Low Level
2/3
2/3 High Level
3
2
1
1
4/3
1/2 Low Level
3/4
1/2 High Level
2
2 tCYC
1/2
1/2
0.03
tSCK
tSCK
µ
s
Output delay time
Serial output
tdDO SO0(P10),
SO1(P13),
SB0(011),
SB1(P14)
•Measured with resp ect
to SI0CLK trailing
edge.
•When port is open
drain: Time delay
from SI0CLK trailing
edge to the SO data
change.
•Refer to figure 6
4.5–6.0
1/3
tCYC
+0.05
No.6718-15/23
LC8766C8A/B2A/96A
5. Pulse Input Conditions at Ta=-30°C to +70°C, VSS1=VSS2=0V
Parameter Symbol Pins Conditions
•Interrupt accept able
•Events to timer 0 can
be input.
•Interrupt accept able
•Events to timer 0 can
be input.
•Interrupt accept able
•Events to timer 0 can
be input.
•Interrupt accept able
•Events to timer 0 can
be input.
counter enabl ed
counter countable
pulse width
tPIH(1)
tPIL(1)
tPIH(2)
tPIL(2)
tPIH(3)
tPIL(3)
tPIH(4)
tPIL(4)
tPIH(5)
tPIL(5)
tPIH(6)
tPIL(6)
tPIL(7)
INT0(P70),
INT1(P71),
INT2(P72)
INT3(P73)
(Noise rejection ratio set
to 1/1.)
INT3(P73)
(Noise rejection ratio set
to 1/32.)
INT3(P73)
(Noise rejection ratio set
to 1/128.)
MICIN(P87) •Weak signal detection
NKIN(P72) •High speed clock
•Reset possible 4.5–6.0 200
RES
Ratings
VDD[V] min. typ. max.
4.5–6.0 1
4.5–6.0 2
4.5–6.0 64
4.5–6.0 256
4.5–6.0 1
4.5–6.0 1/12
unit
CYC
t
µ
High/low level
s
6. AD Converter Characteristics at Ta=-30°C to + 70°C, VSS1=VSS2=0V
Parameter Symbol Pins Conditions
Resolution N 4.5–6.0 8 bit
Absolute precision ET (Note2) 4.5–6.0
Conversion time TCAD
Analog input
voltage range
current
VAIN 4.5–6.0 VSS VDD V
IAINH VAIN=VDD 4.5–6.0 1
IAINL
AN0(P80) to
AN7(P87)
AN8(P70),
AN9(P71)
AN10(XT1),
AN11(XT2)
AD conversion time
= 32 × tCYC
(ADCR2=0)
(Note 3)
AD conversion time
= 64 × tCYC
(ADCR2=1)
(Note 3)
VAIN=VSS 4.5–6.0 -1
Ratings
VDD[V] min. typ. max.
4.5–6.0
15.62
(tCYC=
0.488µs)
18.82
(tCYC=
0.294µs)
±
97.92
(tCYC=
3.06µs)
97.92
(tCYC=
1.53µs)
unit
1.5 LSB
s
µ
A Analog port input
µ
(Note 2) Absolute precision not including quantizing error (±1/2 LSB).
(Note 3) Conversion time means time from executing AD conversion instruction to loading complete digital value to register.
No.6718-16/23
LC8766C8A/B2A/96A
7. Current Dissipation Characteristics at Ta=-30°C to +70°C, VSS1=VSS2=0V
Parameter Symbol Pins Conditions
Current dissipation
during basic
operation
(Note 4)
IDDOP(1) •FmCF=10MHz for
IDDOP(2) •CF1=20MHz for
IDDOP(3) •FmCF=4MHz Ceramic
IDDOP(4) •FmCF=0Hz (No
IDDOP(5)
VDD1=
VDD2=
VDD3=
VDD4
Ceramic resonator
oscillation
•FsX’tal=32.768kH z f or
crystal oscillation
•System clock: CF
oscillation
•Internal RC oscillation
stopped.
•Divider set to 1/1
external clock
•FsX’tal=32.768kH z f or
crystal oscillation
vSystem clock: CF
oscillation
•Internal RC oscillation
stopped.
•Divider set to 1/2
resonator oscillation
•FsX’tal=32.768kH z f or
crystal oscillation
•System clock: CF
oscillation
•Internal RC oscillation
stopped.
•Divider set to 1/1
oscillation)
•FsX’tal=32.768kH z f or
crystal oscillation
•System clock: RC
oscillation
•Divider set to 1/2
•FmCF=0Hz (No
oscillation)
•FsX’tal=32.768kH z f or
crystal oscillation
•System clock:
32.768kHz
•Internal RC oscillation
stopped.
•Divider set to 1/2
Ratings
VDD[V] min. typ. max
4.5–6.0 10 30
4.5–6.0 11 31
4.5–6.0 4.6 17
4.5–6.0 1 10
4.5–6.0 40 140 µA
unit
mA
Continued
No.6718-17/23
LC8766C8A/B2A/96A
=
=
=
Parameter Symbol Pins Conditions
Current dissipation
HALT mode
(Note 4)
IDDHALT(1) HALT mode
IDDHALT(2) HALT mode
IDDHALT(3)
IDDHALT(4) HALT mode
IDDHALT(5) HALT mode
VDD1
VDD2
VDD3
VDD4
•FmCF=10MHz for
Ceramic resonator
oscillation
•FsX’tal=32.768kH z f or
crystal oscillation
•System clock :
CF oscillation
•Internal RC oscillation
stopped.
•Divider: 1/1
•CF1=20MHz for extern al
clock
•FsX’tal=32.768kH z f or
crystal oscillation
•System clock :
CF oscillation
•Internal RC oscillation
stopped.
•Divider 1/2
HALT mode
•FmCF=4M Hz for Ceramic
resonator
oscillation
•FsX’tal=32.768kH z f or
crystal oscillation
•System clock :
CF oscillation
•Internal RC oscillation
stopped.
•Divider: 1/2
•FmCF=0Hz
(When oscillation stops.)
•FsX’tal=32.768kH z f or
crystal oscillation
•System clock :
RC oscillation
•Divider: 1/2
•FmCF=0Hz
(When oscillation stops.)
•FsX’tal=32.768kH z f or
crystal oscillation
•System clock : 32.768kHz
•Internal RC oscillation
stopped.
•Divider: 1/2
Ratings
VDD[V] min. typ. max.
4.5 to 6.0 4 12
4.5 to 6.0 4.8 13
4.5 to 6.0 1.8 6
4.5 to 6.0 500 1600
4.5 to 6.0 25 100
unit
mA
µ
A
Continued
No.6718-18/23
LC8766C8A/B2A/96A
Parameter Symbol Pins Conditions
Current dissipation
HOLD mode
Current dissipation
Date/time clock
HOLD mode
IDDHOLD(1) VDD1 HOLD mode
•CF1=VDD or open
circuit (when using
external clock)
IDDHOLD(2) VDD1 Date/time clock HOLD
mode
•CF1=VDD or open
circuit (when using
external clock)
•FmX’tal=32.768kHz
for crystal oscillation
Ratings
VDD[V] min. typ. max.
4.5 to 6.0 0.05 25
4.5 to 6.0 20 90
(Note 4) The currents of the output transistors and the pull-up MOS transistors are ignored.
unit
A
µ
No.6718-19/23
LC8766C8A/B2A/96A
Main system clock osci llation circuit characteristics
The characteristics in the table bellow is based on the following conditions:
1. Use the standard evaluation board SANYO has provided.
2. Use the peripheral parts with indicated value externally.
3. The peripheral parts value is a recommended value of oscillator manufacturer
Table 1. Main system clock oscillation circuit characteristics using ceramic resonator
Frequency Manufacturer Oscillator
CST10.0MTW (30pF) (30pF) 0Ω 4.5 to 6.0V 0.06ms 0.2ms Built in C1, C2 Murata
10MHz
4MHz
The oscillation stabilizing time is a period until the oscillation becomes stable after VDD becomes higher than minimum operating voltage. (Refer to Figure4)
CSTS0400MG03 (15pF) (15pF) 680Ω 4.5 to 6.0V 0.03ms 0.15ms Built in C1, C2 Murata
The characteristics in the table bellow is based on the following conditions:
1. Use the standard evaluation bo ard SANYO has provided.
2. Use the peripheral parts with indicated value externally.
3. The peripheral parts value is a recommended value of oscillator manufacturer
Table 2. Subsystem clock oscillation circuit characteristics using crystal oscillator
Oscillation
stabilizing time
typ max
Notes
Frequency Manufacturer Oscillator
MC-306 32.768kHz Seiko EPSON
C-002RX
Circuit parameters
C3 C4 Rf Rd2
18pF 18pF 10MΩ 750kΩ 4.5 to 6.0V 1.3S 3.0S
Operating
supply voltage
range
The oscillation stabilizing time is a period until the oscillation becomes stable after executing the instruction which starts the
sub-clock oscillation or after releasing the HOLD mode. (Refer to Figure4)
(Notes) • Since the circuit pattern affects the oscillation frequency, place the oscillation-related parts as close tothe oscillation
pins as possible with the shortest possible pattern length.