Sanyo LC822964, LC99359, LC99812, LV24000, LV24002 Brochure

'06-04

Cell Phone Devices

CONTENTS ⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯3
SANYO Group Cell Phone Components ⋯⋯⋯⋯⋯⋯⋯⋯4

[SANYO Original technology]
Integrated System in Board⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯6
Integrated System in Board Application Products

(Standard Products) ⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯8

Cell Phone Block Diagram Examples⋯⋯⋯⋯⋯⋯⋯⋯⋯10
Frame Transfer Full-Color CCD Sensors ⋯⋯⋯⋯⋯⋯⋯12
1/4-Type 3.2 MP CCD Camera Module for Cell Phones ⋯14
System-on-chip FM Radio ICs for Miniature Cell Phones⋯⋯⋯

16

System-on-chip FM Radio ICs Easy Radio IC

TM

Series ⋯18
Sound Generator IC (MIDI)⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯20
Audio Compression IC ⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯21
Terrestrial Digital One-Segment Chipset ⋯⋯⋯⋯⋯⋯⋯22
Cell Phone Video Drivers ⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯22
NTSC/PAL Video Encoder ⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯23
Earphone Mic Solutions⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯24
LED Driver ICs ⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯26
New Charge Pump ICs ⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯28
Motor Drivers for Cell Phones ⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯30
Amorphous Optical Sensors⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯32
Cell Phone Discrete Devices⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯34
SANYO's Lineup of High-Reliability Discrete Devices ⋯38

CONTENTS

■

Any and all SANYO products described or contained herein do not have
specifications that can handle applications that require extremely high levels of
reliability, such as life-support systems, aircraft's control systems, or other
applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your SANYO representative
nearest you before using any SANYO products described or contained herein in
such applications.

■

SANYO assumes no responsibility for equipment failures that result from using
products at values that exceed, even momentarily, rated values (such as
maximum ratings, operating condition ranges, or other parameters) listed in
products specifications of any and all SANYO products described or contained
herein.

■

Specifications of any and all SANYO products described or contained herein
stipulate the performance, characteristics, and functions of the described
products in the independent state, and are not guarantees of the performance,
characteristics, and functions of the described products as mounted in the
customer's products or equipment. To verify symptoms and states that cannot be
evaluated in an independent device, the customer should always evaluate and
test devices mounted in the customer's products or equipment.

■

SANYO Electric Co., Ltd. strives to supply high-quality high-reliability products.
However, any and all semiconductor products fail with some probability. It is
possible that these probabilistic failures could give rise to accidents or events
that could endanger human lives, that could give rise to smoke or fire, or that
could cause damage to other property. When designing equipment, adopt safety
measures so that these kinds of accidents or events cannot occur. Such
measures include but are not limited to protective circuits and error prevention
circuits for safe design, redundant design, and structural design.

■

In the event that any or all SANYO products(including technical data, services)
described or contained herein are controlled under any of applicable local export
control laws and regulations, such products must not be exported without
obtaining the export license from the authorities concerned in accordance with
the above law.

■

No part of this publication may be reproduced or transmitted in any form or by
any means, electronic or mechanical, including photocopying and recording, or
any information storage or retrieval system, or otherwise, without the prior written
permission of SANYO Electric Co., Ltd.

■

Any and all information described or contained herein are subject to change
without notice due to product/technology improvement, etc. When designing

Notes on Package Types and Naming
The package names used in this documentation are designed to indicate rough
classification of the packages used, and do not necessarily indicate the formal name of
each individual package.
Refer to the delivery specifications document for the particular product for the package
dimensions figure and the formal name of the package.

SANYO's leading-edge technologies support
advances in portable electronic equipment.

With the increasingly wide adoption of 3G and later cell phone infrastructure,
cell phones are featuring even more advanced and diverse functionality.
The speed with which multimedia functionality is being adopted is increasing,
and that trend is not limited to Japan, but is spreading worldwide.

SANYO has, for the first time in the industry,
adopted a 1/9-type CCD image sensor for cell phones.
SANYO is moving towards the megapixel age in camera cell phones,
starting with the chip size package (CSP).
Furthermore, SANYO continues to contribute to the development
of the cell phone market with efforts such as developing
SANYO's unique Integrated System in Board module technology
that achieves even higher densities and thinner form factors,
developing QVGA OLED displays,
the Easy Radio IC

TM

series that makes it easy
to include a radio receiver in portable equipment,
providing an extensive lineup of motor drivers for zoom,
autofocus, and other functions in cell phone cameras,
and developing power supply ICs for high pixel count CCDs.

Higher pixel counts, further miniaturization, and lower power.
To respond to these market needs
and to provide new areas of added value
for our customers' products,
SANYO uses their subtle technological arts
to expand their lineup of diverse chipsets
and individual devices.

3

FEM

(Front End Module)

POSCAP

ASM

(Antena Switch

Module)

Integrated

System in Board

SAW Filer

SAW Duplexer

DC/DC

Vibration Motor

Mega Pixel CCD

Camera Module

Speaker

Die Electric Filter

&

Duplexer

RGB Chip LED

Battery

LCD

(SANYO EPSON IMAGING
DEVICES CORPORATION)

Sound Generator

IC

LED Driver

FM Tuner IC

Charge Pump

Amorphous

Optical Sensor

Small discrete

devices

SANYO Group Cell Phone Components

SANYO Group Cell Phone Components

Here we introduce several technologies that SANYO has pushed to the limits.

4 5

Integrated System in Board is a type of SiP (system in package) technology, and is a module technology that achieves high
densities and thinner form factors by using SANYO's unique substrate and mounting technologies. The Integrated System in
Board lineup consists of three types of process: ISB-Solo, ISB-Duo, and ISB-Quad. Which process is used is selected based on
the application.
In addition to standard products, customer specified circuit blocks can also be converted to Integrated System in Board using an
optimal process, thus creating a new module device in a short time.

76

Integrated System in Board

Integrated System in Board

●Thickness of only 0.45 mm (0.65 mm if resistors are included) realizes excellent thermal radiation and

short development TAT

●Optimal for SiP implementation of small-scale block that includes semi-power semiconductors.

● Adopts unique SANYO-developed 0.2 mm thickness high-density substrate (2 layers)

Line 40

µm / Space 40 µm at 25 µm thickness copper foil,

Via diameter 100 µm / Via land diameter 150 µm

● Thickness of only 0.53 mm (0.73 mm if resistors are included) realizes high-density mounting

● Optimal for SiP implementation of high-frequency (up to 10 GHz) blocks, blocks that require

performance or EMC workarounds based on component placement/wiring pattern, and blocks that
require partial high-density mounting.

●Adopts unique SANYO-developed 0.24 mm thickness high-density substrate (4 layers)

●Thickness of only 0.6 mm realizes high-density mounting

●Optimal for SiP implementation of high-frequency (up to 10 GHz) blocks, blocks that require performance

or EMC workarounds based on component placement /wiring pattern, and subsystems that require high­density mounting.

●Chip-on-Board type

■ Assembly structure examples

Integrated System in Board

Earlier mounting

Integrated System in Board

Top surface

Back surface

Mounting area

reduced by 80%

4.45 × 4.45 × 0.65 mm

3

Integrated System in Board

Earlier mounting

Integrated System in Board

Top surface

Back surface

Mounting area

reduced by 58%

4.3 × 4.3 × 0.73 mm

3

Passive components

(resistors and capacitors)

ISB-Duo

ISB-Quad

WS-CSP Flip Chip

0.24 mm

■ Application example (Cell phone charger circuit block)

■ Application example (Clock detector block)

■ Assembly structure examples

■ Assembly structure examples

● Reduced wiring area due to implementation as miniature modules

● Integration of noise reducing components

● Supply voltage stabilization by using dedicated layers for power supply and ground

Dedicated power
supply/ground layer

Integration of noise

reducing components

LSI

Analysis conditions

Chip heat generation
Chip size
Land size
Atmospheric temperature

Cooling conditions

Analysis model

3 [W]

4✕4✕0.3 [mm

3

]

5✕5✕0.03 [mm

3

]

25 [°C]

Ideal cooling of the solder lower
surface;

25 [°C]

1/4 model (since symmetrical)

Maximum
temperature

40.4 [°C]

Maximum
temperature

54.3 [°C]

Maximum temperature

92.7 [°C]

Temperature
difference

38.4°C

Temperature
difference

52.3°C

MK

Z

Y X

MK

Z

X

Y

MK

X

Y

97

81

65

49

33

89

73

57

41

25

Typical BGA

Integrated System Board
that dissipates heat

Integrated System Board package

Integrated System in Board Process Lineup

ISB-Solo

ISB-Duo

ISB-Quad

Noise suppression effect (measured)

Heat dissipation effect (simulation)

Module technologies that achieve high-density and thinner form factors

SANYO Original technology

■ Evaluation results using a microcontroller and SRAM

(Surface probe method - 30 MHz to 1 GHz)

SRAM

10 mm × 10 mm

SRAM

Noise is reduced

significantly

Microcontroller

Microcontroller

Wiring on board
Integration of noise

reducing components

Integrated System in
Board stack structure
(high-density mounting)
Integration of noise

reducing components

Reasons noise can be reduced by Integrated Sysytem in Board

ISB-Duo (2-layer ISB)

Separate microcontroller
and SRAM

Surface scan using a field probe

Here we introduce examples of ICs used for cell phones implemented as modules using Integrated System in Board.

These products combine a step-up DC/DC converter, n-channel power MOSFET, and Schottky barrier diode devices
in a single module. A switching step-up power supply can easily be implemented with just the addition of external
voltage setting resistor, coil, and capacitor components.

8 9

Module technologies that achieve high-density and thinner form factors

Integrated System in Board Application
Products (Standard Products)

Integrated System in Board Application
Products (Standard Products)

Top surface

Back surface

3.4 × 3.4 × 0.65 mm

3

Mounting area

reduced by 35%

Earlier mounting

Integrated System in Board

Integrated System in Board

Di

TR

GND

CE

EXT

IC

VDD

FB

■ Block Diagram (SR10010)

■ Block Diagram

■

Compared to discrete components with Integrated System in Board

Type No. Type

Size Status

SR10010 1ch Step-up type 180 kHz 20 V ES samples/MP support
SR10020 300 kHz 20 V ES samples/MP support
SR10030 180 kHz 30 V 3.4 × 3.4 × 0.65 mm

3

ES samples/MP support

SR10110 100 kHz 20 V In volume production
SR10210 100 kHz 20 V In volume production
SR103XX -------- -------- -------- Under development
SR20010 2ch 180 kHz 20 V 5.0 × 5.0 × 0.65 mm

3

ES samples/MP support

Number of

channels

Oscillator
frequency

Withstand

voltage

Step-down
type

– power
supply type

■ Product lineup

2002

2004

Charge control circuit

10.0 × 10.0 = 100.0 mm

2

+

Regurator IC

3.0 × 3.0 = 9.0 mm

2

ISB-E17-0

4.4 5 × 4.45 = 19.80 mm

2

Mounting area

reduced by 80%

Size: 109.0 mm2→ 19.80 mm

2

Thin Form, Miniature 1 or 2 Channel DC/DC Converter Power Supplies

SR Series

Earlier mounted

Integrated system in Board

NTSC/PAL encoder+Video driver+Audio codec+Speaker amplifier

LC822964

■Video Block

●One output system

Low-cost version specialized for cell phones

●Supports a wide variety of input data (ITU-R601/SQ)

●No output coupling capacitors required

●High performance

- Switching noise does not appear on the screen due to
the use of charge pump technology

- Voltage sag does not occur

●Built-in 6th order low-pass filter: fc = 7.5 MHz

●Standby mode power consumption: 0 µA

■Audio Block

●D/A converter signal-to-noise ratio: 98 dB (A

weighting), THD: 84 dB at 48 kHz

●A/D converter signal-to-noise ratio: 90 dB (A
weighting), THD: 80 dB at 48 kHz

●Programmable ALC/noise gate

●Stereo/monaural microphone interface

●Built-in headphone driver

●Low power consumption

●450 mW output (Vcc = 3.6 V, 1 kHz, THD = 1%)

●Power saving and standby functions

Featuring

Speaker
amplifier

Microphone
amplifier

Speaker amplifier

LA74220C

Audio Codec

ALC

ADC

DAC

Volume

Heaphone
amplifier

Audio I/O block

I2S

75 Ω Video Driver

LA73074C

NTSC/PAL Encoder LC822962

Timing

Generator

IIC I/F

ITU-R601/SQ

I/F

NTSC/PAL

Video Encoder

TV output block

CCIR601

Composit

video output

Current mounting area

84.88 mm

2

+

Passive components

Integrated System in Board

45 mm

2

(6.0×7.5 mm

2

)

Sound I/O + TV output

NTSC/PAL encoder

5.0×5.0×1.0 mm

3

Video driver

2.8×2.8×0.8 mm

3

TV Output Block

Sound I/O Block

Audio codec

5.2×5.2×0.8 mm

3

Speaker amplifier

5.0×5.0×0.8 mm

3

Mounting area

can be

reduced by

over 50%

New

product

SANYO Original technology

Since the next generation of cell phones will include an even wider variety of functions than ever before, we expect that
dedicated multimedia processors and devices will be required.
SANYO provides a wide range of devices required by next generation cell phones, and can provide powerful support for your
cell phone development efforts.

携帯電話ブロックダイアグラム例

SANYO devices support megapixel class cameras and provide extensive functionality

Cell Phone Block Diagram Examples

RF

One-segment tuner

Frequency
conversion

Video driver

TV

LCD

display

SP

MIC

LED driver

KEY

Audio

compression

decoder

Sound

generator

Terrestrial
broadcast

one-segment

OFDM

demodulator

FM/AM tuner

Baseband processor

(CPU)

Amorphous

optical

sensors

Flash
memory

External
memory

Graphic
memory

Memory

Power supply

control

Battery

Display
controller

NTSC/PAL
encoder

Application processor

Motor driver
(Miniature series)

Autofocus

Optical zoom

Megapixel CCD
camera module

Sub-camera

CIF/VGA

Charge pump

Charge pump

Integrated System in Board

Audio

codec

Headphone

Diversity antenna

10 11

*: A separate coil is required for applications that include an AM radio

LED Driver

LV5202PL

13-ch 9-LED

driver

High-Efficiency Charge Pump Type

LC410592

7 LEDs
For main LCD backlights

LC410591

LV5203FN

13-ch 11-

LED driver

LV5204PL

13-ch 11-LED

driver

LV5213LP

3-ch RGB-LED

driver

Earphone/Microphone
Solutions

S.T.F.D.

SANYO has developed a chip that
supports communication with just an
earphone.

● Conversation is possible even without
a microphone

● Achieves clearly audible conversation
even in noisy environments

(Single Transducer Full Duplex)

MP3 and WMA Decoder IC

LC823231

By using dedicated circuits with a
hardwired structure to implement
the MP3 and WMA decode
functions, these ICs achieve
extremely low power levels.

(FM+RDS)

LV24010

(FM+source selector+
headphone amplifier)

LV24003

(FM+AM)
These revolutionary devices are
self-contained FM radio ICs that
require no external components.

LV24100

LV24020

These ICs can generate up to 128
sounds at the same time and include
3D Audio functions.
This is the latest sound generator IC
that even supports new melody formats
such as Mobile XMF, and provides the
highest functionality in the series as an
independent sound generator product.

64 or 128-Voice Polyphony
Sound Generator IC Series

Sound Generator +
Audio Compression IC

LC823872

These ICs can generate up to 64
sounds at the same time and
include 3D Audio functions.
This is a combined product that
integrates ultralow-power MP3 and
AAC decoder functions, and is
optimal for use in cell phones for
true audio aficionados.

LC823553

This model corresponds to a low-price
version of the LC823553 with certain
functions removed, and is a combined
product that integrates an ultralow­power MP3 decoder with a sound
generator IC that supports 64-voice
polyphony.

LC823501

Cell Phone 1/4-Type 3.2 MP CCD
Camera Chipset

The extensive depth of field provided
by these camera modules means the
user never has to worry about focus.
These camera modules are optimal for
camera cell phones that need to
provide easy and convenient imaging.

Cell Phone 1/7-Type VGA
Resolution CCD Camera Chipset

These camera modules are optimal for
low-end camera cell phones. These
ultraminiature camera modules are so
small that they do not interfere with the
design of cell phone.

These modules are optimal for
sub-camera of video conferencing
cell phone products.

Cell Phone 1/9-Type CIF
Resolution CCD Camera Chipset

LC99267(CCD)+
LC99807(DSP)

LC99359(CCD)+
LC99812(DSP)

LC99268(CCD)+
LC99809(DSP)

NTSC/PAL Encoder

The cell phone display can easily
be connected to a TV for viewing.
These devices support a wide
variety of input data rates (ITU­R601/SQ).
The LC822971 includes 16 Mbits of
SDRAM and allows the CPU to
draw graphics without concern for
the TV display rate.

LC822963
LC822971

LC822961

Video Driver

LA73074CL

Terrestrial Broadcast One-Segment
Frequency Conversion IC

LA8101

The adoption of direct conversion
technology obviates the need for a
SAW filter and supports miniaturization.

Terrestrial Broadcast One-Segment
OFDM Demodulator IC

LC74112

The adoption of diversity synthesis
technology makes stable reception
possible.

4 LEDs

P26, P27

P21

P20

P20

P32, P33

P22

P8, P9

P28, P29

P24

P9

P16 to P19

MP3/AAC/AAC+Decoder

LC82335X

P12 to P15

P23

P22

Under

development

New

product

New

product

Under

development

Under

development

New

product

New

product

New

product

Under

development

Under

development

New

product

New

product

New

product

Under

development

New

product

New

product

Under

development

New

product

Under

development

New

product

Under

development

Under

development

1-Chip FM/AM Tuner ICs

Integrated Audio/Video ICs

LC822964

Integration of an NTSC/PAL
encoder, video drivers, an audio
codec, and a speaker amplifier IC
in a single package using ISB
technology. The mounting area can
be reduced by 50% or more.

Ultraminiature Package 2-Phase
Stepping Motor Drivers

LB1935CL
LB1935T

LB1906CL

Constant Current Driving Motor Driver with
1-ch H Bridge and Thermal Shutdown Curcuit

LB1941T

LB1941CL

2-ch stepping + 1-ch Constant Current
Forward/Reverse Motor Driver IC

LB8682CL

1-ch Low-Saturation
Forward/Reverse Motor Driver

LB1938T

2-Phase Excitation Motor Driver

LB1801CL

1.5-ch Constant Current
Forward/Reverse Motor Driver IC

LB8683CL

Auto Foucus Piezo Actuator

LV8071LG

P30, P31

New

product

Under

development

Under

development

SANYO fabricates frame transfer (FT) CCD sensors using unique technologies with ultrafine design rules and provides them as
modules assembled using advanced leading-edge mounting technologies.
SANYO makes a point of providing fine and delicate semiconductor devices in forms that our customers will find approachable
and easy to use.

1312

High image quality, ultraminiature size, and low power makes these devices optimal for
use in cell phones

Frame Transfer Full-Color CCD Sensors

Achieves the industry’s smallest optical size class by using the frame transfer CCD, which makes it possible to reduce
feature sizes while maintaining sensitivity.
Sensitivity was increased by adopting a simple single-layer gate gap structure and thin-film polysilicon.

Photo Diode

Micro Lens

Photo Diode

Micro Lens

P-Sub

N+ N+P+ P+N+ N+

Micro Lens

Photo Diode

[storage 1/3 compression Type]

Imaging area

Storage area

Horizontal shift register

output

PD

=Transfer

area

Low voltage

Imaging area

Horizontal shift register

output

High voltage

Transfer

area

Switch

PD

Low voltage

X direction register

Y direction register

PD

Amplifier

PD: Photo Diode

FT-CCD CMOS IL-CCD

A charge pump type voltage step-up circuit that features minimal noise generation, and the supply voltages required for
system drive are generated efficiently with just the supply of a single +2.9 V power supply. This design is also effective at
achieving reduced power consumption.
SANYO implemented, in a single package, the timing generator circuit required for system drive and all the analog and
digital processing required to accept the CCD output by taking advantage of the SANYO CMOS analog/digital hybrid
process and MCP (multi-chip package) technologies.

CCD sensor CMOS sensor (1/4 VGA)

2004 2005 2006

Megapixel

CCD chipset

1.0M

VGA CCD

chipset

Coexistance
between
near infrared
sensitivity and
color

3.2M

CIF CCD
chipset

Near infrared

CCD chipset

30 fps

High reliability

LC99807

LC99808

LC99117

LC99268

LC99267

LC99810

LC99353

LC99812

LC99359

LC99704

LC99268G

LC99809

LC99268FL

Near infrared

High image quality
Dynamic range of
VGA motion picture
and 3.2-MP still picture
has expanded

Inproved stability
at high-temperature
(85 °C)

Still Motion Still Motion Motion

Motion

Motion
LC99359 3.2M VGA Low High Normal 30 DigitalColor
LC99268FL VGA VGA High

Wide 15 DigitalColor

LC99117 CIF CIF

Very High

Wide 30 DigitalB&W

Dynamic Range

Frame Rate

Output

Resolution

Sensitivity

Color/B&W

Chip Set

Correlated double

sampling

CCD driver

Charge pump

Power supply circuit

Digital color signal processor

RGB/YUV output

Multifunction DSP

CCD module

CCD timing generator

+2.9 V
Single power supply

Storage area

Imaging area

Horizontal shift
register

Output
amplifier

AGC

8-bit
ADC

Analog front end processor

Registers for picture arrangement

/Output mode/etc.

I

2

C bus

AE/AWB controller

CLK

HREF/VREF

High sensitivity

Horizontal transfer

FT-CCD structure

Mixing area

2R+G B+2G

R, G, and B are extracted by calculations

Compressed to 1/3 the number of lines by combining 3 pixels.

R+2G 2B+G

Low moire

Imaging area

Imaging area

Storage area

Storage area

Mixing area

Frame Transfer CCD

CCD drive circuit and image processing implemented in a single package

Multifunction DSP chip

Device Density Comparison

Roadmap

Cross Section Comparison

Newly developed

Comparison of Differences in Electronic Shutter Types

CCD Module Basic Structure Example

Comparison of chip
sizes required to
acquire the same
imaging device area

The FT CCD method uses
no elements that block the
entrance of light, and thus
they can capture light from
a wider range of incidence
angles.

High sensitivity

Reducing the device

height is possible

In the 1.0-MP CCD, SANYO developed a new charge accumulation method.
Low moire, high sensitivity, and a high frame rate achieved by pixel addition during preview and spatial
filter processing.