Any and all SANYO products described or contained herein do not have specifications that can handle
applications that require extremely high levels of reliability, such as life-support systems, aircraft’s
control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your SANYO representative nearest you before using
any SANYO products described or contained herein in such applications.
SANYO assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges,or other
parameters) listed in products specifications of any and all SANYO products described or contained
herein.
CMOS IC
128K-Bit CMOS Mask ROM
Ordering number:ENN1542
LC3101
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
Overview
The LC 3101 is a 128k-bit CMOS mask ROM that contains an interface connectable direct to the speech synthesizer IC LC8100. With one piece of this mask ROM, approximately 100 seconds of speech synthesis can be attained. Since it also contains an interface connectable direct to an EPROM, speech synthesis can be attained by
using this mask ROM and an EPROM jointly.
A selection of 8-bit, 4-bit, or single-bit output data is allowed by means of external control. This mask ROM is
also suited for use in applications other than speech syn-
thesis.
Features
• ROM capacity : 128K bits
• Access time : 25.6µs typ (for operation at 200kHz typ).
• Cycle time : 30.6µs typ (for operation at 200kHz typ).
• Funciton
(1) Contains an interface to an EPROM.
(2) Contains an interface to the LC8100 (sepeech
synthesizer IC).
(3) Possible to select the bit length of output data.
8-bit data
4-bit data
Single-bit data
• Low power dissipation : CMOS
• Current drain :
2mA max (at operating mode).
1µA max (at nonoperating mode).
• Single +5V power supply.
+2.7 to 6.0V (supply voltage range).
• Package : DIP24
Package Dimensions
unit:mm
3014A-DIP42
[LC3101]
42
1
1.22.54
unit:mm
3025B-DIP42S
42
1
0.95
53.2
0.5
[LC3101]
37.9
0.48
22
13.8
15.24
21
4.25
5.1max
4.1
1.2
22
21
1.78
0.51min
SANYO : DIP42
13.8
15.24
4.25
5.1max
3.8
0.51min
1.15
SANYO : DIP42S
0.25
0.25
73101TN (KT)/7024KI, TS No.1542–1/14
LC3101
Pin Assignment
Equivalent Circuit Block Diagram
A0 to A3 :18-bit address setting pins
ASTRB :A0 to A3 strobe pin
DREQ :ROM data request pin
DOUT :ROM data serial output pin
CT :Basic operation clock input pin
D0 to D7 :8-bit input/output pins
MODE :DREQ pin input pulse count control pin
DSEL :Output bit length select pin
CE :Power-down control pin
EA0 to EA17 : 18-bit address output pins
Description of Operation of Internal Block
• ASTRB COUNTER :Block which internally sets address information applied in 5 steps from A0 to A3
pins.
The mask ROM and an external EPROM can be used jointly. Two selections of operation mode shown below are
available by high-order 4 bits (EA14 to EA17) of 18-bit address.
The LC3101 contains a 4-bit chip select decoder (user option : Refer to “User mask”). Coincidence or uncoincidence
with high-order 4 bits (EA14 to EA17) of 18-bit address is detected to select the operation mode.
Fig.1 shows the schematic diagram of the control section related to these operation modes. Fig. 2 shows the assignment of 256K-byte (128k bits × 16) that can be specified by 18-bit address.
Fig. 1 Schematic Diagram of Control Section
edomelbanedaerMORksaM
edomtibihnidaerMORksaM
Fig. 2 Address Space Assignement
No.1542–4/14
LC3101
ROM Data Readout Procedure
The following flowchart shows the outline of readout procedure. (1) to (7) give a more detailed description.
(1) Initialization of internal mode
There are 4 counter blocks (ASTRB counter, 18-bit ADDRESS counter, READ PULSE counter, DREQ counter)
inside the LC3101. Since initialization is required immediately after application of power, apply one ‘H’ level
pulse to CE pin. When CE is set to ‘L’ level, the power-down mode is released (refer to (7) ) and it is possible to
start readout any time.
(2) Setting of bit length of readout data
For the bit length of ROM data output, a selection of 3 lengths is allowed : 8 bits, 4 bits, and a single bit. For
controlling this selection, MODE, DSEL pins are used. The following Table shows 3 types of pin setting.
EDOM
LESD
'L'
'H'–)etoN(htgneltib-4
'L''H'
htgneltib-elgniS
)sisehtnyshceeps(
rohtgneltib-4rotib-8
)etoN(htgneltib-4
(Note) When DSEL is set to ‘L’, 20 to 23 bits are outputted at D0 to D3 pins.
When DSEL is set to ‘H’, 24 to 27 bits are outputted at D0 to D3 pins.
No.1542–5/14
LC3101
(3) Address setting
Apply 5 successive pulses to ASTRB pin. Synchronously with these pulses apply 18-bit address information to A0
to A3 pins from high-order bit downward by 4 bits in 5 steps. At this address setting mode DREQ pin must be set
to ‘L’ level. Shown below is the timing.
(Note) • “*”=don’t care.
• “2n”=Binary number at the nth bit to be set in address counter.
• For the numeric values of T
STRH
, T
STRL
, T
ADST
, T
, refer to Electrical Characteristics.
ADHS
Start of readout of set address data
Readout of ROM data starts at the falling of the 5th ASTRB pulse or the first (MODE=’H’) or the 8th (MODE=’L’)
DREQ pulse, and when access time T
has elapsed 20 bit is outputted at DOUT pin and 20 to 27 data are outputted
AC1
at D0 to D7 pins. (Refer to the following Timing Chart.)
Note) For the numeric value of T
, refer to Electrical Characteristics.
AC1
(4) Fetching of output data
As shown above, whenever access time T
has elapsed, data can be fetched from output ports DOUT or D0 to
AC1
D7 pins (Pin setting as shown in Table in (2) is required).
Counting one byte in a single bit from DOUT pin
Count a single bit (2n bit) from DOUT pin. To count the following single bit (2
n+1
bit), apply a shift clock to
DREQ pin. Shown below is Timing Chart.
For the numeric values of T
AC1
, T
DRQH
, T
, refer to Electical Characteristics.
SHFT
No.1542–6/14
LC3101
Counting one byte in 4-bits from D0 to D3 pins
In accordance with Table and (Note) in (2), fetch one byte from D0 to D3 pins by 4 bits in 2 steps. Shown below is
Timing Chart.
Counting one byte in 8 bits from D0 to D7 pins
Fetch 8 bits from D0 to D7 pins. Shown below is Timing Chart.
(5) Setting address again and counting data
(1) Timing for application of ASTRB pulse when address A is set and read out and then address B is set and read
out.
No.1542–7/14
LC3101
(2) Timing for application of ASTRB pulse when data is read out by application of DREQ signal (refer to (6)
below) and then address B is set and read out.
(6) Request of ROM data at the following address
When the signal shown below is applied to the IC, the IC begins to read out data at the address immediately
following the address at which preceding data is read out.
Falling of 8th DREQ pulse (MODE=’L’)
Falling of 1st DREQ pulse (MODE=’H’)
Shown below is Timing Chart.
Note) Apply ROM data request signal after T
For the numeric value of T
, refer to Electrical Characteristics.
CYCLE
or more has elapsed.
CYCLE
(7) Power-down mode
When the input at CE pin is set to ‘H’ level, the LC3101 enters power-down mode (each block inside the IC stops
its operation,with no unnecessary current dissipated.). At this mode, the IC inside becomes as follows and current
dissipation is reduced.
(1) Input at input ports (ASTRB, DREQ, A0 to A3) is inhibited.
(It should be noted that if input is floating, current drain increases.)
(2) Both address decoder and data selector in 128K-bit ROM matrix stop their internal operation.
(3) Output at 3-state output pins DOUT, D0 to D7 is floating or fixed. (The user can select either of the two. Refer
to “User mask”) When CE is set to ‘H’, in addition to reduction in current drain as mentioned above, 4 internal
COUNTER) are initialized in readiness for readout after power-down mode release (CE=’L’).
No.1542–8/14
LC3101
User mask
(1) CHIP SELECT DECODER
User mask option which makes IC chip select signal (select, nonselect) with 214 to 217 bits of 18-bit addresses.
Shown below is the output modes including CE pin conditions.
'L'=EC)nwod-rewoP('H'=EC
tcelespihC
.snip
tcelesnonpihC
.ecnadepmi
7Dot0D,TUODmorfdettuptuosiATAD
hgihasahsnip7Dot0D,TUODtatuptuO
.ecnadepmi
)etoN(.dettuptuodnadleh
Note) In this case, the IC only, having CHIP SELECT DECODER whose 214 to 217 bits are all 0, outputs data and
all others have a high impedance.
(2) SW mask
SW mask controls output at DOUT, D0 to D7 output pins in the following two ways at power-down mode.
The user can select either of the two beforehand.
(i) Output at DOUT, D0 to D7 pins is set to a high impedance.
(ii)Data immediately before power-down mode is held and outputted.
Sample Application Circuit (1)
One word to one key correspondence
sisrucco'H'=ECerofebyletaidemmiataD
hgihasahsnip7Dot0D,TUODtatuptuO
No.1542–9/14
Sample Application Circuit (2)
CPU control : Edit and synthesis with CPU
(The mask ROM and a 64k-bit EPROM are used jointly.)
LC3101
Specifications
Absolute Maximum Ratings at Ta = 25˚C, VSS=0V
retemaraPlobmySsnoitidnoCsgnitaRtinU
egatlovylppusmumixaMV
egatlovtupnIV
egatlovtuptuOV
tnerructuptuOI
noitapissidrewopelbawollAxamdP07+ot03–=aT°C002Wm
erutarepmetgnitarepOrpoT07+ot03–
erutarepmetegarotSgtsT521+ot55–
Allowable Operating Range at Ta = –30 to +70˚C, VSS=0V, VDD=4.5 to 6.5V
IDD (1) Test Circuit (A)IDD (1) Test Circuit (B)IDD (2) Test Circuit
Fig. 3Fig. 4
No.1542–12/14
Fig. 5 (1)
Fig. 5 (2)
LC3101
Fig. 6Fig. 7
Fig. 8
Note 1 Use the following formulas to calculate TAC max, Tcycle max.
TAC max= +0.6µs Tcycle max= +0.6µs
5000
fCT (kHz)
6000
fCT (kHz)
No.1542–13/14
LC3101
Specifications of any and all SANYO products described or contained herein stipulate the performance,
characteristics, and functions of the described products in the independent state, and are not guarantees
of the performance, characteristics, and functions of the described products as mounted in the customer's
products or equipment. To verify symptoms and states that cannot be evaluated in an independent device,
the customer should always evaluate and test devices mounted in the customer's products or equipment.
SANYO Electric Co., Ltd. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with some probability. It is possible that these probabilistic failures could
give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire,
or that could cause damage to other property. When designing equipment, adopt safety measures so
that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective
circuits and error prevention circuits for safe design, redundant design, and structural design.
In the event that any or all SANYO products(including technical data,services) described or
contained herein are controlled under any of applicable local export control laws and regulations,
such products must not be exported without obtaining the export license from the authorities
concerned in accordance with the above law.
No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system,
or otherwise, without the prior written permission of SANYO Electric Co. , Ltd.
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification"
for the SANYO product that you intend to use.
Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not
guaranteed for volume production. SANYO believes information herein is accurate and reliable, but
no guarantees are made or implied regarding its use or any infringements of intellectual property rights
or other rights of third parties.
This catalog provides information as of July, 2001. Specifications and information herein are subject to
change without notice.
PS No.1542–14/14
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