Sanyo 2SJ277 Specifications

Sanyo 2SJ277 Specifications

Ordering number:EN4241

P-Channel Silicon MOSFET

2SJ277

Ultrahigh-Speed Switching Applications

Features

Package Dimensions

·Low ON resistance.

·Ultrahigh-speed switching.

·Low-voltage drive.

·Surface mount type device making the following possible.

·Reduction in the number of manufacturing processes for 2SJ277-applied equipment.

·High density surface mount applications.

·Small size of 2SJ277-applied equipment.

unit:mm

2093A

 

 

 

 

[2SJ277]

 

 

0.9

10.2

 

 

4.5

 

 

 

1.3

11.5

 

 

 

8.8

 

 

1.6

 

 

 

 

20.9

 

 

 

1.2

 

 

 

 

 

 

9.4

0.8

 

 

11.0

 

 

 

 

 

 

0.4

 

1

2

3

 

1 : Gate

 

 

 

 

2.7

2 : Drain

 

 

 

 

3 : Source

 

 

 

 

 

 

2.55

 

 

2.55

SANYO : SMP

unit:mm

2090A

0.8

10.2

[2SJ277]

 

4.5

1.3

 

 

3.0 9.9

1.5max 8.8

1

2

3

0.8

 

1.2

 

 

2.55

 

2.55

2.7

2.55 2.55

1.35

1.4

0 to 0.3

0.4

1 : Gate

2 : Drain

3 : Source

SANYO : SMP-FD

Any and all SANYO products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft’s control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your SANYO representative nearest you before using any SANYO products described or contained herein in such applications.

SANYO assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges,or other parameters) listed in products specifications of any and all SANYO products described or contained herein.

SANYO Electric Co.,Ltd. Semiconductor Company

TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN

42899TH (KT)/51193TH (KOTO) AX-8376 No.4241–1/4

2SJ277

Specifications

Absolute Maximum Ratings at Ta = 25˚C

Parameter

Symbol

Conditions

Ratings

Unit

 

 

 

 

 

Drain-to-Source Voltage

VDSS

 

–100

V

Gate-to-Source Voltage

VGSS

 

±15

V

Drain Current (DC)

ID

 

–15

A

Drain Current (Pulse)

IDP

PW≤10µs, duty cycle≤1%

–60

A

Allowable Power Dissipation

PD

 

1.65

W

 

 

 

Tc=25°C

70

W

 

 

Channel Temperature

Tch

 

150

˚C

 

 

 

 

 

Storage Temperature

Tstg

 

–55 to +150

˚C

 

 

 

 

 

Electrical Characteristics at Ta = 25˚C

Parameter

Symbol

Conditions

 

Ratings

 

Unit

 

 

 

 

 

 

min

typ

max

 

 

 

 

 

 

 

 

Drain-to-Source Breakdown Voltage

V(BR)DSS

ID=–1mA, VGS=0

–100

 

 

V

Gate-to-Source Breakdown Voltage

V(BR)GSS

IG=±100µA, VDS=0

±15

 

 

V

Zero-Gate Voltage Drain Current

IDSS

VDS=–100V, VGS=0

 

 

–100

µA

Gate-to-Source Leakage Current

IGSS

VGS=±12V, VDS=0

 

 

±10

µA

Cutoff Voltage

VGS(off)

VDS=–10V, ID=–1mA

–1.0

 

–2.0

V

Forward Transfer Admittance

| yfs |

VDS=–10V, ID=–8A

7.5

13

 

S

Static Drain-to-Source ON-State Resistance

RDS(on)

ID=–8A, VGS=–10V

 

120

160

RDS(on)

ID=–8A, VGS=–4V

 

160

220

 

 

Input Capacitance

Ciss

VDS=–20V, f=1MHz

 

1900

 

pF

Output Capacitance

Coss

VDS=–20V, f=1MHz

 

400

 

pF

Reverse Transfer Capacitance

Crss

VDS=–20V, f=1MHz

 

80

 

pF

Turn-ON Delay Time

td(on)

See specified Test Circuit

 

18

 

ns

Rise Time

tr

See specified Test Circuit

 

25

 

ns

Turn-OFF Delay Time

td(off)

See specified Test Circuit

 

300

 

ns

Fall Time

tf

See specified Test Circuit

 

120

 

ns

Diode Forward Voltage

VSD

IS=–15A, VGS=0

 

–1.0

–1.5

V

Switching Time Test Circuit

No.4241–2/4

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