SanDisk SSD X100 Product Manual

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SanDisk® SSD X100

Product Manual

(Released)

Rev 1.0

April 2012

Document No. 80-11-01842

SanDisk Corporation

Phone [phone] • Fax [phone]

www.sandisk.com

SanDisk SSD X100 Product Manual (Released) Rev 1.0

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© 2011 SanDisk Corporation. All rights reserved.

Document No. 80-11-01842 04/2012 Printed in U.S.A.

© 2011 SanDisk® Corporation 2 Document No. 80-11-01842

SanDisk SSD X100 Product Manual (Released) Rev 1.0

Revision

Description

Date

0.2

 Initial version

Sep 15, 2011

0.3

 Updated mSATA drawing
 Updated 64GB data
 Add 32GB mSATA configuration

Oct 25, 2011

0.4

 Updated performance
 Added 2.5” 9.5mm configuration
 Updated word 106: 0x4000

Nov 15, 2011

0.41

 Updated mSATA drawing

Dec 1, 2011

0.5

 Updated performance (2.3)
 Updated operating power consumption (3.4)
 Updated mSATA dimensions (tolerance) (4.3)
 Added mSATA drawing for keep out areas (4.3)
 Updated ESD test voltage (5.6)
 Updated chemical restrictions (5.9)
 Updated regulations (5.10)
 Added MTTF data (6.2)
 Updated Commands set (8.1)
 Updated Identify Data (8.2)
 Updated Log Pages (8.3)
 Updated Ordering information (9)

Dec 22, 2011

0.6

 Updated performance (2.3)
 Updated power consumption (3.3 & 3.4)
 Updated operating power consumption (3.4)
 Updated mSATA form factor drawing (4.3)
 Updated mSATA thickness (4.3)
 Updated vibration (5.3)
 Updated shock (5.4)
 Updated MTTF of 512GB (6.2)
 Updated Identify Data (8.2)
 Removed Device Statistics (04h) from Log

Pages (8.3)

Feb 29, 2012

0.7

 Updated performance (2.3)

Apr 4, 2012

1.0

 Updated performance (2.3)
 Average power consumption (3.3)
 Updated Identify Data (8.2), word 76 (HIPM

enable)

Apr 19, 2012

Revision History

© 2011 SanDisk® Corporation 3 Document No. 80-11-01842

SanDisk SSD X100 Product Manual (Released) Rev 1.0

Table of Contents

1. INTRODUCTION .............................................................................................................................. 8

1.1 GENERAL DESCRIPTION ...................................................................................................................... 8

1.2 KEY FEATURES ................................................................................................................................. 9

1.3 FUNCTIONAL DESCRIPTION ............................................................................................................... 11

1.4 ADVANCED FLASH MANAGEMENT ..................................................................................................... 12

1.4.1 Defect and Error Management ............................................................................................. 12

1.4.2 Wear Leveling ....................................................................................................................... 12

1.4.3 Bad Block Management ........................................................................................................ 12

1.4.4 Tiered Caching ...................................................................................................................... 13

1.5 ADVANCED POWER MANAGEMENT ................................................................................................... 14

1.5.1 Slumber SATA low power mode ............................................................................................ 14

1.6 BACKGROUND GARBAGE COLLECTION ................................................................................................ 14

1.7 PERFORMANCE THROTTLING ............................................................................................................. 14

2. GENERAL PRODUCT SPECIFICATIONS ............................................................................................ 15

2.1 INTERFACE .................................................................................................................................... 15

2.2 CAPACITY ...................................................................................................................................... 15

2.3 PERFORMANCE .............................................................................................................................. 16

2.4 ENDURANCE .................................................................................................................................. 16

3. POWER CHARACTERISTICS ............................................................................................................ 17

3.1 SUPPLY VOLTAGE ........................................................................................................................... 17

3.2 GRACEFUL POWER-OFF REQUIREMENTS ............................................................................................. 17

3.3 AVERAGE POWER CONSUMPTION ...................................................................................................... 18

3.4 OPERATING POWER CONSUMPTION – AVERAGE MAX ........................................................................... 19

3.5 LOW POWER MODE CONSUMPTION .................................................................................................. 20

4. PHYSICAL SPECIFICATION .............................................................................................................. 21

4.1 SATA 2.5” 7.0MM FORM FACTOR .................................................................................................... 21

4.2 SATA 2.5” 9.5MM FORM FACTOR .................................................................................................... 22

4.3 MSATA FORM FACTOR ................................................................................................................... 23

5. ENVIRONMENTAL SPECIFICATIONS ............................................................................................... 25

5.1 TEMPERATURE ............................................................................................................................... 25

5.2 HUMIDITY ..................................................................................................................................... 25

5.3 VIBRATION .................................................................................................................................... 25

5.4 SHOCK.......................................................................................................................................... 25

5.5 ALTITUDE ...................................................................................................................................... 26

5.6 ELECTROSTATIC DISCHARGE (ESD) .................................................................................................... 26

5.7 ACOUSTICS .................................................................................................................................... 26

5.8 EMI/RFI COMPLIANCE ................................................................................................................... 26

5.9 CHEMICAL RESTRICTIONS ................................................................................................................. 27

5.10 REGULATIONS ................................................................................................................................ 27

6. RELIABILITY CHARACTERISTICS ...................................................................................................... 28

6.1 ERROR RATE .................................................................................................................................. 28

6.2 MTTF (MEAN-TIME-TO-FAILURE) .................................................................................................... 28

7. INTERFACE .................................................................................................................................... 29

7.1 SUPPORTED STANDARDS .................................................................................................................. 29

7.2 PIN ASSIGNMENTS – STANDARD SATA............................................................................................... 29

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7.3 PIN ASSIGNMENTS – MSATA ........................................................................................................... 30

8. SUPPORTED ATA COMMANDS ...................................................................................................... 31

8.1 COMMANDS SET............................................................................................................................. 31

8.2 IDENTIFY DATA .............................................................................................................................. 35

8.3 LOG PAGES ................................................................................................................................... 39

9. ORDERING INFORMATION ............................................................................................................ 40

10. CONTACT INFORMATION ......................................................................................................... 41

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Table of Figures

FIGURE 1-1: SANDISK SSD X100 TIERED CACHING TECHNOLOGY .............................................................................. 13

FIGURE 4-1 : DRAWING - 2.5” 7.0MM FORM FACTOR ............................................................................................. 21

FIGURE 4-2 : DRAWING - 2.5” 9.5MM FORM FACTOR ............................................................................................. 22

FIGURE 4-3: DRAWING - MSATA FORM FACTOR .................................................................................................... 23

FIGURE 4-4: DRAWING - MSATA KEEP OUT AREA .................................................................................................. 24

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Table of Tables

TABLE 2-1: SANDISK SSD X100 CAPACITY SPECIFICATION ........................................................................................ 15

TABLE 2-2: SANDISK SSD X100 PERFORMANCE ..................................................................................................... 16

TABLE 2-3: SANDISK SSD X100 ENDURANCE ........................................................................................................ 16

TABLE 3-1: SANDISK SSD X100 SUPPLY VOLTAGE ................................................................................................. 17

TABLE 3-2: SANDISK SSD X100 AVERAGE POWER CONSUMPTION ............................................................................ 18

TABLE 3-3: SANDISK SSD X100 ACTIVE POWER CONSUMPTION ............................................................................... 19

TABLE 3-4: SANDISK SSD X100 POWER CONSUMPTION IN LOW POWER MODE .......................................................... 20

TABLE 4-1: MECHANICAL INFORMATION – 2.5” 7.0MM FORM FACTOR ...................................................................... 21

TABLE 4-2: MECHANICAL INFORMATION – 2.5” 9.5MM FORM FACTOR ...................................................................... 22

TABLE 4-3: MECHANICAL INFORMATION - MSATA FORM FACTOR .............................................................................. 23

TABLE 5-1: SANDISK SSD X100 TEMPERATURE SPECIFICATION ................................................................................. 25

TABLE 5-2: SANDISK SSD X100 HUMIDITY SPECIFICATION ....................................................................................... 25

TABLE 5-3: SANDISK SSD X100 VIBRATION SPECIFICATION ...................................................................................... 25

TABLE 5-4: SANDISK SSD X100 SHOCK SPECIFICATION............................................................................................ 25

TABLE 5-5: SANDISK SSD X100 ALTITUDE SPECIFICATION ........................................................................................ 26

TABLE 5-6: SANDISK SSD X100 ESD SPECIFICATION ............................................................................................... 26

TABLE 5-7: SANDISK SSD X100 EMI/RFI COMPLIANCE .......................................................................................... 26

TABLE 5-8: SANDISK SSD X100 REGULATION STANDARDS ....................................................................................... 27

TABLE 6-1: SANDISK SSD X100 MTTF ................................................................................................................ 28

TABLE 7-1: STANDARD SATA CONNECTOR PIN ASSIGNMENT .................................................................................... 29

TABLE 7-2: MSATA CONNECTOR PIN ASSIGNMENT ................................................................................................. 30

TABLE 8-1: SUPPORTED ATA COMMANDS ............................................................................................................. 34

TABLE 8-2: IDENTIFY DATA VALUES ...................................................................................................................... 38

TABLE 8-3: SUPPORTED SMART LOG PAGES ......................................................................................................... 39

TABLE 9-1: SSD X100 ORDERING INFORMATION.................................................................................................... 40

TABLE 9-2: EXAMPLES OF DECODED SKU FOR SSD X100 PRODUCTS .......................................................................... 40

© 2011 SanDisk® Corporation 7 Document No. 80-11-01842

SanDisk SSD X100 Product Manual (Released) Rev 1.0

1. Introduction

1.1 General Description

SanDisk SSD X100 is designed to improve the mobile computing user experience with leading

performance, high reliability and power efficiency in SATA standard 2.5” and mSATA small form

factor.

SanDisk X100 with 32, 64, 128, 256 and 512 gigabyte1 (GB) flash memory, support performance
optimizations such as “Multi Stream” support, performance throttling, and move/copy mega­files in high performance.

With a state of the art and an evolutionary controller design, SanDisk SSD provides more than
fast sequential read/write performance and provides significant improved random I/O
performance and multi stream capabilities enabling SanDisk SSD to work much faster.

SanDisk, the industry leader in flash storage, is uniquely positioned to drive the paradigm shift in
mobile computing to SSDs Inside enterprise and consumers computers, such as the thin & light
laptops and transportable laptops.

This manual describes the functional, mechanical and interface specifications for the following
SanDisk SSD X100 model drives: SATA 2.5” 7.0mm, SATA 2.5” 9.5mm and SATA mSATA.

1

1 megabyte (MB) = 1 million bytes; 1 gigabyte (GB) = 1 billion bytes. Some of the listed capacity is used

for formatting and other functions, and thus is not available for data storage.

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1.2 Key Features

 Flash Memory used:

 SanDisk 24nm 64Gb MLC ABL

 Unformatted capacities

 SATA 2.5”: 64GB, 128GB, 256GB, 512GB
 mSATA: 32GB, 64GB, 128GB, 256GB

 Form factors:

 SATA 2.5” 7.0mm case, complies with SFF-8223 and SFF-8201
 SATA 2.5” 9.5mm case, complies with SFF-8223 and SFF-8201
 Standard mSATA form factor with a Mini-PCIe edge connector, complies to

JEDEC MO-300B standard

 Interface to host:

 SATA 6Gb/s (Revision 3.0) compliant
 Backwards compliant to SATA 3Gb/s & SATA 1.5Gb/s
 ATA 8 Command Set ACS-2
 NCQ support up to queue depth = 32
 SMART support

 High performance

 Maximum Host transfer rate: 6Gb/s
 Sustained Sequential Read: 500 MB/s
 Sustained Sequential Write: 430 MB/s
 4K Random Write: 43,000 IOPS
 4K Random Read: 76,000 IOPS
 Write Latency: 65µs
 Read Latency: 55µs

 Low power consumption:

 Typical read/write
 Slumber power mode

2

:

3

:

4

: 120mW to 150mW

5

: 70mW to 100mW

2

The logical capacity of the drive conforms to the IDEMA HDD Specification. See www.idema.org for details. Some of
the listed capacity is used for formatting and other functions, and thus is not available for data storage. 1 megabyte
(MB) = 1 million bytes; 1 gigabyte (GB) = 1 billion bytes.

3

Performance for 256GB product on SATA 6Gb/s host, Queue Depth = 32. Based on internal testing; performance
may vary.

4

Average (typical) power while running MobileMarkTM 2007. X100 is configured with Device Initiated Power
Management (DIPM) enabled and Host Initiated Power Management (HIPM) enabled. 120mW for form factors with
input power of 3.3V ; 150mW for 2.5” standard SATA (5V).

5

With DIPM enabled. 70mW-75mW for form factors with input power of 3.3V ; 100mW for 2.5” standard SATA (5V).

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 Advanced Flash Management:

 nCache™ – Non Volatile Write Cache
 Support for TRIM
 Dynamic & Static Wear-leveling
 Bad Block Management
 Background Garbage Collection

 Support for Dynamic Performance Throttling:

 Performance will be throttled in the event junction temperature of critical

components is measured to be exceeding the maximum allowable for the
product.

 Highly-reliable:

 At least 5 years useful life
 Mean time to failure (MTTF): Up to 2,000,000 hrs
 Uncorrectable Bit Error Rate (UBER): 1 sector per 10

16

bits read

 Operating and non-operating shock: 1,500G, 0.5ms half sine
 Operating vibration: 5gRMS, 10-2000 Hz
 Non-operating vibration: 4.9gRMS, 2.5-800 Hz
 Operating temperature: 0˚C to 70˚C
 Non-operating temperature and storage

6

: -55˚C to +85˚C

6

Temperature measured on board via temperature sensor, Storage temperature does not guarantee data
retention.

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1.3 Functional Description

The SSD X100 contains a high-level, intelligent storage subsystem with powerful capabilities.

These capabilities include the following:

 Supports multi stream – improves user experience in multitasking systems
 Support for Trim command
 Minimal write amplification – increases endurance and performance
 Tiered caching – Volatile and non-volatile cache
 Supports ATA register and command set (ATA-8 / ACS2 standard)
 S.M.A.R.T. feature supported
 Host independence from details of erasing and programming flash memory
 Sophisticated system for error recovery including a powerful error correction code (ECC)
 Sophisticated system for managing defects
 Advanced power management for low power operation
 Implementation of dynamic and static wear-leveling to extend SSD X100 life

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1.4 Advanced Flash Management

1.4.1 Defect and Error Management

SSD X100 contains a sophisticated defect and error management system that is similar to the
systems found in magnetic disk drives, and in many cases, offers enhancements. If necessary,
the SSD device will rewrite data from a defective block to a good block. This action is completely
transparent to the host and does not consume any user data space.

The SSD soft error rate specification is much better than the magnetic disk drive specification. In
the extremely rare case that a read error does occur, the SSD X100 products have innovative
algorithms to recover the data by using error detection code and error correction code
(EDC/ECC). These defect and error management systems, coupled with the solid state
construction, give SSD X100 unparalleled reliability.

1.4.2 Wear Leveling

Wear leveling is an intrinsic part of the erase pooling functionality of SSDs using NAND memory.
Advanced features of dynamic and static wear-leveling, and automatic block management are
used to ensure an even distribution of write/erase cycles throughout the entire device,
regardless of how dynamic or static the data written is. This guarantees high data reliability and
maximizes flash life expectancy.

1.4.3 Bad Block Management

Bad blocks are occasionally created during the life cycle of a flash component, in a phenomenon
called dynamic bad-block accumulation. These bad blocks must be marked and replaced
dynamically in order to prevent read/write failures. When a bad block is detected, the
embedded Bad Block Mapping algorithm maps out the block, which will remove the block from
future use.

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1.4.4 Tiered Caching

The SSD X100 supports a unique feature to improve random write performance and ensure very
positive user experience. Studies show that modern operating systems mostly access the
storage device using small access blocks, with the majority being 4KB access blocks.

The small logical access blocks conflict with the physical block structure (>1MB) for the newer
generation flash memory technology. Therefore, to bridge this difference, SSD X100 employs
three storage layers:

 Volatile cache - DDR DRAM cache
 nCache™ - A non-volatile flash write cache
 Mass storage – MLC NAND flash

The nCache™ is used to accumulate small writes (called segments) at high speed and then flush

& consolidate them to larger MLC section of the NAND Flash memory array.

Figure 1-1: SanDisk SSD X100 Tiered Caching Technology

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