sandisk SDAT2FAH-128, SDBT2FAH-256, SDBT2FCH-512, SDBT2FCH-1024 User guide

TriFlash with Secure Digital (SD) Interface

Product Manual (Preliminary)

CORPORATE HEADQUARTERS

140 Caspian Court

Sunnyvale, CA 94089-1000 408-542-0500

FAX: 408-542-0503 URL: http://www.sandisk.com

SanDisk® Corporation general policy does not recommend the use of its products in life support applications where in a failure or malfunction of the product may directly threaten life or injury. Per SanDisk Terms and Conditions of Sale, the user of SanDisk products in life support applications assumes all risk of such use and indemnifies SanDisk against all damages.

The information in this manual is subject to change without notice.

SanDisk Corporation shall not be liable for technical or editorial errors or omissions contained herein; nor for incidental or consequential damages resulting from the furnishing, performance, or use of this material.

All parts of the TriFlash documentation are protected by copyright law and all rights are reserved. This documentation may not, in whole or in part, be copied, photocopied, reproduced, translated, or reduced to any electronic medium or machine-readable form without prior consent, in writing, from SanDisk Corporation.

SanDisk and the SanDisk logo are registered trademarks of SanDisk Corporation.

Product names mentioned herein are for identification purposes only and may be trademarks and/or registered trademarks of their respective companies.

SanDisk products are covered or licensed under one or more of the following U.S. Patent Nos. 5,070,032; 5,095,344; 5,168,465; 5,172,338; 5,198,380; 5,200,959; 5,268,318; 5,268,870; 5,272,669; 5,418,752; 5,602,987. Other U.S. and foreign patents awarded and pending.

Lit. No. 80-13-00171 Rev. 1.2 3/2003

Printed in U.S.A.

Revision History

•Revision 0.1—Preliminary draft.

•Revision 0.5—First edits from marketing and engineering.

•Revision 0.8—Manual reformatted, minor editorial and technical changes.

•Revision 0.9—Minor editorial and technical changes.

•Revision 1.0—Minor editorial and technical changes to figures.

•Revision 1.1—Minor editorial and technical changes.

•Revision 1.2—Changed power requirements in Section 2.2, Table 2.2; updated addresses in Appendix A

ii	TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION

Table of Contents

1. Introduction to the TriFlash with SD Interface ..................................................................................................	1-1
1.1. Scope.................................................................................................................................................	1-2
1.2. Product Models .................................................................................................................................	1-2
1.3. System Features.................................................................................................................................	1-2
1.4. SD Memory Card Standard ...............................................................................................................	1-3
1.5. Functional Description ......................................................................................................................	1-3
1.5.1. Flash Technology Independence.............................................................................................	1-4
1.5.2. Defect and Error Management ................................................................................................	1-4
1.5.3. Endurance ...............................................................................................................................	1-4
1.5.4. Wear Leveling.........................................................................................................................	1-4
1.5.5. Using the Erase Command......................................................................................................	1-5
1.5.6. Automatic Sleep Mode............................................................................................................	1-5
1.5.7. TriFlash—SD Bus Mode ........................................................................................................	1-5
1.5.7.1. TriFlash Standard Compliance ..............................................................................	1-5
1.5.7.2. Negotiating Operation Conditions .........................................................................	1-5
1.5.7.3. Device Acquisition and Identification ...................................................................	1-5
1.5.7.4. Device Status .........................................................................................................	1-6
1.5.7.5. Memory Array Partitioning....................................................................................	1-6
1.5.7.6. Read and Write Operations....................................................................................	1-8
1.5.7.7. Data Transfer Rate.................................................................................................	1-9
1.5.7.8. Data Protection ......................................................................................................	1-9
1.5.7.9. Erase ......................................................................................................................	1-9
1.5.7.10. Write Protection...................................................................................................	1-9
1.5.7.11. Optional Copyright Protection.............................................................................	1-9
1.5.7.12. Copy Bit...............................................................................................................	1-10
1.5.7.13. The CSD Register ................................................................................................	1-10
1.5.8. TriFlash—SPI Mode ...............................................................................................................	1-10
1.5.8.1. Negotiating Operating Conditions .........................................................................	1-10
1.5.8.2. Card Acquisition and Identification.......................................................................	1-10
1.5.8.3. Card Status.............................................................................................................	1-10
1.5.8.4. Memory Array Partitioning....................................................................................	1-10
1.5.8.5. Read and Write Operations....................................................................................	1-11
1.5.8.6. Data Transfer Rate.................................................................................................	1-11
1.5.8.7. Data Protection in the TriFlash..............................................................................	1-11
1.5.8.8. Erase ......................................................................................................................	1-11
1.5.8.9. Write Protection.....................................................................................................	1-11
2. Product Specifications ........................................................................................................................................	2-1
2.1. System Environmental Specifications...............................................................................................	2-1
2.2. Typical Power Requirements ............................................................................................................	2-1
2.3. System Performance..........................................................................................................................	2-2
2.4. System Reliability and Maintenance .................................................................................................	2-2
2.5. Physical Specifications......................................................................................................................	2-3
3. TriFlash Interface Description............................................................................................................................	3-1
3.1. General Description of Pins and Registers........................................................................................	3-1
3.1.1. Pin Assignments in SD Bus Mode ..........................................................................................	3-1
3.1.2. Pin Assignments in SPI Mode.................................................................................................	3-2
3.1.3. Registers..................................................................................................................................	3-2
3.2. SD Bus Topology..............................................................................................................................	3-3
3.3. SPI Bus Topology .............................................................................................................................	3-5
3.4. Electrical Interface ............................................................................................................................	3-6
3.4.1. Power-up .................................................................................................................................	3-6


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Table of Contents

3.4.2. Bus Operating Conditions.......................................................................................................	3-8
3.4.3. Bus Signal Levels....................................................................................................................	3-9
3.4.4. Bus Timing..............................................................................................................................	3-10
3.4.5. TriFlash-Specific Functions....................................................................................................	3-12
3.4.5.1. Ready/Busy Function [Output]..............................................................................	3-12
3.4.5.2. Write Protect Function [Input + Pullup] ................................................................	3-12
3.4.5.3. Reset Function [Input + Pullup].............................................................................	3-12
3.5. TriFlash Registers .............................................................................................................................	3-12
3.5.1. Operating Conditions Register (OCR) ....................................................................................	3-12
3.5.2. Card Identification (CID) Register..........................................................................................	3-14
3.5.3. CSD Register...........................................................................................................................	3-14
3.5.4. SCR Register...........................................................................................................................	3-21
3.5.5. Status Register.........................................................................................................................	3-22
3.5.6. SD Status.................................................................................................................................	3-24
3.5.7. RCA Register ..........................................................................................................................	3-25
3.5.8. TriFlash Registers in SPI Mode ..............................................................................................	3-25
3.6. Standard Data Interchange Format and Card Sizes...........................................................................	3-25
3.6.1. Data Interchange Format and Card Sizes with Optional Security...........................................	3-25
4. Secure Digital (SD) Bus Protocol Description ...................................................................................................	4-1
4.1. SD Bus Protocol................................................................................................................................	4-1
4.2. Protocol’s Functional Description.....................................................................................................	4-4
4.3. Card Identification Mode ..................................................................................................................	4-5
4.3.1. Reset........................................................................................................................................	4-6
4.3.2. Operating Voltage Range Validation ......................................................................................	4-7
4.3.3. Device Identification Process..................................................................................................	4-8
4.4. Data Transfer Mode ..........................................................................................................................	4-8
4.4.1. Wide Bus Selection/Deselection .............................................................................................	4-10
4.4.2. Data Read Format ...................................................................................................................	4-10
4.4.3. Data Write Format ..................................................................................................................	4-11
4.4.4. Write Protect Management .....................................................................................................	4-13
4.4.4.1. Device’s Internal Write Protection (Optional).......................................................	4-13
4.4.5. Card Lock/Unlock...................................................................................................................	4-13
4.4.6. Application Specific Commands.............................................................................................	4-13
4.5. Clock Control ....................................................................................................................................	4-14
4.6. Cyclic Redundancy Codes (CRC).....................................................................................................	4-15
4.7. Error Conditions................................................................................................................................	4-17
4.7.1. CRC and Illegal Command .....................................................................................................	4-17
4.7.2. Read, Write and Erase Time-out Conditions ..........................................................................	4-17
4.8. Commands.........................................................................................................................................	4-17
4.8.1. Command Types .....................................................................................................................	4-18
4.8.2. Command Format....................................................................................................................	4-18
4.8.3. Command Classes ...................................................................................................................	4-18
4.8.4. Detailed Command Description ..............................................................................................	4-20
4.9. Card State Transition Table...............................................................................................................	4-24
4.10. Responses........................................................................................................................................	4-26
4.11. Timings ...........................................................................................................................................	4-27
4.11.1. Command and Response .......................................................................................................	4-27
4.11.2. Data Read..............................................................................................................................	4-28
4.11.3. Data Write.............................................................................................................................	4-29
4.11.4. Timing Values.......................................................................................................................	4-31

iv	TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION

	Table of Contents
5. SPI Protocol Definition ......................................................................................................................................	5-1
5.1. SPI Bus Protocol ...............................................................................................................................	5-1
5.1.1. Mode Selection .......................................................................................................................	5-1
5.1.2. Bus Transfer Protection ..........................................................................................................	5-2
5.1.3. Data Read................................................................................................................................	5-2
5.1.4. Data Write...............................................................................................................................	5-3
5.1.5. Erase and Write Protect Management.....................................................................................	5-4
5.1.6. Read CID/CSD Registers........................................................................................................	5-5
5.1.7. Reset Sequence .......................................................................................................................	5-5
5.1.8. Clock Control..........................................................................................................................	5-5
5.1.9. Error Conditions......................................................................................................................	5-6
5.1.9.1. CRC and Illegal Commands ..................................................................................	5-6
5.1.9.2. Read, Write and Erase Time-out Conditions .........................................................	5-6
5.1.10. Memory Array Partitioning...................................................................................................	5-6
5.1.11. Card Lock/Unlock.................................................................................................................	5-7
5.1.12. Application Specific Commands...........................................................................................	5-7
5.1.13. Copyright Protection Commands..........................................................................................	5-7
5.2. SPI Command Set .............................................................................................................................	5-7
5.2.1. Command Format....................................................................................................................	5-7
5.2.2. Command Classes ...................................................................................................................	5-7
5.2.2.1. Detailed Command Description.............................................................................	5-8
5.2.3. Responses................................................................................................................................	5-12
5.2.3.1. Format R1 ..............................................................................................................	5-12
5.2.3.2. Format R1b ............................................................................................................	5-12
5.2.3.3. Format R2 ..............................................................................................................	5-12
5.2.3.4. Format R3 ..............................................................................................................	5-13
5.2.3.5. Data Response .......................................................................................................	5-14
5.2.4. Data Tokens ............................................................................................................................	5-14
5.2.5. Data Error Token ....................................................................................................................	5-15
5.2.6. Clearing Status Bits.................................................................................................................	5-15
5.3. Card Registers ...................................................................................................................................	5-15
5.4. SPI Bus Timing Diagrams.................................................................................................................	5-15
5.4.1. Command/Response................................................................................................................	5-16
5.4.2. Data Read................................................................................................................................	5-17
5.4.3. Data Write...............................................................................................................................	5-17
5.4.4. Timing Values.........................................................................................................................	5-18
5.5. SPI Electrical Interface......................................................................................................................	5-18
5.6. SPI Bus Operating Conditions ..........................................................................................................	5-19
5.7. Bus Timing........................................................................................................................................	5-19
Appendix A. Ordering Information........................................................................................................................	A-1
Appendix B. Technical Support Services...............................................................................................................	B-1
Appendix C. SanDisk Worldwide Sales Offices ....................................................................................................	C-1
Appendix D. Limited Warranty..............................................................................................................................	D-1


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vi	TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION

1. Introduction to the TriFlash with SD Interface

The SanDisk TriFlash is a very small, flash storage device, designed specifically for storage applications that put a premium on small form factor, low power and low cost. Flash is the ideal storage medium for portable, batterypowered devices. It features low power consumption and is non-volatile, requiring no power to maintain the stored data. It also has a wide operating range for temperature, shock and vibration.

TriFlash is well suited to meet the needs of small, low power, electronic devices. With a form factor as small as 10 mm by 12 mm and 1.1 mm thick, TriFlash is expected to be used in a wide variety of portable devices like mobile phones, pagers, and voice recorders.

To support this wide range of applications, the TriFlash is offered with either the MultiMediaCard (see TriFlash with MultiMediaCard Interface Product Manual) or Secure Digital (SD) interface. The SD interface product is fully compatible with SD cards, provides a 4-bit data bus for maximum performance, and, optionally, has the full SD security features. For compatibility with existing controllers, the TriFlash offers, in addition to these interfaces, an alternate communication protocol based on the SPI standard.

These interfaces allow for easy integration into any design, regardless of microprocessor used. All device and interface configuration data (such as maximum frequency and card identification) are stored on the device.

The TriFlash provides up to 1024 million bits of memory using SanDisk Flash memory chips, which were designed by SanDisk especially for use in mass storage applications. In addition to the mass storage specific flash memory chip, the TriFlash includes an intelligent controller, which manages interface protocols, and data storage and retrieval, as well as Error Correction Code (ECC) algorithms, defect handling and diagnostics, power management and clock control. Figure 1-1 is a block diagram of the TriFlash with SD Interface.

SD Bus/SPI Bus

Interface

	Data
SanDisk	In/Out	Data
SanDisk
Single
Single		Flash
Chip	Control	Flash
Chip		Modules
Controller


SanDisk TriFlash

Figure 1-1. TriFlash with SD Interface Block Diagram

1-1

Introduction to the TriFlash with SD Interface

1.1. Scope

This document describes the key features and specifications of the TriFlash with SD interface, as well as the information required to interface this product to a host system.

1.2. Product Models

The TriFlash is available in the capacities shown in Table 1-1.

Table 1-1. TriFlash Capacities

SD Model No.	Capacities

SDAT2FAH-128	128 Mb

SDBT2FAH-256	256 Mb

SDBT2FCH-512	512 Mb

SDBT2FCH-1024	1024 Mb

1.3. System Features

TriFlash provides the following system features:

•Up to 1024 Mbits of data storage.

•SD Memory Card protocol compatible.

•Supports SPI Mode.

•Targeted for portable and stationary applications for secured (copyrights protected) and non-secured data storage.

•Voltage range:

−Basic communication (CMD0, CMD15, CMD55, ACMD41): 2.0—3.6V.

−Other commands and memory access: 2.7—3.6V.

•Variable clock rate 0—25 MHz.

•Up to 12.5MByte/sec data transfer rate (using 4 parallel data lines).

•Maximum data rate with up to 10 devices or cards.

•Correction of memory field errors.

•Optional Copyrights Protection Mechanism—Complies with highest security of SDMI standard.

•Built-in write protection features (permanent and temporary).

•Application specific commands.

•Comfortable erase mechanism.

•Standard footprint across all capacities.

1-2	TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION

Introduction to the TriFlash with SD Interface

The performance of the communication channel is described in Table 1-2.

Table 1-2. SD Bus/SPI Bus Comparison

TriFlash Using SD Bus	TriFlash Using SPI Bus
Six-wire communication channel (clock, command, 4	Three-wire serial data bus (Clock, dataIn, dataOut) + card
data lines).	specific CS signal (hardwired card selection).
Error-protected data transfer.	Optional non-protected data transfer mode available.
Single or multiple block oriented data transfer.	Single or multiple block oriented data transfer.

1.4. SD Memory Card Standard

The SanDisk TriFlash is fully compatible with the SD Memory Card Physical Layer Specification standard listed below:

The SD Memory Card Physical Layer System Specification

Version 1.01

This specification may be obtained from:

SD Card Association 53 Muckelemi St. P.O. Box 189

San Juan Bautista, CA 95045-0189 USA

Phone: 831-623-2107

Fax: 831-623-2248

Email: rcreech@sdcard.org http://www.sdcard.org

1.5. Functional Description

The SanDisk TriFlash contains a high level, intelligent subsystem as shown in the block diagram, Figure 1-1. This intelligent (microprocessor) subsystem provides many capabilities not found in other types of devices. These capabilities include:

•Host independence from details of erasing and programming flash memory.

•Sophisticated system for managing defects (analogous to systems found in magnetic disk drives).

•Sophisticated system for error recovery including a powerful error correction code (ECC).

•Power management for low power operation.

1-3

Introduction to the TriFlash with SD Interface

1.5.1. Flash Technology Independence

The 512-byte sector size of the TriFlash is the same as that in an IDE magnetic disk drive. To write or read a sector (or multiple sectors), the host computer software simply issues a Read or Write command to the TriFlash. This command contains the address. The host software then waits for the command to complete. The host software does not get involved in the details of how the flash memory is erased, programmed or read. This is extremely important as flash devices are expected to get more and more complex in the future. Because the TriFlash uses an intelligent on-board controller, the host system software will not require changing as new flash memory evolves. In other words, systems that support the TriFlash today will be able to access future SanDisk TriFlash devices built with new flash technology without having to update or change host software.

1.5.2. Defect and Error Management

The TriFlash contains a sophisticated defect and error management system. This system is analogous to the systems found in magnetic disk drives and in many cases offers enhancements. For instance, disk drives do not typically perform a read after write to confirm the data is written correctly because of the performance penalty that would be incurred. The TriFlash does a read after write under margin conditions to verify that the data is written correctly. In the rare case that a bit is found to be defective, the TriFlash replaces this bad bit with a spare bit within the sector header. If necessary, the TriFlash will even replace the entire sector with a spare sector. This is completely transparent to the host and does not consume any user data space.

The TriFlash device’s soft error rate specification is much better than the magnetic disk drive specification. In the extremely rare case a read error does occur, the TriFlash has innovative algorithms to recover the data. This is similar to using retries on a disk drive but is much more sophisticated. The last line of defense is to employ a powerful ECC to correct the data. If ECC is used to recover data, defective bits are replaced with spare bits to ensure they do not cause any future problems.

These defect and error management systems coupled with the solid-state construction give the TriFlash unparalleled reliability.

1.5.3. Endurance

The SanDisk TriFlash has an endurance specification for each sector of 300,000 or 100,000 writes (reading a logical sector is unlimited) under typical conditions (depending on the model, refer to Table 2-4). This is far beyond what is needed in nearly all applications of TriFlash devices. Even very heavy use of the TriFlash in cellular phones, personal communicators, pagers and voice recorders will use only a fraction of the total endurance over the typical device’s five year lifetime. For instance, it would take over 34 years to wear out an area on the TriFlash on which a file of any size (from 512 bytes to capacity) was rewritten 3 times per hour, 8 hours a day, 365 days per year.

With typical applications, the endurance limit is not of any practical concern to the vast majority of users.

1.5.4. Wear Leveling

The SanDisk TriFlash does not require or perform a Wear Level operation.

1-4	TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION

Introduction to the TriFlash with SD Interface

1.5.5. Using the Erase Command

The Erase command provides the capability to substantially increase the write performance of the TriFlash. Once a sector has been erased using the Erase command, a write to that sector will be much faster. This is because a normal write operation includes a separate sector erase prior to write.

1.5.6. Automatic Sleep Mode

A unique feature of the SanDisk TriFlash (and other SanDisk products) is automatic entrance and exit from sleep mode. Upon completion of an operation, the TriFlash will enter the sleep mode to conserve power if no further commands are received within 5 msec. The host does not have to take any action for this to occur. In most systems, the TriFlash is in sleep mode except when the host is accessing it, thus conserving power.

When the host is ready to access the TriFlash and it is in sleep mode, any command issued to the TriFlash will cause it to exit sleep and respond.

1.5.7. TriFlash—SD Bus Mode

The following sections provide valuable information for TriFlash in SD Bus Mode.

1.5.7.1. TriFlash Standard Compliance

The TriFlash is fully compliant with the SD Memory Card Physical Layer Standard Specification V1.01. The structure of the Card Specific Data (CSD) register is compliant with CSD Structure 1.0.

1.5.7.2. Negotiating Operation Conditions

The TriFlash supports the operation condition verification sequence defined in the SD Memory Card Standard Specifications. Should the TriFlash host define an operating voltage range, which is not supported by the TriFlash, it will put itself in an inactive state and ignore any bus communication. The only way to get the TriFlash out of the inactive state is by powering it down and up again.

In addition, the host can explicitly send the TriFlash to the inactive state by using the GO_INACTIVE_STATE command.

1.5.7.3. Device Acquisition and Identification

The SD bus is a single master (TriFlash host application) and multi-slaves (devices) bus. The Clock and Power lines are common to all devices on the bus. During the identification process, the host accesses each device separately through its own command lines. The TriFlash device’s CID register is pre-programmed with a unique card identification number, which is used during the identification procedure.

1-5

Introduction to the TriFlash with SD Interface

In addition, the TriFlash host can read the device’s CID register using the READ_CID command. The CID register is programmed during the TriFlash testing and formatting procedure, on the manufacturing floor. The TriFlash host can only read this register and not write to it.

An internal pull-up resistor on the DAT3 line may be used for device detection (insertion/removal). The resistor can be disconnected during data transfer (using ACMD42).

1.5.7.4. Device Status

The device status is separated into two fields: CardStatus and SD_Status.

•CardStatus is stored in a 32 bit status register which is sent as the data field in the card response to host commands. Status register provides information about the device’s current state and completion codes for the last host command. The card status can be explicitly read (polled) with the SEND_STATUS command.

•SD_Status is stored in 512 bits, which are sent as a single data block after it was requested by the host using the SD_STATUS (ACMD13) command. SD_STATUS contains extended status bits that relate to BUS_WIDTH, security related bits and future specific applications.

1.5.7.5.Memory Array Partitioning

The basic unit of data transfer to/from the TriFlash is one byte. All data transfer operations which require a block size always define block lengths as integer multiples of bytes. Some special functions need other partition granularity.

For block-oriented commands, the following definition is used:

•Block—The unit that is related to the block oriented read and write commands. Its size is the number of bytes that will be transferred when one block command is sent by the host. The size of a block is either programmable or fixed. The information about allowed block sizes and the programmability is stored in the CSD.

The granularity of the erasable units is in general not the same as for the block-oriented commands:

•Sector—The unit that is related to the erase commands. Its size is the number of blocks that will be erased in one portion. The size of a sector is fixed for each device. The information about the sector size (in blocks) is stored in the CSD.

For devices that include write protection, the following definition is used:

•WP Group—The minimal unit that may have individual write protection. Its size is the number of groups that will be write protected by one bit. The size of a WP-group is fixed for each device. The information about the size is stored in the CSD.

1-6	TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION

Introduction to the TriFlash with SD Interface

TriFlash

WP Group 0

Sector 1

Sector 2

Block	Block
0	1

Block	Block
2	n

Sector 3

Sector n

WP Group 1

WP Group n

Protected Area (Copyright protection)

Sector 1	Block
	0
Sector n

Block	Block	Block
1	2	n

Figure 1-2. Memory Array Partitioning

Table 1-3. Memory Array Structures Summary1

Part Number	Block Size	Protected Area	User Area
	(Byte)	Size (Blocks)2	(Blocks)
SDBT2FCH-1024	512	--	250, 880

SDBT2FCH-512	512	--	125,440
SDBT2FAH-256	512	--	62,720

SDAT2FAH-128	512	--	31,360

1All measurements are in units per card.

2The part of the TriFlash with separate DOS partitioning that includes sectors and blocks. The card write protection mechanism does not affect this area.

1-7

Introduction to the TriFlash with SD Interface

1.5.7.6. Read and Write Operations

The TriFlash supports two read/write modes as shown in Figure 1-3.

Multiple Block Mode

Memory

Sectors

Write

Read

Start

Stop Start

Stop

Address

Single Block Mode

Misalignment Error

Memory

Sectors

Start	Start	Start
Address	Address	Address
(Read)	(Write)	(Read/Write)

Figure 1-3. Data Transfer Formats

Single Block Mode

In this mode the host reads or writes one data block in a pre-specified length. The data block transmission is protected with 16-bit CRC, which is generated by the sending unit and checked by the receiving unit.

The block length, for read operations, is limited by the device sector size (512 bytes) but can be as small as a single byte. Misalignment is not allowed. Every data block must be contained in a single physical sector.

The block length for write operations must be identical to the sector size and the start address aligned to a sector boundary.

Multiple Block Mode

This mode is similar to the single block mode, but the host can read/write multiple data blocks (all have the same length), which will be stored or retrieved from contiguous memory addresses starting at the address specified in the command.

The operation is terminated with a stop transmission command.

Misalignment and block length restrictions apply to multiple blocks as well and are identical to the single block read/write operations.

1-8	TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION

Introduction to the TriFlash with SD Interface

1.5.7.7. Data Transfer Rate

The TriFlash can be operated using either a single data line (DAT0) or four data lines (DAT0-DAT3) for data transfer. The maximum data transfer rate for a single data line is 25 Mb per second and for four data lines it is 100 Mb (12.5 MB) per second.

1.5.7.8. Data Protection

Every sector is protected with an Error Correction Code (ECC). The ECC is generated (in the memory card) when the sectors are written and validated when the data is read. If defects are found, the data is corrected prior to transmission to the host.

1.5.7.9. Erase

The smallest erasable unit in the TriFlash is a sector. In order to speed up the erase procedure, multiple sectors can be erased at the same time.

To facilitate selection, a first command with the starting address is followed by a second command with the final address, and all sectors within this range will be selected for erase.

1.5.7.10. Write Protection

Two device level write protection options are available: permanent and temporary. Both can be set using the PROGRAM_CSD command (see below). The permanent write protect bit, once set, cannot be cleared. This feature is implemented in the TriFlash controller firmware and not with a physical OTP cell.

1.5.7.11. Optional Copyright Protection

A detailed description of the optional Copyright Protection mechanism and related security commands can be found in the SD Memory Card Security Specification document from the SD Card Association. All TriFlash security related commands operate in the data transfer mode.

As defined in the SDMI specification, the data content that is saved in the device is saved already encrypted and it passes transparently to and from the device. No operation is done on the data and there is no restriction to read the data at any time. Associated with every data packet (song, for example) that is saved in the unprotected memory there is a special data that is saved in a protected memory area. For any access (any Read, Write or Erase command) from/to the data in the protected area. For an authentication procedure is done between the TriFlash and the connected device, either the LCM (PC for example) or the PD (portable device, such as SD player). After the authentication process passes, the TriFlash is ready to accept or give data from/to the connected device. While the TriFlash is in the secured mode of operation (after the authentication succeeded) the argument and the associated data that is sent to the TriFlash or read from the TriFlash are encrypted. At the end of the Read, Write or Erase operation, the TriFlash automatically gets out of its secured mode.

1-9

Introduction to the TriFlash with SD Interface

1.5.7.12. Copy Bit

The content of a TriFlash can be marked as an original or a copy using the copy bit in the CSD register. Once the Copy bit is set (marked as a copy) it cannot be cleared. The Copy bit of the TriFlash is programmed (during test and formatting on the manufacturing floor) as a copy. The TriFlash can be purchased with the copy bit set (copy) or cleared, indicating the TriFlash is a master. This feature is implemented in the TriFlash controller firmware and not with a physical OTP cell.

1.5.7.13. The CSD Register

All the configuration information of the TriFlash is stored in the CSD register. The MSB bytes of the register contain manufacturer data and the two least significant bytes contain the host controlled data, the card Copy, write protection and the user file format indication.

The host can read the CSD register and alter the host controlled data bytes using the SEND_CSD and PROGRAM_CSD commands.

1.5.8. TriFlash—SPI Mode

The SPI mode is a secondary communication protocol for TriFlash devices. This mode is a subset of the SD Bus protocol, designed to communicate with an SPI channel, commonly found in Motorola’s (and lately a few other vendors’) microcontrollers.

1.5.8.1. Negotiating Operating Conditions

The operating condition negotiation function of the SD Bus is supported differently in SPI mode by using the READ_OCR (CMD58) command. The host shall work within the valid voltage range (2.7 to 3.6 volts) of the device or put the device in an inactive state by sending a GO_INACTIVE command to the device.

1.5.8.2. Card Acquisition and Identification

The host must know the number of devices currently connected on the bus. Specific device selection is done via the CS signal. The internal pull-up resistor on the CD line may be used for device detection (insertion/removal).

1.5.8.3. Card Status

In SPI mode, only 16 bits (containing the errors relevant to SPI mode) can be read out of the 32-bit TriFlash status register. The SD_STATUS can be read using ACMD13, the same as in SD Bus mode.

1.5.8.4. Memory Array Partitioning

Memory partitioning in SPI mode is equivalent to SD Bus mode. All read and write commands are byte addressable with the limitations given in section 1.5.7.5 above.

1-10	TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION

Introduction to the TriFlash with SD Interface

1.5.8.5. Read and Write Operations

In SPI mode, both single and multiple block data transfer modes are supported.

1.5.8.6. Data Transfer Rate

In the SPI mode, only one data line is used for each direction. The SPI mode data transfer rate is the same as the SD Bus mode data transfer rate when using one data line only (up to 25Mbits per second).

1.5.8.7. Data Protection in the TriFlash

Same as for the SD Bus mode.

1.5.8.8. Erase

Same as in SD Bus mode.

1.5.8.9. Write Protection

Same as in SD Bus mode.

1-11

Introduction to the TriFlash with SD Interface

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1-12	TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION

2. Product Specifications

For the specifications in the following sections, values are defined at ambient temperature and nominal supply voltage unless otherwise stated.

2.1. System Environmental Specifications

Table 2-1. System Environmental Specifications

Temperature	Operating:	-25° C to 85° C
	Non-Operating:	-40° C to 85° C
Humidity	Operating:	8% to 95%, non-condensing
	Non-Operating:	8% to 95%, non-condensing
ESD Protection		± 2kV, Human body model

Vibration	Operating:	15 G peak to peak max.
	Non-Operating:	15 G peak to peak max.
Shock	Operating:	1,000 G max.
	Non-Operating:	1,000 G max.
Altitude (relative to sea level)	Operating:	80,000 feet max.
	Non-Operating:	80,000 feet max.

2.2. Typical Power Requirements

Table 2-2. Power Requirements

VDD (ripple: max, 60 mV peak to peak) 2.7 V—3.6 V

		(Ta = -25 – 85C)
	@ VDD = 2.7V		@ VDD = 3.6V

Operating current (maximum rates)	Read: 30 mA		Read: 40 mA
Fclk = 25 MHz, 0.5 Mbyte/s	Read: 30 mA		Read: 40 mA
Fclk = 25 MHz, 0.5 Mbyte/s	Write: 35 mA		Write: 45 mA
Read/Write speed	Write: 35 mA		Write: 45 mA
Read/Write speed

			(Ta = -25 – 85C)
		Typical		Maximum
Sleep Current	@ 2.7 V	40 uA		120 uA

	@3.3 V	50 uA		150 uA
	@3.3 V	50 uA		150 uA

2-1

Product Specifications

2.3. System Performance

Table 2-3. System Performance1

	Typical	Maximum

Block Read Access Time	1.5 msec	100 msec

CMD1 to Ready (after power up)	50 msec	100 msec

Sleep to Ready	1 msec	2 msec

2.4. System Reliability and Maintenance

Table 2-4. System Reliability and Maintenance Specifications

MTBF	> 1,000,000 hours

Preventive Maintenance	None

Data Reliability	< 1 non-recoverable error in 1014 bits read
Endurance
SDxT2FAH-xxx	≥ 300,000 erase/program cycles per block typical
Endurance
SDxT2FCH-xxx	≥ 100,000 erase/program cycles per block typical

1All values quoted are under the following conditions:

a)Voltage range: 2.7 V to 3.6 V.

b)Temperature range: -25° C to 85° C.

c)Are independent of the TriFlash clock frequency.

2-2	TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION

sandisk SDAT2FAH-128, SDBT2FAH-256, SDBT2FCH-512, SDBT2FCH-1024 User guide

Product Specifications

2.5. Physical Specifications

The SanDisk TriFlash is a 44and 56-pin Thin Fine-Pitched Ball Grid Array (TFBGA). See Figure 2-1 (56-pin) and Figure 2-2 (44-pin) for the physical specifications and dimensions. See Figure 2-3 for a top view of the pin definitions.

aaa

"B"

<![if ! IE]>

<![endif]>D

aaa

			A	B
E1		(NOTE 6)
E1
<![if ! IE]> <![endif]>e			1
<![if ! IE]> <![endif]>D1	<![if ! IE]> <![endif]>D2	<![if ! IE]> <![endif]>D3	2	b
<![if ! IE]> <![endif]>D1	<![if ! IE]> <![endif]>D2	<![if ! IE]> <![endif]>D3

			3	(NOTE 3)
			3
			DETAIL: B
A B C D E F G H			Oeee M C A B
A B C D E F G H			O fff M	C
			O fff M	C

								Non-functional
								balls (12 places)
					bbb C			Cavity
					bbb C
"A"
					<![if ! IE]> <![endif]>A2			<![if ! IE]> <![endif]>A
								<![if ! IE]> <![endif]>A1
						C		Solder Ball
							ddd C	Seating Plane
								Seating Plane
								(NOTE 2)
								DETAIL: A
	Dimension in mm			Dimension in inch
Symbol	MIN	NOM	MAX	Min	NOM	MAX		NOTE:
A	---	---	1.10	---	---	0.043
A1	0.32	0.35	0.38	0.013	0.014	0.015		1. Controlling Dimension: Millimeter.
A2	0.62	0.67	0.72	0.024	0.026	0.028
D	17.90	18.00	18.10	0.705	0.709	0.713		2. Primary Datum C and seating plane are defined by the
E	11.90	12.00	12.10	0.469	0.472	0.476		spherical crowns of the solder balls.
D1	---	7.00	---	---	0.276	---		3. Dimensions b is measured at the maximum solder ball
D2	---	11.00	---	---	0.433	---		3. Dimensions b is measured at the maximum solder ball
D3	---	13.00	---	---	0.512	---		diameter, parallel to Primary Datum C.
E1	---	7.00	---	---	0.276	---		4. There shall be a minimum clearance of 0.25mm between
e	---	1.00	---	---	0.039	---		4. There shall be a minimum clearance of 0.25mm between
b	0.40	0.45	0.50	0.016	0.018	0.020		the edge of the solder ball and the body edge.
aaa		0.10			0.004			5. Reference document: JEDEC MO-205.
bbb		0.10			0.004			5. Reference document: JEDEC MO-205.
bbb		0.10			0.004
ddd		0.15			0.006			6. The pattern of Pin 1 Fiducial is for reference only.
eee		0.25			0.010			6. The pattern of Pin 1 Fiducial is for reference only.
eee		0.25			0.010
fff		0.10			0.004			7. All numbers are in mm.
MD/ME		12/11			12/11			7. All numbers are in mm.
MD/ME		12/11			12/11

8. All numbers are typical unless otherwise stated.

Figure 2-1. TriFlash Physical Specifications—18 X 12mm Package

2-3

Product Specifications

aaa

A1	B
	<![if ! IE]> <![endif]>E

aaa

"A"

	H
	G
	F
	E	<![if ! IE]> <![endif]>E1
	D	<![if ! IE]> <![endif]>E1
	D
	C
	B
	A
	"B"	1 2 3 4 5 6 7 8

	Dimension in mm			Dimension in inch
Symbol	MIN	NOM	MAX	Min	NOM	MAX
A	---	---	1.10	---	---	0.043
A1	0.32	0.35	0.38	0.013	0.014	0.015
A2	0.62	0.67	0.72	0.024	0.026	0.028
D	11.90	12.00	12.10	0.469	0.472	0.476
E	9.90	10.00	10.10	0.390	0.394	0.398
D1	---	7.00	---	---	0.276	---
E1	---	7.00	---	---	0.276	---
e	---	1.00	---	---	0.039	---
b	0.40	0.45	0.50	0.016	0.018	0.020
aaa		0.10			0.004
bbb		0.10			0.004
ddd		0.15			0.006
eee		0.25			0.010
fff		0.10			0.004
MD/ME		8/8			8/8

bbb C	Cavity
bbb C
<![if ! IE]> <![endif]>A2		<![if ! IE]> <![endif]>A
		<![if ! IE]> <![endif]>A1
C	Solder Ball
ddd C	Seating Plane
	Seating Plane
	(NOTE 2)
DETAIL: A
Oeee M C A B
O fff M	C
B		<![if ! IE]> <![endif]>3)
B		<![if ! IE]> <![endif]>(NOTE
A	<![if ! IE]> <![endif]>b	<![if ! IE]> <![endif]>(NOTE
A

(NOTE 6)

DETAIL: B

NOTE:

1.Controlling Dimension: Millimeter.

2.Primary Datum C and seating plane are defined by the spherical crowns of the solder balls.

3.Dimensions b is measured at the maximum solder ball diameter, parallel to Primary Datum C.

4.There shall be a minimum clearance of 0.25mm between the edge of the solder ball and the body edge.

5.Reference document: JEDEC MO-205.

6.The pattern of Pin 1 Fiducial is for reference only.

Figure 2-2. TriFlash Physical Specifications—12 X 10mm Package

2-4	TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION

Product Specifications

	H7	H6	H5	H4	H3	H2
	GND	VDD	DU	DU	DU	GND
G8	G7	G6	G5	G4	G3	G2	G1
DU	RSTB	DAT2	CSB_DAT3	CMD	DAT1	DAT0	CLK
F8	F7					F2	F1
DU	DU					DU	VDD
E8	E7					E2	E1
DU	DU					DU	DU
D8	D7					D2	D1
DU	DU					DU	GND
C8	C7					C2	C1
DU	DU					DU	VDD
B8	B7	B6	B5	B4	B3	B2	B1
DU	DU	DU	WPSB	SEL_B	SEL_A	RDY/BSY	GND
	A7	A6	A5	A4	A3	A2
	GND	VDD	DU	DU	DU	VDD

NOTE: DU=Don't Use.

Pin A1 ID

Figure 2-3. TriFlash Pinout (Top View)

2-5

Product Specifications

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2-6	TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION

3. TriFlash Interface Description

3.1. General Description of Pins and Registers

The TriFlash is a TFBGA package with 44 core balls (see Figure 2-3). The host is connected to the TriFlash using the 11 interface connections shown on following 2 tables, plus power and ground balls.

3.1.1. Pin Assignments in SD Bus Mode

Table 3-1. SD Bus Mode Pad Definition

Pin #	Name	Type1	Function	Comment
H6, F1, C1, A2, A6	VDD	S	Supply Voltage

H7, H2, D1, B1, A7	VSS	S	Supply Voltage Ground
G2	DAT0	I/O	Data Line [Bit 0]
G3	DAT12	I/O	Data Line [Bit 1]
G6	DAT2	I/O	Data Line [Bit 2]

G5	DAT3	I/O3	Data Line [Bit 3]
G1	CLK	I	Clock

G4	CMD	I/O	Command/Response

B5	WPB	I	Write Protect (Active Low)

G7	RSTB	I	Reset (Active Low)
B2	RDY/BSY	O	Ready/Busy Interrupt
B3	SEL_A	I	Defines I/F	Pull up to VDD

B4	SEL_B	I	Defines I/F	Pull up to VDD

1S=power supply; I=input; O=output using push-pull drivers.

2The extended DAT lines (DAT1-DAT3) are inputs on power up. They start to operate as DAT lines after the SET_BUS_WIDTH command.

3After power up, this line is input with 50KOhm pull-up (can be used for device detection or SPI mode selection). The pull-up should be disconnected by the user, during regular data transfer, with SET_CLR_CARD_DETECT (ACMD42) command.

3-1

TriFlash Interface Description

3.1.2. Pin Assignments in SPI Mode

Table 3-2. SPI Bus Mode Pad Definition

Pin #	Name	Type	Function	Comment
		4

H6, F1, C1, A2, A6	VDD	S	Supply Voltage

H7, H2, D1, B1, A7	VSS	S	Supply Voltage Ground

G2	DataOut	I/O	Device to Host Data and Status

G3	DAT1	I/O	Unused	Pull up to VDD

G6	DAT2	I/O	Unused	Pull up to VDD

G5	CS	I	Chip Select (Active low)

G1	CLK	I	Clock
G4	DataIn	I	Host to Device Commands and Data
B5	WPB	I	Write Protect (Active low)

G7	RSTB	I	Reset (Active low)

B2	RDY/BSY	O	Ready/Busy Interrupt

B3	SEL_A	I	Defines I/F	Pull up to VDD

B4	SEL_B	I	Defines I/F	Pull up to VDD

3.1.3. Registers

Each device has a set of information registers. A detailed description is given in Section 3.5.

		Table 3-3. TriFlash Registers
Name	Width	Description

CID	128	Card identification number: individual card number for identification.

RCA5	16	Relative card address: local system address of a device, dynamically
		suggested by the device and approved by the host during initialization.
CSD	128	Card specific data: information about the device operation conditions.
SCR	64	SD Configuration Register: information about the TriFlash’s special
		features capabilities.
OCR	32	Operation Condition Register.

The host may reset the devices by switching the power supply off and on again, or toggling the Reset pin. The device has its own power-on detection circuitry, which puts the device into an idle state after the power-on. The device can also be reset by sending the GO_IDLE (CMD0) command.

4S=power supply; I=input; O=output using push-pull drivers.

5The RCA register is not used (not available) in SPI Mode.

3-2	TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION

TriFlash Interface Description

DAT2 CD/DAT3 CMD RDY/BSY VDD	CLK RSTB WPB DAT0 DAT1
Interface Driver
OCR[31:0]
CID[127:0]
RCA[15:0]	Card Interface		<![if ! IE]> <![endif]>Connection
DSR[15:0]	Controller
CSD[127:0]		reset
		reset
SCR[63:0]
SCR[63:0]			<![if ! IE]> <![endif]>Power
Memory Core Interface		reset	<![if ! IE]> <![endif]>Power
Memory Core Interface		reset
Memory Core

Figure 3-1. TriFlash Architecture

3.2. SD Bus Topology

The SD bus has six communication lines and three supply lines:

•CMD—Command is a bi-directional signal. (Host and device drivers are operating in push pull mode.)

•DAT0-3—Data lines are bi-directional signals. (Host and device drivers are operating in push pull mode.)

•CLK—Clock is a host to devices signal. (CLK operates in push pull mode.)

•VDD—VDD is the power supply line for all devices.

•VSS—VSS are ground lines.

3-3

TriFlash Interface Description

Figure 3-2 shows the bus topology of several devices with one host in SD Bus mode.

HOST

CLK	CLK
CLK
Vdd	Vdd
Vdd	Vss	TriFlash (A)
Vss	Vss	TriFlash (A)
Vss
D0-3(A),	D0-D3, CMD
CMD(A)
	CLK
	Vdd
	Vss	SD Memory
		Card (B)
D0-3(B),	D0-D3, CMD
CMD(B)

	CLK
	Vdd
	Vss	MultiMediaCard
		(C)
D0-3(C)	D0, CS, CMD	D1&D2 Not
D0-3(C)		D1&D2 Not
CMD(C)		Connected

Figure 3-2. TriFlash System Bus Topology

During the initialization process, commands are sent to each device individually, allowing the application to detect the devices and assign logical addresses to the physical slots. Data is always sent to each device individually. However, to simplify the handling of the card stack, after initialization, all commands may be sent concurrently to all devices. Addressing information is provided in the command packet.

The SD Bus allows dynamic configuration of the number of data lines. After power-up, by default, the TriFlash will use only DAT0 for data transfer. After initialization, the host can change the bus width (number of active data lines). This feature allows an easy trade off between hardware cost and system performance.

3-4	TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION

TriFlash Interface Description

RDAT RCM	V SS
	CMD
TriFlash	DAT 0-3
Host	CLK
	CLK
C1 C 2	C3

Figure 3-3. SD Bus Circuitry Diagram

RDAT and RCMD are pull-up resistors protecting the CMD and the DAT line against bus floating when all device drivers are in a hi-impedance mode. Refer to Table 3-5 for the component values and conditions. C1, C2 and C3 are

the equivalent load capacitance (CL) of each line in the bus.

3.3. SPI Bus Topology

The TriFlash SPI interface is compatible with SPI hosts available on the market. As with any other SPI device the TriFlash SPI channel consists of the following 4 signals:

•CS—Host to device Chip Select signal.

•CLK—Host to device clock signal

•DataIn—Host to device data signal.

•DataOut—Device to host data signal.

Another SPI common characteristic, which is implemented in the TriFlash as well, is byte transfers. All data tokens are multiples of 8 bit bytes and always byte aligned to the CS signal.

The SPI standard defines the physical link only and not the complete data transfer protocol. In SPI Bus mode, the TriFlash uses a subset of the SD protocol and command set.

The TriFlash identification and addressing algorithms are replaced by a hardware Chip Select (CS) signal. A device (slave) is selected, for every command, by asserting (active low) the CS signal (see Figure 3-4).

The CS signal must be continuously active for the duration of the SPI transaction (command, response and data). The only exception is device programming time. At this time the host can de-assert the CS signal without affecting the programming process.

The bi-directional CMD and DAT lines are replaced by uni-directional DataIn and DataOut signals. This eliminates the ability of executing commands while data is being read or written. An exception is the multi read/write operations. The Stop Transmission command can be sent during data read. In the multi block write operation a Stop Transmission token is sent as the first byte of the data block.

3-5

TriFlash Interface Description

Power	SPI Bus	CS
		CS
Supply	Master

SPI Bus (CLK, DataIN, DataOut)

TriFlash		SPI
Card		Card

Figure 3-4. SPI Bus System

3.4. Electrical Interface

The following sections provide valuable information on TriFlash’s electrical interface.

3.4.1. Power-up

The power up of the bus is handled locally in each TriFlash and in the bus master.

3-6	TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION

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