SanDisk CompactFlash Extreme III, 20-10-00038 User Manual

SanDisk CompactFlash Memory Card

SanDisk Corporation

Corporate Headquarters 601 McCarthy Boulevard Milpitas, CA 95035 (408) 801-1000 Phone (408) 801-8657 Fax

www.sandisk.com

OEM Product Manual

Version 12.0

Document No. 20-10-00038

02/2007

SanDisk CompactFlash Card OEM Product Manual

SanDisk® Corporation general policy does not recommend the use of its products in life support applications where in a failure or malfunction of the product may directly threaten life or injury. Per SanDisk Terms and Conditions of Sale, the user of SanDisk products in life support applications assumes all risk of such use and indemnifies SanDisk against all damages. Security safeguards, by their nature, are capable of circumvention. SanDisk cannot, and does not, guarantee that data will not be accessed by unauthorized persons, and SanDisk disclaims any warranties to that effect to the fullest extent permitted by law.

This document is for information use only and is subject to change without prior notice. SanDisk Corporation assumes no responsibility for any errors that may appear in this document, nor for incidental or consequential damages resulting from the furnishing, performance or use of this material. No part of this document may be reproduced, transmitted, transcribed, stored in a retrievable manner or translated into any language or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise, without the prior written consent of an officer of SanDisk Corporation.

All parts of the SanDisk documentation are protected by copyright law and all rights are reserved. SanDisk and the SanDisk logo are trademarks of SanDisk Corporation, registered in the United States and other countries. CompactFlash is a U.S. registered trademark of SanDisk Corporation.

Product names mentioned herein are for identification purposes only and may be trademarks and/or registered trademarks of their respective companies.

SanDisk products are covered or licensed under one or more of the following U.S. Patent Nos. 5,070,032; 5,095,344; 5,168,465; 5,172,338; 5,198,380; 5,200,959; 5,268,318; 5,268,870; 5,272,669; 5,418,752; 5,602,987. Other U.S. and foreign patents awarded and pending.

Document 20-10-00038 Rev. 12.0

Revision History

Date Revision Description

February 2007 12.0 Merged CFlash 11.2 manual with CF ExtremeIII

v1.2 to create v12.0; updated to comply with CFA Spec v4.0.

SanDisk CompactFlash Card OEM Product Manual

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Table of Contents

CHAPTER 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

CompactFlash Standard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-2

PCMCIA Standard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3

Related Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3

Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3

CHAPTER 2 Product Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

System Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . 2-1

System Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

System Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

System Reliability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4

Physical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4

CHAPTER 3 Interface Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

Physical Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

Electrical Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3

Electrical Specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-8

Card Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-20

I/O Transfer Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-25

True IDE Mode I/O Transfer Function . . . . . . . . . . . . . . . . . . . . . . .3-26

CHAPTER 4 ATA Register Set and Protocol . . . . . . . . . . . . . . . . . . . . . . . . 4-1

I/O Primary and Secondary Address Configurations . . . . . . . . . . . . 4-1

Contiguous I/O Mapped Addressing . . . . . . . . . . . . . . . . . . . . . . . . . 4-2

Table of Contents SanDisk CompactFlash Card OEM Product Manual

Memory Mapped Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-3

True IDE Mode Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-4

ATA Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-4

CHAPTER 5 ATA Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

ATA Command Set. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1

Error Posting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-29

CHAPTER 6 CIS Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1

APPENDIX A Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-1

APPENDIX B Limited Warranty . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-1

APPENDIX C Disclaimer of Liability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C-1

CHAPTER 1 Introduction

1.1 General Description

SanDisk CompactFlash® Memory Card products provide high capacity solid-state flash memory that electrically complies with the Personal Computer Memory Card International Association ATA (PC Card ATA) standard. (In Japan, the applicable standards group is JEIDA.) The CompactFlash Memory Card Series also supports a True IDE Mode that is electrically compatible with an IDE disk drive. The original CF form factor card can be used in any system that has a CF slot, and with a Ty pe II PCMCIA adapter can be used in any system that has a PCMCIA Type II or Type III socket.

CompactFlash Memory cards use SanDisk Flash memory, which was designed by SanDisk specifically for use in mass storage applications. In addition to the mass storage-specific flash memory chips, CompactFlash Memory cards include an on-card intelligent controller that provides a high level interface to the host computer. This interface allows a host computer to issue commands to the memory card to read or write blocks of memory. The host addresses the card in 512 byte sectors. Each sector is protected by a powerful Erro r Correcting Code (ECC).

The on-card intelligent controller in the CompactFlash Memory Card manages interface protocols, data storage and retrieval as well as ECC, defect handling and diagnostics, power management and clock control. Once the card has been configured by the host, it appears to the host as a standard ATA (IDE) disk drive. Additional ATA commands have been provided to enhance system performance.

The host system can support as many cards as there are CompactFlash and PCMCIA Type II or III card slots. The original form factor CompactFlash Memory cards require a PCMCIA Type II Adapter to be used in a PCMCIA Type II or Type III socket.

Figure 1-1 SanDisk CompactFlash Card Block Diagram

SanDisk CompactFlash

Data In/Out

Control

Flash

Memory

Host

Interface

SanDisk

Single Chip

Controller

Introduction SanDisk CompactFlash Card OEM Product Manual

1.2 Features

SanDisk CompactFlash Memory cards provide the following system features:

• Up to 16 GB of mass storage data

• PC Card ATA protocol compatible

• True IDE Mode compatible

• Very low CMOS power

• Very high performance

• Very rugged

• Low weight

• Noiseless

• Low Profile

• +5 Volts or +3.3 Volts operation

• Automatic error correction and retry capabilities

• Supports power down commands and sleep modes

• Non-volatile storage (no battery required)

• MTBF >1,000,000 hours

• Minimum 10,000 insertions

1.3 Scope

This document describes the key features and specifications of CompactFlash Memory cards, as well as the information required to interface this product to a host system. Retail CompactFlash specifications are not covered in this manual.

1.4 CompactFlash Standard

SanDisk CompactFlash Memory cards are fully compatible with the CompactFlash Specification published by the CompactFlash Association. Contact the CompactFlash

Association for more information.

CompactFlash Association P.O. Box 51537 Palo Alto, CA 94303 USA Phone: 415-843-1220 Fax: 415-493-1871 www.compactflash.org

SanDisk CompactFlash Card OEM Product Manual Introduction

1.5 PCMCIA Standard

SanDisk CompactFlash Memory cards are fully electrically compatible with the PCMCIA specifications listed below:

• PCMCIA PC Card Standard, 7.0, February 1999

• PCMCIA PC Card ATA Specification, 7.0, February 1999

These specifications may be obtained from:

PCMCIA 2635 N. First Street, Suite 209 San Jose, CA 95131 USA Phone: 408-433-2273 Fax: 408-433-9558

1.6 Related Documentation

ATA operation is governed by the ATA-4 specification published by ANSI. For more information, refer to the American National Standard X3.221: AT Attachment for Interface for Disk Drives document.

Documentation can be ordered from IHS by calling 1-800-854-7179 or accessing their Web site: http://global.ihs.com.

1.7 Functional Description

CompactFlash Memory cards contain a high level, intelligent subsystem as shown in the block diagram, Figure 1-1. This intelligent (microprocessor) subsystem provides many capabilities not found in other types of memory cards. These capabilities include the following:

• Standard ATA register and command set (same as found on most magnetic disk drives).

• Host independence from details of erasing and programming flash memory.

• Sophisticated system for managing defects (analogous to systems found in magn etic disk

drives).

• Sophisticated system for error recovery including a powerful error correction code (ECC).

• Power management for low power operation.

• Implementation of dynamic and static wear-leveling to extend card’s life.

Introduction SanDisk CompactFlash Card OEM Product Manual

1.7.1 Technology Independence

The 512-byte sector size of the CompactFlash Memory Card is the same as that in an IDE magnetic disk drive. T o write or read a sector (or multiple sectors), the host computer software simply issues a Read or Write command to the card. This command contains the address and the number of sectors to write/read. The host software then waits for the command to complete.

The host software does not get involved in the details of how the flash memory is erased, programmed or read. This is extremely important as flash devices are expected to get more and more complex in the future. Because the CompactFlash Memory Card Series uses an intelligent on-board controller, the host system software will not require changing as new flash memory evolves. In other words, systems that support CompactFlash Memory cards now, will be able to access future SanDisk cards built with new flash technology without having to update or change host software.

1.7.2 Defect and Error Management

CompactFlash Memory cards contain a sophisticated defect and error management system. This system is analogous to the systems found in magnetic disk drives and in many cases offers enhancements. If necessary, the cards will rewrite data from a defective sector to a good sector. This is completely transparent to the host and does not consume any user data space.

The CompactFlash Memory Card soft error rate specification is much better than the magnetic disk drive specification. In the extremely rare case a read error does occur, CompactFlash Memory cards have innovative algorithms to recover the data by using hardware on-the-fly Error Detection Code/Error Correction Code (EDC/ECC), based on a BCH algorithm.

These defect and error management systems, coupled with the solid state construction, give SanDisk CompactFlash cards unparalleled reliability

1.7.3 Wear Leveling

Wear Leveling is an intrinsic part of the erase pooling functionality of SanDisk CompactFlash using NAND memory. The CF WEAR LEVEL command is supported as a NOP operation to maintain backward compatibility with existing software utilities. Advanced featu res of dynamic and static wear-leveling, and automatic block management are used to ensure high data reliability and maximize flash life expectancy.

1.7.4 Using Erase Sector and Write Commands

SanDisk CompactFlash Memory cards support the CF ERASE SECTOR and WRITE WITHOUT ERASE commands. In some applications, write operations may be faster if the addresses being written are first erased with the ERASE SECTOR command. WRITE WITHOUT ERASE behaves as a normal write command and no performance gain results from its use.

SanDisk CompactFlash Card OEM Product Manual Introduction

1.7.5 Automatic Sleep Mode

A unique feature of the SanDisk CompactFlash Memory Card is automatic entrance and exit from sleep mode. Upon completion of a command, the card will enter sleep mode to conserve power if no further commands are received within 5 msec. The host does not have to take any action for this to occur. In most systems, the CompactFlash Memory Card is in sleep mode except when the host is accessing it, thus conserving power. The delay from command completion to entering sleep mode is adjustable.

When the host is ready to access the card and is in sleep mode, any command issued to it will cause the card to exit sleep and respond. The host does not have to follow the ATA protocol of issuing a reset first. It may do this if desired, but it is not needed. By not issuing the reset, performance is improved through the reduction of overhead but this must be done only for the SanDisk products as other ATA products may not support this feature.

1.7.6 Dynamic Adjustment of Performance vs. Power Consumption

This feature is no longer supported. This command will be treated as a NOP (No Operation) to guarantee backward compatibility.

1.7.7 Power Supply Requirements

This is a dual voltage product, which means it will operate at a voltage range of 3.30 volts ± 5% or 5.00 volts ± 10%. Per the PCMCIA specification Section 2.1.1, the host system must apply 0 volts in order to change a voltage range. This same procedure of providing 0 volts to the card is required if the host system applies an input voltage outside the desired voltage by more than 15%. This means less than 4.25 volts for the 5.00-volt range and less than 2.75 volts for the 3.30 volt range.

Introduction SanDisk CompactFlash Card OEM Product Manual

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CHAPTER 2 Product Specifications

For all the following specifications, values are defined at ambient temperature and nominal supply voltage unless otherwise stated.

2.1 System Environmental Specifications

T able 2-1 contains environmental specifications which include temperature, humidity , acoustic noise, vibration, shock and altitude.

Table 2-1 Environmental Specifications

CompactFlash CompactFlash Extreme III

Temperature

Humidity

Acoustic Noise At 1 meter: 0 dB 0 dB

Vibration

Shock

Altitude (relative to sea level)

Operating:

Non-operating:

Operating:

Non-operating:

Operating:

Non-operating:

Operating:

Non-operating:

Operating:

Non-operating:

15 G peak to peak maximum 15 G peak to peak maximum

° C to 70° C

0

° C to 85° C

-25

8% to 95% non-condensing 8% to 95% non-condensing

2,000 G maximum 2,000 G maximum

80,000 ft. maximum 80,000 ft. maximum

-25

° C to 85° C

-25

° C to 85° C

8% to 95% non-condensing 8% to 95% non-condensing

15 G peak to peak maximum 15 G peak to peak maximum

2,000 G maximum

2,000 G maximum 80,000 ft. maximum 80,000 ft. maximum

2.2 System Power Requirements

All values quoted in T able 2-2 are typical at 25° C and nominal supply voltage unless otherwise stated.

Product Specifications SanDisk CompactFlash Card OEM Product Manual

Sleep mode currently is specified under the condition that all card inputs are static CMOS levels and in a "Not Busy" operating state.

Table 2-2 Power Requirements

DC Input Voltage (Vcc)

100 mV max. ripple (p-p) 3.3V +/- 5% 5V +/- 10%

a

Memory Subsystem

CompactFlash Memory Card Sleep

Up to 512 MB 300

1.0 GB 600 µ 800 µ

Over 1.0 GB 1 mA 1.2 mA Read 50 mA 55 mA Write 65 mA 70 mA Read/Write Peak 100 mA 100 mA

a

CompactFlash Extreme III Memory Card Sleep

Up to 512 MB

512 MB to 1.5 GB

Over 1.5 GB Read 75 mA 100 mA Write 75 mA 100 mA Read/Write Peak 100 mA 100 mA

µ 500 µ

µ

300 600 µ

1 mA

500 µ 800 µ

1.2 mA

a. Maximum average value.

SanDisk CompactFlash Card OEM Product Manual Product Specifications

2.3 System Performance

All performance timings assume the CompactFlash Memory Card Series controller is in the default (i.e., fastest) mode.

Table 2-3 Performance

CompactFlash Memory Card

Start-up Times

Sleep to Write Sleep to Read Reset to Ready

Active to Sleep Delay

Data Transfer Rate To/From Flash

Data Transfer Rate To/From Host

Controller Overhead

Command to DRQ 50 ms maximum

2.5 ms maximum 20 ms maximum 50 ms typical; 400 ms maximum Programmable

20.0 MB/sec burst

16.0 MB/sec burst

CompactFlash Extreme III Memory Card

Start-up Times

Sleep to Write Sleep to Read Reset to Ready

Data Transfer Rate To/From Flash

Data Transfer Rate To/From Host

Maximum Performance

Sequential Read 20.0 MB/sec Sequential Write 20.0 MB/sec

NOTE: The Sleep to Write and Sleep to Read times are the times it takes the

2.5 ms maximum 20 ms maximum 50 ms typical; 400 ms maximum

20.0 MB/sec burst

25.0 MB/sec burst

CompactFlash Memory Card to exit sleep mode when any command is issued by the host to when the card is reading or writing. CompactFlash Memory cards do not require a reset to exit sleep mode.

Product Specifications SanDisk CompactFlash Card OEM Product Manual

2.4 System Reliability

Table 2-4 Reliability

MTBF (@ 25 C)

Preventative Maintenance

Data Reliability

>1,000,000 hours

None

<1 non-recoverable error in 10 <1 erroneous correction in 1020 bits read

14

bits read

2.5 Physical Specifications

Refer to T able 2-5 and see Figure 2-1 for CompactFlash Memory Card physical specifications and dimensions.

Table 2-5 CompactFlash Physical Dimensions

Weight

Length

Width

Thickness

11.4 g (.40 oz) typical, 14.2 g (.50 oz) maximum

36.40 ± 0.15 mm (1.433 ± .006 in)

42.80 ± 0.10 mm (1.685 ± .004 in)

3.3 mm ± 0.10 mm (.130 ± .004 in) (Excluding Lip)

SanDisk CompactFlash Card OEM Product Manual Product Specifications

Figure 2-1 CompactFlash Memory Card Dimensions

Product Specifications SanDisk CompactFlash Card OEM Product Manual

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CHAPTER 3 Interface Description

3.1 Physical Description

The host connects to SanDisk CompactFlash Memory cards using a standard 50-pin connector consisting of two rows of 25 female contacts each on 50 mil (1.27 mm) centers.

3.1.1 Pin Assignments and Types

The signal/pin assignments are listed in Table 3-1. Low active signals have a "-" prefix. Pin types are Input, Output or Input/Output. Sections 3.3.1 and 3.3.2 define the DC characteristics for all input and output type structures..

Table 3-1 PC Card Memory Mode Pin Assignments

Pin No.

1 GND – Ground 26 -CD1 O Ground 2 D03 I/O I1Z,OZ3 27 D11 I/O I1Z,OZ3 3 D04 I/O I1Z,OZ3 28 D12 I/O I1Z,OZ3 4 D05 I/O I1Z,OZ3 29 D13 I/O I1Z,OZ3 5 D06 I/O I1Z,OZ3 30 D14 I/O I1Z,OZ3 6 D07 I/O I1Z,OZ3 31 D15 I/O I1Z,OZ3 7 -CE1 I I3U 32 -CE2 I I3U 8 A10 I I1Z 33 -VS1 O Ground

9 -OE I I3U 34 -IORD I I3U 10 A09 I I1Z 35 -IOW R I I3U 11 A08 I I1Z 36 -WE I I3U 12 A07 I I1Z 37 RDY/BSY O OT1 13 VCC – Power 38 VCC – Power 14 A06 I I1Z 39 -CSEL I I2Z 15 A05 I I1Z 40 -VS2 O OPEN 16 A04 I I1Z 41 RESET I I2Z 17 A03 I I1Z 42 -WAIT O OT1 18 A02 I I1Z 43 -INPACK O OT1 19 A01 I I1Z 44 -REG I I3U 20 A00 I I1Z 45 BVD2 I/O I1U,OT1 21 D00 I/O I1Z,OZ3 46 BVD1 I/O I1U,OT1 22 D01 I/O I1Z,OZ3 47 D08 I/O I1Z,OZ3 23 D02 I/O I1Z,OZ3 48 D09 I/O I1Z,OZ3 24 WP O OT3 49 D10 I/O I1Z,OZ3 25 -CD2 O Ground 50 GND – Ground

Signal

Name Pin Type I/O Ty pe Pin No.

Signal

Name Pin Type I/O Type

Interface Description SanDisk CompactFlash Card OEM Product Manual

PC Card I/O Pin Assignments are contained in Table 3-2.

Table 3-2 PC Card I/O Mode Pin Assignments

Pin No.

1 GND – Ground 26 -CD1 O Ground 2 D03 I/O I1Z,OZ3 27 D11 I/O I1Z,OZ3 3 D04 I/O I1Z,OZ3 28 D12 I/O I1Z,OZ3 4 D05 I/O I1Z,OZ3 29 D13 I/O I1Z,OZ3 5 D06 I/O I1Z,OZ3 30 D14 I/O I1Z,OZ3 6 D07 I/O I1Z,OZ3 31 D15 I/O I1Z,OZ3 7 -CE1 I I3U 32 -CE2 I I3U 8 A10 I I1Z 33 -VS1 O Ground

9 -OE I I3U 34 -IORD I I3U 10 A09 I I1Z 35 -IOWR I I3U 11 A08 I I1Z 36 -WE I I3U 12 A07 I I1Z 37 -IREQ O OT1 13 VCC – Power 38 VCC – Power 14 A06 I I1Z 39 -CSEL I I2Z 15 A05 I I1Z 40 -VS2 O OPEN 16 A04 I I1Z 41 RESET I I2Z 17 A03 I I1Z 42 -WAIT O OT1 18 A02 I I1Z 43 -INPACK O OT1 19 A01 I I1Z 44 -REG I I3U 20 A00 I I1Z 45 -SPKR I/O I1U,OT1 21 D00 I/O I1Z,OZ3 46 -STSCHG I/O I1U,OT1 22 D01 I/O I1Z,OZ3 47 D08 I/O I1Z,OZ3 23 D02 I/O I1Z,OZ3 48 D09 I/O I1Z,OZ3 24 -IOIS16 O OT3 49 D10 I/O I1Z,OZ3 25 -CD2 O Ground 50 GND – Ground

Signal

Name Pin Type I/O Type Pin No.

Signal

Name Pin Type I/O Type

True IDE Mode Pin Assigments are contained in Table 3-3.

Table 3-3 True IDE Mode Pin Assignments

No.

1 GND – Ground 26 -CD1 O Ground 2 D03 I/O I1Z,OZ3 27 D11 I/O I1Z,OZ3 3 D04 I/O I1Z,OZ3 28 D12 I/O I1Z,OZ3 4 D05 I/O I1Z,OZ3 29 D13 I/O I1Z,OZ3 5 D06 I/O I1Z,OZ3 30 D14 I/O I1Z,OZ3 6 D07 I/O I1Z,OZ3 31 D15 I/O I1Z,OZ3 7 -CS0 I I3Z 32 -CS1 I I3Z 8 A10 I I1Z 33 -VS1 O Ground

Signal

Name Pin Type I/O Type Pin No.

Signal

Name Pin Type I/O Type

SanDisk CompactFlash Card OEM Product Manual Interface Description

Table 3-3 True IDE Mode Pin Assignments

Pin No.

9 -ATA SEL I I3U 34 -IORD I I3Z 10 A09 I I1Z 35 -IOWR I I3Z 11 A08 I I1Z 36 -WE I I3U 12 A07 I I1Z 37 INTRQ O OZ1 13 VCC – Power 38 VCC – Power 14 A06 I I1Z 39 -CSEL I I2U 15 A05 I I1Z 40 -VS2 O OPEN 16 A04 I I1Z 41 RESET I I2Z 17 A03 I I1Z 42 IORDY O OT1 18 A02 I I1Z 43 -DMARQ O OZ1 19 A01 I I1Z 44 -DMACK I I3U 20 A00 I I1Z 45 -DASP I/O I1U,ON1 21 D00 I/O I1Z,OZ3 46 -PDIAG I/O I1U,ON1 22 D01 I/O I1Z,OZ3 47 D08 I/O I1Z,OZ3 23 D02 I/O I1Z,OZ3 48 D09 I/O I1Z,OZ3 24 -IOCS16 O ON3 49 D10 I/O I1Z,OZ3 25 -CD2 O Ground 50 GND – Ground

Signal

Name Pin Type I/O Type Pin No.

3.2 Electrical Description

Signal

Name Pin Type I/O Type

The CompactFlash Memory Card Series is optimized for operation with hosts, which support the PCMCIA I/O interface standard conforming to the PC Card ATA specification. However, the card may also be configured to operate in systems that support only the memory interface standard. The CompactFlash card configuration is controlled using the standard PCMCIA configuration registers starting at address 200h in the Attribute Memory space of the card.

Table 3-4 describes the I/O signals. Signals whose source is the host are designated as inputs while signals that the card sources are outputs. SanDisk CompactFlash Memory Card logic levels conform to those specified in Section 3.3 of the PCMCIA Release 2.1 Specification.

NOTE: The sleep-to-write and sleep-to-read times are the time it takes the

card to exit sleep mode when any command is issued by the host to when the card is reading or writing. CompactFlash Memory cards do not require a reset to exit sleep mode.

Interface Description SanDisk CompactFlash Card OEM Product Manual

The SanDisk CompactFlash Memory Card signals are described in Table 3-4.

Table 3-4 Signal Description

Signal Name Dir. Pin Description

A10-A0

(PC Card Memory Mode) (PC Card I/O Mode)

A2-A0

(True IDE Mode)

A10-A3

(True IDE Mode)

BVD1

(PC Card Memory Mode)

-STSCHG

(PC Card I/O Mode)

-PDIAG

(True IDE Mode)

BVD2

(PC Card Memory Mode)

-SPKR

(PC Card I/O Mode)

-DASP

(True IDE Mode)

-CD1, -CD2

(PC Card Memory Mode) (PC Card I/O Mode (True IDE Mode)

-CE1, -CE2

(PC Card Memory Mode) (PC Card I/O Mode)

-CS0, -CS1

(True IDE Mode)

-CSEL

(PC Card Memory Mode) (PC Card I/O Mode)

)

I

8, 10, 11, 12, 14,

15, 16, 17, 18, 19,

20

I

I/O 46 This signal is asserted high as the BVD1 signal

I/O 45 This output line is always driven to a high state

O 26, 25 These Card Detect pins are connected to

I 7, 32 The Card Enable input signals are used both to

I 39 This signal is not used for PC Card Memory

18, 19, 20

These address lines, along with the -REG signal, are used to select the following: I/O port address registers within the card, memorymapped port address registers within the card, a byte in the card's information structure and its configuration control and status registers.

In True IDE Mode only A[2:0] is used to select one of eight registers in the Task File.

In True IDE Mode these remaining address lines should be grounded by the host.

since a battery is not used with this product. The Status Changed signal is asserted low to

alert the host to changes in the RDY/-BSY and Write Protect states, while the I/O interface is configured. Its use is controlled by the Card Config. and Status Register.

In the True IDE Mode, this input/output is the Pass Diagnostic signal in the master/slave handshake protocol.

in Memory Mode since a battery is not required for this product.

This output line is always driven to a high state in I/O Mode since this product does not support the audio function.

In the True IDE Mode, this input/output is the Disk Active/Slave Present signal in the master/ slave handshake protocol.

ground on the card. They are used by the host to determine if the card is fully inserted into its socket.

select the card and to indicate to the card whether a byte or a word operation is being performed. -CE2 always accesses the odd byte of the word. -CE1 accesses the even byte or the Odd byte of the word depending on A0 and -CE2. A multiplexing scheme based on A0, -CE1, -CE2 allows 8 bit hosts to access all data on D0-D7.

In True IDE Mode, -CS0 is the chip select for the Task File registers while -CS1 is used to select the Alternate Status Register and the Device Control Register.

Mode or PC Card I/O Mode.

SanDisk CompactFlash Card OEM Product Manual Interface Description

Table 3-4 Signal Description

Signal Name Dir. Pin Description

-CSEL

(True IDE Mode)

D15-D00

(PC Card Memory Mode) (PC Card I/O Mode)

D15-D00

(True IDE Mode)

GND

(PC Card Memory Mode) (PC Card I/O Mode (True IDE Mode)

-INPACK

(PC Card Memory Mode)

-INPACK

(PC Card I/O Mode)

-DMARQ

(True IDE Mode)

-IORD

(PC Card Memory Mode)

)

I/O 31, 30, 29, 28, 27,

49, 48, 47, 6, 5, 4,

3, 2, 23, 22, 21

-- 1, 50 Ground.

O 43 This signal is not used in this mode.

I 34 This signal is not used in this mode.

This internally pulled up signal is used to configure this device as a master or slave when configured in the True IDE Mode. When this pin is grounded, this device is configured as a master. When the pin is open, this device is configured as a slave.

These lines carry the data, commands and status information between the host and the controller. D00 is the LSB of the Even Byte of the word. D08 is the LSB of the Odd Byte of the word.

In True IDE Mode, all Task File operations occur in byte mode on the low order bus D00D07 while all data transfers are 16 bits using D00-D15.

The Input Acknowledge signal is asserted by the card when it is selected and responding to an I/O read cycle at the address that is on the address bus. This signal is used by the host to control the enable of any input data buffers between the card and the CPU.

This signal is used for DMA data transfers between host and device and is asserted by the device when it is ready to transfer data to or from the host. The direction of data transfer is controlled by DIOR- and DIOW-. This signal is used in a handshake manner with DMACK(i.e., the device waits until the host asserts DMACK- before negating DMARQ, and reasserting DMARQ if there is more data to transfer).

-IORD

(PC Card I/O Mode) (True IDE Mode)

-IOWR

(PC Card Memory Mode)

I 35 This signal is not used in this mode.

This is an I/O read strobe generated by the host. This signal gates I/O data onto the bus from the card when the card is configured to use the I/O interface.

Interface Description SanDisk CompactFlash Card OEM Product Manual

Table 3-4 Signal Description

Signal Name Dir. Pin Description

-IOWR

(PC Card I/O Mode) (True IDE Mode)

-OE

(PC Card Memory Mode)

-OE

(PC Card I/O Mode)

-ATA SEL

(True IDE Mode)

RDY/-BSY

(PC Card Memory Mode)

-IREQ

(PC Card I/O Mode)

INTRQ

(True IDE Mode)

-REG

(PC Card Memory Mode)

-REG

(PC Card I/O Mode)

I 9 This is an output enable strobe generated by

O 37 In Memory Mode, this signal is set high when

I 44 This Attribute Memory Select signal is used

The I/O write strobe pulse is used to clock I/O data on the Card Data bus into the card controller registers when the card is configured to use the I/O interface.

The clocking will occur on the negative to positive edge of the signal (trailing edge).

the host interface. It is used to read data from the card in Memory Mode and to read the CIS and configuration registers.

In PC Card I/O Mode, this signal is used to read the CIS and configuration registers.

To enable True IDE Mode this input should be grounded by the host.

the card is ready to accept a new data transfer operation and held low when the card is busy. The host memory card socket must provide a pull-up resistor.

At power up and at reset, the RDY/-BSY signal is held low (busy) until the card has completed its power up or reset function. No access of any type should be made to the card during this time. The RDY/-BSY signal is held high (disabled from being busy) whenever the following condition is true: The card has been powered up with +RESET continuously disconnected or asserted.

I/O Operation–After the card has been configured for I/O operation, this signal is used as an interrupt request. This line is strobed low to generate a pulse mode interrupt or held low for a level mode interrupt.

In True IDE Mode, this signal is the active high Interrupt Request to the host.

during memory cycles to distinguish between Common Memory and Register (Attribute) Memory accesses: High for common memory, and low for attribute memory.

The signal must also be active (low) during I/O cycles when the I/O address is on the bus.

SanDisk CompactFlash Card OEM Product Manual Interface Description

Table 3-4 Signal Description

Signal Name Dir. Pin Description

-DMACK

(True IDE Mode)

RESET

(PC Card Memory Mode) (PC Card I/O Mode)

-RESET

(True IDE Mode)

V

CC

(PC Card Memory Mode) (PC Card I/O Mode (True IDE Mode)

)

-VS1

-VS2

(PC Card Memory Mode) (PC Card I/O Mode (True IDE Mode)

)

-WAIT

(PC Card Memory Mode)

-WAIT

(PC Card I/O Mode)

IORDY

(True IDE Mode)

-WE

(PC Card Memory Mode)

-WE

(PC Card I/O Mode)

-WE

(True IDE Mode)

WP

(PC Card Memory Mode)

I 41 When the pin is high, this signal resets the

-- 13, 38 +5V, +3.3V power.

O 33, 40 Voltage Sense Signals. -VS1 is grounded so

O 42 SanDisk CompactFlash Memory cards do not

I 36 This is a signal driven by the host and used for

O 24 Memory Mode–The CompactFlash Card does

This signal is used by the host in response to DMARQ to initiate DMA transfers.

NOTE: This signal may be negated by the host to suspend the DMS transfer in process. For Multiword DMA transfers, the device may negate DMARQ with the t

specified time once

L

the DMACK- is asserted and reasserted again at a later time to resume DMA operation. Alternatively, if the device is able to continue the data transfer, the device may leave DMARQ asserted and wait for the host to reassert DMACK-.

card. The card is reset only at power-up if this pin is left high or open from power-up. The card is also reset when the Soft Reset bit in the Card Configuration Option Register is set.

In the True IDE Mode this input pin is the active low hardware reset from the host.

that the CompactFlash Card CIS can be read at

3.3 volts and VS2 is open and reserved by PCMCIA for a secondary voltage.

assert the -WAIT signal. SanDisk CompactFlash Memory cards do not

assert the -WAIT signal. SanDisk CompactFlash Memory cards, except

when in UDMA modes, do not assert an IORDY signal.

strobing memory write data to the registers of the card when it is configured in the Memory Interface Mode. It is also used for writing the configuration registers.

In PC Card I/O Mode, this signal is used for writing the configuration registers.

In True IDE Mode this input signal is not used and should be connected to VCC by the host.

not have a write-protect switch. This signal is held low after the completion of the reset initialization sequence.

Interface Description SanDisk CompactFlash Card OEM Product Manual

Table 3-4 Signal Description

Signal Name Dir. Pin Description

-IOIS16

(PC Card I/O Mode)

-IOCS16

(True IDE Mode)

I/O Operation–When the card is configured for I/O Operation, pin 24 is used for the -I/O Selected is 16 Bit Port (-IOIS16) function. A low signal indicates that a 16-bit or odd-byte only operation can be performed at the addressed port.

This output signal is asserted low when this device is expecting a word data transfer cycle.

3.3 Electrical Specification

All D.C. Characteristics for the CompactFlash Memory Card Series are defined as follows:

T ypical conditions unless otherwise stated:

= 5V +/- 10%

V

CC

= 3.3V +/- 5%

V

CC

Ta = 0 °C to 60 °C

Absolute Maximum conditions:

= -0.3V min. to 6.5V max.

V

CC

V* = 0.5V min. to V *Voltage on any pin except V

+ 0.5V max.

CC

with respect to GND.

CC

3.3.1 Input Leakage Control and Input Characteristics

In Table 3-5, “x” refers to the characteristics described in Table 3-6. For example–"I1U" indicates a pull-up resistor with a Type 1 input characteristic.

Table 3-5 Input Leakage Control

Type Parameter Symbol Conditions MIN MAX Unit

lxZ Input Leakage Current IL Vih=VCC/Vil=GND -1 1 uA IxU Pull Up Resistor RPU1 VCC=5.0V 50k 500k Ohm IxD Pull Down Resistor RPD1 VCC=5.0V 50k 500k Ohm

NOTE: The minimum pull-up resistor leakage current meets the PCMCIA

specification of 10k ohms but is intentionally higher in the CompactFlash Memory Card Series product to reduce power use.

SanDisk CompactFlash Card OEM Product Manual Interface Description

T able 3-6 defines the input characteristics of the parameters in Table 3-5.

Table 3-6 Input Characteristics

Min. Typ. Max. Min. Typ. Max.

Type Parameter Symbol VCC = 3.3V VCC = 5.0V Unit

1 Input Voltage Vih 2.4 4.0 V

CMOS Vil 0.6 0.8

2 Input Voltage Vih 1.5 2.0 V

CMOS Vil 0.6 0.8

3 Input Voltage Vth 1.8 2.8 V

CMOS Vtl 1.0 2.0

Schmitt Trigger

3.3.2 Output Drive Type and Characteristics

In Table 3-7 "x" refers to the characteristics desc ribed in Table 3-8. For example–"OT3" refers to Totempole output with a Type 3 output drive characteristic.

Table 3-7 Output Drive Type

Type Output Type Valid Conditions

OTx Totempole loh & lol OZx Tri-state N-P Channel loh & lol OPx P-Channel Only loh only ONx N-Channel Only loh Only

Table 3-8 Output Drive Characteristics

Type Parameter Symbol Conditions Min. Typ. Max. Unit

1 Output Voltage Voh loh= -4 mA V

Vol lol= 4 mA Gnd

2 Output Voltage Voh loh= -8 mA V

Vol lol= 8 mA Gnd

3 Output Voltage Voh loh= -8 mA V

Vol lol= 8 mA -0.8V Gnd

X Tri-State

Leakage Current

loz Vol = Gnd

Voh = V

CC

-0.8V

+0.4V

CC

-0.8V

+0.4V

CC

+0.4V

-10 10 uA

V

Interface Description SanDisk CompactFlash Card OEM Product Manual

3.3.3 Power Up/Power Down Timing

The timing specification in Table 3-9 was defined to permit peripheral cards to perform powerup initialization.

Table 3-9 Power Up/Power Down Timing

Item

Value

Symbol Condition

CE Signal Level

a

CE Setup Time 20 ms T CE Setup Time T CE Recover T i me

V

Rising Time

CC

Falling Time

V

CC

b

Reset Width T

a. V

b. The tpr and t

means Absolute Maximum Voltage for Input in the period of 0V <VCC <2.0V, Vi (CE) is only

iMAX

.

pf

0V~V

the waveform is not "linear waveform," its rising and falling time must be met by this specification.

Vi (CE) 0V <V

2.0V <V

SU (VCC)

(RESET) 20 ms

SU

T

REC (VCC)

t

pr

pf

(RESET) 10 µs

W

(Hi-z Reset) 1 ms

T

h

T

(Hi-z Reset) 0 ms

S

10%-->90% of (V 90% of (V

<2.0V 0 V

CC

CC <VIH

<V

IH <VCC

--- ---

--- --+ 5%) 0.1 300 ms

CC

+ 5%)-->10% 3.0 300 ms t

CC

--- ---

are defined as "linear waveform" in the period of 10% to 90% or vice-versa. Even if

Min. Max. Unit

<V

- 0.1 V

CC

V

IH

V

0.001 ms

Figure 3-1 Power Up/Power Down Timing for Systems supporting RESET

t

tSU(VCC)

pr

iMAX iMAX iMAX

V

VCC Min.

V

Hi-z

tSU(Reset)

tW(Reset)

IH

V

IH

Hi-z

tW(Reset)

V

-CE1, -CE2

tSU(Reset)

2V

th (Hi-z Reset)

CC

Reset

VCC Min.

t

rec

-CE1, -CE2

t

pf

2V

ts (Hi-z Reset)

SanDisk CompactFlash Card OEM Product Manual Interface Description

Figure 3-2 Power Up/Power Down Timing for Systems not supporting RESET

t

pr

V

CC

VCC Min.

V

IH

2V

Always Hi-z from system

RESET

V

CC

-CE1, -CE2

3.3.4 Common Memory Read Timing

Table 3-10 contains common memory read timing specifications for all types of memory.

NOTE: All timings measured at the CompactFlash Memory Card. Skews and

delays from the system driver/receiver to the card must be accounted for by the system.

tSU(VCC)

Supplied by pull-up resistor

on card (if present)

t

pf

VCC Min.

t

rec

2V

-CE1, -CE2

V

IH

Table 3-10 Common Memory Read Timing Specification

100 ns

Speed Version Item Symbol

Read Cycle Time t Address Access Time

a

Card Enable Access Time t Output Enable Access Time t Output Disable Time from -OE t Output Disable Time from -CE t Output Enable Time from -CE t Output Enable Time from -OE t

Data Va lid from Add Change

a

Address Setup Time t

c

ta (A)

(CE)

a

(OE)

a dis dis en en

tv (A)

su

(R)

(OE) (CE) (CE) (OE)

(A)

IEEE Symbol

t

AVAV

t

AVQV

t

ELQV

t

GLQV

t

GHQZ

t

EHQZ

t

ELQNZ

t

GLQNZ

t

AXQX

t

AVGL

Min. Max.

100

---

--5 5 0

10

--100 100

50 50 50

---

Interface Description SanDisk CompactFlash Card OEM Product Manual

Table 3-10 Common Memory Read Timing Specification

100 ns

Speed Version Item Symbol IEEE Symbol

Address Hold Time th (A) 15t Card Enable Setup Time t Card Enable Hold Time t

(CE) 0t

su

(CE) 15t

h

a. The -REG signal timing is identical to address signal timing

3.3.5 Common and Attribute Memory Write Timing

The write timing specifications for Common and Attribute memory are the same.

All timings measured at the CompactFlash Memory Card. Skews and delays from the system driver/receiver to the card must be accounted for by the system

NOTE: SanDisk CompactFlash Memory cards do not assert the -WAIT

signal.

Table 3-11 Common and Attribute Memory Write Timing Specification

Speed Version Symbol IEEE Symbol

Write Cycle Time t Write Pulse Width t

Address Setup Time Address Setup Time for -WE

a

Card Enable Setup Time for -WE t Data Setup Time form -WE t Data Hold Time t Write Recover Time t Output Disable Time from -WE Output Disable Time from -OE t Output Enable Time from -WE t Output Enable Time from -OE t Output Enable Setup from -WE t Output Enable Hold from -WE Card Enable Setup Time t Card Enable Hold Time t

a. The -REG signal timing is identical to address signal timing.

(W) 100 t

c

(WE) 60t

w

t

(A) 10t

su

t

(A-WEH) 70t

su

(CE-WEH) 70t

su

(D-WEH) 40t

su

(D) 15t

h

(WE) 15t

rec

(WE) t

t

dis

(OE) 50 t

dis

(WE) 5t

en

(OE) 5t

en

(OE-WE) 10t

su

(OE-WE) 10

t

h

(CE) 0t

su

(CE) 15t

h

GHAX

ELGL

GHEH

AVAV

WLWH

AVWL

AVWH

ELWH DVWH WMDX WMAX WLQZ GHQZ

WHQNZ

GLQNZ

GHWL

t

WHGL

ELWL GHEH

Min. Max.

---

100 ns

Min. Max.

---

50

---