Samsung X450 Service Manual

GSM TELEPHONE
SGH-X450
SERVICE
Manual
GSM TELEPHONE CONTENTS
1. Specification
2. Circuit Description
3. Exploded Views and Parts List
4. Electrical Parts List
6. PCB Diagrams
7. Flow Chart of Troubleshooting
ELECTRONICS
his Service Manual is a property of Samsung Electronics Co.,Ltd.
ny unauthorized use of Manual can be punished under applicable
nternational and/or domestic law.
Samsung Electronics Co.,Ltd. August. 2003 Printed in Korea.
Code No.: GH68-04745A BASIC.
1. SGH-X450 Specification
1. GSM General Specification
GSM900
Phase 1
Freq. Band[MHz]
Uplink/Downlink
ARFCN range 1~124
Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz
Mod. Bit rate/
Bit Period
Time Slot
Period/Frame Period
Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~13dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm
890~915 935~960
270.833kbps
3.692us
576.9us
4.615ms
EGSM 900
Phase 2
880~915 925~960
0~124 &
975~1023
270.833kbps
3.692us
576.9us
4.615ms
DCS1800
Phase 1
1710~1785 1805~1880
512~885 512~810
270.833kbps
3.692us
576.9us
4.615ms
PCS1900
1850~1910 1930~1990
270.833kbps
3.692us
576.9us
4.615ms
Power Class 5pcl ~ 15pcl 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl
Sensitivity -102dBm -102dBm -100dBm -100dBm
TDMA Mux 8 8 8 8
Cell Radius 35Km 35Km 2Km -
1-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SGH-X450 Specification
2. GSM TX power class
TX Power
control level
5 33±2 dBm
6 31±2 dBm
7 29±2 dBm
8 27±2 dBm
9 25±2 dBm
10 23±2 dBm
11 21±2 dBm
GSM900
TX Power
control level
0 30±2 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
DCS1800
TX Power
PCS1900
control level
0 30±2 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3dBm
18 7±3 dBm
19 5±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
1-2
15 0±5 dBm
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
2. SGH-X450 Circuit Description
1. SGH-X450 RF Circuit Description
1) RX PART
1. ASM(U201)→Switching Tx, Rx path for E`GSM900, DCS1800 and PCS1900 by logic controlling.
2. ASM Control Logic (U501, U502, U503)→Truth Table VC1 VC2 VC3
GSM Tx Mode H L L DCS / PCS Tx Mode L H L PCS Rx Mode L L H GSM / DCS Rx Mode L L L
3. FILTER
To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band.
- GSM FILTER (C220,C221,L204)→For filtering the frequency band between 925 ~ 960 MHz
- DCS FILTER (C218,C219,L203)→For filtering the frequency band 1805 and 1880 MHz.
- PCS SAW FILTER (F200)→For filtering the frequency band between 1930 and 1990 MHz
4. TC-VCXO (OSC100)
To generate the 13MHz reference clock to drive the logic and RF.
After additional process, the reference clock applies to the U100 Rx IQ demodulator and Tx IQ modulator. The oscillator for RX IQ demodulator and Tx modulator are controlled by serial data to select channel and use fast lock mode for GPRS high class operation.
5. SI 4205 (U100) This chip integrates three differential-input LNAs. The GSM input supports the E-GSM, DCS input supports the DCS1800, PCS input supports the PCS1900. The LNA inputs are matched to the 200 ohm differential output SAW filters through eternal LC matching network. Image-reject mixer downconverts the RF signal to a 100 KHz intermediate frequency(IF) with the RFLO from frequency synthesizer. The RFLO frequency is between 1737.8 ~ 1989.9 MHz. The Mixer output is amplified with an analog programmable gain amplifier(PGA), which is controlled by AGAIN. The quadrature IF signal is digitized with high resolution A/D converts (ADC). Also, this chip down-converts the ADC output to baseband with a digital 100 KHz quadrature LO signal. Digital decimation and IIR filters perform channel selection to remove blocking and reference interface signals. After channel selection, the digital output is scaled with a digital PGA, which is controlled with the DGAIN. DACs drive a differential analog signal onto the RXIP, RXIN, RXQP, RXQN pins to interface to standard analog-input baseband IC.
2-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SGH-X450 Circuit Description
2) TX PART
Baseband IQ signal fed into offset PLL, this function is included inside of U100 chip. SI4205 chip generates modulator signal which power level is about 1.5dBm and fed into Power Amplifier(U200). The PA output power and power ramping are well controlled by Auto Power Control circuit. We use offset PLL below
GSM -35dBc
DCS -35dBc PCS -35dBc GSM -66dBc
DCS -65dBc PCS -66dBc GSM -75dBc
DCS -68dBc PCS -75dBc
Modulation Spectrum
200kHz offset 30 kHz bandwidth
400kHz offset 30 kHz bandwidth
600kHz ~ 1.8MHz offset 30 kHz bandwidth
2. Baseband Circuit description of SGH-X450
1) PSC2106
1. Power Management
Seven low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal system performance and long battery life.A programmable LDO provides support for 1.8V, 3.0V SIMs, while a self-resetting, electronically fused switch supplies power to external accessories. Ancillary support functions, such as two LED drivers and two call-alert drivers, aid in reducing both board area and system complexity.A four-wire serial interface unit(SIU) provides access to control and configuration registers. This interface gives a microprocessor full control of the PSC2106 and enables system designers to maximize both standby and talk times. Error reporting is provided via an interrupt signal and status register.Supervisory functions. including a reset generator, an input voltage monitor, and a thermal monitor, support reliable system design. These functions work together to ensure proper system behavior during start-up or in the event of a fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).
2. Battery Charge Management
A battery charge management block, incorporating an internal PMOS switch, and an 8-bit ADC, provides fast, efficient charging of single-cell Li-Ion battery. Used in conjunction with a current-limited voltage source, this block safely conditions near-dead cells and provides the option of having fast-charge and top-off controlled internally or by the system's microprocessor.
2-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SGH-X450 Circuit Description
3. Backlight LED Driver
The backlight LED driver is a low-side, programmable current source designed to control the brightness of the keyboard and LCD illumination. LED1_DRV is controlled via LED1_[0:2] and can be programmed to sink from 15mA to 60mA in
7.5mA steps. LED2_DRV is controlled via LED2_ [0:2] and can be programmed to sink from 5mA to 40mA in 5mA steps. Both LED drivers are capable of sinking their maximum output current at a worst-case maximum output voltage of 0.6V. For efficient use, the LEDs is connected between the battery and the LED_DRV output.
4. Vibrator Motor Driver
The vibrator motor driver is a low-side, programmable voltage source designed to drive a small dc motor that silently alerts the user of an incoming call. The driver is controlled by VIB[0:1] and can be programmed to maintain a motor voltage of 1.3V, 2.0V, or 2.5V(relative to VBAT) while sinking up to 100mA. For efficient use, the vibrator motor should be connected between the main battery and the VIB_DRV output.
2) Connector
1. LCD Connector
LCD is consisted of main LCD(color 65K UFB LCD). Chip select signals of EMI part in the trident, CLCD_EN, can enable main LCD. LED_EN signal enables white LED of main LCD and EL_EN signal enables dimming mode of main LCD. These two signals are from IO part of the DSP in the trident. RST signal from 2106 initiates the initial process of the LCD. 16-bit data lines(D(0)~D(15)) transfers data and commands to LCD through emi_filter. Data and commands use A(2) signal. If this signal is high, Inputs to LCD are commands. If it is low, Inputs to LCD are data. The signal which informs the input or output state to LCD, is required. But this system is not necessary this signal. So CP_WEN signal is used to write data or commands to LCD. Power signals for LCD are +VBATT and VCCD. SPK1P and SPK1N from CSP1093 are used for audio speaker. And YMU_VIB_EN from MA-3 enables the motor.
2. JTAG Connector
Trident has two JTAG ports which are for ARM core and DSP core(DSP16000). So this system has two port connector for these ports. Pins' initials for ARM core are 'CP_' and pins' initials for DSP core are 'DSP_'. CP_TDI and DSP_TDI signal are used for input of data. CP_TDO and DSP_TDO signals are used for the output of the data. CP_TCK and DSP_TCK signals are used for clock because JTAG communication is a synchronous. CP_TMS and DSP_TMS signals are test mode signals. The difference between these is the RESET_INT signal which is for ARM core RESET.
2-3
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SGH-X450 Circuit Description
C. Battery Charge Management
3. Keypad connector
This is consisted of key interface pins in the trident, KEY_ROW[0~4] and KEY_COL[0~4]. These signals compose the matrix. Result of matrix informs the key status to key interface in the trident. Some pins are connected to varistor for ESD protection. And power on/off key is seperated from the matrix. So power on/off signal is connected with PSC2106 to enable PSC2106. SVC_GREEN, SVC_RED and SVC_BLUE are from OCTL of CSP1093. These signals decide the color of LED, service indicator. Nine key LED use the +VBATT supply voltage. These are connected to BACKLIGHT signal in the PSC2106. This signal enables LEDs with current control. FLIP_SNS informs the status of folder (open or closed) to the trident. This uses the hall effect IC, A3210ELH. A magnet under main LCD enables A3210ELH which is on the main PCB.
4. EMI Filtering
This system uses the EMI Filter to reduce noise from LCD part. Some control signals are connected to LCD without EMI filtering.
3) IF connetor
It is 23-pin connector, and uses 18-pin at present. They are designed to use SDS, DEBUG, DLC-DETECT, JIG_ON, VEXT, VTEST, VF, +VBATT and GND. They connected to power supply IC, microprocessor and signal processor IC.
4) Audio
AOUTAP, AOUTAN from CSP1093 is connected to the speaker via analog switch. AOUTBP and AOUTBN are connected to the ear-mic speaker via ear-jack. MICIN and MICOUT are connected to the main MIC. And AUXIN and AUXOUT are connected to the Ear-mic. YMU762MA3 is a LSI for portable telephone that is capable of playing high quality music by utilizing FM synthesizer and ADPCM decorder that are included in this device. As a synthesis, YMU762MA3 is equipped 16 voices with differenttones. Since the device is capable of simultaneously generating up to synchronous with the play of the FM synthesizer, various sampled voices can be used as sound effects. Since the play data of YMU762MA3 are interpreted at anytime through FIFO, the length of the data(playing period) is not limited, so the device can flexiblysupport application such as incoming call melody music distribution service. The hardware sequencer built in this device allows playing of the complex music without giving excessive load to the CPU of the portable telephones. Moreover, the registers of the FM synthesizer can be operated directly for real time sound generation, allowing, for example, utilization of various sound effects when using the game software installed in the portable telephone.
2-4
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SGH-X450 Circuit Description
YMU762 includes a speaker amplifier with high ripple removal rate whose maximum output is 550mW (SPVDD=3.6V). The device is also equipped with conventional function including a vibartor and a circuit for controlling LEDs synchornous with music. For the headphone, it is provided with a stereophonic output terminal. For the purpose of enabling YMU762MA3 to demonstarte its full capablities, Yamaha purpose to use "SMAF:Synthetic music Mobile Application Format" as a data distribution format that is compatible wiht multimedia. Since the SMAF takes a structure that sets importance on the synchronization between sound and images, various contents can be written into it including incoming call melody with words that can be used for traning karaoke, and commercial channel that combines texts, images and sounds, and others. The hardware sequencer of YMU762MA3 directly interprets and plays blocks relevant to systhesis (playing music and reproducing ADPCM with FM synthesizer) that are included in data distributed in SMAF.
5) Memory
This system uses SHARP's memory, LRS1828. It is consisted of 128M bits flash memory and 32M bits SCRAM. It has 16 bit data line, D[0~15] which is connected to trident, LCD or CSP1093. It has 22 bit address lines, A[1~22]. They are connected too. CP_CSROMEN and CO_CSROM2EN signals, chip select signals in the trident enable two memories. They use 3 volt supply voltage, VCCD. During wrting process, CP_WEN is low and it enables writing process to flash memory and SCRAM. During reading process, CP_OEN is low and it output information which is located at the address from the trident in the flash memory or SCRAM to data lines. Each chip select signals in the trident select memory among 2 flash memory and SCRAM. Reading or writing procedure is processed after CP_WEN or CP_OEN is enabled. Memories use FLASH_RESET, which is buffered signal of RESET from PSC2106, for ESD protection. A[0] signal enables lower byte of SCRAM and UPPER_BYTE signal enables higher byte of SCRAM.
6) Trident
Trident is consisted of ARM core and DSP core. It has 20K*16bits RAM 144K*16bits ROM in the DSP. It has 4K*32bits ROM and 2K*32bits RAM in the ARM core. DSP is consisted of timer, one bit input/output unit(BIO), JTAG, EMI and HDS(Hardware Development System). ARM core is consisted of EMI, PIC(Programmable Interrupt Controller), reset/power/clock unit, DMA controller, TIC(Test Interface Controller), peripheral bridge, PPI, SSI(Synchronous Serial Interface), ACCs(Asynchronous communications controllers), timer, ADC, RTC(Real-Time Clock) and keyboard interface. DSP_AB[0~8], address lines of DSP core and DSP_DB[0~15], data lines of DSP core are connected to CSP1093. A[0~20], address lines of ARM core and D[0~15], data lines of ARM core are connected to memory, LCD and YMU762. ICP(Interprocessor Communication Port) controls the communication between ARM core and DSP core. CSROMEN, CSRAMEN and CS1N to CS4N in the ARM core are connected to each memory. WEN and OEN control the process of memory. External IRQ(Interrupt ReQuest) signals from each units, such as, YMU, Ear-jack, Ear-mic and CSP1093, need the compatible process.
2-5
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SGH-X450 Circuit Description
Some PPI pins has many special functions. CP_KB[0~9] receive the status from key FPCB and are used for the communicatios using data link cable(DEBUG_DTR/RTS/TXD/RXD/CTS/DSR). And UP_CS/SCLK/SDI, control signals for PSC2106 are outputted through PPI pins. It has signal port for charging(CHG_DET), SIM_RESET and FLIP_SNS with which we knows open.closed status of folder. It has JTAG control pins(TDI/TDO/TCK) for ARM core and DSP core. It recieves 13MHz clock in CKI pin from external TCXO and receives
32.768KHz clock from X1RTC. ADC(Analog to Digital Convertor) part receives the status of temperature, battery type and battery voltage. And control signals(DSP_INT, DSP_IO and DSP_RWN) for DSP core are used. It enables main LCD with DSP IP pins.
7) CSP1093
CSP1093 integrates the timing and control functions for GSM 2+ mobile application with the ADC and DAC functions. The CSP1093 interfaces to the trident, via a 16-bit parallel interface. It serves as the interface that connects a DSP to the RF circuitry in a GSM 2+ mobile telephone. DSP can load 148 bits of burst data into CSP1093’s internal register, and program CSP1093’s event timing and control register with the exact time to send the burst. When the timing portion of the event timing and control register matches the internal quarter-bit counter and internal frame counter, the 148 bits in the internal
Register are GMSK modulated according to GSM 2+ standards. The resulting phase information is translated into I and Q differential output voltages that can be connected directly to an RF modulator at the TXOP and TXON pins. The DSP is notified when the transmission is completed. For receiving baseband data, a DSP can program CSP1093’s event timing and control register with the exact time to start receiving I and Q samples through TXIP and TXIN pins. When that time is reached, the control portion of the event timing and control register will start the baseband receive section converting I and Q sample pairs. The samples are stored in a double-buffered register until the register contains 32 sample pairs. CSP1093 then notifies the DSP which has ample time to read the information out before the next 32 sample pairs are stored. The voice band ADC converter issues an interrupt to the DSP whenever it finishes converting a 16-bit PCM word. The DSP then reads the new input sample and simultaneously loads the voice band output DAC converter with a new PCM output word. The voice band output can be connected directly to a speaker via AOUTAN and AOUTAP pins and be connected to a Ear-mic speaker via AOUTBN and AOUTBP pins.
8) X-TAL(13MHz)
This system uses the 13MHz TCXO, TCO-9141B, Toyocom. AFC control signal form CSP1093 controls frequency from 13MHz x-tal. It generates the clock frequency. This clock is fed to CSP1093,Trident,YMU762 and Silab solution.
2-6
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
3. SGH-X450 Exploded View and its Parts list
1. Cellular phone Exploded View-1
1
11
12
13
2
5 3
4
6
9
16
18
8
15
22
14
17
20
19
21
7
10
23
3-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SGH- X450 Exploded view and its Part list
2. Cellular phone Parts list
1 2 3 4 5 6 7 8 9 10 11 12 13 14
NO
Description SEC CODE Remark
FOLDER UPPER GH75-03608A FRAME GH72-11125A MOTOR GH31-00077A SPEAKER 3001-001509 MAIN LCD GH07-00490A FOLDER LOWER GH75-03609A WINDOW LCD GH71-01539A SCREW 6001-001479 SCREW CAP(L) GH74-01466A SCREW CAP(R) GH74-01467A FRONT COVER GH75-03607 KEYPAD GH75-04141A DOME SHEET GH59-01212A MAIN PBA GH92-01595A
15 16 17
18 19
20 21 23
VOLKEY FPCB GH59-01213A IF COVER GH73-01844A MIC GH30-00090A
VOLUME KEY GH75-02846A ANTENNA GH42-00374A
REAR COVER GH75-03610A RF COVER GH73-01894A BATTERY GH43-01074A
3-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Loading...
+ 26 hidden pages