Samsung WIDT10B Users Manual

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Green
Vendor Registr
A TE
Indemn WNC directo liabilit profess Compo propert intellec Compo copyrig Samsu or mod infringi
ITEM
DEL NA SCRIPTI OLUTIO
MSUNG P WNC P/N
rocurement
Code
tion Date
DRAWIN
M OF VA
ification
ill indemni s, officers, or expense
onals) arisi
ents provi right. If
ual propert
ents provi
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g the right t
fy the alleg
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E
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IDITY
y, hold har mployees, ( including
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NC receiv right infri
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CHECK
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US
IEEE 8
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T LEAST
Samsung's dependent
nd reasona
m any third
tent, copyr
n alleged p
Samsung's
vented by p
may, at it oducts and/ that it is no
ua
Embedde
WIDT10B
02.11n 2x2 dcom: BC
BN59-011
REEMEN
5-YEARS
request, de ontractors f
le fees of a party claim
ght, trade s
tent, copyri use of the
ermanent in
sole optio
r the Com
longer infri
Module
B
iFi Mode
43236
0A
FROM IS
end Samsu
om and aga
torneys and
that any Pr
cret right o
ght, trade s
roducts and
unction for
and expen
onents as p
ging, or re
APPROV
UED DAT
g and Sams
inst any los
other
ducts and/
other intell
cret or othe
or the
reasons of
e, procure
ovided here
lace the all
L
ng's
, cost,
r
ectual
atent,
r nder,
gedly
MAKER
ADDRESS
DNUB-S2
2
WNC
Park Ave
ue II, Hsinc
TEL
u Science
ark, Hsinc
86-3-6667
u 308, Tai
99
an
D
I
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t
a
3
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C
5
66666
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B
ndex
Part I
1.
2.
3.
4.
5.
Part I
1. In
2. Fe
3. H
4. L
5. P
6. Sp
Genera
History S
Part List
Circuit dia
PCBA pi
Box packa
Specifi
roduction
atures
rdware Arc
.1 Mai
bel
B
.1 PC
ecifications
.1 Sup
informat
eet
ram
ture
e spec
ation of
itecture:
Chipset In
Gerber
ly Voltage
ion
IDT10
ormation
7. M
8. In
.2 Cur
.3 RF
.4 RF
.5 Env
G test ite
tallation Pr
ent Consu
ower
ensitivity
ronmental
s
cedure
ption
pec
NUB-S2
v
t
s
e
i
i( 2
v
D
D
v
s
b
u
m
D
1
0
5
1. Re
Edi
ision Hi
ion # R
V
0.1 In
V
0.2 In
tory
ason for re tial Draft
tial Draft 010/10/06
ision
ocument ba
ocument
ersion)
e on Sams
ase on Sa
ng V0.2 H sung V0.4
HDK
Issue date
2010/09/1 2010/10/1
DNUB-S2
2
3
s
5
2
0
C
5
7
8
4
t
m
U
U
P
U
U
U
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F
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Ω
%
%
5
K
K
K
x
.
D
0
T
P
A
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M
o
/
A
O
H
A
D
A
O
E
C
1
C
B
A
0
C
K
C
A
C
E
E
C
0
H
A
K
D
0
A
A
A
S
. Part li
C3,C28,C32,C6
36
9
4 2 C13,C16
5 2 C17,C27
61C18 7 3 C19,C86,C87
C21,C22,C24,C 31,C33,C34,C4
819
,C51,C53,C69, 82,C84,C88
9 2 C23,C30
10 6 C37,C38,C44,C
11 1 C39
12 2 C41,C58
13 1 C42
C62,C74,C75,C
14 6
85
15 5 C63,C76,C78,C
16 1 CN1
17 4 C120,C130,C14 18 1 BD1 19 1 BD2 20 2 L1,L2
R20,R27,R42,R
21 6
53
22 1 R1
R16,R17,R18,R
23 6
34
24 1 R7
25 1 R24
26 1 R40
27 1 R29
28 2 R30,R32
29 1 R31
30 3 R33,R61,R62
31 1 R35
32 1 R50
33 1 D1
34 2 U3,U4
35 1 IC5
36 1 X1
97
A1
37 1 IC1
t
,C81,C8
5,C26,C ,C43,C46 71,C80,C
4,C67,C 4.7uF
7,C79,C
3,C90 0.01uF
0,C150 9pF
3,R49,R
19,R28,R
1000pF
20MHz
PCB Shield Can
Antenna
BCM43236KMLG
1uF
9pF
4.7uF
0.1uF 100pF
0.1uF
0.1uF
39pF
10uF
22pF
2.2uH
0
221
0
1K
100K
100K
60.4K
59K
267K
10K
15K
4.02K
LED
CAP,CER,0402,1UF
CAP,CER,0402,9PF
CAP,CER,1206,4.7
CAP,CER,0603,0.1 CAP,CER,0201,100
CAP,CER,0201,0.1
CAP,CER,0402,0.1
CAP,CER,0603,4.7
CAP,CER,0201,39P
CAP,CER,0805,10U
CAP,CER,0201,22P
CAP,CER,0201,100
CAP,CER,0201,0.01
BOX,4P,1R,1.25mm
CAP,CER,0201,9PF 220ohm,2012,TP,80 600ohm,0402, 300m
2.2uH, ±20%, 0.158
RES,THK,0402,0,5
RES,THK,0201,221,
RES,THK,0201,0,5
RES,THK,0201,1K,
RES,THK,0201,100
RES,THK,0402,100
RES,THK,0402,60.4
RES,THK,0402,59K,
RES,THK,0402,267
RES,THK,0201,10K,
RES,THK,0201,15K,
RES,THK,0201,4.02
SMD,BLUE,1.6x0.8
MOD,SMT,2.4-2.5/4
IC,REG,WDFN12,A
XTL,FXD,SMT,20.0
34x36mm, 4Layer,
Carrier type
WLAN SINGLE CHI
,10%,6.3V,X6S,X5R
,0.25PF,50V,NP0,C0G
F,20_80%,25V,Y5V
F,80_20%,50V,Y5V
F,5%,25V,X7R
F,10%,6.3V,X5R
F,10%,10V,X5R
F,20%,6.3V,X5R
,5%,16V,NP0,C0G
F,10%,10V,X5R
,5%,25V,NP0,C0G
PF,10%,25V,X7R
UF,10%,6.3V,X5R
,SMD-A,Sn,2um min,NATUR
,0.5PF,25V,NP0
hm/100MHz,200ohm/600M
A, 0.6ohm
1.4A, 2.5X2mm
,63MW 50V
1%,50MW
,50MW
%,50MW
,5%,50MW
,5%,50MW
K,1%,63MW
1%,63MW
,1%,63MW
5%,50MW
1%,50MW
K,1%
0.4mm,470,1.6x0.8x0.4mm
9-5.875GHZ,3.3V,3X3X1M
J_ADJ,1_1A,SW,1.5MHZ,B
0MHZ,10PPM,3.2X2.5 X0.6
hrough hole via, Au plating
Rest BOM T
11N 2X2 -DUAL BAND
L
z
,SW/2DIPLEXER,802.11A/B
CK,UVL,SCP
M,9PF,FUND tal
G FEM
MURATA SEM TDK YAGEO SEM MURATA SEM TDK MURATA MURATA
YAGEO SEM VENKEL
SEM MURATA TDK SEM TDK SEM MURATA YAGEO SEM TDK TDK YAGEO MURATA SEM TDK YEONHO
DCOELECTR FOOSUNG TEC JAEEUN ELECTRONICS JWT MURATA SEM MURATA TDK MATSUSHITA YAGEO ABCO KOA KOA YAGEO SEM KOA SEM KOA SEM KOA
BCO SEM SEM KOA MATSUE ,PSIN SEM ROHM KOA SEM YAGEO ROHM KOA SEM KOA SEM KOA SEM KOA
OT LITE-ON SEMIC SB1314E-V TDK SiGe PAM AURA micro SEIKO EPSON
BROADCOM
GRM155R60J105K CL05A105KQ5NNN C1005X5R0J105K CC0402KRX5R5BB CL05C090CB5ANN GJM1555C1H9R0C CL31F475ZONE C3216Y5V1E475Z GRM188F51H104Z GRM0335C1E101J
C0201KRX5R5BB1 CL03A104KQ3NNN C0201X5R6R3-104
CL05A104KP5NNN GRM155R61A104K C1608X5R0J475MT CL03C390JA3ANN C0603C0G1E390JT CL21A106KPFNNN GRM21BR61A106K C0201JRNP08BN22 CL03C220JA3ANN C0603C0G1E220JT C0603X7R1E102KT C0201KRX7R8BB1 GRM033R60J103K CL03A103KQ3NNN C0603X5R0J103KT 12507WR-04L LM123-004-TF13
NICS
FW12501-04 JE204-B1.25-5T4
IP125-L04B-C26 GRM0335C1E9R0D CIC21P221NE BLM15AG601SN1 VLS252010T-2R2M ERJ2GEJ000X RC0402JR-070R ACR0402T000J RK73Z1ETQTP RK73H1HTQTB221 RC0201FR-07221R RC0603J000CS RK73Z1HTQTB RC0603J102CS RK73B1HL102J RC0603J104CS RK73B1HL104J
RC1005J104CS RC1005F6042CS RK73H1ETTP6042F ERJ2RKF5902X RC1005F5902CS MCR01MZPF5902 RK73H1ETTP5902F RC1005F2673CS RC0402FR-07267K MCR01MZPF2673 RK73H1ETTP2673F RC0603J103CS RK73B1HL103J RC0603F153CS RK73H1HTTB1502F RC0603F4021CS RK73H1HTTB4021F
LIST-C193ZBKT-AC
N
광전자㈜
SE2577 PAM2306AYPAA AUR9707 TSX-3225
IMP43236A0KMLG
1255WRO-4PS-H
CR0402T104J
OT-0603P-B01AZ
SM3053755T-5104
19D
05
01J
01C
4
NP
01D
19L
0
2
01D
F
MIC
. Circui
DNUB-S2
diagra
-
DNUB
S2
DNUB-S2
D
4
A
w
e
c
V
. PCB
Top vie
picture
Bottom
iew
5. Box
TBD
Packag
Specifi
ation
NUB-S2
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