Samsung SGH-T519 Service Manual
GSM TELEPHONE
SGH-T519
GSM TELEPHONE
CONTENTS
1. Safety Precautions
2. General Introduction
3. Specification
4. Product Funtion
5. Circuit Description
6. Test Command & Test Procedure
7. Array course control
8. Exploded View and its Parts list
9. MAIN Electrical Parts List
10. Flow Chart of Troubleshooting and
Circuit Diagrams
11. PCB Diagrams
12. Block Diagrams
13. Reference data
Contents
1. Safety Precautions
1-1. Repair Precaution ...........................................................................1-1
1-2. ESD(Electrostatically Sensitive Devices) Precaution ...........................1-2
2. General Introduction
3. Specification
3-1. GSM General Specification ..............................................................3-1
3-2. GSM TX Power class ......................................................................3-2
3-3. EDGE TX Poser Level .....................................................................3-3
4. Product Function
4-1. Main Function ................................................................................4-1
5. Circuit Description
6. TEST Command & Test Procedure
6-1. Calibration Equipment ....................................................................6-1
6-2. Calibration Program .......................................................................6-1
6-3. TX Power Tune up procedure .........................................................6-2
7. Array course control
7-1. Downloading Binary Files ................................................................7-2
7-2. Pre-requsite for Downloading ..........................................................7-2
7-3. S/W Downloader Program ...............................................................7-3
7-4. How to Download ..........................................................................7-5
8. Exploded View and its Parts list
8-1. Cellular phone Exploded View .........................................................8-1
8-2. Cellular phone parts list .................................................................8-2
8-3. Disassembly ..................................................................................8-4
8-4. Assembly ......................................................................................8-7
Contents
9. MAIM Electrical parts list
10. Flow Chart of Troubleshooting and Circuit Diagrams
10-1. Baseband
10-1-1. Power on ..............................................................................10-1
10-1-2. Initial ....................................................................................10-3
10-1-3. Sim Part ...............................................................................10-4
10-1-4. Charging Part ........................................................................10-5
10-1-5. Microphone Part .....................................................................10-7
10-1-6. Speaker Part .........................................................................10-9
10-1-7. Camera Part ........................................................................10-13
10-2. RF
10-2-1. GSM850/EGSM900 RX ..........................................................10-15
10-2-2. PCS RX ...............................................................................10-16
10-2-3. DCS RX ...............................................................................10-17
10-2-4. GSM850/EGSM900 TX ...........................................................10-18
10-2-5. DCS/PCS TX ........................................................................10-19
10-2-6. BLUETOOTH .........................................................................10-20
11. PCB Diagrams
12. Block Diagrams
12-1. RF Solution Block Diagram ..........................................................12-1
12-2. Base Band Solution Block Diagram ..............................................12-2
13. Reference data
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
ⓒ
Samsung Electronics Co.,Ltd.
Code No.: GH68-12034A
2006. 08. Rev.1.0
1. Safety Precautions
1-1. Repair Precaution
●
Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test,
because specipicty of cellular phone is sensitive for surrounding interference(RF noise).
●
Be careful to use a kind of magnetic object or tool,
because performance of parts is damaged by the influence of manetic force.
●
Surely use a standard screwdriver when you disassemble this product,
otherwise screw will be worn away.
●
Use a thicken twisted wire when you measure level.
A thicken twisted wire has low resistance, therefore error of measurement is few.
●
Repair after separate Test Pack and Set because for short danger (for example an
overcurrent and furious flames of parts etc) when you repair board in condition of
connecting Test Pack and tuning on.
●
Take specially care of soldering, because Land of PCB is small and weak in heat.
●
Surely tune on/off while using AC power plug, because a repair of battery charger is
dangerous when tuning ON/OFF PBA and Connector after disassembing charger.
●
Don't use as you pleases after change other material than replacement registered on
SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
1-1
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Safety Precautions
1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easilly by static electricity. Such parts are called by
ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
●
Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity
prevention string on wrist.
●
Use earthed soldering steel when you connect or disconnect ESD.
●
Use soldering removing tool to break static electricity. otherwise ESD will be damaged by
static electricity.
●
Don't unpack until you set up ESD on product. Because most of ESD are packed by box
and aluminum plate to have conductive power,they are prevented from static electricity.
●
You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or a circuit board.
1-2
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2. General Introduction
The SGH-T519 Quad Band phone functions as digital phone working in GSM
(Global Syst em for Mobile communications)850,EGSM900, DCS1800 and
PCS(PersonalCommunication System)1900 modes.
<Specification>
●
Dimension : 113 x 50 x 8.6 mm (with Standard Battery)
●
Weight : 76g (wi th Standard Battery)
●
LCD : LCD 260K TFT Color LCD (176 x 220) 1.93"
●
R/F band : GSM850 / EGSM 900 / DCS1800 / PCS1900
●
Vocoder :EFR+FR+HR+AMR
●
Antenna : Fixed type
●
SIM : 3 Voltage operation
●
BLUETOOTH : VER 1.0
<GPRS/EGPRS Factor>
●
MS Class : Class B
●
GPRS Phase : GSM Phase II+
●
Multi-slot : GPRS/EGPRS Class 10 (2 Up-link, 4 Down-link, 5 Sum)
●
SMG : SMG #31
●
Coding scheme : CS1 - CS4(GPRS), MCS5 - MCS9(EGPRS) support
●
Power class : GSM850 - Class 4 (2W)
EGSM900 - Class 4 (2W)
DCS1800 - Class 1 (1W)
PCS1900 - Class 1 (1W)
●
WAP 2.0 Browser
●
SIM AT(Application Toolkit)
●
40 Polyphonic Ringtone
<BasicPackage>
●
Handset + Standard Battery + TA + User Guide + Handstrap
<OptionItem>
●
Travel Adapter
●
Ear Microphone
●
Bluetooth Headset
●
Bluetooth Hands Free Kit
●
Car Charger/Adapter
2-1
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3. Specification
3-1. GSM General Specification
GSM850 EGSM900 DCS1800 PCS1900
Freq. Band[MHz]
Uplink/Downlink
ARFCN range 128~251
Tx/Rx spacing 45 MHz 45 MHz 95 MHz 80 MHz
Mod. Bit
rate/
Bit Period
Time Slot
Period/Frame Period
Modulation
MS Power
GPRS
EDGE
GPRS 0.3 GMSK 0.3 GMSK 0.3 GMSK 0.3 GMS K
EDGE 8PSK 8PSK 8PSK 8PSK
GPRS 33 dBm~5 dBm 33 dBm~5 dBm 30 dBm~0 dBm 30 dBm~0 dBm
EDGE 27~5 dBm 27~5 dBm 26~0 dBm 26~0 dBm
824~849
869~894
270.833 Kbps
3.692 us
812.5 Kbps
3.692 us
576.9 us
4.615 ms
880~915
925~960
0~124&
975~1023
270.833 Kbps
3.692 us
812.5 Kbps
3.692 us
576.9 us
4.615 ms
1710~1785
1805~1880
512~885 512~810
270.833 Kbps
3.692 us
812.5 Kbps
3.692 us
576.9 us
4.615 ms
1850~1910
1930~1990
270.833 Kbps
3.692 us
812.5 Kbps
3.692 us
576.9 us
4.615 ms
GP R S 5~19(class4) 5~19(class4) 0~15(class1) 0~15(class1)
Power Level
EDGE 8~19(class E2) 8~19(class E2) 2~15(class E2) 2~15(class E2)
Sensitivity -102 dBm -102 dBm -100 dBm -102 dBm
TDMA Mux 8 8 8 8
Cell Radius 35 Km 35 Km 2 Km 2 Km
3-1
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3-2. GSM TX power class
Specification
TX
Power
control
GSM850
level
5 33±2 dBm
6 31±2 dBm
7 29±2 dBm
8 27±2 dBm
9 25±2 dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±2 dBm
17 9±2 dBm
18 7±2 dBm
19 5±2 dBm
TX
Power
control
EGSM900
level
5 33±2 dBm
6 31±2 dBm
7 29±2 dBm
8 27±2 dBm
9 25±2 dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±2 dBm
17 9±2 dBm
18 7±2 dBm
19 5±2 dBm
TX
Power
control
DCS1800
level
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4 dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX
Power
control
PCS1900
level
030±3dBm
128±3dBm
226±3dBm
324±3dBm
422±3dBm
520±3dBm
618±3dBm
716±3dBm
814±3dBm
912±4dBm
10 10±4 dBm
11 8±4 dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
3-2
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Specification
3-3. EDGE TX Power Level
TX
Power
control
GSM850
level
8 27±3 dBm
9 25±3 dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5 dBm
18 7±5 dBm
TX
Power
control
EGSM900
level
8 27±3 dBm
9 25±3 dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5 dBm
18 7±5 dBm
TX
Power
control
DCS1800
level
226±3dBm
324±3dBm
422±3dBm
520±3dBm
618±3dBm
716±3dBm
814±3dBm
912±4dBm
10 10±4 dBm
11 8±4 dBm
12 6±4 dBm
TX
Power
control
PCS1900
level
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4 dBm
12 6±4 dBm
19 5±5 dBm
19 5±5 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
3-3
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4. Product Function
Main Function
-1.3 Megapixel Camera and Camcorder
-Bluetooth®Wireless Technology
-Instant Messageing capability
-Multimedia capability
-Fun & Apps featurep rovides My Files, music player, games,
alarms, calendar, task list, calculato r, world time, unit conversion, timer,
and stopwatch.
4-1
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5. Circuit Description
< RF Circuit Description of SGH-T519 >
1. FEM (F100)
==> Switching Tx, Rx path for GSM850, EGSM900, DCS1800 and PCS1900
controlled by logic.
Integration of GSM850, EGSM900, DCS1800 and PCS1900 RX SAW Filters.
To convert Electromagnetic Field Wave to Acoustic Wave and the pass the specific
frequency band.
- for filtering the frequency band 824 ~ 849 / 869 ~ 894 MHz
- for filtering the frequency band 880 ~ 915 / 925 ~ 960 MHz
- for filtering the frequency band 1710 ~ 1785 / 1805 ~ 1880 MHz
- for filtering the frequency band 1850 ~ 1910 / 1930 ~ 1990 MHz
2. FEM Control Logic
==> Truth Table
VC1 VC2 VC3
GSM850 Rx Mode L L H
EGSM900 L L L
GSM850/EGSM900 Tx Mode L H L
DCS/PCS Rx Mode L L L
DCS/PCS Tx Mode H L L
3. VC-TCXO(TCX400)
==> To generate the 26 MHz reference clock to drive the logic and RF.
4. SKY74137 (UCD100)
==> The sky74137 is a RF tranceiver IC for GS850, EGSM900 DCS1800
and PCS1900 quardband cellular systems, and incorporates EDGE tranceiver
capabillity, and integrates most of the low power silicon functions of a tranceiver.
The receive path implements a direct downconversion architecture. The transceiver
consists of four integrated Low Noise Amplifiers (LNAs), a quadrature demodulator,
selectable baseband filter bandwidths, and lowdroop DC Offset Correction (DCOC)
sequencer.
- RX Function
Four LNAs which support different bands of operation have separated differential
inputs. The LNA outputs feed into a quadrature demodulator that down-converts
the RF signals directly to baseband. The baseband I and Q paths consist of
cascaded amplifiers and low pass filter sections. All baseband filtering is provided
on-chip using no external capacitors.
5-1
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Circuit Description
- TX Function
The device implements Skyworks Polar Loop transmit architecture. This architecture
autonomously splits the amplitude and phase w ithin the device using the traditional
analog In-Phase and Quadrature (I/Q) signals. The filter-saving advantage of the
translation-loop approach is embedded in the architecture. Also included is an AM loop
that provides both signal AM and power level control. The transmitter is provided a
coupled feedback signal from the PA and downconverts it to an IF. Following an IF VGA,
this feedback signal is fed to both loops. The reference for both loops is a transmit IF
signal produced by an I/Q modulator
5. POWER AMP (PAM400)
The module consists of a EGSM850/900 PA block and a DCS1800/PCS1900 PA block,
Both PA blocks share common power supply pins to distribute current. The subsystem
consists of two parts : a Power Amplifier Control (PAC) block, and an Integrated Coupler.
To select GSM900/850 and GMS1800/1900 as determined from the Band Select
(BAND_SEL) signal. SKY77331 contains band select switching circuitry to select GSM
(BAND_SEL is low) and DCS/PCS (BAND_SEL is HIGH) as determined from the Band
Select (BAND_SEL) signal. The BAND_SEL pad selects the PA output (DPCS_OUT or
GSM_OUT) while the Power Control (VPC) controls the level of output power. The
integrated power amplifier control (PAC) function provides envelope amplitude control by
reducing sensitivity to input drive, temperature, power supply, and process variation.
< Baseband Circuit description of SGH-D407 >
1. CSP2750 (UCD301)
==> The CSP2750 has two major logical components power management and
conversion signal processing.
The PSC component is responsible for all power-related functionality, including the
following;
●
Power management for RF, BB and ancillary devices within the GSM/GPRS
●
Battery-charge management
●
Reset control
●
SIM card voltage-level shifting
The CSP component is responsible for the following ;
●
Intraframe event scheduling
●
Voice band processing, including voice band ADC and DAC
●
Analog baseband processing, including baseband ADC and DAC
●
Providing RF interface for Trident digital baseband device
●
Transmitter Power control
●
Automatic frequency control
●
A5 ciphering
●
Low-power sleep mode and wake-up control
The CSP2750 has the following major physical components;
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5-2
●
Timing and control unit
●
RF serial interface
●
Low-power sleep mode controller
●
Baseband Transmitter / Receiver
●
Voice input and output
2. WM8955L(UCD401)
==> The WM8955L is a low power, high quality stereo DAC with intergrated headphone
and loudspwaker amplifiers, designed to reduce external component
requirements in portable digital audio application.
The on-chip headsphone amplifiers can deliver 40mW into a 16Ωload. Advanced
on-chip digital signal processing performs bass and treble tone comtrol.
The WM8955L can operate as a master or a slave, and include an on-chip PLL. It
can use most master clock frequencies commonly found in portable systems,
including USB,GSM, CDMA or PDC clocks, or standard 256f
Different audio sample rates such as 48khz, 44.1khz, 8khz and many other are
supported.
Circuit Description
s,clockrates.
The WM8955L operates on supply voltages from 1.8V up to 3.6V, although the
digital core can operates on a separate supply down to 1.42V, saving power.
Different section of the chip can also be powered down under software control.
3. HPE(UCP201)
==> The Trident-HPE digital baseband processor is a complete system IC designed for
wireless terminals that includes two digital signal processor(DSP) cores
optimized for low-power communications applications and a powerful,
highperformance,
industry-standard microcontroller core along with a rich set of peripherals.
The Trident-HPE digital baseband processor achieves best-in-class signal processing
performance while maintaining the efficient software code density, low power
consumption, and small physical size required for GSM/GPRS terminals
ARM946E-S microcontroller core;
●
101 MHz system bus, 16 kbyte instruction and 16kbyte data caches.
●
8 kbyte tightly coupled zero wait-state instruction and 4kbyte tightly coupled zero wait-
state data memory
●
direct memory access controller for transparent transfer between memory and
peripherals.
●
External Memory interface with asynchronous burst mode support
5-3
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Circuit Description
●
Synchronous serial port supporting
●
Programmable 48-bit general-purpose IO unit, keyboard interface, programmable interval
timer and real-time clock.
●
SD/MMC controller that supports interfacing to secure digital/multimedia memory card.
Two DSP16000 dual-MAC DSP cores;●Up to 404 million MACs per second at 101 MHz.
●
Memory complement;
- DSP0 : 144K X 16-bit ROM, 40k X 16-bit RAM.
- DSP1 : 96K X 16-bit ROM, 16k X 16-bit RAM.
JTAG boundary scan and integrated H/W developement system Low power;
●
Ultralow leakage process technology for best-in-class standby
power
●
Flexible power management modes to allow for maximum active power management
Interprocessor communication hardware support between ARM, DSP0 and DSP1.
Supported by Trident-HPE digital baseband processor software and hardware
developementtoolsaswellasindustry standard ARM software and hardware
developement tools Two on-chip, programmable, PLL clock synthesizers;
- one for ARM and DSP, the other one for USB.
5-4
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6. Test Command & Test Procedure
6-1. Calibration Equipment
-HP8960
- DC Power Supply
-TestJig
- Configuration
RF
DC POWER SUPPLY
GPIB
+ --
TEST JIG
HP8960
P C
GPIB
6-2. Calibration Program
- Samsung internal software
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Serial
6-1
Serial
6-3. Tx Power Tune up Procedure
-GMSK
1) Procedure:
a. Calibraion equipment HP8960 and the cell phone are connected
through RF cable.
b. Target power ( required power level according to the specification
which should be set by calibration program) is set to equipment as
power level (ex: GSM 5 level is 32.5 dBm).
c. Activate phone in Tx_Mode_Only.
d. HP8960 equipment measures transmitted power through rf test cable
from the phone and reports measured level to calibration program.
Test Command & Test Procedure
e. The program compares measured power with the target power.
f. The calibration program decides power code which is defined in
advance in the program and writes the codes to the flash memory in
the phone.
2) Target value is defined according to the value of GSM specification.
See the TX power level definition table below.
3) Target values of the peak level of the phone are set normally in
conducted mode
-GSM8505level:32.5dBm
- EGSM900 5 level : 32.5dBm
- DCS 0 level : 2 9.5dBm
- PCS 0 level : 29.5dBm (Tolerance : -2dB ~ +1dB )
4) Accuracy
All the TX level from the phone after tuned-up satisfy the GSM
specification
5) TX ramp mask specification applied to the calibration program :
6-2
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Test Command & Test Procedure
-8PSK
1) Procedure:
a. Calibraion equipment HP8960 and the cell phone are connected
through RF cable.
b. Target power ( required power level according to the specification
which should be set by calibration program) is set to equipment as
power level (ex: GSM 8 level is 27 dBm).
c. Activate phone in Cont_8psk_Tx_Mode_Only.
d. HP8960 equipment measures transmitted power through rf test cable
from the phone and reports measured level to calibration program.
e. The program compares measured power with the target power.
f. The calibration program decides power code which is defined in
advance in the program and writes the codes to the flash memory in
the phone.
2) Target value is defined according to the value of EGPRS specification.
6-3
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Test Command & Test Procedure
See the TX power level definition table below.
3) Target values of the peak level of the phone are set normally in
conducted mode
-GSM8508level:27dBm
- EGSM900 8 level : 27dBm
- DCS 2 level : 26dBm
- PCS 2 level : 26dBm (Tolerance : -2dB ~ +1dB )
4) Accuracy
All the TX level from the phone after tuned-up satisfy the EGPRS
specification
5) TX ramp mask specification applied to the calibration program :
6-4
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7. Array course control
Test Jig (GH80-03307A)
Test Cable (GH39-00478A)
RF Test Cable (GH39-00397A)
7-1
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Array course control
Software Downloading
7-1. Downloading Binary Files
• Two binary files for downloading T519.
–T519XXYY.s3 : Main source code binary.
7-2. Pre-requsite for Downloading
• Downloader Program(OptiFlash.exe)
• T519 Mobile Phone
• Data Cable
• Binary files
7-2
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Array course control
7-3. S/W Downloader Program
1. Load the binary download programby executing the “OptiFlash.exe”
2. Select the “Options” -> “Settings” -> “Generic” ->
“Specify hardware platform”.
Choose hardware platform for the downloader file setting.
Set the everything else as the default values which are shown below
7-3
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Array course control
3. Select the COM port when the download cable is connected
Up to 64 ports are supported. Additionally you can select the maximum
transfer speed OptiFlash will use to communicate with the phone.
However, OptiFlash will use a slower speed if either the PC’s or the
phone’s serial hardware is incapable of handling the selected speed.
7-4
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Array course control
4. Select the“Flash&Verify” -> “Browse”
Set the directory path and choose the latest s/w binary, for example
“T519XXYY.s3”,for the downloader binary setting.
In case of D407 the reserved regions are not a necessity.
(It is defined in platform.def file)
7-5
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Array course control
5. Click “OK” button then press “Flash”.
(Before pressing ‘Flash’ button, push the button ‘*’and ‘END’ at the
same time.Thenpress‘Flash’.)
Downloader will upload the binary file as below for the downloading.
6. When downloading is finished successfully, there is a “All is well”
message.
7. After finishing downloading, Certain memory resets should be done to
guarantee the normal performance.
8. Confirm the downloaded version name and etc. :
*#1234#
Full Reset :
*2767*3855#
7-6
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