Samsung SGH-D600 Service Manual

GSM TELEPHONE
SGH-D600
GSM TELEPHONE
CONTENTS
1. Specification
2. Circuit Description
3. Exploded Views and Parts List
4. Electrical Parts List
6. PCB Diagrams
7. Flow Chart of Troubleshooting
This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable International and/or domestic law.
Samsung Electronics Co.,Ltd. September. 2005 Printed in Korea.
Code No.: GH68-08500A BASIC.

1. Specification

1-1. GSM General Specification
GSM850
phase1
Freq.
Band[MHz]
Uplink/Downlin
k
ARFCN range 128~251 1~124
Tx/Rx spacing 45MHz 45MHz 45MHz 95MHz 80MHz
Mod. Bit rate/
Bit Period
Time Slot
Period/Frame
Period
Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~13dBm 33dBm~13dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm
824~849 869~894
270.833kbps
3.692us
576.9us
4.615ms
GSM900
Phase 1
890~915 935~960
270.833kbps
3.692us
576.9us
4.615ms
EGSM 900
Phase 2
880~915 925~960
0~124 &
975~1023
270.833kbps
3.692us
576.9us
4.615ms
DCS1800
Phase 1
1710~1785 1805~1880
512~885 512~810
270.833kbps
3.692us
576.9us
4.615ms
PCS1900
1850~1910 1930~1990
270.833kbps
3.692us
576.9us
4.615ms
Power Class 5pcl ~ 15pcl 5pcl ~ 15pcl 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl
Sensitivity -102dBm -102dBm -102dBm -100dBm -100dBm
TDMA Mux 8 8 8 8 8
Cell Radius 35Km 35Km 35Km 2Km -
1-1
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Specification
1-2. GSM TX power class
TX
Power
control
level
GSM850
TX
Power
control
level
GSM900
TX
Power
control
level
DCS1800
TX
ower
control
level
PCS1900
5 33±3 dBm
6 31±3 dBm
7 29±3 dBm
8 27±3 dBm
9 25±3 dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
5 33±2 dBm
6 31±2 dBm
7 29±2 dBm
8 27±2 dBm
9 25±2 dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
0 30±2 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
0 30±2 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5 dBm
18 7±5 dBm
19 5±5 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3dBm
18 7±3 dBm
19 5±3 dBm
1-2
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
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8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm

2. Circuit Description

2-1. SGH-D600 RF Circuit Description
2-1-1. RX PART
- FEM(F100 SWICHPLEXER) Switching Tx, Rx path for GSM850, GSM900, DCS1800 and PCS1900 by logic controlling.
- ANTENNA SWITCH Control Logic (F100)→Truth Table VC_1 VC_2 VC_3
GSM850/900 Rx Mode L L L DCS Rx Mode L L L PCS Rx Mode GSM Tx Mode (GSM850/900) H L L DCS/PCS Tx Mode L H L
- FILTER
To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band.
- GSM850 FILTER (L113,C133,C134,C135)→For filtering the frequency band between 869 ~ 894 MHz.
- GSM900 FILTER (L106,C122,C123,C124)→For filtering the frequency band between 925 ~ 960 MHz.
- DCS FILTER (L108,L109,C129,C130)→For filtering the frequency band 1805 and 1880 MHz.
- PCS FILTER (L110,L111,C131,C132)→For filtering the frequency band 1930 and 1990 MHz.
LL
H
- VC-TCXO (U102)
To generate the 26MHz reference clock to drive the logic and RF.
After additional process, the reference clock applies to the U100 Rx IQ demodulator and Tx IQ modulator. The oscillator for RX IQ demodulator and Tx modulator are controlled by serial data to select channel and use fast lock mode for GPRS high class operation.
- TRANSCEIVER (U100) This chip fully integrated GSM GPRS quad-band transceiver with transmit baluns, loop filters and most of the passive component in it. And also fully integrated fractional N RF synthesizer with AFC control possibility, RF VCO with integrated supply regulator. semi integrated reference oscillator with integrated supply regulator. RF Receiver front-end amplifies the GSM850, E-GSM900, DCS1800 and PCS1900 aerial signal, convert the chosen channel down to a low IF of 100kHz. In IF section, further amplifies the wanted channel output level to the desired value and rejects DC.
2-1-2. TX PART
The transmitter is fully differential using a direct up conversion architecture. It consists of a signal side band power up mixer. Gain is controlled by 6 dB via 3-wire serial bus programing. The fully integrated VCO and power mixer achieve LO suppression, quadrature phase error, quadrature amplitude balance and low noise floor specification. Output matching/balun components drive a standard 50 ohms single ended load.
2-1
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Circuit Description
2-2. Baseband Circuit description of SGH-D600
2-2-1. PCF50603 (U400)
- Power Management Eight low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal system performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0V SIMs, while a self-resetting, electronically fused switch supplies power to external accessories. Ancillary support functions, such as RTC module and High Voltage Charge pump, Clock generator, aid in reducing both board area and system complexity. I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor full control of the PCF50603 and enables system designers to maximize both standby and talk times. Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable system design. These functions work together to ensure proper system behavior during start-up or in the event of a fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).
- Clock Generator
The Clock Generator (CG) generates all clocks for internal and external usage. The 32.768 kHz crystal oscillator provides an accurate low clock frequency for the PCF50603 and other circuitry.
2-2-2. LCD
LCD is consisted of main LCD(color 262K TFT LCD). Chip select signals in the U301, LCD_MAIN_CS, can enable LCD. BACKLIGHT signal enables white LED of main LCD. 16-bit data lines(LD(0)~LD(15)) transfers data and commands to LCD. Data and commands use "RS" signal. If this signal is high, Inputs to LCD are commands. If it is low, Inputs to LCD are data. The signal which informs the input or output state to LCD, is required. But this system is not necessary this signal. So "L_WRB" signal is used to write data or commands to LCD. Power signals for LCD are "VDD_IO_HIGH".
2-2-3. Key
This is consisted of key interface pins KEY_ROW(0:4) and KEY_COL(0:4) in PCF5212EL1. These signals compose the matrix. Result of matrix informs the key status to key interface in the PCF5212EL1. Power on/off key is seperated from the matrix. So power on/off signal is connected with PCF50603 to enable PCF50603. Key LED is consisted of six white LEDsforsubkeyandtwelvewhiteLEDsformainkey. White LED for sub key use the VBAT voltage.
"SLIDER_KEY_ON" signal enables Transistor for sub key backlight. Main key LED use the 3.3V LDO for a supply voltage. KEY_LED_ON signal enables eight white LED. "FLIP" informs the status of slide (open or closed) to the PCF5213EL1. This uses the hall effect IC, EM-1681 A magnet under LCD enables EM-1681.
2-2
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Circuit Description
2-2-4. EMI ESD Filter
This system uses the EMI ESD filter, U500 to protect noise from IF CONNECTOR part.
2-2-5. IF connetor
It is 18-pin connector. They are designed to use VBAT, V_EXT_CHARGE, USB_D+, +VBUS, USB_D-, TXD1, RXD1, AUX_ON, EXT1, EXT2, HFK_SPK, HFK_MIC and GND. They connected to power supply IC, microprocessor and signal processor IC.
2-2-6. Battery Charge Management
A complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries. If TA connected to phone, "V_EXT_CHARGE" enable charger IC and supply current to battery. When fault condition caused, "CHG_ON" signal level change low to high and charger IC stop charging process.
2-2-7. Audio
HFR_P and HFR_N from PCF5212El1 are connected to the main speaker via analog switches. MIC_P and MIC_N are connected to the main MIC as well. EAR1 is the source of External Speaker. AK4642 is 16-bit stereo audio CODEC with a built-in microphone - Amplifier and Headphone - Amplifier. I2S signals from CL8522S5 are decoded with audio analog signals. SAPA1D2-24ELP amplify these signals and deliver to stereo speakers.
2-2-8. Memory
This system uses Samsung's memory, KBH10PD00M-D414. The KBH10PD00M is a Multi Chip Package Memory which combines 256Mbit Synchronous Burst Multi Bank NOR Flash Memory and two 1Gbit OneNAND Flash and 256Mbit Synchronous Burst UtRAM. It has 16 bit data line, HD[1~16] which is connected to PCF5212 and CL8522S5, also has 24 bit address lines, HA[1~24]. There are 3 chip select signals, CS0n_FLASH, CS4n_NAND, and CS1n_RAM. In the Wrting process, WEn is fallen to low and it enables writing process to operate. During reading process, OEn is fallen to low and it enables reading process to operate. Each chip select signals in the PCF5212 choose
different memories.
2-3
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Circuit Description
2-2-9. PCF5212EL1
The PCF5212EL1 is mainly composed of embeded DSP and ARM core. The DSP subsystem includes the Saturn DSP core with embedded RAM and ROM, and a set of peripherals. It has 24kx16 bits PRAM, 104k*16 bits, 32k*16 XYRAM and 63k*16 XYROM in the DSP. The ARM946E-S consists of an ARM9E-S processor core, 8 kbyte instruction cache and 8 kbyte data cache, tghtly-coupled ITCM(Instruction Tightly Coupled Memory) and DTCM(Data Tightly Coupled Memory) memories, a memory protection unit, and an AMBA(Advanced Microcontroller Bus Architecture) AHB(Advanced High-performance Bus) bus interface with a write buffer. HD(0:15), data lines and HA(0:23), address lines are connected to KBJ10KB00M (memory), MV319DNQ (image dsp) and YMU765 (melody IC). It has 64 kbyte SC RAM (0.5 Mbit) and 32 kbyte SC program ROM for bootstrap loader in the ARM core. HD(0:15), data lines and HA(0:23), address lines are connected to memory and YMU765 to communicate. MV319DNQ(Camera DSP Chip) controls the communication between ARM core and DSP core. OEn, WEn control the access of memory. KROW, and KCOL recognize the key string input status. It has J-TAG control pins (TDI/TDO/TCK) for ARM and DSP core. J-SEL signal controls different access to ARM and DSP core. ADC(Analog to Digital Convertor) receives the condition of temperature, battery type and battery voltage.
2-2-10. TCO-5888T (26MHz)
This system uses the 26MHz TCXO, TCO-5871U, Toyocom. AFC control signal form PCF5212 controls frequency from 26MHz x-tal. It generates the clock frequency. This clock is connected to PCF5212, YMU765 and
UAA3587.
2-2-11. Multimedia Chip (CL8522S5)
CL8522S5 is the hardware based MPEG4 CODEC is available to capture the video signal of up to CIF Resolution (352X288, at 30FPS). CL8522S5 directly transmits and previews the RGB Data to the LCD graphic memory by processing the sensor output data. It can save the raw RGB data up to 1600x1200 into its image buffer and allows the host processor to download with scalable sized compressed data.
2-4
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3. Exploded View and Parts List

3-1. Exploded View
QFR01
QMW01
QFU01
QKP02
QAU01
QMO01
QLC01
QCR32
QME02
QCR32
QKP01
QCR12
QCA02
QME01
QVK01
QMP01
QCA01
QSP02 QSP01
QAN06
QAN05
QAN02
QFL01
QCR26
QSC11
QHI01
QPC01
QVO01
QRF01
3-1
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QCK01
QRE01
QIF01
QCR31
QBA01
Exploded view and Part List
3-2. Parts List
Location No Description Sec Code
QAN05 QAN06 QAU01 QBA01 QCA01 QCA02 QCK01 QCR12 QCR26 QCR31
QFR01
QFU01
QIF01 QKP01 QKP02
QLC01 QME01 QME02
QMO01
QMP01
QMW01
QPC01 QRE01
QRF01 QSC11 QVK01 QVO01 QSP02
ㅤ ㅤ
QFL01
ㅤ ㅤ
ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ ㅤ
QSP01 SPEAKER;0.7W,8.0ohm,87dB±2dB,700Hz, 3001-001788
QAN02 INTENNA-SGHD600;EWPADG006A,SGH-D600, GH42-00596A
QCR32 SCREW-MACHINE;CH,+,M1.4,L2,ZPC(BLK), 6001-001700
QHI01 MEC-HINGE MODULE;SGH-D600,EU,-,-,-,- GH75-07211A
MEC-INTENNA CONN RUBBER;SGH-D600,EU, GH75-08200A MEC-INTENNA CONN RUB SM;SGH-D600,EU, GH75-08201A AUDIO-RECEIVER;32ohm,109dB±2dB,11X6 3009-001125 BATTERY-900MAH,BLK,ENG,M;BST4389BE,S GH43-01939A UNIT-CAMERA;SGH-D600,IC04001AA,-,EU, GH59-02171A UNIT-CAMERA KEY;SGH-D600,H/K F.P.C A GH59-02208A PMO-CAMERA KEY;SGH-D600,PC(K2261),BL GH72-22444A SCREW-MACHINE;PH,+,M1.4,L2.5,ZPC(BLK 6001-001530 SCREW-MACHINE;CH,+,M1.7,L3,ZPC(BLK), 6001-001850 SCREW-MACHINE;CH,+,M1.7,L3,ZPC(BLK), 6001-001795 MEC-FRONT COVER;SGH-D600,EU,-,-,-,-, GH75-07212A MEC-SLIDE UPPER;SGH-D600,EU,-,-,-,-, GH75-07334A PMO-IF COVER;SGH-D600,PC+UREATHANE,B GH72-22629A MEC-KEYPAD MAIN;SGH-D600,EU,-,-,-,-, GH75-07207A MEC-KEYPAD SUB;SGH-D600,EU,-,-,-,-,C GH75-07206A LCD-LCD MODULE;LTS200QV-F03-0,SGH-D6 GH07-00734A UNIT-METAL DOME;SGH-D600,-,-,EU,12V, GH59-02206A UNIT-KEY PAD;SGH-D600,HUW9555-010010 GH59-02094A MOTOR DC-SGHZ130;DMJBRV83CG,SGH-Z130 GH31-00153B PBA MAIN-SGHD600;SGH-D600,EU,EU,PBA GH92-02191A PCT-WINDOW MAIN;SGH-D600,ACRYL,TRP,- GH72-22505A PCB-FPCB;SGH-D600,POLYIMIDE,3L,-,0.0 GH41-00892A MEC-REAR COVER;SGH-D600,EU,-,-,-,-,C GH75-07208A MPR-R/F CAP;SGH-D600,PC SHEET,P5.4XT GH74-15303A RMO-LOWER SCREW CAP;SGH-D600,CR RUBB GH73-05136A UNIT-VOLUME KEY;SGH-D600,SGH-D600 V/ GH59-02207A PMO-VOLUME KEY;SGH-D600,PC(K2261),BL GH72-22445A UNIT-SPEAKER MODULE;SGH-D600,SS-SGH- GH59-02364A
MEC-SLIDE LOWER;SGH-D600,EU,-,-,-,-, GH75-07210A
3-2
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Exploded view and Part List
Description Sec Code
BAG PE;LDPE,T0.05,W80,L180,TRP,-,- 6902-000634 CBF INTERFACE-AV CABLE;SGH-D600,10 p GH39-00410A CBF INTERFACE-DATA LINK CABLE;SGH-D6 GH39-00423A ADAPTOR-SGHD500 BLK;TAD137EBE,SGH-D5 GH44-00954A S/W CD-SAMSUNG PC STUDIO;SGH-D600,SG GH46-00167A UNIT-EAR PHONE(BLK);SGH-D600,AEP421S GH59-02335A LABEL(P)-WATER SOAK;COMM,NORGE,100G, GH68-02026A MANUAL-WEEE CARD;COMM,SEC,ENGLISH,UN GH68-07013A LABEL(R)-MAIN(EU);SGH-D600,EU,POLYES GH68-07243A MANUAL-USER;SGH-D600,XEF,FRENCH,FRAN GH68-07562A BOX(P)-SLIPCASE(EU);SGH-D600,SC300+S GH69-03033A CUSHION-CASE(1-2);SGH-D600,PULP,T0.8 GH69-03036A BOX(P)-UNIT(EU);SGH-D600,SC300g+S120 GH69-03175A ICT-BATT LOCKER SPRING;SGH-D600,STS3 GH70-00611A PMO-BATTERY LOCKER;SGH-D600,PC(K2261 GH72-22498A MPR-TAPE BOHO MAIN WIN A;SCH-X850,3M GH74-06456A MPR-BOHO VINYL IF;SCH-X699,3M 4187C, GH74-11062A MPR-BOHO VINYL S/U (R);SGH-D500,STA GH74-13284A MPR-MAIN CON INSULATION;SGH-D600,SP6 GH74-15311A MPR-MAIN PBA DOWN L IN;SGH-D600,SP65 GH74-15312A MPR-MAIN PBA DOWN R IN;SGH-D600,SP65 GH74-15313A MPR-MAIN PBA UP L IN;SGH-D600,SP65,8 GH74-15314A MPR-MAIN PBA UP R IN;SGH-D600,SP65,9 GH74-15315A MPR-TAPE B TO B CON IN;SGH-D600,SP65 GH74-15317A MPR-TAPE B TO B CON EMI;SGH-D600,DTF GH74-15318A MPR-SUB CON INSLATION;SGH-D600,SP65, GH74-15319A MPR-TAPE SUB CON EMI;SGH-D600,DTF-10 GH74-15320A MPR-TAPE BASE BTB LA;SGH-D600,TAST49 GH74-16479A MPR-BOHO VINYL MAIN WIN;SGH-D600,ST5 GH74-16880A MPR-BOHO VINYL R/W LENS;SGH-D600,ST5 GH74-16881A MPR-B TO B CON SIDE EMI;SGH-D600,DTF GH74-16883A MPR-TAPE IF HOLDER;SCH-V740,FABRIC T GH74-17165A MPR-TAPE BASE BTB;SGH-D600,TASA 4962 GH74-18234A AS-INTENNA FRONT GASKET;SGH-D600,-,G GH81-02279A AS-INTENNA REAR GASKET;SGH-D600,-,GA GH81-02280A
3-3
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Exploded view and Part List
3-3. Test Jig (GH80-01909A)
3-3-2. Test Cable
(GH39-00337C)
3-3-3. Serial Cable
3-3-1. RF Test Cable
(GH39-00283A)
3-3-4. Power Supply Cable
3-3-5. DATA CABLE
(GH39-00423A]
3-3-6. TA
3-3-7. TV-OUT Cable
(GH44-00954A)
3-4
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(GH39-00410A)

4. Electrical Parts List

Design LOC Description SEC CODE
ANT101,ANT102,ANT302 NPR-CONTACT ANT GH71-04813A
BAT400 BATTERY 4302-001177 BTC500 CONNECTOR-HEADER 3711-005880
C101,C106,C110,C113 C-CERAMIC,CHIP 2203-000628
C102,C105 C-CERAMIC,CHIP 2203-005057
C103,C107,C111,C114 C-CERAMIC,CHIP 2203-000254
C104,C108 C-TA,CHIP 2404-001374
C109 C-CERAMIC,CHIP 2203-002968 C112,C121,C128,C605 C-CERAMIC,CHIP 2203-000278 C115,C125,C410,L115 C-CERAMIC,CHIP 2203-000233
C116,C146 C-CERAMIC,CHIP 2203-000654 C117,C203,C205,C206 C-CERAMIC,CHIP 2203-005482 C118,C119,C136,C143 C-CERAMIC,CHIP 2203-000812
C120,C126 C-CERAMIC,CHIP 2203-002687 C122,C124,C133,C135 C-CERAMIC,CHIP 2203-001259 C127,C201,C202,C307 C-CERAMIC,CHIP 2203-000254
C131,C137 C-CERAMIC,CHIP 2203-005288
C132,C141 C-CERAMIC,CHIP 2203-002668
C142 INDUCTOR-SMD 2703-002176 C144 C-CERAMIC,CHIP 2203-006260
C145 C-TA,CHIP 2404-001348 C204,C215,C217,C219 C-CERAMIC,CHIP 2203-000812 C207,C208,C209,C210 C-CERAMIC,CHIP 2203-005482 C211,C301,C303,C308 C-CERAMIC,CHIP 2203-006399 C212,C213,C214,C216 C-CERAMIC,CHIP 2203-005482 C218,C305,C306,C309 C-CERAMIC,CHIP 2203-005482 C222,C223,C412,C715 C-CERAMIC,CHIP 2203-000812 C302,C304,C324,C404 C-CERAMIC,CHIP 2203-006562 C310,C311,C312,C318 C-CERAMIC,CHIP 2203-005482
C313,C314 C-CERAMIC,CHIP 2203-000330 C315,C607 C-CERAMIC,CHIP 2203-005050
C316,C322,C403,C819 C-CERAMIC,CHIP 2203-006324
C320 C-TA,CHIP 2404-001225 C323,C501,C610,C803 C-CERAMIC,CHIP 2203-006399
C401 C-CERAMIC,CHIP 2203-000359 C402,C413,C415,C418 C-CERAMIC,CHIP 2203-006208 C405,C507,C612,C718 C-CERAMIC,CHIP 2203-006562 C406,C419,C503,C505 C-CERAMIC,CHIP 2203-005482
C407,C409 C-CERAMIC,CHIP 2203-000386
C408,C414,C416,C417 C-CERAMIC,CHIP 2203-006257
C411 C-TA,CHIP 2404-001394
C422 C-CERAMIC,CHIP 2203-000585
C423,C426,C805 C-CERAMIC,CHIP 2203-006208
C424,C425 C-CERAMIC,CHIP 2203-006257
C502 C-CERAMIC,CHIP 2203-005503
C504 C-CERAMIC,CHIP 2203-000854
C506 C-TA,CHIP 2404-001268 C508,C701,C702,C703 C-CERAMIC,CHIP 2203-000679
C601 C-TA,CHIP 2404-001392 C602,C604,C617,C706 C-CERAMIC,CHIP 2203-005482
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4-1
Electrical Parts List
Design LOC Description SEC CODE
C606,C611,C811,C812 C-CERAMIC,CHIP 2203-000995
C609 C-CERAMIC,CHIP 2203-002443
C613,C614 C-CERAMIC,CHIP 2203-000438
C615 C-CERAMIC,CHIP 2203-001405
C616,C829,C830 C-TA,CHIP 2404-001405
C704,C705,C712,C713 C-CERAMIC,CHIP 2203-000679
C707 C-TA,CHIP 2404-001339
C708 C-CERAMIC,CHIP 2203-006190 C710,C720,C801,C802 C-CERAMIC,CHIP 2203-005482
C716,C717 C-CERAMIC,CHIP 2203-006438
C719,C834,C835 C-CERAMIC,CHIP 2203-006562
C721 C-CERAMIC,CHIP 2203-000812
C733 C-CERAMIC,CHIP 2203-000679 C804,C806,C807,C818 C-CERAMIC,CHIP 2203-005482 C810,C813,C814,C817 C-CERAMIC,CHIP 2203-006399
C815,C816 C-CERAMIC,CHIP 2203-000995
C820,C821,C822,C824 C-CERAMIC,CHIP 2203-005482
C823 C-CERAMIC,CHIP 2203-000885
C826 C-CERAMIC,CHIP 2203-006399
C827,C828 C-CERAMIC,CHIP 2203-005482
CN100 CONNECTOR-COAXIAL 3705-001358 CN500 CONNECTOR-CARD EDGE 3709-001393 CN600 JACK-PHONE 3722-002356 CN700 CONNECTOR-FPC/FFC/PIC 3708-002156 CN701 CONNECTOR-HEADER 3711-005643
F100 FILTER 2911-000014
F300 FILTER-DUPLEXER 2909-001279
F500 FILTER-EMI SMD 2901-001315 F701,F702,F703,F704 FILTER-EMI SMD 2901-001286
F705 FILTER-EMI SMD 2901-001286
IFC500 CONNECTOR-SOCKET 3710-001994
L103 INDUCTOR-SMD 2703-002313
L104,L105,L107 INDUCTOR-SMD 2703-002320
L106,L113 INDUCTOR-SMD 2703-002596
L108,L109,L110,L111 INDUCTOR-SMD 2703-002365
L112 INDUCTOR-SMD 2703-001751
L301 INDUCTOR-SMD 2703-002208
L401 CORE-FERRITE BEAD 3301-001120
L402 INDUCTOR-SMD 2703-002774
L601,L602 CORE-FERRITE BEAD 3301-001438
L603 CORE-FERRITE BEAD 3301-001534
L701,L801,L814 CORE-FERRITE BEAD 3301-001729 L803,L804,L806,L807 INDUCTOR-SMD 2703-002201 L809,L810,L812,L813 INDUCTOR-SMD 2703-002201
LED601,LED602,LED603 LED 0601-002055 LED604,LED605,LED606 LED 0601-002055
MIC600 MIC-CONDENSOR 3003-001107 OSC300 CRYSTAL-UNIT 2801-004340 OSC400 CRYSTAL-UNIT 2801-004339
Q401,U201,U202,U203 TR-DIGITAL 0504-001151
4-2
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