Samsung SGH-B7610 Demontage et remontage

Disassembly and Assembly Instructions
11.
11-1.
Disassembly
1
Caution
Be care of scratch and molding damage.
1)
Unscrew the5points.
1) Separate the REAR from the FRONT ass'y
2)
using disassembly stick.
2
Be care of scratch and molding damage.
1)
Be care of damage to slide F-CPB.
2)
Unscrew the2points.
1) Separate Slide ass'y connector and T-flash
2)
connector
Separate PBA from the Front Case
3)
Caution
3
1)
Caution
Seprete the KEYPAD from the slide ass'y.
11-1
4
Caution
1)
Unscrew the8points.
1)
Separate the FRONT case from the slide
2)
ass'y.
Be care of scratch and molding damage.
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Disassembly and Assembly Instructions
5
Unscrew the5points.
1)
Separate the LOWER case from the
2)
UPPER case.
6
Disassemble the all F-PCB from the sub
2) PCB.
Remove the Tape.
1)
Caution
Be care of scratch and
1)
Be care of damage to slide F-CPB.
2)
7 8
Disassemble the Receiver FPCB, CIF FPCB
1)
and Detach Slide FPCB from LCD module
Separate the LCD module and TSP from
2) the Upper Case.
molding damage.
Caution
Be care of
1)
Be care of damage to the slide F-CPB.
2) Be care of damage to the connector.
3)
1)
2)
s
cratch and molding damage.
Unscrew the1point.
Detatch the SPK FPCB from the PBA by
soldering designated point(Blue line)
Caution
1
Be care of damage to all FPCB
)
2)
Be care of scratch to main WINDOW.
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
11-2
Caution
Disassembly and Assembly Instructions
9
Unscrew the2points.
1)
Separate the Shield Can from the PBA
2)
10
Separate the camera module from the
1)
PBA.
11
Caution
1)
Detatch the Mic FPCB from the PBA by
soldering designated point
Caution
Caution
1) Be care of damage to FPCB
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
11-3
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