Samsung SCALA2-14DI Schematic
SAMSUNG PROPRIETARY
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DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D
4
SCALA2-14/15DI
CPU :
Chip Set :
C
Remarks :
Model Name :
PBA Name :
PCB Code :
ZACATE
HUDSON-M1
Internal GFX
AMD Brazos Platform
SCALA2-DI
MAIN
BA41-01649A (GCE)
BA41-01648A (NY)
BA41-01650A (HAN)
3
(AMD-INT)
sheet01 :
sheet02 :
sheet03 :
sheet04 :
sheet05 :
sheet06 :
sheet07 :
sheet08 :
sheet09 :
sheet10 :
sheet11 :
sheet12 :
sheet13 :
sheet14 :
sheet15 :
sheet16 :
sheet17 :
sheet18 :
sheet19 :
sheet20 :
sheet21 :
sheet22 :
sheet23 :
sheet24 :
sheet25 :
sheet26 :
sheet27 :
sheet28 :
sheet29 :
2
Cover
BLOCK DIAGRAM
BOARD INFORMATION
POWER DIAGRAM
POWER RAILS
POWER SEQUENCE
CLOCK DISTRIBUTION
Thermal Sensor
APU
APU
APU
DDR3 SODIMM #0
DDR3 SODIMM #1
FCH
FCH
sheet31 :
sheet32 :
sheet33 :
sheet34 :
sheet35 :
sheet36 :
sheet37 :
sheet38 :
sheet39 :
sheet40 :
sheet41 :
sheet42 :
sheet43 :
sheet44 :
sheet45 :
FCH
FCH
FCH strap
80 port and BIOS ROM
LVDS / CAMERA
CRT
HDMI
MICOM
MICOM Glue Logic (KBD / TP)
15" Touch pad
14" LED cuicirt
Audio - ALC269
Audio - HP/MIC
LAN (Realtek 8111E)
WLANsheet30 :
1
14"SATA interface
15"SATA interface
3-in-1 Card (AU6437)
Power S/W SUB B’D Connector
USB connector
Power - charger
Power - P3.3V_AUX / P5.0V_AUX
Power - P1.05V (Chipset Power)
Power - DDR3
Chipset Power
Power - CPU VRM
Power - P1.8V
Power - Switched Power 1
Power - Power Discharge
MOUNT HOLE and EMI cap
D
C
B
Dev. Step :
Revision :
T.R. Date :
Design
Tang cuili
A
Owner :
4
CHECK
SEC IT Solution N/P LAB
MP
1.0
2011.04.25
APPROVAL
Sun xiao
BC LEE
Signature :
3
wanni
B
A
DRAW
CHECK
APPROVAL
MODULE CODE
2
Tang cuili
Sun xiao
BC LEE
DATE
DEV. STEP
REV
LAST EDIT
8/19/2010
rev. 1.0
TITLE
MP
SCALA2-DI
MAIN
COVER
April 12, 2011 15:43:18 PM
1
SAMSUNG
ELECTRONICS
PART NO.
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DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
D
P5V_AUX
P3.3V_AUX
PG 37
P1.05V
P1.1V _AUX
PG 40
SWITCHED
POWER
PG 38
PG 43
P1.8V
PG 42
PG 22
PG 20
PG 21
CPU
Thermal
HDMI
LCD
CRT
FAN
PG 8 PG 8
30P
3
BLOCK DIAGRAM
HDMI
Mobile Processor
AMD Brazos CPU
LCD
(BGA, Ontario)
CRT
PG 9-11
UMI x4
2
Channel A (STANDARD)
Single channel
DDR IIl
DDR IIl
CPU
VRM
PG 41
Charger &
POWER
Management
PG 36
DDR IIl
PG 12
SODIMM 0
DDR IIl
PG 13
SODIMM 1
1
D
Power
Discharge
PG 44
DDR IIl Power
PG 39
3 in 1
PG 41
PG 24
BC LEE
DATE
DEV. STEP
REV
LAST EDIT
52P
PG 30
AU6437
8/19/2010
rev. 1.0
TITLE
MP
Mini Card 1 (WLAN)
HSDPA
Realtek RTL8111E
PG 29
SD(SDHC)
MMC
SCALA2-DI
MAIN
BLOCK DIAGRAM
April 12, 2011 15:43:18 PM
C
HDD
SATA
PG 31
For 14"
SATA ODD
PG 31
SATA ODD
For 15"
HDAUDIO
B
High Definition Audio
Audio
PG 20
Camera
SATA 0
SATA 1
12P
PG 32
HD Primary
ALC269Q
PG 27
INT MIC
HP
PG 28
2P
2P
PG 27
MIC-IN
SPKR R
A
SPKR L
4
USB 8
Lane 0
USB 2
USB 7
PCIE x1
PCIE x1Lane 1
12P
PG 34
FCH
USB 3
USB 0,6
SPI ROM
SPI
MICOM
MEC1300
2
PCIE x1Lane 2
USB 2.0
DRAW
CHECK
APPROVAL
MODULE CODE
Touch
PAD
KBD
Tang cuili
Sun xiao
undefined
Hudson-M1
PG 14-18
3.3V LPC, 33MHz
LPC
3.3V LPC, 33MHz
80 Port
3
PG 19
PG 23
ANT
PG 33
PG 33
SAMSUNG
PART NO.
PAGE
1
D:/users/ecad58/Scala2-DI/Scala2-AMD_Int
RJ45
PG 29
ELECTRONICS
BA41-0XXXXXA
2 45
OF
C
B
A
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PROPRIETARY INFORMATION THAT IS
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DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
3
2
1
BOARD INFORMATION
SCHEMATIC ANNOTATIONS AND BOARD INFORMATION
D
Voltage Rails
VDC
P12.0V_ALW
P3.3V_MICOM
P5.0V_ALW
P5.0V_STB
P5.0V_AUX
P3.3V_AUX
P1.5V_AUX
P5.0V
P3.3V
C
B
P1.8V
P1.5V
P1.05V
P0.75V
VCC_CORE
IGFX_CORE
EGFX_CORE
P1.05V (VCCP)
PORT #
0
1
2
3
4
5
6
7
8
9
10
11
12
13
Primary DC system power supply (7 to 21V)
12.0V always power rail
3.3V always power rail (for Micom)
5.0V always power rail
5.0V always power rail
5.0V switched on power rail (off in S4-S5)
3.3V switched on power rail (off in S4-S5)
1.5V power rail for DDR (off in S4-S5)
5.0V switched power rail (off in S3-S5)
3.3V switched power rail (off in S3-S5)
1.8V switched power rail (off in S3-S5)
1.05V power rail for chipset (off in S3-S5)
0.9V power rail for DDR (off in S3-S5)
Core Voltage for CPU
Core Voltage for IGFX
Core Voltage for GPU
VCC for Arrandale & IBEX Peak
USB PORT Assign
ASSIGNED TO
SYSTEM PORT 0
SYSTEM PORT 1
Mini PCI Express
Multi Memory Card Controller
NC
NC
(N/A WITH HM55)
NC
(N/A WITH HM55)
NC
NC
SYSTEM PORT 2 (SUB BOARD)
Bluetooth
Camera
NC
NC
PCI Express Assign
ASSIGNED TO
PORT #
Mini Card 1 (WLAN)
1
2
NC 0011 010x
NC
3
4
LAN CONTROLLER
NC
5
NC
6
7
8
(N/A WITH HM55)
NC
NC
(N/A WITH HM55)
Active in
S4 - S5
S3
S0
S0
Crystal / Oscillator
TYPE
Crystal
Crystal
Crystal
FREQUENCY
32.768KHz
14.318MHz
25MHz
DEVICE
IBEX-PEAK
CLOCK-Generator
LAN
USAGE
Real Time Clock
CK-505
Intel LAN
LCD Pannel Detect
Devices1.5V switched power rail (off in S3-S5) PANNEL_DETECT_0
LTN140AT17
2
I C / SMB Address
Devices
IBEX PEAK
CPU Thermal Sensor
SODIMM0
SODIMM1
Thermal Sensor on SODIMM0
Thermal Sensor on SODIMM1
CK-505M Shrink(Clock Generator)
Thermal Sensor on board
Power thermal management TS
Resolution
HD(1366x768)
Address
Master
0111 101x
1010 000x
1010 010x
0011 000x
1101 001x
1101 100x
1101 011x
Hex
7Ah
A0h
A4h
30h
34h
D2h
98h
96h
SEC3250
Bus
SMBUS Master
Thermal Sensor
-
-
-
Clock, Unused Clock Output Disable
D
C
B
SATA PORT Assign
ASSIGNED TO
PORT #
0
HDD
ODD
1
2
(N/A WITH HM55)
3
(N/A WITH HM55)
4
5
A
DRAW
CHECK
APPROVAL
MODULE CODE
4
3
2
Tang cuili
Sun xiao
BC LEE
undefined
DATE
DEV. STEP
REV
LAST EDIT
8/19/2010
rev. 1.0
TITLE
SCALA2-DI
MP
MAIN
BOARD INFO
April 12, 2011 15:43:18 PM
1
SAMSUNG
ELECTRONICS
PART NO.
BA41-0XXXXXA
3 45
PAGE
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A
OF
SAMSUNG PROPRIETARY
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THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
2
POWER DIAGRAM
13
D D
AC Adapter
Battery DC
VDC
KBC3_SUSPWR
KBC3_PWRON
P1.05V
IGFX_CORE
EGFX_CORE
ARD
IBEX PEAK
INT GFX
EXT GFX
Nvidia N11P
KBC3_VRON
VCC_CORE
P1.05V_D
ARD
NVIDIA OPTIMUS
C
P1.5V_AUX
DDR3 MEMORY
PCH
P1.5V
P0.75V
USB CONN
P5.0V_ALW
When USB Charge Enable
B
P3.3V_MICOM
SPI ROM
MICOM
P5.0V_AUX
P3.3V_AUX
P1.8V_LAN
PCH
LAN
LAN
P5.0V
P3.3V
gDDR-3 for EGFX
DDR3 MEMORY
HDD
CRT
FAN
PEG
IBEX PEAK
MICOM
HD AUDIO
P1.5V_D
MICOM
HDMI
THERMAL SENSOR
MINI PCIE
MMC
P3.3V_D
NVIDIA OPTIMUS
LCD
BT
DDR3
LEDs
NVIDIA OPTIMUS
C
B
Power On/Off Table by S-state
State
A
+V* (CORE)
Rail
+V*A(LWS)
+V*LAN
+V*AUX
+V
P5.0V_STB
P1.8V
IBEX PEAK
Nvidia n11P
P12.0V_ALW
S0
ON
ON
ON
ON
S5
S3
S4
ON
ON
ON
ON
4
S5-S4
S3
S0
A
DRAW
CHECK
APPROVAL
MODULE CODE
3
2
Tang cuili
Sun xiao
BC LEE
undefined
DEV. STEP
REV
LAST EDIT
5/10/2010
rev. 1.0
TITLEDATE
SCALA2-DI
MP
MAIN
POWER DIAGRAM
April 12, 2011 15:43:18 PM
1
SAMSUNG
ELECTRONICS
PART NO.
BA41-0XXXXXA
4 45
PAGE
D:/users/ecad58/Scala2-DI/Scala2-AMD_Int
OF
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PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
3
2
1
POWER RAILS ANALYSIS
D D
220V
Adapter Battery
MICOM 3V ( TBD A )
1.8V ( TBD A )
5.0V_AUX ( TBD A )
3.3V_AUX ( TBD A )
IGFX CORE ( TBD A )
CPU CORE ( TBD A )
1.05V ( TBD A )
1.5V ( TBD A )
3.3V ( TBD A )
5.0V ( TBD A )
1.5V_AUX ( TBD A )
0.75V( TBD A )
C C
RTC_Battery
VGA CORE (TBD A)
B B
P3.3V_AUX
P1.8V_LAN
P1.0V_LAN
0.08 A (TBD)
0.29 A (TBD)
0.15 A (TBD)
LAN (88E8059)
1.8V
IGFX CORE
CPU CORE
1.05V (VCCP)
1.5V
1.05V
1.8V
3.3V_AUX
3.3V
1.5V_AUX
5V_AUX
5.0V
EGFX CORE
1.05V_D
3.3V_D (PEX IO)
1.5V_D
1.5V_AUX
0.75V
1.5V_D
3.3V (LCD 3V)
1.3 A (TBD)
22 A (TBD)
48 A (TBD)
20.6 A (TBD)
3.2 A (TBD)
6.09 A (TBD)
0.227 A (TBD)
0.08 A (TBD)
0.412 A (TBD)
0.008 A (TBD)
0.001 A (TBD)
0.001 A (TBD)
25.73 A (TBD)
3.82 A (TBD)
1.38 A (TBD)
6.49 A (TBD)
Total max
2.8 A (TBD)
1.16 A (TBD)
0.67 A (TBD)
ARD BGA
( 35 W )
IBEX PEAK
PCH
(3.9 W )
N11P-LP
DDR-3
(Dual slots)
( ~ 5.0 W )
gDDR3 (x4)
LCD
3.3V_AUX
3.3V
3.3V
3.3V
5V
5V
5V
5V
5V
5V
0.75 A (TBD)
0.25 A (TBD)
0.015 A (TBD)
0.06 A (TBD)
0.07 A (TBD)
1.5 A (TBD)
0.22 A (TBD)
0.16 A (TBD)
2 A (TBD)
0.2 A (TBD)
Thermal
Sensor
CLOCK
SPI
HD Audio
ODD
SATA
SATA HDD
FAN
USB (x 3)
Touch Pad
MICOM 3V
3.3V
MICOM 3V
3.3V
3.3V
0.08 A (TBD)
0.08 A (TBD)
0.1 A (TBD)
0.1 A (TBD)
1.5 A (TBD)
KBC
PWR LED
SD Card
Mini Card
A A
DRAW
CHECK
APPROVAL
MODULE CODE
4
3
2
Tang cuili
Sun xiao
BC LEE
undefined
DATE
DEV. STEP
REV
LAST EDIT
5/10/2010
rev. 1.0
TITLE
SCALA2-DI
MP
MAIN
POWER RAILS
April 12, 2011 15:43:18 PM
1
SAMSUNG
ELECTRONICS
PART NO.
BA41-0XXXXXA
PAGE OF
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455
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PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
2) VDC
ISL6255
3-1) ADT3_SEL#
2
POWER SEQUENCE
4) POWER_SW#
13
Rev. 1.0
CHARGER
D D
CK505 SHRINK
5) KBC3_SUSPWR
3) P3.3V_MICOM
5) KBC3_SUSPWR
TPS51125
3) P3.3V_MICOM
6) P5.0V_ALW
6) P5.0V_AUX
6) P3.3V_AUX
19-1) VRM3_CLKPWRGD#_INV
INVERT LOGIC
C
ISL62882
CPU_CORE
19) VRM3_CPU_PWRGD
18) KBC3_VRON
KBC
(MEC1300-NU)
(START 110ms DELAY
FROM P3.3V ON)
12) KBC3_PWRON
RT8207
MEM POWER
12) KBC3_PWRON
SWITCHED POWER
APL5930 P1.8V
1) RTC
RT8207 P0.75V
19) KBC3_PWRGD
SYS_PWROK
PCH_PWROK
MPWROK
B
19-1) ROMSHIP
23) BIOS ACCESS
ME
9) CHP3_SLPS5#
11) CHP3_SLPS3#
10) CHP3_SLPS4#
PCH
DRAMPWROKSM_DRAMPWROK
7) KBC3_RSMRST#
8) KBC3_PWRBTN#
CPU_PWRGD
PLT_RST#
GPIO17
12-1) CHP3_PEG_PWREN#
GPIO36
17) VTT3_PWRGD
12-2) EGFX_CORE_PWREN
TPS51117
CHIPSET POWER
ISL958708 EGFX_CORE
3-2) MICOM CODE ACCESS
20) CHP1_DRAM_PWRGD
21) CHP1_CPU_PWRGD
22) PLT3_RST#
3.3V TO 1.1V
VOLTEGE DIVIDER
16) VTT3_PWRGD
3.3V TO 1.1V
VOLTEGE DIVIDER
15) GFX_VR_EN
ADP3211 IGFX_CORE
6) P1.5V_AUX
13) P1.5V
13) P3.3V
13) P5.0V
13) P1.8V
13) P0.75V
13) P1.05V
13) EGFX_CORE
14) VRM3_EGFX_PWRGD
16) IGFX_CORE
C
B
1
6-1) P1.8V_LAN
SAMSUNG
PART NO.
6 45
PAGE
A
ELECTRONICS
BA41-0XXXXXA
OF
DEV. STEP
REV
LAST EDIT
6) P3.3V_AUX
TITLEDATE
5/10/2010
MP
rev. 1.0
SPI ROM
VCCPWRGD0
A
VCCPWRGD1
ARD
4
3
RSTIN#
VTT_PWRGD
DRAW
CHECK
APPROVAL
MODULE CODE
2
Tang cuili
Sun xiao
BC LEE
undefined
88E8059
LAN MARVELL
SCALA2-DI
MAIN
POWER SEQUENCE
April 12, 2011 15:43:18 PM
SAMSUNG PROPRIETARY
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THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
3
2
CLOCK DISTRIBUTION
1
Rev. 1.0
D D
Buffered Mode
Arrandale only
XTAL 25M
CPU
PCIE GRAPHICS
XTAL
BCLK 133M
DMI 100M
CK505
C C
PLL1
133M
DP 120M
RTC
DMI
FDI
OSC
INT
RTC
XTAL
32.768M
DISPLAY
96M
PLL2
DOT96
PLL
&
SSC
100M
B B
PLL3
PCIE*
BLOCK
120/27M
USB
48M
SPI
PCIE
CLK1_PEG/#
CLK1_MINIPCIE/#
CLK1_PCH_LAN#
CLK1_PCH3GPLL_OUT#
SATA
100M
CLK3_PCLKMICOM
CLK3_DBGLPC
PLL4
100M
SATA
REF
LEGACY
14M
PCI_CLK
CLK3_PCIFB
14.318MHz
A A
4
3
PCH
DRAW
CHECK
APPROVAL
MODULE CODE
2
Tang cuili
Sun xiao
BC LEE
undefined
DATE
DEV. STEP
REV
LAST EDIT
5/10/2010
rev. 1.0
TITLE
MP
SCALA2-DI
MAIN
CLOCK DIAGRAM
April 12, 2011 15:43:18 PM
1
SAMSUNG
ELECTRONICS
PART NO.
BA41-0XXXXXA
PAGE OF
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THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
3
2
1
D
THERMAL SENSOR & FAN CONTROL
D
P3.3V_AUX
P5.0V
C534
C533
4700nF-X7R
100nF
6.3V
10V
C
ADDRESSS_SEL MODE
0
HIGH Z
1 0101 110xb
0101 111xb
0111 101xb (7A)
SHDN_SEL MODE
0
HIGH Z
1
INTEL TR MODE
AMD CPU/DIODE MODE
EXT.DIODE 2 MODE
FAN5_VDD
FAN3_FDBACK#
P3.3V_AUX
R547
10K
B
P3.3V_AUX
C557
100nF
10V
THERMAL_VDD5V_MN
0111 101xb (7A)
1%
THERMAL_SHDN_SEL_MN
R519
49.9
1%
U505
EMC2112-BP-TR
THERMAL_VDD3V_MN
1
VDD_3V
16
VDD_5V_1
19
VDD_5V_2
9
RESET#
17
FAN_1
18
FAN_2
20
TACH
10
ADDR_SEL
6
SHDN_SEL
7
TRIP_SET
R548
1.5K
1%
Temperature : 95c
confirmed by thermal charger
(2010.03.15)
THERMAL_PAD
SMDATA
SMCLK
ALERT#
SYS_SHDN#
DN1
DP1
DP3_DN2
DN3_DP2
CLK
GND
1209-001887
P3.3V_AUX
14
15
12
THM3_ALERT#
8
2
3
4
5
11
13
21
1%
10K
R552
1%
10K
R551
C558
2.2nF
50V
1%
10K
R550
P3.3V_AUX
1%
10K
(Selectable : PWR_SHDN)
R549
nostuff
C559
2.2nF
50V
THERMAL_DN2_MN
C70
0.022nF
50V
THERMAL_DP2_MN
nostuff
2
MMBT3904
C561
1
4700nF-X5R
Q5
6.3V
3
Default
Place near pin of diode.
To remove noise.
After test it can be removed.
KBC3_THERM_SMDATA
KBC3_THERM_SMCLK
THM3_ALERT#
THM3_STP#
CPU2_THERMDC
CPU2_THERMDA
C560
4700nF-X5R
6.3V
KBC3_THERM_SMCLK
KBC3_THERM_SMDATA
nostuff
nostuff
nostuff
C71
100nF
10V
P5.0V
1%
10K
THM3_STP#
TH500
R521
G765P71U
7
6
3
8
9
1209-002035
R520
6V
0
TH1
G709T1UF
5
VCC
3
OT_N
1
SET
1209-002034
R48
6V
13K
1%
GMT
Temperature : 103c
confirmed by thermal charger
(2010.10.04)
R (kohm) = 0.0012T - 0.9308T + 96.147
set
P5.0V
R522
10K
1%
10
VCC
X2
CLK
ADD0
SCL
SDA
GMT
FOUT
ALERT#
GND
1
2
FG
4
5
GMT
HYST
GND
GMT
2
P5.0V
4
2
GMT
C507
4700nF-X5R
10V
FAN5_VDD
FAN3_FDBACK#
GMT
C508
100nF
10V
C
B
FAN
M504
HEAD
SCALA2-DI
DIA
LENGTH
BA61-01090A
1
P5.0V
Line Width = 20 mil
R523
10K
GMT
SMT500
0-1005
KBC3_RST#THM3_STP#
FAN5_VDD
1%
FAN3_FDBACK#
A
4
3
C535
10000nF-X5R
6.3V
P3.3V
R524
10K
1%
J3
HDR-4P-1R-SMD
STD
1
2
3
4
5
MNT1
6
MNT2
3711-000456
TYPE : STRAIGHT
DESIGN
CHECK
APPROVAL
MODULE CODE
2
Tang cuili
Sun xiao
BC LEE
DEV. STEP
REV
LAST EDIT
8/19/2010
rev. 1.0
TITLEDATE
MP
THERMAL SENSOR
THERMAL SENSOR EMC2112
April 12, 2011 15:43:18 PM
M500
HEAD
DIA
LENGTH
BA61-01090A
SAMSUNG
ELECTRONICS
PART NO.
BA41-0XXXXXA
8 45
PAGE
D:/users/ecad58/Scala2-DI/Scala2-AMD_Int
OF
A
SAMSUNG PROPRIETARY
Vinafix.com
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
3
CPU_ZACATE
2
1
D
C
B
A
P1.5V_AUX
MEM1_AMA(15:0)
MEM1_ABS(2:0)
MEM1_ADM(7:0)
MEM1_ADQS(7:0)
MEM1_ADQS#(7:0)
CLK1_A_MCLK0
CLK1_A_MCLK0#
CLK1_A_MCLK1
CLK1_A_MCLK1#
CLK1_A_MCLK2
CLK1_A_MCLK2#
CLK1_A_MCLK3
CLK1_A_MCLK3#
MEM1_A_RST#
1% R7271K
MEM1_A_CKE0
MEM1_A_CKE1
MEM1_A_ODT0
MEM1_A_ODT1
MEM1_A_ODT2
MEM1_A_ODT3
MEM1_A_CS0#
MEM1_A_CS1#
MEM1_A_CS2#
MEM1_A_CS3#
MEM1_A_RAS#
MEM1_A_CAS#
MEM1_A_WE#
U4-1
ZACATE
0
R17
M_ADD_0
1
H19
M_ADD_1
2
J17
M_ADD_2
3
H18
M_ADD_3
4
H17
M_ADD_4
5
G17
M_ADD_5
6
H15
M_ADD_6
7
G18
M_ADD_7
8
F19
M_ADD_8
9
E19
M_ADD_9
10
T19
M_ADD_10
11
F17
M_ADD_11
12
E18
M_ADD_12
13
W17
M_ADD_13
14
E16
M_ADD_14
15
G15
M_ADD_15
0
R18
M_BANK_0
1
T18
M_BANK_1
2
F16
M_BANK_2
0
D15
M_DM_0
1
B19
M_DM_1
2
D21
M_DM_2
3
H22
M_DM_3
4
P23
M_DM_4
5
V23
M_DM_5
6
AB20
M_DM_6
7
AA16
M_DM_7
0
A16
M_DQS_H_0
1
B20
M_DQS_H_1
2
E23
M_DQS_H_2
3
J22
M_DQS_H_3
4
R22
M_DQS_H_4
5
W22
M_DQS_H_5
6
AC20
M_DQS_H_6
7
AB16
M_DQS_H_7
0
B16
M_DQS_L_0
1
A20
M_DQS_L_1
2
E22
M_DQS_L_2
3
J23
M_DQS_L_3
4
P22
M_DQS_L_4
5
V22
M_DQS_L_5
6
AC21
M_DQS_L_6
7
AC16
M_DQS_L_7
M17
M_CLK_H_0
M16
M_CLK_L_0
M19
M_CLK_H_1
M18
M_CLK_L_1
N18
M_CLK_H_2
N19
M_CLK_L_2
L18
M_CLK_H_3
L17
M_CLK_L_3
L23
M_RESET_L
N17
M_EVENT_L
F15
M_CKE_0
E15
M_CKE_1
W19
M0_ODT_0
V15
M0_ODT_1
U19
M1_ODT_0
W15
M1_ODT_1
T17
M0_CS_L_0
W16
M0_CS_L_1
U17
M1_CS_L_0
V16
M1_CS_L_1
U18
M_RAS_L
V19
M_CAS_L
V17
M_WE_L
0902-002737
MEMORY I/F
4
1 / 5
M_DATA_0
M_DATA_1
M_DATA_2
M_DATA_3
M_DATA_4
M_DATA_5
M_DATA_6
M_DATA_7
M_DATA_8
M_DATA_9
M_DATA_10
M_DATA_11
M_DATA_12
M_DATA_13
M_DATA_14
M_DATA_15
M_DATA_16
M_DATA_17
M_DATA_18
M_DATA_19
M_DATA_20
M_DATA_21
M_DATA_22
M_DATA_23
M_DATA_24
M_DATA_25
M_DATA_26
M_DATA_27
M_DATA_28
M_DATA_29
M_DATA_30
M_DATA_31
M_DATA_32
M_DATA_33
M_DATA_34
M_DATA_35
M_DATA_36
M_DATA_37
M_DATA_38
M_DATA_39
M_DATA_40
M_DATA_41
M_DATA_42
M_DATA_43
M_DATA_44
M_DATA_45
M_DATA_46
M_DATA_47
M_DATA_48
M_DATA_49
M_DATA_50
M_DATA_51
M_DATA_52
M_DATA_53
M_DATA_54
M_DATA_55
M_DATA_56
M_DATA_57
M_DATA_58
M_DATA_59
M_DATA_60
M_DATA_61
M_DATA_62
M_DATA_63
M_VREF
M_ZVDDIO_MEM_S
0
B14
1
A15
2
A17
3
D18
4
A14
5
C14
6
C16
7
D16
8
C18
9
A19
10
B21
11
D20
12
A18
13
B18
14
A21
15
C20
16
C23
17
D23
18
F23
19
F22
20
C22
21
D22
22
F20
23
F21
24
H21
25
H23
26
K22
27
K21
28
G23
29
H20
30
K20
31
K23
32
N23
33
P21
34
T20
35
T23
36
M20
37
P20
38
R23
39
T22
40
V20
41
V21
42
Y23
43
Y22
44
T21
45
U23
46
W23
47
Y21
48
Y20
49
AB22
50
AC19
51
AA18
52
AA23
53
AA20
54
AB19
55
Y18
56
AC17
57
Y16
58
AB14
59
AC14
60
AC18
61
AB18
62
AB15
63
AC15
M23
R756 39.2
M22
Connection P1.5V_AUX should be
directly to the plane
without a long trace
MEM1_ADQ(63:0)
P1.5V_AUX
1%
3
P1.05V
C912
100nF
10V
1%
2K R712
UMI1_FCH_TXP0
UMI1_FCH_TXN0
UMI1_FCH_TXP1
UMI1_FCH_TXN1
UMI1_FCH_TXP2
UMI1_FCH_TXN2
UMI1_FCH_TXP3
UMI1_FCH_TXN3
C911
1nF
50V
NB_PCE_CALRN_R_MN
P1.5V_AUX
R757
1K
1%
R755
1K
1%
AA12
AA10
AB10
AC10
AA6
AB4
AC4
AA1
AA2
AC7
AB7
Y6
Y4
Y3
Y14
Y12
Y10
U4-2
ZACATE
P_GPP_RXP_0
P_GPP_RXN_0
P_GPP_RXP_1
P_GPP_RXN_1
P_GPP_RXP_2
P_GPP_RXN_2
P_GPP_RXP_3
P_GPP_RXN_3
P_ZVDD_10
P_UMI_RXP_0
P_UMI_RXN_0
P_UMI_RXP_1
P_UMI_RXN_1
P_UMI_RXP_2
P_UMI_RXN_2
P_UMI_RXP_3
P_UMI_RXN_3
0902-002737
P_GPP_TXP_0
P_GPP_TXN_0
P_GPP_TXP_1
P_GPP_TXN_1
P_GPP_TXP_2
P_GPP_TXN_2
PCIE I/FUMI I/F
P_GPP_TXP_3
P_GPP_TXN_3
P_UMI_TXP_0
P_UMI_TXN_0
P_UMI_TXP_1
P_UMI_TXN_1
P_UMI_TXP_2
P_UMI_TXN_2
P_UMI_TXP_3
P_UMI_TXN_3
DRAW DATE
APPROVAL
MODULE CODE
2
2 / 5
P_ZVSS
AB6
AC6
AB3
AC3
Y1
Y2
V3
V4
NB_PCE_CALRP_R_MN
AA14
NB_UMI_TX0P_C_MN
AB12
NB_UMI_TX0N_C_MN
AC12
NB_UMI_TX1P_C_MN
AC11
NB_UMI_TX1N_C_MN
AB11
NB_UMI_TX2P_C_MN
AA8
NB_UMI_TX2N_C_MN
Y8
NB_UMI_TX3P_C_MN
AB8
NB_UMI_TX3N_C_MN
AC8
Tang cuili
Sun xiao
BC LEE
undefined
DEV. STEPCHECK
REV
LAST EDIT
R729 1.24K
C89
C91
C85
C88
C87
9/23/2008
MP
rev. 1.0
100nFC90
100nF
100nFC92
100nF
100nFC86
100nF
100nF
100nF
TITLE
1%
R728
1/16W
10V
10V
10V
10V
10V
10V
10V
10V
SCALA2-DI
April 12, 2011 15:43:18 PM
30.1
AMD recommended
1608, 1.27k ohm
(2007-007669)
UMI1_FCH_RXP0
UMI1_FCH_RXN0
UMI1_FCH_RXP1
UMI1_FCH_RXN1
UMI1_FCH_RXP2
UMI1_FCH_RXN2
UMI1_FCH_RXP3
UMI1_FCH_RXN3
CPU
culv
SAMSUNG
PART NO.
PAGE
1
D:/users/ecad58/Scala2-DI/Scala2-AMD_Int
ELECTRONICS
BA41-0XXXXXA
D
C
B
A
459
OF
SAMSUNG PROPRIETARY
Vinafix.com
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
3
2
1
CPU_ZACATE
D
CHP3_TX2P_HDMI
CHP3_TX2N_HDMI
CHP3_TX1P_HDMI
CHP3_TX1N_HDMI
CHP3_TX0P_HDMI
CHP3_TX0N_HDMI
CHP3_TXCP_HDMI
CHP3_TXCN_HDMI
LCD1_ADATA2
LCD1_ADATA2#
LCD1_ADATA1
LCD1_ADATA1#
C
APU1_SIC
APU1_SID
P1.8V
CPU1_LDTRST#
CPU1_PWRGDCPU
CPU3_PROCHOT#
CPU3_THRMTRIP#
R68 301
R69
R65
R66
nostuff
nostuff
1%
1%
301
0-1005
R72
P3.3V
0
1%
0
R641K
1K R70
1%
LCD1_ADATA0
LCD1_ADATA0#
R711K
1%
LCD1_ACLK
LCD1_ACLK#
P3.3V
CLK0_SB_HCLK0#
CLK1_SB_NBREF
CLK1_SB_NBREF#
R61
R63
1K
1K
CPU1_SIC_R_MN
1%
1%
CPU1_SID_R_MN
CLK0_SB_HCLK0
B
P3.3V
R38
nostuff
MMBT3904
KBC3_THERM_SMDATA
KBC3_THERM_SMCLK APU1_SIC
MMBT3904
R39
10K
10K
1%
1%
nostuff
Q4
1
40V
3
2
nostuff
1
nostuff
3
2
Q3
40V
A
4 23
CPU1_SVC
CPU1_SVD
APU1_SID
10V
100nF
C1067
100nF
10V
C1071
100nF
10V
C1066
100nF
10V
C1070
100nF
10V
C1065
10V
100nF
C1069
100nF
10V
C1068
100nF
10V
C1072
TDO
TCK
TMS
TRST_L
DBRDY
DBREQ_L
CPU1_VDDNB_FB
CPU1_VDDCPU_FB
CPU1_VDDMEM_FB
CPU1_VDDCPU_FB#
CPU_TDP1_TXP_0_C_MN
CPU_TDP1_TXN_0_C_MN
CPU_TDP1_TXP_1_C_MN
CPU_TDP1_TXN_1_C_MN
CPU_TDP1_TXP_2_C_MN
CPU_TDP1_TXN_2_C_MN
CPU_TDP1_TXP_3_C_MN
CPU_TDP1_TXN_3_C_MN
TDI
U4-3
ZACATE
A8
TDP1_TXP_0
B8
TDP1_TXN_0
B9
TDP1_TXP_1
A9
TDP1_TXN_1
D10
TDP1_TXP_2
C10
TDP1_TXN_2
A10
TDP1_TXP_3
B10
TDP1_TXN_3
B5
LTDP0_TXP_0
A5
LTDP0_TXN_0
D6
LTDP0_TXP_1
C6
LTDP0_TXN_1
A6
LTDP0_TXP_2
B6
LTDP0_TXN_2
D8
LTDP0_TXP_3
C8
LTDP0_TXN_3
V2
CLKIN_H
V1
CLKIN_L
D2
DISP_CLKIN_H
D1
DISP_CLKIN_L
J1
SVC
J2
SVD
P3
SIC
P4
SID
T3
RESET_L
T4
PWROK
U1
PROCHOT_L
U2
THERMTRIP_L
T2
ALERT_L
N2
TDI
N1
TDO
P1
TCK
P2
TMS
M4
TRST_L
M3
DBRDY
M1
DBREQ_L
F4
VDDCR_NB_SENSE
G1
VDDCR_CPU_SENSE
F3
VDDIO_MEM_S_SEN
F1
VSS_SENSE
B4
RSVD_1
W11
RSVD_2
V5
RSVD_3
0902-002737
DP_VARY_BL
DP MISC
TDP1_AUXP
TDP1_AUXN
DISPLAYPORT 1DISPLAYPORT 0
LTDP0_AUXP
LTDP0_AUXN
LTDP0_HPD
DAC_REDB
DAC_GREEN
DAC_GREENB
DAC_BLUEB
DAC_HSYNC
DAC_VSYNC
VGA DAC
CLK
SERCTRLJTAG
TEST
DMAACTIVE_L
3 / 5
DP_ZVSS
DP_BLON
DP_DIGON
TDP1_HPD
DAC_RED
DAC_BLUE
DAC_SCL
DAC_SDA
DAC_ZVSS
TEST4
TEST5
TEST6
TEST14
TEST15
TEST16
TEST17
TEST18
TEST19
TEST25_H
TEST25_L
TEST28_H
TEST28_L
TEST31
TEST33_H
TEST33_L
TEST34_H
TEST34_L
TEST35
TEST36
TEST37
TEST38
CPU_DP_ZVSS_R_MN
H3
R890
CPU_DP_BLON_R_MN
G2
CPU_DP_DIGON_R_MN
H2
CPU_DP_VARY_BL_R_MN
H1
B2
C2
C1
A3
B3
D3
C12
D13
A12
B12
A13
B13
E1
E2
F2
D4
R891
D12
R688
R1
R2
R689
R6
T5
E4
K4
L1
L2
TEST18
M2
TEST19
K1
K2
L5
M5
M21
10V
J18
10V
J19
U15
T15
H4
N5
R5
K3
T1
1K
1%
R50
1%
499
CHP3_HDMI_CLK
CHP3_HDMI_DATA
R893
R892
R894
CHP3_HDMI_HPD
LCD3_EDID_CLK
LCD3_EDID_DATA
R888
CHP3_CRT_HSYNC
CHP3_CRT_VSYNC
CHP3_CRT_DDCCLK
CHP3_CRT_DDCDATA
499
1%
0-1005
0-1005
C834
R84
C72
R52 510
C827
C910
100nF
100nF
R54
C835
R67 1K
nostuff
Pull down to Vss with a resistor of 1K
Pull up resistor to VDD_18; not installed by default:1K
1K
100nF
510R49
100nF
C877
C879100nF
1KR51
1K
100nF
100nF
100nF
C888
1%
1%
1%
1%
1%
10V
10V
10V
10V
51
51
10V
nostuff
P1.8V
1%
CPU2_THERMDA
CPU2_THERMDC
nostuff10V
nostuff
nostuff
nostuff
nostuff
R725
R726
nostuff
C1062
0.012nF
50V
1% 150
DRAW
CHECK
APPROVAL
MODULE CODE
0-1005
0-1005
0-1005
R887
1501%
P1.8V
CPU1_ALL_LDTSTP
R886
100K
C1063
0.012nF
50V
Tang cuili
Sun xiao
BC LEE
undefined
LCD3_BKLTEN
LCD3_VDDEN
LCD3_BRIT
R889
150
1%
R686
10K 10K
1% 1%
DATE
DEV. STEP
REV
LAST EDIT
HDT HEADER
C1064
0.012nF
50V
TRST_L
R687
P1.8V
TITLE
9/23/2008
MP
rev. 1.0
CHP3_CRT_RED
CHP3_CRT_GREEN
CHP3_CRT_BLUE
P1.8V
R685
10K
1%
1KR59
R62 1K
1KR60
R58 1K
R57 10K
301R56
1K
R55
1KR53
SCALA2-DI
CPU
culv
April 12, 2011 15:43:18 PM
J510
SOCK-20P-2R-SMD
1
3 4
5 6
7 8
9
10
11 12
13 14
15 16
17 18
19220
0311621300
1%
1%
1%
1%
1%
1%
1%
1%
1
TCK
TMS
TDI
TDO
CPU1_PWRGDCPU
CPU1_LDTRST#
DBRDY
DBREQ_L
TEST19
TEST18
nostuff
TDI
TCK
TMS
TRST_L
DBRDY
DBREQ_L
TEST19
TEST18
SAMSUNG
ELECTRONICS
PART NO.
BA41-0XXXXXA
PAGE
D:/users/ecad58/Scala2-DI/Scala2-AMD_Int
OF
D
C
A
4510
SAMSUNG PROPRIETARY
Vinafix.com
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
3
2
1
CPU_ZACATE
D D
U4-5
CPU_CORE
C794
C823
100nF
6.3V
10000nF-X5R
10V
C836
100nF
10V
C829
100nF
10V
C831
C C
100nF
10V
C795
6.3V
10000nF-X5R
nostuff
10000nF-X5R
C821
100nF
10V
C792
6.3V
nostuff
C822
1000nF-X5R
6.3V
C818
6.3V
10000nF-X5R
nostuff
C826
1000nF-X5R
6.3V
C793
6.3V
10000nF-X5R
nostuff
C825
1000nF-X5R
6.3V
C816
6.3V
10000nF-X5R
nostuff
C820
1000nF-X5R
6.3V
C817
6.3V
10000nF-X5R
VDDCR_NB
C870
10000nF-X5R
6.3V
C819
1000nF-X5R
6.3V
C830
1000nF-X5R
6.3V
C828
220uF
2.5V
C874
1000nF-X5R
6.3V
C815
22000nF-X5R
20%
6.3V
C833
1000nF-X5R
6.3V
C814
10000nF-X5R
6.3V
C882
1000nF-X5R
6.3V
nostuff
C883
100nF
10V
C875
100nF
10V
C824
100nF
10V
C876
100nF
10V
B B
P1.5V_AUX
C872
C1049
0.18nF
50V 50V
C1048
C1047
0.18nF
0.18nF
50V
Place close to APU
C1046
0.18nF
1000nF-X5R
6.3V
C1045
0.18nF
50V50V
C1044
0.18nF
50V
C881
1000nF-X5R
6.3V
C878
1000nF-X5R
6.3V
C889
1000nF-X5R
6.3V
C891
100nF
10V
C884
100nF
10V
C871
10000nF-X5R
6.3V
C885
100nF
10V
C886
10000nF-X5R
6.3V
ZACATE
E5
VDDCR_CPU_1
E6
VDDCR_CPU_2
F5
VDDCR_CPU_3
F7
VDDCR_CPU_4
G6
VDDCR_CPU_5
G8
VDDCR_CPU_6
H5
VDDCR_CPU_7
H7
VDDCR_CPU_8
J6
VDDCR_CPU_9
J8
VDDCR_CPU_10
L7
VDDCR_CPU_11
M6
VDDCR_CPU_12
M8
VDDCR_CPU_13
N7
VDDCR_CPU_14
R8
VDDCR_CPU_15
E8
VDDCR_NB_1
E11
VDDCR_NB_2
E13
VDDCR_NB_3
F9
VDDCR_NB_4
F12
VDDCR_NB_5
G11
VDDCR_NB_6
G13
VDDCR_NB_7
H9
VDDCR_NB_8
H12
VDDCR_NB_9
K11
VDDCR_NB_10
K13
VDDCR_NB_11
L10
VDDCR_NB_12
L12
VDDCR_NB_13
L14
VDDCR_NB_14
M11
VDDCR_NB_15
M12
VDDCR_NB_16
M13
VDDCR_NB_17
N10
VDDCR_NB_18
N12
VDDCR_NB_19
N14
VDDCR_NB_20
P11
VDDCR_NB_21
P13
VDDCR_NB_22
G16
VDDIO_MEM_S_1
G19
VDDIO_MEM_S_2
E17
VDDIO_MEM_S_3
J16
VDDIO_MEM_S_4
L16
VDDIO_MEM_S_5
L19
VDDIO_MEM_S_6
N16
VDDIO_MEM_S_7
R16
VDDIO_MEM_S_8
R19
VDDIO_MEM_S_9
W18
VDDIO_MEM_S_10
U16
VDDIO_MEM_S_11
0902-002737
VDD_18_1
VDD_18_2
VDD_18_3
VDD_18_4
VDD_18_5
VDD_18_6
VDD_18_7
VDD_18_DAC
POWER
VDDPL_10
VDD_10_1
VDD_10_2
VDD_10_3
VDD_10_4
4 / 5
VDD_33
U8
W8
U6
U9
W6
T7
V7
W9
U11
U13
W13
V12
T12
A4
P3.3V
C83
1000nF-X5R
6.3V
C846
10000nF-X5R
6.3V
C844
1000nF-X5R
6.3V
C847
10000nF-X5R
6.3V
C848
10000nF-X5R
6.3V
C851
10000nF-X5R
6.3V
C842
1000nF-X5R
6.3V
C84
100nF
10V
C840
1000nF-X5R
6.3V
C837
1000nF-X5R
6.3V
BLM18PG181SN1
C841
1000nF-X5R
6.3V
C838
1000nF-X5R
6.3V
C849
10000nF-X5R
6.3V
C890
100nF
10V
BLM18PG181SN1
C845
1000nF-X5R
6.3V
C843
100nF
10V
B526
BLM18PG181SN1
C839
100nF
10V
BLM18PG181SN1
C850
1000nF-X5R
6.3V
C887
100nF
10V
B527
P1.8V
B525
P1.8V
P1.05V
P1.05V
B528
U4-4
A7
B7
B11
B15
B17
B22
C4
D5
D7
D9
D11
D14
D17
D19
E7
E9
E12
E20
F8
F11
F13
G4
G5
G7
G9
G12
G20
G22
H6
H11
H13
J4
J5
J7
J20
K10
K14
L4
L6
L8
L11
L13
L20
L22
M7
N4
N6
N8
N11
ZACATE
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSS_13
VSS_14
VSS_15
VSS_16
VSS_17
VSS_18
VSS_19
VSS_20
VSS_21
VSS_22
VSS_23
VSS_24
VSS_25
VSS_26
VSS_27
VSS_28
VSS_29
VSS_30
VSS_31
VSS_32
VSS_33
VSS_34
VSS_35
VSS_36
VSS_37
VSS_38
VSS_39
VSS_40
VSS_41
VSS_42
VSS_43
VSS_44
VSS_45
VSS_46
VSS_47
VSS_48
VSS_49
0902-002737
5 / 5
VSS_50
VSS_51
VSS_52
VSS_53
VSS_54
VSS_55
VSS_56
VSS_57
VSS_58
VSS_59
VSS_60
VSS_61
VSS_62
VSS_63
VSS_64
VSS_65
VSS_66
VSS_67
VSS_68
VSS_69
VSS_70
VSS_71
VSS_72
VSS_73
GROUND
VSS_74
VSS_75
VSS_76
VSS_77
VSS_78
VSS_79
VSS_80
VSS_81
VSS_82
VSS_83
VSS_84
VSS_85
VSS_86
VSS_87
VSS_88
VSS_89
VSS_90
VSS_91
VSS_92
VSS_93
VSS_94
VSS_95
VSS_96
VSS_97
VSSBG_DAC
N13
N20
N22
P10
P14
R4
R7
R20
T6
T9
T11
T13
U4
U5
U7
U12
U20
U22
V8
V9
V11
V13
W1
W2
W4
W5
W7
W12
W20
Y5
Y7
Y9
Y11
Y13
Y15
Y17
Y19
AA4
AA22
AB2
AB5
AB9
AB13
AB17
AB21
AC5
AC9
AC13
A11
A A
SAMSUNG
ELECTRONICS
4
3 1
2
COM-22C-015(1996.6.5) REV. 3
SAMSUNG PROPRIETARY
Vinafix.com
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
DDR SO-DIMM #0
Height : 8 mm (STANDARD)
P/N : 3709-001615 (FOXCONN)
3
2
P1.5V_AUX
1
P/N : 3709-001622 (CONCRAFT)
D D
MEM1_ADQ(63:0)
MEM1_AMA(15:0)
C C
MEM1_ABS(0)
MEM1_ABS(1)
MEM1_ABS(2)
MEM1_A_CS0#
MEM1_A_CS1#
CLK1_A_MCLK0
CLK1_A_MCLK0#
CLK1_A_MCLK1
CLK1_A_MCLK1#
MEM1_A_CKE0
MEM1_A_CKE1
MEM1_A_CAS#
MEM1_A_RAS#
MEM1_A_WE#
SMB3_CLK
SMB3_DATA
MEM1_A_ODT0
MEM1_A_ODT1
B B
MEM1_ADM(7:0)
MEM1_ADQS(7:0)
MEM1_ADQS#(7:0)
A A
4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
DDR2-1
DDR3-SODIMM-204P-STD
1/2
98
A0
97
A1
96
A2
95
A3
92
A4
91
A5
90
A6
86
A7
89
A8
85
A9
107
A10_AP
84
A11
83
A12_BC#
119
A13
80
A14
78
A15
109
BA0
108
BA1
79
BA2
114
S0#
121
S1#
101
CK0
103
CK0#
102
CK1
104
CK1#
73
CKE0
74
CKE1
115
CAS#
110
RAS#
113
WE#
197
SA0
201
SA1
202
SCL
200
SDA
116
ODT0
120
ODT1
0
11
DM0
1
28
DM1
2
46
DM2
3
63
DM3
4
136
DM4
5
153
DM5
6
170
DM6
7
187
DM7
0
12
DQS0
1
29
DQS1
2
47
DQS2
3
64
DQS3
4
137
DQS4
5
154
DQS5
6
171
DQS6
7
188
DQS7
0
10
DQS#0
1
27
DQS#1
2
45
DQS#2
3
62
DQS#3
4
135
DQS#4
5
152
DQS#5
6
169
DQS#6
7
186
DQS#7
3709-001560
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
TEST
EVENT#
RESET#
P1.5V_AUX
0
5
1
7
2
15
3
17
4
4
5
6
6
16
7
18
8
21
9
23
10
33
11
35
12
22
13
24
14
34
15
36
16
39
17
41
18
51
19
53
20
40
21
42
22
50
23
52
24
57
25
59
26
67
27
69
28
56
29
58
30
68
31
70
32
129
33
131
34
141
35
143
36
130
37
132
38
140
39
142
40
147
41
149
42
157
43
159
44
146
45
148
46
158
47
160
48
163
49
165
50
175
51
177
52
164
53
166
54
174
55
176
56
181
57
183
58
191
59
193
60
180
61
182
62
192
63
194
MEM1_VREF
MEM1_VREF
P3.3V
C1003
100nF
10V
P0.75V
C1002
2200nF-X5R
10V
C973
C972
100nF
2200nF-X5R
10V
10V
C1001
C1000
2200nF-X5R
100nF
10V
10V
125
198
30
MEM1_A_RST#
3
DDR2-2
DDR3-SODIMM-204P-STD
2/2
75
76
81
82
87
88
93
94
99
100
105
106
111
112
117
118
123
124
203
204
199
126
77
122
13
14
19
20
25
26
VDD1
VDD2
VDD3
VDD4
VDD5
VDD6
VDD7
VDD8
VDD9
VDD10
VDD11
VDD12
VDD13
VDD14
VDD15
VDD16
VDD17
VDD18
VTT1
VTT2
VDDSPD
1
VREFDQ
VREFCA
NC1
NC2
2
VSS1
3
VSS2
8
VSS3
9
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
3709-001560
205
MNT1
206
MNT2
VSS11
VSS12
VSS13
VSS14
VSS15
VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
VSS35
VSS36
VSS37
VSS38
VSS39
VSS40
VSS41
VSS42
VSS43
VSS44
VSS45
VSS46
VSS47
VSS48
VSS49
VSS50
VSS51
VSS52
31
32
37
38
43
44
48
49
54
55
60
61
65
66
71
72
127
128
133
134
138
139
144
145
150
151
155
156
161
162
167
168
172
173
178
179
184
185
189
190
195
196
C1039
0.18nF
Place close to SODIMM
C1038
0.18nF
50V50V
2
P1.5V_AUX
C1040
0.18nF
50V
DRAW
CHECK
APPROVAL
MODULE CODE
EC507
220uF
2.5V
Place between two memory Connector
Place near SO-DIMM0
C995
C994
10000nF-X5R
10000nF-X5R
6.3V
6.3V
Tang cuili
Sun xiao
BC LEE
DATE
DEV. STEP
REV
LAST EDIT
C996
10000nF-X5R
6.3V
8/19/2010
rev. 1.0
R819
10K
1%
R820
10K
1%
MP
C993
10000nF-X5R
6.3V
nostuff
TITLE
MEM1_VREF
P0.75V
C974
1000nF-X5R
6.3V
C992
C991
10000nF-X5R
10000nF-X5R
6.3V
SCALA2-DI
SODIMM B
DDR3
April 12, 2011 15:43:18 PM
nostuff
nostuff
C976
C975
1000nF-X5R
1000nF-X5R
6.3V
6.3V
C989
100nF
1000nF-X5R
10V
6.3V6.3V
SAMSUNG
PART NO.
PAGE OF
1
D:/users/ecad58/Scala2-DI/Scala2-AMD_Int
C990
100nF
10V
ELECTRONICS
BA41-0XXXXXA
C977
1000nF-X5R
6.3V
nostuff
C998C997
1000nF-X5R
6.3V
4512
COM-22C-015(1996.6.5) REV. 3
SAMSUNG PROPRIETARY
Vinafix.com
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D
4 1
MEM1_ADQ(63:0)
MEM1_AMA(15:0)
CLK1_A_MCLK2
CLK1_A_MCLK2#
CLK1_A_MCLK3
CLK1_A_MCLK3#
MEM1_A_ODT2
MEM1_A_ODT3
MEM1_ADM(7:0)
MEM1_ABS(0)
MEM1_ABS(1)
MEM1_ABS(2)
MEM1_A_CS2#
MEM1_A_CS3#
MEM1_A_CKE0
MEM1_A_CKE1
MEM1_A_CAS#
MEM1_A_RAS#
MEM1_A_WE#
SMB3_CLK
SMB3_DATA
C
P3.3V
B
MEM1_ADQS(7:0)
MEM1_ADQS#(7:0)
A
4
DDR SO-DIMM #1
Height : 4 mm (STANDARD)
P/N : 3709-001560 (FOXCONN)
P/N : 3709-001607 (CONCRAFT)
DDR1-1
DDR3-SODIMM-204P-STD
1/2
0
98
1
97
2
96
3
95
4
92
5
91
6
90
7
86
8
89
9
85
10
107
11
84
12
83
13
119
14
80
15
78
109
108
79
114
121
101
103
102
104
73
74
115
110
113
197
201
202
200
116
120
0
11
1
28
2
46
3
63
4
136
5
153
6
170
7
187
0
12
1
29
2
47
3
64
4
137
5
154
6
171
7
188
0
10
1
27
2
45
3
62
4
135
5
152
6
169
7
186
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10_AP
A11
A12_BC#
A13
A14
A15
BA0
BA1
BA2
S0#
S1#
CK0
CK0#
CK1
CK1#
CKE0
CKE1
CAS#
RAS#
WE#
SA0
SA1
SCL
SDA
ODT0
ODT1
DM0
DM1
DM2
DM3
DM4
DM5
DM6
DM7
DQS0
DQS1
DQS2
DQS3
DQS4
DQS5
DQS6
DQS7
DQS#0
DQS#1
DQS#2
DQS#3
DQS#4
DQS#5
DQS#6
DQS#7
3709-001595
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
TEST
EVENT#
RESET#
3
2
D
0
5
1
7
2
15
3
17
4
4
5
6
6
16
7
18
8
21
9
23
10
33
11
35
12
22
13
24
14
34
15
36
16
39
17
41
18
51
19
53
20
40
21
42
22
50
23
52
24
57
25
59
26
67
27
69
28
56
29
58
30
68
31
70
32
129
33
131
34
141
35
143
36
130
37
132
38
140
39
142
40
147
41
149
42
157
43
159
146
148
158
160
163
165
175
177
164
166
174
176
181
183
191
193
180
182
192
194
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
P3.3V
C961
C960
100nF
2200nF-X5R
10V
10V
MEM1_VREF
MEM1_VREF
C944
100nF
125
198
30
MEM1_A_RST#
C957
100nF
10V
P1.5V_AUX
DDR1-2
DDR3-SODIMM-204P-STD
2/2
75
VDD1
76
VDD2
81
VDD3
82
VDD4
87
VDD5
88
VDD6
93
VDD7
94
VDD8
99
VDD9
100
VDD10
105
VDD11
106
VDD12
111
P0.75V
C958
2200nF-X5R
10V
C945
2200nF-X5R
10V
10V
VDD13
112
VDD14
117
VDD15
118
VDD16
123
VDD17
124
VDD18
203
VTT1
204
VTT2
199
VDDSPD
1
VREFDQ
126
VREFCA
77
NC1
122
NC2
2
VSS1
3
VSS2
8
VSS3
9
VSS4
13
VSS5
14
VSS6
19
VSS7
20
VSS8
25
VSS9
26
VSS10
MNT1
3709-001595
205
C1043
0.18nF
50V
Place close to SODIMM
206
MNT2
VSS11
VSS12
VSS13
VSS14
VSS15
VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
VSS35
VSS36
VSS37
VSS38
VSS39
VSS40
VSS41
VSS42
VSS43
VSS44
VSS45
VSS46
VSS47
VSS48
VSS49
VSS50
VSS51
VSS52
C1042
0.18nF
50V
31
32
37
38
43
44
48
49
54
55
60
61
65
66
71
72
127
128
133
134
138
139
144
145
150
151
155
156
161
162
167
168
172
173
178
179
184
185
189
190
195
196
C1041
0.18nF
50V
nostuff
P1.5V_AUX
EC506
220uF
2.5V
C952
10000nF-X5R
6.3V
C953
10000nF-X5R
6.3V
C948
10000nF-X5R
6.3V
nostuff
nostuff
C950
10000nF-X5R
6.3V
P0.75V
C955
10000nF-X5R
6.3V
C962
1000nF-X5R
6.3V
nostuff
C956
10000nF-X5R
C963
C1005
1000nF-X5R
1000nF-X5R
6.3V
6.3V
nostuff
Place near SO-DIMM1
C949
C947
10nF
100nF
25V
10V
C951
100nF
10V
C1006
1000nF-X5R
6.3V
C954
1000nF-X5R
6.3V
C
B
A
DRAW
CHECK
APPROVAL
MODULE CODE
3
2
Tang cuili
Sun xiao
BC LEE
DATE
DEV. STEP
REV
LAST EDIT
8/19/2010
rev. 1.0
TITLE
SCALA2-DI
MP
SODIMM A
DDR3
April 12, 2011 15:43:18 PM
1
SAMSUNG
ELECTRONICS
PART NO.
BA41-0XXXXXA
13 45
PAGE
D:/users/ecad58/Scala2-DI/Scala2-AMD_Int
OF
SAMSUNG PROPRIETARY
Vinafix.com
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
D
DG - R833 ; 590 ohm
R834 ; 2k ohm
R876
10K
1%
nostuff
P3.3V_AUX
U596
7SZ08
1
2
C
CHP3_PLT_RST#
PLT3_RST_ORG#
R885
0-1005
B
P3.3V_AUX
R748
10K
1%
nostuff
CHP3_PEX_RST#
PEX3_RST_ORG#
1
2
R884
0-1005
nostuff
R734
A
CLK3_25M_XTAL
SB_25M_X1_R_MN
SB_25M_X2_R_MN
C897
0.007nF
50V
R733
1
25MHz
Y503
0
1M
2
C898
0.007nF
50V
0.5pF0.5pF
4 1
PEX3_RST_ORG#
PLT3_RST_ORG#
UMI1_FCH_TXP0
UMI1_FCH_TXN0
UMI1_FCH_TXP1
UMI1_FCH_TXN1
UMI1_FCH_TXP2
UMI1_FCH_TXN2
UMI1_FCH_TXP3
UMI1_FCH_TXN3
UMI1_FCH_RXP0
UMI1_FCH_RXN0
UMI1_FCH_RXP1
UMI1_FCH_RXN1
UMI1_FCH_RXP2
UMI1_FCH_RXN2
UMI1_FCH_RXP3
UMI1_FCH_RXN3
P1.1V
C1053
100nF
10V
nostuff
5
+
4
-
nostuff
3
CLK1_SB_NBREF
CLK1_SB_NBREF#
CLK0_SB_HCLK0
CLK0_SB_HCLK0#
CLK1_SB_MINIPCIE
CLK1_SB_MINIPCIE#
CLK1_SB_PCIELOM
CLK1_SB_PCIELOM#
U517
7SZ08
5
nostuff
+
4
-
3
0
R735
0
R736
R696
R698
PEX1_MINI_TXP0
PEX1_MINI_TXN0
PEX1_LAN_TXP2
PEX1_LAN_TXN2
PEX1_MINI_RXP0
PEX1_MINI_RXN0
PEX1_LAN_RXP2
PEX1_LAN_RXN2
C1054
100nF
10V
nostuff
510
PLT3_RST#
PEX3_RST#
1%
1%2K
C904
C902
0.1nF
0.1nF
50V
50V
10V
100nF C861
10V
100nF
10V
100nF
10V
100nF
10V
100nF C858
10V
100nF
10V
100nF
10V
100nF
10V
100nF C864
10V
10V
100nF C867
10V
100nF
CLK3_MMC48
80.6R697 1%
R737 22 5%
C860
C805
C866
C859
C863
C862
C865100nF
C868
SB_PCIE_RST#_R_MN
22R741
5%
SB_A_RST#_R_MN
NB_GPP_TX0P_C_MN
NB_GPP_TX0N_C_MN
NB_GPP_TX1P_C_MN
NB_GPP_TX1N_C_MN
NB_GPP_TX2P_C_MN
NB_GPP_TX2N_C_MN
NB_GPP_TX3P_C_MN
NB_GPP_TX3N_C_MN
FCH_GPP_TX0P_C_MN
FCH_GPP_TX0N_C_MN
FCH_GPP_TX2P_C_MN
FCH_GPP_TX2N_C_MN
22
R116
3
FCH_HUDSON
U516-1
HUDSON-M1
P1
PCIE_RST#
L1
A_RST#
AD26
UMI_TX0P
AD27
UMI_TX0N
AC28
UMI_TX1P
AC29
UMI_TX1N
AB29
UMI_TX2P
AB28
UMI_TX2N
AB26
UMI_TX3P
AB27
UMI_TX3N
AE24
UMI_RX0P
AE23
UMI_RX0N
AD25
UMI_RX1P
AD24
UMI_RX1N
AC24
UMI_RX2P
AC25
UMI_RX2N
AB25
UMI_RX3P
AB24
UMI_RX3N
AD29
PCIE_CALRP
AD28
PCIE_CALRN
AA28
GPP_TX0P
AA29
GPP_TX0N
Y29
GPP_TX1P
Y28
GPP_TX1N
Y26
GPP_TX2P
Y27
GPP_TX2N
W28
GPP_TX3P
W29
GPP_TX3N
AA22
GPP_RX0P
Y21
GPP_RX0N
AA25
GPP_RX1P
AA24
GPP_RX1N
W23
GPP_RX2P
V24
GPP_RX2N
W24
GPP_RX3P
W25
GPP_RX3N
M23
PCIE_RCLKP_NB_LNK_CLKP
P23
PCIE_RCLKN_NB_LNK_CLKN
U29
NB_DISP_CLKP
U28
NB_DISP_CLKN
T26
NB_HT_CLKP
T27
NB_HT_CLKN
V21
CPU_HT_CLKP
T21
CPU_HT_CLKN
V23
SLT_GFX_CLKP
T23
SLT_GFX_CLKN
L29
GPP_CLK0P
L28
GPP_CLK0N
N29
GPP_CLK1P
N28
GPP_CLK1N
M29
GPP_CLK2P
M28
GPP_CLK2N
T25
GPP_CLK3P
V25
GPP_CLK3N
L24
GPP_CLK4P
L23
GPP_CLK4N
P25
GPP_CLK5P
M25
GPP_CLK5N
P29
GPP_CLK6P
P28
GPP_CLK6N
N26
GPP_CLK7P
N27
GPP_CLK7N
T29
GPP_CLK8P
T28
GPP_CLK8N
L25
14M_25M_48M_OSC
L26
25M_X1
L27
25M_X2
0904-002660
3
1 / 5
PCICLK0
PCICLK1_GPO36
PCICLK2_GPO37
PCICLK3_GPO38
PCICLK4_14M_OSC_GPO39
PCI CLKS
PCI EXPRESS I/F
PCI I/F
REQ2#_CLK_REQ8#_GPIO41
REQ3#_CLK_REQ5#_GPIO42
GNT3#_CLK_REQ7#_GPIO46
CLOCK GENERATOR
LPCCPURTC
LDRQ1#_CLK_REQ6#_GPIO49
ALLOW_LDTSTP_DMA_ACTIVE#
PCIRST#
AD0_GPIO0
AD1_GPIO1
AD2_GPIO2
AD3_GPIO3
AD4_GPIO4
AD5_GPIO5
AD6_GPIO6
AD7_GPIO7
AD8_GPIO8
AD9_GPIO9
AD10_GPIO10
AD11_GPIO11
AD12_GPIO12
AD13_GPIO13
AD14_GPIO14
AD15_GPIO15
AD16_GPIO16
AD17_GPIO17
AD18_GPIO18
AD19_GPIO19
AD20_GPIO20
AD21_GPIO21
AD22_GPIO22
AD23_GPIO23
AD24_GPIO24
AD25_GPIO25
AD26_GPIO26
AD27_GPIO27
AD28_GPIO28
AD29_GPIO29
AD30_GPIO30
AD31_GPIO31
CBE0#
CBE1#
CBE2#
CBE3#
FRAME#
DEVSEL#
IRDY#
TRDY#
STOP#
PERR#
SERR#
REQ0#
REQ1#_GPIO40
GNT0#
GNT1#_GPO44
GNT2#_GPO45
CLKRUN#
LOCK#
INTE#_GPIO32
INTF#_GPIO33
INTG#_GPIO34
INTH#_GPIO35
LPCCLK0
LPCCLK1
LAD0
LAD1
LAD2
LAD3
LFRAME#
LDRQ0#
SERIRQ_GPIO48
PROCHOT#
LDT_PG
LDT_STP#
LDT_RST#
32K_X1
32K_X2
RTCCLK
INTRUDER_ALERT#
VDDBT_RTC_G
PAR
SB_PCICLK0_R_MN
W2
SB_PCICLK1_R_MN
W1
W3
W4
Y1
V2
AA1
AA4
AA3
AB1
AA5
AB2
AB6
AB5
AA6
AC2
AC3
AC4
AC1
AD1
AD2
AC6
Delete after test.
AE2
AE1
nostuff
AF8
AE3
nostuff
nostuff
AF1
AG1
AF2
AE9
AD9
AC11
AF6
AF4
SB3_AD28_R_MN
AF3
SB3_SD29_R_MN
AH2
AG2
AH3
AA8
AD5
AD8
AA10
AE8
AB9
AJ3
AE7
AC5
AF5
AE6
AE4
AE11
AH5
AH4
AC12
AD12
AJ5
AH6
AB12
AB11
AD7
AJ6
AG6
AG4
AJ4
SB_LPCCLK0_R_MN
SB_LPCCLK1_R_MN
R151
H24
R146
H25
0
J27
1
J26
2
H29
3
H28
G28
J25
AA18
AB19
G21
H21
K19
G22
J24
C1
C2
D2
B2
B1
2
C112
0.033nF
50V
P3.3V
R702
R701
10K
10K
1%
1%
1%
R879
nostuff
10K
PCI3_CLKRUN#
CHP3_PLT_RST#
Near the SB
22
22
CPU1_ALL_LDTSTP
CPU3_PROCHOT#
CPU1_PWRGDCPU
CPU1_LDTSTP#
CPU1_LDTRST#
RTC3_32K_X1
RTC3_32K_X2
CHP3_RTCCLK
CHP3_RTCRST#
2
R105
R104
C111
0.033nF
50V
CHP3_RTCRST#
R878
10K
R877
10K
EXT15
1%
1%
PCI3_AD23
PCI3_AD24
PCI3_AD25
PCI3_AD26
PCI3_AD27
P1.05V
EXT14
1%
10K
PRTC_COIN
R880
5%
nostuff nostuff
R760
330
nostuff
C918
22000nF-X5R
6.3V
LPC3_CLK0
LPC3_CLK1
LPC3_LAD(3:0)
CLK3_DBGLPC
5%
22
CLK3_PCLKMICOM
PCI3_CLK2
PCI3_CLK3
PCI3_CLK4
PCICLK1
PCIE GEN1 ; 10K PD
PCIE GEN2 ; P3.3V 10K PU
Debug Strap
P3.3V_MICOM
P3.3V_AUX
nostuff
12
25MHz
Y504
C913
0.012nF
50V
nostuff
Strap
RTC BATTERY
PRTC_BAT
1%
510
R850
C1019
C182
1000nF-X5R
100nF
25V
10V
nostuff
For RTC Reset
Place under Memory Door
Silkscreen "RTC Reset"
CHP3_RTCRST#_R_MN
C1018
1000nF-X5R
25V
CLOCK DISTIBUTOR
U519
SLG3NB145VTR
2
VDD3
VDD_25M
VDDIO_25M_A
VDDIO_25M_B
VDDIO_32K_B
VBAT
X2
X1
CLK3_RTC_XTAL1
RTC3_32K_X1
RTC3_32K_X2
VDD_RTC_OUT
32KHZ_A
32KHZ_B
25MHZ_A
25MHZ_B
nostuff
R784
GND_1
GND_2
GND_3
GND_4
R762
R761
C923
C914
0.012nF
50V
nostuff
5
11
6
14
13
3
4
1205-004168
3.3V
5%
22
LPC3_LFRAME#
CHP3_SERIRQ
nostuff
CPU1_LDTSTP#
R148
R152
nostuff
1
1
12
15
9
8
nostuff
7
10
16
17
nostuff
0
0
0.01nF
20K 1%
0
P3.3V_MICOM
3
1 2
R851
CHP3_RTCRST#_RD_MN
PRTC_BAT
0
0
R787
R786
R785
20M
0.032768MHz
Y505
P1.8V
After test, will delete
D516
BAT54C
30V
PRTC_COIN
J515
1%
1K
1
PWR
2
GND
4309-001029
C915
1000nF-X5R
6.3V
nostuff
CLK3_RTC_XTAL1
CLK3_LAN_XTAL
CLK3_25M_XTAL
0
41
23
C924
0.01nF
SAMSUNG
ELECTRONICS
D
C
B
A
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