Samsung SENS Q1, SantaFe NT-Q1 Service Manual
SENS
Q1
SantaFe
NT-Q1
SERVICE
Manual
SENS Q1
AGENDA
1. Small but Storng UMPC
-. Intel Celeron M ULV Processor
-. 7" WVGA TFT LCD
-. A mere 779g(Without the bluetooth)
2. Convinience
-. Touch Screen Panel
-. Windows Xp Tablet Edition OS
-. Usability Similar to a normal PC
Contents that don't record this book refer to K-zone Service manual
Contents that don't record this book refer to K-zone Service manual
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1. Caution
1) General After-Sales Service Precautions
(1) Do not let customers repair the product themselves.
☞
There is a danger of injury and the product life time may be shortened.
(2) Make sure to disconnect the power cord from the wall outlet before repairing the product
(especially for after-sales service of electric parts).
☞
There is a danger of electric shock.
(3) Do not let customers plug several electric home appliances into a single wall outlet at the same
time
☞
There is a danger of fire due to overheating.
(4) Check if the power plug or wall outlet are damaged in any way.
repair or replace it immediately. (There is a danger of electric shock or fire)
(5) Make sure that it is properly grounded. (Check the ground of the wall outlet)
☞
Electricity leakage may cause electric shock.
(6) Do not spray water on to the product to clean it.
☞
There is a danger of electric shock or fire and it may shorten the lifetime of the product.
(7) Check the assembly status of the product after the after-sales service.
☞
The assembly status of the product must be the same as before the after-sales service.
(8) Unplug the power cord holding the power plug (and not the cord).
☞
If the cord is disconnected, it may cause electric shock or fire.
(9) Repair the product using only authorized parts.
(10) Keep the product away from heating devices such as heaters.
☞
Exposure to heaters may cause deformation of the product or fire.
☞
If a defect is found,
SAMSUNG Q1 < 1 - 1 >
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1. Caution
2) Safety Precautions
(1) EMI
This device has been registered regarding EMI for residential use. It can be used in all areas.
(2) Circuit Test (Logic Test) Precautions
The LSI and MSI used in this product are semiconductor integrated circuits based on MOS-FET
or CMOS. Since these types of devices are highly susceptible to static electricity or current
leakage, an isolation break may be caused. Therefore read and follow the instructions below.
1. When handling an LSI or MSI, make sure your body is grounded through a few mega-ohms
of resistance. In addition, wear gloves and a jacket made of cotton and not of synthetic fibers
that easily generate static electricity.
2. When repairing the product, place a conductive material (e.g. aluminum foil) grounded to the
earth on the worktable.
3. You must use a soldering iron without a leakage current.
4. Do not touch the pin of an IC and carefully insert the IC into the black plastic package.
5. When inserting an IC into a PCB, be careful with the direction of the IC. When installing an
IC in the wrong direction, it might become damaged.
6. When carrying an IC, package the IC with conducting material such as aluminum foil or
conducting sponge so as to keep the voltage level of each of the terminals the same.
7. Since the storage temperature of an IC is between -20 ~ +70 degrees, keep it at room
temperature, if possible.
8. When installing or removing a device from a PCB or installing or removing a board, you
must disconnect the power before taking any action.
9. When soldering an IC, solder it in as short a time as possible so that unnecessary heat is
not applied to the device.
10. Avoid leaving excessive amounts of flux within a custom IC or between the pins when soldering
acustomIC.
11.TakecaretonotdamagetheboardwheninstallingorseparatinganOptionBoard.
12. Take care to not break the printed circuit pattern on the PCB when separate an IC.
SAMSUNG Q1 < 1 - 2 >
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1. Caution
3) Ground
The product must be grounded to protect it from static electricity and other dangers. When using a
multitap,pleaseuseamultitapwithagroundterminalonly.
If you use a 220V wall outlet with a ground terminal, you do not need to ground it additionally. Avoid
using wall outlets if they are not grounded even if they have a ground terminal.
To ground the product, connect the ground to an exclusive ground terminal or metal water pipe.
Connect the ground cable to the ground terminal at the rear of the main body. To ground the product,
connect the ground terminal of the product to a metal water pipe, wall outlet or exclusive ground terminal
with an electric wire equal to or thicker than #18.
Never ground the product to a PVC water pipe, phone line, TV, radio antenna, aluminum window or
gas pipe, because this does not actually ground the product and may be dangerous.
4) Static Electricity Precautions
Many parts of the system are susceptible to static electricity. Using an electrostatic discharge (ESD)
device is very important for the safety of the user and the user's surroundings. Using an ESD device
increases the probability of a successful repair and lowers the expenses for damaged parts.
To prevent static electricity, follow the instructions below.
(1) Perform the repair in a location without static electricity.
(2) Touch your hands to a metal water pipe or some metal object connected to the ground to
discharge any static electricity from your body before handling the parts.
(3) Touch only the edges of the board, if possible.
(4) Do not touch any parts unless absolutely necessary
(5) Disassemble the parts on the anti-static-electricity pad.
(6) When a board is not installed in the system, packagetheboardwithananti-static-electricity
packaging.
SAMSUNG Q1 < 1 - 3 >
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2. Introduction and Specification
Product Characteristic
1)
SENS Q-1 < 2 - 1 >
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2. Introduction and Specification
Specification
2)
Processor and Motherboard X11
CPU Intel Celeron M ULV Processor
Speed Dothan 900MHz
Cache 1MB L2 cache(Celeron M)
Chipset Intel 915GMS+ICH6M
BIOS 8 Mbit, Flash upgradable
Thermal Design Performance MAX. 5W
Memory
Memory/Max.Memory 256MB / Max.1GB
Memory type PC2-3200(400MHz) SODIMM
Memory Modules 256MB, 512MB, 1GB SODIMM
Sockets 1SODIMMSocket
Display and Graphics
LCD 7" WVGA with TSP
LCD Vendor
LCD Viewable Area 152.4(H) x 91.44(V)mm (HxV)
LCD Resolution 800 x 480 x 262K color
Pixel Pitch 0.1905mm
Viewing angle Hor. 140 degree ,Ver. 100degree
Contrast Ratio Typ.400:1
Brightness Typ.180(cd/m2)
Response time Typ 30ms
Graphics Controller
Intel GMA 900 Intel 915GMS
Video Memory DVMT Max 128MB
Max.Resolution for LFP LVDS
Max.Resolution for External
Monitor
CPT (CLAA070VA03T)
Intel Graphic Media Accelerator 900
800*480x32Bitscolor(WVGA)
2048 x 1536 @75HZ (CRT)
Audio
Sound High Definition Audio comliant
Controller HD Audio CODEC, AD1986A
Conversion Built-in high performance 20-bit ADC & 24-bit DAC
Speaker Power Rating 2 Speakers x 2 Watt with enclosure each
External Interfaces Array MIC, Headphone
Controls Keyboard volume control, SRS enable / disable
Output Impedance
SENS Q-1 < 2 - 2 >
2.2KΩ
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2. Introduction and Specification
Storage
Hard Disk Drive 5/8 mmH 1.8" SFF HDD
Supports SMART UltraDMA-33/66/100 support, DMA Mode 2/4, PIO Mode 4
Average Access Time 15m sec.
Speed 4200rpm
Capacity 5mm 30GB / 8mm 40GB, 60GB
Network Tools
LAN 10/100 Ethernet UTP
Chipset Mavell 88E8036
Features RJ45 Output
802.11b/g Wireless LAN Askey Athros AR5BXB61 : 802.11 b/g
Type Mini card
Chipset Atheros
Antenna Integrated 1 Antenna
Bluetooth BCM92045NMD : Factory Option
Type USB daughter card with integrated PIFA antenna
Chipset Broadcom BCM2045
Standard version 2.0
DMB Module SDM-1000 : Factory Option / Alternative with SIO port
-Type USB I/F
- Antenna Int. Cable & Rod Antenna
I/O Interface
CF CardBus Slots 1TypeIICard
Controller Ricoh R5C801
Support 32bit CardBus cards
I/O Ports
USB Port 2 (USB2.0, Powered USB)
Video Port VGA port (15 pin)
Audio Jacks Head Phone-out
Modem/LAN RJ45
Power 1 (8.4pie)
Input Devices
Joystick 4 way direction button
Buttons
TSP(Touch Screen Panel)
QuickAccessButton
Auto Scaler, Enter, Menu, 4 User Define button, Volume
Up/Down
,Hold Switch
4-Wire resistive type
MIO / Power Swtich
SENS Q-1 < 2 - 3 >
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2. Introduction and Specification
Sepcial Feature
AV Station Now
OS XP Embedded
Funtion DVD Player / MP3 player / Picture slide show
Boot-up time 12 sec(Including HDD Navigation)
Control Button TSP(Touch Screen), 4 Way-slide Button
Power and Power
Management
Battery (Standard) AA-PB0UC3B (3cells, Smart Li-Ion Battery)
- Dimension 270x33.5x22.5mm
- Weight 180g (max)
-RechargeTime 2 hours to 100% with Windows on & off
- Battery Life over 3.5hour ( Battery mark 4.01)
- Details of Cell 3cells (1Parallel 3Serial)
- Voltage 11.1 Vdc
- Battery Capacity 2600mAh
- Battery Rating 11.1V / 2600mAh (28.86Wh)
AC Adapter AD-6019S
Output Power 60Watts
Dimension 108 X 47 X 28mm
Weight (AC Adapter) 270g (typ)
Worldwide Compatibility Auto-sensing 100 - 240VAC
Line Frequency 50 / 60Hz
Adapter Rating - Input 100V - 240V, 1.8A
Adapter Rating - Output 19.0VDC / 3.16A
Power Management Features
System Dimensions
ACPI 1.0b support, Standby(S3), Hibernate(S4)
Dimensions (W X D X H) 227.5 x 139.5 x 24.5~26.5 mm
799g (w/o DMB, ODD)
Weight (Full system w/ 3Cell)
Materials Front: PC, Back: PC/ABS
SENS Q-1 < 2 - 4 >
Status : No options, 3cell battery, 1.8" 40GB HDD,
7" TSP LCD(200 nit)
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2. Introduction and Specification
Product specification comparison
3)
Section Q1
Feature
CPU Intel Celeron M ULV (Dothan)
Chipset 915GM / ICH6
M
Memory DDR II 400MHz(Max.1GB)
Graphic Intel 915GMA 900(Internal)
LCD 7” WVGA
Wireless 802.11 b/g, DMB, Bluetooth
Lan Mavell 88E8036,10/100
HDD 1.8” HDD(30GB)
ODD External ODD,
Port 2 USB, 1 PC card, VGA, LAN, HP Jack, Array MIC, DC-in
Battery
3 Cell (38.5W, 3.5hrs) /
Power Pack 8 Cell (77W, 9hrs)
Dimesion 227.5 x 139.5 x 24.5~26.5mm
Weight 799g
SENS Q-1 < 2 - 5 >
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2. Introduction and Specification
4) Wireless LAN
Wireless LAN product standard (802.11BG card)
(1)
Atheros AR5006EX Wireless Network Adapter
■ Form registration device name : Specific crops power wireless radio device for wireless data
Specification
device
communication system
SENS Q-1 < 2 - 6 >
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2. Introduction and Specification
SENS Q-1 < 2 - 7 >
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2. Introduction and Specification
Option Material List
5)
HDD
BA59-01841A HDD(30G) 30G,HTC426030G5CE00,S63,H16,C16383,5.0MM,1.8INCH,PATA,30G/P,4200RPM,FDB
BA59-01872A HDD(60G) 60G,HTC426060G8CE00,S63,H16,C16383,5.0MM,1.8INCH,PATA,30G/P,4200RPM,FDB
BA59-01871A HDD(40G) 40G,HTC426040G8CE00,S63,H16,C16383,5.0MM,1.8INCH,PATA,30G/P,4200RPM,FDB
HDD FPC
BA41-00618A HDD FPC(AFC) SANTAFE,1.0,Cu,Ni,COVERPLAY,90Pins(40+50),0.3?0.05mm,Goldplating,2Layers
BA41-00616A HDD FPC(CMI) SANTAFE,1.0,Cu,Ni,COVERPLAY,90Pins(40+50),0.3?0.05,Goldplating,2Layers
LCD FPC
BA41-00619A LCD FPC(AFC) SANTAFE,1.0,Cu,Ni,COVERPLAY,50Pins,0.3?0.05mm,Goldplating,2Layers,50Pins
BA41-00617A LCD FPC(CMI) SANTAFE,1.0,Cu,Ni,COVERPLAY,50Pins,0.3?0.05,Goldplating,2Layers,50Pins
SUB BOARD FPC
BA41-00622A SUBBOARD FPC(AFC) SANTAFE,1.0,Cu,Ni,COVERPLAY,20Pins,0.3?0.05mm,Goldplating,2Layers
BA41-00616A SUBBOARD FPC(CMI) SANTAFE,1.0,Cu,Ni,COVERPLAY,20Pins,0.3?0.05,Goldplating,2Layers
SENS Q-1 < 2 - 8 >
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2. Introduction and Specification
MEMORY
1105-001606 256M(SEC) DDR2 400Mhz 256MB M470T3354BG0
1105-001612 256M(IN) DDR2 400Mhz 256MB HYS64T32000HDL
1105-001607 512M(SEC) DDR2 400Mhz 512MB M470T6554BG0
1105-001613 512M(IN) DDR2 400Mhz 512MB HYS64T64020HDL
1105-001608 1G(SEC) DDR2 400Mhz 1GB M470T2953BS0
BLUETOOTH
BA59-01691A BLUETOOTH BCM92045NMD
BA39-00572A
WLAN
BA59-01843A 802.11b/g WLL3140-D99(MOW-ROHS,WMAC+RF,2.4GHz,IEEE802.11b/g,Mini Card,CCK/OFDM,11C
BA59-01842A 802.11b/g WLL3140-D99(ROHS),WMAC+RF,2.4GHz,IEEE802.11b/g,CCK/OFDM,Mini Card,13CH
DMB Module & Antenna(Option)
BA59-01503A DMB module SDM-1000
BA59-01810A DMB Antenna DMB SUB,-,W250*L110mm,DMB SUB B/D
BLUETOOTH
HARNESS
8Pins,60,RED/BLK/YRL,AWG32,51021-0800,08SUR-32S,BULK,-,1
SENS Q-1 < 2 - 9 >
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2. Introduction and Specification
Option Sales List
6)
Power Bank Charge
AA-PL0UC8B / X
ODD - 12.7mm
AA-EB0U12B
AA-ES0U12B / X 12.7mm Super-multi
ODD - 9.5mm
/X
Power Bank Charge & Extend Battery
12.7mm DVD-COMBO
AA-EB0U09B / X 9.5mm DVD-COMBO
KEYBOARD
AA-SK0TKBD / Xx USB Keyboard
SENS Q-1 < 2 - 10 >
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2. Introduction and Specification
Option Sales List
6)
Car Cradle
AA-EX0UCAR / X
Car Adapter
AA-PC0NCAR / X
GPS
AA-EX0UNAV GPS Module
AA-EX0UMAP GPS Map
차량용 거치대
차량용 어댑터
DATA CABLE
AA-EX0TSYN / X DATA SINK CABLE
SENS Q-1 < 2 - 11 >
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2. Introduction and Specification
Option Sales List
6)
Organizer
AA-EX0UORG / X
BAG#1
AA-EX0UBAG / X BAG
BAG#2
오거나이져
AA-EX1UBAG / X BAG
POUCH
AA-EX0UPOU / X Set Pouch
SENS Q-1 < 2 - 12 >
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4. Disassembly and Assembly
1) Q1 Disassembly and Assembly
Part Picture Explanation
1. Separate the AC adaptor and the battery
certainly before disjoint system.
2. Push out the battery on like figure 2 after
have pushed latches with figure 1 to both side.
1
2 2
1
3. Remove the Bottom Screws (6EA) and
Detach Housing-Back.
Main
System
4. Remove Tapes.
Caution
Tape and Cable must fix like the picture.
5. Remove DMB module Screw (2EA) and
Antenna Screw (1EA)
6. Remove DMB module and Antenna Sub Board.
5
Caution
No DMB model : go next stage
SENS Q-1 < 4 - 1 >
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4. Disassembly and Assembly
Part Picture Explanation
7. Remove Antenna Screw 1EA and Remove
7
Wireless LAN module and Antenna
8. Open Latch and Remove HDD.
Main
System
9. Disconnect Fan Connector, Speaker
Connector(2), Left Sub Board FPC, LCD FPC,
Mic Connetor.
10. Remove Fan Screw (2EA).
11. Remove Main Board Screw (7EA).
12. Remove Fan.
13. Disconnect Right Sub Board FFC.
14. Lift up Main Board and Disconnect Inverter
Cable.
15. Remove MainBoard.
SENS Q-1 < 4 - 2 >
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4. Disassembly and Assembly
Part Picture Explanation
16. Disconnect LCD Power Connector.
17. Remove Invertor Board Screw (2EA) and
Remove Invertor Board.
18. Remove Mg Shield Screw (4EA) and Lift up
Mg Shield.
Main
System
19. Disconnect connectors.
(※Check Next stage Description.)
19-1. Disconnect Right Sub Board FFC & TSP
FPC.
19-2. Remove Right Sub Board의 Screw (1EA)
and Lift Right Sub Board.
Assembly Caution
TSP FPC must be over LCD Bracket
SENS Q-1 < 4 - 3 >
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4. Disassembly and Assembly
Part Picture Explanation
19-3. Disconnect Left Sub Board FPC.
16-4. Disconnect LED FPC.
16-5. Remove Left Sub Board Screw (1EA) and
Bluetooth Screw (1EA)
Lift Left Sub Board and Bluetooth Module.
20. Detatch LCD FPC Gasket.
Main
System
21. Detatch Tape, and Open latch.
Disjoint LCD FPC.
22. Remove Cover_Top (Lift and push like
picture).
SENS Q-1 < 4 - 4 >
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4. Disassembly and Assembly
부품명 설명사진 수리요령
23. Unlatch 6 point and Lift LCD Bracket.
24. Lift LCD.
Main
System
25. Lift User Define button.
Assembly Caution
User define button assemble like picture.
26. Lift Left Sub Board and Lift 4Way-Slide
Button.
Assembly Caution
Inner Slide button part attach to Sub board.
Check Indicator direct down like picture.
SENS Q-1 < 4 - 5 >
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