Samsung R60 NP-R60FY series Service Manual

R60
PRAHA NP-R60FYxx/xxx
SERVICE
Manual
SAMSUNG R60
FEATURES
-. Intel Core2 Duo/Celeron M
Processor
-. AMD RS600ME + AMD SB600
2. High Performance & Security
-. 15.4" WXGA Super Bright
Glare LCD/Non Glare LCD
-. AVS now, Bluetooth.
If there are the Contents not included in this book, please refer to K-zone Service Manual
- This Document can not be used without Samsung's authorization -
-
CONTENTS
1. Precautions
1) General After-Sales Service Precautions.................................................................................................................
2) Safety Precautions......................................................................................................................................................
3) Ground.........................................................................................................................................................................
4) Static Electricity Precautions........................................................................................................................................
Introduction and Specification
2.
1) Introduction..................................................................................................................................................................
2) Specification.................................................................................................................................................................
3) System Spec Comparison..........................................................................................................................................
4) Option list.....................................................................................................................................................................
5) BIOS Setup..................................................................................................................................................................
6) Description of Main board...........................................................................................................................................
3.
Disassembly and Reassembling
1) Disassembly and Re-assembly of PRAHA.................................................................................................................
4.
Troubleshooting
1) General......................................................................................................................................................................
2) Debugging Flow Chart..............................................................................................................................................
3) System Diagnosis......................................................................................................................................................
4) Use of diagnostic program.......................................................................................................................................
5) Hardware Troubleshooting......................................................................................................................................
6) Device Settings Related Software Diagnosis........................................................................................................
7) Battery Use Time....................................................................................................................................................
8) Other........................................................................................................................................................................
5. Exploded view
-
1) System Main Assy (List).................................................................................... 5-1
2) LCD Bsck Assy (List).........................................................................................5-3
3) LCD Front Assy (List)....................................................................................... 5-4
4) Assy CAP-TOP (List)..........................................................................................5-5
5) Housing Top Assy (List).................................................................................. 5-6
6) Housing Bottom Assy (List)................................................................................ 5-7
7) ODD (List)........................................................................................................5-9
6. Material list
1) SYSTEM....................................................................................................................................................................
7.
System Block Diagram
1) Top............................................................................................................................................................................
2) Bottom.......................................................................................................................................................................
3) LCD............................................................................................................................................................................
8.Schematic
1)Schematicc
............................................................................................................8-1
1-1
1-2 1-3
1-3
2-1
2-2
2-3
2-4 2-5
2-6
3-1
4-1
4-2
4-5 4-8
4-14
4-25 4-26 4-30
6-1
7-1 7-2
7-3
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2. Introduction and Specification
1) Introduction (1) High Performance Note PC
- Intel® Core™ 2 Duo Processor
- Intel® Core™ Duo Processor
- Intel® Pentium Dual Core™ Processor
- Intel® Celeron® M Processor
Wireless LAN (Option), Bluetooth (Option).
-
(2) Convenient AV
-Touch Pad Under Plastic
-Wireless On/Off indicator & Button
-ASF Solution Ready
(3) Communications
-Wireless Solution (F. Option)
-AtherosAR2423 (802.11bg)
-Bluetooth V2.0
-MDC (F. Option) . Delphi(D40)
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2. Introduction and Specification
2) Specification
Processor and Motherboard Description
Intel® Core™ 2 Duo Processor
CPU
Speed
Intel® Pentium Dual Core™ Processor+ AMD RS600ME + AMD SB600 Intel® Celeron® M Processor
R60 : Intel® Core™Duo Processor T2450 (2.0GHz) ~ Intel® Core™ 2 Duo Processor T5600 (1.83GHz) Intel® Pentium Dual Core Processor T2080 (1.73GHz) ~ T2130 (1.86GHz) Intel® Celeron M Processor 430 (1.73GHz) ~ 530 (1.73GHz)
R60 Plus : Intel® Core™ 2 Duo Processor T5250 (1.5GHz) ~ T7700 (2.4GHz) Intel® Celeron Processor 530 (1.73GHz) ~ 550 (2.0GHz)
4MB (Intel® Core™ 2 Duo Processor T7700, T7500, T7300)
Cache
Chipset RS600ME + SB600 BIOS 8 Mbit, Flash upgradable, SPI ROM Thermal Design Performance MAX. 35W
Memory
Memory / Max. Memory 1GB~MAX4GB Memory type PC2-5300(667MHz) DDR2 SODIMM Memory Modules 1GB, 2GB, 4GB SODIMM Sockets 2-slot SODIMM's
Display and Graphics
LCD 15.4" WXGA (Glare/NonGlare) LCD Vendor AMLCD/CPT ATI Internal GFx ATI Internal GFx Video Memory ATI 32MB ~ Max. 256MB Shared Memory Max.Resolution for LFP LVDS 1280 x 800 x 32Bits color (WXGA)
Max.Resolution for External Monitor
2MB (Intel® Core™ 2 Duo Processor) 1MB (Intel® Pentium Dual Core Processor, Intel® Celeron®M Processor)
ATI Radeon Xpress 1250
2048 x 1536 @ 32bps (CRT)
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2. Introduction and Specification
Storage
Hard Disk Drive 9.5mmH 2.5" HDD, Removable Supports SMART Ultra DMA 33/66/100, DMA Mode 2/4 ; SATA
Average Access Time 13m sec. Speed 5400 / 7200 RPM , Hybrid HDD, TMR/PMR Type
Capacity
Optical Disk Drive DVD/CD-ROM/Combo / Super Multi (12.7mm) ; Factory Option Type Fixed type (Factory Option)
S/W supplied Cyberlink DVD Solution Security RPC-II Regional Encoding
Optical Driver Modules
Combo Drive 1 Factory Option
Module type Fixed 12.7mm Slim Speed 8x DVD-ROM, 24x RW, 24x CD-R : TSST, TS-L332A Average Access Time DVD 130ms Typ, CD 130ms Typ Weight 176g or less S/W Supplied Cyberlink DVD Solution Security RPC-II Regional Encoding
Combo Drive 2 Factory Option
Module type Fixed 12.7mm Slim Speed 8x DVD-ROM, 24x RW, 24x CD-R, 24x CD : TSST, TS-L462D Average Access Time DVD 130ms Typ, CD 130ms Typ,. Weight 176g or less S/W supplied Cyberlink DVD Solution Security RPC-II Regional Encoding
SuperMultiDualLayer1 Factory Option
Module type Fixed 12.7mm Slim Speed Average Access Time DVD 130ms Typ., CD 130ms Typ.
Weight 190g or less S/W supplied Cyberlink DVD Solution Security RPC-II Regional Encoding
SuperMultiDualLayer2 Factory Option
Module type Fixed 12.7mm Slim Speed
80GB / 100GB / 120GB / 160GB / 200GB : HGST, Hitachi, Samsung
- 80 ~ 160GB SATA 5400rpm
- 200GB SATA 4200rpm (June '07)
5x DVD-RAM, 8x DVD±R 2.4x DVD+R DL, 4x DVD±RW, 24x CD-R, 16x CD-RW, 8x DVD, 24x CD : Panasonic UJ-850
5x DVD-RAM, 8x DVD±R, 6x DVD±R DL, 8x DVD+RW, 6x DVD-RW, 24x CD-R/RW, 8x DVD, 24x CD : TSSTTS-L632D
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2. Introduction and Specification
Average Access Time DVD 130ms Typ., CD 130ms Typ. Weight 180g or less S/W supplied Cyberlink DVD Solution Security RPC-II Regional Encoding
Super MultiDual Layer 3 Factory Option
Module type Fixed 12.7mm Slim Speed Average Access Time DVD 130ms Typ., CD 130ms Typ.
Weight 180g or less S/W supplied Cyberlink DVD Solution Security RPC-II Regional Encoding
Network Tools
5x DVD-RAM, 8x DVD±R, 6x DVD±R DL, 8x DVD+RW, 6x DVD-RW, 24x CD-R/RW, 8x DVD, 24x CD : TeacDV-W28EC
Fax/Modem
Chipset CSP1040 AGR A3 & A3 5V1 Features RJ11 Output
LAN
Chipset Marvell 88E8039 Features Integrated PHY, MAC 10/100, RJ45 Output
802.11b/g Wireless LAN
Type Mini card (Factory Option) Chipset AR2423
Bluetooth
Type USB daughter card with integrated PIFA antenna Chipset Broadcom BCM2045 Standard version 2.0
56Kbps / V.92 Azalia Modem, DELPHI (D40) (Factory Opeion)
10/100 Ethernet UTP
AtherosAR2423: Factory option
BCM92045NMD : Factory Option
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2. Introduction and Specification
I/O Interface
PC CardBus Slots PCI Express Card Slot I/O Ports USB Port 3(USB2.0) Video (CRT) Port 1
Audio Jacks HeadPhone-out Modem / LAN RJ11, RJ45 Power 1 DC-in (5pie) Input Devices
Key board Touchpad Synaptics Touchpad (Plat type with Scroll area)
Easy Button -
Power and Power Management
Battery (Standard) AA-PB3NC6B (6cells, Smart Li-Ion Battery) Dimension 204 x 48 x 20mm Weight 350g (max) Recharge Time 2 hours to 100% with Windows on & off Battery Life over 2.5hour ( Battery mark 4.01) Details of Cell 6cells (2Parallel 3Serial) - Standard only Voltage 11.1Vdc Battery Capacity 2000mAh/cell Battery Rating 11.1V / 4000mAh (44.4Wh) Battery (LongLife) AA-PL2NC9B (9cells, Smart Li-Ion Battery) Recharge Time 4 hours to 100% with Windows on & off Battery Life over 5hour ( Battery mark 4.01) Details of Cell 9cells (3Parallel 3Serial) Voltage 11.1Vdc
1
88KEY(KR/US) Travel length 2.6mm / Key Pitch 19.05mm
Battery Capacity 2600mAh/cell Battery Rating 11.1V / 7800mAh (86.58Wh)
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2. Introduction and Specification
AC Adapter AD-9019S(2.0GHz↑) Output Power 90Watts Dimension 126 X 51 X 30 mm Weight (AC Adapter) 270g (typ) Worldwide Compatibility Auto-sensing 100 - 240VAC Line Frequency 50 / 60Hz Adapter Rating - Input 100V - 240V, 1.5A(Min) Adapter Rating - Output 19.0VDC , 4.74A Power Management Features ACPI 3.0 support, Standby(S3), Hibernate(S4) AC Adapter AD-6019S(2.0GHz Output Power 60 Watts Dimension 108 x 46.5 x 28mm Weight (AC Adapter) 320g (max) Worldwide Compatibility Auto-sensing 100 - 240VAC Line Frequency 50 / 60Hz Adapter Rating - Input 100V - 240V, 1.4A Adapter Rating - Output 19.0VDC / 3.16A Power Management Features ACPI 1.0b support, Standby(S3), Hibernate(S4)
↓)
System Dimensions
Dimensions (W X D X H) 335.9mm x 240.4mm x 28.2~38.8mm Weight (Full system w/4cell Battery)
Materials LCD Front: PC, Back: PC/ABS
2.19Kg
Status : Combo , 4cell battery, 2.5" 80GB HDD
Top: PC/ABS, Bottom: Mg
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2. Introduction and Specification
3) Specification comparison
모델명
R40 plus R60 plus
Platform Intel Yonah (FSB667, 2MB L2)
LCD 15.4” WXGA 15.4” WXGA CHIP SET CPU T5600 T7700
Graphic
Internal RadeonXPress1250M RadeonXPress1250M
s
Modem 56Kbps F.Option 56Kbps F.Option
Network
Ethernet 10/100 10/100
Wireless bg bg
Port
RS600ME + SB600 RS600ME + SB600
PCMCIA, 4USB, TV-out, VGA, Audio
Intel Merom (FSB667,800 2MB,4MB L2)
PCI Express Card, 3USB, VGA, Audio
BATTERY ODD
Size (cm)
Weight (kg) 2.46 2.46
6CELL 6CELL
Super-Multi Super-Multi
340.4 x 259.6
31.1~38.7
2- 7
335.9 x 240.4
28.2~38.8
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2. Introduction and Specification
3) Specification comparison
모델명
Sony
LG(T1-
(VGN-
HP(V3037TU)
Samsung(X22)
CPU
LCD
Graphics
Memory
HDD
ODD
Network
Battery
T2400 M760 T2300E T7100
14.0”WXGA 14.1”WXGA 14.1”WXGA
Intel GMA950 Intel GMA950 Intel GMA950
DDR2 1024MB DDR2 512MB DDR2 512MB DDR2 1024MB
60GB 80GB 80GB 80GB
COMBO
Modem Gigabit, abg
6Cell 6Cell 6Cell 4Cell/8Cell
DVD±RW
Modem 10/100, bg
COMBO Super-Multi
Modem 10/100, abg
14.1”WXGA/WXGA+
ATI X2400
Modem(56Kbps)
Gigabit abg/n or abg
PC Card Slot
Port
Dock
Size (cm)
Weight (kg)
4-in-1 MS, MS pro 5-in-1 6-in-1
3xUSB,1394 VGA, S-Video
-Replicator- X-Dock
334x240
21.5~31.5
1.93 2.4 2.4
3xUSB,1394 VGA, S-Video
340x253.5 21~33
2- 8
3xUSB, 1394 VGA, S-Video
334x237 26~39
3xUSB, no 1394 VGA,
335.9 x 240.4
28.2~38.8
2.19
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2. Introduction and Specification
4) Wireless LAN Specification
(1) Wireless LAN
Atheros Wireless Network Adapter
Standard
(802.11BG
card
)
2. Introduction and Specification
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2. Introduction and Specification
Option list
5)
HDD
BA59-01999A HTS541660J9SA00 5400rpm, , 60G, SATA, 8M BA59-01946A MHV2060BH-PL 5400rpm, , 60G, SATA, 8M BA59-02084A MHW2060BH 5400rpm, , 60G, SATA, 8M BA59-02038A HM060HI 5400rpm, , 60G, SATA, 8M BA59-02001A HTS541680J9SA00 5400rpm, , 80G, SATA, 8M BA59-01947A MHV2080BH-PL 5400rpm, , 80G, SATA, 8M BA59-02085A MHW2080BH 5400rpm, , 80G, SATA, 8M BA59-02009A ST980815AS 5400rpm, , 80G, SATA, 8M BA59-01742A HTS541010G9SA00 5400rpm, , 100G,SATA , 8M BA59-01948A MHV2100BH-PL 5400rpm, , 100G, SATA, 8M BA59-02086A MHW2100BH 5400rpm, , 100G, SATA, 8M BA59-02014A HM101JI 5400rpm, , 100G, SATA, FFS BA59-02010A ST9100828AS 5400rpm, , 100G, SATA, 8M BA59-02002A HTS541612J9SA00 5400rpm, , 120G, SATA, 8M BA59-01957A MHV2120BH-PL 5400rpm, , 120G, SATA, 8M BA59-02087A MHW2120BH 5400rpm, , 120G, SATA, 8M BA59-02013A hm121JI 5400rpm, , 120G, SATA, FFS BA59-02039A HM120JI 5400rpm, , 120G, SATA, 8M BA59-02011A ST9120822AS 5400rpm, , 120G, SATA, 8M BA59-02003A HTS541616J9SA00 5400rpm, , 160G, SATA, 8M BA59-02012A ST9160821AS 5400rpm, , 160G, SATA, 8M BA59-02110A MHW2160BH-PL 5400rpm, , 160G, SATA, 8M
LCD
BA59-01814A BA59-02147A
15.4WXGA
15.4WXGA
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2. Introduction and Specification
MEMORY
1105-001683 DDR2 667Mhz 512MB M470T6554CZ3-CE6
1105-001684 DDR2 667Mhz 1GB M470T2953CZ3-CE6
1105-001783 DDR2 667MHz 512MB NT512T64UH8B0FN-3C
1105-001790 DDR2 667MHz 1GB NT1GT64U8HB0BN-3C 1105-001825 DDR2 667MHz 2GB M470T5663CZ3
CPU
0902-002196 T_T7100(Merom Dual Core ) 1.8Ghz(FSB800) 2MB 0902-002197 T_T7300(Merom Dual Core ) 2.0Ghz(FSB800) 4MB 0902-002198 T_T7500(Merom Dual Core ) 2.2Ghz(FSB800) 4MB 0902-002199 T_T7700(Merom Dual Core ) 2.4Ghz(FSB800) 4MB
BATTERY
BA43-00169A BATTERY 4Cell BA43-00170A BATTERY 8Cell
BLUETOOTH
BA59-01691A
BA59-01916A
MODULE-BLUETOOTH Bluetooth V2.0,T60H928.01,Bluetooth Module,USB I/F,V2.0,C MODULE-BLUETOOTH Bluetooth Version 2.0,BTO2P0B2SA,Bluetooth Module,
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2. Introduction and Specification
ODD
BA96-03223A S_MULTI(DV228EC) TEAC BA96-03241A S_MULTI(UJ-850) MATSUHITA BA96-03242A S_MULTI(TS-L632D) TSST BA96-03222A ROM(DW-224E-R) TEAC BA96-03239A COMBO(TS-L462D) TSST WLAN
BA59-02154A 802.1 /b/g
WLL3141
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5. Exploded View and Part List
SYSTEM
I0003
K4001
K3001
K1001
K0001
K1002
K4002
K1003
M3004
B0013
M4000
W3017
I0001
M3000
K3002
K0002
R0201
T0010
I0006
T0001
M0001
G0003
I0002
I0009
B0001
D0001
W3007
G0011
B0003
B0150
I0005
B0100
5-1
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5. Exploded View and Part List
Unit-Housing-Back
K0001
K0301
K0006
K4003
K0004
K2002
K0007
5-2
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5. Exploded View and Part List
Unit-Housing-Top
T0001
L1005
W4011
T2001
W4011
T0408
T0002
T0302
5-3
T0101
T0407
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5. Exploded View and Part List
Unit-Housing-Bottom
B0001
B0501
B0303
B0302
B0501
B0009
B0402
B0010
B0010
B0403
B0009
5-4
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5. Exploded View and Part List
Unit-ODD
D0001
D2000
D1002
D3000
5-5
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5. Exploded View and Part List
NP-R60X0B1/SEK
Location Part Number Parts Name & Specification Q'ty SA/SNA
A0010 3903-000055 CBF-POWER CORD;DT,EU,CP2/NO,E(IEC320 C7) 1 SA
A1001 BA46-05711A S/W CD;RCD,NP/DT,VISTAHB,1.0,ENG,DVD,1/1 1 SA
A1001 BA46-07026A S/W CD;UTILITY,PRAHA,WINVISTA,0.0,EXP,DV 1 SA
B0001 BA75-01983A UNIT-HOUSING_BOTTOM;PRAHA,SEC,PC+ABS,W35 1 SA
B0003 BA81-03831A DOOR-MEMORY;PRAHA,PC+ABS,W117.2*L66.0*H2 1 SA
B0009 BA81-03443A RUBBER-FOOT;HAINAN2,DOMESTIC,SR,L19*W6.5 4 SA
B0010 BA81-03458A RUBBER-FOOT_CENTER;OSLO,SILICON,HS70,W3. 2 SA
B0013 BA81-03955A CARD-DUMMY_EXPRESS;PRAHA,PC/ABS,L70.4*W5 1 SA
B0100 BA75-01982A UNIT-DOOR_HDD;PRAHA,SEC,PC+ABS,W80.2*L11 1 SA
B0150 BA75-01944A UNIT-BRACKET_HDD;PRAHA,SEC,SECC,W71.0*L3 1 SA
B0302 BA81-02795A LINK-BATTERY_L;FIRENZE2,POM,L26.4*W10.8* 1 SA
B0303 BA81-03823A LINK-BATTERY_R;PRAHA,POM,L26.4*W10.8*H5. 1 SA
B0402 BA81-03382A KNOB-BATTERY_R;OSLO,PC+ABS,W25*L6.5*H7.8 1 SA
B0403 BA81-03383A KNOB-BATTERY_L;OSLO,PC+ABS,W25*L6.5*H7.8 1 SA
B0501 BA61-00780A SPRING ETC-BATT;AQUILA-P,STS304,CD0.3,ID 2 SA
D0001 BA96-03223A ASSY DVD-SUPERMULTI;OSLO,SUPERMULTI,TEAC 1 SA
D0001 BA96-03241A ASSY DVD-SUPERMULTI;OSLO,Matsushita, UJ- 1 SA
D0001 BA96-03323A ASSY DVD-SUPERMULTI;OSLO,Slim Super Mult 1 SA
D1002 BA59-01970A DVD-SUPERMULTI;UJ-850,8X,180ms,E-IDE,2M, 1 SA
D1002 BA59-02020A DVD-SUPERMULTI;DV-W28E-C,8X,110ms,E-IDE, 1 SA
D1002 BA59-02192A DVD-SUPERMULTI;TS-L632H,18x,130ms,Pata,2 1 SA
D2000 BA81-03428A BRACKET-ODD;OSLO,SUS304,W27*L10*T1.0mm,N 1 SA
D3000 BA75-01863B UNIT-BEZEL_ODD-MULTI_DL;HAINAN2,DOMESTIC 1 SA
G0003 BA59-02154A MODULE-WLAN;DT/NP,WLL3141,-,802.11BG,min 1 SA
I0001 0902-002163 IC-MICROPROCESSOR;LF80537NE0251M,1.6GHz, 1 SA
I0002 1105-001683 IC-DRAM MODULE;M470T6554,DDR2,512MByte,6 2 SA
I0002 1105-001783 IC-DRAM MODULE;NT512T64UH8B0FN-3C,DDR2,5 2 SA
I0003 BA59-01814A LCD PANEL-154WXGA;LTN154X3-L03-C/N,15.4W 1 SA
I0003 BA59-02147A LCD PANEL-154WXGA;LTN154X3-L03-A,15.4WXG 1 SA
I0005 BA59-01957A HDD;120G,MHV2120BH-PL,S63,H16,D16385,H9. 1 SA
I0005 BA59-02002A HDD;120G,HTS541612J9SA00,S63,H16,D16385, 1 SA
I0005 BA59-02039A HDD;120G,HM120JI,S63,H16,D16385,H9.5mm,2 1 SA
I0005 BA59-02087A HDD;120G,MHW2120BH,S63,H16,D16385,H9.5mm 1 SA
I0005 BA59-02189A HDD;120G,HM121HI,S63,H16,D16385,H9.5mm,2 1 SA
I0005 BA59-02202A HDD;120G,HTS542512K9A300,S63,H16,D16385, 1 SA
I0005 BA59-02208A HDD;120G,MHY2120BH,S63,H16,D16385,9.5mm, 1 SA
5-6
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5. Exploded View and Part List
NP-R60X0B1/SEK
Location Part Number Parts Name & Specification Q'ty SA/SNA
I0005 BA59-02226A HDD;120G,WD1200BEVS-22UST0,S63,H16,D1638 1 SA
I0006 BA59-02044A KEYBOARD;OSLO,88,M/B,-,US,-,BLACK,- 1 SA
I0006 BA59-02044F KEYBOARD;OSLO,88 KEYS,-,-,US,-,BLK,- 1 SA
I0007 BA44-00238A ADAPTOR;0335C1960,AD-6019,AC/DC,90to264V 1 SA
I0007 BA44-00243A ADAPTOR;ADP-60ZH A,AD-6019,AC/DC,90to264 1 SA
I0009 BA43-00155A BATTERY;3UR18650Y-2-SDN-14,HABANA-C,Li-i 1 SA
I0009 BA43-00162A BATTERY-PACK;P32R04-06-H01,Firenze2,Li-i 1 SA
K0001 BA75-01945A UNIT-HOUSING_LCD-BACK;PRAHA,SEC,PC+ABS,W 1 SA
K0002 BA75-01941A UNIT-HOUSING_LCD-FRONT;PRAHA,SEC,PC+ABS, 1 SA
K0004 BA81-03824A KNOB-LATCH_LCD;PRAHA,PC+ABS,W159.0*L9.0 1 SA
K0006 BA61-00631A SPRING ETC-KNOB_LCD;AQUILLA,STS304,T0.25 1 SA
K0007 BA64-00716A LOGO-SAMSUNG;HAINAN2,DOMESTIC,T0.75,8.25 1 SA
K0100 BA81-04180A RUBBER-FRONT;PRAHA,SILICON RUBBER,HS85,D 5 SA
K0301 BA81-01824A SPONGE-BACK_CENTER;FIRENZE,CR SPONGE,W50 1 SA
K1001 BA39-00658A CBF HARNESS-LCD;PRAHA,AL,UL10005,30/8/30 1 SA
K1001 BA39-00661A CBF HARNESS-LCD;PRAHA,AL,UL10005,30/8/30 1 SA
K1002 BA44-00248A INVERTER;OSLO,541180560003,DC,8.5to20V,1 1 SA
K1002 BA44-00249A INVERTER;OSLO,DAC-09N019 AF,DC,8.5Vto20V 1 SA
K1002 BA44-00250A INVERTER;OSLO,VK.21209.202,DC,8.5to20V,1 1 SA
K1003 BA63-00543A PROTECTOR-LCD_FRONT;FIRENZE2,PET,T0.1mm, 1 SA
K2002 BA42-00183A ANTENNA-AUX;SS-03-03-100,Oslo,2.3to6GHz, 1 SA
K3001 BA61-00998A HINGE-L;FIRENZE,ZAMAK2,T3.0mm,-,-,NTR,-, 1 SA
K3001 BA61-01119A HINGE-L;FIRENZE2,Mg,T3.0,W5.6,L21.9mm,NT 1 SA
K3001 BA61-01130A HINGE-L;PRAHA,Mg,T1.5,W5.6,L21.9mm,NTR,- 1 SA
K3002 BA61-00999A HINGE-R;FIRENZE,ZAMAK2,T3.0mm,-,-,NTR,-, 1 SA
K3002 BA61-01120A HINGE-R;FIRENZE2,Mg,T3.0,W5.6,L21.9mm,NT 1 SA
K3002 BA61-01131A HINGE-R;PRAHA,Mg,T1.5,W5.6,L21.9mm,NTR,- 1 SA
K4001 BA81-03839A BRACKET-LCD_L;PRAHA,SECC T0.8,W252.6*L30 1 SA
K4002 BA81-03840A BRACKET-LCD_R;PRAHA,SECC T0.8,W252.6*L28 1 SA
K4003 BA81-03833A BRACKET-LCD_UPPER;PRAHA,SECC T0.8,W344.0 1 SA
L1004 BA68-20039A LABEL-PPID_E;BLADE,-,PET,-,W50.8,L12.7mm 1 SA
L1005 BA68-20323A LABEL CAUTION;NOTE PC,-,PET,T0.06,W30.0, 1 SA
M0001 BA92-04669A ASSY MOTHER BD-TOP;PRAHA,NAPA,RS600ME/SB 1 SA
M1002 3301-001594 BEAD-SMD;90ohm,2.0*1.2*1.3mm,-,TP,-,-,- 1 SA
M1004 2203-005052 C-CER,CHIP;0.0033nF,0.25pF,50V,NP0,1005 1 SA
M1004 2203-005918 C-CER,CHIP;1000nF,10%,6.3V,X7R,1608 1 SA
5-7
- This Document can not be used without Samsung's authorization -
5. Exploded View and Part List
NP-R60X0B1/SEK
Location Part Number Parts Name & Specification Q'ty SA/SNA
M1004 2203-006000 C-CER,CHIP;1NF,10%,3KV,X7R,TP,4520 1 SA
M1009 3711-002127 HEADER-BOARD TO CABLE;BOX,8P,1R,1.25mm,S 1 SA
M1009 3711-005753 HEADER-BOARD TO BOARD;BOX,10P,1R,1mm,SMD 1 SA
M1021 1201-001991 IC-AUDIO AMP;TPA6017A2PWPR,TSSOP,20P,6.5 1 SA
M1024 0801-002195 IC-CMOS LOGIC;7S08,AND GATE,SOT-25,5P,63 1 SA
M1025 1203-003344 IC-POSI.FIXED REG.;MIC5252,SOT-23,5P,2.9 1 SA
M1028 3722-001692 JACK-MODULAR;12P/10C,STANDARD,N,SMD-OFFS 1 SA
M1028 3722-002601 JACK-USB;4P/2C,AUF,BLK,ANGLE-OFFSET,A TY 1 SA
M1029 2007-000048 R-CHIP;6.19Kohm,1%,1/10W,TP,1608 1 SA
M1029 2007-000052 R-CHIP;10Kohm,1%,1/10W,TP,1608 1 SA
M1029 2007-008299 R-CHIP;61.9ohm,1%,1/16W,TP,1005 1 SA
M1032 BA61-00784A SUPPORT-VIDEO_BD;ARGO,CU ALLOY,T3.5,W3.5 1 SA
M1033 4301-000108 BATTERY-LI;3V,220mAH,BUTTON,20x3.2mm,NO 1 SA
M1036 0504-001157 TR-DIGITAL;DTA114YUA,PNP,200mW,10K/47K,U 1 SA
M3000 BA62-00445A HEAT SINK-CPU;PRAHA,Aluminum,T17,W128,L1 1 SA
M3000 BA62-00445B HEAT SINK-CPU;PRAHA,Aluminum,T17,W128,L1 1 SA
M3004 BA31-00051A FAN-CPU;MCF-915BM05,PRAHA,Plastic,-,- 1 SA
M3004 BA31-00051B FAN-CPU;BDB05405HB-7D92,PRAHA,Plastic,-, 1 SA
M4000 BA59-02036A MODEM;1456VQL-T3(INT-RoHS),56Kbps,Agere 1 SA
M4000 BA59-02037A MODEM;T60M951.07 LF,56Kbps,Agere 2 Chip, 1 SA
M9999 0403-001047 DIODE-ZENER;BZX84C12L,5%,225mW,SOT-23,TP 1 SA
M9999 0501-000465 TR-SMALL SIGNAL;MMBT3904,NPN,350mW,SOT-2 1 SA
M9999 0601-001402 LED;SMD,RED/Y-GRN,1.2X1.5MM,660/570NM,1. 1 SA
M9999 0601-002037 LED;SMD,BLUE,1.6x0.8x0.4mm,465/470nm,1.6 1 SA
M9999 0903-001439 IC-MICROCOMPUTER;H8S/2110B,16Bit,TQFP,10 1 SA
M9999 0904-002207 IC-MEMORY CONT.;216MEP6CLA14FG,FCBGA,120 1 SA
M9999 0904-002225 IC-BUS CONTROLLER;AU6371,LQFP,48P,7x7mm, 1 SA
M9999 0904-002230 IC-I/O CONTROLLER;SB600,FcBGA,549P,23x23 1 SA
M9999 1103-001333 IC-EEPROM;24C08A,1Kx8Bit,SOP,8P,5x4mm,-, 1 SA
M9999 1107-001646 IC-FLASH MEMORY;MX25L8005,8Mbit,8Mx1,SOP 1 SA
M9999 1203-002546 IC-POSI.FIXED REG.;MIC5258,SOT-23-5,5P,6 1 SA
M9999 1203-003765 IC-PWM CONTROLLER;SC486IMLTRT,MLP,24P,4x 1 SA
M9999 1203-004685 IC-PWM CONTROLLER;SC415,MLPQ,24P,4x4mm,P 1 SA
M9999 1203-004687 IC-PWM CONTROLLER;TPS51120,QFN,32P,5x5mm 1 SA
M9999 1205-002807 IC-SWITCH;R5538D001-TR-F,QFN,20P,4x4mm,P 1 SA
M9999 1205-002853 IC-CODEC;ALC262-GR,LQFP,48P,7x7mm,PLASTI 1 SA
5-8
- This Document can not be used without Samsung's authorization -
5. Exploded View and Part List
NP-R60X0B1/SEK
Location Part Number Parts Name & Specification Q'ty SA/SNA
M9999 1205-003090 IC-ETHERNET CONTROLLER;88E8039,QFN,64P,9 1 SA
M9999 1205-003157 IC-CLOCK GENERATOR;ICS951461,TSSOP,64P,1 1 SA
M9999 1209-001718 IC-SENSOR;EMC2102,QFN,28P,5x5mm,PLASTIC, 1 SA
M9999 2007-000309 R-CHIP;10ohm,5%,1/10W,TP,1608 1 SA
M9999 2007-000972 R-CHIP;5.1ohm,5%,1/4W,TP,3216 1 SA
M9999 2007-007382 R-CHIP;20Mohm,5%,1/10W,TP,1608 1 SA
M9999 2007-007441 R-CHIP;562ohm,1%,1/10W,TP,1608 1 SA
M9999 2007-008789 R-CHIP;0.001ohm,1%,1W,TP,6432 1 SA
M9999 2203-002487 C-CER,CHIP;4.7nF,10%,25V,X7R,1005 1 SA
M9999 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA
M9999 2203-006090 C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 1 SA
M9999 2203-006474 C-CER,CHIP;22000nF,20%,6.3V,X5R,2012 1 SA
M9999 2402-001120 C-POLYMER AL CHIP;330uF,0.2,6.3V,-,TP,7. 1 SA
M9999 3301-001772 BEAD-SMD;27ohm,1608,-,TP,30ohm/120MHz,48 1 SA
M9999 3404-001311 SWITCH-TACT;12VDC,50mA,100gf,6.0x6.0x5.0 1 SA
M9999 3701-001403 CONNECTOR-DSUB;15P,2R,FEMALE,ANGLE,NI 1 SA
M9999 3708-002166 CONNECTOR-FPC/FFC/PIC;25P,0.5mm,SMD-A,AU 1 SA
M9999 3708-002402 CONNECTOR-FPC/FFC/PIC;6P,1.0mm,SMD-A,SnB 1 SA
M9999 3709-001375 CONNECTOR-CARD EDGE;200P,0.6mm,SMD,AUF,S 1 SA
M9999 3709-001398 CONNECTOR-CARD EDGE;52P,0.8mm,SMD-A,AU,M 1 SA
M9999 3709-001459 CONNECTOR-CARD EDGE;200P,0.6mm,SMD-A,Au, 1 SA
M9999 3709-001489 CONNECTOR-CARD EDGE;200P,0.6mm,SMD-A,Au, 1 SA
M9999 3709-001491 CONNECTOR-CARD SLOT;26P,1.0mm,ANGLE,AU,E 1 SA
M9999 3709-001492 CONNECTOR-CARD SLOT;9P,2.5mm,SMD-A,Au,2 1 SA
M9999 3710-002133 SOCKET-BOARD TO BOARD;12P,2R,0.8mm,SMD-A 1 SA
M9999 3710-002468 CONNECTOR-HEADER;-,7+15P,1R,1.27mm,ANGLE 1 SA
M9999 3710-002498 SOCKET-BOARD TO CABLE;30P,2R,10mm,SMD-A, 1 SA
M9999 3711-000386 HEADER-BOARD TO CABLE;BOX,10P,1R,1.25MM, 1 SA
M9999 3711-000541 HEADER-BOARD TO CABLE;BOX,2P,1R,1.25mm,S 1 SA
M9999 3711-006059 HEADER-BATTERY;NOWALL,7P,1R,2.5,BATTERY, 1 SA
M9999 3711-006496 CONNECTOR-HEADER;NO WALL,26P,1R,1mm,SMD- 1 SA
M9999 3722-002132 JACK-DC POWER;3P,5.5mm,SN-P,BLK 1 SA
M9999 3722-002365 JACK-PHONE;6P,AUF,PINK 1 SA
M9999 3722-002382 JACK-USB;4P/2C,AUF,BLK,ANGLE-OFFSET,A TY 1 SA
M9999 3722-002416 JACK-PHONE;6P,AUF,LIME,ANGLE 1 SA
M9999 3722-002610 JACK-USB;4P,AU,BLK,DIP,A-TYPE 1 SA
5-9
- This Document can not be used without Samsung's authorization -
5. Exploded View and Part List
NP-R60X0B1/SEK
Location Part Number Parts Name & Specification Q'ty SA/SNA
M9999 4309-001020 BATTERY-HOLDER;COIN CELL,SPRING,25.4mm,2 1 SA
M9999 BA61-01060B BRACKET-SUPPORT_CPU;OSLO,AL,T1.5,W24,L43 1 SA
M9999 BA62-00389A INSULATION-MEMORY;SEDONA,PC,T0.2,W64,L30 1 SA
M9999 BA75-01937A UNIT-BRACKET_CPU;PALAU,SEC,SPCC,W50*L40* 1 SA
R0201 BA68-03931B LABEL-FRONT_R60;PRAHA,SEC,PC,0.3T,W24.8, 1 SA
T0001 BA75-01981A UNIT-HOUSING_TOP;PRAHA,SEC,PC+ABS,W354.8 1 SA
T0002 BA81-04203A UNIT-HOUSING_TOP-SVC;PRAHA,PC/ABS,W354.8 1 SA
T0005 BA68-02502A LABEL-INTEL_CELERON-M;CETUS,ALL,-,-,W19. 1 SA
T0005 BA68-03685A LABEL-LOGO_VISTA-BASIC;N/P ALL,VISTA BAS 1 SA
T0005 BA68-03914A LABEL-ATI;PALAU,ATI,POLY C/B,T0.1,W16.1, 1 SA
T0005 BA68-04034A LABEL-ZAIGEN;PRAHA,ENG,PET,-,W100,L60mm, 1 SA
T0010 BA75-01946A UNIT-CAP_TOP;PRAHA,SEC,PC+ABS,W300.3*L61 1 SA
T0101 BA59-02145A BOARD-TOUCHPAD;ACCORDION,TM-01020-003,BO 1 SA
T0302 BA41-00802A FFC-TOUCHPAD;PRAHA,1.0,FILM,6PIN,T0.3mm, 1 SA
T0407 BA81-03803A INSULATOR-TOUCHPAD_TOP;ACCORDION,PC,W70. 1 SA
T0408 BA81-03896A SHIELD-TOUCHPAD;PRAHA,AL,W7.0*L65.7*T0.1 1 SA
T2001 BA96-03296A ASSY SPEAKER;PRAHA,P18CEG04SH2,180/465mm 1 SA
W3017 BA39-00485A WIRE HARNESS-MODEM;CICHLID2,UL1571,-,2P, 1 SA
W4001 6001-001625 SCREW-MACHINE;BH,+,-,M2.6,L8,ZPC(BLK),SW 2 SA
W4002 6001-000730 SCREW-MACHINE;CH,+,-,M2,L7,ZPC(BLK),SWRC 2 SA
W4002 6001-001406 SCREW-MACHINE;CH,+,M2.0,L6.0,NI PLT,SWRC 2 SA
W4002 6001-001480 SCREW-MACHINE;CH,+,M3,L4.0,ZPC(BLK),SWRC 2 SA
W4002 6001-001570 SCREW-MACHINE;CH,+,-,M2,L4,ZPC(BLK),SWRC 1 SA
W4011 BA81-04210A TAPE-SPEAKER;PRAHA,TESA,W20.0*L22.0*T0.1 2 SA
5-10
4
SAMSUNG PROPRIETARY
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
4
PRAHA (SRI)
CPU :
Chip Set :
Remarks :
Model Name : PBA Name :
PCB Code :
Dev. Step :
T.R. Date :
DRAW
3
3
Intel Merom (800MHz)
RS600ME & SB600
Mobility Platform
PRAHA MAIN
TPT : BA41-00791A GCE : BA41-00792A NAN : BA41-00811A
MP1.0 (8-Layer)
Samsung
1.0Revision :
2007.07.02
CHECK
APPROVAL
2
2
1
1
Table of Contents
Sheet 1. COVER Sheet 2-6. DIAGRAM (Block/Power) & ANNOTATIONS Sheet 7. CLOCK GENERATOR Sheet 8-10. Merom 800 Sheet 11. THERMAL SENSOR / FAN CONTROL Sheet 12-16. RS600ME Sheet17. DDR II SODIMM Sheet18. DDR II TERMINATION Sheet19-22. SB600 Sheet23. SB600 STRAPS Sheet24. SPI ROM & DEBUG CARD CONN Sheet25. LCD Sheet26. CRT Sheet27. EXPRESS CARD Sheet28. 2 IN 1 Sheet29. MINICARD Sheet30-32. AUDIO Sheet33. HDD(SATA) & ODD(IDE) Sheet34. MICOM Sheet35. LOM WITH COMBO Sheet36. USB & MDC Sheet37. LED & BLUETOOTH & TOUCHPAD & KEYBOARD & LID S/W Sheet38. CHARGER Sheet39. P3.3V_AUX & P5.0V_AUX Sheet40. P1.2V & P1.2V_AUX & VCCP Sheet41. DDR2 POWER Sheet42. CPU VRM Sheet43. P1.5V POWER & SWITCHED POWER & MICOM RESET Sheet44. ICT PORT Sheet45. POWER DRAW & MOUNT HOLE Sheet46-48. TP
D
D
C
C
B
B
Owner :
4
4
Confidential
SEC Mobile R & D Signature :
USE ICT PORT
A
A
X
3
3
2
2
1
1
SAMSUNG
ELECTRONICS
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D
4
Wireless LAN
Mini Card
PG 29
ANT
Express Card
C
PG 27
PG 30
AUDIO
Audio
B
AMP
PG 31
AZALIA
Codec
ALC260
HP
PG 32
MIC-IN
PG 30
3
PG 26
CRT
CRT
PG 25
LCD
LVDS
FAN
PG 11
CPU
Thermal
Sensor
30P
1ch
PG 11
PCI Express
Mobile Processor
MEROM
(800MHz)
L2 Cache : 2 MB, 4MB 478pin
PG 8, 9,10
North Bridge
IMVP-6
Channel A
Channel B
RS600ME
PCI Express
Internal Graphics
Clocking
CK-410 for ATI
64 PIN
PG 7
USB 1
PG 39
USB 0,8,9
4P
PG 31
RJ11
PG 35
PG 33
ANT
Bluetooth
PG 37
Samsung
12P
AZALIA
MDC 1.5
PG 36
Confidential
HDD
USB 0,8,9
USB 5
AZALIA Primary
AZALIA Secondary
SATA
707 FCBGA
PG 12 ~ 16
4-Lane A-Link Express
South Bridge
SB600
564 BGA
PG 19 ~ 22
PCI Express
USB 4
CPU VRM
PG 42
2
DDR II 667/533
3.3V LPC, 33MHz
System
Connector
DC/DC
DDR II SODIMM 0
DDR II SODIMM 1
PG 17
PG 17
Charging
Circuit
PG 38
DDR II
VRM
PG 41
10/100 LOM
88E8039
PG 35
2 IN 1
AU6371
PG 28
SPI ROM
PG 24
MICOM
Hitachi H8S
2110B
PG 34
1
Switched PWR
PG 43
RJ45 PG 35
SD/MMC
PG 37
Touch
PAD
KBD
PG 37
D
C
PG 28
B
SPKR R
PG 33
A
SPKR L
4
ODD
3
PATA
A
SAMSUNG
ELECTRONICS
2
1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
34
2
Power Diagram
1
D D
AC Adapter
KBC3_SUSPWRON
VDC
Battery DC
C
P12.0V_ALW
P5.0V_ALW
MICOM_P3.3V
P1.2V_ALW
P1.8V_AUX P1.8V
P1.2V_AUX
P3.3V_AUX
KBC3_PWRON
P0.9V
P5.0VP5.0V_AUX
P3.3V
KBC3_VRON
CPU
P1.05V
P1.2V
NB SB
(VCCP)
P1.2V_PWRGD
VCC_CORE
CPU
Samsung
B
P2.5V_LAN
P1.5V
C
B
P1.2V_LAN
Rail
State
OFFONONS4
LOFFOFFONS5
A
4
VRON
PWRONSUSPWR+V+V*AUX+V*Always
HHONONONFull On LHOFFONONS3 LH L
S5 / S4
H L L L
Confidential
MEM1_REF
S0S3
A
SAMSUNG
ELECTRONICS
3
2 1
D
C
B
A
POWER
S/W
5
4
P12.0V_ALW
3) MICOM_P3.3V
KBC
5)KBC3_PWRSW#
88E8039
Sheet 35
4
MMBT3904
Sheet43
RHU002N06
(KBC3_RST#)
Sheet43
19
17
8
10
6
Sheet34
P5.0V_AUX & P3.3V_AUX
TPS51120
Sheet39
7) P3.3V_AUX
LOM
21-1) PEX3_RST#
P1.2V_ALW
MIC5258-1.2
Sheet43
AP4435GM
Sheet38
3
MICOM_P3.3V & P5V_ALW
TPS51120
Sheet39
18) VRM3_CPU_PWRGD
19) KBC3_PWRGD
17) CLK3_PWRGD#
9) CHP3_SLPS5#/S3#
8) KBC3_RSMRST#
7) P3.3V_AUX
10) KBC3_PWRON
11) P5.0V
6) KBC3_SUSPWRON
21-1) PLT3_RSTF#
18) KBC3_NBPWRGD
4) P1.2V_ALW
P1.2V_AUX
SI3456
Sheet43
V5FILT
6) KBC3_SUSPWRON
7) P5.0V_AUX
(2/2)
7) P3.3V_AUX
7
7-1) P1.2V_LAN
7-1) P2.5V_LAN
MICOM_P3.3V
VDC
(1/2)
10-1) KBC3_VRON
7-1) P1.2V_AUX
BCP69-16
Sheet 35
BCP69-16
Sheet 35
3
4
4) P1.2V_ALW
2
2) VDC
V5FILT
Battery
Sheet 19
Samsung
Confidential
POWER SEQUENCE
RTC
3
1
1) PRTC_BAT
3) MICOM_P3.3V
7) P3.3V_AUX
11) P5.0V
7-1) P1.2V_AUX
7) P5.0V_AUX
10-1) KBC3_VRON
10) KBC3_PWRON
MICOM_P3.3V
9
SB600
P1.2V & VCCP
SC415
Sheet 43
DDR2 POWER
SC486
Sheet 41
10) KBC3_PWRON
7) P3.3V_AUX
4) P1.2V_ALW
20 21
SB
Sheet 20-23
12
13
7) P5.0V_AUX
10) KBC3_PWRON
7) P3.3V_AUX
10) PWRON#
7) P1.8V_AUX
10) PWRON#
MIC5219B
Sheet 44
20) CPU1_PWRGDCPU
21) CHP3_ALINK_RST#
21)PEX3_RST#_CTRL
12) VCCP
11) P3.3V
12) P1.2V
21-1) PLT3_RSTF#
12) P1.2V
12) VCCP(1.05V)
13) P1.2V_PWRGD
11) P5.0V
11) 0.9V
7) MEM1_REF
7) P1.8V_AUX
2
Rev. 0.1
11) P1.5V
18
AP4435GM
Sheet 43
AP6680AGM
Sheet 43
AP680AGM
Sheet 43
2
CLOCK
CHIP
Sheet 8
17) CLK3_PWRGD#
18) VRM3_CPU_PWRGD
13) P1.2V_PWRGD
21-1) CHP3_NBRST#
21-1) PEX3_RST#
CPU VRM
Sheet 45
11) P5.0V
20) CPU1_PWRGDCPU
18) KBC3_NBPWRGD
21-2) CHP3_NBRST#
19) KBC3_PWRGD
21-1) PLT3_RSTF#
11
11) P5.0V 11-1) VDD_AUD
P12.0V_ALW
11) P3.3V
P12.0V_ALW
11) P1.8V
20-1) PEX3_RST#
20-1) PEX3_RST#
14
11) P1.5V
12) VCCP
11) P3.3V
11) P1.8V
7) P1.8V_AUX
12) VCCP
12) P1.2V
11) P5.0V
7) P3.3V_AUX
11) P3.3V
11) P3.3V
11) P0.9V
7) MEM1_REF
7) P1.8V_AUX
11) P3.3V
11) P3.3V
11) P3.3V
7) P3.3V_AUX
11) P1.5V
11) P3.3V
7) P3.3V_AUX
11) P1.5V
1
15
15) CLK3_PWRGD#11) P3.3V
16
16) Clock Running
15) CLK3_PWRGD#
14) VCC_CORE
CPU
Sheet 8-10
NB
RS600ME
Sheet 12 - 16
Thermal
Sensor
Sheet 11
2-in-1
Controller
Sheet 28
DDR2
Memory
Sheet 17 - 18
Audio Codec
Sheet 30
Express
Card
Sheet 27
Mini Card
WLAN
Sheet 29
1
D
22
C
22) CPU1_CPURST#
B
A
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
3
2
1
D
C
CLOCK GENERATOR
ICS951461 SLG84610
Samsung
B
CLK0_HCLK0 CLK0_HCLK0#
CLK0_HCLK1 CLK0_HCLK1#
CLK1_PCIEICH CLK1_PCIEICH#
CLK1_NBSRC CLK1_NBSRC#
CLK3_NB14M
CLK1_PCIERCLK CLK1_PCIERCLK#
CLK3_USB48
CLK3_ICH14
25MHz
(FOR SATA)
CLK1_PCIELOM CLK1_PCIELOM#
CLK1_MINIPCIEA CLK1_MINIPCIEA#
CPU
(YONAH/MEROM)
RS600ME
SB600
LAN Controller (88E8039)
MINI CARD
CLK1_AMCLK1 CLK1_AMCLK1# CLK1_AMCLK2
CLK1_AMCLK2# CLK1_BMCLK1
CLK1_BMCLK1# CLK1_BMCLK2
CLK1_BMCLK2#
SPI3_CLK
CLK3_PCLKMICOM
32.768KHz
(FOR RTC)
25MHz
SODIMM1
DDR2
CHANNEL A
SODIMM2
DDR2
CHANNEL B
SPI ROM
MICOM
10MHz
D
C
B
CLK1_EXPCARD CLK1_EXPCARD#
Confidential
14.318 MHz
A
4
3
Express CARD
2-in-1 (AU6371)
12MHz
A
SAMSUNG
ELECTRONICS
2
1
4
SAMSUNG PROPRIETARY
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
EXCEPT AS AUTHORIZED BY SAMSUNG.
SCHEMATIC ANNOTATIONS AND BOARD INFORMATION
D
D
4
3
3
2
2
1
1
D
D
PCI Devices
Devices
USB Hub to PCI LPC bridge/IDE/AC97/SMBUS Internal MAC AC Link
Voltage Rails
VDC VCC_CORE
C
C
B
B
VCCP
P0.9V P1.2V P1.5V P1.5V_AUX P1.8V P1.8V_AUX P1.8V_ALWS P2.5V_LAN
MICOM_P3.3V P3.3V P3.3V_AUX
P5V P5V_AUX
P5.0V_ALWS P12V_ALWS
2
I C / SMB Address
Devices SB600
SODIMM0 SODIMM1 CK-410 (Clock Generator)
USB PORT Assign
PORT NUMBER 0
1 4 5
IDSEL# AD30(internal)
AD31(internal) AD31(internal)
AD31(internal)
-
Primary DC system power supply (7 to 21V) Core voltage for YONAH (0~1.5V) YONAH Processor System Bus(PSB) Termination (1.05V)
0.9V switched power rail (off in S3-S5)
1.2V switched power rail (off in S3-S5)
1.5V switched power rail (off in S3-S5)
1.5V power rail (off in S4-S5)
1.8V switched power rail (off in S3-S5)
1.8V power rail(off in S4-S5)
1.8V power rail (Always On)
2.5V power rail (off in S4-S5)
3.3V always on power rail for MICOM
3.3V switched power rail (off in S3-S5)
3.3V power rail (off in S4-S5)
5.0V switched power rail (off in S3-S5)
5.0V power rail (off in S4-S5)
5.0V power rail (Always On) 12V power rail (Always On)
Address Master
1010 0100 1010 0110 1101 001x
REQ/GNT#
Hex
­A4h A6h D2h
ASSIGNED TO Left side USB Port
USB Express Card 2-in-1 Memory Card Bluetooth Rear side USB Port8, 9
Interrupts
TYPE USAGE Crystal
Crystal
Crystal Crystal
Crystal
FREQUENCY
32.768KHz 25MHz 10MHz
14.318MHz 25MHz
12MHzCrystal 2-in-1 2-in-1 (SD/MMC)
CPU Core Voltage Table
Active Mode
VID(6:0)
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0 1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
1
0
0
1
0
0 1
0
0
0
1
0
0
0
0
1
0
0
1
0
0
0
0
1
0
0
0
1
0
0
1
0
0
0
0
1
1
0
0
1
Samsung
Bus SMBUS Master
-
­Clock, Unused Clock Output Disable
Confidential
0 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1 1
0
1
0 0
1
0
1
0
1 1
0
1
0
1
DPRSLPVR DPRSTP* PSI2*
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1 0
0 0
0
0
0
0
0 0
0 0
0
0
0
0
0
0
0
1
0
0
0
1
0 0
1
1 01
0
1
1
0
1
1
0 1
1
1 1.4125 V
1
1
0
0
0
0
0
1
0
1
0 1
0
1
0
0
1 1
0
1
1
1
0
1
1
1
0
0
0
0
1
0
0
1
0
1
0
1
1
0
0
0
1
1
1
0
1
1
1
1
1
1 0
0
00
1
0
0
101.1750 V
0
0
1
0
0
0 0
1
1
1
1
0
1
1
1
0
0
0
1
0
0 0
0
1 1
0
1
0
1
0 1
1
0 1
1
0
1
1
1
1
10
Active 0 1 0 or 1
Voltage
1.5000 V
1.4875 V
1.4750 V 1
1.4625 V 1
1.4500 V
1.4375 V
1.4250 V 1
1.4000 V
1.3875 V
1.3750 V 1
1.3625 V
1.3500 V
1.3375 V
1.3250 V 1
1.3125 V
1.3000 V
1.2875 V
1.2750 V
1.2625 V
1.2500 V
1.2375 V
1.2250 V
1.2125 V
1.2000 V
1.1875 V
1.1625 V
1.1500 V
1.1375 V
1.1250 V
1.1125 V
1.1000 V
1.0875 V
1.0750 V
1.0625 V
1.0500 V
1.0375 V
1.0250 V
1.0125 V
Active/Deeper Sleep Dual Mode Region
VID(6:0)
0
0
1
0
1
0
0
0
0
0
1
0
0
1
0
0
0
0
0
1
0
1
1
0
1
1
0
1
0
1
1
0
1
1
0
1
1
0
1
0
1
1
0
1
1
1
0
1
0
1
1
1
0
1
0
1
1
0
1
1
0
1
1
1
0
1
1
0
1
0
0
1
0
0
1
0
0
1
0
1
0
0
0
1
0
1
0
0
1
0
0 0
0
1
0
0
1
0
1
0
1
0
0
1
0
0 0
1
0 0
1
0 0
1
0 0
1
1
1
DPRSLPVR DPRSTP* PSI2*
DEVICE SB600
SB600 MICOM CLOCK-Generator LAN
IMVP-6
0
0
1
0
1
0
1
1
0
1
0
1
10
1
0 0
1
1
1
1
1 1
1
1
1 0
0
0
0
0
0
0
0
1 1
0
0
1
0
0 0
0
1 1
0
1
0
1
1
0
0
1
0
0
1
0
110.7750 V
1
0
1
1 0
1
1
0
1
1
1
1
1
1
1
1 0
010.7000 V
0 0
0
0
1
0
0 0
1
0
010.6500 V
0
1
0
0
1
0
1
1
0
1
1 0
1
0 0
1
0
1
1
0
1
1
0
0
1
1
1
0
1
1
1
1
1
1
1
1
1 000
0
0
0
Deeper Slp 1 0 0 or 1
Real Time Clock SATA H8S-2110B CK-410M LOM
Deeper Sleep/Extended Deeper Sleep Dual Mode Region
VID(6:0)
Voltage
1
0
1.0000 V
0.9875 V
1 0
0.9750 V
0.9625 V
0.9500 V
0.9375 V
1 0
0.9250 V
0.9125 V
1
1
0.9000 V
0 1
0.8875 V
0
0.8750 V
0.8625 V
1
0.8500 V
0 1
0.8375 V
0
0.8250 V
1
0.8125 V
0
0.8000 V
1
0.7875 V 0 1
0.7625 V 0
0.7500 V
0.7375 V
1 0
0.7250 V
0.7125 V
1
1 0 1
0.6875 V
0.6750 V
0 1
0.6625 V 0 1
0.6375 V 0
0.6250 V 1
0.6125 V 0
0.6000 V
0.5875 V
1
0.5750 V
0
0.5625 V
1
0.5500 V
0
0.5375 V
1
0.5250 V
0
0.5125 V
1
0.5000 V
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1 1
1 1
1 1
1
1
1 1
1
1
1
1
1
1 1
1 1
1
1
1
1
1 1
1 1
1
1
1
*"1111111" : 0V power good asserted.
Crystal / Oscillator
Voltage
0
1
0
0
1
1
0 0
1
0
1
0
1
0
1 1
0 1
1
1
1 1
1
1
1
1
1 1
1
1
1
1
1 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
0
1
0 0
1
0
1
0
1
0
1
0
1 1
0
10
1 1
1 1
1
1
1 1
1
1
1 1
1 1
1
0.4875 V
0.4750 V
0
0
1
0
1
0.4625 V
1 0
0
1
0.4500 V
1
0.4375 V
0
1
0.4250 V
0
1
1
0.4125 V
1
1
1
0
0.4000 V
0
0
1
0
0
0.3875 V
1
0.3750 V
0
0
1
0.3625 V
0
1
0
1
0.3500 V
0
1
0
0.3375 V
1
1
0.3250 V
0
1
1
1
1
0.3125 V
0
0
0.3000 V
0
0.2875 V
0
0
1
0
0
1
0.2750 V
0.2625 V
0
1
1
0.2500 V
1
0
0
1
0
0.2375 V
0.2250 V
1
1
0 1
1
0.2125 V
1
1
0.2000 V1
0
0
0 1
0
0.1875 V
0
0.1750 V
1
0
0
1
0
1
0.1625 V
0
0
1
0.1500 V
0.1375 V
1
1
0
0.1250 V
1
0
1
1
1
0.1125 V
1
0.1000 V
0
0
0
0
0
1
0.0875 V
0
0.0750 V
0
1
1
1
0
0.0625 V
0
0
1
0.0500 V
0.0375 V
0
1
1
0.0250 V
0
1
1
1
1
1
0.0125 V
0
0
1
0
0.0000 V
0
0
1
0.0000 V
0.0000 V
0
0
1
0.0000 V
1
0
1
0.0000 V
0
0
1
0
1
1
0.0000 V
1
0.0000 V
1
0
1
1
1
0.0000 V
C
C
B
B
System Power States
A
A
CHP3_SLPS1* S1, Powered-On-Suspend(POS) : In this state, all clocks(except the 32.768KHz clock) are stopped.
CHP3_SLPS3* S3, Suspend-To-RAM(STR) : The system context is maintained in system DRAM, but power is shut off to non-critical circuits. CHP3_SLP4S* S4, Suspend-To-Disk(STD) : The Context of the system is maintained on the disk. All power is then shut off to the system except for the logic required to resume. CHP3_SLPS5* S5, Soft Off(SOFF) : System context is not maintained. All power is shut off except for the logic required to restart. A full boot is required when waking.
The system context is maintained in system DRAM. Power is maintained to PCI, the CPU, memory controller, memory, and all other criticial subsystems.
Note that this state does not preclude power being removed from non-essential devices, such as disk drives. During this state, CPU can be selected for either Deep Sleep or Deeper Sleep. In Deeper Sleep, CPU voltage reduced in this state to reduce the leakage power.
Memory is retained, and refreshes continue. All clocks stop except RTC clock. Externally appears same as S5, but may have different wake events.
4
4
3
3
*Yonah Processor (2.33 GHz / 800 MHz : TBD)
A
A
SAMSUNG
ELECTRONICS
2
2
1
1
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