Samsung Suzhou-D, NP-R423, NP-R425 Schematic
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D
4
SUZHOU-D
CPU :
Chip Set :
C
Remarks :
Model Name : Suzhou-D
PBA Name :
PCB Code :
B B
Dev. Step : PV
Revision :
T.R. Date :
Design CHECK APPROVAL
AMD Caspin
AMD RX881+SB710
Tigris Platform
MAIN
GCE :
NAN :
HAN :
Samsung
1.0
2009.11.10
Confidential
XIE BIN
A A
Owner :
4
SEC Mobile R & D
GUO LEI
BC LEE
Signature :
3
2
1
Table of Contents
Page.
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X
3
1
2
3Page.
4
5
6
7
8
9
10~12
13~15
16~17
18~22
23
24~27
28~29
30
31
32
33
34
35Page.
36~37
38
39
40
41
42
43
44
45
46
47
48
49
50~51
52
53
54
COVER
OPERATION BLOCK DIAGRAM
BOARD INFORMATION
POWER DIAGRAM
POWE RAILS ANALYSIS
TIMING DIAGRAM,POWER ON
CLOCK DISTRIBUTION
THERMAL SENSOR&FAN CONTROL
CLOCK GEN.
S1g3 CPU
RX881M
SODIMM DDR2
SB710
SPI_BIOS_ROM
PARK-S3
gDDR3
LVDS (LCD CONNECTOR)
CRT CONNECTOR
HDMI CONNECTOR
MICOM
KBD CONN & TOUCHPAD
LED LOGIC
AUDIO
LOM(Marvell 88E8040)
WLAN
MEMORY CARD (AU6336)
EXPRESS CARD
HDD & ODD
MDC CONN. & BLUETOOTH
USB CONNECTOR
SUB BOARD_POWER SWITCH
CHARGER
P3.3V_AUX & P5.0V_AUX & P12V_ALW
DDR2 POWER & P0.9V_AUX
CPU VRM
CHIPSET POWER(P1.1V & P1.2V)
GFX POWER
gDDR3 POWER & P1.0V
SWITCHED POWER
(P5.0V & P3.3V &P 2.5V & P1.8V & P1.2V_AUX)
55
POWER DISCHARGER
56Page. MOUNT HOLE
57Page. TEST POINT
DRAW
CHECK
APPROVAL
MODULE CODE
2
XIE BIN
GUO LEI
BC LEE
DATE
DEV. STEP
REV
LAST EDIT
08/18/2009
TITLE
ADV
0.1
Suzhou-D
MAIN
COVER
July 15, 2009 19:25:13 PM
1
SAMSUNG
ELECTRONICS
PART NO.
BA41-xxxxxxA
158
PAGE
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OF
D
C
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D
PG 32
PG 30
C C
PG 31
4
P5V_AUX
P3.3V_AUX
PG 47
HDMI
LCD
CRT
PG 30
P1.1V /
PG 50~51
P1.2V
HDMI
LCD
CRT
Clocking
GFX CORE
PG 52
Ext. PEG
PARK-S3
PG 18~21
PG 9
PEG x16
3
FAN
PG 8
CPU
Thermistor
PG 8
External Graphics
Mobile Processor
AMD Caspian CPU
(s1g3 socket)
636pin
PG 10~12
L2 Cache : 2M/1M/512K
HyperTansport Gen3
North Bridge
RX881
528 FCBGA
PG 13~15
PCIEXPRESS
X4
Channel A (Reverse)
Dual channel
Channel B (Reverse)
Lane 2
PCIE x1
Lane 0
PCIE x1
PCIE x1 Lane 1
2
DDR II 667/800
DDR II 667/800
CPU
VRM
PG 49 PG 53
Charging
Circuit
PG 46
DDR II
SODIMM 0
DDR II
SODIMM 1
52P
PG 16
PG 17
Smart
Battery
Module
P1.8V_AUX
P0.9V_AUX
DDR II Power
PG 48
8040
PG 38
Mini Card 1 (WLAN)
PG 39
Express Card
PG 41
1
RJ45
PG 38
ANT
D
eSATA
High Definition Audio
HDAUDIO
Camera
Audio
ALC269
PG 37
PG 36
RJ11
B
INT MIC
HP
MIC-IN
2P
2P
PG 36
SPKR R
A A
SPKR L
4
PG 42
PG 42
PG 29
SATA HDD
SATA ODD
MDC
Modem
PG 43
SPI ROM
12P
Samsung
Confidential
3
SATA4
USB 8
HD Primary
HD Secondary
SPI
SATA 0
SATA 1
SB710
528 BGA
PG 24 - 28
LPC
3.3V LPC, 33MHz
80 Port
PG 29
USB 4
USB 4
PG 33
USB 0,1,6
USB 5
MICOM
MEC1308-NU
TMKBC (TBD)
LED
2
PG 35
USB 0,1,6
Bluetooth
DRAW
CHECK
APPROVAL
MODULE CODE
Touch
PAD
KBD
PG 44,45
ANT
XIE BIN
GUO LEI
BC LEE
PG 34
PG 43
DATE
DEV. STEP
REV
LAST EDIT
08/18/2009
3 IN 1
AU6336
PG 40
ADV
0.1
TITLE
Suzhou-D
MAIN
BLOCK DIAGRAM
July 15, 2009 19:25:13 PM
SAMSUNG
ELECTRONICS
PART NO.
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OF
B
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D
4
SCHEMATIC ANNOTATIONS AND BOARD INFORMATION
3
2
1
BOARD INFORMATION
D
Voltage Rails
VDC
CPU_CORE0
CPU_CORE1
EGFX_CORE Core Voltage for GPU
P1.1V
P1.2V
P3.3V_MICOM
C
B
P1.5V
P1.8V_AUX
P3.3V
P3.3V_AUX
P5.0V
P5.0V_AUX
P5.0V_STB
P12.0V_ALW 12.0V always power rail
PORT # ASSIGNED TO
Primary DC system power supply (7 to 21V)
Core Voltage for CPU
Core Voltage for CPU
VTT for M92,RX881
Core Voltage for SB710
3.3V always power rail (for Micom)
1.5V switched power rail (off in S3-S5)
1.8V switched power rail (off in S3-S5)P1.8V
1.8V power rail for DDR (off in S4-S5)
0.9V power rail for DDR (off in S3-S5)P0.9V_AUX
3.3V switched power rail (off in S3-S5)
3.3V switched on power rail (off in S4-S5)
5.0V switched power rail (off in S3-S5)
5.0V switched on power rail (off in S4-S5)
5.0V always power rail
USB PORT Assign
SYSTEM PORT 0
0
SYSTEM PORT 1
1
NC
2
NC
3
3 IN 1
4
5
Bluetooth
SYSTEM PORT 2
6
NC
7
8
Camera
9
NC
EXPRESS CARD
10
Samsung
PCI Express Assign
ASSIGNED TO
PORT #
Mini Card (WLAN)
0
1
EXPRESS CARD
LOM
2
3
NC
4
NC
NC
5
Crystal / Oscillator
TYPE
Crystal
Crystal CLOCK-Generator
2
I C / SMB Address
Devices
SB710
CPU Thermal Sensor
SODIMM0
SODIMM1
CK-505M (Clock Generator) 1101 0010
FREQUENCY DEVICE
32.768KHz
10MHzCrystal MICOM
14.318MHz
25MHzCrystal
25MHzCrystal
Address
Master
0111 101x
1010 000x
1010 010x
0011 000x
0011 010x 34h
SB710
LAN 88E8040
SATA
Hex
7Ah
A0h
A4h
30hThermal Sensor on SODIMM0
D2h
USAGE
Real Time Clock
MEC1308-NU
CK-505
SB710
Bus
SMBUS Master
Thermal Sensor
-
-
-
-Thermal Sensor on SODIMM1
Clock, Unused Clock Output Disable
Confidential
REVISION HISTORY
LCD Pannel Detect
A A
Devices Resolution
4
(TBD)
PANNEL_DETECT_0(strap0)
3
See rev notes for more information.
DRAW
CHECK
APPROVAL
MODULE CODE
2
XIE BIN
GUO LEI
BC LEE
DATE
DEV. STEP
REV
LAST EDIT
08/18/2009
ADV
0.1
TITLE
BOARD INFORMATION
Suzhou-D
MAIN
July 15, 2009 19:25:13 PM
1
SAMSUNG
ELECTRONICS
PART NO.
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PAGE
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OF
C
B
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4 1
3
POWER DIAGRAM
2
Rev 0.1
D D
(CHP3_S4_STATE*)
KBC3_PWRON
(CHP3_SLPS3*)
KBC3_VRONKBC3_SUSPWR
AC Adapter
RX881
Battery DC
VDC
P1.8V_AUX
P5V_AUX
C C
P3.3V_MICOM
MICOM SB710
LED
P0.9V_AUX
P1.2V_AUX
P5.0V_STB
B
USB N Charger
Samsung
P3.3V_AUX
AMD S1G3
SODIMM (DDR II)
USB connector
DDR II-Termination
SB710
SB710
EXPRESS CARD
WLAN
LAN
MDC
THERMAL
LVDS
LED
P1.8V
P5.0V
EGFX_CORE
P1.0V
P1.5V
PARK
gDDR-3 for PARK
eSATA Reapter
AU6336
THERMAL
CRT
SB710
MICOM
ODD
HDD
TOUCH PAD
PARK
PARK
CK505
WLAN
EXPRESS CARD
HDMI
AUDIO
CAMERA
CPU_CORE0,1
P1.2V
P1.1V
S1G3
RX881
SB710
RX881
PARK
S1G3
P1.2V_LAN
LAN
P12.0V_ALW
P2.5V
S1G3
B
A
Power On/Off Table by S-state
Rail
S0
State
+V*A(LWS)
+V*LAN
+1.8V_AUX
+0.9V_AUX
+V*AUX
+V
+V* (CORE)
S3
ON
ON
ON
ON
ON
ON
ON
ON
4
S4ONS5
THERMAL
PARK
HDMI
WLAN
AUDIO
BT
08/18/2009
RX881
CRT
SB710
LEDS
EXPRESS CARD
AU6336
S0
TITLE
ADV
0.1
Suzhou-D
MAIN
POWER DIAGRAM
July 15, 2009 19:25:13 PM
SAMSUNG
ELECTRONICS
PART NO.
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A
OF
CK505
DDR2
XIE BIN
GUO LEI
BC LEE
LVDS
SPI
LAN
HDD
DATE
DEV. STEP
REV
LAST EDIT
Confidential
ON
S5-S4
3
S3
2
P3.3V
DRAW
CHECK
APPROVAL
MODULE CODE
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D
C C
B
4
220V
Adapter Battery
MICOM 3V ( TBD A )
1.8V ( TBD A )
1.2V_AUX ( TBD A )
3.3V_AUX ( TBD A )
CPU CORE ( TBD A )
1.8V_AUX ( TBD A )
1.5V ( TBD A )
1.1V ( TBD A )
3.3V ( TBD A )
5.0V ( TBD A )
1.2V ( TBD A )
0.9V_AUX( TBD A )
P3.3V_AUX
P1.2V_LAN
P1.8V_LAN
VDC INV ( TBD A )
VGA CORE (TBD A)
RTC_Battery
0.08 A (TBD)
0.29 A (TBD)
0.15 A (TBD)
LAN (88E8040)
CPU CORE
1.8V_AUX
1.2V
1.1V
1.8V
3.3V
1.2V
3.3V
3.3V_AUX
5V
1.2V_AUX
RTC_Battery
0.9-1.2V (EGFX CORE)
1.1V
1.8V
3.3V
1.8V_AUX
0.9V_AUX
1.8V
Samsung
3.3V (LCD 3V)
19V (VDC INV)
Confidential
3
POWER RAILS ANALYSIS
41 A (TBD)
4.5 A (TBD)
0.13 A (TBD)
7.7 A (TBD)
4.48 A (TBD)
3.79 A (TBD)
0.33 A (TBD)
1.13 A (TBD)
0.374 A (TBD)
0.209 A (TBD)
0.001 A (TBD)
0.001 A (TBD)
0.006 A (TBD)
17.75 A (TBD)
4.48 A (TBD)
6.53 A (TBD)
0.67 A (TBD)
3.1 A (TBD)
1 A (TBD)
3.1 A (TBD)
0.67 A (TBD)
0.5 A (TBD)
S1G3
( 35 W )
RX881
MCH
(8 - 8.5 W )
SB710
( ~ 2.0 W )
PEG
DDR-2
(Dual slots)
( ~ 5.0 W )
gDDR3
LCD
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
5V
5V
5V
5V
5V
5V
5V
0.75 A (TBD)
0.25 A (TBD)
0.2 A (TBD)
0.01 A (TBD)
0.015 A (TBD)
0.06 A (TBD)
0.07 A (TBD)
1.5 A (TBD)
0.22 A (TBD)
0.16 A (TBD)
1.5 A (TBD)
2 A (TBD)
0.2 A (TBD)
2
Rev. 0.6 (060920)
Thermal
Sensor
CLOCK
KeyBoard
KBD LED
SPI
HD Audio
SATA ODD
SATA HDD
FAN
Audio AMP
USB (x 3)
Touch Pad
MICOM 3V
3.3V
MICOM 3V
1.8V
3.3V
3.3V_AUX
3.3V_AUX
3.3V
3.3V
1.5V
1
0.08 A (TBD)
0.08 A (TBD)
0.1 A (TBD)
0.1 A (TBD)
0.6 A (TBD)
0.5 A (TBD)
0.5 A (TBD)
1.5 A (TBD)
0.75A (TBD)
KBC
PWR LED
SD Card
LAN
MDC
Bluetooth
Mini Card X 2
D
B
A
Value by Datasheet/Application notes
4
3
(Value by measurement)
DRAW
CHECK
APPROVAL
MODULE CODE
2
XIE BIN
GUO LEI
BC LEE
DATE
DEV. STEP
REV
LAST EDIT
08/18/2009
TITLE
ADV
0.1
Suzhou-D
MAIN
POWER RAILS ANALYSIS
July 15, 2009 19:25:13 PM
1
SAMSUNG
ELECTRONICS
PART NO.
BA41-xxxxxxA
558
PAGE
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826
A
OF
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
3
Timing Diagram, Power ON
Rev..1.0 2009-08-27
2
1
D
VDC
P12.0V_ALW
P5.0V_STB
P3.3V_MICOM
KBC3_RST#
KBC3_CHKPWRSW#
KBC3_SUSPWRON
P5.0V_AUX
C C
B
P3.3V_AUX
P1.8V_AUX
KBC3_RSMRST#
CHP3_SLPS5#
CHP3_SLPS3#
KBC3_PWRON
P5.0V
P3.3V
EGFX_CORE
P1.8V
P1.1V
KBC3_VRON
CPU_CORE
VRM3_CPU_PWRGD
Samsung
VDD_CPU_NB
P1.2V
KBC3_PWRGD
CPU1_CPUPWRGD
A_RST#
KBC3_CPURST#
CPU1_LDTRST*
120ms
740us
937.7us
9.4ms
19.05ms
126ms
126ms
103.5ms
538.9us
1.704ms
621.3us
2.212ms
1.243ms
170us
508.8us
631.4us
492.7us
791.6US
118.6ms
99.16ms
102.1ms
600.5ns
104.1ms
D
B
Confidential
A
DRAW
CHECK
APPROVAL
MODULE CODE
4
3
2
XIE BIN
GUO LEI
BC LEE
DATE
DEV. STEP
REV
LAST EDIT
08/18/2009
TITLE
Suzhou-D
ADV
0.1
MAIN
TIMING DIAGRAM
July 15, 2009 19:25:13 PM
1
SAMSUNG
ELECTRONICS
PART NO.
BA41-xxxxxxA
658
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A
OF
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
3
CLOCK DISTRIBUTION
2
1
P3.3V
D
PD*
1
200 MHz
CLK0_HCLK0/0#
CPU
667/800 MHz
667/800MHz
667/800 MHz
667/800 MHz
CLK1_MCLK0/0#
CLK1_MCLK1/1#
CLK1_MCLK2/2#
CLK1_MCLK3/3#
SODIMM #0
SODIMM #1
HT Gen3
MUX
Main PLL
SSC
100 MHz
100 MHz
CLK0_HTT/HTT#
CLK3_NBGFX/GFX#
HPLL
MPLL
RX881
100 MHz (SRC0)
C C
PLL3
SSC
48MHz PLL
B
SLG8SP628VTR
MUX
100 MHz
27MHz CLK3_GFX_27M
100 MHz (SRC 1,2,3)
MUX
CLK1_PEG/PEG#
CLK3_GFX_27M_SS
Samsung
CLK1_SBLINK/SBLINK#
AMD PARK-S3
CLK1_SBSRC/SBSRC#100 MHz (SRC 4)
CLK3_USB4848 MHz
CLK3_ICH1414.318 MHz
CLK3_PCLKICH33 MHz
PEG
X16
DPLLA
DPLLB
PCIEXPRESS X4
PCIEPLL
USBPLL
SATAPLL
32.768 KHz
OSC
MCH
SB710
HDA3_AUD_BCLK
HD 24 MHz
100 MHz (SRC 2)
100 MHz (SRC 1)
100 MHz (SRC 3)
HD Audio
MIN3_CLKREQ#
CLK1_MINIPCIE/PCIE#
LOM3_CLKREQ#
CLK1_PCIELOM/LOM#
EXP3_CLKREQ*#
CLK1_EXPCARD/CARD#
MINI PCIE
CARD 1
PCIE LAN
(Marvell)
25 MHz
EXPRESS CARD
D
B
33 MHz
Buffer
14 MHz
A A
OSC
Confidential
SPI
PORT 80
SPI3_CLK17.86 MHz
33 MHz CLK3_DBGLPC
RTC Clock
32.768 KHz
14.318 MHz
4
3
HDA3_MDC_BCLK
HDA3_HDMI_BCLK
33 MHz CLK3_PCLKMICOM
DRAW
CHECK
APPROVAL
MODULE CODE
2
XIE BIN
GUO LEI
BC LEE
MDC
HDMI
KBC
DATE
DEV. STEP
REV
LAST EDIT
08/18/2009
ADV
0.1
32.768 KHz
TITLE
CLOCK DISTRIBUTION
Suzhou-D
MAIN
July 15, 2009 19:25:13 PM
1
SAMSUNG
ELECTRONICS
PART NO.
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4 1
3
2
THERMAL SENSOR & FAN CONTROL
D D
P3.3V_AUX
R76
49.9
C92
100nF
10V
TH_TRIP_SET_R_MN
1%
U5
EMC2112-BP-TR
TH_VDD_3V_R_MN
1
VDD_3V
16
VDD_5V_1
19
VDD_5V_2
9
RESET#
17
FAN_1
18
FAN_2
20
TACH
10
ADDR_SEL
6
SHDN_SEL
7
TRIP_SET
1209-001887
5.5V
C85
10000nF-X5R
6.3V
3
SMDATA
SMCLK
ALERT#
SYS_SHDN#
DN1
DP1
DP3_DN2
DN3_DP2
CLK
GND
THERMAL_PAD
SMBUS Address 7Ah
P3.3V
R72
10K
1%
Line Width = 20 mil
nostuff
C86
C94
10000nF-X5R
100nF
6.3V
10V
C C
P3.3V_AUX
SMT3
B B
C88
10000nF-X5R
6.3V
FAN5_VDD CPU2_THERMDA
FAN3_FDBACK#
R65
0
TH_SHDN_SEL_R_MN
R66
1.5K
1%
95 degree C
0-1005
Samsung
FAN5_VDD
FAN3_FDBACK#
Confidential
SHDN_SEL MODE
0
HIGH Z
A
1
CH1(CPU MODE)
CH3(DIODE MODE)
N/A (SHDN# NOT USED)
4
14
15
12
8
2
3
TH_DP3_DN2_S_MN
4
5
TH_DN3_DP2_S_MN
11
13
21
J2
HDR-4P-1R-SMD
1
2
3
4
5
MNT1
6
MNT2
3711-000456
P3.3VP5.0V
1%
10K
10K 1%
R77
R78
P3.3V_AUX
1%10K
R68
C91
50V
2.2nF
C72
50V
2.2nF
10K 1%
R67
1
CPU1_THRMTRIP#
KBC3_THERM_SMDATA
KBC3_THERM_SMCLK
CPU2_THERMDC
3
Q3
MMBT3904
40V
2
2
4700nF-X5R
C1512
DRAW
CHECK
APPROVAL
MODULE CODE
2
1
3
3
1
40V
2
C71
2.2nF
50V
Place between CPU & GPU
P1.8V
R43
2K
1%
25V25V
4700nF-X5R
C1513
40V
MMBT3904
Q522
Q4
MMBT3904
XIE BIN
GUO LEI
BC LEE
DATE
DEV. STEP
REV
LAST EDIT
THM3_ALERT#
THM3_STP#
0
R64
0
R63
CHP3_THRMTRIP#
TITLE
08/18/2009
ADV
0.1
GFX3_THERMDN
GFX3_THERMDP
Suzhou-D
THERMAL SENSOR
EMC2112
July 15, 2009 19:25:13 PM
SAMSUNG
ELECTRONICS
PART NO.
BA41-xxxxxxA
PAGE OF
1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826
588
A
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
3
P3.3V
P1.5V
2
CK_CLOCK_AMD
1
B523
D D
BLM18PG181SN1
nostuff
10V
10V
10V
P3.3V
B522
BLM18PG181SN1
AMD used : 600ohm,500mA
10V
10V
2200nF-X5R
C893
VDD_REF
R762
1
2801-004518
Y501
14.31818MHz
50V
10V
100nF
C924
1M
2
2200nF-X5R
VDD_48
C892
C C
SMB3_CLK
SMB3_DATA
C950
0.033nF
10V
100nF
C927
1%
10V
100nF
C921
nostuff
C951
0.033nF
50V
10V
100nF
C887
10V
100nF
C889
B
Place 14.318MHz within
500mils of CK-505
100nF
C929
10V
10V
10V
100nF
100nF
100nF
C922
C894
C925
For PI
LOM3_CLKREQ#
MIN3_CLKREQ#
EXP3_CLKREQ#
Samsung
10V
100nF
C926
100nF
C923
C895
100nF
C888
6.3V
20%
22000nF-X5R
nostuff
10V
10V
6.3V 20%
22000nF-X5R
100nF
100nF
C890
C891
C896
CK_VDD_SB_SRC_IO_B_MN
CK_VDD_SB_SRC_IO_B_MN
CK_VDD_SB_SRC_IO_B_MN
CK_VDD_SB_SRC_IO_B_MN
CK_VDD_SB_SRC_IO_B_MN
8.2K
8.2K 5%
R754
R758
CK_XTAL_OUT_C_MN
CK_VDD_REF_B_MN
CK_XTAL_IN_C_MN
CK_PD#_R_MN
U509
SLG8SP628VTR
56
VDD_REF
60
VSS_REF
17
VDD_SRC_IO_1
11
VDD_SRC_IO_0
47
VDD_CPU_IO
25
VDD_ATIG_IO
34
VDD_SB_SRC_IO
63
VDD_48
26
VDD_ATIG
48
VDD_CPU
4
VDD_DOT
55
VDD_HTT
40
VDD_SATA
35
VDD_SB_SRC
16
VDD_SRC
2
SCL
3
SDA
61
XTAL_IN
62
XTAL_OUT
51
PD#
23
CLKREQ_0#
45
CLKREQ_1#
44
CLKREQ_2#
39
CLKREQ_3#
38
CLKREQ_4#
1
VSS_48M
24
VSS_ATIG
46
VSS_CPU
7
VSS_DOT
52
VSS_HTT
43
VSS_SATA
33
VSS_SB_SRC
18
VSS_SRC_1
10
VSS_SRC_0
1205-003515
3.465V
This part is 64pin QFN package.
Confidential
CLK REQ
CLK REQ 0
CLK REQ 1
A
CLK REQ 3
CLK REQ 4
4
DEVICE
LOM3_CLKREQ#
MIN3_CLKREQ#CLK REQ 2
EXP3_CLKREQ#
-
SRC PORT
SB Link
LOM
MINI CARD
EXP CARD
SB_SRC
3
B529
BLM18PG181SN1
AMD used : 600ohm,500mA
CPU_K8_0
CPU_K8_0#
ATIGCLK_1
ATIGCLK_1#
ATIGCLK_0
ATIGCLK_0#
SB_SRC_1
SB_SRC_1#
SB_SRC_0
SB_SRC_0#
SRC_7_27M_SS
SRC_7#_27M
SRC_6_SATA
SRC_6#_SATA#
SRC_4
SRC_4#
SRC_3
SRC_3#
SRC_2
SRC_2#
SRC_1
SRC_1#
SRC_0
SRC_0#
HTT_0#_66M_1
HTT_0_66M_0
48MHZ_0
REF_0_SEL_HTT66
REF_1_SEL_SATA
REF_2_SEL_27
THERMAL
P3.3V
1%10K
1%10K
nostuff
nostuff
10K 1%
R779
R780
R777
50
49
28
27
30
29
CK_SB_SRC_1_R_MN
32
CK_SB_SRC_1#_R_MN
31
CK_SB_SRC_0_R_MN
37
CK_SB_SRC_0#_R_MN
36
CK_SRC_7_27M_SS_R_MN
6
CK_SRC_7#_27M_R_MN
5
CK_SRC_6_SATA_R_MN
42
CK_SRC_6#_SATA#_R_MN
41
9
8
13
12
15
14
20
19
22
21
53
54
CK_48MHZ_0_R_MN
64
CK_REF_0_SEL_HTT66_R_MN
59
CK_REF_1_SEL_SATA_R_MN
58
CK_REF_2_SEL_27_R_MN
57
65
1%10K
10K 1%
10K 1%
R761
R759
R760
nostuff
2
10K 1%
R725
R726
R757
R724
R763
R764
R755
R756
R766
R765
R778
C928
0.01nF
0.5pF
50V
DRAW
CHECK
APPROVAL
MODULE CODE
10K 1%
22.6 1%
22.6
10K 1%
33 1%
33
nostuff
1%10K
1%10K
1%
1%10K
1%33
1%
C949
0.022nF
50V
CLK0_HCLK0
CLK0_HCLK0#
CLK1_PEG
CLK1_PEG#
CLK1_NBGFX
CLK1_NBGFX#
CLK3_GFX_27M_SS
CLK3_GFX_27M
CLK1_SBSRC
CLK1_SBSRC#
CLK1_EXPCARD
CLK1_EXPCARD#
CLK1_MINIPCIE
CLK1_MINIPCIE#
CLK1_PCIELOM
CLK1_PCIELOM#
CLK1_SBLINK
CLK1_SBLINK#
CLK0_HTT#
CLK0_HTT
CLK3_MMC48
CLK3_USB48
CLK3_SB14
SEL_HTT66
SEL_SATA
SEL_27M
DATE
XIE BIN
DEV. STEP
GUO LEI
REV
BC LEE
LAST EDIT
08/18/2009
100MHz
27MHz
SB710 : 1.1V (OSC_14MHz)
1
(Pin 59)
(Pin 58)
(Pin 57)
TITLE
ADV
0.1
66MHz 3.3V single HTT clock
0 *
100MHz differential clock
SRC6 diff. clock
1
100MHz spreading diff. clock
0 *
1*
27MHz/27MHz_SS graphics clock
SRC7 diff. clock
0
Suzhou-D
Main_Clock_Circuit
CK for AMD CPU
July 15, 2009 19:25:13 PM
1
SAMSUNG
ELECTRONICS
PART NO.
BA41-xxxxxxA
958
PAGE
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OF
B
A
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
3
CPU_Caspian
12
D
P1.2V
U7-1
47296-6111
D1
VLDT_A0
D2
D3
CPU1_HTIN(15:0) CPU1_HTOUT(15:0)
C C
CPU1_HTIN#(15:0)
CPU1_CLKIN_0
CPU1_CLKIN_1
CPU1_CLKIN_0#
CPU1_CLKIN_1#
CPU1_CTLIN_0
CPU1_CTLIN_1
B
CPU1_CTLIN_0#
CPU1_CTLIN_1#
D4
0
E3
E1
2
G3
3
G1
4
J1
5
L3
6
L1
7
N3
8
E5
9
F3
10
G5
11
H3
12
K3
13
L5
14
M3
15
N5
0
E2
1
F1
2
G2
3
H1
4
K1
5
L2
6
M1
7
N2
8
F5
9
F4
10
H5
11
H4
12
K4
13
M5
14
M4
15
P5
J3
J5
J2
K5
N1
P3
P1
P4
3704-001228
VLDT_A1
VLDT_A2
VLDT_A3
L0_CADIN_H0
L0_CADIN_H1
L0_CADIN_H2
L0_CADIN_H3
L0_CADIN_H4
L0_CADIN_H5
L0_CADIN_H6
L0_CADIN_H7
L0_CADIN_H8
L0_CADIN_H9
L0_CADIN_H10
L0_CADIN_H11
L0_CADIN_H12
L0_CADIN_H13
L0_CADIN_H14
L0_CADIN_H15
L0_CADIN_L0
L0_CADIN_L1
L0_CADIN_L2
L0_CADIN_L3
L0_CADIN_L4
L0_CADIN_L5
L0_CADIN_L6
L0_CADIN_L7
L0_CADIN_L8
L0_CADIN_L9
L0_CADIN_L10
L0_CADIN_L11
L0_CADIN_L12
L0_CADIN_L13
L0_CADIN_L14
L0_CADIN_L15
L0_CLKIN_H0
L0_CLKIN_H1
L0_CLKIN_L0
L0_CLKIN_L1
L0_CTLIN_H0
L0_CTLIN_H1
L0_CTLIN_L0
L0_CTLIN_L1
HT LINK
VLDT_B0
VLDT_B1
VLDT_B2
VLDT_B3
L0_CADOUT_H0
L0_CADOUT_H1
L0_CADOUT_H2
L0_CADOUT_H3
L0_CADOUT_H4
L0_CADOUT_H5
L0_CADOUT_H6
L0_CADOUT_H7
L0_CADOUT_H8
L0_CADOUT_H9
L0_CADOUT_H10
L0_CADOUT_H11
L0_CADOUT_H12
L0_CADOUT_H13
L0_CADOUT_H14
L0_CADOUT_H15
L0_CADOUT_L0
L0_CADOUT_L1
L0_CADOUT_L2
L0_CADOUT_L3
L0_CADOUT_L4
L0_CADOUT_L5
L0_CADOUT_L6
L0_CADOUT_L7
L0_CADOUT_L8
L0_CADOUT_L9
L0_CADOUT_L10
L0_CADOUT_L11
L0_CADOUT_L12
L0_CADOUT_L13
L0_CADOUT_L14
L0_CADOUT_L15
L0_CLKOUT_H0
L0_CLKOUT_H1
L0_CLKOUT_L0
L0_CLKOUT_L1
L0_CTLOUT_H0
L0_CTLOUT_H1
L0_CTLOUT_L0
L0_CTLOUT_L1
P1.2V
1 / 5
AE2
AE3
AE4
AE5
0
AD1
11
AC2
2
AB1
3
AA2
4
W2
5
V1
6
U2
7
T1
8
AD4
9
AD5
10
AB4
11
AB5
12
Y5
13
V4
14
V5
15
T4
AC1
AC3
AA1
AA3
W3
U1
U3
R1
AD3
AC5
AB3
AA5
W5
V3
U5
T3
Y1
Y4
W1
Y3
R2
T5
Samsung
R3
R5
0
1
2
3
4
5
6
7
8
9
11
12
13
14
15
CPU1_CLKOUT_0
CPU1_CLKOUT_1
CPU1_CLKOUT_0#
CPU1_CLKOUT_1#
CPU1_CTLOUT_0
CPU1_CTLOUT_1
CPU1_CTLOUT_0#
CPU1_CTLOUT_1#
CPU1_HTOUT#(15:0)
CPU Socket : 0185482000 (3704-001228)
P2.5V
B12
BLM18PG181SN1
CLK0_HCLK0
CLK0_HCLK0#
nostuff
nostuff
nostuff
nostuff
nostuff
C129
4700nF-X5R
25V
P1.2V
P1.8V_AUX
P1.8V_AUX
C769
C770
R672
R673
R671
R670
C131
C132
220nF
3.3nF
10V
50V
2012
50V
3.9nF
2012
3.9nF 50V
CPU1_LDTRST#
CPU1_PWRGDCPU
CPU1_LDTSTP#
CPU1_ALERT#
R630
R629
CPU1_VDD_FB
CPU1_VDD_FB#
R50
R46
R51
R49
R53
R52
R54
SHORT501
1608
CPU1_SIC
CPU1_SID
44.2
1%
1%
44.2
301
1%
301
1%
1%
301
499
1%
499
1%
1%10301
1%
301
1%
301
1%
301
1%
301
1%
301
0
C130
100nF
10V
CPU_VDDA1_B_MN
R692
CPU_CLKIN_H_C_MN
169
CPU_CLKIN_L_C_MN
1%
CPU_HT_REF0_R_MN
CPU_HT_REF1_R_MN
CPU_TEST23_R_MN
CPU_TEST18_R_MN
CPU_TEST19_R_MN
CPU_TEST25_H_R_MN
CPU_TEST25_L_R_MN
CPU_TEST21_R_MN
CPU_TEST20_R_MN
CPU_TEST24_R_MN
CPU_TEST22_R_MN
CPU_TEST12_R_MN
CPU_TEST27_R_MN
CPU_TEST9_R_MN
AF4
AF5
AE6
AB6
G10
AA9
AC9
AD9
AF9
AD7
H10
AB8
AF7
AE7
AE8
AC8
AF8
AA6
F8
F9
A9
A8
B7
A7
F10
C6
R6
P6
F6
E6
Y6
G9
E9
E8
C2
A3
A5
B3
B5
C1
U7-4
47296-6111
VDDA1
VDDA2
CLKIN_H
CLKIN_L
RESET_L
PWROK
LDTSTOP_L
LDTREQ_L
SIC
SID
ALERT_L
HT_REF0
HT_REF1
VDD0_FB_H
VDD0_FB_L
VDD1_FB_H
VDD1_FB_L
DBRDY
TMS
TCK
TRST_L
TDI
TEST23
TEST18
TEST19
TEST25_H
TEST25_L
TEST21
TEST20
TEST24
TEST22
TEST12
TEST27
TEST9
TEST6
RSVD1
RSVD2
RSVD3
RSVD4
RSVD5
3704-001228
4 / 5
KEY1
KEY2
SVC
SVD
THERMTRIP_L
PROCHOT_L
MEMHOT_L
THERMDC
THERMDA
VDDIO_FB_H
VDDIO_FB_L
VDDNB_FB_H
VDDNB_FB_L
DBREQ_L
TDO
TEST28_H
TEST28_L
TEST17
TEST16
TEST15
TEST14
TEST7
TEST10
TEST8
TEST29_H
TEST29_L
RSVD10
RSVD9
RSVD8
RSVD7
RSVD6
M11
W18
A6
A4
AF6
AC7
AA8
CPU_MEMHOT_L_R_MN
W7
W8
W9
Y9
H6
G6
R675
E10
CPU_DBREQ_L_R_MN
AE9
J7
H8
D7
E7
CPU_TEST15_R_MN
F7
CPU_TEST14_R_MN
C7
C3
CPU_TEST10_R_MN
K8
C4
C9
C8
H18
H19
AA7
D5
C5
P1.8V_AUX
1%
1%
1%
301
301
301
R45
R62
R628
CPU2_THERMDC
CPU2_THERMDA
CPU1_VDDIO_FB
CPU1_VDDIO_FB#
CPU1_VDDNB_FB
CPU1_VDDNB_FB#
P1.8V
301
1%
nostuff
nostuff
CPU1_SVC
CPU1_SVD
CPU1_THRMTRIP#
CPU1_PROCHOT#
301
R669
301
R690
301
R667
1%
P1.2V
1%
1%
P1.8V
1%
1K
08/18/2009
R687
R691
R689
R674
1%
301
1%
301
1%
301
P1.8V_AUX
390
R47
390
R48
1K
R44
nostuff
TITLE
Suzhou-D
ADV
0.1
Caspian CPU
S1G3 CPU (1/3)
July 15, 2009 19:25:13 PM
1
SAMSUNG
ELECTRONICS
PART NO.
BA41-xxxxxxA
10
PAGE
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826
58
OF
CPU1_LDTREQ#
CPU1_LDTRST#
Confidential
P1.2V
C127
4700nF-X5R
25V
C65
4700nF-X5R
25V
C66
4700nF-X5R
25V
C68
220nF
10V
C133
220nF
10V
C589
100nF
10V
1608
C590
100nF
10V
C67
0.18nF
50V
C128
0.18nF
50V
CPU1_PWRGDCPU
CPU1_LDTSTP#
CPU1_SIC
CPU1_SID
CPU1_ALERT#
A A
DRAW
CHECK
APPROVAL
MODULE CODE
4
3
2
XIE BIN
GUO LEI
BC LEE
DATE
DEV. STEP
REV
LAST EDIT
D
B
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D
MEM1_ADQ(63:0) MEM1_BDQ(63:0)
C
B
A
4 3
0
456
1
23
MEM1_ADM(7:0) MEM1_ADQS#(7:0)
0
G12
MA_DATA0
1
F12
MA_DATA1
2
H14
MA_DATA2
3
G14
MA_DATA3
4
H11
MA_DATA4
5
H12
MA_DATA5
6
C13
MA_DATA6
7
E13
MA_DATA7
8
H15
MA_DATA8
9
E15
MA_DATA9
10
E17
MA_DATA10
11
H17
MA_DATA11
12
E14
MA_DATA12
13
F14
MA_DATA13
14
C17
MA_DATA14
15
G17
MA_DATA15
16
G18
MA_DATA16
17
C19
MA_DATA17
18
D22
MA_DATA18
19
E20
MA_DATA19
20
E18
MA_DATA20
21
F18
MA_DATA21
22
B22
MA_DATA22
23
C23
MA_DATA23
24
F20
MA_DATA24
25
F22
MA_DATA25
26
H24
MA_DATA26
27
J19
MA_DATA27
28
E21
MA_DATA28
29
E22
MA_DATA29
30
H20
MA_DATA30
31
H22
MA_DATA31
32
Y24
MA_DATA32
33
AB24
MA_DATA33
34
AB22
MA_DATA34
35
AA21
MA_DATA35
36
W22
MA_DATA36
37
W21
MA_DATA37
38
Y22
MA_DATA38
39
AA22
MA_DATA39
40
Y20
MA_DATA40
41
AA20
MA_DATA41
42
AA18
MA_DATA42
43
AB18
MA_DATA43
44
AB21
MA_DATA44
45
AD21
MA_DATA45
46
AD19
MA_DATA46
47
Y18
MA_DATA47
48
AD17
MA_DATA48
49
W16
MA_DATA49
50
W14
MA_DATA50
51
Y14
MA_DATA51
52
Y17
MA_DATA52
53
AB17
MA_DATA53
54
AB15
MA_DATA54
55
AD15
MA_DATA55
56
AB13
MA_DATA56
57
AD13
MA_DATA57
58
Y12
MA_DATA58
59
W11
MA_DATA59
60
AB14
MA_DATA60
61
AA14
MA_DATA61
62
AB12
MA_DATA62
63
AA12
MA_DATA63
MEM1_BDM(7:0)
0
0
1
E12
MA_DM0
MB_DM0
A12
12
2
43
C15
E19
F24
AC24
MA_DM1
MA_DM2
MA_DM3
MB_DM1
MB_DM2
MB_DM3
B16
A22
E25
AB26
34
5
67
Y19
AB16
MA_DM4
MA_DM5
MB_DM5
MB_DM4
AE22
AC16
56
MA_DM6
MB_DM6
7
G13
G16
C22
G22
Y13
MA_DM7
MA_DQS_H0
MA_DQS_H1
MA_DQS_H2
U7-3
47296-6111
3 / 5
3704-001228
MB_DM7
MB_DQS_H0
MB_DQS_H1
MB_DQS_H2
F26
A24
C12
D16
AD12
2
1
AD23
AB19
Y15
W12
MA_DQS_H3
MA_DQS_H4
MA_DQS_H5
MA_DQS_H6
MB_DQS_H3
MB_DQS_H4
MB_DQS_H5
MB_DQS_H6
AF21
AF12
AE16
AC25
4
3
65
MEM1_ADQS(7:0)
7
1
4
2
G15
C21
G21
AC23
AB20
MA_DQS_L1
MA_DQS_L2
MA_DQS_L3
MA_DQS_L4
MB_DQS_L1
MB_DQS_L2
MB_DQS_L3
MB_DQS_L4
A23
E26
C16
AF22
AC26
4
3
2
1
MEM1_BDQS(7:0)
73
56
W15
W13
MA_DQS_L5
MA_DQS_L6
MA_DQS_L7
MB_DQS_L5
MB_DQS_L6
MB_DQS_L7
AE12
AD16
7
65
MB_DATA0
MB_DATA1
MB_DATA2
MB_DATA3
MB_DATA4
MB_DATA5
MB_DATA6
MB_DATA7
MB_DATA8
MB_DATA9
MB_DATA10
MB_DATA11
MB_DATA12
MB_DATA13
MB_DATA14
MB_DATA15
MB_DATA16
MB_DATA17
MB_DATA18
MB_DATA19
MB_DATA20
MB_DATA21
MB_DATA22
MB_DATA23
MB_DATA24
MB_DATA25
MB_DATA26
MB_DATA27
MB_DATA28
MB_DATA29
MB_DATA30
MB_DATA31
MB_DATA32
MB_DATA33
MB_DATA34
MB_DATA35
MB_DATA36
MB_DATA37
MB_DATA38
MB_DATA39
MB_DATA40
MB_DATA41
MB_DATA42
MB_DATA43
MB_DATA44
MB_DATA45
MB_DATA46
MB_DATA47
MB_DATA48
MB_DATA49
MB_DATA50
MB_DATA51
MB_DATA52
MB_DATA53
MB_DATA54
MB_DATA55
MB_DATA56
MB_DATA57
MB_DATA58
MB_DATA59
MB_DATA60
MB_DATA61
MB_DATA62
MB_DATA63
MEM1_BDQS#(7:0)
C11
A11
A14
B14
G11
E11
D12
A13
A15
A16
A19
A20
C14
D14
C18
D18
D20
A21
D24
C25
B20
C20
B24
C24
E23
E24
G25
G26
C26
D26
G23
G24
AA24
AA23
AD24
AE24
AA26
AA25
AD26
AE25
AC22
AD22
AE20
AF20
AF24
AF23
AC20
AD20
AD18
AE18
AC14
AD14
AF19
AC18
AF16
AF15
AF13
AC12
AB11
Y11
AE14
AF14
AF11
AD11
0
H13
MA_DQS_L0
MA_DQS_H7
Samsung
MB_DQS_H7
MB_DQS_L0
Confidential
B12
0
70
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
4 3
CPU_Caspian
P1.8V_AUX
R587
1K
1%
R588
1K
1%
Place close to MEMORY
PLACE EACH CAP NEAR W17 pin
MEM1_VREF0
MEM1_VREF0
C593
100nF
2
P1.8V_AUX
R579
R578
MEM1_ODT0
MEM1_ODT1
MEM1_CS0#
MEM1_CS1#
MEM1_CKE0
MEM1_CKE1
CLK1_MCLK0
CLK1_MCLK1
CLK1_MCLK0#
CLK1_MCLK1#
MEM1_AMA(15:0)
MEM1_ABS(2:0)
MEM1_ARAS#
MEM1_ACAS#
MEM1_AWE#
C595
1nF
50V10V
DRAW
CHECK DEV. STEP
APPROVAL
MODULE CODE
2
P0.9V_AUX
39.2
39.2
1%
1%
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
1
2
P0.9V_AUX
GUO LEI
U7-2
47296-6111
D10
VTT1
C10
B10
AD10
AF10
AE10
H16
T19
V22
U21
V19
T20
U19
U20
V20
J22
J20
N19
E16
Y16
P19
N20
F16
AA16
P20
N21
M20
N22
M19
M22
L20
M24
L21
L19
K22
R21
L22
K20
V24
K24
K19
R20
R23
J21
R19
T22
T24
XIE BIN
BC LEE
MEM:CMD/CTRL/CLK
VTT2
VTT3
VTT4
MEMZP
MEMZN
RSVD_M1
MA0_ODT0
MA0_ODT1
MA1_ODT0
MA1_ODT1
MA0_CS_L0
MA0_CS_L1
MA1_CS_L0
MA1_CS_L1
MA_CKE0
MA_CKE1
MA_CLK_H5
MA_CLK_H1
MA_CLK_H7
MA_CLK_H4
MA_CLK_L5
MA_CLK_L1
MA_CLK_L7
MA_CLK_L4
MA_ADD0
MA_ADD1
MA_ADD2
MA_ADD3
MA_ADD4
MA_ADD5
MA_ADD6
MA_ADD7
MA_ADD8
MA_ADD9
MA_ADD10
MA_ADD11
MA_ADD12
MA_ADD13
MA_ADD14
MA_ADD15
MA_BANK0
MA_BANK1
MA_BANK2
MA_RAS_L
MA_CAS_L
MA_WE_L
3704-001228
C139, C253 replaced with 22000nf (from 4700nF) : PI_ADV1
C778
4700nF-X5R
25V
08/18/2009
C777
1nF
50V
ADV
0.1
C574
4700nF-X5R
25V
C771
1nF
50V
C573
22000nF-X5R
20%
6.3V
C774
C44
1nF
1nF
50V
50V
DATE TITLE
REV
LAST EDIT
2 / 5
VTT5
VTT6
VTT7
VTT8
VTT9
VTT_SENSE
MEMVREF
RSVD_M2
MB0_ODT0
MB0_ODT1
MB1_ODT0
MB0_CS_L0
MB0_CS_L1
MB1_CS_L0
MB_CKE0
MB_CKE1
MB_CLK_H5
MB_CLK_H1
MB_CLK_H7
MB_CLK_H4
MB_CLK_L5
MB_CLK_L1
MB_CLK_L7
MB_CLK_L4
MB_ADD0
MB_ADD1
MB_ADD2
MB_ADD3
MB_ADD4
MB_ADD5
MB_ADD6
MB_ADD7
MB_ADD8
MB_ADD9
MB_ADD10
MB_ADD11
MB_ADD12
MB_ADD13
MB_ADD14
MB_ADD15
MB_BANK0
MB_BANK1
MB_BANK2
MB_RAS_L
MB_CAS_L
MB_WE_L
C775
22000nF-X5R
20%
6.3V
C572
C575
0.18nF
0.18nF
50V
50V
Suzhou-D
Caspian CPU
S1G3 CPU (2/3)
July 15, 2009 19:25:13 PM
1
P0.9V_AUX
W10
AC10
AB10
AA10
A10
Y10
CPU1_VTTSENSE
W17
MEM1_VREF0
B18
W26
MEM1_ODT2
W23
MEM1_ODT3
Y26
V26
MEM1_CS2#
W25
MEM1_CS3#
U22
J25
MEM1_CKE2
H26
MEM1_CKE3
P22
A17
CLK1_MCLK2
AF18
CLK1_MCLK3
R26
R22
A18
CLK1_MCLK2#
AF17
CLK1_MCLK3#
R25
P24
N24
P26
N23
N26
L23
N25
L24
M26
K26
T26
L26
L25
W24
J23
J24
R24
U26
J26
U25
U24
U23
C43
220nF
10V
C772
0.18nF
50V
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
1
2
C42
220nF
10V
C773
0.18nF
50V
MEM1_BMA(15:0)
MEM1_BBS(2:0)
MEM1_BRAS#
MEM1_BCAS#
MEM1_BWE#
C776
220nF
10V
SAMSUNG
PART NO.
PAGE OF
1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826
C41
220nF
10V
ELECTRONICS
BA41-xxxxxxA
D
C
A
5811
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D
U7-5
47296-6111
G4
VDD0_1
H2
VDD0_2
J9
VDD0_3
J11
VDD0_4
J13
VDD0_5
J15
VDD0_6
K6
VDD0_7
K10
VDD0_8
K12
VDD0_9
K14
VDD0_10
L4
VDD0_11
L7
VDD0_12
L9
VDD0_13
L11
M10
N11
M16
H25
M18
M21
M23
M25
N17
L13
L15
K16
P16
T16
V16
J17
K18
K21
K23
K25
L17
M2
M6
M8
N7
N9
VDD0_14
VDD0_15
VDD0_16
VDD0_17
VDD0_18
VDD0_19
VDD0_20
VDD0_21
VDD0_22
VDD0_23
VDDNB_1
VDDNB_2
VDDNB_3
VDDNB_4
VDDNB_5
VDDIO1
VDDIO2
VDDIO3
VDDIO4
VDDIO5
VDDIO6
VDDIO7
VDDIO8
VDDIO9
VDDIO10
VDDIO11
VDDIO12
3704-001228
C
VDD_CPU_NB
B
5 / 5
VDD1_1
VDD1_2
VDD1_3
VDD1_4
VDD1_5
VDD1_6
VDD1_7
VDD1_8
VDD1_9
VDD1_10
VDD1_11
VDD1_12
VDD1_13
VDD1_14
VDD1_15
VDD1_16
VDD1_17
VDD1_18
VDD1_19
VDD1_20
VDD1_21
VDD1_22
VDD1_23
VDD1_24
VDD1_25
VDD1_26
VDDIO27
VDDIO26
VDDIO25
VDDIO24
VDDIO23
VDDIO22
VDDIO21
VDDIO20
VDDIO19
VDDIO18
VDDIO17
VDDIO16
VDDIO15
VDDIO14
VDDIO13
P8
P10
R4
R7
R9
R11
T2
T6
T8
T10
T12
T14
U7
U9
U11
U13
U15
V6
V8
V10
V12
V14
W4
Y2
AC4
AD2
Y25
V25
V23
V21
V18
U17
T25
T23
T21
T18
R17
P25
P23
P21
P18
2
CPU_CORE
6.3V
22000nF-X5R
C647
1%100
CPU_CORE
6.3V
20%
22000nF-X5R
C649
6.3V
6.3V
20%
22000nF-X5R
22000nF-X5R
C657
C658
10V
25V
10%
4700nF-X5R
220nF
C723
C666
20%
20%
10%
CORE0_RUN
6.3V
20%
22000nF-X5R
C653
6.3V
20%
22000nF-X5R
C648
P1.8V_AUXVDD_CPU_NB
10V
10%
220nF
C665
100 1%
CPU_Caspian
CPU1_VDD_FB
CPU1_VDD_FB#
R666
R668
CPU_CORECPU_CORE
VSS66
VSS67
VSS68
VSS69
VSS70
VSS71
VSS72
VSS73
VSS74
VSS75
VSS76
VSS77
VSS78
VSS79
VSS80
VSS81
VSS82
VSS83
VSS84
VSS85
VSS86
VSS87
VSS88
VSS89
VSS90
VSS91
VSS92
VSS93
VSS94
VSS95
VSS96
VSS97
VSS98
VSS99
VSS100
VSS101
VSS102
VSS103
VSS104
VSS105
VSS106
VSS107
VSS108
VSS109
VSS110
VSS111
VSS112
VSS113
VSS114
VSS115
VSS116
VSS117
VSS118
VSS119
VSS120
VSS121
VSS122
VSS123
VSS124
VSS125
VSS126
VSS127
VSS128
VSS129
J6
J8
J10
J12
J14
J16
J18
K2
K7
K9
K11
K13
K15
K17
L6
L8
L10
L12
L14
L16
L18
M7
M9
AC6
M17
N4
N8
N10
N16
N18
P2
P7
P9
P11
P17
R8
R10
R16
R18
T7
T9
T11
T13
T15
T17
U4
U6
U8
U10
U12
U14
U16
U18
V2
V7
V9
V11
V13
V15
V17
W6
Y21
Y23
N6
Bottom side decoupling
Decoupling between processor and Memory
Place close to processor as possible
P1.8V_AUX
25V
10%
4700nF-X5R
C670
25V
10%
4700nF-X5R
C667
6.3V
20%
22000nF-X5R
C659
25V
10%
4700nF-X5R
C671
P1.8V_AUX
AA4
VSS1
AA11
VSS2
AA13
VSS3
AA15
VSS4
AA17
VSS5
AA19
VSS6
AB2
VSS7
AB7
VSS8
AB9
VSS9
AB23
VSS10
AB25
VSS11
AC11
VSS12
AC13
VSS13
AC15
VSS14
AC17
VSS15
AC19
VSS16
AC21
VSS17
AD6
VSS18
AD8
VSS19
AD25
VSS20
AE11
VSS21
AE13
VSS22
AE15
VSS23
AE17
VSS24
AE19
VSS25
AE21
VSS26
AE23
VSS27
B4
VSS28
B6
VSS29
B8
VSS30
B9
VSS31
B11
VSS32
B13
VSS33
B15
VSS34
B17
VSS35
B19
VSS36
B21
VSS37
B23
VSS38
B25
VSS39
D6
VSS40
Samsung
Confidential
D8
VSS41
D9
VSS42
D11
VSS43
D13
VSS44
D15
VSS45
D17
VSS46
D19
VSS47
D21
VSS48
D23
VSS49
D25
VSS50
E4
VSS51
F2
VSS52
F11
VSS53
F13
VSS54
F15
VSS55
F17
VSS56
F19
VSS57
F21
VSS58
F23
VSS59
F25
VSS60
H7
VSS61
H9
VSS62
H21
VSS63
H23
VSS64
J4
VSS65
6.3V
20%
22000nF-X5R
C654
6.3V
20%
22000nF-X5R
C652
6.3V
20%
22000nF-X5R
C725
10V
10%
220nF
C662
134
6.3V
20%
22000nF-X5R
C655
6.3V
20%
22000nF-X5R
C650
6.3V
20%
22000nF-X5R
C668
10V
10%
220nF
C663
10V
220nF
C719
10V
220nF
C591
10V
220nF
C724
10nF
C661
10%
10%
25V
10V
220nF
C664
25V
10nF
C720
25V
10nF
C656
10%
10nF
C722
10%
50V
0.18nF
C660
25V
50V
0.18nF
C651
50V
0.18nF
C646
50V
0.18nF
C669
50V
0.18nF
C726
5%
1608
D
C
B
A
08/18/2009
TITLEDRAW
Suzhou-D
ADV
0.1
Caspian CPU
S1G3 CPU (3/3)
July 15, 2009 19:25:13 PM
1
SAMSUNG
ELECTRONICS
PART NO.
BA41-xxxxxxA
12 58
PAGE
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826
DATE
CHECK
APPROVAL
MODULE CODE
4
3
2
XIE BIN
GUO LEI
BC LEE
DEV. STEP
REV
LAST EDIT
A
OF
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
3
2
1
D
NB_ RX881_AMD
U6-2
PEG1_RXP(15:0)
U6-1
RX881
0
Y25
HT_RXCAD0P
1
V22
HT_RXCAD1P
V25
HT_RXCAD2P
3
U24
HT_RXCAD3P
4
T25
HT_RXCAD4P
5
P22
HT_RXCAD5P
6
P25
HT_RXCAD6P
7
N24
C C
CPU1_HTOUT#(15:0) CPU1_HTIN#(15:0)
B
CPU1_CLKOUT_0
CPU1_CLKOUT_1
CPU1_CTLOUT_0
CPU1_CTLOUT_1
CPU1_CLKOUT_0#
CPU1_CLKOUT_1#
CPU1_CTLOUT_0#
CPU1_CTLOUT_1#
R685
301
1%
NB_HT_RXCALP_R_MN
NB_HT_RXCALN_R_MN
HT_RXCAD7P
8
AC24
HT_RXCAD8P
9
AB25
HT_RXCAD9P
10
AA24
HT_RXCAD10P
11
Y22
HT_RXCAD11P
12
W21
HT_RXCAD12P
13
V21
HT_RXCAD13P
14
U20
HT_RXCAD14P
15
U19
HT_RXCAD15P
0
Y24
HT_RXCAD0N
1
V23
HT_RXCAD1N
2
V24
HT_RXCAD2N
3
U25
HT_RXCAD3N
4
T24
HT_RXCAD4N
5
P23
HT_RXCAD5N
6
P24
HT_RXCAD6N
7
N25
HT_RXCAD7N
8
AC25
HT_RXCAD8N
9
AB24
HT_RXCAD9N
10
AA25
HT_RXCAD10N
11
Y23
HT_RXCAD11N
12
W20
HT_RXCAD12N
13
V20
HT_RXCAD13N
14
U21
HT_RXCAD14N
15
U18
HT_RXCAD15N
T22
HT_RXCLK0P
AB23
HT_RXCLK1P
M22
HT_RXCTL0P
R21
HT_RXCTL1P
T23
HT_RXCLK0N
AA22
HT_RXCLK1N
M23
HT_RXCTL0N
R20
HT_RXCTL1N
C23
HT_RXCALP
A24
HT_RXCALN
0904-002536
HYPER TRANSPORT CPU I/F
* Hyper Transport Calibration resistors
RS780M / RX781 : 301 ohm
RX780 / RD780 : 1.21K ohm (for S3 issue in D/T chipset)
1 / 5
HT_TXCAD0P
HT_TXCAD1P
HT_TXCAD2P
HT_TXCAD3P
HT_TXCAD4P
HT_TXCAD5P
HT_TXCAD6P
HT_TXCAD7P
HT_TXCAD8P
HT_TXCAD9P
HT_TXCAD10P
HT_TXCAD11P
HT_TXCAD12P
HT_TXCAD13P
HT_TXCAD14P
HT_TXCAD15P
HT_TXCAD0N
HT_TXCAD1N
HT_TXCAD2N
HT_TXCAD3N
HT_TXCAD4N
HT_TXCAD5N
HT_TXCAD6N
HT_TXCAD7N
HT_TXCAD8N
HT_TXCAD9N
HT_TXCAD10N
HT_TXCAD11N
HT_TXCAD12N
HT_TXCAD13N
HT_TXCAD14N
HT_TXCAD15N
HT_TXCLK0P
HT_TXCLK1P
HT_TXCTL0P
HT_TXCTL1P
HT_TXCLK0N
HT_TXCLK1N
HT_TXCTL0N
HT_TXCTL1N
HT_TXCALP
HT_TXCALN
CPU1_HTIN(15:0)CPU1_HTOUT(15:0)
0
D24
1
E24
22
F24
3
F23
4
H23
5
J25
6
K24
7
K23
8
F21
9
G20
10
J20
11
J18
12
L19
13
M19
14
M21
15
P18
0
D25
1
E25
2
F25
3
F22
4
H22
5
J24
6
K25
7
K22
8
G21
9
H21
10
J21
11
K17
12
J19
13
L18
14
P21
15
M18
Samsung
H24
L21
M24
P19
H25
L20
M25
R18
NB_HT_TXCALP_R_MN
B24
NB_HT_TXCALN_R_MN
B25
R686
301
CPU1_CLKIN_0
CPU1_CLKIN_1
CPU1_CTLIN_0
CPU1_CTLIN_1
CPU1_CLKIN_0#
CPU1_CLKIN_1#
CPU1_CTLIN_0#
CPU1_CTLIN_1#
1%
PEX1_MINI_RXP0
PEX1_MINI_RXN0
PEX1_EXPCARD_RXP1
PEX1_EXPCARD_RXN1
PEX1_LAN_RXP2
PEX1_LAN_RXN2
PEX1_SB_TXP(3:0)
PEX1_SB_TXN(3:0)
Confidential
EMI
EMI1
260118-1
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
D4
A3
C2
E5
G5
H5
J6
J7
L5
M8
P7
P5
R8
R6
P4
T4
C4
B3
C1
F5
G6
H6
J5
J8
L6
L8
M7
M5
P8
R5
P3
T3
AE3
AD4
AE2
AD3
AD1
AD2
V5
W6
U5
U6
U8
U7
0
AA8
1
AA7
2
AA5
3
W5
0
Y8
1
Y7
2
AA6
3
Y5
RX881
GFX_RX0P
GFX_RX1P
GFX_RX2P
GFX_RX3P
GFX_RX4P
GFX_RX5P
GFX_RX6P
GFX_RX7P
GFX_RX8P
GFX_RX9P
GFX_RX10P
GFX_RX11P
GFX_RX12P
GFX_RX13P
GFX_RX14P
GFX_RX15P
GFX_RX0N
GFX_RX1N
GFX_RX2N
GFX_RX3N
GFX_RX4N
GFX_RX5N
GFX_RX6N
GFX_RX7N
GFX_RX8N
GFX_RX9N
GFX_RX10N
GFX_RX11N
GFX_RX12N
GFX_RX13N
GFX_RX14N
GFX_RX15N
GPP_RX0P
GPP_RX0N
GPP_RX1P
GPP_RX1N
GPP_RX2P
GPP_RX2N
GPP_RX3P
GPP_RX3N
GPP_RX4P
GPP_RX4N
GPP_RX5P
GPP_RX5N
SB_RX0P
SB_RX1P
SB_RX2P
SB_RX3P
SB_RX0N
SB_RX1N
SB_RX2N
SB_RX3N
0904-002536
PCIE I/F GFX
PCIE I/F GPP
PCIE I/F SB
PCE_CALRN_PCE_BCALRN
PCE_CALRP_PCE_BCALRP
2 / 5
GFX_TX0P
GFX_TX1P
GFX_TX2P
GFX_TX3P
GFX_TX4P
GFX_TX5P
GFX_TX6P
GFX_TX7P
GFX_TX8P
GFX_TX9P
GFX_TX10P
GFX_TX11P
GFX_TX12P
GFX_TX13P
GFX_TX14P
GFX_TX15P
GFX_TX0N
GFX_TX1N
GFX_TX2N
GFX_TX3N
GFX_TX4N
GFX_TX5N
GFX_TX6N
GFX_TX7N
GFX_TX8N
GFX_TX9N
GFX_TX10N
GFX_TX11N
GFX_TX12N
GFX_TX13N
GFX_TX14N
GFX_TX15N
GPP_TX0P
GPP_TX0N
GPP_TX1P
GPP_TX1N
GPP_TX2P
GPP_TX2N
GPP_TX3P
GPP_TX3N
GPP_TX4P
GPP_TX4N
GPP_TX5P
GPP_TX5N
SB_TX0P
SB_TX1P
SB_TX2P
SB_TX3P
SB_TX0N
SB_TX1N
SB_TX2N
SB_TX3N
NB_GFX_TX0P_C_MN
A5
NB_GFX_TX1P_C_MN
A4
NB_GFX_TX2P_C_MN
C3
NB_GFX_TX3P_C_MN
D1
NB_GFX_TX4P_C_MN
E2
NB_GFX_TX5P_C_MN
F4
NB_GFX_TX6P_C_MN
F1
NB_GFX_TX7P_C_MN
H4
NB_GFX_TX8P_C_MN
H1
NB_GFX_TX9P_C_MN
J2
NB_GFX_TX10P_C_MN
K4
NB_GFX_TX11P_C_MN
K1
NB_GFX_TX12P_C_MN
M4
NB_GFX_TX13P_C_MN
M1
NB_GFX_TX14P_C_MN
N2
NB_GFX_TX15P_C_MN
P1
NB_GFX_TX0N_C_MN
B5
NB_GFX_TX1N_C_MN
B4
NB_GFX_TX2N_C_MN
B2
NB_GFX_TX3N_C_MN
D2
NB_GFX_TX4N_C_MN
E1
NB_GFX_TX5N_C_MN
F3
NB_GFX_TX6N_C_MN
F2
NB_GFX_TX7N_C_MN
H3
NB_GFX_TX8N_C_MN
H2
NB_GFX_TX9N_C_MN
J1
NB_GFX_TX10N_C_MN
K3
NB_GFX_TX11N_C_MN
K2
NB_GFX_TX12N_C_MN
M3
NB_GFX_TX13N_C_MN
M2
NB_GFX_TX14N_C_MN
N1
NB_GFX_TX15N_C_MN
P2
NB_GPP_TX0P_C_MN
AC1
NB_GPP_TX0N_C_MN
AC2
NB_GPP_TX1P_C_MN
AB4
NB_GPP_TX1N_C_MN
AB3
NB_GPP_TX2P_C_MN
AA2
NB_GPP_TX2N_C_MN
AA1
Y1
Y2
Y4
Y3
V1
V2
NB_SB_TX0P_C_MN
AD7
NB_SB_TX1P_C_MN
AE6
NB_SB_TX2P_C_MN
AB6
NB_SB_TX3P_C_MN
AD5
NB_SB_TX0N_C_MN
AE7
NB_SB_TX1N_C_MN
AD6
NB_SB_TX2N_C_MN
AC6
NB_SB_TX3N_C_MN
AE5
NB_PCE_CALRN_R_MN
AB8
NB_PCE_CALRP_R_MN
AC8
C107
C99
C106
C101
C109
C96
C108
C98
C112
C100
C114
C105
C81
C75
C77
C78
C120
C104
C113
C102
C116
C103
C115
C97
C111
C95
C110
C73
C82
C74
C79
C80
C54 100nF
C583
C582
C52
C76
C60
100nF 10V
C57
100nF 10V
C585
100nF
C56
C59
C58
C584
100nF 10V
C55
R627
R584
AMD recommended
1608, 1.27k ohm
(2007-007669)
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
6.3V
100nF
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
6.3V
100nF
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
6.3V
100nF
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
100nF
6.3V
10V
100nFC53
10V
100nF
10V
100nF
10V
10V100nF
10V100nF
10V100nF
10V
10V100nF
10V100nF
10V100nF
1.24K 1%
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
1
2
3
0
1
2
3
P1.1V
1%2K
PEG1_TXP(15:0)
PEG1_TXN(15:0)PEG1_RXN(15:0)
PEX1_MINI_TXP0
PEX1_MINI_TXN0
PEX1_EXPCARD_TXP1
PEX1_EXPCARD_TXN1
PEX1_LAN_TXP2
PEX1_LAN_TXN2
PEX1_SB_RXP(3:0)
PEX1_SB_RXN(3:0)
D
B
A A
DRAW
CHECK
APPROVAL
MODULE CODE
4 23
XIE BIN
GUO LEI
BC LEE
DATE
DEV. STEP
REV
LAST EDIT
08/18/2009
TITLE
Suzhou-D
ADV
0.1
MCH
RX881 (1/3)
July 15, 2009 19:25:13 PM
1
SAMSUNG
ELECTRONICS
PART NO.
BA41-xxxxxxA
13 58
PAGE
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826
OF
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
3
2
1
NB_ RX881_AMD
D D
P3.3V
NB_KBC3_PWRGD_Q_MN
RHU002N06
Q524
60V
C
KBC3_PWRGD
CPU1_LDTRST#
PLT3_RST#
CHP3_NB_PWRGD
G
1
R654
SMT502
R659
B B
DBG3_HSYNC
R683
10K
1%
D
3
S
2
nostuff
nostuff
P1.8V
R682
1K
1%
3
D
RHU002N06
Q523
G
60V
1
S
2
1K
0-1005
1K
CPU1_LDTSTP#
CPU1_LDTREQ#
CPU1_ALL_LDTSTP
CLK0_HTT
CLK0_HTT#
R656
4.7K
5%
R657
4.7K
5%
P3.3V
P1.8V
20%
C709
22000nF-X5R
6.3V
P1.1V
P3.3V
R664
1K
1%
R665
DBG3_HSYNC
DBG3_VSYNC
B505
B504
2200nF-X5R
C712
R663
SMT503
NB_REFCLK_N_PWM_GPIO3_R_MN
CLK1_NBGFX
CLK1_NBGFX#
CLK1_SBLINK
CLK1_SBLINK#
R660
1K
1%
NB_NC_1_R_MN
1K
1%
NB_NC_9_R_MN
R661
715
1%
10V
C705
2200nF-X5R
10V
NB_SYSRESET#_R_MN
NB_POWERGOOD_R_MN
NB_ALLOW_LDTSTOP_R_MN
1K
0-1005
NB_NC_16_R_MN
Confidential
U6-3
RX881
F12
AVDD1_NC
E12
AVDD2_NC
F14
AVDDDI_NC
G15
AVSSDI_NC
H15
AVDDQ_NC
H14
AVSSQ_NC
E17
NC_1
F17
NC_2
F15
NC_3
G18
NC_4
G17
VSS35
E18
NC_5
F18
VSS36
E19
NC_6
F19
VSS37
A11
DAC_HSYNC_PWM_GPIO4
B11
DAC_VSYNC_PWM_GPIO6
F8
NC_7
E8
NC_8
G14
NC_9
A12
PLLVDD_NC
D14
PLLVDD18_NC
B12
PLLVSS_NC
H17
VDDA18HTPLL
NB_VDDA18HTPLL_B_MN
D7
VDDA18PCIEPLL1
E7
VDDA18PCIEPLL2
NB_VDDA18PCIEPLL_B_MN
D8
SYSRESET#
A10
POWERGOOD
C10
LDTSTOP#
C12
ALLOW_LDTSTOP
C25
HT_REFCLKP
C24
HT_REFCLKN
E11
REFCLK_P_OSCIN_OSCIN
F11
REFCLK_N_PWM_GPIO3
T2
GFX_REFCLKP
T1
GFX_REFCLKN
U1
GPP_REFCLKP
U2
GPP_REFCLKN
V4
GPPSB_REFCLKP_SB_REFCLKP
V3
Samsung
GPPSB_REFCLKN_SB_REFCLKN
B9
NC_10
A9
NC_11
A8
NC_12
B8
NC_13
B7
NC_14
A7
NC_15
B10
STRP_DATA
G11
RSVD
C8
NC_16
0904-002536
R655
150
1%
CRT / TVOUTPLL PWRPMCLOCKs
MIS.
LVTM
SUS_STAT#_PWM_GPIO5
3 / 5
NC_17
NC_18
NC_19
NC_20
NC_21
NC_22
NC_23
NC_24
NC_25
NC_26
NC_27
NC_28
NC_29
NC_30
NC_31
NC_32
NC_33
NC_34
NC_35
NC_36
VDDLTP18_NC
VSSLTP18_NC
VDDLT18_1_NC
VDDLT18_2_NC
VDDLT33_1_NC
VDDLT33_2_NC
VSSLT1_VSS
VSSLT2_VSS
VSSLT3_VSS
VSSLT4_VSS
VSSLT5_VSS
VSSLT6_VSS
VSSLT7_VSS
GPIO3
GPIO2
GPIO4
NC_37
NC_38
THERMALDIODE_P
THERMALDIODE_N
TESTMODE
A22
B22
A21
B21
B20
A20
A19
B19
B18
A18
A17
B17
D20
D21
D18
D19
B16
A16
D16
D17
A13
B13
A15
B15
A14
B14
C14
D15
C16
C18
C20
E20
C22
E9
F7
G12
D9
D10
D12
AE8
AD8
D13
NB_TESTMODE_R_MN
R662
1.91K
1%
1.8k ohm
nostuff
nostuff
R585
P1.8V
R586
CHP3_SUSSTAT#
40.2
1%
NB_NC_64_R_MN
40.2
1%
U6-4
RX881
AB12
NC_39
AE16
NC_40
V11
NC_41
AE15
NC_42
AA12
NC_43
AB16
NC_44
AB14
NC_45
AD14
NC_46
AD13
NC_47
AD15
NC_48
AC16
NC_49
AE13
NC_50
AC14
NC_51
Y14
NC_52
AD16
NC_53
AE17
NC_54
AD17
NC_55
W12
NC_56
Y12
NC_57
AD18
NC_58
AB13
NC_59
AB18
NC_60
V14
NC_61
V15
NC_62
W14
NC_63
AE12
NC_64
AD12
NC_65
0904-002536
NB_NC_65_R_MN
CPU1_ALL_LDTSTP
SBD_MEM / DVO_I/F
IOPLLVDD18_NC
IOPLLVDD_NC
IOPLLVSS_NC
MEM_VREF_NC
1K
R688
4 / 5
AA18
NC_66
AA20
NC_67
AA19
NC_68
Y19
NC_69
V17
NC_70
AA17
NC_71
AA15
NC_72
Y15
NC_73
AC20
NC_74
AD19
NC_75
AE22
NC_76
AC18
NC_77
AB20
NC_78
AD22
NC_79
AC22
NC_80
AD21
NC_81
Y17
NC_82
W18
NC_83
NC_84
NC_85
NC_86
NC_87
AD20
AE21
W17
AE19
AE23
AE24
AD23
AE18
P1.1V P1.8V
NB_IOPLLVDD18_NC_B_MN
C63
2200nF-X5R
10V
nostuff
P1.8V
1%
DBG3_VSYNC
R684
R658
nostuff
1K
A A
1%
4
nostuff
1K
1%
DRAW
CHECK
APPROVAL
MODULE CODE
3
2
XIE BIN
GUO LEI
BC LEE
DATE
DEV. STEP
REV
LAST EDIT
08/18/2009
TITLE
Suzhou-D
ADV
0.1
MCH
RX881 (2/3)
July 15, 2009 19:25:13 PM
1
SAMSUNG
ELECTRONICS
PART NO.
BA41-xxxxxxA
14 58
PAGE OF
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826
C
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
3
2
1
D
NB_ RX881_AMD
P1.1V
C706
100nF 1000nF-X5R
10V
C707
100nF
10V
C630
6.3V
C704
1000nF-X5R
6.3V
C121
4700nF-X5R
25V
P1.1V
C636
C635
100nF 100nF
10V
10V
C634
100nF
10V
C638
10000nF-X5R
6.3V
C633
10000nF-X5R
6.3V
C587
100nF
10V
C637
100nF
10V
C641
100nF
10V
C639
100nF
10V
P1.1V
U6-5
RX881
J17
VDDHT_1
K16
VDDHT_2
C643
C713
4700nF-X5R
25V
C C
10000nF-X5R
6.3V
P1.2V
C642
C64
100nF
25V
10V 10V
C714
100nF
100nF 100nF
10V
10V
C715
C717C716
100nF
100nF
10V10V
C645
C588
100nF
100nF4700nF-X5R
10V
P1.8V
B6
BLM18PG181SN1
C61
B B
C62
4700nF-X5R
25V
4700nF-X5R
25V
NB_VDDA18PCIE_B_MN
C632
C631
100nF 100nF
10V
100nF
10V
C586
10V
P1.8V
C708
1000nF-X5R
6.3V
L16
C640
10V
C718
100nF
10V
C644
100nF
10V
VDDHT_3
M16
VDDHT_4
P16
VDDHT_5
R16
VDDHT_6
T16
VDDHT_7
H18
VDDHTRX_1
G19
VDDHTRX_2
F20
VDDHTRX_3
E21
VDDHTRX_4
D22
VDDHTRX_5
B23
VDDHTRX_6
A23
VDDHTRX_7
AE25
VDDHTTX_1
AD24
VDDHTTX_2
AC23
VDDHTTX_3
AB22
VDDHTTX_4
AA21
VDDHTTX_5
Y20
VDDHTTX_6
W19
VDDHTTX_7
V18
VDDHTTX_8
U17
VDDHTTX_9
T17
VDDHTTX_10
R17
VDDHTTX_11
P17
VDDHTTX_12
M17
VDDHTTX_13
J10
VDDA18PCIE_1
P10
VDDA18PCIE_2
K10
VDDA18PCIE_3
M10
VDDA18PCIE_4
L10
VDDA18PCIE_5
W9
Samsung
VDDA18PCIE_6
H9
VDDA18PCIE_7
T10
VDDA18PCIE_8
R10
VDDA18PCIE_9
Y9
VDDA18PCIE_10
AA9
VDDA18PCIE_11
AB9
VDDA18PCIE_12
AD9
VDDA18PCIE_13
AE9
VDDA18PCIE_14
U10
VDDA18PCIE_15
F9
VDD18_1
G9
VDD18_2
AE11
VDD18_MEM1_NC
AD11
VDD18_MEM2_NC
0904-002536
Confidential
VDDPCIE_1
VDDPCIE_2
VDDPCIE_3
VDDPCIE_4
VDDPCIE_5
VDDPCIE_6
VDDPCIE_7
VDDPCIE_8
VDDPCIE_9
VDDPCIE_10
VDDPCIE_11
VDDPCIE_12
VDDPCIE_13
VDDPCIE_14
VDDPCIE_15
VDDPCIE_16
VDDPCIE_17
POWER
VDD_MEM1_NC
VDD_MEM2_NC
VDD_MEM3_NC
VDD_MEM4_NC
VDD_MEM5_NC
VDD_MEM6_NC
VDD33_1_NC
VDD33_2_NC
5 / 5
VDDC_1
VDDC_2
VDDC_3
VDDC_4
VDDC_5
VDDC_6
VDDC_7
VDDC_8
VDDC_9
VDDC_10
VDDC_11
VDDC_12
VDDC_13
VDDC_14
VDDC_15
VDDC_16
VDDC_17
VDDC_18
VDDC_19
VDDC_20
VDDC_21
VDDC_22
A6
B6
C6
D6
E6
F6
G7
H8
J9
K9
M9
L9
P9
R9
T9
V9
U9
K12
J14
U16
J11
K15
M12
L14
L11
M13
M15
N12
N14
P11
P13
P14
R12
R15
T11
T15
U12
T14
J16
AE10
AA11
Y11
AD10
AB10
AC10
H11
H12
C711
100nF
P3.3V
C710
100nF
10V10V
D23
G22
G24
G25
H19
M20
N22
R19
R22
R24
R25
H20
U22
W22
W24
W25
AD25
M14
N13
R11
R14
U14
U11
U15
W11
W15
AC12
AA14
AB11
AB15
AB17
AB19
AE20
AB21
A25
E22
J22
L17
L22
L24
L25
P20
V19
Y21
L12
P12
P15
T12
V12
Y18
K11
VSSAHT1
VSSAHT2
VSSAHT3
VSSAHT4
VSSAHT5
VSSAHT6
VSSAHT7
VSSAHT8
VSSAHT9
VSSAHT10
VSSAHT11
VSSAHT12
VSSAHT13
VSSAHT14
VSSAHT15
VSSAHT16
VSSAHT17
VSSAHT18
VSSAHT19
VSSAHT20
VSSAHT21
VSSAHT22
VSSAHT23
VSSAHT24
VSSAHT25
VSSAHT26
VSSAHT27
VSS11
VSS12
VSS13
VSS14
VSS15
VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
GROUND
VSSAPCIE1
VSSAPCIE2
VSSAPCIE3
VSSAPCIE4
VSSAPCIE5
VSSAPCIE6
VSSAPCIE7
VSSAPCIE8
VSSAPCIE9
VSSAPCIE10
VSSAPCIE11
VSSAPCIE12
VSSAPCIE13
VSSAPCIE14
VSSAPCIE15
VSSAPCIE16
VSSAPCIE17
VSSAPCIE18
VSSAPCIE19
VSSAPCIE20
VSSAPCIE21
VSSAPCIE22
VSSAPCIE23
VSSAPCIE24
VSSAPCIE25
VSSAPCIE26
VSSAPCIE27
VSSAPCIE28
VSSAPCIE29
VSSAPCIE30
VSSAPCIE31
VSSAPCIE32
VSSAPCIE33
VSSAPCIE34
VSSAPCIE35
VSSAPCIE36
VSSAPCIE37
VSSAPCIE38
VSSAPCIE39
VSSAPCIE40
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
A2
B1
D3
D5
E4
G1
G2
G4
H7
J4
R7
L1
L2
L4
L7
M6
N4
P6
R1
R2
R4
V7
U4
V8
V6
W1
W2
W4
W7
W8
Y6
AA4
AB5
AB1
AB7
AC3
AC4
AE1
AE4
AB2
AE14
D11
G8
E14
E15
J15
J12
K14
M11
L15
D
A A
DRAW
CHECK
APPROVAL
MODULE CODE
4
3
2
XIE BIN
GUO LEI
BC LEE
DATE
DEV. STEP
REV
LAST EDIT
08/18/2009
TITLE
Suzhou-D
ADV
0.1
MCH
RX881 (3/3)
July 15, 2009 19:25:13 PM
1
SAMSUNG
ELECTRONICS
PART NO.
BA41-xxxxxxA
15 58
PAGE OF
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826
3
4
SAMSUNG PROPRIETARYSAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
EXCEPT AS AUTHORIZED BY SAMSUNG.
D
D
C
C CC
CLK1_MCLK0
CLK1_MCLK0#
CLK1_MCLK1
CLK1_MCLK1#
B B
B
A A
A A
4
MEM1_ADQ(63:0)
MEM1_AMA(15:0)
MEM1_ABS(2)
MEM1_ABS(0)
MEM1_ABS(1)
MEM1_CS0#
MEM1_CS1#
0.0015nF
50V
C721
C592
0.0015nF
MEM1_CKE0
MEM1_CKE1
MEM1_ACAS#
MEM1_ARAS#
MEM1_AWE#
R567
R566
SMB3_CLK
SMB3_DATA
MEM1_ODT0
MEM1_ODT1
MEM1_ADM(7:0)
MEM1_ADQS(7:0)
MEM1_ADQS#(7:0)
4
4
50V
10K 1%
10K 1%
MEM0_SA0_R_MN
MEM0_SA1_R_MN
DDR SO-DIMM #0
DDR1-1
DDR2-SODIMM-200P-RVS
1/2
0
102
A0
1
101
A1
2
100
A2
3
99
A3
4
98
A4
5
97
A5
6
94
A6
7
92
A7
8
93
A8
9
91
A9
10
105
A10_AP
11
90
A11
12
89
A12
13
116
A13
14
86
A14
15
84
A15
85
A16_BA2
107
BA0
106
BA1
110
S0*
115
S1*
30
CK0
32
CK0*
164
CK1
166
CK1*
79
CKE0
80
CKE1
113
CAS*
108
RAS*
109
WE*
198
SA0
200
SA1
197
SCL
195
SDA
114
ODT0
119
ODT1
0
10
DM0
1
26
DM1
2
52
DM2
3
67
DM3
4
130
DM4
5
147
DM5
6
170
DM6
7
185
DM7
0
13
DQS0
1
31
DQS1
2
51
DQS2
3
70
DQS3
4
131
DQS4
5
148
DQS5
6
169
DQS6
7
188
DQS7
0
11
DQS*0
1
29
DQS*1
2
49
DQS*2
3
68
DQS*3
4
129
DQS*4
5
146
DQS*5
6
167
DQS*6
7
186
DQS*7
3709-001341
0
5
DQ0
1
7
DQ1
2
17
DQ2
3
19
DQ3
4
4
DQ4
5
6
DQ5
6
14
DQ6
7
16
DQ7
8
23
DQ8
9
25
DQ9
10
35
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
11
37
12
20
13
22
14
36
15
38
16
43
17
45
18
55
19
57
20
44
21
46
22
56
23
58
24
61
25
63
26
73
27
75
28
62
29
64
30
74
31
76
32
123
33
125
34
135
35
137
36
124
37
126
38
134
Samsung
39
136
40
141
41
143
42
151
43
153
44
140
45
142
46
152
47
154
48
157
49
159
50
173
51
175
52
158
53
160
54
174
55
176
56
179
57
181
58
189
Confidential
59
191
60
180
61
182
62
192
63
194
3
MCH3_EXTTS0#
MEM1_VREF1
P1.8V_AUX
R694
1K
1%
R693
1K
1%
Place close to MEMORY
nostuff
3
3
ME POWER RAIL UNDER ME ENABLE
P3.3V
C553
100nF
10V
C831
100nF
10V
MEM1_VREF1
ME POWER RAIL UNDER ME ENABLE
P1.8V_AUX
XC500
330uF
2.5V
OXI
P3.3V
R676
R677
P1.8V_AUX
112
111
117
96
95
118
81
82
87
103
88
104
199
83
C554
2200nF-X5R
120
10V
50
69
163
1
201
C830
1nF
202
50V
47
133
183
77
12
48
184
78
71
72
121
122
196
193
8
Place near SO-DIMM0
C672
C606
2200nF-X5R2200nF-X5R
10V
10V
1%
10K
1%
10K
DDR1-2
DDR2-SODIMM-200P-RVS
2/2
VDD1
VDD2
VDD3
VDD4
VDD5
VDD6
VDD7
VDD8
VDD9
VDD10
VDD11
VDD12
VDDSPD
NC1
NC2
NC3
NC4
NCTEST
VREF
GND0
GND1
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
VSS13
VSS14
VSS15
3709-001341
C596
2200nF-X5R
10V
C598
C607
2200nF-X5R
2200nF-X5R
10V
10V
MCH3_EXTTS0#
MCH3_EXTTS1#
VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
VSS35
VSS36
VSS37
VSS38
VSS39
VSS40
VSS41
VSS42
VSS43
VSS44
VSS45
VSS46
VSS47
VSS48
VSS49
VSS50
VSS51
VSS52
VSS53
VSS54
VSS55
VSS56
VSS57
C679
100nF
10V
18
24
41
53
42
54
59
65
60
66
127
139
128
145
165
171
172
177
187
178
190
9
21
33
155
34
132
144
156
168
2
3
15
27
39
149
161
28
40
138
150
162
C599
100nF
10V
C605
100nF
10V
2
2
2
2
Array resistors & Single resistors used to improve layout & routing.
MEM1_AMA(15:0)
MEM1_CS0#
MEM1_CS1#
MEM1_CKE0
MEM1_CKE1
MEM1_ODT0
MEM1_ODT1
MEM1_ABS(0)
MEM1_ABS(1)
MEM1_ABS(2)
MEM1_ACAS#
MEM1_ARAS#
MEM1_AWE#
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Place one cap close to every 2 pull-up resistors terminated to P0.9V_AUX
P0.9V_AUX
C597
100nF
10V
DATE
CHECK
APPROVAL
MODULE CODE
XIE BIN
GUO LEI
BC LEE
DEV. STEP
REV
LAST EDIT
08/18/2009
1
1
P0.9V_AUX
P1.8V_AUX
100nF
C616
47
R601
47
R596
47
R599
47
R589
47
R603
47
R631
47
R639
47
R604
47
R595
47
R635
47
R597
47
R640
47
R632
47
R598
47
R637
47
R636
47
R605
47
R591
47
R634
47
R638
47
R606
47
R593
47
R592
47
R602
47
R633
47
R590
47
R600
47
R594
C691
C687
C698
C697
100nF100nF
100nF
10V
TITLEDRAW
10V
10V
10V
Suzhou-D
ADV
0.1
SODIMM_DDR2
SODIMM_DDR2 (1/2)
July 15, 2009 19:25:13 PM
10V
C615
100nF
10V
100nF
C688
10V
C686
100nF
10V
100nF
C683
10V
C613
100nF
10V
100nF
C611
10V
C689
100nF
10V
100nF
C681
10V
C684
100nF
10V
100nF
C609
10V
C608
100nF
10V
100nF
C614
10V
C612
100nF
10V
100nF
C617
10V
C610
100nF
10V
C690
C695
nostuff
nostuff
nostuff
nostuff
nostuffnostuff
100nF100nF
100nF
10V
10V
PAGE
1
1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826
P1.8V_AUX
P1.8V_AUX
P1.8V_AUX
P1.8V_AUX
P1.8V_AUX
P1.8V_AUX
P1.8V_AUX
SAMSUNG
ELECTRONICS
PART NO.
BA41-xxxxxxA
16 58
OF
D
D
B
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
4
DDR SO-DIMM #1
3
2
1
D
Array resistors & Single resistors used to improve layout & routing.
MEM1_BDQ(63:0)
MEM1_BMA(15:0)
C C
MEM1_BBS(2)
MEM1_BBS(0)
MEM1_BBS(1)
MEM1_CS2#
CLK1_MCLK2
CLK1_MCLK2#
CLK1_MCLK3
CLK1_MCLK3#
B B
P3.3V
MEM1_CS3#
C779
0.0015nF
C594
MEM1_CKE2
MEM1_CKE3
MEM1_BCAS#
MEM1_BRAS#
MEM1_BWE#
R35
R36
SMB3_CLK
SMB3_DATA
MEM1_ODT2
MEM1_ODT3
MEM1_BDM(7:0)
MEM1_BDQS(7:0)
MEM1_BDQS#(7:0)
A A
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
50V
50V
0.0015nF
MEM1_SA0_R_MN
10K 1%
MEM1_SA1_R_MN
10K 1%
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
DDR2-1
DDR2-SODIMM-200P-RVS
1/2
102
A0
101
A1
100
A2
99
A3
98
A4
97
A5
94
A6
92
A7
93
A8
91
A9
105
A10_AP
90
A11
89
A12
116
A13
86
A14
84
A15
85
A16_BA2
107
BA0
106
BA1
110
S0*
115
S1*
30
CK0
32
CK0*
164
CK1
166
CK1*
79
CKE0
80
CKE1
113
CAS*
108
RAS*
109
WE*
198
SA0
200
SA1
197
SCL
195
SDA
114
ODT0
119
ODT1
10
DM0
26
DM1
52
DM2
67
DM3
130
DM4
147
DM5
170
DM6
185
DM7
13
DQS0
31
DQS1
51
DQS2
70
DQS3
131
DQS4
148
DQS5
169
DQS6
188
DQS7
11
DQS*0
29
DQS*1
49
DQS*2
68
DQS*3
129
DQS*4
146
DQS*5
167
DQS*6
186
DQS*7
3709-001390
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
0
5
1
7
2
17
3
19
4
4
5
6
6
14
7
16
8
23
9
25
10
35
11
37
12
20
13
22
14
36
15
38
16
43
45
55
57
44
46
56
58
61
63
73
75
62
64
74
76
123
125
135
137
124
126
134
136
141
143
151
153
140
142
152
154
157
159
173
175
158
160
174
176
179
181
189
191
180
182
192
194
MCH3_EXTTS1#
17
MEM1_VREF1
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
Samsung
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
Confidential
59
60
61
62
63
P1.8V_AUX
nostuff
4
C551
100nF
10V
C781
100nF
10V
XC501
330uF
2.5V
OXI
3
P3.3V
P1.8V_AUX
112
111
117
96
95
118
81
82
87
103
88
104
199
83
C552
2200nF-X5R
120
10V
50
69
163
C780
1nF
50V
1
201
202
47
133
183
77
12
48
184
78
71
72
121
122
196
193
8
Place near SO-DIMM1
C619
C699
2200nF-X5R
2200nF-X5R
10V
10V
nostuff
nostuff
nostuff
DDR2-2
DDR2-SODIMM-200P-RVS
2/2
VDD1
VDD2
VDD3
VDD4
VDD5
VDD6
VDD7
VDD8
VDD9
VDD10
VDD11
VDD12
VDDSPD
NC1
NC2
NC3
NC4
NCTEST
VREF
GND0
GND1
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
VSS13
VSS14
VSS15
3709-001390
C692
2200nF-X5R
10V
C629
2200nF-X5R
10V
VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
VSS35
VSS36
VSS37
VSS38
VSS39
VSS40
VSS41
VSS42
VSS43
VSS44
VSS45
VSS46
VSS47
VSS48
VSS49
VSS50
VSS51
VSS52
VSS53
VSS54
VSS55
VSS56
VSS57
C620
2200nF-X5R
10V
C618
100nF
10V
P0.9V_AUX
MEM1_BMA(15:0)
18
24
41
53
42
54
59
65
60
66
127
139
128
145
165
171
172
177
187
178
190
9
21
33
155
34
132
144
156
168
2
3
15
27
39
149
161
28
40
138
150
162
MEM1_CS2#
MEM1_CS3#
MEM1_CKE2
MEM1_CKE3
MEM1_ODT2
MEM1_ODT3
MEM1_BBS(0)
MEM1_BBS(1)
MEM1_BBS(2)
MEM1_BCAS#
MEM1_BRAS#
MEM1_BWE#
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
R622
R615
R621
R610
R616
R611
R648
R617
R643
R641
R608
R650
R642
R618
R649
R647
R619
R612
R645
R646
R620
R607
R613
R624
R644
R609
R623
R614
47
47
47
47
47
47
47
47
47
47
47
47
47
47
47
47
47
47
47
47
47
47
47
47
47
47
47
47
C623
100nF
10V
C678
100nF
10V
C693
100nF
10V
C696
100nF
10V
C602
100nF
10V
C601
100nF
10V
C624
100nF
10V
C674
100nF
10V
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
P1.8V_AUX
10V
C604
P1.8V_AUX
10V
C622
P1.8V_AUX
10V
C600
P1.8V_AUX
10V
C677
P1.8V_AUX
10V
C694
P1.8V_AUX
10V
C626
P1.8V_AUX
10V
C625
P1.8V_AUX
10V
C603
Place one cap close to every 2 pull-up resistors terminated to P0.9V_AUX
P0.9V_AUX
C621
100nF
10V
C627
100nF
10V
C628
100nF
10V
C675
C685
DRAW
CHECK
APPROVAL
MODULE CODE
XIE BIN
GUO LEI
BC LEE
C673
100nF
10V
DATE
DEV. STEP
REV
LAST EDIT
100nF
10V
08/18/2009
C680
100nF
100nF
10V
10V
TITLE
ADV
0.1
2
nostuff
C682
C676
100nF
100nF
10V
10V
Suzhou-D
SODIMM_DDR2
SODIMM_DDR2 (2/2)
July 15, 2009 19:25:13 PM
SAMSUNG
ELECTRONICS
PART NO.
BA41-xxxxxxA
PAGE OF
1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826
5817
D
PLT3_RST#
P1.2V
2801-003856
0.032768MHz
4
B532
BLM18PG181SN1
C996
2200nF-X5R
14
23
R844
20M
Y504
C254
C253
C219
C246
C248
C247
C251
C252
P1.2V
R834
C249
1000nF-X5R
10V
CLK1_SBSRC
CLK1_SBSRC#
CPU1_ALL_LDTSTP
CPU1_PROCHOT#
CPU1_PWRGDCPU
CPU1_LDTSTP#
CPU1_LDTRST#
C952
0.1nF
50V
R194
100nF
100nF 10V
100nF 10V
100nF 10V
100nF 10V
R833
1608
2.05k ohm
6.3V
CLK3_SB14
R204
100K
1%
2.2K
33 1%
10V
10V100nF
10V100nF
10V100nF
562
1%
SB_A_RST#_R_MN
SB_PCIE_TX0P_C_MN
SB_PCIE_TX0N_C_MN
SB_PCIE_TX1P_C_MN
SB_PCIE_TX1N_C_MN
SB_PCIE_TX2P_C_MN
SB_PCIE_TX2N_C_MN
SB_PCIE_TX3P_C_MN
SB_PCIE_TX3N_C_MN
SB_PCIE_CALRP_R_MN
SB_PCIE_CALRN_R_MN
SB_PCIE_PVDD_B_MN
SB_X1_C_MN
SB_X2_C_MN
U516-1
SB710
N2
A_RST#
V23
PCIE_TX0P
V22
PCIE_TX0N
V24
PCIE_TX1P
V25
PCIE_TX1N
U25
PCIE_TX2P
U24
PCIE_TX2N
T23
PCIE_TX3P
T22
PCIE_TX3N
U22
PCIE_RX0P
U21
PCIE_RX0N
U19
PCIE_RX1P
V19
PCIE_RX1N
R20
PCIE_RX2P
R21
PCIE_RX2N
R18
PCIE_RX3P
R17
PCIE_RX3N
T25
PCIE_CALRP
T24
PCIE_CALRN
P24
PCIE_PVDD
P25
PCIE_PVSS
N25
PCIE_RCLKP_NB_LNK_CLKP
N24
PCIE_RCLKN_NB_LNK_CLKN
K23
NB_DISP_CLKP
K22
NB_DISP_CLKN
M24
NB_HT_CLKP
M25
NB_HT_CLKN
P17
CPU_HT_CLKP
M18
CPU_HT_CLKN
M23
SLT_GFX_CLKP
M22
M19
M20
N22
G25
G24
J19
J18
L20
L19
P22
L18
J21
J20
A3
B3
F23
F24
F22
Samsung
SLT_GFX_CLKN
GPP_CLK0P
GPP_CLK0N
GPP_CLK1P
GPP_CLK1N
GPP_CLK2P
GPP_CLK2N
GPP_CLK3P
GPP_CLK3N
25M_48M_66M_OSC
14M_X1
14M_X2
Confidential
X1
X2
ALLOW_LDTSTP
PROCHOT#
LDT_PG
LDT_STP#
LDT_RST#
0904-002534
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
PEX1_SB_TXP(0)
PEX1_SB_TXN(0)
PEX1_SB_TXP(1)
PEX1_SB_TXN(1)
PEX1_SB_TXP(2)
PEX1_SB_TXN(2)
PEX1_SB_TXP(3)
PEX1_SB_TXN(3)
PEX1_SB_RXP(0)
PEX1_SB_RXN(0)
PEX1_SB_RXP(1)
PEX1_SB_RXN(1)
PEX1_SB_RXP(2)
PEX1_SB_RXN(2)
PEX1_SB_RXP(3)
PEX1_SB_RXN(3)
C C
B B
C1026
0.01nF
C1013
A A
0.01nF
4
3
PCI CLKSPCI INTERFACE
PCICLK5_GPIO41
PCI EXPRESS INTERFACE
CLOCK GENERATOR
RTC XTALCPU
LPCRTC
LDRQ1#_GNT5#_GPIO68
BMREQ#_REQ5#_GPIO65
INTRUDER_ALERT#
3
SB_710_AMD
1 / 5
P4
PCICLK0
P3
PCICLK1
P1
PCICLK2
P2
PCICLK3
T4
PCICLK4
T3
N1
PCIRST#
U2
AD0
P7
AD1
V4
AD2
T1
AD3
V3
AD4
U1
AD5
V1
AD6
V2
AD7
T2
AD8
W1
AD9
T9
AD10
R6
AD11
R7
AD12
R5
AD13
U8
AD14
U5
AD15
Y7
AD16
W8
AD17
V9
AD18
Y8
AD19
AA8
AD20
Y4
AD21
Y3
AD22
Y2
AD23
AA2
AD24
AB4
AD25
AA1
AD26
AB3
AD27
AB2
AD28
AC1
AD29
AC2
AD30
AD1
AD31
W2
CBE0#
U7
CBE1#
AA7
CBE2#
Y1
CBE3#
AA6
FRAME#
W5
DEVSEL#
AA5
IRDY#
Y5
TRDY#
U6
PAR
W6
STOP#
W4
PERR#
V7
SERR#
AC3
REQ0#
AD4
REQ1#
AB7
REQ2#
GNT0#
GNT1#
GNT2#
CLKRUN#
LOCK#
LPCCLK0
LPCCLK1
LAD0
LAD1
LAD2
LAD3
LFRAME#
LDRQ0#
SERIRQ
RTCCLK
VBAT
AE6
AB6
AD2
AE4
AD5
AC6
AE5
AD6
V5
AD3
AC4
AE2
AE3
G22
E22
H24
H23
J25
J24
H25
H22
AB8
AD7
V15
C3
C2
B2
REQ3#_GPIO70
REQ4#_GPIO71
GNT3#_GPIO72
GNT4#_GPIO73
INTE#_GPIO33
INTF#_GPIO34
INTG#_GPIO35
INTH#_GPIO36
SB_PCICLK0_R_MN
SB_PCICLK1_R_MN
SB_PCICLK2_R_MN
SB_PCICLK3_R_MN
SB_PCICLK4_R_MN
SB_PCICLK5_R_MN
SB_LPCCLK0_R_MN
SB_LPCCLK1_R_MN
0
1
2
3
R161
R162
R200
R198
R186
R187
5%
0.022nF
0.022nF
5%
C234
50V
50V
C235
PCI3_AD23
PCI3_AD24
PCI3_AD25
PCI3_AD26
PCI3_AD27
PCI3_AD28
P3.3V
R877
10K
1%
R878
10K
1%
PCI3_CLKRUN#
R240
R247
LPC3_LAD(3:0)
LPC3_LFRAME#
CHP3_SERIRQ
CHP3_RTCCLK
CHP3_INTRUDER#
CHP3_RTCRST#
2
22.6 1%
22
22
1%22.6
22.6 1%
22.6 1%
22.6
1%
22.6
1%
For BIOS Upgrade Select:
PU For Suzhou-D
PD For Bremen-D
LPC3_CLK0
LPC3_CLK1
2
CLK3_PCLKMICOM
CLK3_DBGLPC
PCI3_CLK2
PCI3_CLK3
PCI3_CLK4
PCI3_CLK5
CHP3_INTRUDER#
CHP3_RTCRST#
DRAW
CHECK
APPROVAL
MODULE CODE
C166
1000nF-X5R
nostuff
For RTC Reset
Place under Memory Door
XIE BIN
GUO LEI
BC LEE
KBC3_RCIN#
KBC3_A20G
RTC BATTERY
PRTC_BAT
nostuff
nostuff
1M
R298
1000nF-X5R
C346
100nF
10V
C347
DATE
DEV. STEP
REV
LAST EDIT
1608
C345
1000nF-X5R
08/18/2009
CHP3_RTCRST#_R_MN
R296
25V
TITLE
ADV
0.1
10K
R176
R174
P3.3V_MICOM
3
510
1%
Suzhou-D
ICH
SB710 (1/5)
July 15, 2009 19:25:13 PM
1
P3.3V
1%
1%10K
nostuff
BAT54C
30V
D11
12
CHP3_RTCRST#_RD_MN
1K
R300
3
4
PAGE OF
1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826
J519
HDR-2P-SMD
1%
1
2
MNT1
MNT2
3711-000541
SAMSUNG
ELECTRONICS
PART NO.
BA41-xxxxxxA
5818
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