Samsung NP700G7C-T01US, NP700G7CS02US User Manual

NP700G7C

700G7C

MANUAL

SERVICE

70G7CContents

1.Precaution

2.Introduction

3.DesassemblyandReassembly

4.Troubleshooting

5.SystemWireDiagram

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents

1.Precaution........................................................................................................................................1−1

1.1.GeneralAfter-SalesServicePrecautions.......................................................................................1−1

1.2.SafetyPrecautions...................................................................................................................1−2

1.3.Ground..................................................................................................................................1−3

1.4.StaticElectricityPrecautions......................................................................................................1−4

2.Introduction.....................................................................................................................................2−1

2.1.ProductFeatures......................................................................................................................2−1

2.2.Specication...........................................................................................................................2−3

2.3.Comparingproductspecications...............................................................................................2−9

2.4.OptionpartList.......................................................................................................................2−10

2.5.FunctionofProduct..................................................................................................................2−14

2.6.Hardware–NewH/W.............................................................................................................2−20

2.7.SWList.................................................................................................................................2−29

2.8.SystemSetup(BiosSetup).........................................................................................................2−31

2.9.MainBoardInformation............................................................................................................2−37

3.DesassemblyandReassembly..............................................................................................................3−1

3.1.MainSystem............................................................................................................................3−1

3.2.LCDPart................................................................................................................................3−4

4.Troubleshooting...............................................................................................................................4−1

4.1.Generalspec...........................................................................................................................4−1

4.2.DebuggingFlowChart..............................................................................................................4−2

4.3.SystemDiagnosis....................................................................................................................4−5

4.4.DiagnosticProgram..................................................................................................................4−6

4.5.HardwareTroubleshooting........................................................................................................4−8

4.5.1.LCD.........................................................................................................................4−8

4.5.2.MainSystem..............................................................................................................4−10

4.6.RTCBatteryReset...................................................................................................................4−17

4.7.CPUFANControl....................................................................................................................4−18

4.8.BatteryUsetime......................................................................................................................4−21

4.9.BiosUpdate............................................................................................................................4−24

4.10.H/WUpgrade.........................................................................................................................4−25

5.SystemWireDiagram........................................................................................................................5−1

5.1.SystemLayout........................................................................................................................5−1

5.2.BoardComponent....................................................................................................................5−4

1.Precaution

DEVICE UNDER TES T

(READING S HOULD) NOT BE ABOVE 0 .5mA

LEAKAGE CURR ENT TES TER

TES T ALL EXPO SED METAL SUR FACES

2-WIRE C ORD

*ALSO TE ST WITH PLUG R EVERS ED (USING AC ADAPTER PLUG AS REQUIRED)

EARTH GRO UND

1.1.GeneralAfter-SalesServicePrecautions

1)Donotletcustomersrepairtheproductthemselves..

›Thereisadangerofinjuryandtheproductlifetimemaybeshortened.

2)Makesuretodisconnectthepowercordfromthewalloutletbeforerepairingtheproduct(especiallyforafter-sales serviceofelectricparts).

›Thereisadangerofelectricshock.

3)Donotletcustomersplugseveralelectrichomeappliancesintoasinglewalloutletatthesametime.

›Thereisadangerofreduetooverheating.

4)Checkifthepowerplugorwalloutletaredamagedinanyway.

›Ifadefectisfound,repairorreplaceitimmediately.

(Thereisadangerofelectricshockorre)

1.Precaution

5)Makesurethatitisproperlygrounded. (Checkthegroundofthewalloutlet)

›Electricityleakagemaycauseelectricshock.

Figure1.1LeakageCurrentTestCircuit

6)Donotspraywaterontotheproducttocleanit.

›Thereisadangerofelectricshockorreanditmayshortenthelifetimeoftheproduct..

7)Checktheassemblystatusoftheproductaftertheafter-salesservice..

›Theassemblystatusoftheproductmustbethesameasbeforetheafter-salesservice.

8)Unplugthepowercordholdingthepowerplug(andnotthecord).

›Ifthecordisdisconnected,itmaycauseelectricshockorre.

9)Repairtheproductusingonlyauthorizedparts

10)Keeptheproductawayfromheatingdevicessuchasheaters.

›Exposuretoheatersmaycausedeformationoftheproductorre.

1.Precaution

1.2.SafetyPrecautions

1)EMI ThisdevicehasbeenregisteredregardingEMIforresidentialuse.Itcanbeusedinallareas.

2)CircuitTest(LogicT est)Precautions TheLSIandMSIusedinthisproductaresemiconductorintegratedcircuitsbasedonMOS-FETorCMOS.Since

thesetypesofdevicesarehighlysusceptibletostaticelectricityorcurrentleakage,anisolationbreakmaybecaused. Thereforereadandfollowtheinstructionsbelow.

a)WhenhandlinganLSIorMSI,makesureyourbodyisgroundedthroughafewmega-ohmsofresistance.In

addition,wearglovesandajacketmadeofcottonandnotofsyntheticbersthateasilygeneratestaticelectricity. b)Whenrepairingtheproduct,placeaconductivematerial(e.g.aluminumfoil)groundedtotheearthontheworktable. c)Youmustuseasolderingironwithoutaleakagecurrent. d)DonottouchthepinofanICandcarefullyinserttheICintotheblackplasticpackage. e)WheninsertinganICintoaPCB,becarefulwiththedirectionoftheIC.WheninstallinganICinthewrong

direction,itmightbecomedamaged. f)WhencarryinganIC,packagetheICwithconductingmaterialsuchasaluminumfoilorconductingspongesoasto

keepthevoltagelevelofeachoftheterminalsthesame. g)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible. h)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible. i)WhensolderinganIC,solderitinasshortatimeaspossiblesothatunnecessaryheatisnotappliedtothedevice. j)AvoidleavingexcessiveamountsofuxwithinacustomICorbetweenthepinswhensolderingacustomIC. k)TakecaretonotdamagetheboardwheninstallingorseparatinganOptionBoard. l)TakecaretonotbreaktheprintedcircuitpatternonthePCBwhenseparateanIC.

1.Precaution

1.3.Ground

Theproductmustbegroundedtoprotectitfromstaticelectricityandotherdangers.Whenusingamultitap,pleaseusea multitapwithagroundterminalonly.

Ifyouusea220Vwalloutletwithagroundterminal,youdonotneedtogrounditadditionally.Avoidusingwalloutletsif theyarenotgroundedeveniftheyhaveagroundterminal.

Togroundtheproduct,connectthegroundtoanexclusivegroundterminalormetalwaterpipe.Connectthegroundcableto thegroundterminalattherearofthemainbody.Togroundtheproduct,connectthegroundterminaloftheproducttoa metalwaterpipe,walloutletorexclusivegroundterminalwithanelectricwireequaltoorthickerthan#18.

NevergroundtheproducttoaPVCwaterpipe,phoneline,TV ,radioantenna,aluminumwindoworgaspipe,becausethis doesnotactuallygroundtheproductandmaybedangerous.

※Iftheproductisdamagedbygroundingunused:Paidserviceresponse

1.Precaution

1.4.StaticElectricityPrecautions

Manypartsofthesystemaresusceptibletostaticelectricity.Usinganelectrostaticdischarge(ESD)deviceisveryimportant forthesafetyoftheuserandtheuser'ssurroundings.UsinganESDdeviceincreasestheprobabilityofasuccessfulrepair andlowerstheexpensesfordamagedparts.

Topreventstaticelectricity,followtheinstructionsbelow.

1)Performtherepairinalocationwithoutstaticelectricity.

2)Touchyourhandstoametalwaterpipeorsomemetalobjectconnectedtothegroundtodischargeanystatic Electricityfromyourbodybeforehandlingtheparts.

3)Touchonlytheedgesoftheboard,ifpossible.

4)Donottouchanypartsunlessabsolutelynecessary

5)Disassemblethepartsontheanti-static-electricitypad.

6)Whenaboardisnotinstalledinthesystem,packagetheboardwithananti-static-electricitypackaging.

2.Introduction

2.1.ProductFeatures

2.Introduction

2.2.Specication

ProcessorandMotherboard

CPU***

(UpgradeNot,Useonekindof)

SocketSocketG2(rPGA988B) Manufacturingprocess0.022micron CacheL2:6MB IntelTurboBoost

ChipsetIntelHM76 BIOS64MbitSPIash ThermalDesignPerformanceMAX.45W

Memory Memory***/Max.MemoryMAX.16GB(Max4GBperSODIMM)

MemorytypePC3-12800(1600MHz)DDR3SODIMM

MemoryModules4GBSODIMM8GBSODIMM16GBSODIMM

Intel®Core™i7Processor3610QM(2.30GHz,6MB) Intel®Core™i7Processor3720QM(2.60GHz,6MB) Intel®Core™i7Processor3820QM(2.70GHz,6MB)

i7-3610QM-Max3.3Ghz i7-3720QM-Max3.6Ghz i7-3610QM-Max3.7Ghz

※PC3-10600(1333Mhz) Memoryreliability/compatibilityvericationiscomplete

Sockets4-slotSODIMMs

DisplayandGraphics LCD***17.3"FHD+(16:9)Glare

VendorSamsungLCD TypeLEDLCDwithGlare LCDViewableArea381.888(H)x214.812(V)(17.3”diagonal) LCDPanelTN LCDResolutionFHD(1920x1080) PixelPitch0.2175(H)x0.2088(V)(TYP.) ViewingangleHorizontal65°/65°,Vertical45°/50°(TYP.) ColorGamut72%(TYP.) Brightness400cd/m2 Responsetime5ms(typ) ThemaximumopeningangleLCD145º

GraphicsController***nVidia675M(N13E-GS1,MXM) VideoMemory2GBgDDR5Descretedgraphicmemory GPUTDPMax.75W Max.ResolutionforLFPLVDSduallinkresolutionof1920X1200perlink/amaximum

theoreticalpixelrateof224MP/s

2.Introduction

Max.resolutionforVGAMaxresolutionof2,048x1,536at85Hzrefreshrate(ext.)

(640x480,800x600,1024x768,1152x864, 1280x800,1280x960,1280x1024,1400x1050, 1440x900,1600x1024,1600x1200,1680x1050,1920x1200, 1920x1440,2048x1536)

[Ext.monitorresolutionsSupportedbyEDIDinformation]

Max.resolutionforHDMISupportv1.4acompliant/aresolutionof2048x1536pixels

with32-bitcolorat75Hz [Ext.monitorresolutionsSupportedbyEDIDinformation]

Max.resolutionforDisplayPortSupportDP++/aresolutionof2048x1536pixelswith32-bit

colorat75Hz [Ext.monitorresolutionsSupportedbyEDIDinformation]

3DFunctionNotsupport

AudioandVideo

Sound

ChipsetREALTEKALC269Q-VB2-GR CodecHDAudioCodec,ALC269Q-VB2-GR ConversionBuilt-inhighperformance24-bitADC&24-bitDAC SoundeffectDolby InternalInterfacesEmbeddedstereospeakers&integratedmonomicrophone SpeakerPowerRating2speakersx2Wwithenclosureeach+Woofer3W ExternalInterfacesMicrophone,Headphone,SPDIFNOTSUP ControlsKeyboardvolumecontrol

Microphone

Type1integratedmonomicrophone Sensitivity.-42dB[0dB=1V/Pa,at1KHz] OutputimpedaceMax.2,200Ohmat1KHz NoisesupressionNoisesupression

Camera

Type2.0FHDWeb-Cam(interface:USB2.0) ChipsetSC_20FHL11146M(MCNEX) Imagesensor.1/6”ColorCMOS2.0MFHD(1920X1080) StillImageCaptureResolution1920x1080(FullHD1080P),1280x720(HD720P),800x

600(SVGA), 640x480(VGA),352x288(CIF),320x240(QVGA),176

x144(QCIF) 160x120(QQVGA)

VideoCaptureResolution1920x1080(FullHD1080P),1280x720(HD720P),800x

600(SVGA), 640x480(VGA),352x288(CIF),320x240(QVGA),176

x144(QCIF)

160x120(QQVGA) OutputVideoFormatUncompressed–basedonCameraH/W UVCSupportSupproted

Storage

2.Introduction

HardDiskDrive-7200rpm***9.5mmH2.5"SATAHDD,Removable HDDVendorHGST,Fujitsu,SamsungStorage,Toshiba,WD Type9.5mmHeight2.5"S-ATA SupportsSATAhostcontrollersupport48bitLBA(HDDInterface

supportsSATA1

-1stHDD/SA T A2-2ndHDD) AverageAccessTime13msec. Speed5400rpm/7200rpmSA TA Capacity500GB,750GB,1TB,1.5TB,2TB(F.option)

*SSDSupport(1stHDD:SA TA3/2ndHDD:SATA2 Support)

2ndHDDAssyUnitBA96-05817A

-includedinbundleUNIT_BRACKET-HDD_SUPPORT

RUBBER-HDD SCREW-MACHINEMANUAL-1SHEET_GUIDE

LABEL-PPID_E

ExpressCache(ISSD)SandiskExpressCachei100adpot(Interface:P5:SA TA3,

P4:SA TA2) SpeedMaximumHosttrasferRate6Gb/s Capacity8GB

OpticalDriverModules OpticalDiskDriver***Blue-rayComboDrive1(Blue-rayReadonly)-SA TA2

Interface VendorTSST/PLDS Moduletype12.7mmFixedtype,S-AT A Speed4xBD-R/BD-RE,2xBD-RDL/BD-REDL,5xDVD-RAM,

8xDVD±R,

6xDVD±RDL,8xDVD+RW,6xDVD-RW,24xCD-R/RW ,

8xDVD,24xCD AverageAccessTimeBD250~400ms,DVD150~350ms.,CD150~170ms. Weight175g+/-5g S/WSuppliedCyberlinkMediaSuite8BlurayDisc3D,Bluray,

Supermulti(F.option) SecurityRPC-IIRegionalEncoding

OpticalDiskDriver***SuperMultiDualLayer VendorTSST/TEAC/PLDS Moduletype12.7mm,S-ATA,Fixedtype SpeedWriting(CD-R24X/CD-RW24X/DVD±R8X/DVD+RW

8X(4X)/DVD-RW6X/DVD-RAM5X),

Reading(CD24X/DVD8X) AverageAccessTimeDVD130~160msTyp,CD130~160msTyp Weightmax.140g S/WSuppliedCyberlinkDVDSolution SecurityRPC-IIRegionalEncoding

2.Introduction

NetworkT ools LAN***Integrated10/100/1000MbpsEthernet

ChipsetRTL8111E FeaturesRJ45Output Combomodule***IntelJacksonpeak2WLAN+BTCombo TypeIntelJacksonPeak2,802.11a/g/n2x2WiFi_Bluetooth(4.0)

Combocard(Vendor:Intel)

MaxSpeed300Mbps(LinkSpeedisonlystandardvalue,Actuallyvalue

willdecidedbyeachenvironmant) InterfaceHalfMinicardtype Chipset1.Jackson-Peak2MAC/BBSilicon2.Jackson-Peak22x2

Wi-Fi-BTRadioSilicon Antenna2AntennaSupport:WLAN(2TX,2RX),BT(1TX/RX)

BluetoothModule

TypeIntel802.11agn(2x2)+Bluetooth4.0(HalfMiniCardSTD) VendorIntel InterfacePCIe(WLAN)+USB(Bluetooth)

I/OInterface MemorycardslotMemorycardchip7-in-1RTS5209

VendorRealtek Support(SD/SDHC/SDXC/XD/MMC/Memorystick/

MemorystickPro)

testedupto32GB

Size27mm*5mm

I/OPorts

USBPort2xUSB2.0portsand2xUSB3.0ports(incl.1Chargeable) VGAPort1CRT AudioJacksHeadPhone-out,MIC-in LANRJ45 TV1HDMI(15mm*6mm),1DP(16mm*7mm) SecurityKensingtonLock(8mm*3mm) Power1xDC-injackforACadapter(12.8pie)

InputDevices

Keyboard"100(KOR,RUS,UKR,US)101(UK,FR,GM,SP)"

└NumKeypad

Yes

TouchpadELANtouchpad(withgesturefunction)

PowerandPowerManagement

Systempowermanagement

PowermanagementfeaturesACPIV2.0compliant,Standby(S3),Hibernate(S4)

Standardbattery***

ModelcodeAA-PBAN8AB

TypeLi-ion Detailsofcell8cells Batterycapacity5,900mAh Voltage15.1V Batteryrating89Wh ColorBlack/Yellow Dimension140x85x30.0mm(WxHxD) WeightMax.400g RechargetimeApprox.3.0hours

ACAdapter***A11-200P1A OutputPower200W Dimension170X85X35mm(WxHxD) Weight(ACAdapter)Typ.750g WorldwideCompatibilityAuto-sensing110-240VAC LineFrequency50Hz/60Hz

2.Introduction

AdapterRating-Input100V AC~240VAC,1.5A AdapterRating-Output19.0VDC,10.5A

SystemDimensions

Dimensions(WXDXH)W409.84xL284.8xH32.99~52.6 Weight3.81KG(3.4KGwithoutbattery) ConditionSM-DL,8cellbattery,2.5"500GBHDD PackageDimensions(WXDXH) PackageWeight6.6kg ConditionSM-DL,8cellbattery,2.5"500GBHDD MaterialsPC/ABS

Design LCDBackNCVM

Safeplasticlmsupport LCDFrontUVCoat SystemTopUVMolding SystemBottomPC+ABS

ProtectFilm

SystemTopYes SystemYes LCD-BACKYES

O/S

XPDriverN/A(Because3Dfunction)

LabelLocation