Samsung MZ-7GE960EW User Manual

Page 1

DATA SHEET Ver. 1.1, June, 2014

SAMSUNG SSD 845DC EVO

Data Sheet, Ver. 1.1

DISCLAIMER

SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein may change without notice and

is provided on an “AS IS” basis, without warranties

of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppels or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office.

This material is copyrighted by Samsung Electronics. Any unauthorized reproductions, use or disclosure of this material, or any part thereof, is strictly prohibited and is a violation under copyright law.

TRADEMARKS & SERVICE MARKS

The Samsung Logo is the trademark of Samsung Electronics. Adobe is a trademark and Adobe Acrobat is a registered trademark of Adobe Systems Incorporated. All other company and product names may be trademarks of the respective companies with which they are

associated.

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DATA SHEET Ver. 1.1, June, 2014

Revision History

Revision No.

History

Date

Ver.1.0

Initial Release

May 2014

Ver.1.1

Content reorganized

June 2014

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DATA SHEET Ver. 1.1, June, 2014

Table of Contents

Product Overview Revision history

1. General Description .......................................................................................................................................................................... 5

2. Mechanical Specification ................................................................................................................................................................ 6

2.1 Physical dimensions and Weight........................................................................................................................................... 6

3. Product Specifications ..................................................................................................................................................................... 7

3.1 Interface and Configuration .................................................................................................................................. 7

3.2 Capacity ................................................................................................................................................................ 7

3.3 Performance .............................................................................................................................................................................. 7

3.3.1 Sequential Read/Write Bandwidth ................................................................................................................................ 7

3.3.2 Random Read/Write Input/Output Operations Per Second (IOPS)................................................................ 7

3.3.3 IOPS Consistency ................................................................................................................................................................ 7

3.3.4 Latency ........................................................................................................................................... ..................... 8

3.3.5 Quality of Service (QoS)...................................................................................................................................................... 8

3.4 Electrical Characteristics.......................................................................................................................................................... 9

3.4.1 Supply Voltage ................................................................................................................................................................. 9

3.4.2 Power Consumption ................................. ..................................... ............... ................................................................ 9

3.4.3 Power Loss Protection ............................................................................ ................................................... 9

3.5 Reliability .............................................................................................................. .............................. 10

3.6 Environmental Specifications ............................................................................................................................................. 10

4. Electrical Interface Specification ……………………………………………………………………………………………………………………………………… 11

4.1 Serial ATA Interface connector............................................................................................................................................... 11

4.2 Pin Assignments............................................................................................................................................................................ 11

5. Shadow Register Block registers Description ...........................................................................................................................12

5.1 Command Register........................................................................................................................................................................12

5.2 Device Control Register.............................................................................................................................................................. 12

5.2.1 Field / bit description .........................................................................................................................................................12

5.3 Device / Head Register............................................................................................................................................................... 12

5.3.1 Field / bit description .................................................................................................................................................………12

5.4 Error Register ..........................…………………………………………………………………………………………………………………………………………..12

5.4.1 Field / bit description …………………………………………………………..……………………………………….............................................12

5.5 Features Register ......................................................................................................................................................................... 12

5.6 Cylinder High (LBA High) Register ......................................................................................................................................... 13

5.7 Cylinder Low (LBA Mid) Register ............................................................................................................................................ 13

5.8 Sector Number (LBA low) Register ....................................................................................................................................... 13

5.9 Sector Count Register ................................................................................................................................................................ 13

5.10 Status Register ........................................................................................................................................................................... 13

5.10.1 Field / bit description .......................................................................................................................................................13

6. Command Descriptions......................................................................................................................................................................14

6.1 Supported ATA Commands……………………………………………………………………………………………………………………………………….….14

6.2 SECURITY FEATURE Set ............................................................................................................................................................ 15

6.2.1 SECURITY mode default setting.................................................................................................................................... 15

6.2.2 Initial setting of the user password............................................................................................................................... 15

6.2.3 SECURITY mode operation from power-on.............................................................................................................. 15

6.2.4 Password lost......................................................................................................................................................................... 15

6.3 SMART FEATURE Set (B0h) …………………………………………………………………………………………………………………………………………. 15

6.3.1 Sub Command ..................................................................................................................................................................... 15

6.3.1.1 S.M.A.R.T. Read Attribute Values (subcommand D0h)............................................................................... 15

6.3.1.2 S.M.A.R.T. Read Attribute Thresholds (subcommand D1h) ..................................................................... 15

6.3.1.3 S.M.A.R.T. Enable/Disable Attribute Autosave (subcommand D2h) ................................................... 15

6.3.1.4 S.M.A.R.T. Save Attribute Values (subcommand D3h) .............................................................................. 16

6.3.1.5 S.M.A.R.T. Execute Off-line Immediate (subcommand D4h) ...........................................................……..16

6.3.1.6 S.M.A.R.T. Selective self-test routine ................................................................................................................ 16

6.3.1.7 S.M.A.R.T. Read Log Sector (subcommand D5h)...........................................................................................18

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DATA SHEET Ver. 1.1, June, 2014

6.3.1.8 S.M.A.R.T. Write Log Sector (subcommand D6h)..........................................................................................18

6.3.1.9 S.M.A.R.T. Enable Operations (subcommand D8h) ……………………………………………………………………………..18

6.3.1.10 S.M.A.R.T. Disable Operations (subcommand D9h) .................................................................………………18

6.3.1.11 S.M.A.R.T. Return Status (subcommand DAh) ........................................................................................….18

6.3.1.12 S.M.A.R.T. Enable/Disable Automatic Off-line (subcommand DBh) ................................................. 19

6.3.2 Device Attribute Data Structure.......................................................................................................................................... 19

6.3.2.1 Data Structure Revision Number ...................................................................................................................... 19

6.3.2.2 Individual Attribute Data Structure .................................................................................................................. 19

6.3.2.3 Off-Line Data Collection Status .......................................................................................................................... 21

6.3.2.4 Self-test execution status...................................................................................................................................... 21

6.3.2.5 Total time in seconds to complete off-line data collection activity .................................................... 21

6.3.2.6 Current segment pointer ...................................................................................................................................... 21

6.3.2.7 Off-line data collection capability ………………………………………………………………………………………………………….. 21

6.3.2.8 S.M.A.R.T. Capability ................................................................................................................................................ 22

6.3.2.9 Error logging capability ......................................................................................................................................... 22

6.3.2.10 Self-test failure check point.............................................................................................................................. 22

6.3.2.11 Self-test completion time ................................................................................................................................. 22

6.3.2.12 Data Structure Checksum.................................................................................................................................. 22

6.3.3 Device Attribute Thresholds data structure .................................................................................................................. 22

6.3.3.1 Data Structure Revision Number ……………………………………………………………………………………………………………. 22

6.3.3.2 Individual Thresholds Data Structure............................................................................................................... 22

6.3.3.3 Attribute ID Numbers ............................................................................................................................................. 22

6.3.3.4 Attribute Threshold ................................................................................................................................................. 23

6.3.3.5 Data Structure Checksum..................................................................................................................................... 23

6.3.4 S.M.A.R.T. Log Directory …………………………………………………………………………………………………………………………………………… 23

6.3.5 S.M.A.R.T. error log sector ……………………………………………………………………………………………………………………………………….. 23

6.3.5.1 S.M.A.R.T. error log version ………………………………………………………………………………………………………………………. 23

6.3.5.2 Error log pointer ....................................................................................................................................................... 23

6.3.5.3 Device error count .................................................................................................................................................. 23

6.3.5.4 Error log data structure ......................................................................................................................................... 23

6.3.5.5 Command data structure ..................................................................................................................................... 23

6.3.5.6 Error data structure.................................................................................................................................................. 25

6.3.6 Self-test log structure ................................................................................................................................................ 25

6.3.7 Selective self-test log data structure ………………………………………………………………………………………………………… 25

6.3.8 Error reporting .............................................................................................................................................................. 26

7. OOB signaling and Phy Power State ............................................................................................................................................ 27

7.1 OOB signaling ................................................................................................................................................................................ 27

7.1.1 OOB signal spacing ............................................................................................................................................................. 27

7.2 Phy Power State............................................................................................................................................................................ 27

7.2.1 COMRESET sequence state diagram .......................................................................................................................... 27

8. SPOR Specification(Sudden Power Off and Recovery) ........................................................................................................ 28

8.1. Data Recovery in Sudden Power Off..................................................................................................................................... 28

8.2 Time to Ready Sequence........................................................................................................................................................... 28

9. SATA II Optional Feature.................................................................................................................................................................... 29

9.1 Asynchronous Signal Recovery............................................................................................................................................... 29

9.2 Power Segment Pin P11 ........................................................................................................................................................... 29

9.3 Activity LED indication ............................................................................................................................................................... 29

10. Product Compliance......................................................................................................................................................................... 30

10.1 Product Regulatory compliance and Certifications .................................................................................................... 30

11. Identify Device Data ........................................................................................................................................................................ 31

12. Product Line up ................................................................................................................................................................................. 33

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DATA SHEET Ver. 1.1, June, 2014

1. General Description

845DC EVO

Capacity

240GB, 480GB, 960GB

Application

Mixed and Read-centric applications are recommended

Dimensions (LxWxH)

(100.20±0.25) x (69.85±0.25) x (6.80±0.20) mm

Weight

Max. 63g (960GB)

Interface

Serial ATA 6Gb/s (compatible with SATA 3Gb/s and SATA 1.5Gb/s) Fully complies with ATA/ATAPI-7 Standard(Partially Complies with ATA/ATAPI-8) Support NCQ : Up to 32 depth

Form Factor

2.5” type

Controller

Samsung 3-core MEX controller

NAND Flash Memory

Samsung 19nm Toggle 3bit MLC NAND

DRAM Cache memory

256MB (240GB), 512MB (480GB), 1GB (960GB)

Performance*

Sequential Read:

Up to. 530 MB/s

Sequential Write:

Up to. 410 MB/s (480GB, 960GB)

Up to. 270 MB/s (240GB)

Random Read (4KB, QD32):

Max. 87,000 IOPS

Random Write (4KB, QD32):

Max. 14,000 IOPS(480GB, 960GB) Max. 12,000 IOPS(240GB)

Quality of Service

(4KB, QD32)

99.99%

Read: 0.6ms

Write: 7ms

Max.

Read: 3ms

Write: 8ms

Latency

(4KB, QD1)

Sequential

Read :55 us Write : 45us

Random

Read :115us Write : 55us

Reliability

- Mean Time Between Failures (MTBF) : 2,000,000 hours

- Uncorrectable Bit Error Rate (UBER) : 1 sector per 10

bits read

- End-to-end data protection

TBW

240GB : 150TBW 480GB : 300TBW 960GB : 600TBW

Power Consumption

Active Read/Write : 3.1 Watt/4.2Watt Idle : 1.5 Watt

Temperature

Operating: Non-Operating:

0°C to 70°C

-40°C to 85°C

Humidity

5% to 95%, non-condensing

Vibration

Non-Operating:

20~2000Hz, 20G

Shock

Non-Operating:

1500G , duration 0.5m sec, 3 axis

Certification

CE, BSMI, KCC, VCCI, C-tick, FCC, IC, UL, TUV, CB

RoHS compliance

ROHS2

Warranty

5 years limited

Samsung SSD 845DC EVO is designed for server and data centers delivering an exceptionally high performance, consistent low latency and outstanding reliability. With the addition of Tantalum capacitors, crucial data is protected from corruption due to power loss more than ever before. The 845DC EVO provides a state-of-the-art yet cost-effective solution for today’s increasing data traffic.

* Actual performance may vary depending on use conditions and environment

1. Performance measured using FIO with queue depth 32

2. Measurements are performed on whole LBA range

3. Write cache enabled

4. 1MB/sec = 1,048,576 bytes/sec was used in sequential performance

5. Uncorrectable Bit Error Rate (UBER) and Endurance (TBW) is based on JEDEC standard.

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DATA SHEET Ver. 1.1, June, 2014

2. Mechanical Specification

Model Name

Height

Width

Length

Weight

MZ-7GE240 MZ-7GE480 MZ-7GE960

6.80±0.20

69.85±0.25

100.20±0.25

Max. 63g

2.1 Physical dimensions and Weight

※ For the thickness size(height), drive label thickness was included

[Figure 2-1] Physical dimension

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DATA SHEET Ver. 1.1, June, 2014

3. Product Specifications

MZ-7GE240

MZ-7GE480

MZ-7GE960

Unformatted Capacity

240 GB

480 GB

960 GB

User-addressable Capacity

(Number of sectors)

468,862,128

937,703,088

1,875,385,008

Byte per Sector

512 Bytes

Sequential (128KB, MB/s)

Model Name

MZ-7GE240

MZ-7GE480

MZ-7GE960

Read

530

Write

270

410

4KB Random (IOPS)

MZ-7GE240

MZ-7GE480

MZ-7GE960

QD 32

Read IOPS

87,000

Write IOPS

12,000

14,000

QD 1

Read IOPS

8,000

Write IOPS

12,000

14,000

8KB Random (IOPS)

MZ-7GE240

MZ-7GE480

MZ-7GE960

QD 32

Read IOPS

55,000

Write IOPS

6,000

7,000

QD 1

Read IOPS

7,000

Write IOPS

3,000

5,000

3.1 Interface and Configuration

Burst read/write rate is 600 MB/sec (6Gb/s). Fully compatible with ATA-7 Standard (Partially Complies with ATA/ATAPI-8)

3.2 Capacity

※ 1 Megabyte (MB) = 1 Million bytes; 1 Gigabyte (GB) = 1 Billion bytes

Actual usable capacity may be less due to formatting, partitioning, operating system, application and otherwise.

3.3 Performance

3.3.1 Sequential Read/Write Bandwidth

3.3.2 Random Read/Write Input/Output Operations Per Second (IOPS)

※ Actual performance may vary depending on usage conditions and system environment.

1. Performance measured FIO with queue depth 32

2. Measurements are performed on whole LBA range

3. Write cache enabled

4. 1MB/sec = 1,048,576 bytes/sec was used in sequential performance

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DATA SHEET Ver. 1.1, June, 2014

3.3.3 IOPS Consistency

4KB

MZ-7GE240

MZ-7GE480

MZ-7GE960

Random Read (%)

QD1

QD32

Random Write (%)

QD1

QD32

90 8KB

MZ-7GE240

MZ-7GE480

MZ-7GE960

Random Read (%)

QD1

QD32

Random Write (%)

QD1

QD32

MZ-7GE240

MZ-7GE480

MZ-7GE960

Read (us)

Typical 4KB Random

110

115

Typical Sequential

Write (us)

Typical 4KB Random

Typical Sequential

QD1

MZ-7GE240

MZ-7GE480

MZ-7GE960

Read

Write

Read

Write

Read

Write

99.9% (ms)

4KB

0.2

0.4

0.2

0.4

0.2

0.4

8KB

0.2

0.6

0.2

0.6

0.2

0.6

Max (99.9999%)

(ms)

4KB

1 1 1 1 1 1 8KB

1.5 1 1.5 1 1.5

QD32

MZ-7GE240

MZ-7GE480

MZ-7GE960

Read

Write

Read

Write

Read

Write

99.9% (ms)

4KB

0.6 7 0.6 7 0.6 7 8KB

10 1 10 1 10

Max (99.9999%)

(ms)

4KB

3 8 3 8 3

8KB

15 5 15 5 15

※ IOPS Consistency [%] = (99.9% IOPS)/(Average IOPS) x 100

3.3.4 Latency

※ Latency is measured using 4KB transfer size with Queue Depth 1.

3.3.5 Quality of Service (QoS)

Quality of Service (QoS) is the level of quality that provides steady and consistent performance given as a maximum response time under the certain confidence level of 99.9% or 99.9999%.

※ Actual performance may vary depending on usage conditions and system environment.

Test condition: Intel® i3-3240 3.40GHz, 4GB DDR3-1600, Intel C216 Family Chipset RedHat Enterprise Linux 6.4 with AHCI (ver.9.3.0.1011)

Test program: FIO 2.1.3

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DATA SHEET Ver. 1.1, June, 2014

3.4 Electrical Characteristics

Characteristics

Requirements

Allowable voltage

5V ± 5%

Allowable noise/ripple

100mV p-p or less

Rise time (Max./Min.)

1s / 1ms

Fall time

500ms

Inrush current (Typical Peak)

1.5A, <1s

MZ-7GE240

MZ-7GE480

MZ-7GE960

Active Read

(Watt)

Average

3.1

Burst

3.1

Active Write

(Watt)

Average

3.1

4.1

4.2

Burst

3.4

4.4

4.8

Idle (Watt)

1.0

1.5

MZ-7GE240

MZ-7GE480

MZ-7GE960

Number of Capacitors

Capacitance

1.4mF

2.1mF

2.3mF

Discharging time

Min 35ms

3.4.1 Supply Voltage

※ The 845DC EVO needs only 5V power rail, and the 12V power pin of a SATA connector is not connected to any

net and components in the 845DC EVO. If both 12V and 5V power rails are provided to the SSD, the SSD would work well. If only 5V power rail is provided to the SSD, the SSD would work well. If only 12V power rail is provided to the SSD, the SSD would not work, but this won’t bring any problems to host system.

3.4.2 Power Consumption

3.4.3 Power Loss Protection (PLP)

Samsung 845DC EVO SSD is built with tantalum capacitors to protect all data in the write cache in case of a power failure. On detection of the external power loss, the SSD uses the electricity from a tantalum capacitor to transfer the cached data in DRAM to the flash memory. This enterprise-grade PLP provides an added level of security to ensure that valuable write information is well protected against data corruption caused by sudden power loss.

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DATA SHEET Ver. 1.1, June, 2014

3.5 Reliability

MZ-7GE240

MZ-7GE480

MZ-7GE960

Mean Time Between Failures (MTBF)

2,000,0000 Hours

Uncorrectable Bit Error Rate (UBER)

1 sector per 10^17 bits read

Endurance(TBW)

150TBW

300TBW

600TBW

Data Retention

3 months (@40℃)

Power on/off cycle

24 per Day

Insertion cycle

500 cycles

Features

Operating

Non-Operating

Temperature

0℃ to 70℃

-40℃ to 85℃

Humidity

5% to 95%, non-condensing

Vibration

1~2KHz, 20Grms, 20min/3-axis

Shock

1500G with 0.5ms duration

※ Refer to JESD218 standard table 1 for requirements of enterprise SSD reliability.

3.6 Environmental Specifications

※ Notes :

1. Temperature specification is following JEDEC standard; Expressed temperature must be measured right on

the case.

2. Humidity is measured in non-condensing.

3. Shock test condition: 0.5ms duration with half sine wave.

4. Vibration test condition: 10Hz to 2,000Hz, 15mins/axis on 3axis(X,Y,Z)

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DATA SHEET Ver. 1.1, June, 2014

4. Electrical Interface Specification

No.

Plug Connector pin definition

Signal

GND

2nd mate

A+

Differential signal A from Phy

A-

GND

2nd mate

B-

Differential signal A from Phy

B+

GND

2nd mate

Key and spacing separate signal and power segments

Power

V33

3.3V power (Unused)

V33

3.3V power (Unused)

V33

3.3V power, pre-charge, 2nd mate (Unused)

GND

mate

GND

2nd mate

GND

2nd mate

5V power, pre-charge, 2nd mate

5V power

P10

GND

2nd mate

P11

DAS/DSS

Device Activity Signal/Disable Staggered Spinup

P12

GND

1st mate

P13

V12

12V power, pre-charge, 2nd mate (Unused)

P14

V12

12V power (Unused)

P15

V12

12V power (Unused)

4.1 Serial ATA Interface connector

Drive Connector : AMPHENOL, SATA-001-0009-1-TR

4.2 Pin Assignments

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DATA SHEET Ver. 1.1, June, 2014

5. Shadow Register Block registers Description

7 6 5 4 3 2 1

HOB - - - -

SRST

nlEN

7 6 5 4 3 2 1 0 - L -

DEV

HS3

HS2

HS1

HS0

7 6 5 4 3 2 1

ICRC

UNC

IDNF

ABRT

TKONF

AMNF

5.1 Command Register

This register contains the command code being sent to the device. Command execution begins immediately after this register is written. All other registers required for the command must be set up before writing the Command Register.

5.2 Device Control Register

5.2.1 Field/bit description

※ HOB is defined by the 48bit Address feature set. A write to any Command register shall clear the HOB bit to zero. ※ SRST is the host software reset bit. SRST=1 indicates that the drive is held reset and sets BSY bit in Status register.

Setting SRST=0 re-enables the device.

※ nIEN is the enable bit for the device Assertion of INTRQ to the host. When nIEN=0, and the device is selected by

Drive select bit in DEVICE/HEAD register, device interrupt to the host is enabled. When this bit is set, the "I’ bit in the Register Host to Device, PIO setup, Set Device Bits and DMA Set Up will be set, whether pending interrupt is found or not.

5.3 Device / Head Register

5.3.1 Field / bit description

The content of this register shall take effect when written.

※ L : Binary encoded address mode select. When L=0, addressing is by CHS mode. When L=1, addressing is by LBA

mode.

※ DEV: Device select. Cleared to zero selects Device 0. Set to one selects Device1.

※ HS3, HS2, HS1, HS0 : Head select bits. The HS3 through HS0 contain bits 24-27 of the LBA. At command

completion, these bits are updated to reflect the current LBA bits 24-27.

5.4 Error Register

5.4.1 Field / bit description

※ ICRC: Interface CRC Error. CRC=1 indicates a CRC error has occurred on the data bus during a Ultra-DMA transfer. ※ UNC: Uncorrectable Data Error. UNC=1 indicates an uncorrectable data error has been encountered. ※ IDNF: ID Not Found. IDN=1 indicates the requested sector’s ID field coul ※ ABRT: Aborted Command. ABT=1 indicates the requested command has been aborted due to a device status

error or an invalid parameter in an output register.

※ TKONF: Track 0 Not Found. T0N=1 indicates track 0 was not found during a Recalibrate command. ※ AMNF: Address Mark Not Found. When AMN=1, it indicates that the data address mark has not been found after

finding the correct ID field for the requested sector.

5.5 Features Register

This register is command specific. This is used with the Set Features command, S.M.A.R.T. Function Set command.

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DATA SHEET Ver. 1.1, June, 2014

5.6 Cylinder High (LBA High)

7 6 5 4 3 2 1

BSY

DRDY

DSC

DRQ

CORR

IDX

ERR

This register contains Bits 16-23. At the end of the command, this register is updated to reflect the current LBA Bits 16-23.

5.7 Cylinder Low (LBA Mid) Register

This register contains Bits 8-15. At the end of the command, this register is updated to reflect the current LBA Bits 8-15. When 48-bit addressing commands are used, the "most recently written" content contains LBA Bits 8-15, and the "previous content" contains Bits 32-39

5.8 Sector Number (LBA low) Register

This register contains Bits 0-7. At the end of the command, this register is updated to reflect the current LBA Bits 0-7. When 48-bit commands are used, the "most recently written" content contains LBA Bits 0-7, and the "previous content" contains Bits 24-31.

5.9 Sector Count Register

This register contains the number of sectors of data requested to be transferred on a read or write operation between the host and the device. If the value in the register is set to 0, a count of 256 sectors (in 28-bit addressing) or 65,536 sectors (in 48-bit addressing) is specified. If the register is zero at command completion, the command was successful. If not successfully completed, the register contains the number of sectors which need to be transferred in order to complete the request. The contents of the register are defined otherwise on some commands. These definitions are given in the command descriptions.

5.10 Status Register

This register contains the device status. The contents of this register are updated whenever an error occurs and at the completion of each command. If the host reads this register when an interrupt is pending, it is considered to be the interrupt acknowledge. Any pending interrupt is cleared whenever this register is read. If BSY=1, no other bits in the register are valid. And read/write operations of any other register are negated in order to avoid the returning of the contents of this register instead of the other registers’ contents.

5.10.1 Field / bit description.

※ BSY : Busy. BSY=1 whenever the device is accessing the registers. The host should not read or write any registers

※ DRDY : Device Ready. RDY=1 indicates that the device is capable of responding to a command. RDY will be set to

0 durin

※ DF : Device Fault. DF=1 indicates that the device has detected a write fault condition. DF is set to 0 after the

Status Register is read by the host.

※ DSC : Device Seek Complete. DSC=1 indicates that a seek has completed and the device head is settled over a

track. DSC is set to 0 by the device just before a seek begins. When an error occurs, this bit is not changed until the Status Register is read by the host, at which time the bit again indicates the current seek complete status. When the device enters into or is in Standby mode or Sleep mode, this bit is set by device in spite of not spinning up.

※ DRQ : Data Request. DRQ=1 indicates that the device is ready to transfer a word or byte of data between the host

and the device. The host should not write the Command register when DRQ=1.

※ CORR : Corrected Data. Always 0. ※ IDX : Index. IDX=1 once per revolution. Since IDX=1 only for a very short time during each revolution, the host

may not see it set to 1 even if the host is reading the Status Register continuously. Therefore the host should not attempt to use IDX for timing purposes.

※ ERR : ERR=1 indicates that an error occurred during execution of the previous command. The Error Register

should be read to determine the error type. The device sets

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DATA SHEET Ver. 1.1, June, 2014

6. Command Descriptions

Command Name

Command Code(Hex)

Command Name

Command Code(Hex)

CHECK POWER MODE

E5h

STANDBY

E2h

DATA SET MANAGEMENT

06h

STANDBY IMMEDIATE

E0h

DEVICE CONFIGURATION FREEZE LOCK

B1/C1

WRITE BUFFER

E8h

DEVICE CONFIGURATION IDENTIFY

B1/C2

WRITE BUFFER DMA

EBh

DEVICE CONFIGURATION RESTORE

B1/C0

WRITE DMA

CAh

DEVICE CONFIGURATION SET

B1/C3

WRITE DMA EXT

35h

DOWNLOAD MICROCODE

92h

WRITE DMA FUA EXT

3Dh

DOWNLOAD MICROCODE DMA

93h

WRITE DMA WITHOUT RETRY

CBh

EXECUTE DEVICE DIAGNOSTIC

90h

WRITE FPDMA QUEUED

61h

FLUSH CACHE

E7h

WRITE LOG DMA EXT

57h

FLUSH CACHE EXT

EAh

WRITE LOG EXT

3Fh

IDENTIFY DEVICE

ECh

WRITE MULTIPLE

C5h

IDLE

E3h

WRITE MULTIPLE EXT

39h

IDLE IMMEDIATE

E1h

WRITE MULTIPLE FUA EXT

CEh

INITIALIZE DEVICE PARAMETERS

91h

WRITE SECTORS

30h

NOP

00h

WRITE SECTORS EXT

34h

READ BUFFER

E4h

WRITE SECTORS WITHOUT RETRY

31h

READ BUFFER DMA

E9h

WRITE UNCORRECTABLE EXT

45h

READ DMA

C8h

READ DMA EXT

25h

READ DMA WITHOUT RETRIES

C9h

READ FPDMA QUEUED

60h

READ LOG DMA EXT

47h

READ LOG EXT

2Fh

READ MULTIPLE

C4h

READ MULTIPLE EXT

29h

READ NATIVE MAX ADDRESS

F8h

READ NATIVE MAX ADDRESS EXT

27h

READ SECTORS

20h

READ SECTORS EXT

24h

READ SECTORS WITHOUT RETRY

21h

READ VERIFY SECTORS

40h

READ VERIFY SECTORS EXT

42h

READ VERIFY SECTORS WITHOUT RETRY

41h

RECALIBRATE

10h

RECEIVE FPDMA QUEUED

65h

SECURITY DISABLE PASSWORD

F6h

SECURITY ERASE PREPARE

F3h

SECURITY ERASE UNIT

F4h

SECURITY FREEZE LOCK

F5h

SECURITY SET PASSWORD

F1h

SECURITY UNLOCK

F2h

SEEK

70h

SEND FPDMA QUEUED

64h

SET MAX ADDRESS

F9h

SET MAX ADDRESS EXT

37h

SET MULTIPLE MODE

C6h

SLEEP

E6h

SMART

B0h

6.1 Supported ATA Commands

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6.2 SECURITY FEATURE Set

Command Name

Code

Command Name

Code

SMART READ DATA

D0h

SMART WRITE LOG

D6h

SMART READ ATTRIBUTE THRESHOLDS

D1h

SMART ENABLE OPERATIONS

D8h

SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE

D2h

SMART DISABLE OPERATIONS

D9h

SMART SAVE ATTRIBUTE VALUES

D3h

SMART RETURN STATUS

DAh

SMART EXECUTE OFF-LINE IMMIDIATE

D4h

SMART ENABLE/DISABLE AUTOMATIC OFF-LINE

DBh

SMART READ LOG

D5h

The Security mode features allow the host to implement a security password system to prevent unauthorized access to the disk drive.

6.2.1 SECURITY mode default setting

The SSD is shipped with master password set to 00h value(ASCII blanks) and the lock function disabled. The system manufacturer/dealer may set a new master password by using the SECURITY SET PASSWORD command, without enabling the lock function.

6.2.2 Initial setting of the user password

When a user password is set, the drive automatically enters lock mode by the next powered-on.

6.2.3 SECURITY mode operation from power-on

In locked mode, the SSD rejects media access commands until a SECURITY UNLOCK command is successfully completed.

6.2.4 Password lost

If the user password is lost and High level security is set, the drive does not allow the user to access any data. However, the drive can be unlocked using the master password. If the user password is lost and Maximum security level is set, it is impossible to access data. However, the drive can be unlocked using the ERASE UNIT command with the master password. The drive will erase all user data and unlock the drive.

6.3 SMART FEATURE Set (B0h)

The SMART Feature Set command provides access to the Attribute Values, the Attribute Thresholds, and other low level subcommands that can be used for logging and reporting purposes and to accommodate special user needs. The SMART Feature Set command has several separate subcommands which are selectable via the device's Features Register when the SMART Feature Set command is issued by the host. In order to select a subcommand the host must write the subcommand code to the device's Features Register before issuing the SMART Feature Set command.

6.3.1 Sub Command

In order to select a subcommand the host must write the subcommand code to the device's Features Register before issuing the S.M.A.R.T. Function Set command. The subcommands and their respective codes are listed below.

6.3.1.1 S.M.A.R.T. Read Attribute Values (subcommand D0h) This subcommand returns the device's Attribute Values to the host. Upon receipt of the S.M.A.R.T. Read Attribute Values subcommand from the host, the device asserts BSY, saves any updated attribute Values to the Attribute Data sectors, asserts DRQ, clears BSY, asserts INTRQ, and then waits for the host to transfer the 512 bytes of Attribute Value information from the device via the Data Register.

6.3.1.2 S.M.A.R.T. Read Attribute Thresholds (subcommand D1h) This subcommand returns the device's Attribute Thresholds to the host. Upon receipt of the S.M.A.R.T. Read Attribute Thresholds subcommand from the host, the device reads the Attribute Thresholds from the Attribute Threshold sectors and then waits for the host to transfer the 512 bytes of Attribute Thresholds information from the device

6.3.1.3 S.M.A.R.T. Enable/Disable Attribute Auto-save (subcommand D2h) This subcommand enables and disables the attribute auto save feature of the device. The S.M.A.R.T. Enable/Disable Attribute Auto-save subcommand allows the device to automatically save its

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updated Attribute Values to the Attribute Data Sector at the timing of the first transition to Active

LBA Low

Subcommand

00h

Execute S.M.A.R.T. off-line data collection routine immediately

01h

Execute S.M.A.R.T. Short self-test routine immediately in off-line mode

02h

Execute S.M.A.R.T. Extended self-test routine immediately in off-line mode

03h

Reserved

04h

Execute S.M.A.R.T. Selective self-test routine immediately in off-line mode

40h

Reserved

7Fh

Abort off-line mode self-test routine

81h

Execute S.M.A.R.T. short self-test routine immediately in captive mode

82h

Execute S.M.A.R.T. Extended self-test routine immediately in captive mode

84h

Execute S.M.A.R.T. selective self-test routine immediately in captive mode

C0h

Reserved

idle mode and after 15 minutes after the last saving of Attribute Values. This subcommand causes the auto save feature to be disabled. The state of the Attribute Auto-save feature—either enabled or disabled—will be preserved by the device across the power cycle. A value of 00h—written by the host into the device's Sector Count Register before issuing the S.M.A.R.T. Enable/Disable Attribute Auto-save subcommand— will cause this feature to be disabled. Disabling this feature does not preclude the device from saving Attribute Values to the Attribute Data sectors during some other normal operation such as during a power-up or a power-down. A value of F1h—written by the host into the device's Sector Count Register before issuing the S.M.A.R.T. Enable/Disable Attribute Auto-save subcommand— will cause this feature to be enabled. Any other nonzero value written by the host into this register before issuing the S.M.A.R.T. Enable/Disable Attribute Auto-save subcommand will not change the current Auto-save status. The device will respond with the error code specified in Table: “S.M.A.R.T. Error Codes” on page 26. The S.M.A.R.T. Disable Operations subcommand disables the auto save feature along with the device's S.M.A.R.T. operations. Upon the receipt of the subcommand from the host, the device asserts BSY, enables or disables the Auto-save feature, clears BSY, and asserts INTRQ.

6.3.1.4 S.M.A.R.T. Save Attribute Values (subcommand D3h) This subcommand causes the device to immediately save any updated Attribute Values to the device's Attribute Data sector regardless of the state of the Attribute Auto-save feature. Upon receipt of the S.M.A.R.T. Save Attribute Values subcommand from the host, the device asserts BSY, writes any updated Attribute Values to the Attribute Data sector, clears BSY, and asserts INTRQ.

6.3.1.5 S.M.A.R.T. Execute Off-line Immediate (subcommand D4h) This subcommand causes the device to immediately initiate the set of activities that collect Attribute data in an offline mode (off-line routine) or execute a self-test routine in either captive or off-line mode. The LBA Low register shall be set to specify the operation to be executed

Off-line mode : The device executes command completion before executing the specified routine. During execution of the routine the device will not set BSY nor clear DRDY. If the device is in the process of performing its routine and is interrupted by a new command from the host, the device will abort or suspend its routine and service the host within two seconds after receipt of the new command. After servicing the interrupting command, the device will resume its routine automatically or not start its routine depending on the interrupting command. Captive mode : When executing self-test in captive mode, the device sets BSY to one and executes the specified self-test routine after receipt of the command. At the end of the routine, the device sets the execution result in the Self-test execution status byte (see Table “Device Attribute Data Structure” on page 6.3.2) and ATA registers and then executes the command completion. See definitions below.

Status Set ERR to one when the self-test Error Set ABRT to one when the self-test LBA Low Set to F4h when the self-test has failed LBA High Set to 2Ch when self-test has failed

6.3.1.6 S.M.A.R.T. Selective self-test routine When the value in the LBA Low register is 4 or 132, the Selective self-test routine shall be performed. This self test routine shall include the initial tests per-formed by the Extended self-test routine plus a selectable read scan. The host shall not write the Selective self-test log while the execution of a Selective self-test command is in progress. The user may choose to do read scan

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only on specific areas of the media. To do this, user shall set the test spans desired in the Selective self-test log and set the flags in the Feature flags field of the Selective self-test log to indicate do not perform off-line scan. In this case, the test spans defined shall be read scanned in their entirety. The Selective self-test log is updated as the self-test proceeds indicating test progress. When all specified test spans have been completed, the test is terminated and the appropriate self-test execution status is reported in the SMART READ DATA response depending on the occurrence of errors. Below figure shows an example of a Selective self test definition with three test spans defined. In this example, the test terminates when all three test spans have been scanned.

After the scan of the selected spans described above, a user may wish to have the rest of media read scanned as an off-line scan. In this case, the user shall set the flag to enable off-line scan in addition to the other settings. If an error occurs during the scanning of the test spans, the error is reported in the self-test execution status in the SMART READ DATA response and the off-line scan is not executed. When the test spans defined have been scanned, the device shall then set the offline scan pending and active flags in the Selective self-test log to one, the span under test to a value greater than five, the self-test execution status in the SMART READ DATA response to 00h, set a value of 03h in the off-line data collection status in the SMART READ DATA response and shall proceed to do an off-line read scan through all areas not included in the test spans. This off-line read scan shall completed as rapidly as possible, no pauses between block reads, and any errors encountered shall not be reported to the host. Instead error locations may be logged for future reallocation. If the device is powered-down before the off-line scan is completed, the off-line scan shall resume when the device is again powered up. From power-up, the resumption of the scan shall be delayed the time indicated in the Selective self-test pending time field in the Selective selftest log. During this delay time the pending flag shall be set to one and the active flag shall be set to zero in the Selective self-test log. Once the time expires, the active flag shall be set to one, and the off-line scan shall resume. When the entire media has been scanned, the off-line scan shall terminate, both the pending and active flags shall be cleared to zero, and the off-line data collection status in the SMART READ DATA response shall be set to 02h indicating completion. During execution of the Selective self-test, the self-test executions time byte in the Device SMART Data Structure may be updated but the accuracy may not be exact because of the nature of the test span segments. For this reason, the time to complete off-line testing and the self-test polling times are not valid. Progress through the test spans is indicated in the selective self-test log. A hardware or software reset shall abort the Selective self-test except when the pending bit is set to one in the Selective self-test log). The receipt of a SMART EXECUTE OFF-LINE IMMEDIATE command with 0Fh, Abort off-line test routine, in the LBA Low register shall abort Selective selftest regardless of where the device is in the execution of the command. If a second self-test is issued while a selective self-test is in progress, the selective self-test is aborted and the newly requested self-test is executed.

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6.3.1.7 S.M.A.R.T. Read Log Sector (subcommand D5h)

LBA Low

Subcommand

00h

Log directory

01h

SMART error log

02h

Comprehensive SMART error log

04h-05h

Reserved

06h

SMART self-test log

08h

Reserved

09h

Selective self-test log

R/W

0Ah-7Fh

Reserved

80h-9Fh

Host vendor specific

R/W

A0h-FFh

Reserved

This command returns the indicated log sector contents to the host. Sector count specifies the number of sectors to be read from the specified log. The log transferred by the drive shall start at the first sector in the specified log, regardless of the sector count requested. Sector number indicates the log sector to be returned as described in the following Table.

RO – Log is read only by the host.

R/W – Log is read or written by host. VS - Log is vendor specific thus read/write ability is vendor specific.

6.3.1.8 S.M.A.R.T. Write Log Sector (subcommand D6h) This command writes 512 bytes of data to the specified log sector. The 512 bytes of data are transferred at a command and the LBA Low value shall be set to one. The LBA Low shall be set to specify the log sector address. If a Rea Only log sector is specified, the device returns ABRT error.

6.3.1.9 S.M.A.R.T. Enable Operations (subcommand D8h) This subcommand enables access to all S.M.A.R.T. capabilities within the device. Prior to receipt of a S.M.A.R.T. Enable Operations subcommand, Attribute Values are neither monitored nor saved by the device. The state of S.M.A.R.T.—either enabled or disabled—will be preserved by the device across power cycles. Once enabled, the receipt of subsequent S.M.A.R.T. Enable Operations subcommands will not affect any of the Attribute Values. Upon receipt of the S.M.A.R.T. Enable Operations subcommand from the host, the device asserts BSY, enables S.M.A.R.T. capabilities and functions, clears BSY, and asserts INTRQ.

6.3.1.10 S.M.A.R.T. Disable Operations (subcommand D9h) This subcommand disables all S.M.A.R.T. capabilities within the device including the device's attribute auto save feature. After receipt of this subcommand the device disables all S.M.A.R.T. operations. Non self-preserved Attribute Values will no longer be monitored. The state of S.M.A.R.T.—either enabled or disabled—is preserved by the device across power cycles. Note that this subcommand does not preclude the device's power mode attribute auto saving. Upon receipt of the S.M.A.R.T. Disable Operations subcommand from the host, the device asserts BSY, disables S.M.A.R.T. capabilities and functions, clears BSY, and asserts INTRQ. After receipt of the device of the S.M.A.R.T. Disable Operations subcommand from the host, all other S.M.A.R.T. subcommands— with the exception of S.M.A.R.T. Enable Operations—are disabled, and invalid and will be aborted by the device—including the S.M.A.R.T. Disable Operations subcommand— returning the error code as specified in Table: “S.M.A.R.T. Error Codes” on page 6.3.8. Error reporting. Any Attribute Values accumulated and saved to volatile memory prior to receipt of the S.M.A.R.T. Disable Operations command will be preserved in the device's Attribute Data Sectors. If the device is re-enabled, these Attribute Values will be updated, as needed, upon receipt of a S.M.A.R.T. Read Attribute Values or a S.M.A.R.T. Save Attribute Values command

6.3.1.11 S.M.A.R.T. Return Status (subcommand DAh) This subcommand is used to communicate the reliability status of the device to the host's request. Upon receipt of the S.M.A.R.T. Return Status subcommand the device asserts BSY, saves any updated Attribute Values to the reserved sector, and compares the updated Attribute Values to the Attribute Thresholds. If the device does not detect a Threshold Exceeded Condition, or detects a Threshold Exceeded Condition but involving attributes are advisory, the device loads 4Fh into the LBA Mid register, C2h into the LBA High register, clears BSY, and asserts INTRQ. If the device detects a Threshold Exceeded Condition for pre-failure attributes, the device loads F4h into the

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LBA Mid register, 2Ch into the LBA High register, clears BSY, and asserts INTRQ. Advisory attributes

Byte

Description

0 ~ 1

Data structure revision number

2 ~ 361

1st - 30th Individual attribute data

362

Off-line data collection status

363

Self-test execution status

364 ~ 365

Total time in seconds to complete off-line data collection activity

366

Vendor Specific

367

Off-line data collection capability

368 ~ 369

SMART capability

370

Error logging capability 7-1 Reserved 0 1=Device error logging supported

371

Self-test failure check point

372

Short self-test routine recommended polling time (in minutes)

373

Extended self-test routine recommended polling time (in minutes)

374 ~ 510

Reserved

511

Data structure checksum

never result in a negative reliability condition.

6.3.1.12 S.M.A.R.T. Enable/Disable Automatic Off-line (subcommand DBh) This subcommand enables and disables the optional feature that cause the device to perform the set of off-line data collection activities that automatically collect attribute data in an off-line mode and then save this data to the device's nonvolatile memory. This subcommand may either cause the device to automatically initiate or resume performance of its off-line data collection activities or cause the automatic off-line data collection feature to be disabled. This subcommand also enables and disables the off-line read scanning feature that cause the device to perform the entire read scanning with defect reallocation as the part of the off-line data collection activities. The Sector Count register shall be set to specify the feature to be enabled or disabled:

Sector Count Feature Description

00h Disable Automatic Off-line F8h Enable Automatic Off-line

A value of zero written by the host into the device's Sector Count register before issuing this subcommand shall cause the automatic off-line data collection feature to be disabled. Disabling this feature does not preclude the device from saving attribute values to nonvolatile memory during some other normal operation such as during a power-on, during a power-off sequence, or during an error recovery sequence. A value of F8h written by the host into the device's Sector Count register before issuing this subcommand shall cause the automatic Off-line data collection feature to be enabled. Any other non-zero value written by the host into this register before issuing this subcommand is vendor specific and will not change the current Automatic Off-Line Data Collection and Off-line Read Scanning status. However, the device may respond with the error code specified in Table: “S.M.A.R.T. Error Codes” on 6.3.8 Error reporting.

6.3.2 Device Attribute Data Structure The following defines the 512 bytes that make up the Attribute Value information. This data structure is accessed by the host in its entirety using the S.M.A.R.T. Read Attribute Values subcommand.

Device Attribute Data Structure

6.3.2.1 Data Structure Revision Number The Data Structure Revision Number identifies which version of this data structure is implemented by the device. This revision number will be set to 0005h. This revision number identifies both the Attribute Value and Attribute Threshold Data structures.

6.3.2.2 Individual Attribute Data Structure

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The following defines the 12 bytes that make up the information for each Attribute entry in the

Byte

Description

Attribute ID number 01-FFh

1 ~ 2

Status flag bit 0 (pre-failure/advisory bit)

bit 0 = 0: If attribute value is less than the threshold, the drive is in advisory condition.

Product life period may be expired.

bit 0 = 1: If attribute value is less than the threshold, the drive is in pre-failure

condition. The drive may have failure. bit 1 (on-line data collection bit) bit 1 = 0: Attribute value will be changed during off-line data collection operation. bit 1 = 1: Attribute value will be changed during normal operation. bit 2 (Performance Attribute bit) bit 3 (Error rate Attribute bit) bit 4 (Event Count Attribute bit) bit 5 (Self-Preserving Attribute bit) bit 6-15 Reserved

Attribute value 01h-FDh *1 00h, FEh, FFh = Not in use 01h = Minimum value 64h = Initial value Fdh = Maximum value

Worst Ever normalized Attribute Value (valid values from 01h-FEh)

5 ~ 10

Raw Attribute

Value Attribute specific raw data (FFFFFFh - reserved as saturated value)

Reserved(00h)

*1 For ID = 199 CRC Error Count

Attribute name

Reallocated Sector Count

Power-on Hours

Power-on Count

177

Wear Leveling Count

179

Used Reserved Block Count (total)

180

Unused Reserved Block Count (total)

181

Program Fail Count (total)

182

Erase Fail Count (total)

183

Runtime Bad Count (total)

184

End to End Error data path Error Count

187

Uncorrectable Error Count

190

Air Flow Temperature

195

ECC Error Rate

199

CRC Error Count

202

SSD Mode Status

235

Power Recovery Count

241

Total LBA Written

242

Total LBA Read

250

SATA Interface Downshifts (total)

Device Attribute Data Structure.

Attribute ID Numbers: Any nonzero value in the Attribute ID Number indicates an active attribute. The device supports following Attribute ID Numbers.

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6.3.2.3 Off-Line Data Collection Status The value of this byte defines the current status of the off-line activities of the device. Bit 7 indicates an Automatic Off-line Data Collection Status.

Bit 7 Automatic Off-line Data Collection Status

0 Automatic Off-line Data Collection is disabled. 1 Automatic Off-line Data Collection is enabled.

Bits 0–6 represent a hexadecimal status value reported by the device Value Definition 0 Off-line data collection never started. 2 All segments completed without errors. In this case the current segment pointer is equal to the total segments

3 Off-line activity in progress. 4 Off-line data collection is suspended by the interrupting command. 5 Off-line data collecting is aborted by the interrupting command. 6 Off-line data collection is aborted with a fatal error.

required.

6.3.2.4 Self-test execution status

Bit Definition 0-3 Percent Self-test remaining. An approximation of the percent of the self-test routine remaining until completion

4-7 Current Self-test execution status.

given in ten percent increments. Valid values are 0 through 9.

0 The self-test routine completed without error or has never been run. 1 The self-test routine was aborted by the host. 2 The self-test routine was interrupted by the host with a hard or soft reset. 3 The device was unable to complete the self-test routine due to a fatal error or unknown test error. 4 The self-test routine was completed with an unknown element failure. 5 The self-test routine was completed with an electrical element failure. 6 The self-test routine was completed with a servo element failure. 7 The self-test routine was completed with a read element failure. 15 The self-test routine is in progress.

6.3.2.5 Total time in seconds to complete off-line data collection activity

This field tells the host how many seconds the device requires to complete the off-line data collection activity.

6.3.2.6 Current segment pointer

This byte is a counter indicating the next segment to execute as an off-line data collection activity. Because the number of segments is 1, 01h is always returned in this field

6.3.2.7 Off-line data collection capability

Bit Definition

0 Execute Off-line Immediate implemented bit

0 S.M.A.R.T. Execute Off-line Immediate subcommand is not implemented

1 Enable/disable Automatic Off-line implemented bit

2 Abort/restart off-line by host bit

3 Off-line Read Scanning implemented bit

4 Self-test implemented bit

5 Reserved (0) 6 Selective self-test routine is not implemented

7 Reserved (0)

1 S.M.A.R.T. Execute Off-line Immediate subcommand is implemented

0 S.M.A.R.T. Enable/disable Automatic Off-line subcommand is not implemented 1 S.M.A.R.T. Enable/disable Automatic Off-line subcommand is implemented

0 The device will suspend off-line data collection activity after an interrupting command and resume it

after a vendor specific event

1 The device will abort off-line data collection activity upon receipt of a new command Bit Definition

0 The device does not support Off-line Read Scanning 1 The device supports Off-line Read Scanning

0 Self-test routing is not implemented 1 Self-test routine is implemented

0 Selective self-test routine is not implemented 1 Selective self-test routine is implemented

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6.3.2.8 S.M.A.R.T. Capability

Byte

Description

0 ~ 1

Data structure revision number

2 ~ 361

1st - 30th Individual attribute data

362 ~ 379

Reserved

380 ~ 510

Vendor Specific

511

Data structure checksum

Byte

Description

Attribute ID Number (01h to FFh)

Attribute Threshold (for comparison with Attribute Values from 00h to FFh) 00h - "always passing" threshold value to be used for code test purposes 01h - minimum value for normal operation FDh - maximum value for normal operation FEh - invalid for threshold value FFh - "always failing" threshold value to be used for code test purposes

2~11

Reserved (00h)

This word of bit flags describes the S.M.A.R.T. capabilities of the device. The device will return 03h indicating that the device will save its Attribute Values prior to going into a power saving mode and supports the S.M.A.R.T. ENABLE/DISABLE ATTRIBUTE AUTOSAVE command.

Bit Definition 0 Pre-power mode attribute saving capability. If bit = 1, the device will save its Attribute Values prior to going into a

1 Attribute auto save capability. If bit = 1, the device supports the S.M.A.R.T. ENABLE/ DISABLE ATTRIBUTE

2-15 Reserved (0)

power saving mode (Standby or Sleep mode).

AUTOSAVE command.

6.3.2.9 Error logging capability

Bit Definition 7-1 Reserved (0) 0 The Error Logging support bit. If bit = 1, the device supports the Error Logging

6.3.2.10 Self-test failure check point

This byte indicates the section of self-test where the device detected a failure.

6.3.2.11 Self-test completion time

These bytes are the minimum time in minutes to complete the self-test.

6.3.2.12 Data Structure Checksum

The Data Structure Checksum is the 2's compliment of the result of a simple 8-bit addition of the first 511 bytes in the data structure.

6.3.3 Device Attribute Thresholds data structure

The following defines the 512 bytes that make up the Attribute Threshold information. This data structure is accessed by the host in its entirety using the S.M.A.R.T. Read Attribute Thresholds. All multibyte fields shown in these data structures follow the ATA/ATAPI-6 specification for byte ordering, that is, that the least significant byte occupies the lowest numbered byte address location in the field. The sequence of active Attribute Thresholds will appear in the same order as their corresponding Attribute Values

Device Attribute Thresholds Data Structure

6.3.3.1 Data Structure Revision Number

This value is the same as the value used in the Device Attributes Values Data Structure.

6.3.3.2 Individual Thresholds Data Structure

The following defines the 12 bytes that make up the information for each Threshold entry in the Device Attribute Thresholds Data Structure. Attribute entries in the Individual Threshold Data Structure are in the same order and correspond to the entries in the Individual Attribute Data Structure.

6.3.3.3 Attribute ID Numbers

Attribute ID Numbers supported by the device are the same as Attribute Values Data Structures.

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6.3.3.4 Attribute Threshold

Byte

Description

0 ~ 1

S.M.A.R.T. Logging Version

Number of sectors in the log at log address 1

Reserved

Number of sectors in the log at log address 2

Reserved

…… 510

Number of sectors in the log at log address 255

511

Reserved

Byte

Description

S.M.A.R.T. error log version

Error log pointer

2 ~ 91

1st error log data structure

92 ~ 181

2nd error log data structure

182 ~ 271

3rd error log data structure

272 ~ 361

4th error log data structure

362 ~ 451

5th error log data structure

452 ~ 453

Device error count

454 ~ 510

Reserved

511

Data structure checksum

Byte

Description

n ~ n + 11

1st command data structure

n + 12 ~ n + 23

2nd command data structure

n + 24 ~ n +35

3rd command data structure

n+36 ~ n + 47

4th command data structure

n+48 ~ n + 59

5th command data structure

n+60 ~ n+89

Error data structure

These values are preset at the factory and are not meant to be changeable. However, the host might use the "S.M.A.R.T. Write Attribute Threshold" subcommand to override these preset values in the Threshold sectors.

6.3.3.5 Data Structure Checksum

The Data Structure Checksum is the 2's compliment of the result of a simple 8-bit addition of the first 511 bytes in the data structure.

6.3.4 S.M.A.R.T. Log Directory The following defines the 512 bytes that make up the S.M.A.R.T. Log Directory. The S.M.A.R.T. Log Directory is on S.M.A.R.T. Log Address zero and is defined as one sector long.

S.M.A.R.T Log Directory

The value of the S.M.A.R.T. Logging Version word shall be 01h. The logs at log addresses 80-9Fh are defined as 16 sectors long.

6.3.5 S.M.A.R.T. error log sector The following defines the 512 bytes that make up the S.M.A.R.T. error log sector. All multi-byte fields shown in these data structures follow the ATA/ATAPI- 6 specifications for byte ordering.

S.M.A.R.T error log sector

6.3.5.1 S.M.A.R.T. error log version

This value is set to 01h.

6.3.5.2 Error log pointer

This value points to the most recent error log data structure. Only values 1 through 5 are valid.

6.3.5.3 Device error count

This field contains the total number of errors. The value will not roll over.

6.3.5.4 Error log data structure

The data format of each error log structure is shown below.

Error log data structure

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6.3.5.5 Command data structure

Byte

Description

Content of the Device Control register when the Command register was written

n+1

Content of the Features Control register when the Command register was written

n+2

Content of the Sector Count Control register when the Command register was written

n+3

Content of the LBA Low register when the Command register was written

n+4

Content of the LBA Mid register when the Command register was written

n+5

Content of the LBA High register when the Command register was written

n+6

Content of the Device/Head register when the Command register was written

n+7

Content written to the Command register

n+8

Timestamp

n+9

Timestamp

n+10

Timestamp

n+11

Timestamp

Byte

Description

Reserved

n+1

Content written to the Error register after command completion occurred.

n+2

Content written to the Sector Count register after command completion occurred.

n+3

Content written to the LBA Low register after command completion occurred.

n+4

Content written to the LBA Mid register after command completion occurred.

n+5

Content written to the LBA High register after command completion occurred.

n+6

Content written to the Device/Head register after command completion occurred.

n+7

Content written to the Status register after command completion occurred.

n+8 ~ n + 26

Extended error information

n+27

State

n+28

Life Timestamp (least significant byte)

n+29

Life Timestamp (most significant byte)

Byte

Description

x0h

Unknown

x1h

Sleep

x2h

Standby

x3h

Active/Idle with BSY cleared to zero

x4h

Executing SMART off-line or self-test

x5h ~ xAh

Reserved

xBh ~ xFh

Vendor unique

Data format of each command data structure is shown below.

Command data structure

Timestamp shall be the time since power-on in milliseconds when command acceptance occurred. This timestamp may wrap around.

6.3.5.6 Error data structure

Data format of error data structure is shown below.

Error data structure

Extended error information is vendor specific which is not available for 845DC EVO State field contains a value indicating the device state when command is issued to the device.

Vendor unique is not available for 845DC EVO.

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6.3.6 Self-test log structure

Byte

Description

0~1

Data structure revision

n*24 + 2

Self-test number

n*24 + 3

Self-test execution status

n*24 + 4 ~ n*24 + 5

Life timestamp

n*24 + 6

Self-test failure check point

n*24 + 7 ~ n*24 + 10

LBA of first failure

n*24 +11 ~ n*24 + 25

Vendor specific

……

506 ~ 507

Vendor specific

508

Self-test log pointer

509 ~ 510

Reserved

511

Data structure checksum

Byte

Description

Read/Write

0 – 1

Data structure revision

R/W

2 – 9

Starting LBA for test span 1

R/W

10 – 11

Ending LBA for test span 1

R/W

18 – 25

Starting LBA for test span 2

R/W

26 – 33

Ending LBA for test span 2

R/W

34 – 41

Starting LBA for test span 3

R/W

42 – 49

Ending LBA for test span 3

R/W

50 – 57

Starting LBA for test span 4

R/W

58 – 65

Ending LBA for test span 4

R/W

66 – 73

Starting LBA for test span 5

R/W

74 – 81

Ending LBA for test span 5

R/W

82 – 337

Reserved

338 – 491

Vendor specific

Vendor Specific

492 – 499

Current LBA under test

Read

500 – 501

Current span under test

Read

502 – 503

Feature flags

R/W

504 – 507

Vendor Specific

508 – 509

Selective self-test pending time

R/W

510

Reserved

511

Data structure checksum

R/W

The following defines the 512 bytes that make up a Self-test log sector.

Self-test log data structure

NOTE : N is 0 through 20

The data structure contains the descriptor of the Self-test that the device has performed. Each descriptor is 24 bytes long and the self-test data structure is capable to contain up to 21 descriptors. After 21 descriptors has been recorded, the oldest descriptor will be overwritten with the new descriptor. The self-test log pointer points to the most recent descriptor. When there is no descriptor, the value is 0. When there are descriptor(s), the value is 1 through 21.

6.3.7 Selective self-test log data structure

The Selective self-test log is a log that may be both written and read by the host. This log allows the host to select

the parameters for the self-test and to monitor the progress of the self-test. The following table defines the contents

of the Selective self-test log which is 512 bytes long. All multi-byte fields shown in these data structures follow the

specifications for byte ordering.

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6.3.8 Error reporting

Error condition

Status

Error

A S.M.A.R.T. FUNCTION SET command was received by the device without the required key being loaded into the LBA High and LBA Mid registers.

51h

04h

A S.M.A.R.T. FUNCTION SET command was received by the device with a subcommand value in the Features Register that is either invalid or not supported by this device.

51h

04h

A S.M.A.R.T. FUNCTION SET command subcommand other than S.M.A.R.T. ENABLE OPERATIONS was received by the device while the device was in a "S.M.A.R.T Disabled" state.

51h

04h

The device is unable to read its Attribute Values or Attribute Thresholds data structure

51h

10h or 04h

The device is unable to write to its Attribute Values data structure.

51h

10h or 04h

The following table shows the values returned from the Status and Error Registers when specific error conditions are encountered by a device.

S.M.A.R.T Error Codes

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7. OOB signaling and Phy Power State

Time

Value

106.7 ns

320ns

7.1 OOB signaling

7.1.1 OOB signal spacing

There shall be three Out Of Band (OOB) signals used/detected by the Phy: COMRESET, COMINIT, and COMWAKE. Each burst is followed by idle periods (at common-mode levels), having durations as depicted in following Figure and Table. The COMWAKE OOB signaling is used to bring the Phy out of a power-down state (Partial or Slumber)

7.2 Phy Power State

7.2.1 COMRESET sequence state diagram

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8. SPOR Specification (Sudden Power Off and Recovery)

8.1 Data Recovery in Sudden Power Off

If power interruption is detected, SSD dumps all cached user data and meta data to NAND Flash. SSD could protect even the user data in DRAM from sudden power off while SSD is used with cache on. Commonly, data is protected all of the operation period.

In normal power-off recovery status, SSD needs less than 11 seconds to reach operating mode where SSD works perfectly with cache-on state. SSD is ready to respond Identify Device command during FTL OPEN. When the sudden power-off occurs, the user data in DRAM will be dumped into to NAND Flash using the stored power in the capacitor. In sudden power-off recovery condition, mapping data will be loaded or the FTL meta data be rebuilt perfectly for initial max. 40 seconds. During this period, Identify Device command is still supported. It is called SPOR.(Sudden Power Off and Recovery)

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9. SATA II Optional Feature

9.1 Asynchronous Signal Recovery

Phys may support asynchronous signal recovery for those applications where the usage model of device insertion into a receptacle does not apply. When signal is lost, both the host and the device may attempt to recover the signal. A host or device shall determine loss of signal as represented by a transition from PHYRDY to PHYRDYn, which is associated with entry into states LSI: NoCommErr or LS2:NoComm within the Link layer. Note that negation of PHYRDY does not always constitute a loss of signal. Recovery of the signal is associated with exit from state LS2:NoComm. If the device attempts to recover the signal before the host by issuing a COMINIT, the device shall return its signature following completion of the OOB sequence which included COMINIT. If a host supports asynchronous signal recovery, when the host receives an unsolicited COMINIT, the host shall issue a COMRESET to the device. When a COMRESET is sent to the device in response to an unsolicited COMINIT, the host shall set the Status register to 7Fh and shall set all other Shadow Command Block Registers to FFh. When the COMINIT is received in response to the COMRESET which is associated with entry into state HP2B:HR_AwaitNoCOMINIT, the Shadow Status register value shall be updated to either FFh or 80h to reflect that a device is attached.

9.2 Power Segment Pin P11

Pin P11 of the power segment of the device connector may be used by the device to provide the host with an activity indication and it may be used by the host to indicate whether staggered spinup should be used. To accomplish both of these goals, pin P11 acts as an input from the host to the device prior to PHYRDY for staggered spin-up control and then acts as an output from the device to the host after PHYRDY for activity indication. The activity indication provided by pin P11 is primarily for use in backplane applications. A host may only support one pin P11 feature, either receiving activity indication or staggered spin-up disable control. If a host supports receiving activity indication via pin P11, then the host shall not use pin P11 to disable staggered spin-up. If a host does not support receiving activity indication via pin P11, then the host may use pin P11 to disable staggered spin-up.

9.3 Activity LED indications

The signal provides for activity indication. This is a low-voltage and low-current driver intended for efficient integration into present and future IC manufacturing processes. The signal is NOT suitable for directly driving an LED and must first be buffered using a circuit external to the drive before driving and LED. The LED indication signal is working on 200msec periods on FORMAT and Write same command. (100ms at high state and then 100msec at low state) On the other case of commands, the signal is working on 100msec periods.

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10. Product Compliance

Samsung MZ-7GE960EW User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual