SAMSUNG MAX670RLC Service Manual

6+1 CD CHANGER MINI COMPONENT

1. Precautions

2. Product Specifications

3. Disassembly and Reassembly

4. Alignment and Adjustments

5. Special Circuit Descriptions

6. Troubleshooting

7. Exploded Views and Parts List

8. Electrical Parts List

9. Block Diagrams

10. PCB Diagrams

11. Wiring Diagram

12. Schematic Diagrams

CD SYNCHRO

DUBBING

HIGHNORMAL

RESET

DOLBY NRCOUNTER

DOLBY B NR

AUTO REVERSEAUTO REVERSE

REC/PLAY

PUSH EJECT

PLAYBACK

PUSH EJECT

AI OFF

1 2

REPEAT

REPEATPROGRAM

123456

EXTRA

OPEN/CLOSE

MIC VOL.

MAXMIN

PHONES

POWER

ON/STAND BY

BIO VCR AUX ECHO

1-2-OFF

MIC

EQ SBS RELAX LEVEL

DSP SRS

MULTI JOG

VOLUME

MIN MAX

PASS POP ROCK JAZZ CLASSIC MUTE

BAND

TIMER/CLOCK MEMORY PRESET

SERVICE

Manual

6+1 CD CHANGER MINI COMPONENT SYSTEM

MAX-670

CONTENTS

Samsung Electronics Co., Ltd. Oct. 1996. Code No. AH68-20108A

1. Precautions

Follow these safety, servicing and ESD precautions to prevent damage and protect against potential hazards such as electrical shock and X-rays.

1-1 Safety Precautions

1. Be sure that all of the built-in protective devices are replaced.

(Reading should

2. When reinstalling the chassis and its

assemblies, be sure to restore all protective

devices, including control knobs and

compartment covers.

3. Make sure that there are no cabinet

openings through which people-particularly children--might insert fingers

and contact dangerous voltages. Such openings include the spacing between the picture tube and the cabinet mask,

excessively wide cabinet ventilation slots,

and improperly fitted back covers.

Device Under

Test

Test all

exposed metal

surfaces

2-Wire Cord

Also test with plug reversed (using AC adapter plug as required)

Fig. 1-1 AC Leakage Test

not be above

0.5mA)

Leakage Currant Tester

Earth Ground

4. Design Alteration Warning: Never alter or add to the mechanical or electrical design of the unit. Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, any design changes or additions will void the manufacturer's warranty.

5. Leakage Current Hot Check (Figure 1-1):

Warning: Do not use an isolation transformer during this test. Use a leakage-

current tester or a metering system that complies with American National Standards Institute (ANSI C101.1, Leakage Current for Appliances), and Underwriters Laboratories (UL Publication UL1410, 59.7).

With the unit completely reassembled, plug

the AC line cord directly into a 120V AC outlet. With the unit's AC switch first in the ON position and then OFF, measure the current between a known earth ground (metal water pipe, etc.) and all exposed metal parts. Examples: Handle brackets, metal cabinets, screwheads and control shafts. The current measured should not exceed 0.5 milliamp. Reverse the powerplug prongs in the AC outlet and repeat.

6. Insulation Resistance Cold Check: (1) With the unit's AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs. (2) Set the power switch to ON. (3) Measure the resistance between the shorted AC plug and any exposed metallic parts. Example: Screwheads, antenna, control shafts or handle brackets.

If any of the exposed metallic parts has a return path to the chassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the measured resistance should be "infinite." If the resistance is outside these limits, a shock hazard might exist. See Figure 1-2

Antenna Terminal

Exposed Metal Part

ohm

Ohmmeter

Fig. 1-2 Insulation Resistance Test

Samsung Electronics 1-1

Precautions

1-1 Safety Precautions (Continued)

7. Components, parts and wiring that appear to have overheated or that are otherwise

damaged should be replaced with parts that meet the original specifications. Always determine the cause of damage or overheating, and correct any potential hazards

8. Observe the original lead dress, especially

near the following areas: Antenna wiring, sharp edges, and especially the AC and high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring. Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage. Make sure that no wires or components touch thermally hot parts.

1-2 Servicing Precautions

9. Product Safety Notice: Some electrical and mechanical parts

have special safety-related characteristics which might not be obvious from visual inspection. These safety features and the protection they give might be lost if the replacement component differs from the original--even if the replacement is rated for higher voltage, wattage, etc.

10 Components that are critical for safety are

indicated in the circuit diagram by

shading, or . Use replacement

components that have the same ratings,

especially for flame resistance and

dielectric strength specifications. A

replacement part that does not have the

same safety characteristics as the original

might create shock, fire or other hazards.

Warning1: First read the "Safety Precautions" section of this manual. If some unforeseen circumstance creates a conflict

between the servicing and safety precautions, always follow the safety precautions.

1. Servicing precautions are printed on the cabinet. Follow them.

2. Always unplug the unit's AC power cord from the AC power source before attempting to: (a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in parallel with an electrolytic capacitor.

3. Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used. The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elements to their original position.

4. After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that the portion around the serviced part has not been damaged.

5. Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal panels, input terminals and earphone jacks).

6. Insulation Checking Procedure: Disconnect the power cord from the AC source and turn the power switch ON. Connect an insulation resistance meter (500V) to the blades of the AC plug.

The insulation resistance between each blade of the AC plug and accessible conductive parts (see above) should be greater than 1 megohm.

7. Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all solid-state heat sinks are correctly installed.

8. Always connect a test instrument's ground lead to the instrument chassis ground before connecting the positive lead; always remove the instrument's ground lead last.

Samsung Electronics1-2

1-3 Precautions for Electrostatically Sensitive Devices (ESDs)

Precautions

1. Some semiconductor ("solid state") devices are easily damaged by static electricity. Such components are called Electrostatically Sensitive Devices (ESDs). Examples include integrated circuits and some field-effect transistors. The following techniques will reduce the occurrence of component damage caused by static electricity.

2. Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it prior to applying power--this is an electric shock precaution.)

3. After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent accumulation of electrostatic charge.

4. Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.

5. Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.

6. Use only an anti-static solder removal device. Many solder removal devices are not rated as "anti-static" (these can accumulate sufficient electrical charge to damage ESDs).

7. Do not remove a replacement ESD from its protective package until you are ready to install it. Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum foil or other conductive materials.

8. Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material to the chassis or circuit assembly into which the device will be installed.

9. Minimize body motions when handing unpackaged replacement ESDs. Motions such as brushing clothes together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

1-4 Special Precautions and Warning Labels for Laser Products

(UL)

This Product Complies with DHHS Rules 21CFR, Sub chapter J.At date of Manufacture

(SCAN)

CAUTION : INVISIBLE LASER RADIATION WHEN OPEN

AND INTERLOCKS DEFEATEO AVOIDEXPOSURE TO BEAM

ADVARSEL:USYNLIG LASERSTRÅLING VED ABNING

NÅR SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION

UNDGA UDSAETTELSE FOR STRALING

VARO:AVATTAESSA JA SUOJALUKITUS OHITETTAESSA

OLET ALTTINA NAKYMATTÖMALLE LASERSATEILYLLE ALA KATSO SATEESEEN!

VARNING:OSYNLIG LASERSTRÅLNING NAR DENNA DEL

AR OPPNAD OCH SPARREN AR URKOPPLAD BETRAKTA EJSTRÅLEN!

CERTIFIED ONLY TO CANADIAN ELECTRICAL CODE.

CERTIFIE EN VERTU DU CODE CANADIAN DE LELETRICITE SEULEMENT

Fig. 1-3 Warning Labels (Location: Enclosure Block)

(EU)

(CSA)

UL : Manufactured for U.S.A. Market. CSA : Manufactured for Canadian Market. EU : Manufactured for European Market. SCAN : Manufactured for Scandinavian

Market.

(EU)

CLASS 1 LASER PRODUCT

Fig. 1-4 Warning Labels (Location: Disc Clamper, Inner Side of Unit Door or Nearby Unit Chassis )

Samsung Electronics 1-3

Precautions

1-4 Special Precautions and Warning Labels for Laser Products (Continued)

1-4-1 Warnings

1. When servicing, do not approach the LASER exit with the eye too closely. In case it is necessary to confirm LASER beam emission, be sure to observe from a distance of more than 30 cm from the surface of the objective lens on the optical pick-up block.

2. Do not attempt to handle the objective lens when the DISC is not on the tray.

1-4-2 Laser Diode Specifications

Material: GaAs+ GaAlAs Wavelength: 760-800 nm Emission Duration: Continuous

Laser Output: 0.2 mw (measured at a

1.6 mm distance from the objective lens surface on the optical pick-up block.)

1-4-3 Handling the Optical Pick-up

1. Static electricity from clothing or the body may cause electrostatic breakdown of the laser diode in the Optical Pickup. Follow this procedure:

2. Place a conductive sheet on the work bench (i.e., the black sheet used for wrapping

repair parts.) Note: The surface of the work

bench should be covered by a copper

ground plane, which is grounded.

3. The repair technician must wear a wrist strap which is grounded to the copper sheet.

4. To remove the Optical Pickup block: Place the set on the conductive sheet, and momentarily touch the conductive sheet

with both hands. (While working, do not

allow any electrostatic sources--such as clothes--to touch the unit.)

5. Ground the "Short Terminal" (located on the PCB, inside the Pickup Assembly) before replacing the Pickup. This terminal should be shorted whenever the Pickup Assembly

is lifted or moved.

short terminal

SOH91VI(LDP)

short terminal

SOH91CI(CAR,walkman)

6. After replacing the Pickup, reopen the Short Terminal. See diagrams below:

THE UNIT

(1) WRIST-STRAP FOR GROUNDING

short terminal

SOH-A1

(CMS-V10,CMS-V30)

SOH94T4N

(CMS-V10,CMS-V30)

CONDUCTIVE SHEET

short terminal

Samsung Electronics1-4

2. Specifications

Power source Power consumption Dimmensions(mm)

220V 280W 270(W)x317(H)x333(D)

Power output Total harmonic distortion Frequency range Signal to noise ratio Channel separation Input sensitivity

Frequency range Usable sensitivity Signal to noise ratio If rejection ratio Total harmonic distortion Separation(Stereo)

Frequency range Usable sensitivity Signal to noise ratio If rejection ratio Total harmonic distortion

Frequency range Usable sensitivity Signal to noise ratio

Frequency range WOW FLUTTER Erasing effect Signal to noise ratio Total harmonic distortion

Frequency response Signal to noise ratio Channel separation Total harmonic distortion

87.5 ~ 108MHz 1µV 62dB 60dB

0.45% 35dB

522 ~ 1611KHz 600µV 40dB 30dB 2%

146 ~ 290KHz 1000µV 35dB

125Hz ~ 12.5KHz

0.15% 60dB 40dB

2.5%

20Hz ~ 20KHz(¡ 1dB) 100dB(1kHz 0dB) 80dB(1kHz 0dB)

0.01%(1kHz 0dB)

90W/CH(6Ω) 10% 20Hz ~ 20kHz 75 dB 50 dB (1 KHz) AUX 400mV

General

Amp

Tuner

Cassette Deck

Compact Disc

(Option)

Samsung Electronics 2-1

* Specifications are subject to change without notice.

3. Disassembly and Reassembly

* Before removing the unit, be sure to unplug.

3-1 Amp and Tuner Section

3-1-1 Cabinet-Top

1. Remove 9 screws ! holding the Cabinet-Top.

2. Remove the Cabinet-Top in the direction of arrow.

FRONT

BOTTOM

REAR

TOP

Figure 3-1

Samsung Electronics 3-1

3-1-2 Cabinet-Rear

1. Remove 7 screws ! holding the Cabinet-Rear.

2. Remove the Cabinet-Rear in the direction of arrow.

3. Remove the Main PCB in the direction of arrow.

Figure 3-2

3-2 Samsung Electronics

REAR

MAIN PCB

Disassembly and Reassembly

3-1-3 Cabinet-Front

1. Remove 3 screws ! holding the Cabinet-Front.

2. Remove the Cabinet-Front from the Bottom.

Figure 3-3

Samsung Electronics 3-3

Disassembly and Reassembly

Figure 3-4

3-4 Samsung Electronics

3-2 Cassette Deck and CD Section

3-2-1 Cabinet-Top

1. Remove 9 screws ! holding the Cabinet-Top.

2. Remove the Cabinet-Top in the direction of arrow.

FRONT

BOTTOM

REAR

TOP

Disassembly and Reassembly

4-1Samsung Electronics

4. Alignment and Adjustments

4-1 Tuner Section

FM T.H.D Adjustment

SSG FREQ.

Adjustment point (TL2)

Minimum output(Figure4-1)

Level : Maximum (Figure4-2)

SSG FREQ. Adjustment

point (TL1)

SSG FREQ. Adjustment

point (TL1)

“TUNED” is shown of FLT (Figure4-3)

Adjustment point (TL1)

SSG FREQ.

“TUNED” is shown of FLT (Figure4-4)

FM antenna Terminal

Speaker Terminal

Input

Figure 4-1 IF CENTER and T.H.D Adjustment

Output

Voltmeter

Oscilloscope

FM S.S.G

SET

Output GND

TVR2

TL2

TL1

TVR1

AM IF Adjustment

Figure 4-3 AM Search Level Adjustment

Figure 4-4 FM Search Level Adjustment

FM S.S.G

GND

Oscilloscope

VTVM

60 cm

30dB

FM IN

FM Antenna

SET

5 kB

AM Search Level Adjustment

Figure 4-2 AM IF Level Adjustment

AM S.S.G

AM Antenna Terminal

FM Search Level Adjustment

* Note : Be sure to adjust the AM for Tuner Search Level.

(If AM is adjusted, FM is adjusted automatically.)

* Note : Adjust FM S.S.G Level to

EMF 21dB (Included Loss)

60 cm

AM S.S.G

20KB

SET

98MHz

FM DETECTIR COIL

594KHz

AM IF COIL

999KHz

SEMI-VR (20KB)

98MHz

SEMI-VR (5KB)

3KHZ 1%

5700~6300KHz

Samsung Electronics4-2

Alignment and Adjustments

4-2 Cassette Deck Section

1) Measuring Tape i) MTT-111(or equivalent) (Tapes recorded with 3kHz )

ii) MTT-5512(or equivalent)

2) Connect the Cassette Deck to the

frequency counter as in Figure 4-5

Note

4-2-1 To Adjust Tape Speed

Figure 4-5

Cassette Deck

Frequency Counter

Line Out

TP1

Output

LSR1R

LSR1L

JSR3R

JSR2R

JSR1R

CSR1

TP3

CSR2

LL2

TP1

TP2

NOR SPEED Control counter

HI SPEED Control

OUT (connected tothe frequency counter)

Same as above

1) A-Deck: MTT-111

2) Press PLAY SW button

3) B-Deck: Same as below

1) A-Deck: MTT-111

2) B-Deck: MTT-5512

3) Press Hi Speed

dubbing switch

Turn CSR1,2 to

left and right.

Fixed

Check

Step

To Adjust

Item

Standard

Remark

Pre-Setup Condition

Pre-Setup

VTVM 400mV 5%

105KHz 5%

VTVM (7V 5%)

Max output and same phase both channels.

300mV 0.5dB

Max output and same phase (both channels).

300mV 0.5dB

4-3Samsung Electronics

Figure 4-6

Figure 4-7

Cassette Deck

LINE OUT

TP1

V H

Oscilloscope

Recording/Play head

REVERSE PLAY

Input Output

Azimuth Control Knob

Alignment and Adjustments

1) Before the actual adjustment, clean the replay/recording head.

2) Measuring tape :

i) MTT-114NA (or equivalent 12.5 kHz AZIMUTH

control).

ii) MTT-150 (or equivalent : Dolby level 200mwb/m)

3) Dolby NR SW OFF

4) The cassette deck is connections as shown in figure4-6.

NOTES

4-2-2 To Adjust Replay Head

Step

To Adjust

Item

Standard

Remark

Pre-Setup Condition

Pre-Setup

AZIMUTH

PlayBack out Level

TP1 OUT (VTVM is connected to the scope)

Same as above

After putting MTT

-114NA into Deck 1.

1) Press FWD PLAY button.

2) Press REV PLAY button.

PLAY MTT-150 on Deck1.

1) Turn the control knob to as shown in Figure 4-6.

2) Adjust the right

control screw to playback Rev. Mode.

L-CH : Turn JSR1R

to the right and left

R-CH : Fixed

After adjustment secure it with REGION LOCK.

See the diagram for adjustment locations

After adjustment secure it with REGION LOCK.

See the diagram for adjustment locations

AZIMUTH

PlayBack out Level

TP3 OUT (VTVM is connected to the scope)

Same as above

After putting MTT-114NA into Deck 2.

1) Press FWD PLAY button.

2) Press REV PLAY button.

PLAY MTT-150 on Deck2.

1) Turn the control knob to left and right as shown in the Figure 4-6.

2) Adjust the right

control screw to playback Rev. Mode.

L-CH :Turn JSR2R to

the right and left;

R-CH : Fixed

1) Adjust 1-Deck Replay Level

2) Adjust 2-Deck Replay Level

1) Connect the measuring instruments as shown in Figure 4-8

2) Set the DOLBY NR Switch off.

3) Measuring tape : MTT-5512 ( or equivalent : normal recording )

4) The input signals supply 400Hz 400mV into AUX IN of AMP (AUDIO OSC).

NOTES

Step

Item

Pre-Setup Condition

Normal electric current for recording

BIAS OSC. FREQUENCY

BIAS electric current

Connect to TP2 as in Figure 4-8

and read VTVM

Connect the frequency counter to

TP1 Connect to

TP1 as in Figure 4-8

and read the VTVM

Insert MTT-5512 into Deck 2, then press REC button.

Insert MTT-5512 into Deck 2,

then press REC button.

Insert MTT-5512 into Deck 2,

then press REC button.

L-CH : DSR2L to the right and left. R-CH : Fixed

Turn BIAS oscillator frequency coil (LL2) to the right and left.

L-CH : DSR1L and R-CH: DSR1R to the right and left.

See diagram for adjustment locations.

4-2-3 To Adjust PlayBack

Figure 4-8

In Out

VTVM

AUDIO OSC

Oscilloscope

Cassette Deck

AUX IN

TP1

Pre-Setup

To Adjust

Standard

Remark

Samsung Electronics4-4

4-3 CD Section

A=B

---100mV

---0V

---250mV

---0 V

---100mV

---0 V

4-3-1 To Adjust FOCUS BIAS(STOP mode)

1. Set Volt/Div of the oscilloscope to DC 100mV.

2. Ground the scope input and set the waveform to 0V, DC range.

3. Connect the GND terminal of the oscilloscope to Vref, and (+) terminal to center of TP1.

4. Set WVR4 to 0mV.

4-3-4 To Adjust E/F Balance (PLAY mode)

1. Set TIME/DIV of the oscilloscope to 2mS.

2. Set Volt/DIV of the oscilloscope to 0.5V.

3. Ground the scope input and set to DC and then set the DC range.

4. Connect the GND terminal of the oscilloscope to Vref and (+) terminal to center to AP2.

5. Load and play the disc.

6. Turn WVR1 counterclockwise to the minimum value.

7. Raise WVR3 and adjust the waveform so that its middle comes to GND of the oscilloscope (or until the upper half of waveform becomes symmetrical to the bottom half, A=B)

8. Adjust WVR1 (arrow) for normal sound.

VOLT/DIV : 0.1V TIME/DIV : 2mS

Normal Frequency

Low Frequency High Fequency

4-3-3 To Adjust Focus Gain (PLAY mode)

1. Connect the GND terminal of the oscilloscope to Vref and (+) terminal to TP1.

2. Load and play the disc

3. While the disc is running adjust the gain with NVR1703 as shown in the following figure.

4-3-2 To Adjust Tracking Gain (PLAY mode)

1. Connect the GND terminal of the oscilloscope to Vref and (+) terminal to AP2.

2. Load and play the disc

3. While the disc is running adjust the gain with WVR1 as shown below.

Normal Frequency

VOLT/DIV : 0.2V TIME/DIV : 2mS

Low Frequency

VOLT/DIV : 0.2V TIME/DIV : 2mS

High Frequency

Alignment and Adjustments

Samsung Electronics 5-1

RF I-V Amp(1) and RF I-V Amp(2) are converted to voltage via internal resistance of 58k½ from the current of PD1(A+C) and PD2(B+D): This voltage is added to RF summing amplifier. The signal (A+B+C+D) is applied to RFO (No. 66 terminal). RF output voltage is calculated as follows :

VFE = (R2/R1) x (V2-V1) = 5.4(V2-V1)

This FOCUS ERROR voltage is sent to FOCUS SERVO .

VRF = -R3 x (iPD1 + iPD2)

VRF = -R3 x (V1/R1 + V2/R2)

VRF = -R3 x ( + )

VRF = - x (V1 + V2)

10K 10K

V 1 V 2

10K

Photo Detector

PD1 PD2

58K

RF I-V AMP(1)

58K

10K

RF I-V AMP(2)

10K

RF SUMMING

V1 AMP

RFO

5-1-1 RF Amp (KA9220) : WIC01

5-1-2 FOCUS ERROR Amp(KA9220) : WIC01

174K

C1 25P

FOCUS ERROR

AMP

164K

32K

C2 25P

-(A+C)

-(B+D)

V1 32K

5-1-3 FOCUS SERVO SYSTEM (KA9220) : WIC01

When FS3 is ON, high frequency gain decreases (time constant set by pin17, pin19, and capacitor connected to internal resistance). The capacitor between pin 18 and GND sets the time constant to pass the low frequency operated in PLAY mode.

The maximum frequency of focus phase compensation is inversely proportional to the resistance connected to pin 7. Focus search peak is about 1.1 Vp-p, and is inversely proportional to the resistance connected to pins 22,23 (if this resistance changes, the peak of track jump and sled kick change). The inversion input of FZC comparator is set to 5.7% of the difference between Vcc and VC(pin69) {{5.7% x (Vcc-Vc)}. Note : If the resistance connected to pin7 changes, the phase compensation peak of focus, tracking, sled servo changes. At the same time, 'op-amp' dynamic range and offset voltage also change.

3.6K

60K

FZC

0.0022

20K

0.1UF

FDFCT

HFGD

EFR

FE2

470K

DFCT

FS4

20K 48K

58 60

46K

580K FS3

FSW

470K

130K

0.1UF

40K

PFSET

FS2

PHASE COMPENSATION

92K

40K

10K

4.7UF

FSCH

FS1

50K

5.5U 11U

VREG

180K

ISET

FCE

120K

FOCUS COIL

FSEO

FE1

5-1 CD

FOCUS ERROR Amp is the circuit which amplifies the difference between RF I-V Amp(1) output (A+C) and RF I-V Amp(2) output(B+D). These two signals are supplied to (-) and (+) input terminals of FOCUS ERROR Amp. The FOCUS ERROR signal resulting from this difference voltage is applied to FE (Terminal No.57). The FE output voltage of this low frequency component varies according to {(A+C) - (B+D)}. VFE is calculated as follows :

5. Special Circuit Descriptions

5-1-5 Motor Drive(LB1649) : UIC4

22 23

40 41 39

47 48

0.022UF

TZC

0.047UF

150K

BPF

1K 1K

TZC

100K

ATC

20K

TE 1

TE2

470K

100K

ATS

TDFC1

0.1UF

680K

66PF

10K

DFCT

0.1UF

RTG

20K

TGSW

470K

TG2

82K

110K

PHASE

COMPENSATION

S STOP

100K

S STOP

SLED

SLEI

SLEN

10K

56K

100K

ISET VREG

180K

SLED DRIVER

120K

100K

TKEO

TKEI

TM2

TM6

TM5

TM4

5.5U

TM3

5.5U

10K

90K

TM7

PFSET

470K

TRACKING COIL

5-2

Special Circuit Descriptions

Samsung Electronics

OUT1

OUT2

VCC1

IN 1

Fin

IN 2

VZ1

VZ2

IN3

IN4

VCC2

OUT3

OUT4

Input Logic Input Logic

Pre-Driver

IN 1 2 OUT1 OUT2

0 0 L L 1 0 H L 0 1 L H 1 1 L L

IN 3 IN 4 OUT3 OUT4

0 0 L L 1 0 H L

0 1 L H 1 1 L L

5-1-4 Tracking Sled Servo System (KA9220) : WIC01

The capactor between pin 15 and 16 attenuates the high frequency when TG2 is off. The maximum frequency of tracking phase compensation is inversely proportional to the resistance connected to pin 7 (about 1.2kHz at 470k). The tracking jump (FWD and REV) is decided when TM3 and TM4 are ON, and the peak voltage induced from

tracing coil is decided by the both TM3 and TM4 current values and feed back resistance of pin 47. Track jump max voltage = TM3 (TM4) current x feedback resistance.

FWD or REV sled kick occnrs when TM5 or TM6 is ON, and the peak voltage added to sled motor is decided by TM5 or TM6 current and the feedback resistance of pin 41. Sled jump max. voltage = TM5(TM6) current x feedback resistance Each SW current is decided by the resistance connected to pin 22 and 23.

When the resistance is about 150½,

TM3 or TM4 = 11µA, TM5 or TM6 = 22µA,

This current is inversely proportional to the resistor, variable within a range of t 5 to 40 µA for TM3. STOP is the ON/OFF detection signal for the limit SW (or the sled motor's innermost cirumference).

Samsung Electronics 6-1

6-1 The Amp Section

6-1-1 Power Malfunction

6. Troubleshooting

Main PCB µ-com VDD(5V)

normal?

UIC1 pin no. 18,47,90

Front PCB

Main PCB POSNS voltage normal ? (pin no. 28 ; 4.5V)

Check the Front PCB ; UQ1 Check the Main PCB ; RD3,RZD4,PC11,PR33 PR9,PR10,PC12

Check the Power PCB ; PIC2,PR4,3

RF3,4(T2A 250V)

Main PCB UIC5(78L05) IN : 8V

Input voltage normal ?

Replace UIC5

Does UX2(12MHz)

oscillate ?

At the base of

Main PCB ; PQ3

Base High Display ?

Replace µ-com

Front PCB, When the power is ON 'H', displays at pin no.84 ? (5V)

Connect Front PCB and Main PCB & Check the connector Main PCB

Wafer CCW2,CMW2

Replace µ-com

Connector inserted

correctly?

Check voltage : AC 5V

at FRONT-PCB FLT?

Check Main-PCB & Front PCB connection and the voltage of CCW2, pins19,20 (AC 5V)

Check voltage at UIC1

pin no. 48(-36V)

Check the voltage of PZD2 (-36V)

Reinsert the connector.

Replace UIC1

6-2 Samsung Electronics

Troubleshooting

6-1-2 F.L.T Malfunction

AQ OC2,OC8 pin no.7 ;

Main PCB OC2,OC8

(STK4221), pin no.11,13

; B+,B circuits

Check the B+ power source part in PBD2(GBU6D), PC1 and PC2.

Is Mute selected ?

Confirm for TR short Replace it

Remove it with Remocon

Check if the output line is short

B- (-0.3V)

Check the mute circuit OQ1(KSR2003) base B+ (0V)

Replace OD8

Replace OQ1

OQ4,OQ2 Base B+ ?

Headphone jack

Short ?

Replace Headphone jack

soldering condition

Front PCB

µ-com pin no.5 ;

Check the "H"

Replace µ-com

Samsung Electronics 6-3

Troubleshooting

6-1-3 No Output

Main PCB µ-com VDD(5V)

normal?

UIC1 pin no. 18,47,90

Main PCB

Main PCB POSNS voltage normal ? (pin no. 29 ; 4.5V)

Check the Main PCB ; CSW1

Main PCB RIC4(BA7805) IN : 5V

Input voltage normal ?

Replace RIC4

Does UX2(12MHz)

oscillope ?

Main PCB

Check µ-com vpp pin no.48

Check the Power PCB ; RD1,RD2(IN5392)

At the base of Main PCB ; RFS1,2 (T2A 250V)

Replace UIC1

6-4 Samsung Electronics

6-2 The Deck Section

6-2-1 Power Malfunction

Troubleshooting

Connector inserted

correctly?

Check voltage : AC 5V

at FRONT-PCB FLT?

Check Main-PCB & Front PCB connection and the voltage of CCW2, pins1,2 (AC 5V)

Check voltage at UIC1

pin no. 48(-36V)

Check the voltage at pin no.8 of CSW1

Reinsert the connector.

Replace UIC1

Samsung Electronics 6-5

6-2-2 F.L.T Malfunction

Troubleshooting

Main PCB DIC2

(HC14066), pin no. 7,14

; Check signal

Check the B+ power source part in RIC3(KA7812), IN ; 15V, OUT ;12V

Check signal of pin no. 43,45

of JIC1 ?

Replace JIC1

Check B+ of pin no. 10 of DIC1 ?

Check RIC3(KA7812) IN ; 15V, OUT ; 12V

Replace RQ4

Check signal of pin no. 1,2 of JIC1 ?

Check signal of pin no.

3,13V of DIC1 ?

Check B+ ; 10V of pin no.22 of JIC1 ?

6-6 Samsung Electronics

6-2-3 No Output

Troubleshooting

PICK-UP LIMIT SW (ON OFF)

PICK-UP UNIT SW (DOWN)

DISC CASE P.SENSOR(L)

LOAD

LOADING PLATE P.SENSOR(H L)

LOADING MOTOR STOP

LOADING MOTOR (CCW)

30mS (BRAKE)

LOADING MOTOR STOP 40mS

LOADING MOTOR (CCW)

LOADING PLATE P.SENSOR(L H)

LOADING MOTOR STOP 30mS

LOADING MOTOR (CW)

LOADING PLATE P.SENSOR(H L)

LOADING MOTOR STOP

END

LOADING MOTOR(CW)

Samsung Electronics

6-7

Troubleshooting

6-3 CD Section

6-3-1 Load Operation

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