General Description ……………………………………………………………………………...…………… (4)
General Information..……………………………………………………………………………………………..(4)
Mechanical INFORMATION…………………………………………………………………………………(5)
1. Absolute Maximum Ratings …………………………………………………………………………………(6)
8. Reliability Test ……………………………………………………………………………………………….(35)
9. General Precaution…………………………………………………………………………….…………….(37)
9.1 Handling
9.2 Storage
9.3 Operation
9.4 Guides for the Operation Condition
9.5 Others
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General Description
Description
LTA550HQ23 is a color active matrix liquid crystal display (LCD) that uses amorphous silicon TFT(Thin
Film Transistor) as switching components. This model is composed of a TFT LCD panel, a driver circuit,
and a back-light unit. This 46.0” model has a resolution of 1920 x 1080 pixels (16:9) can display up to
1.07 Billion colors(Dithering) with the wide viewing angle of 89° or higher in all directions. This panel is
intended to support applications by providing an excellent performance for the display products with a flat
panel such as Home-alone Multimedia TFT-LCD TV and a High Definition TV.
General Information
Features
High contrast ratio & aperture ratio with the wide color gamut
SVA(Super Vertical Align) mode
Wide viewing angle (±178°)
High speed response
FHD resolution (16:9)
Edge Type LED (Light Emitted Diode) BLU
ROHS compliance (Pb-free)
Low power consumption
DE (Data enable) mode
2 Channel LVDS(Low Voltage Differential Signaling) interface
The interface (1pixel/clock) of LVDS serial interface)
Items
Specification
Unit
Note
Active Display Area
1209.600(H) x 680.400(V)
㎜
Switching Components
a-Si TFT Active matrix
Module Size
1229.4(H) x 704.2 (V)
mm
+1.0mm ~ -0.5mm
31.7 (D)
mm
+3mm, -1mm
Weight
16700
g
± 10%
Display Colors
16.7M (True Display)
1.07B (Dithered 10bit)
color
Number of Pixels
1920 x 1080
pixel
16 : 9
Pixel Arrangement
RGB vertical stripe
Display Mode
Normally Black
Surface Treatment
AG POL
Haze
Haze 2.3%
± 2.1%
Hardness
Hard coating 2H
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Item
Min.
Typ.
Max.
Note
Module size
Horizontal(H)
1228.9
1229.4
1230.4
mm
Vertical(V)
703.7
704.2
705.2
mm
Depth(D)
30.7
31.7
34.7
mm
( With Converter )
Bezel Open
Horizontal(H)
1216.6
1217.6
1218.6
mm
Vertical(V)
687.4
688.4
689.4
mm
Black Matrix
Shift
Horizontal(H)
3.4
4.0
4.6
mm
(1)
Vertical(V)
3.5
4.0
4.5
Weight
16700
18370
g
NOTE (1) Measure the figure for Black Matrix shift to be recorded on the spec. with referring to the drawings.
| A - B | ≤ Horizontal Spec
| C - D | ≤ Vertical Spec
<Module Depth Measure Point>
MECHANICAL INFORMATION
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1. ABSOLUTE MAXIMUM RATINGS
1.1 Environmental Absolute Ratings
Item
Symbol
Min.
Max.
Unit
Note
Storage temperate
TSTG
-20
65
C
(1)
Operating temperate
TOPR 0 50
C
(1)
Humidity for storage
HSTG 5 90
%RH
Operating humidity
HOPR
20
90
%RG
Endurance on static electricity
150
V
(2)
Shock (non-operating)
Snop(X,Y)
30
G
(3),(5)
Snop(Z)
-
30
Vibration (non-operating)
Vnop - 1.5
G
(4),(5)
Note (1) The ranges of temperature and relative humidity are shown in the graph below. 90% RH Max.
(The temperature of Ta shall be over 39℃.)
The maximum temperature of wet–bulb shall be less than 39℃.
No condensation
Note (2) Keep the static electricity under 150V in Polarizer attaching process.
Note (3) 11ms, half sine wave, one time for X, Y, Z axis
Note (4) 10 ~ 300 Hz, Swap rate for X, Y, Z axis one time*
Note (5) The fixture for the test of the vibration and shock, which holds the module to be tested shall be hard and
rigid in order for the module not to be twisted or bent by the fixture.
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Note (1) Within Ta (25 2 C)
The permanent damage or defect to the device may occur if the panel is operated at the figure set, which
exceeds a limit of maximum value stated in the former spec.
The functional operation should be limited to the conditions described above under normal operating
conditions.
Item
Symbol
Min.
Typ.
Max.
Unit
Note
Input Supply
Voltage /
Converter
Vcc
- - 26
V
LED Current(2D)
ILED,2D
-
147
mAmean
Continuous operation
@String (1 String/PCB)
LED Current(3D)
ILED,3D
-
265
mAhigh
Duty 56%
1.2 Electrical Absolute Ratings
(1) TFT LCD MODULE
1.3 The Others Absolute Ratings
STATIC ELECTRICITY PRESSURE RESISTANCE
Item
Symbol
Min.
Typ.
Max.
Unit
Note
Power Supply Voltage
VDD
10.8
13.2
V
(1)
Dimming Control
Vdim
0- 3.3V(1)
Item
Test Conditions
Remark
CONTACT DISCHARGE
150pF, 330, 10kV, 210points, 1 time/point
Operating
AIR DISCHARGE
150pF, 330, 20kV, 210points, 1 time/point
Operating
(2)BACK-LIGHT UNIT
Ta (25 2 C)
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2. Optical characteristics
The optical characteristics shall be measured in the dark room or the space surrounded by the similar ambient
setting.
* Ta = 25 2 C, VDD=3.3V, fv= 60Hz, fDCLK = 69.3MHz, IF = 100% duty
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Notice
(a) Setup for test equipment
The measurement should be executed in a stable, windless, and dark room for 40min and 60min after
operating the panel at the given temperature for stabilization of the standard light.
This measurement should be measured at the center of screen.
The environment condition: Ta = 25 ± 2 °C
Note (1) Definition of contrast ratio (C/R)
: The ratio of gray max (Gmax) & gray min (Gmin) at the center point ⑤ of the panel
Gmax : The luminance with all white pixels
Gmin : The luminance with all black pixels
Note (2) Definition of the brightness uniformity of 9 points (Test pattern : The full white)
Bmax : The maximum brightness
Bmin : The minimum brightness
Note (3) Definition of response time : Sum of Tr, Tf
※ G-to-G: Average response time between the whole gray scale to the whole gray scale.
The response of
optical instruments
Display data
C R
G
G
/
max
min
Buni
BB
B
100
(maxmin)
max
H : Horizontal Length of Active Area
V : Vertical height of Active Area
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Note (4) The definition of luminance of white: The luminance of white at the center point ⑤
Note (5) The definition of chromaticity (CIE 1931)
The color coordinate of red, green, blue and white at the center point ⑤
Note (6) Definition of viewing angle: The range of viewing angle (C/R ≥10)
Note (7) The definition of crosstalk; (Cross modulation) (DSHA): The phenomenon, which the level of contrast
ratio is declined by the interference of signals in pixels.
(%)100
||
)(
normal
abnormalnormal
SHA
Y
YY
DRatioModulationCrosstalk
* Measure the size of background pattern at the interval of 4 grays with excluding the size of white
rectangle within the range from gray 1 to gray 64.
* Measure the horizontal crosstalk and vertical crosstalk both.
* The maximum value among measured values can be defined as a crosstalk.
Reference: The color of rectangle for Gmin is black when the color of screen is white.
The color of rectangle for Gmax is white when the color of screen is black.
* Pattern to measure the crosstalk and points to be measured
< Horizontal Crosstalk >
MOVE
MOVE
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< Vertical Crosstalk >
Note (8)
The definition of terminology, flicker: The phenomenon, which the pixels on the screen of LCD panel blink.
1) Calculate the value of crosstalk with observing the standard for measuring the flicker.
2) The points to be measured
- The pattern to measure the flicker
< Green checker Inversion >
Note (9) Definition of Gamma
MOVE
MOVE
GammaXY
XZBBB
lum
lum
log(/) /log( /)
() / ()
minmaxmin
100100
100
Y: Measurement Level / Z: Measurement Brightness
B
max
: Maximum Brightness / B
min
: Minimum Brightness
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3. Electrical characteristics
The connector to transmit a display data and a timing signal shall be connected.
Ta = 25°C ± 2 °C
Item
Symbol
Min.
Typ.
Max.
Unit
Note
Voltage of Power Supply
VDD
10.8
12.0
13.2
V
(1)
Current of
Power
Supply
(a) Black
I
DD
-
510
-
mA
(2),(3)
(b) White
-
490
-
mA
(c) N-PTN
-
670
-
mA
Vsync Frequency
fV
48
60
62.5
Hz Hsync Frequency
fH
60
67.5
70
kHz Main Frequency
f
DCLK
130
148.5
152.5
MHz Rush Current
I
RUSH
- - 4
A
(4)
Note (1) The voltage for ripple shall be controlled under the range of fewer than 10% of V
DD
voltage.
(2) fV=60Hz, f
DCLK
=148.5MHz, VDD = 12.0V, DC Current.
(3) The pattern for checking the power dissipation (LCD module only)
(4) Conditions for measurement
* The temperature range for component of the some major part of operating module
3.1 TFT_LCD Module
(a) checker pattern b) White pattern c) Black Pattern
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3.2 BACK-LIGHT UNIT
* Back light unit is composed of 1–LED bars. (76 PCS of LEDs).
Item
Symbol
Min.
Typ.
Max.
Unit
Note
Operating Temperature range
Top
-20 - 70
℃
Storage Temperature range
Tstg
-30 - 85
℃
Junction Temperature
Tj
- - 145
℃
LED Forward Current
IF
133
140
147
mA
Continuous operation @String
(4 String/PCB)
Operating Current 140mA
IFP
- 252
mA
120Hz/Duty56%
LED Forward Voltage
VF
108.5
115.5
123.2
V
@140mA/string@ Tj 25℃
VFP
- 130
V
120Hz/Duty56%
Thermal Resistance Junction
to PCB
Rth, JS
-
-
25
K/W
Power Consumption
P
60.7
64.7
69.0
W
IF X VF
Operating Life Time
Hr
30000 - -
Hour
MTTF, 2D Only
LED Counts
Q
-
76 - EA
Ta=25℃
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ITEM
SYMBOL
CONDITION
MIN
TYP
MAX
UNIT
NOTE
Input Voltage
VIN 22
24
26 V
Inrush Current
Note(2)(3)
I
INRUSH,N
VIN = 24V, Dim=Max
3D ENA=Off
- - 3.57 A Normal Mode
I
INRUSH,3D
VIN = 24V,
3D ENA = On
- - 8.20 A 3D Mode
Output Current
Note(1)
I
LED,N
VIN = 24V, Dim=Max
3D ENA=Off
133
140
147
mAmean
Normal Mode
@1 String
I
LED,3D
VIN = 24V,
3D ENA = On
239
252
265
mAdc
Note(5)
3D Mode
Active High @1String
Converter
On/Off Control
ENA
Enable
2.4 - 5.25
V
Disable
-0.3 - 0.4
INT_DIM
V
INT_DIM
VIN = 24V
0 - 3.3
V
Note(*4)(*5)
V
EXT_DIM
Pin(#14)
: floating(N.C)
D
INT_DIM
(Duty)
VIN = 24V
1 - 100
%
EXT_DIM
V
EXT_DIM
High Level
2.4 - 5.25
V
Note(4)(5)(6)
V
INT_DIM
pin(#13)
= floating(N.C.)
Low Level
-0.3 - 0.4
D
EXT_DIM
(Duty)
VIN = 24V
1 - 100
%
F
EXT_DIM
-
150
-
Hz
Note(7)
T
RISING
- -
200
ns
T
FALLING
- -
200
ns
V
SYNC
V
SYNC
High Level
2.4 - 3.6
V
Note(*5)(*6)
INT_DIM Only
Low Level
-0.3 - 0.4
D
SYNC
VIN = 24V
-
50 - %
F
SYNC
120
125
130
Hz
Vsync 50
143
150
156
Hz
Vsync 60
T
RISING
- -
200
ns
T
FALLING
- -
200
ns
3D Mode
3D ENA
Enable
2.4 - 3.6
V
Note(*5)(*6)
Disable
-0.3 - 0.4
3D PWM
High Level
2.4 - 3.6 V Low Level
-0.3 - 0.4
D3D_PWM
VIN = 24V
3D ENA = On
56
%
F3D_PWM
120
Hz
3.3 The Condition & Specification of Converter Input (Ta = 25C ± 2 C)
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Note (1) All data was approved after running 120 minutes.
Note (2) Inrush is measured within BLU on 10ms after leaving the BLU as it is at least 1hr or more at room
temperature(25℃)
Note (3) Additional Appendix for Input current at room temperature(25℃)
ITEM
SYMBOL
CONDITION
SPECIFICATION
UNIT
NOTE
MIN
TYP
MAX
Input Current
(Normal Mode)
I overshoot, N
Vin=24V,
Dim=Max
-
3.09
3.18
A mean
Overshoot Current After Turn-on
I saturation, N
-
3.06
3.15
A mean
Saturation current after 1hr aging
Input Current
(3D Mode)
Iovershoot,3D
Vin=24V
3D PWM=56%
-
3.36
3.46
Amean
Overshoot Current After Turn-on
Isaturation,3D
-
3.33
3.43
Amean
Saturation current after 1hr aging
Iovershoot,3D
- - 7.46
Amax
Overshoot Current After Turn-on
Note (4) Internal PWM mode and External PWM mode are not available at the same time. In other word, if
one of the dimming control signal was input (connected), the other dimming control signal must be floating
(No Connection)
Note (5) duty=ton/ttotal Note(6) Signal rising/falling time
Note (7) Use an external frequency which doesn't make a waterfall and a sound noise within this range.
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4. Block diagram
HOT : Built in converter
4.1 TFT LCD MODULE
4.2 Back Light
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5. The Pin assignment in the input terminal
5.1 Input Signal & Power (Connector : IS100-L30O-C23 (UJU, In-PCB Type))
* Level of LVDS signals are base on LVDS CHARACTERISTICS(7-12)
Not Connected : This PINS are only used for SDC internal Operations
Bus release, I2C SCL and I2C SDA shouldn’t be communicated with I2C device whose output level is 5V.
Sequence: On = Vdd (T1) ≥LVDS Option ≥Interface Signal (T2) / Off = interface Signal (T3) ≥ LVDS Option ≥ Vdd
Note (1) Pin number, which starts from the left side.
a. Pins for power GND shall be connected to the LCD’s metal chassis.
b. All input pins for power shall be connected together.
c. All NC pins shall be designed with being separated from other signal or power.
Fig . The diagram of connector
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Input Connector Model No. : 22022WR-H14B2 (YEONHO) or Equivalent Connector
PIN NO
SYMBOL
REMARK
1,2,3,4,5
Vin
Power Supply DC 24V
6,7,8,9,10
GND
Ground
11
NC
No Connection
12
ENA
Converter On/Off Control Signal
13
INT_DIM
Internal Dimming Control Signal
No Connection (In case of using
EXT_DIM
#14)
14
EXT_DIM
External Dimming Control Signal
No Connection (In case of using
INT_DIM
#13)
INT_DIM mode and EXT_DIM mode are not available at same time. In other word, if one of the dimming control signal
was input (connected) the other dimming control signal must be floating. (No Connection)
5.2 Configuration of Input pin of Converter
5.3 The power sequence for inputting the Converter
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5.4 LVDS Interface ( LVDS Receiver : T-CON (merged) , Data Format(JEIDA Only )
LVDS Channel to Channel Skew (T-chskw) in Multiple LVDS Channels
Note: DE should be synchronized with DE per each LVDS Channel and T-chskw < 16 * LVDS Clock Period
LVDS Clock to Data Skew (T
RSRM
& T
) at each LVDS Channel
RSLM
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R03
RxOUT26RxOUT25RxOUT22
RxOUT24
RxOUT21RxOUT20RxOUT19
RxOUT18RxOUT15RxOUT13RxOUT14RxOUT12RxOUT9RxOUT8
RxOUT7RxOUT6RxOUT3RxOUT4RxOUT2RxOUT1RxOUT0
T
DEVsync B02Hsync B05 B03 B04
G04 B01 G05 B00 G03 G02 G01
G00 R04 R05 R02 R01 R00
TxCLK OUT
RxCK IN
Rx IN1
Rx IN0
Rx IN2
RxOUT23RxOUT17RxOUT11
RxOUT16
RxOUT10RxOUT5RxOUT27
T/7
B07 R06B06 G07 R07 G06
Rx IN3
RESERVED
SYMBOL
PARAMETER
MIN.
TPY.
MAX.
UNITS.
TCIT
TxCLK IN TRANSITION TIME (FIG2)
1.0-6.0
ns
TCIP
TxCLK IN PERIOD (FIG3)
11.76T50
ns
TCIH
TxCLK IN HIGH TIME (FIG3)
0.35T
0.5T
0.65T
ns
TCIL
TxCLK IN LOW TIME (FIG3)
0.35T
0.5T
0.65T
ns
TXIT
TxCLK TRANSITION TIME
1.5-6.0
ns
RECOMMENDED TRANSMITTER INPUT CHARACTERISTICS
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SYMBOL
PARAMETER
MIN.
TPY.
MAX.
UNITS.
LLHT
LVDS LOW TO HIGH TRANSITION TIME (FIG1)
-
0.75
1.5
ns
LHLT
LVDS HIGH TO LOW TRANSITION TIME (FIG1)
-
0.75
1.5
ns
TPPos0
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 0 (FIG 7)
NOTE 1
F = 40MHZ
-0.25 0 0.25
ns
TPPos1
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 1
3.32
3.57
3.82
ns
TPPos2
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 2
6.89
7.14
7.39
ns
TPPos3
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 3
10.46
10.71
10.96
ns
TPPos4
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 4
14.04
14.29
14.54
ns
TPPos5
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 5
17.61
17.86
18.11
ns
TPPos6
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 6
21.18
21.43
21.68
ns
TPPos0
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 0 (FIG 7)
NOTE 1
F = 65MHZ
-0.20 0 0.20
ns
TPPos1
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 1
2.00
2.20
2.40
ns
TPPos2
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 2
4.20
4.40
4.60
ns
TPPos3
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 3
6.39
6.59
6.79
ns
TPPos4
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 4
8.59
8.79
8.99
ns
TPPos5
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 5
10.79
10.99
11.19
ns
TPPos6
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 6
12.99
13.19
13.39
ns
TPPos0
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 0 (FIG 7)
NOTE 1
F = 85MHZ
-0.20 0 0.20
ns
TPPos1
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 1
1.48
1.68
1.88
ns
TPPos2
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 2
3.16
3.36
3.56
ns
TPPos3
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 3
4.84
5.04
5.24
ns
TPPos4
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 4
6.52
6.72
6.92
ns
TPPos5
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 5
8.20
8.40
8.60
ns
TPPos6
TRANSMITTER OUTPUT PULSE POSITION FOR BIT 6
9.88
10.08
10.28
ns
TSTC
TxIN SETUP TO TxCLK IN (FIG 3)
2.5 - -
ns
THTC
TxIN HOLD TO TxCLK IN (FIG 3)
0 - -
ns
TCCD
TxCLK IN TO TxCLK OUT DELAY (FIG4)
Ta = 25 ℃, Vcc = 3.3
V
3.8 - 6.3
ns
TxCLK IN TO TxCLK OUT DELAY (FIG4)
2.8 - 7.1
ns
TJCC
TRANSMITTER JITTER CYCLE TO CYCLE (FIG 8,9)
F=85 MHZ
-
110
150
ps
F=65 MHZ
-
210
230
ps
F=40 MHZ
-
350
370
ps
TPLLS
TRANSMITTER PHASE LOCK LOOP SET (FIG 5)
- - 10
ms
TPDD
TRANSMITTER POWER DOWN DELAY (FIG 6)
- - 100
ns
TRANSMITTER SWITCHING CHARACTERISTICS
-OVER RECOMMENDED OPERATING SUPPLY AND TEMPERATURE RANGES UNLESS OTHERWISE SPECIFIED.
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Note1) the minimum and maximum limits are based on statistical analysis of the device performance over
process, voltage, and temperature ranges. This parameter is functionality tested only on automatic test
equipment (ATE)
Note2) the limits are based on bench characterization of the device's jitter response over the power supply
voltage range. output clock jitter is measured with a cycle to cycle jitter of ± 3ns applied to the input clock
signal while data inputs are switching (fig8,9).A jitter event of 3 ns, represents worse case jump in the clock
edge from most graphics controller VGA Chips currently available. This parameter is used when calculating
system margin as described in AN-1059
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Symbol
Parameter
Condition
Min
Typ
Max
Unit
V
DIFF_LVDS
LVDS differential
input
V
CM_LVDS
=1.2V
100
600
mv
V
CM_LVDS
Input common level
VSSL
+0.6
1.2
VDDL
-0.6
V
I
DD_LVDS
Dynamic current
consumption
V
CM_LVDS
=1.2V
V
DIFF_LVDS
=200mV
F
CLK
=85MHz
Within One LOT
-10%
13
+10%
mA
Within Total LOT
-20%
13
+20%
I
DS_LVDS
Static current
consumption
Within One LOT
-10%
13
+1-%
Within Total LOT
-20%
13
+20%
Symbol
Parameter
Condition
Min
Typ
Max
Unit
V
DIFF_LVDS
LVDS differential input
V
CM_LVDS
=1.2V
100 600
mv
V
CM_LVDS
Input common level
VSSL
+0.6
1.2
VDDL
-0.6
V
F
CLK
55
75
85
MHz
T
SKEW_LVDS
CLOCK data skew margin
F
CLK
=85MHz
400
pS
6.3 Characteristics of Input data of LVDS
(1) DC Specification
(2) AC Specification
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BLU ON TIME
6.4 The sequence of power on and off
To prevent a latch-up phenomena or the DC operation of the LCD Module, the power on/off sequence should
be accorded with the settings described in the diagram below.
T1 : 0.5 msec<T1≤10msec
T2 : 10 msec<T2≤50msec
T3 : 0msec<T3≤50msec
T4 : 1000msec≤T4
T5: 1000msec≤T5 (BLU ON TIME : Converter ENA Signal(ON))
T6 : 100msec≤T6 (BLU OFF TIME : Converter ENA Signal(OFF))
T1 : The time, during which the level of VDD is rising from 10% to 90%.
T2 : The change for the time, during which the V
T3 : The change for the time, during which the valid data of signal started coming until the VDD started coming out.
T4 : The time, during which the V
T5 : The time, during which the valid data starts coming in until the power of B/L exceed 50%.
T6 : The time, during which the level of B/L’s power falls below 50% until the valid data of signal starts coming out.
The inputted V
DD
start coming out to restart the Windows.
DD
’s value for supply voltage, BLU, and signal to the external system of the module shall
start rising the level above 90% until the valid data of signal started coming in.
DD
be computed in observance of the former mentioned value.
The method to apply the voltage to the lamp within the range, which the LCD operates. When the back-
light is turned on before the LCD is operated or the power of LCD is turned off before the back-light is
turned off, the abnormal display on the screen may be shown momentarily.
Please keep the level of input signal low or keep the level of impedance high when the V
is off.
DD
The value shall be measured after the module has been fully discharged between the periods when the
power is on and off during the T4.
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Pin Number
Pin name
Remark
26
3D_EN
If Voltage Level of 3D_EN Signal is High(3.3V), 3D MODE operate.
5
3D_SYNC_O
This Pin is L/R Sync output signal of Shutter Glass
4,6
3D_Format 0
3D_Format 1
3D input format selection
FORMATI[1:0] : 2’b0x = Line interleave , 2’b10 = side/side,
2’b11 = top/bottom
Spec (ms)
Description
Min.
Typ
Max
T7
≥42 msec
-
-
Backlight should be on after 10 frame when 3D signal
input from SET
T8
≥30 msec
-
-
Backlight should be off after 7 frame when 3D signal
change to 2D signal from SET
T9
≥ 0
T10
≥ 0
- 3D Input Source Definitions
For the 3D operating of the Model, 3D drive Source of the 60Hz Frame sequential method must be input.
3D operating cannot support 3D drive Source of another Format.
3D Input Pin Definitions
- VNB 60++ 3D Timing
※ 1 frame (=4.17ms / 240Hz)
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7. Outline dimension
SAMSUNG Confidential
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8. Reliability test
Items to be evaluated
Condition for the evaluation
Quantity
Standard for evaluation
HTOL
50 ℃
4
60 ℃
8
LTOL
-5℃
4
THB
Evaluate the whole cell in the panel when examining the panel, which
is over 32" at 50℃ and 90 %RH.*
10
Margin on the operation of ASG at a
low temperature.
(Optional)
Check the temperature when the noise occurs under the conditions,
the max. frequency and between the -40℃ and 25℃.
Each cell
Applied to products with ASG
only.
Margin on the operation of ASG at a
high temperature. (Optional)
Examine the panel operated under the conditions, the min. frequency
and the 60℃ for 96hrs.
Each cell
Applied to products with ASG
only.
Residual image at a normal temp.
Repeat the exam. to examine the mosaic pattern(9"*10") of panel at
25 ℃ for 12hrs followed by the exam for the rolling pattern at 25 ℃
for 12hrs three times.
8
New decompression
Examine the panel, which is in the temp. range of -40℃ to
50℃ between the 0m(0ft) and 13,700m(45,000ft) for
72 and half hrs.
4
HTS
Store at the 70 ℃.
4
LTS
Store at the -25 ℃.
4
Residual image at the high
temperature
(optional)
Examine the mosaic pattern(9"*10") of DID at 50℃ for 336hrs.
8
Only for DID product
Evaluation for the panel on the pallet
Dropping(20cm)->Set the temp. and humidity(-30℃~60℃ /
40℃~90%RH)->Pressurizing-> Vibrating(Vibrate the panel within the
frequency range between 5hz and 200hz for 2hrs at the sine wave of
1.05 g.)->Dropping(20cm)
1 Pallet
Vibration
Vibrate the panel within the frequency range between 10hz and 300hz
for 10min at the sine wave at 1.5G
Vibrate the panel in the direction of X, Y, and Z axis for 30min.
3
Shock
If the screen size of panel is below 40", drop the panel with applying
the 50G one time toward the direction of ±X, Y, and Z axis from the
spot where the panel is placed respectively for 11mSDC. (±XYZ), If the
screen size is 46“, apply the 40G for ±X and Y axis or the 30G for ±Z.
If the screen size is over 52", apply the 30G.
3
TSS
Test the TV between the -20℃ and 65℃ 440 times. Test the DID
between the -20℃ and 65℃ 220 times.
4
WHTS
Store the module at 60 ℃ and 75 %RH.
4
TS
Execute the exam for TV at -20℃ for 30 min. and at 60℃ for 30min
100 times. / Execute the exam for the DID at -20℃ for 30 min. and at
60℃ for 30min 200 times.
4
Dust
Execute the test to observe the status of falling dust for 5 min. after
spraying the dust in the air for 5 SDC. at a normal temperature and
normal humidity for 5 hrs.
Turn the panel on and off at the interval of 10 min. Execute the test
for the DID for 10hrs.
2
SAMSUNG Confidential
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Twist
Examine the 52”-sized module by pushing the one point of panel by
10 degrees forward and backward with fixing other three points for
0.9s 500 times respectively., Examine the 46”-sized module by
pushing the one point of panel by 10 degrees forward and
backward with fixing other three points for 0.7s 500 times
respectively.
Examine the 40"-sized module by pushing the one point of panel
by 20 degrees forward and backward with fixing other three points
for 0.85s 250 times respectively., Examine the 32”-sized module by
pushing the one point of panel by 20 degrees forward and
backward with fixing other three points for 0.7s 250 times
respectively.
Examine the 26”-sized module by pushing the one point of panel by
20 degrees forward and backward with fixing other three points for
0.6s 250 times respectively.
4
Noise
Noise occurred when the frame of instrument is expanded as the
operating module emits the heat.: Max 50dB (Below the 10 times
when the level of sound is over 36dB.)
2
Noise
Noise from machine : Under the 23dB on average.
2
The new compound stress
Repeat the exam, which stresses the panel under the temp. range of 20℃ to 60℃ and the humidity range of 0%RH to 90%RH two times.
4
ESD
Shoot the ESD with the measuring gun,
which is operated at ±10 kV to the 210 points with contacting the
panel.
3
Shoot the ESD with the measuring gun, which is operated at
±20 kV to the 210 points without contacting the panel.
3
Input pin for inverter and converter (optional): Apply ±15kV three
times.
3
Only for the attached part of
inverter and converter.
[Criteria on evaluation]
The components of product, which may affect to the function of display shall not be changed when the
display quality test is executed under the normal operating condition.
* HTOL/ LTOL : The operating at the high and low temperature*
* THB : The slant of temperature and humidity
* HTS/ LTS : The storage at the high and low temperature
* WHTS : The storage condition at the high temperature with the high humidity
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No.
Item
Standard for control
1
Ionizer
All equipment shall be controlled under 150V.(Typ. 100V)
2
Carrying Roller
The roller for carrying shall be controlled under 200V.
3
Resistance for grounding of
equipment
All resistances for grounding of equipment shall be less than
1ohm.
9. General precautions
9.1 Handling
(a) When assembling, attach the panel kit and BLU kit to the system firmly by combining all mounting
holes. Be careful not to give any adverse effects to the panel kit and the BLU kit.
(b) Be careful not to give any adverse effects to the panel and BLU kit when designing the set.
(c) Be cautious not to give any strong, adverse shocks and/or any forces to the panel kit.
Applying any forces to the panel may cause the panel kit and the back-light kit to operate abnormally
or to be damaged.
(d) Refrain from applying any forces to the source PBA and the drive IC while handling or installing them
to the set. Any forces applied to the sets may cause damage or a malfunction to the panel kit.
(e) Refrain from applying any forces which causes a constant shock to the back side of panel kit, the set
design and BLU kit. Any forces applied to the products may cause an abnormal display, a functional
failure and etc.
(f) Note that polarizer could be damaged easily.
Do not press or scratch the bare surface with the material which is harder than a lead of HB pencil.
(g) Wipe off water droplets or oil immediately. If you leave the droplets on the product for a long time, a
staining or the discoloration may occur.
(h) If the surface of the polarizer is dirty, clean it using the absorbent cotton or the soft cloth.
(i) Desirable cleaners are water or IPA (Isopropyl Alcohol).
Do not use Kenton type materials (ex. Acetone), Ethyl alcohol, Toluene, Ethyl acid or Methyl chloride.
These solutions may cause the permanent damage to the polarizer by the chemical reaction.
(j) If the liquid crystal leaks from the panel, it is recommended to keep it away from the eyes or mouth.
If the user’s hands, legs, or clothes contacts with the liquid crystal, it is recommended to wash your
applied area with soap thoroughly and see a doctor for the medical examination.
(k) Protect the panel kit and a BLU Kit from the static electricity. Otherwise, the circuit IC could be
damaged.
- Reference: Process for controlling the standard of SDC
(l) Remove the stains with wearing finger-stalls on the top of soft gloves in order to keep the display
clean in the process of the incoming inspection and the assembly process.
(m) Do not pull or fold the source drive IC which connects to the source PBA and the panel or the gate
drive IC.
(n) Be cautious not to pull, fold or bend the source drive IC and the gate drive IC in any processes.
Being bent one time on the source drive IC is allowed while assembling the panel Kit and the BLU
Kit.
(o) Don't change a figure for the variable resistor located on the panel kit and BLU kit except when
inputting the changed figure for the flicker.
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- Make sure to peel the protection film off slowly.
(It is recommended to peel it off at the speed of more than 8SDC.
constantly.)
- The direction for peeling is shown at the left fig.
- Instruct the worker to follow the adequate instructions such as
wearing the antistatic wrist band.
- Maker sure the source PBA to be grounded while peeling the
protection film.
-The Ionized air should be injected while peeling.
- The protection film shall not be contacted to the source drive IC.
- If the adhesive marks are remained on the polarizer after peeling
the protection film off, it is recommended to remove marks with
isopropyl-alcohol liquid.
(p) Do not touch pins on the interface connector directly with bare hands.
(q) Be cautious the protection film not to be peeled off.
(r) Peel the protection film for the polarizer off on the panel kit slowly just before using it in order for the
effect by the electrostatic charge to be minimized.
(s) The panel kit and the BLU kit have circuits with a high frequency. The set manufacturers shall
suppress the EMI sufficiently.
(t) The set which the panel is assembled shall not be twisted. The twisted set may cause the damage.
(u) The S D-IC chip must be contacted with the top chassis.
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9.2 Storage
ITEM
Unit
Min.
Max.
Storage
Temperature
(℃)
5
40
Storage
Humidity
(%rH)
35
75
Storage life
12 months
Storage
Condition
- The storage room shall be equipped with a good ventilation facility, which has
a temperature controlling system.
- Products shall be placed on the pallet, which is away from the wall not on the floor.
- Prevent products from being exposed to the direct sunlight, moisture, and water.;
Be cautious not to pile the products up.
- Avoid storing products in the environment where other hazardous material is placed.
- If products are delivered or kept in the storage facility more than 3 months, we recommend
you to leave products under the condition including a 20℃ temperature and a humidity of
50% for 24 hours.
SAMSUNG Confidential
9.3 Operation
(1) Do not connect or disconnect the cable to the module at the "Power On" condition.
(2) The power shall be always turned on/off by the item 6.4. "Power on/off sequence"
(3) The module has a circuit with a high frequency. The electromagnetic interference shall be suppressed
by system manufacturers sufficiently. The method to ground and shield is important to minimize the
interference.
(4) Design the length of cable to connect between the connector for back-light and the inverter as short as
possible and the shorter cable shall be connected directly.
The cable between the back light connector and its converter power supply should be connected directly
with a minimized length. A longer cable between the back light and the converter may cause lower
luminance of LED package and may require higher startup voltage(Vs).
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9.4 Operation condition guide
(a) The LCD product shall be operated under normal conditions.
(b) If the product will be used under extreme conditions such as under the high temperature, humidity,
display patterns or the operation time etc.., it is strongly recommended to contact SDC for the advice
about the application of engineering. Otherwise, its reliability and the function may not be guaranteed.
Extreme conditions are commonly found at airports, transit stations, banks, stock markets, and controlling
systems.-
9.5 Others
(a) The ultra-violet ray filter is necessary for the outdoor operation.
(b) Avoid the condensation of water which may result in the improper operation of product or the
disconnection of electrode.
(c) Do not exceed the limit on the absolute maximum rating. (For example, the supply voltage variation, the
input voltage variation, the variation in content of parts and environmental temperature, and so on) If not,
the module may be damaged.
(d) If the module keeps displaying the same pattern for a long period of time, the image may be remained to
the screen. To avoid the image sticking, it is recommended to use a screen saver.
(e) This module has its circuitry of PCB's on the rear side and should be handled carefully in order for a force
not to be applied.
(f) Please contact the SDC in advance when the same pattern is displayed for a long time.
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