1. T/C 체결 후 Panel 후면 사양
(Source FPC,Thermal Pad, B/L Label (흰색) )
T/C 체결 후 C-SHIELD CASE 에 Thermal Pad 부착 유무를 확인한다.
2. Source FPC 끝단을 Control PCB의 Source FPC Connector부에
Connector 끝단까지 밀어 넣어 체결한다.
놓고
(덮개 끝단과 FPC 흰색 표시선이 수평을 이루게 하여
부분을 오른손 엄지 손가락으로 정확히 눌러 준다
덮개의 가운데
.)
3. FPC Cover(PET-TAPE)를 FPC 중앙 기준으로 양쪽 균형을 맞추어 부착한
다.
(FPC Cover가 들뜨지 않도록 B/L Bottom Chassis에 밀착 시킨다.)
FPC Cover는 C-PBA Cover의 각인에 맞추어 부착한다.
4. 각인에 맞추어 제품 라벨을 부착한다
Page 3
제목Signal Pin Map기안부서개발 3그룹기안자
배포일자2010년 9월 16일배포공정ALL적용 ModelLTA550HQ08-T
■ IT 단 82 pin 쪽 보드 연결 사양
[SIGNAL 51PIN MAP]
PinSymbolDescriptionPinSymbolDescription
112VDC power supply26Rx4[A]P4th, 8thLVDS Signal +
212VDC power supply27Rx4[B]N4th, 8thLVDS Signal 312VDC power supply28Rx4[B]P4th, 8thLVDS Signal +
412VDC power supply29Rx4[C]N4th, 8thLVDS Signal 512VDC power supply30Rx4[C]P4th, 8thLVDS Signal +
6GNDGround31GNDGround
7GNDGround32Rx4CLK-4th, 8thLVDS Clock 8GNDGround33Rx4CLK+4th, 8thLVDS Clock +
9GNDGround34GNDGround
10Rx2[A]N2nd, 6thLVDS Signal -35Rx4[D]N4th, 8thLVDS Signal 11Rx2[A]P2nd, 6thLVDS Signal +36Rx4[D]P4th, 8thLVDS Signal +
12Rx2[B]N2nd, 6thLVDS Signal -37Rx4[E]N4th, 8thLVDS Signal 13Rx2[B]P2nd, 6thLVDS Signal +38Rx4[E]P4th, 8thLVDS Signal +
14Rx2[C]N2nd, 6thLVDS Signal -39GNDGround
15Rx2[C]P2nd, 6thLVDS Signal +40SCLI2C SCL
16GNDGround41SDAI2C SDA
17Rx2CLK-2nd, 6thLVDS Clock -423D_Enable2D/3D selection Input
18Rx2CLK+2nd, 6thLVDS Clock +43B-INTBus release
19GNDGround44ACC SELACC On/Off
20Rx2[D]N2nd, 6thLVDS Signal -45LVDS SELJEIDA/Normal
21Rx2[D]P2nd, 6thLVDS Signal +46DCC SELDCC ON/OFF
22Rx2[E]N2nd, 6thLVDS Signal -47LUT SEL 0
23Rx2[E]P2nd, 6thLVDS Signal +48LUT SEL 1
24GNDGround49LUT SEL 2
25Rx4[A]N4th, 8thLVDS Signal -50SEL0