Samsung K4S281632D-TL75, K4S281632D-TL55, K4S281632D-TL1L, K4S281632D-TL1H, K4S281632D-TC7C Datasheet
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CMOS SDRAM
K4S281632D
Rev. 0.1 Sept. 2001
128Mbit SDRAM
2M x 16Bit x 4 Banks
Synchronous DRAM
LVTTL
* Samsung Electronics reserves the right to change products or specification without notice.
Rev. 0.1
Sept. 2001
CMOS SDRAM
K4S281632D
Rev. 0.1 Sept. 2001
Revision History
Revision 0.0 (Mar. 06, 2001)
Revision 0.1 (Sep. 06, 2001)
• Redefined IDD1 & IDD4 in DC Characteristics
• Changed the Notes in Operating AC Parameter.
< Before >
5. For 1H/1L, tRDL=1CLK and tDAL=1CLK+tRP is also supported .
SAMSUNG recommends tRDL=2CLK and tDAL=2CLK + tRP.
< After >
5.In 100MHz and below 100MHz operating conditions, tRDL=1CLK and tDAL=1CLK + 20ns is also supported.
SAMSUNG recommends tRDL=2CLK and tDAL=2CLK + tRP.
CMOS SDRAM
K4S281632D
Rev. 0.1 Sept. 2001
The K4S281632D is 134,217,728 bits synchronous high data
rate Dynamic RAM organized as 4 x 2,097,152 words by 16
bits, fabricated with SAMSUNG′s high performance CMOS
technology. Synchronous design allows precise cycle control
with the use of system clock I/O transactions are possible on
every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same
device to be useful for a variety of high bandwidth, high performance memory system applications.
• JEDEC standard 3.3V power supply
• LVTTL compatible with multiplexed address
• Four banks operation
• MRS cycle with address key programs
-. CAS latency (2 & 3)
-. Burst length (1, 2, 4, 8 & Full page)
-. Burst type (Sequential & Interleave)
• All inputs are sampled at the positive going edge of the system
clock.
• Burst read single-bit write operation
• DQM for masking
• Auto & self refresh
• 64ms refresh period (4K cycle)
GENERAL DESCRIPTIONFEATURES
FUNCTIONAL BLOCK DIAGRAM
2M x 16Bit x 4 Banks Synchronous DRAM
Bank Select
Data Input Register
2M x 16
2M x 16
Sense AMP
Output BufferI/O Control
Column Decoder
Latency & Burst Length
Programming Register
Address Register
Row Buffer
Refresh Counter
Row Decoder Col. Buffer
LRAS
LCBR
LCKE
LRAS LCBR LWE LDQM
CLK CKE CS RAS CAS WE LDQM
LWE
LDQM
DQi
CLK
ADD
LCAS LWCBR
2M x 16
2M x 16
Timing Register
UDQM
* Samsung Electronics reserves the right to change products or specification without notice.
ORDERING INFORMATION
Part No. Max Freq. Interface Package
K4S281632D-TC/L55 183MHz(CL=3)
LVTTL
54
TSOP(II)
K4S281632D-TC/L60 166MHz(CL=3)
K4S281632D-TC/L7C 133MHz(CL=2)
K4S281632D-TC/L75 133MHz(CL=3)
K4S281632D-TC/L1H 100MHz(CL=2)
K4S281632D-TC/L1L 100MHz(CL=3)
CMOS SDRAM
K4S281632D
Rev. 0.1 Sept. 2001
VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
DQ5
DQ6
VSSQ
DQ7
VDD
LDQM
WE
CAS
RAS
CS
BA0
BA1
A10/AP
A0
A1
A2
A3
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
PIN CONFIGURATION (Top view)
VSS
DQ15
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VDDQ
DQ8
VSS
N.C/RFU
UDQM
CLK
CKE
N.C
A11
A9
A8
A7
A6
A5
A4
VSS
54Pin TSOP (II)
(400mil x 875mil)
(0.8 mm Pin pitch)
PIN FUNCTION DESCRIPTION
Pin Name Input Function
CLK System clock Active on the positive going edge to sample all inputs.
CS Chip select
Disables or enables device operation by masking or enabling all inputs except
CLK, CKE and DQM
CKE Clock enable
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
A0 ~ A11 Address
Row/column addresses are multiplexed on the same pins.
Row address : RA0 ~ RA11, Column address : CA0 ~ CA8
BA0 ~ BA1 Bank select address
Selects bank to be activated during row address latch time.
Selects bank for read/write during column address latch time.
RAS Row address strobe
Latches row addresses on the positive going edge of the CLK with RAS low.
Enables row access & precharge.
CAS Column address strobe
Latches column addresses on the positive going edge of the CLK with CAS low.
Enables column access.
WE Write enable
Enables write operation and row precharge.
Latches data in starting from CAS, WE active.
L(U)DQM Data input/output mask
Makes data output Hi-Z, tSHZ after the clock and masks the output.
Blocks data input when L(U)DQM active.
DQ0 ~ 15 Data input/output Data inputs/outputs are multiplexed on the same pins.
VDD/VSS Power supply/ground Power and ground for the input buffers and the core logic.
VDDQ/VSSQ Data output power/ground
Isolated power supply and ground for the output buffers to provide improved noise
immunity.
N.C/RFU
No connection
/reserved for future use
This pin is recommended to be left No Connection on the device.