October 2009
General Information DDR3 SDRAM
DDR3 SDRAM Product Guide
October 2009
Memory Division
October 2009
General Information DDR3 SDRAM
1. DDR3 SDRAM Component Ordering Information
51 : 512Mb
1G : 1Gb
2G : 2Gb
4G : 4Gb
04 : x 4
08 : x 8
16 : x16
3 : 4 Banks
4 : 8 Banks
5 : 16 Banks
3. DRAM Type
4. Density
5. Bit Organization
6. # of Internal Banks
M
A
B
C
D
E
F
G
H
Z
H
J
M
C
L
Y
9. Package Type
8. Revision
10. Temp & Power
1. SAMSUNG Memory : K
2. DRAM : 4
Revision
# of Internal Banks
Bit Organization
Density
DRAM Type
DRAM
SAMSUNG Memory
Interface (V
DD, VDDQ)
Package Type
Temp & Power
1 2 3 4 5 6 7 8 9 10 11
Speed
B : DDR3 SDRAM
: Commercial Temp.( 0°C ~ 85°C) & Normal Power
: Commercial Temp.( 0°C ~ 85°C) & Low Power
: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
: FBGA (Lead-free)
: FBGA (Halogen-free & Lead-free)
: FBGA (Lead-free, DDP)
: FBGA (Halogen-free & Lead-free, DDP)
: 1st Gen.
: 2nd Gen.
: 3rd Gen.
: 4th Gen.
: 5th Gen.
: 6th Gen.
: 7th Gen
: 8th Gen
: 9th Gen
11. Speed
K 4 B X X X X X X X - X X X X
: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
F7
F8
H9
K0
6 : SSTL (1.5V, 1.5V)
7. Interface ( V
DD, VDDQ)
October 2009
General Information DDR3 SDRAM
2. DDR3 SDRAM Component Product Guide
* Note : 1.35V product is 1.5V operatable.
Density Banks Part Number
Package & Power,
Tem p.
(-C/-L) & Speed
Org. VDD Voltage PKG Avail. Note
1Gb D-die 8Banks
K4B1G0446D HC(L)F7/F8/H9 256M x 4
1.5V
78 + 4 ball
FBGA
Now
K4B1G0846D HC(L)F7/F8/H9 128M x 8
K4B1G1646D HC(L)F7/F8/H9 64M x 16
96 + 4 ball
FBGA
1Gb E-die 8Banks
K4B1G0446E HC(L)F7/F8/H9/K0 256M x 4
1.5V
78 ball
FBGA
Now
K4B1G0846E HC(L)F7/F8/H9/K0 128M x 8
K4B1G1646E HC(L)F7/F8/H9/K0 64M x 16
96 ball
FBGA
K4B1G0446E HYF7/F8/H9/K0 256M x 4
1.35V
78 ball
FBGA
K4B1G0846E HYF7/F8/H9/K0 128M x 8
1Gb F-die 8Banks
K4B1G0446F HC(L)F8/H9 256M x 4
1.5V
78 ball
FBGA
Now
K4B1G0846F HC(L)F8/H9 128M x 8
K4B1G0446F HY(L)F8/H9 256M x 4
1.35V
K4B1G0846F HY(L)F8/H9 128M x 8
2Gb B-die 8Banks
K4B2G0446B HC(L)F7/F8/H9 512M x 4
1.5V
78 ball
FBGA
Now
K4B2G0846B HC(L)F7/F8/H9 256M x 8
K4B2G1646B HC(L)F7/F8/H9 128M x 16
96 ball
FBGA
K4B2G0446B HYF7/F8/H9 512M x 4
1.35V
78 ball
FBGA
K4B2G0846B HYF7/F8/H9 256M x 8
2Gb C-die 8Banks
K4B2G0446C HC(L)F8/H9 512M x 4
1.5V
78 ball
FBGA
Now
K4B2G0846C HC(L)F8/H9 256M x 8
K4B2G0446C HY(L)F8/H9 512M x 4
1.35V
K4B2G0846C HY(L)F8/H9 256M x 8
DDP 2Gb D-die 8Banks
K4B2G0446D MC(L)F7/F8/H9 512M x 4
1.5V
78 ball
FBGA
Now
K4B2G0846D MC(L)F7/F8/H9 256M x 8
DDP 2Gb E-die 8Banks
K4B2G0446E MC(L)F7/F8/H9 512M x 4
1.5V
78 ball
FBGA
Now
K4B2G0846E MC(L)F7/F8/H9 256M x 8
DDP 4Gb B-die 8Banks
K4B4G0446B MC(L)F7/F8/H9 1G x 4
1.5V
78 ball
FBGA
Now
K4B2G0846B MC(L)F7/F8/H9 512M x 8
October 2009
General Information DDR3 SDRAM
3 : DIMM
4 : SODIMM
Z FBGA(Lead-free)
H FBGA(Lead-free & Halogen-free)
J FBGA(Lead-free, DDP)
M FBGA(Lead-free & Halogen-free, DDP)
32
: 32M 33 : 32M (for 128Mb/512Mb)
64 : 64M 65 : 64M (for 128Mb/512Mb)
28 : 128M 29 : 128M (for 128Mb/512Mb)
56 : 256M 57 : 256M (for 512Mb/2Gb)
51 : 512M 52 : 512M (for 512Mb/2Gb)
1G : 1G 1K : 1G (for 2Gb)
2G : 2G 2K : 2G (for 2Gb)
M 1st Gen. A 2nd Gen.
B 3rd Gen. C 4th Gen.
D 5th Gen. E 6th Gen.
F : 7th Gen. G 8th Gen.
0 : None
2 : 2nd Rev.
4 : 4th Rev.
B : DDR3 SDRAM (1.5V VDD)
1. Memory Module : M
2. DIMM Type
3. Data Bits
4. DRAM Component Type
5. Depth
12. Speed
11. Temp & Power
10. PCB Revision
9. Package
8. Component Revision
7 : 8Banks & SSTL-1.5V
6. # of Banks in comp. & Interface
3. DDR3 SDRAM Module Ordering Information
:
:
:
:
:
:
:
:
:
:
:
1 : 1st Rev.
3 : 3rd Rev.
S : Reduced Layer
C Y: Commercial Temp.( 0°C ~ 85°C) & Normal Power
: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
Note: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
PCB Revision
Component Revision
# of Banks in Comp. & Interface
Depth
DRAM Component Type
Data bits
DIMM Type
Memory Module
Package
Temp & Power
Speed
M X X X B X X X X X X X - X X X
1 2 3 4 5 6 7 8 9 10 11 12
Bit Organization
0 : x 4
3 : x 8
4 : x16
7. Bit Organization
: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
F7
F8
H9
K0
71
: x64 204pin Unbuffered SODIMM
78 : x64 240pin Unbuffered DIMM
91 : x72 240pin ECC unbuffered DIMM
92 : x72 240pin VLP Registered DIMM
93 : x72 240pin Registered DIMM
October 2009
General Information DDR3 SDRAM
4. DDR3 SDRAM Module Product Guide
4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)
240Pin DDR3 Unbuffered DIMM
Org. Density Part Number Speed Raw Card Composition
Comp.
Version
Internal
Banks
Rank PKG Height Avail. Note
128Mx 64 1GB
M378B2873DZ1 CF8/H9
A(1Rx8)
128M x 8 * 8 pcs 1Gb D-die
81
78 + 4 ball
FBGA
30mm Now
M378B2873EH1 CF8/H9/K0 128M x 8 * 8 pcs 1Gb E-die
78 ball
FBGA
M378B2873FHS CF8/H9 128M x 8 * 8 pcs 1Gb F-die
128Mx 72 1GB
M391B2873DZ1 CF8/H9
D(1Rx8)
128M x 8 * 9 pcs 1Gb D-die
81
78 + 4 ball
FBGA
30mm Now
M391B2873EH1 CF8/H9/K0 128M x 8 * 9 pcs 1Gb E-die
78 ball
FBGA
M391B2873FH0 CF8/H9/K0 128M x 8 * 9 pcs 1Gb F-die
256Mx 64 2GB
M378B5673DZ1 CF8/H9
B(2Rx8)
128M x 8 * 16 pcs 1Gb D-die
82
78 + 4 ball
FBGA
30mm Now
M378B5673EH1 CF8/H9/K0 128M x 8 * 16 pcs 1Gb E-die
78 ball
FBGA
M378B5673FH0 CF8/H9/K0 128M x 8 * 16 pcs 1Gb F-die
M378B5773CHS CF8/H9/K0 A(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1
256Mx 72 2GB
M391B5673DZ1 CF8/H9
E(2Rx8)
128M x 8 * 18 pcs 1Gb D-die
8
2
78 + 4 ball
FBGA
30mm Now
M391B5673EH1 CF8/H9/K0 128M x 8 * 18 pcs 1Gb E-die
78 ball
FBGA
M391B5673FH0 CF8/H9/K0 128M x 8 * 18 pcs 1Gb F-die
M391B5773CH0 CF8/H9/K0 D(1Rx8) 256M x 8 * 9 pcs 2Gb C-die 1
512Mx 64 4GB
M378B5273BH1 CF8/H9
B(2Rx8)
256M x 8 * 16 pcs 2Gb B-die
82
78 ball
FBGA
30mm Now
M378B5273CH0 CF8/H9/K0 256M x 8 * 16 pcs 2Gb C-die
512Mx 72 4GB
M391B5273BH1 CF8/H9
E(2Rx8)
256M x 8 * 18 pcs 2Gb B-die
82
78 ball
FBGA
30mm Now
M391B5273CH0 CF8/H9/K0 256M x 8 * 18 pcs 2Gb C-die
4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)
* Note : 1.35V product is 1.5V operatable.
240Pin DDR3 Unbuffered DIMM
Org. Density Part Number Speed Raw Card Composition
Comp.
Version
Internal
Banks
Rank PKG Height Avail. Note
128Mx 72 1GB
M391B2873EH1 YF8/H9
D(1Rx8)
128M x 8 * 9 pcs 1Gb E-die
81
78 ball
FBGA
30mm Now
M391B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die
256Mx 72 2GB
M391B5673EH1 YF8/H9
E(2Rx8)
128M x 8 * 18 pcs 1Gb E-die
82
78 ball
FBGA
30mm NowM391B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die
M391B5773CH0 YF8/H9 D(1Rx8) 256M x 8 * 9 pcs 2Gb C-die 8 1
512Mx 72 4GB
M391B5273BH1 YF8/H9
E(2Rx8)
256M x 8 * 18 pcs 2Gb B-die
82
78 ball
FBGA
30mm Now
M391B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die
October 2009
General Information DDR3 SDRAM
4.3 204Pin DDR3 SoDIMM (1.5V Product)
204Pin DDR3 SODIMM
Org. Density Part Number Speed Raw Card Composition
Comp.
Vers ion
Internal
Banks
Rank PKG Height Avail. Note
128Mx 64 1GB
M471B2874DZ1 CF8/H9 A(2Rx16) 64M x 16 * 8 pcs 1Gb D-die 8 2
96 + 4 ball
FBGA
30mm Now
M471B2873EH1 CF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb E-die 8 1
78 ball
FBGA
M471B2874EH1 CF8/H9 A(2Rx16) 64M x 16 * 8 pcs 1Gb E-die 8 2 96 ball
M471B2873FHS CF8/H9 B(1Rx8) 64M x 16 * 8 pcs 1Gb F-die 8 1
78 ball
FBGA
256Mx 64 2GB
M471B5673DZ1 CF8/H9
F(2Rx8)
128M x 8 * 16 pcs 1Gb D-die
82
78 + 4 ball
FBGA
30mm Now
M471B5673EH1 CF8/H9 128M x 8 * 16 pcs 1Gb E-die
78 ball
FBGA
M471B5673FH0 CF8/H9 128M x 8 * 16 pcs 1Gb F-die
M471B5773CHS CF8/H9 B(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1
512Mx 64 4GB
M471B5273BH1 CF8/H9
F(2Rx8)
256M x 8 * 16 pcs 2Gb B-die
82
78 ball
FBGA
30mm Now
M471B5273CH0 CF8/H9 256M x 8 * 16 pcs 2Gb C-die
4.4 204Pin DDR3 SoDIMM (1.35V Product)
* Note : 1.35V product is 1.5V operatable.
204Pin DDR3 SODIMM
Org. Density Part Number Speed Raw Card Composition
Comp.
Vers ion
Internal
Banks
Rank PKG Height Avail. Note
128Mx 64 1GB
M471B2873EH1 YF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb E-die 8 1
78 ball
FBGA
30mm NowM471B2874EH1 YF8/H9 A(1Rx16) 64M x 16 * 8 pcs 1Gb E-die 8 2 96 ball
M471B2873FHS YF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb F-die 8 1
78 ball
FBGA
256Mx 64 2GB
M471B5673EH1 YF8/H9
F(2Rx8)
128M x 8 * 16 pcs 1Gb E-die
82
78 ball
FBGA
30mm NowM471B5673FH0 YF8/H9 128M x 8 * 16 pcs 1Gb F-die
M471B5773CHS YF8/H9 B(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1
512Mx 64 4GB
M471B5273BH1 YF8/H9
F(2Rx8)
256M x 8 * 16 pcs 2Gb B-die
82
78 ball
FBGA
30mm Now
M471B5273CH0 YF8/H9 256M x 8 * 16 pcs 2Gb C-die
October 2009
General Information DDR3 SDRAM
4.5 240Pin DDR3 Registered DIMM (1.5V Product)
240Pin DDR3 Registered DIMM
Org. Density Part Number Sp eed Raw Card Composition
Comp.
Ver sion
Internal
Banks
Rank PKG Height Avai l. Note
128Mx 72 1GB
M393B2873DZ1 CF8/H9
A(1Rx8)
128M x 8 * 9 pcs 1Gb D-die
81
78 + 4 ball
FBGA
30mm Now
M393B2873EH1 CF8/H9 128M x 8 * 9 pcs 1Gb E-die
78 ball
FBGA
M393B2873FH0 CF8/H9 128M x 8 * 9 pcs 1Gb F-die
256Mx 72 2GB
M393B5673DZ1 CF8/H9
B(2Rx8)
128M x 8 * 18 pcs 1Gb D-die
8
2
78 + 4 ball
FBGA
30mm Now
M393B5673EH1 CF8/H9 128M x 8 * 18 pcs 1Gb E-die
2
78 ball
FBGA
M393B5673FH0 CF8/H9 128M x 8 * 18 pcs 1Gb F-die
M393B5670DZ1 CF8/H9
C(1Rx4)
256M x 4 * 18 pcs 1Gb D-die 1
78 + 4 ball
FBGA
M393B5670EH1 CF8/H9 256M x 4 * 18 pcs 1Gb E-die
1
78 ball
FBGA
M393B5670FH0 CF8/H9 256M x 4 * 18 pcs 1Gb F-die
512Mx 72 4GB
M393B5173DZ1 CF7/F8
H(4Rx8)
128M x 8 * 36 pcs 1Gb D-die
8
4
78 + 4 ball
FBGA
30mm Now
M393B5173EH1 CF7/F8 128M x 8 * 36 pcs 1Gb E-die
4
78 ball
FBGA
M393B5173FH0 CF7/F8 128M x 8 * 36 pcs 1Gb F-die
M393B5170DZ1 CF8/H9
E(2Rx4)
256M x 4 * 36 pcs 1Gb D-die 2
78 + 4 ball
FBGA
M393B5170EH1 CF8/H9 256M x 4 * 36 pcs 1Gb E-die
2
78 ball
FBGA
M393B5170FH0 CF8/H9 256M x 4 * 36 pcs 1Gb F-die
M393B5273BH1 CF8/H9
B(2Rx8)
256M x 8 * 18 pcs 2Gb B-die
2
M393B5273CH0 CF8/H9 256M x 8 * 18 pcs 2Gb C-die
M393B5270BH1 CF8/H9
C(1Rx4)
512M x 4 * 18 pcs 2Gb B-die
1
M393B5270CH0 CF8/H9 512M x 4 * 18 pcs 2Gb C-die
1Gx 72 8GB
M393B1G70DJ1 CF7/F8
F(4Rx4)
DDP
512M
x 4 * 36 pcs 1Gb D-die
8
4
78 ball
FBGA
30mm Now
M393B1G70EM1 CF7/F8
DDP
512M
x 4 * 36 pcs 1Gb E-die
M393B1K73BH1 CF7/F8
H(4Rx8)
256M x 8 * 36 pcs 2Gb B-die
4
M393B1K73CH0 CF7/F8 256M x 8 * 36 pcs 2Gb C-die
M393B1K70BH1 CF8/H9
E(2Rx4)
512M x 4 * 36 pcs 2Gb B-die
2
M393B1K70CH0 CF8/H9 512M x 4 * 36 pcs 2Gb C-die
2Gx 72 16GB
M393B2K70BM1 CF7/F8
F(4Rx4)
DDP
1G
x 4 * 36 pcs 2Gb B-die
84
78 ball
FBGA
30mm Now
M393B2K70CM0 CF7/F8
DDP
1G
x 4 * 36 pcs 2Gb C-die
October 2009
General Information DDR3 SDRAM
4.6 240Pin DDR3 Registered DIMM (1.35V Product)
* Note : 1.35V product is 1.5V operatable.
240Pin DDR3 Registered DIMM
Org. Density Part Number Sp eed Raw Card Composition
Comp.
Vers ion
Internal
Banks
Rank PKG Height Avail. Note
128Mx 72 1GB
M393B2873EH1 YF8/H9
A(1Rx8)
128M x 8 * 9 pcs 1Gb E-die
81
78 ball
FBGA
30mm Now
M393B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die
256Mx 72 2GB
M393B5673EH1 YF8/H9
B(2Rx8)
128M x 8 * 18 pcs 1Gb E-die
82
78 ball
FBGA
30mm Now
M393B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die
M393B5670EH1 YF8/H9
C(1Rx4)
256M x 4 * 18 pcs 1Gb E-die
81M393B5670FH0 YF8/H9 256M x 4 * 18 pcs 1Gb F-die
M393B5773CH0 YF8/H9 A(1Rx8) 512M x 4 * 9 pcs 2Gb C-die
512Mx 72 4GB
M393B5173EH1 YF7/F8
H(4Rx8)
128M x 8 * 36 pcs 1Gb E-die
84
78 ball
FBGA
30mm Now
M393B5173FH0 YF7/F8 128M x 8 * 36 pcs 1Gb F-die
M393B5170EH1 YF8/H9
E(2Rx4)
256M x 4 * 36 pcs 1Gb E-die
82
M393B5170FH0 YF8/H9 256M x 4 * 36 pcs 1Gb F-die
M393B5273BH1 YF8/H9
B(2Rx8)
256M x 8 * 18 pcs 2Gb B-die
82
M393B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die
M393B5270BH1 YF8/H9
C(1Rx4)
512M x 4 * 18 pcs 2Gb B-die
81
M393B5270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die
1Gx 72 8GB
M393B1G70EM1 YF7/F8
F(4Rx4)
DDP
512M
x 4 * 36 pcs 1Gb E-die
84
78 ball
FBGA
30mm
Now
M393B1G70FM0 YF7/F8
DDP
512M
x 4 * 36 pcs 1Gb F-die Nov. ’09
M393B1K73BH1 YF7/F8
H(4Rx8)
256M x 8 * 36 pcs 2Gb B-die
84
Now
M393B1K73CH0 YF7/F8 256M x 8 * 36 pcs 2Gb C-die
M393B1K70BH1 YF8/H9
E(2Rx4)
512M x 4 * 36 pcs 2Gb B-die
82
M393B1K70CH0 YF8/H9 512M x 4 * 36 pcs 2Gb C-die
2Gx 72 16GB
M393B2K70BM1 YF7/F8
F(4Rx4)
DDP
1G
x 4 * 36 pcs 2Gb B-die
84
78 ball
FBGA
30mm
Now
M393B2K70CM0 YF7/F8
DDP
1G
x 4 * 36 pcs 2Gb C-die Nov. ’09
October 2009
General Information DDR3 SDRAM
4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product)
240Pin DDR3 VLP Registered DIMM
Org. Density Part Number Speed Raw Card Composition
Comp.
Version
Internal
Banks
Rank PKG Height Avail. Note
128Mx 72 1GB
M392B2873DZ1 CF8/H9
K(1Rx8)
128M x 8 * 9 pcs 1Gb D-die
81
78 + 4 ball
FBGA
18.75mm Now
M392B2873EH1 CF8/H9 128M x 8 * 9 pcs 1Gb E-die
78 ball
FBGA
M392B2873FH0 CF8/H9 128M x 8 * 9 pcs 1Gb F-die
256Mx 72 2GB
M392B5673DZ1 CF8/H9
L(2Rx8)
128M x 8 * 18 pcs 1Gb D-die
8
2
78 + 4 ball
FBGA
18.75mm Now
M392B5673EH1 CF8/H9 128M x 8 * 18 pcs 1Gb E-die
78 ball
FBGA
M392B5673FH0 CF8/H9 128M x 8 * 18 pcs 1Gb F-die
M392B5670DZ1 CF8/H9
M(1Rx4)
256M x 4 * 18 pcs 1Gb D-die
1
78 + 4 ball
FBGA
M392B5670EH1 CF8/H9 256M x 4 * 18 pcs 1Gb E-die
78 ball
FBGA
M392B5670FH0 CF8/H9 256M x 4 * 18 pcs 1Gb F-die
M392B5773CH0 CF8/H9 K(1Rx8) 128M x 8 * 9 pcs 1Gb F-die 1
78 ball
FBGA
512Mx 72 4GB
M392B5170DJ1 CF8/H9
N(2Rx4)
DDP
512M
x 4 * 18 pcs 1Gb D-die
8
2
78 ball
FBGA
18.75mm
Now
M392B5170EM1 CF8/H9
DDP
512M
x 4 * 18 pcs 1Gb E-die
M392B5170FM0 CF8/H9
DDP
512M
x 4 * 18 pcs 1Gb F-die
Dec. ’09
M392B5173FM0 CF7/F8 V(4Rx8)
DDP
256M
x 8 * 18 pcs 1Gb F-die 4
M392B5273BH1 CF8/H9
L(2Rx8)
256M x 8 * 18 pcs 2Gb B-die
2
Now
M392B5273CH0 CF8/H9 256M x 8 * 18 pcs 2Gb C-die
M392B5270BH1 CF8/H9
M(1Rx4)
512M x 4 * 18 pcs 2Gb B-die
1
M392B5270CH0 CF8/H9 512M x 4 * 18 pcs 2Gb C-die
1Gx 72 8GB
M392B1K73BM1 CF7/F8
V(4Rx8)
DDP
512M
x 8 * 18 pcs 2Gb B-die
8
4
78 ball
FBGA
18.75mm Now
M392B1K73CM0 CF7/F8
DDP
512M
x 8 * 18 pcs 2Gb C-die
M392B1K70BM1 CF8/H9
N(2Rx4)
DDP
1G
x 4 * 18 pcs 2Gb B-die
2
M392B1K70CM0 CF8/H9
DDP
1G
x 4 * 18 pcs 2Gb C-die
October 2009
General Information DDR3 SDRAM
4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product)
* Note : 1.35V product is 1.5V operatable.
240Pin DDR3 VLP Registered DIMM
Org. Density Part Number Speed Raw Card Composition
Comp.
Vers ion
Internal
Banks
Rank PKG Height Avail. Note
128Mx 72 1GB
M392B2873EH1 YF8/H9
K(1Rx8)
128M x 8 * 9 pcs 1Gb E-die
81
78 ball
FBGA
18.75mm Now
M392B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die
256Mx 72 2GB
M392B5673EH1 YF8/H9
L(2Rx8)
128M x 8 * 18 pcs 1Gb E-die
82
78 ball
FBGA
18.75mm Now
M392B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die
M392B5670EH1 YF8/H9
M(1Rx4)
256M x 4 * 18 pcs 1Gb E-die
81M392B5670FH0 YF8/H9 256M x 4 * 18 pcs 1Gb F-die
M392B5773CH0 YF8/H9 K(1Rx8) 512M x 4 * 9 pcs 2Gb C-die
512Mx 72 4GB
M392B5170EM1 YF8/H9 N(2Rx4)
DDP
512M
x 4 * 18 pcs 1Gb E-die 8 2
78 ball
FBGA
18.75mm
Now
M392B5173FM0 YF7/F8 V(4Rx8) 256M x 8 * 18 pcs 1Gb F-die 8 4
Dec. ’09
M392B5170FM0 YF8/H9 N(2Rx4) 512M x 4 * 18 pcs 1Gb F-die
82M392B5273BH1 YF8/H9
L(2Rx8)
256M x 8 * 18 pcs 2Gb B-die
Now
M392B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die
M392B5270BH1 YF8/H9
M(1Rx4)
512M x 4 * 18 pcs 2Gb B-die
81
M392B5270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die
1Gx 72 8GB
M392B1K73BM1 YF7/F8
V(4Rx8)
DDP
512M
x 8 * 18 pcs 2Gb B-die
84
78 ball
FBGA
18.75mm
Now
M392B1K73CM0 YF7/F8
DDP
512M
x 8 * 18 pcs 2Gb C-die Nov. ’09
M392B1K70BM1 YF8/H9
N(2Rx4)
DDP
1G
x 4 * 18 pcs 2Gb B-die
82
Now
M392B1K70CM0 YF8/H9
DDP
1G
x 4 * 18 pcs 2Gb C-die Nov. ’09
October 2009
General Information DDR3 SDRAM
4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0
Made in Korea
M393B5170EH1-CH9
0920
5. RDIMM RCD Information
5.1 RCD Identification in JEDEC Description in Module Label
5.2 Label Example
5.3 RCD Information
- Example
Vol tag e Vendor Revision Module P/N JEDEC Description On Label
1.5V
Inphi GS04 B2 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-P0
IDT LV DDR3 B0 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-D2
1.35V
Inphi LV GS02 C0 M393B5170EH1-YF8 4GB 2Rx4 PC3L-8500R-07-10-E1-P1
IDT LV DDR3 B0 M393B5170EH1-YF8 4GB 2Rx4 PC3L-8500R-07-10-E1-D2
October 2009
General Information DDR3 SDRAM
78 + 4Ball FBGA for 1Gb D-die (x4/x8)
96 + 4Ball FBGA for 1Gb D-die (x16)
A
B
C
D
E
F
G
H
M
N
9.00 ± 0.10
0.80 x 12 = 9.60
0.80 x 10 = 8.00
4.000.80
4.80
82 - ∅0.45 Solder ball
0.2 ABM
(Datum B)
(Datum A)
10 8765432111 9
1.60
MOLDING AREA
#A1 INDEX MARK
B
A
11.0 0 ± 0.10
J
K
L
0.80
0.80
(Post Reflow ∅0.05 ± 0.05)
(0.95)
(1.90)
Bottom
Top
Bottom
Top
#A1
9.00 ± 0.10
11.0 0 ± 0.10
0.10MAX
0.50 ± 0.05
1.10 ± 0.10
0.35 ± 0.05
A
B
C
D
E
F
G
H
J
L
M
N
P
R
T
9.00 ± 0.10
4.000.80
6.00
(Datum B)
(Datum A)
10 8765432111 9
1.60
#A1 INDEX MARK
13.30 ± 0.10
K
0.80 x 15 = 12.00
0.80 x 10 = 8.00
B
A
0.80
0.40
100 - ∅0.45 Solder ball
0.2 ABM
MOLDING AREA
(Post Reflow ∅0.05 ± 0.05)
(0.95)
(1.90)
#A1
9.00 ± 0.10
13.30 ± 0.10
0.10MAX
0.50 ± 0.05
1.10 ± 0.10
0.35 ± 0.05
: Support Ball
: Support Ball
October 2009
General Information DDR3 SDRAM
78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8)
96Ball FBGA for 1Gb E-die (x16)
A
B
C
D
E
F
G
H
M
N
7.50 ± 0.10
0.80 x 12 = 9.60
0.80 x 8 = 6.40
3.200.80
4.80
78 - ∅0.45 Solder ball
0.2 ABM
(Datum B)
(Datum A)
1.60
MOLDING AREA
#A1 INDEX MARK
B
A
11.0 0 ± 0.10
J
K
L
0.80
0.80
(Post Reflow ∅0.05 ± 0.05)
(0.95)
(1.90)
Bottom
Top
Bottom
Top
#A1
7.50 ± 0.10
11.00 ± 0.10
0.10MAX
0.50 ± 0.05
1.10 ± 0.10
0.35 ± 0.05
A
B
C
D
E
F
G
H
J
L
M
N
P
R
T
7.50 ± 0.10
6.00
(Datum B)
(Datum A)
#A1 INDEX MARK
13.30 ± 0.10
K
0.80 x 15 = 12.00
B
A
0.80
0.40
96 - ∅0.45 Solder ball
0.2 ABM
MOLDING AREA
(Post Reflow ∅0.05 ± 0.05)
(0.95)
(1.90)
#A1
7.50 ± 0.10
13.30 ± 0.10
0.10MAX
0.50 ± 0.05
1.10 ± 0.10
0.35 ± 0.05
876543219
0.80 x 8 = 6.40
3.200.80 1.60
876543219
October 2009
General Information DDR3 SDRAM
78Ball FBGA for 2Gb B-die (x4/x8)
96Ball FBGA for 2Gb B-die (x16)
A
B
C
D
E
F
G
H
M
N
9.00 ± 0.10
0.80 x 12 = 9.60
3.200.80
4.80
78 - ∅0.45 Solder ball
0.2 ABM
(Datum B)
(Datum A)
1.60
MOLDING AREA
#A1 INDEX MARK
B
A
BOTTOM VIEW
11.5 0 ± 0.10
J
K
L
0.80
0.80
(Post Reflow ∅0.50 ± 0.05)
(0.95)
(1.90)
0.10MAX
1.10 ± 0.10
#A1
9.00 ± 0.10
11.5 0 ± 0.10
0.35 ± 0.05
TOP VIEW
A
B
C
D
E
F
G
H
J
L
M
N
P
R
T
9.00 ± 0.10
3.200.80
6.00
(Datum B)
(Datum A)
1.60
#A1 INDEX MARK
13.30 ± 0.10
K
0.80 x 12 = 12.00
B
A
0.80
0.40
96 - ∅0.45 Solder ball
0.2 ABM
MOLDING AREA
(Post Reflow ∅0.50 ± 0.05)
(0.95)
(1.90)
BOTTOM VIEW
0.10MAX
1.10 ± 0.10
#A1
9.00 ± 0.10
13.30 ± 0.10
0.35 ± 0.05
TOP VIEW
876543219
876543219
October 2009
General Information DDR3 SDRAM
78Ball DDP for 1Gb D-die (x4)
78Ball DDP for 1Gb E-die (x4/x8)
Bottom
Top
Bottom
Top
A
B
C
D
E
F
G
H
M
N
0.80 x 12 = 9.60
0.80 x 8 = 6.40
4.000.80
4.80
82 - ∅0.45 Solder ball
0.2 ABM
(Datum B)
(Datum A)
876543219
1.60
#A1 INDEX MARK
B
A
11.00 ± 0.10
J
K
L
0.80
0.80
(Post Reflow ∅0.50 ± 0.05)
0.10MAX
1.40 ± 0.10
#A1
10.50 ± 0.10
11.0 0 ± 0.10
0.35 ± 0.05
A
B
C
D
E
F
G
H
M
N
9.00 ± 0.10
0.80 x 12 = 9.60
0.80 x 8 = 6.40
3.200.80
4.80
78 - ∅0.45 Solder ball
0.2 ABM
(Datum B)
(Datum A)
876543219
1.60
#A1 INDEX MARK
B
A
11.50 ± 0.10
J
K
L
0.80
0.80
(Post Reflow ∅0.50 ± 0.05)
0.10MAX
1.40 ± 0.10
#A1
9.00 ± 0.10
11.5 0 ± 0.10
0.35 ± 0.05
10.50 ± 0.10
October 2009
General Information DDR3 SDRAM
78Ball DDP for 2Gb B-die (x4/x8)
Bottom
Top
A
B
C
D
E
F
G
H
M
N
10.00 ± 0.10
0.80 x 12 = 9.60
0.80 x 8 = 6.40
3.200.80
4.80
78 - ∅0.45 Solder ball
0.2 ABM
(Datum B)
(Datum A)
876543219
1.60
#A1 INDEX MARK
B
A
11.50 ± 0.10
J
K
L
0.80
0.80
(Post Reflow ∅0.50 ± 0.05)
0.10MAX
1.40 ± 0.10
#A1
10.00 ± 0.10
11.50 ± 0.10
0.35 ± 0.05
October 2009
General Information DDR3 SDRAM
x64/x72 240pin DDR3 SDRAM Unbuffered DIMM
133.35 ± 0.15
Max 4.0
54.675
Units : Millimeters
9.50
128.95
(2)
(4X)3.00 ± 0.1
30.00 ± 0.15
2.30
17.30
A
B
47.00
71.00
2.50
1.00
0.2 ± 0.15
2.50 ± 0.20
Detail B
5.00
Detail A
1.50±0.10
0.80 ± 0.05
3.80
2x 2.10 ± 0.15
2.50
SPD
N/A
(for x72)
(for x64)
ECC
1.270 ± 0.10
N/A
(for x64)
(for x72)
ECC
October 2009
General Information DDR3 SDRAM
x64 204pin DDR3 SDRAM Unbuffered SODIMM
0.25 MAX
2.55
Detail BDetail A
1.00 ± 0.10
0.45 ± 0.03
4.00 ± 0.10
67.60
SPD
0.10 ABM C
2X 4.00 ± 0.10
0.10 ABM C
2X 1.80
(OPTIONAL HOLES)
0.60
Units : Millimeters
21.00
24.80
63.60
39.00
A
B
1.65
6
30.00 ± 0.15
20.00
Max 3.8
1.00 ± 0.10
0.10 ABM C
October 2009
General Information DDR3 SDRAM
x72 240pin DDR3 SDRAM Registered DIMM
Register
Address, Command and Control lines
AB
47.00
71.00
Units : Millimeters
9.50
128.95
(2X)3.00
17.30
Register
1.00
0.2 ± 0.15
2.50 ± 0.20
Detail B
5.00
Detail A
1.50±0.10
0.80 ± 0.05
3.80
2.50
9.76 18.92 32.40 18.93 9.74
10.9
C
Detail C
10.9
R
0
.5
0
0.4
2x 2.10 ± 0.15
2.30
1.27 ± 0.10
1.0 max
133.35 ± 0.15
2.50
30.00 ± 0.15
Max 4.0
54.675
October 2009
General Information DDR3 SDRAM
133.15 ± 0.2
4.65± 0.12
2
130.45 ± 0.15
127 ± 0.12
23.6 ± 0.15
25.6 ± 0.15
7.45
119.29
80.78
Green Line : TIM Attatch Line
0.4
1+0/ -0.3
0.65 ± 0.2
R
0
.
2
R0.1
1
25.6 ± 0.15
0.15
1.3
1.3
2
2 ± 0.1
2.6 ± 0.2
1. FRONT PART
Reg. pedestal line
Outside
Inside
Green Line : TIM Attatch Line
Outside
Inside
2. BACK PART
29.77
31.411. 9
9.26
128.5
Registered DIMM Heat Spreader Design
October 2009
General Information DDR3 SDRAM
19 ± 0.1
39.3 ± 0.2
D
19
E (Clip open size)
K
text mark ’B’ or ’K’
punch press_stamp
B
A
39.3 ± 0.2
29.77
R
1.
5
0.1 ~ 0.3
Upper Bending
Tilting Gap
0.5
3. CLIP PART
C
1.05
132.95 ± 133.45
1.27
4. DDR3 RDIMM ASS’Y View
Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness)
* Dimension Index
Mono DDP Note
Min. Typ. Max. Min. Typ. Max.
A - 43.9 - - 44.4 -
B 6.7 6.8 6.9 7.2 7.3 7.4
C -5.8- -6.3-
D 6.7 6.8 6.9 7.2 7.3 7.4
E (Clip open size) 2.5 - 3.6 2.6 - 3.8
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