WirelessAudio–
Soundbar(Active
SpeakerSystem)
ModelNameHW-H355
ModelCodeHW-H355/XU
SERVICE
WirelessAudio–Soundbar
(ActiveSpeakerSystem)
MANUAL
Contents
1.Precaution
2.ProductSpecication
3.Disassembly&Reassembly
4.Troubleshooting
5.PCBDiagram
HW-H355
6.SchematicDiagram
RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.
Contents
Contents
1.Precaution........................................................................................................................................1−1
1.1.SafetyPrecautions...................................................................................................................1−1
1.2.ServicingPrecautions...............................................................................................................1−3
1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)..............................................................1−4
1.4.InstallationPrecautions.............................................................................................................1−5
2.ProductSpecication.........................................................................................................................2−1
2.1.ProductFeature.......................................................................................................................2−1
2.2.Specications..........................................................................................................................2−2
2.3.SpecicationsAnalysis.............................................................................................................2−3
2.4.Accessories............................................................................................................................2−4
2.4.1.SuppliedAccessories...................................................................................................2−4
3.Disassembly&Reassembly................................................................................................................3−1
3.1.OverallDisassemblyandReassembly..........................................................................................3−1
4.Troubleshooting................................................................................................................................4−1
4.1.CheckpointsbyErrorMode.......................................................................................................4−1
4.1.1.NoPower...................................................................................................................4−2
4.1.2.NoSoundOutput(Digital)............................................................................................4−3
4.1.3.NoSoundOutput(Analog)............................................................................................4−7
4.2.MeasurestobetakenwhentheProtectionCircuitoperates...............................................................4−10
4.2.1.AMPPre-InspectionrelatingtoPowerProtection..............................................................4−10
4.3.Initialization&Update.............................................................................................................4−11
4.3.1.HowtochecktheFirmwareversion................................................................................4−11
4.3.2.Howtoinitialize..........................................................................................................4−11
4.3.3.USBUpdateprocedure.................................................................................................4−12
5.PCBDiagram...................................................................................................................................5−1
5.1.WiringDiagram.......................................................................................................................5−1
5.2.MAINPCBTop......................................................................................................................5−2
5.2.1.PinConnection...........................................................................................................5−3
5.2.2.TestPointWaveForm..................................................................................................5−4
5.3.MAINPCBBottom..................................................................................................................5−5
5.3.1.PinConnection...........................................................................................................5−6
5.3.2.TestPointWaveForm..................................................................................................5−7
5.4.VFDPCBTop.........................................................................................................................5−8
5.5.VFDPCBBottom....................................................................................................................5−9
5.5.1.PinConnection...........................................................................................................5−10
5.6.JACKPCBTop.......................................................................................................................5−11
5.6.1.PinConnection...........................................................................................................5−12
5.6.2.TestPointWaveForm..................................................................................................5−13
iCopyright©1995-2013SAMSUNG.Allrightsreserved.
Contents
5.7.JACKPCBBottom..................................................................................................................5−14
5.7.1.PinConnection...........................................................................................................5−15
6.SchematicDiagram...........................................................................................................................6−1
6.1.OverallBlockDiagram.............................................................................................................6−1
6.2.MAIN-1.................................................................................................................................6−2
6.3.MAIN-2.................................................................................................................................6−3
6.4.MAIN-3.................................................................................................................................6−4
6.4.1.TestPointWaveForm..................................................................................................6−5
6.5.MAIN-4.................................................................................................................................6−6
6.6.MAIN-5.................................................................................................................................6−7
6.6.1.TestPointWaveForm..................................................................................................6−8
6.7.VFD......................................................................................................................................6−9
6.8.JACK....................................................................................................................................6−10
6.8.1.TestPointWaveForm..................................................................................................6−11
Copyright©1995-2013SAMSUNG.Allrightsreserved.ii
1.Precaution
DEVICE
UNDER
TES T
LEAKAGE
CUR RE NT
TES TER
TES T ALL
EXPO SED ME TAL
SU RFACES
2-WIRE CORD
ALSO TE S T WITH
PLUG REVERSED
(US ING AC
ADAPTER P LUG
AS R EQ UIRED)
EARTH
GR OUND
(RE ADING
SH OULD NOT BE
ABOVE 0.5m A)
1.Precaution
FollowthesesafetyinstructionswhileservicingtheESDtopreventdamageandtoprotectagainstpotentialhazards
suchaselectricalshockandX-rays.
1.1.SafetyPrecautions
1)Whenreinstallingthechassisanditsassemblies,besuretorestorealloftheprotectivedevices,includingthecontrol
knobsandthecompartmentcovers.
2)Makesurethattherearenocabinetopeningsthroughwhichpeople(particularlychildren)canmakecontactwith
dangerousinternalcomponents.
3)DesignAlterationWarning:
Neveralteroraddtothemechanicalorelectricaldesignoftheunit.
Example:Donotaddauxiliaryaudioorvideoconnectors.Suchalterationsmightcreateasafetyhazard.
Also,anydesignchangesoradditionswillvoidthemanufacturer’swarranty.
4)LeakageCurrentHotCheckFigure1.1
ACLeakageTest:
WARNING
Donotuseanisolationtransformerduringthistest.Usealeakage-currenttesterorameteringsystemthatcomplies.
Withtheunitcompletelyreassembled,plugtheACcorddirectlyintoaACoutlet.Withtheunit’spowerswitchedfrom
theONtotheOFFposition,measurethecurrentbetweenaknowngroundandallexposedmetalparts.
KnownGrounds-Earth
KnownMetalparts-screwheads,metalcabinets,etc.
Figure1.1ACLeakageTest
1-1Copyright©1995-2013SAMSUNG.Allrightsreserved.
1.Precaution
Ante nna
Term inal
ohm
Expo sed
Meta l Part
Ohmmet er
5)InsulationResistanceColdCheck:
(1)Withtheunit’sACplugdisconnectedfromtheACsource,connectanelectricaljumperacrossthetwoACprongs.
(2)SetthepowerswitchtoON.(3)MeasuretheresistancebetweentheshortedACplugandanyexposedmetallicparts.
Example:screwheads,metalcabinets,antennaport,etc.Ifanyoftheexposedmetallicpartshasareturnpathtothe
chassis,themeasuredresistanceshouldbebetween1and5.2megohms.Ifthereisnoreturnpath,themeasured
resistanceshouldbe“innite.”Iftheresistanceisoutsidetheselimits,ashockhazardmightexist.SeeFigure1.2
InsulationResistanceTest
Figure1.2InsulationResistanceTest
6)Components,partsandwiringthatappeartohaveoverheatedorthatareotherwisedamagedshouldbereplacedwith
partsthatmeettheoriginalspecications.Alwaysdeterminethecauseofdamageoroverheating,andcorrectany
potentialhazards.
7)Observetheoriginalleaddress,especiallynearthefollowingareas:Antennawiring,sharpedges,andespeciallytheAC
andhighvoltagepowersupplies.Alwaysinspectforpinched,out-of-place,orfrayedwiring.
Donotchangethespacingbetweencomponentsandtheprintedcircuitboard.ChecktheACpowercordfordamage.
Makesurethatnowiresorcomponentstouchthermallyhotparts.
8)ProductSafetyNotice:
Someelectricalandmechanicalpartshavespecialsafety-relatedcharacteristicswhichmightnotbeobviousfromvisual
inspection.Thesesafetyfeaturesandtheprotectiontheygivemightbelostifthereplacementcomponentdiffersfrom
theoriginal—evenifthereplacementisratedforhighervoltage,wattage,etc.
9)Componentsthatarecriticalforsafetyareindicatedinthecircuitdiagrambyshading,
or.Usereplacement
componentsthathavethesameratings,especiallyforameresistanceanddielectricstrengthspecications.A
replacementpartthatdoesnothavethesamesafetycharacteristicsastheoriginalmightcreateshock,reorother
hazards.
Copyright©1995-2013SAMSUNG.Allrightsreserved.1-2
1.Precaution
1.2.ServicingPrecautions
1)Servicingprecautionsareprintedonthecabinet.Followthem.
2)Alwaysunplugtheunit’sACpowercordfromtheACpowersourcebeforeattemptingto:
(a)Removeorreinstallanycomponentorassembly ,(b)Disconnectanelectricalplugorconnector,(c)Connecta
testcomponentinparallelwithanelectrolyticcapacitor.
3)Somecomponentsareraisedabovetheprintedcircuitboardforsafety.Aninsulationtubeortapeissometimesused.
Theinternalwiringmaybeclampedtopreventcontactwiththermallyhotcomponents.Reinstallallsuchelements
totheiroriginalposition.
4)Afterservicing,alwayscheckthatthescrews,componentsandwiringhavebeencorrectlyreinstalled.Makesurethat
theportionaroundtheservicedparthasnotbeendamaged.
5)ChecktheinsulationbetweenthebladesoftheACplugandaccessibleconductiveparts(examples:metalpanels,
inputterminalsandearphonejacks).
6)InsulationCheckingProcedure:
DisconnectthepowercordfromtheACsource.Connectaninsulationresistancemeter(500V)tothebladesofthe
ACplug.TheinsulationresistancebetweeneachbladeoftheACplugandaccessibleconductiveparts(seeabove)
shouldbegreaterthan1megohm.
7)NeverdefeatanyoftheB+voltageinterlocks.DonotapplyACpowertotheunit(oranyofitsassemblies)unlessall
solid-stateheatsinksarecorrectlyinstalled.
8)Alwaysconnectatestinstrument’sgroundleadtotheinstrumentchassisgroundbeforeconnectingthepositivelead;
alwaysremovetheinstrument’sgroundleadlast.
CAUTION
Firstreadthe“SafetyPrecautions”sectionofthismanual.Ifsomeunforeseencircumstancecreatesaconictbetweenthe
servicingandsafetyprecautions,alwaysfollowthesafetyprecautions.
1-3Copyright©1995-2013SAMSUNG.Allrightsreserved.
1.Precaution
1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)
Somesemiconductor(“solidstate”)devicesareeasilydamagedbystaticelectricity.
SuchcomponentsarecalledElectrostaticallySensitiveDevices(ESDs).
Examplesincludeintegratedcircuitsandsomeeld-effecttransistors.
Thefollowingtechniqueswillreducetheoccurrenceofcomponentdamagecausedbystaticelectricity:
1)Immediatelybeforehandlinganysemiconductorcomponentsorassemblies,draintheelectrostaticchargefromyour
bodybytouchingaknownearthground.Alternatively,wearadischargingwrist-strapdevice.(Besuretoremoveit
priortoapplyingpower–thisisanelectricshockprecaution.)
2)AfterremovinganESD-equippedassembly,placeitonaconductivesurfacesuchasaluminumfoiltoprevent
accumulationofelectrostaticcharge.
3)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargesthatdamageESDs.
4)Useonlyagrounded-tipsolderingironwhensolderingorunsolderingESDs.
5)Useonlyananti-staticsolderremovaldevice.Manysolderremovaldevicesarenotratedas“anti-static”(thesecan
accumulatesufcientelectricalchargetodamageESDs).
6)DonotremoveareplacementESDfromitsprotectivepackageuntilyouarereadytoinstallit.
MostreplacementESDsarepackagedwithleadsthatareelectricallyshortedtogetherbyconductivefoam,aluminum
foilorotherconductivematerials.
7)ImmediatelybeforeremovingtheprotectivematerialfromtheleadsofareplacementESD,touchtheprotectivematerial
tothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.
8)MinimizebodymotionswhenhandlingunpackagedreplacementESDs.Motionssuchasbrushingclothestogether,or
liftingafootfromacarpetedoorcangenerateenoughstaticelectricitytodamageanESD.
Copyright©1995-2013SAMSUNG.Allrightsreserved.1-4
1.Precaution
1.4.InstallationPrecautions
1)Keeptheproductawayfromaheatsourcesuchascandlelight,mosquitorepellentincense,heatingequipment,ordirect
sunlight.Otherwise,thismaycausere.
2)Donotinstalltheproductonaplacethatisshaking,tilted,unstable,orseriouslyvibrating.Theproductmaydroptoget
damagedorinjureaperson.Ifusingtheproductinahighlyvibratingplace,itmaybebrokenorcausere.
3)Whenmovingtheproduct,turnoffthepowerswitchandunplugalltheconnectedcableswiththeproductsuchasthe
powerplugandantennacable.Ifthepowercordisdamaged,thismaycauseelectricshockorre.
4)Secureroomforventilation.Keepatleast10cmofdistancefromtherearwall,andatleast5cmfromeithersidewall.
5)Installingtheproductinaspecialplacelikebelowratherthannormalenvironmentmaycauseseriousqualityconcerns
duetoitsspecialconditions.Ifthisisthecase,makesuretocontactalocalSamsungservicecenterbeforeinstallingthe
product.(Specialplaces:aplacewherealargeamountofdustisaccumulated;wherechemicalsubstancesareused
ortheambienttemperatureistoohighorlow;aplacethatisfullofmoistureorwater;intransportationvehicles
suchasacar;orinpublicplacessuchastheairportorsubwaystationwheretheproductissupposedtooperate
uninterruptedlyforalongtime)
6)Keepthepackagingplasticwrapperoutofchildren'sreach.Ifchildrenplaywithitimproperly,theymaygetsuffocated.
7)Ifinstallingtheproductonadisplaycabinet,shelf,desk,etc.,keeptheproductfromprotrudingonitslowerside.Ifthe
productfalls,itmaybreakorcausephysicalinjury .Useonlythedisplaycabinetorshelfthatfullycoverstheproduct.
8)Ifusinglithiumbatteries,carefullyreadthefollowingprecautions:
NOTE
•Ensurethebatteriesareinsertedintherightdirection.Otherwise,theymaycauseanexplosion.Disposeofusedbatteries
accordingtothemanufacturer'sinstructions.
•Donotexposethebatterytore.
•Donotdisassemble,short-cut,orheatthebattery.
•Useonlythesametypeandsizeofbatteriesforreplacement.
•Donotexposethebatterytoreorexcessiveheat.
1-5Copyright©1995-2013SAMSUNG.Allrightsreserved.
2.ProductSpecication
2.1.ProductFeature
■HW-H355
•120W(30Wx2+60W)
•2.1CH,System
•VirtualSurround
•USBHostSupport
•BluetoothPowerON
•SmartV olumeII
•SoundConnect
2.ProductSpecication
•3DSOUNDPlus
•Bluetooth
Copyright©1995-2013SAMSUNG.Allrightsreserved.2-1
2.ProductSpecication
2.2.Specications
■BasicSpecication
USB5V/0.5A
Weight
General
Amplier
NOTE
•S/Nratio,distortion,separationandusablesensitivityarebasedonmeasurementusingAES(AudioEngineeringSociety)
guidelines.
•SamsungElectronicsCo.,Ltdreservestherighttochangethespecicationswithoutnotice.
•Weightanddimensionsareapproximate.
Dimensions
(WxHxD)
Operatingtemperaturerange+5°Cto+35°C
Operatinghumidityrange10%to75%
Ratedoutput
power
S/Nratio(analoginput)60dB
Separation(1kHz)50dB
Mainunit1.75kg
Subwoofer3.0kg
Mainunit943x49x59.9mm
Subwoofer152x300x284mm
Mainunit30W/CH,8OHM,THD=10%,1kHz
Subwoofer60W,3OHM,THD=10%,100Hz
2-2Copyright©1995-2013SAMSUNG.Allrightsreserved.
2.3.SpecicationsAnalysis
ModelNameHW-H355HW-F355
Photo
2.ProductSpecication
Output
Power
Extra
Features
DSP
Decoding
RMS(10%THD),
REF:1ch
OutputPower(ch)30Wx2+60W30Wx2+60W
WirelessReady--
SoundConnectOO
USBHOSTOO
BluetoothOO
VirtualSurround
3DSOUND3DSoundPlus3DSoundPlus
ASC--
SmartV olumeSmartVolumeIISmartVolumeII
DolbyDigital/PlusDolbyDigital2.0DolbyDigital2.0
DolbyT rueHDN/AN/A Audio
DTS/DTS-HD
(HR/MA)
Music/Voice/Sports/Cinema
120W120W
4mode
Music/News/Cinema/Drama/
/Standard(Off)
DTSDTS
Sports/Game/Standard(Off)
6mode
O:FeatureIncluded
X:NotIncluded
Audio
In/Out
Optical
Jack
Speaker
TIP
MiniJackAudioInAUX1(3.5φ)AUX1(3.5φ)
RCAInput--
In(DigitalIn)O(1)O(1)
InternalT ype
Type(Sat/T allboy)
Active(Powered)S/WWiredPassiveWiredPassive
(MainFrameBuilt-InType)
1way1spk
InternalT ype
(MainFrameBuilt-InType)
1way1spk
Copyright©1995-2013SAMSUNG.Allrightsreserved.2-3
2.ProductSpecication
POWER
TV POWER
AH59-02548A
TV VOL TV CH AUDIO SYNC
AUX USB TV SOURCE
TV PRE-CH
TV EXIT
SMART VOLUMESOUND EFFECT
S/W
LEVEL
S/W
LEVEL
VOL
VOL
3D SOUND
PLUS
DRC
TV INFOTV MUTE
AUTO POWER
DIMMERREPEAT
OPTICAL
MUTE
2.4.Accessories
2.4.1.SuppliedAccessories
AccessoriesItemItemcode
RemoteControlAH59-02612A
Batteries(AAAsize)4301-000116
FerriteCore3301-001068
Screw
USBCableAH39-01270A
UserManualAH68-02676A
PowerCord3903-000539
AdapterBN44-00722A
AudioCableAH39-01077A
AH61-03342A
6001-001961
2-4Copyright©1995-2013SAMSUNG.Allrightsreserved.
3.Disassembly&Reassembly
3.Disassembly&Reassembly
3.1.OverallDisassemblyandReassembly
CAUTION
•Becarefultofollowthedisassemblysequencedescribedinthemanual.Otherwise,theproductmaybedamaged.
•BesuretocarefullyreadandunderstandthesafetyinstructionsbeforeperforminganyworkastheICchipson
thePCBarevulnerabletostaticelectricity.
•Inordertoassemblereversetheorderofdisassembly.
DescriptionDescriptionPhoto
1.Loosen8screwsattheRearCover.
:M3X10B
CAUTION
Becarefulnottomakeanyscratchesasyouremovethem.
2.Loosen9screwsattheRearCover.
:M3X10B
3.Open2JackCoversattheRearCover.
4.PulltheRearCoverinthedirectionofthearrows.
5.Loosen5screwsontheboards.
:M3X10B,M3X5S
UnplugAllConnectorsontheMainPCB.
6.RemovetheLeftSpeaker.
RemovetheJackPCB.
7.RemovetheMainASSY.
8.Loosen2screwsattheVFDPCB.
:M3X10B
Copyright©1995-2013SAMSUNG.Allrightsreserved.3-1
3.Disassembly&Reassembly
9.RemovetheVFDPCB.
PulltheRightSpeaker.
10.Finish.
DescriptionDescriptionPhoto
3-2Copyright©1995-2013SAMSUNG.Allrightsreserved.
4.Troubleshooting
4.1.CheckpointsbyErrorMode
V oltage/DIV1V/div
TIME/DIV500ms/div
4.Troubleshooting
OscilloscopeSettingV alues
Copyright©1995-2013SAMSUNG.Allrightsreserved.4-1
4.Troubleshooting
Check if 23. 5V
is m e a sure d on the MAIN PC B
PCN1 P IN #1.
Check if 23. 5V
is m e a sure d at the
Adapte r pin #1 .
Check th e AC Cord output.
Yes
MAIN PC B P CN1 cha nge .
No No No
Yes
The powe r doe s n ot tu rn on.
Change the MAIN PC B.
Yes
Check if H(3.4 V)
is m e a sure d at the pin #6 2
of the UIC1 wh en MAIN PCB
power is tu rne d on .
Re place the AC C ord .
Re place the Micom (UIC1).
Check Ada pter a nd
replace Ada pter.
Yes
4.1.1.NoPower
4-2Copyright©1995-2013SAMSUNG.Allrightsreserved.